TWI802118B - 黏著片材 - Google Patents
黏著片材 Download PDFInfo
- Publication number
- TWI802118B TWI802118B TW110144815A TW110144815A TWI802118B TW I802118 B TWI802118 B TW I802118B TW 110144815 A TW110144815 A TW 110144815A TW 110144815 A TW110144815 A TW 110144815A TW I802118 B TWI802118 B TW I802118B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- adhesive layer
- adhesive sheet
- acrylate
- meth
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 145
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 143
- 239000012790 adhesive layer Substances 0.000 claims abstract description 129
- 229920005989 resin Polymers 0.000 claims abstract description 86
- 239000011347 resin Substances 0.000 claims abstract description 86
- 238000007789 sealing Methods 0.000 claims abstract description 33
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000003522 acrylic cement Substances 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000002253 acid Substances 0.000 claims abstract description 20
- 229920000642 polymer Polymers 0.000 claims abstract description 12
- 239000003431 cross linking reagent Substances 0.000 claims description 46
- -1 polyethylene terephthalate Polymers 0.000 claims description 44
- 239000000178 monomer Substances 0.000 claims description 33
- 229920005601 base polymer Polymers 0.000 claims description 23
- 229920000058 polyacrylate Polymers 0.000 claims description 20
- 239000004593 Epoxy Substances 0.000 claims description 16
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 13
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 238000013329 compounding Methods 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 10
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 7
- 150000002148 esters Chemical class 0.000 claims description 4
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 62
- 229920000103 Expandable microsphere Polymers 0.000 description 29
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 27
- 235000012431 wafers Nutrition 0.000 description 26
- 239000000203 mixture Substances 0.000 description 23
- 238000005259 measurement Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 19
- 239000000523 sample Substances 0.000 description 18
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- 238000010438 heat treatment Methods 0.000 description 16
- 238000011156 evaluation Methods 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 13
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- 238000000576 coating method Methods 0.000 description 12
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 239000012948 isocyanate Substances 0.000 description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 9
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 9
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- 150000002513 isocyanates Chemical class 0.000 description 9
- 238000009864 tensile test Methods 0.000 description 9
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 8
- 239000004745 nonwoven fabric Substances 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000003566 sealing material Substances 0.000 description 7
- 235000007586 terpenes Nutrition 0.000 description 7
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
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- 125000000217 alkyl group Chemical group 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 5
- 239000000123 paper Substances 0.000 description 5
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- 150000003505 terpenes Chemical class 0.000 description 5
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
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- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
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- 239000004005 microsphere Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- 229920001342 Bakelite® Polymers 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 238000003918 potentiometric titration Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 2
- 239000004156 Azodicarbonamide Substances 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
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- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
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- 239000004698 Polyethylene Substances 0.000 description 2
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- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 2
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- 125000004432 carbon atom Chemical group C* 0.000 description 2
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- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
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- 238000007654 immersion Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- CRSOQBOWXPBRES-UHFFFAOYSA-N neopentane Chemical compound CC(C)(C)C CRSOQBOWXPBRES-UHFFFAOYSA-N 0.000 description 2
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- 125000006850 spacer group Chemical group 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
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- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
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- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- KYPOHTVBFVELTG-OWOJBTEDSA-N (e)-but-2-enedinitrile Chemical compound N#C\C=C\C#N KYPOHTVBFVELTG-OWOJBTEDSA-N 0.000 description 1
- WFTKISKQZWBTFC-UHFFFAOYSA-N 1,1-diisocyanatocyclohexane Chemical compound O=C=NC1(N=C=O)CCCCC1 WFTKISKQZWBTFC-UHFFFAOYSA-N 0.000 description 1
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- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
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- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
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- CSCSROFYRUZJJH-UHFFFAOYSA-N 1-methoxyethane-1,2-diol Chemical compound COC(O)CO CSCSROFYRUZJJH-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- BFYSJBXFEVRVII-UHFFFAOYSA-N 1-prop-1-enylpyrrolidin-2-one Chemical compound CC=CN1CCCC1=O BFYSJBXFEVRVII-UHFFFAOYSA-N 0.000 description 1
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- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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Abstract
本發明提供一種黏著片材,其對密封半導體晶片之密封樹脂及半導體晶片具有適度之黏著性,可容易地自該密封樹脂剝離且剝離時不易產生糊劑殘留。
本發明之黏著片材具備基材與配置於該基材之至少一側之黏著劑層,該黏著劑層含有丙烯酸系黏著劑,該丙烯酸系黏著劑包含酸值為16 mgKOH/g以下之基礎聚合物。於一實施方式中,上述黏著片材具備上述基材、配置於該基材之一側之上述黏著劑層、及配置於該基材之與該黏著劑層相反一側之第2黏著劑層。
Description
本發明關於一種黏著片材。
近年來,於製造含半導體晶片之半導體零件時,為了防止損傷半導體晶片、擴展金屬佈線等,有時進行用樹脂密封該半導體晶片之操作。於樹脂密封步驟中,就作業性等觀點而言,有時於黏著片材上進行用樹脂密封半導體晶片之操作。例如,將複數個半導體晶片配置於特定之作為暫時固定材之黏著片材上,於該黏著片材上將半導體晶片一次密封,以防止半導體晶片移動。其後,於特定之後續步驟中,將上述黏著片材自密封有半導體晶片之樹脂剝離。
於如上所述之步驟中,若使用先前之黏著片材,則存在於自包含密封樹脂與半導體晶片之構造體剝離該黏著片材時,構造體上有糊劑殘留之問題。
[先前技術文獻]
[專利文獻]
專利文獻1:日本專利特開2001-308116號公報
專利文獻2:日本專利特開2001-313350號公報
專利文獻3:日本專利特開2018-193563號公報
[發明所欲解決之問題]
本發明旨在解決上述先前之課題,其目的在於提供一種黏著片材,其對密封半導體晶片之密封樹脂及半導體晶片具有適度之黏著性,可容易地自該密封樹脂剝離且剝離時不易產生糊劑殘留。
[解決問題之技術手段]
本發明之黏著片材具備基材與配置於該基材之至少一側之黏著劑層,該黏著劑層含有丙烯酸系黏著劑,該丙烯酸系黏著劑包含酸值為16 mgKOH/g以下之基礎聚合物。
於一實施方式中,上述黏著片材具備:上述基材、配置於該基材之一側之上述黏著劑層、及配置於該基材之與該黏著劑層相反一側之第2黏著劑層。
於一實施方式中,於上述黏著劑層貼附矽晶片時在150℃下之剪切接著力B相對於將上述黏著劑層貼附於聚對苯二甲酸乙二酯時在23℃下之黏著力A的比(剪切接著力B/黏著力A)為32.0 g/(N/20 mm)以上。
於一實施方式中,上述基礎聚合物為丙烯酸系聚合物之交聯體。
於一實施方式中,上述黏著劑層之凝膠分率為75%以上。
於一實施方式中,上述丙烯酸系黏著劑包含交聯劑,相對於上述丙烯酸系聚合物之羧基的該交聯劑之調配量為0.08莫耳當量~2莫耳當量。
於一實施方式中,上述交聯劑為環氧系交聯劑。
於一實施方式中,上述黏著劑層在受到加熱處理時之氮氣之產生量為0.05 wt%~1.0 wt%。
於一實施方式中,上述黏著劑層之厚度為1 μm~300 μm。
於一實施方式中,上述黏著片材為半導體晶片之樹脂密封步驟中使用之暫時固定材。
於一實施方式中,上述黏著片材係於該黏著片材上使密封樹脂硬化時使用。
[發明之效果]
根據本發明,可提供一種黏著片材,其對密封半導體晶片之密封樹脂及半導體晶片具有適度之黏著性,可容易地自該密封樹脂剝離、且剝離時不易產生糊劑殘留。
A. 黏著片材之概要圖1係本發明之一實施方式之黏著片材之概略剖視圖。黏著片材100具備基材10與配置於基材10之至少一側之黏著劑層(第1黏著劑層)20。
本發明之黏著片材能夠較佳地用作用樹脂密封半導體晶片時之暫時固定材。更詳細而言,本發明之黏著片材係於該黏著片材之黏著劑層上排列半導體晶片,利用樹脂(通常為環氧系樹脂)包覆該半導體晶片,藉由使該密封樹脂硬化而用樹脂密封半導體晶片,此時能夠用作該半導體晶片之暫時固定材。用樹脂密封半導體晶片後,於特定之後續步驟(例如密封樹脂之背面研削、形成圖案、形成凸塊、切晶(切割成晶片))時,能夠將上述黏著片材從由密封樹脂與半導體晶片構成之構造體剝離。密封樹脂之環氧當量例如為50 g/eq~500 g/eq。
上述黏著劑層含有丙烯酸系黏著劑。該丙烯酸系黏著劑包含酸值為16 mgKOH/g以下之基礎聚合物。這意味著黏著劑層中之成分之殘存羧基較少。於本發明中,藉由減少黏著劑層中之成分之殘存羧基,可降低密封樹脂與黏著劑層成分之相溶性,其結果可防止將黏著片材自密封樹脂剝離時產生糊劑殘留。又,藉由減少黏著劑層中之成分之殘存羧基,可提高丙烯酸系黏著劑之凝集力,其結果即便於高溫下(例如樹脂密封步驟中之加熱環境下)亦具有較佳之黏著力,於樹脂密封時能夠以較高之固定力固定半導體晶片。獲得具有高溫下優異之固定性、且防止糊劑殘留而剝離性優異之黏著片材為本發明之較大成果之一。
圖2係本發明之另一實施方式之黏著片材之概略剖視圖。黏著片材200於基材10之與黏著劑層20相反一側進而具備第2黏著劑層。即,黏著片材200依序具備黏著劑層20、基材10、及第2黏著劑層30。藉由具備第2黏著劑層30,於載台上進行樹脂密封時,將第2黏著劑層30側貼附於該載台,而能夠固定性良好地配置黏著片材200。
於一實施方式中,第2黏著劑層包含熱膨脹性微小球。該熱膨脹性微小球能夠於特定溫度下膨脹。藉由將包含此種熱膨脹性微小球之黏著劑層加熱至特定溫度以上,熱膨脹性微小球膨脹,黏著面(即第2黏著劑層表面)產生凹凸,黏著力降低或消失。若形成包含熱膨脹性微小球之第2黏著劑層,則於固定黏著片材(例如固定於載台)時表現出所需之黏著性,於剝離黏著片材(例如自載台剝離)時藉由加熱黏著力降低或消失而表現出良好之剝離性。
本發明之黏著片材於將黏著劑層貼附於聚對苯二甲酸乙二酯時在23℃下之黏著力A較佳為0.05 N/20 mm~1 N/20 mm,更佳為0.05 N/20 mm~10 N/20 mm,進而較佳為0.05 N/20 mm~5 N/20 mm,尤佳為0.1 N/20 mm~2 N/20 mm,最佳為0.1 N/20 mm~1 N/20 mm。若處於此種範圍,則可獲得能夠良好地固定被黏著體(例如半導體晶片)、且剝離時糊劑殘留較少之黏著片材。再者,於本說明書中,所謂「將黏著劑層貼附於聚對苯二甲酸乙二酯時在23℃下之黏著力」係指如下黏著力:於聚對苯二甲酸乙二酯膜(厚度25 μm)貼合黏著片材(寬度20 mm×長度100 mm)之黏著劑層(貼合條件:用2 kg壓輥來回滾壓1次),於23℃之環境溫度下放置30分鐘後,將該試樣供於拉伸試驗(剝離速度:300 mm/min、剝離角度180°)進行測定。
本發明之黏著片材於黏著劑層貼附矽晶片時在150℃下之剪切接著力B較佳為500 g以上,更佳為700 g~1500 g,進而較佳為800 g~1200 g。若處於此種範圍,則丙烯酸系黏著劑之凝集力較高,即便於高溫下(例如用於使密封樹脂硬化之加熱步驟)亦具有較佳之黏著力,且可防止配置於黏著片材上之被黏著體(例如半導體晶片)發生位置偏移。剪切接著力可藉由如下方式測定:於黏著劑層上以不接觸晶片角之方式垂直地貼附矽晶片(尺寸:5 mm×5 mm)之鏡面後,於130℃下加熱30分鐘使矽晶片密接於黏著劑表面,其後,於測定溫度(剪切接著力B測定之情形時為150℃)下,以剪切速度500 μm/sec、沿與晶片水平之方向施加外力,藉此獲得荷重-位移曲線,自該曲線讀取最大破壞荷重。
於黏著劑層貼附矽晶片時在150℃下之剪切接著力B(以下亦稱為剪切接著力B)相對於將黏著劑層貼附於聚對苯二甲酸乙二酯時在23℃下之黏著力A(以下亦稱為黏著力A)的比(剪切接著力B/黏著力A)較佳為32.0 g/(N/20 mm)以上,更佳為150 g/(N/20 mm)以上,進而較佳為1600 g/(N/20 mm)以上,尤佳為4000 g/(N/20 mm)以上。若處於此種範圍,則能夠防止剝離時產生糊劑殘留、且能夠防止被黏著體發生位置偏移(尤其高溫下之位置偏移)。
本發明之黏著片材於黏著劑層貼附矽晶片時在190℃下之剪切接著力較佳為300 g~1000 g,更佳為350 g~750 g,進而較佳為400 g~600 g。若處於此種範圍,則於上述黏著片材具備包含熱膨脹性微小球之第2黏著劑層之情形時,於使該第2黏著劑層側表現出剝離性時,即,進行加熱以使該熱膨脹性微小球膨脹時,能夠良好地固定黏著劑層上之被黏著體。
本發明之黏著片材之厚度較佳為3 μm~300 μm,更佳為5 μm~150 μm,進而較佳為10 μm~100 μm。
B. 黏著劑層如上所述,上述黏著劑層含有丙烯酸系黏著劑。該丙烯酸系黏著劑包含酸值為16 mgKOH/g以下之基礎聚合物。該基礎聚合物之酸值較佳為10 mgKOH/g以下,更佳為7.5 mgKOH/g以下,進而較佳為5 mgKOH/g以下。若處於此種範圍,則本發明之效果顯著。基礎聚合物之酸值越小越佳,其下限值例如0 mgKOH/g。
於本說明書中,上述基礎聚合物之酸值係藉由以黏著劑層作為樣品之下述方法來測定。更詳細而言,基礎聚合物之酸值係以如下方式測得:利用氯仿使黏著劑層膨潤後,添加過量之甲醇,分離為可溶物(溶膠)與不溶物(凝膠),利用濾紙進行過濾,回收不溶物;將該操作進行,測定乾燥後所獲得之不溶物之酸值。該酸值可依據JIS K 2501,藉由電位差滴定法來測定。基礎聚合物之酸值可藉由添加能夠與基礎聚合物之羧基反應之交聯劑,一邊消耗羧基一邊使該基礎聚合物進行交聯,而使其量成為合適之範圍。再者,於本說明書中,黏著劑層中之丙烯酸系黏著劑所含之所謂「基礎聚合物」,意指使預聚物(未交聯聚合物)交聯所形成之聚合物。
上述黏著劑層之凝膠分率較佳為75%以上,更佳為85%以上,進而較佳為90%以上。若處於此種範圍,則可獲得藉由交聯而使得基礎聚合物之羧基量得到較佳調整而形成之黏著劑層。黏著劑層之凝膠分率越高越佳,其上限例如99%。再者,凝膠分率係將已交聯之黏著劑層於甲苯中浸漬7天後再進行乾燥,並以(浸漬後之乾燥重量/浸漬前之乾燥重量)×100求出。
上述黏著劑層在受到加熱處理時之氮氣之產生量較佳為0.05 wt%~1.0 wt%,更佳為0.07 wt%~0.8 wt%,進而較佳為0.15 wt%~0.7 wt%。於黏著劑層在受到加熱處理時之氮氣之產生量處於此種範圍之情形時,基礎聚合物之羧基因交聯而被消耗,與密封樹脂之相溶性較低,從而形成糊劑殘留較少之黏著劑層。黏著劑層受到加熱處理時之氮氣量係以如下方式求出:採集約5.0 mg~10.0 mg黏著劑層,放在瓷板(ceramic board),利用微天平稱重後,對該樣品於熱分解爐800℃/氧化爐900℃之條件下進行加熱,使用TN(微量總氮分析)裝置求出所產生之氮氣量。
上述黏著劑層之厚度較佳為1 μm~300 μm,更佳為2 μm~300 μm,進而較佳為3 μm~150 μm,進而較佳為4 μm~100 μm,進而較佳為5 μm~50 μm。
上述黏著劑層於25℃下藉由奈米壓痕法測定之彈性模數較佳為未達100 MPa,更佳為0.1 MPa~50 MPa,進而較佳為0.1 MPa~10 MPa。若處於此種範圍,則可獲得具有適度之黏著力之黏著片材。所謂藉由奈米壓痕法測定之彈性模數,係指在包括負載時、卸載時在內之整個過程中連續地測定將壓頭壓入至試樣時對壓頭施加之負載荷重及壓入深度,根據所獲得之負載荷重-壓入深度曲線求出之彈性模數。於本說明書中,所謂藉由奈米壓痕法測定之彈性模數係指於荷重:1 mN、負載/卸載速度:0.1 mN/s、保持時間:1s之測定條件下,藉由如上方式測定所得之彈性模數。
上述黏著劑層於25℃下之拉伸彈性模數較佳為未達100 MPa,更佳為0.1 MPa~50 MPa,進而較佳為0.1 MPa~10 MPa。若處於此種範圍,則可獲得具有適度之黏著力之黏著片材。再者,拉伸彈性模數可依據JIS K 7161:2008進行測定。
上述黏著劑層之探針黏性(probe tack)值較佳為50 N/5 mmϕ以上,更佳為75 N/5 mmϕ以上,進而較佳為100 N/5 mmϕ以上。若處於此種範圍,則可防止配置於黏著片材上之被黏著體(例如半導體晶片)發生位置偏移。探針黏性值之測定條件設為如下:探針加工速度:30 mm/min、測試速度:30 mm/min、密接荷重:100 gf、密接保持時間:1秒、探針面積:5 mmϕSUS。
上述基礎聚合物之sp(Solubility Parameter,溶解度參數)值較佳為7(cal/cm
3)
1/2~10(cal/cm
3)
1/2,更佳為7(cal/cm
3)
1/2~9(cal/cm
3)
1/2,進而較佳為7(cal/cm
3)
1/2~8(cal/cm
3)
1/2。若處於此種範圍,則可獲得具有適度之黏著性且剝離時之糊劑殘留較少之黏著片材。
(丙烯酸系黏著劑)
作為上述丙烯酸系黏著劑,例如可例舉以丙烯酸系聚合物(均聚物或共聚物)為預聚物,將該預聚物之交聯體作為基礎聚合物之丙烯酸系黏著劑等,上述丙烯酸系聚合物(均聚物或共聚物)係使用1種或2種以上之(甲基)丙烯酸烷基酯作為單體成分所得。於一實施方式中,上述基礎聚合物具有基於丙烯酸系聚合物及環氧交聯劑之交聯體結構。
作為上述(甲基)丙烯酸烷基酯之具體例,可例舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等(甲基)丙烯酸C1-20烷基酯。其中,較佳為具有碳數4~20(更佳為6~20、尤佳為8~18)之直鏈狀或支鏈狀烷基之(甲基)丙烯酸烷基酯,更佳為(甲基)丙烯酸2-乙基己酯。
為了凝集力、耐熱性、交聯性等之改質,上述丙烯酸系聚合物(預聚物)視需要亦可含有能夠與上述(甲基)丙烯酸烷基酯進行共聚之其他單體成分所對應之單元。作為此種單體成分,例如可例舉:丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸等含羧基之單體;順丁烯二酸酐、伊康酸酐等酸酐單體;(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯、(甲基)丙烯酸羥基己酯、(甲基)丙烯酸羥基辛酯、(甲基)丙烯酸羥基癸酯、(甲基)丙烯酸羥基月桂酯、甲基丙烯酸(4-羥基甲基環己基)甲酯等含羥基之單體;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸等含磺酸基之單體;(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥甲基丙烷(甲基)丙烯醯胺等(N-取代)醯胺系單體;(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等(甲基)丙烯酸胺基烷基酯系單體;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯系單體;N-環己基順丁烯二醯亞胺、N-異丙基順丁烯二醯亞胺、N-月桂基順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺等順丁烯二醯亞胺系單體;N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基伊康醯亞胺、N-辛基伊康醯亞胺、N-2-乙基己基伊康醯亞胺、N-環己基伊康醯亞胺、N-月桂基伊康醯亞胺等伊康醯亞胺系單體;N-(甲基)丙烯醯氧基亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-8-氧基八亞甲基丁二醯亞胺等丁二醯亞胺系單體;乙酸乙烯酯、丙酸乙烯酯、N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌𠯤、乙烯基吡𠯤、乙烯基吡咯、乙烯基咪唑、乙烯基㗁唑、乙烯基嗎啉、N-乙烯基羧醯胺類、苯乙烯、α-甲基苯乙烯、N-乙烯基己內醯胺等乙烯系單體;丙烯腈、甲基丙烯腈等氰基丙烯酸酯單體;(甲基)丙烯酸縮水甘油酯等含環氧基之丙烯酸系單體;(甲基)丙烯酸聚乙二醇酯、(甲基)丙烯酸聚丙二醇酯、(甲基)丙烯酸甲氧基乙二醇酯、(甲基)丙烯酸甲氧基聚丙二醇酯等二醇系丙烯酸酯單體;(甲基)丙烯酸四氫糠酯、氟化(甲基)丙烯酸酯、(甲基)丙烯酸矽酮酯等含有雜環、鹵素原子、矽原子等之丙烯酸酯系單體;己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、環氧丙烯酸酯、聚酯丙烯酸酯、胺基甲酸酯丙烯酸酯等多官能單體;異戊二烯、丁二烯、異丁烯等烯烴系單體;乙烯醚等乙烯醚系單體等。該等單體成分可單獨使用或將2種以上組合使用。
於一實施方式中,上述丙烯酸系聚合物(預聚物)進而包含源自含羥基之單體之結構單元。藉由使用包含源自含羥基之單體之結構單元的丙烯酸系聚合物,相較於包含源自含羧基之單體之結構單元的丙烯酸系聚合物,與密封樹脂之相互作用變小,因此能夠抑制糊劑殘留。源自含羥基之單體之結構單元之含量相對於構成丙烯酸系聚合物之全部結構單元,較佳為0.1重量%~20重量%,更佳為0.5重量%~10重量%,尤佳為1重量%~7重量%。
上述丙烯酸系黏著劑視需要可含有任意適宜之添加劑。作為該添加劑,例如可例舉:交聯劑、黏著賦予劑、塑化劑(例如偏苯三甲酸酯系塑化劑、均苯四甲酸酯系塑化劑等)、顏料、染料、填充劑、抗老化劑、導電材、抗靜電劑、紫外線吸收劑、光穩定劑、剝離調整劑、軟化劑、界面活性劑、阻燃劑、抗氧化劑等。
作為上述丙烯酸系黏著劑所含之交聯劑,例如可例舉:異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑,以及脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。
於一實施方式中,相對於丙烯酸系聚合物(預聚物)之羧基的交聯劑之調配量較佳為0.08莫耳當量~2莫耳當量,更佳為0.3莫耳當量~1.6莫耳當量。若處於此種範圍,則可獲得黏著劑層中之成分之殘存羧基較少之黏著片材。此處,所謂交聯劑之調配量,意指丙烯酸系聚合物交聯前之交聯劑之含量。
作為上述丙烯酸系黏著劑所含之上述異氰酸酯系交聯劑之具體例,可例舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族異氰酸酯類;三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(Nippon Polyurethane Industry公司製造,商品名「Coronate L」)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚物加成物(Nippon Polyurethane Industry公司製造,商品名「Coronate HL」)、六亞甲基二異氰酸酯之異氰尿酸酯體(Nippon Polyurethane Industry公司製造,商品名「Coronate HX」)等異氰酸酯加成物等。異氰酸酯系交聯劑之調配量可根據所需之黏著力而設定為任意適宜之量,相對於丙烯酸系聚合物100重量份,代表性為0.1重量份~20重量份,更佳為1重量份~10重量份。若處於此種範圍,則可獲得黏著劑層中之成分之殘存羧基較少之黏著片材。此處,所謂交聯劑之調配量,意指丙烯酸系聚合物交聯前之交聯劑之含量。
於一實施方式中,作為上述交聯劑,較佳地使用環氧系交聯劑。若使用環氧系交聯劑,則可形成凝集力較高之黏著劑層,能夠更有效地防止被黏著體發生位置偏移。
作為上述丙烯酸系黏著劑所含之上述環氧系交聯劑,例如可例舉:N,N,N',N'-四縮水甘油基間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-縮水甘油基胺基甲基)環己烷(三菱瓦斯化學公司製造,商品名「Tetrad C」)、1,6-己二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 1600」)、新戊二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 1500NP」)、乙二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 40E」)、丙二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 70P」)、聚乙二醇二縮水甘油醚(日本油脂公司製造,商品名「EPIOL E-400」)、聚丙二醇二縮水甘油醚(日本油脂公司製造,商品名「EPIOL P-200」)、山梨醇聚縮水甘油醚(Nagase chemteX公司製造,商品名「DENACOL EX-611」)、甘油聚縮水甘油醚(Nagase chemteX公司製造,商品名「DENACOL EX-314」)、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚(Nagase chemteX公司製造,商品名「DENACOL EX-512」)、山梨醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三(2-羥基乙基)異氰尿酸三縮水甘油酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚、分子內具有2個以上之環氧基之環氧系樹脂等。環氧系交聯劑之調配量可根據所需之黏著力而設定為任意適宜之量,相對於丙烯酸系聚合物100重量份,代表性為0.01重量份~50重量份,更佳為1重量份~30重量份,進而較佳為2重量份~20重量份,尤佳為3重量份~15重量份。若處於此種範圍,則可獲得黏著劑層中之成分之殘存羧基較少之黏著片材。此處,所謂交聯劑之調配量,意指丙烯酸系聚合物交聯前之交聯劑之含量。
於一實施方式中,作為環氧系交聯劑,使用含N原子之交聯劑。若使用含N原子之交聯劑,則於如下方面有利:藉由觸媒作用促進交聯反應,易使黏著劑高凝膠化。
作為上述丙烯酸系黏著劑所含之上述黏著賦予劑,可使用任意適宜之黏著賦予劑。作為黏著賦予劑,例如可使用黏著賦予樹脂。作為該黏著賦予樹脂之具體例,可例舉:松香系黏著賦予樹脂(例如未改性松香、改性松香、松香酚系樹脂、松香酯系樹脂等)、萜烯系黏著賦予樹脂(例如萜烯系樹脂、萜烯酚系樹脂、苯乙烯改性萜烯系樹脂、芳香族改性萜烯系樹脂、氫化萜烯系樹脂)、烴系黏著賦予樹脂(例如脂肪族系烴樹脂、脂肪族系環狀烴樹脂、芳香族系烴樹脂(例如苯乙烯系樹脂、二甲苯系樹脂等)、脂肪族-芳香族系石油樹脂、脂肪族-脂環族系石油樹脂、氫化烴樹脂、苯并呋喃系樹脂、苯并呋喃-茚系樹脂等)、酚系黏著賦予樹脂(例如烷基酚系樹脂、二甲苯甲醛系樹脂、可溶酚醛、酚醛清漆等)、酮系黏著賦予樹脂、聚醯胺系黏著賦予樹脂、環氧系黏著賦予樹脂、彈性體系黏著賦予樹脂等。其中,較佳為松香系黏著賦予樹脂、萜烯系黏著賦予樹脂或烴系黏著賦予樹脂(苯乙烯系樹脂等)。黏著賦予劑可單獨使用或將2種以上組合使用。上述黏著賦予劑之添加量相對於基礎聚合物100重量份,較佳為5重量份~100重量份,更佳為8重量份~50重量份。
較佳為使用軟化點或玻璃轉移溫度(Tg)較高之樹脂作為上述黏著賦予樹脂。若使用軟化點或玻璃轉移溫度(Tg)較高之樹脂,則可形成即便於高溫環境下(例如半導體晶片密封時之加工等高溫環境下)亦能夠表現出較高黏著性之黏著劑層。黏著賦予劑之軟化點較佳為100℃~180℃,更佳為110℃~180℃,進而較佳為120℃~180℃。黏著賦予劑之玻璃轉移溫度(Tg)較佳為100℃~180℃,更佳為110℃~180℃,進而較佳為120℃~180℃。
較佳為使用低極性之黏著賦予樹脂作為上述黏著賦予樹脂。若使用低極性之黏著賦予樹脂,則可形成與密封材料之親和性較低之黏著劑層。作為低極性之黏著賦予樹脂,例如可例舉:脂肪族系烴樹脂、脂肪族系環狀烴樹脂、芳香族系烴樹脂(例如苯乙烯系樹脂、二甲苯系樹脂等)、脂肪族・芳香族系石油樹脂、脂肪族・脂環族系石油樹脂、氫化烴樹脂等烴系黏著賦予樹脂。其中,較佳為碳數5~9之黏著賦予劑。其原因在於,此種黏著賦予劑不僅為低極性,且與丙烯酸系聚合物之相溶性優異,於廣泛之溫度範圍內不會發生相分離,可形成穩定性優異之黏著劑層。
上述黏著賦予樹脂之酸值較佳為40以下,更佳為20以下,進而較佳為10以下。若處於此種範圍,則可形成與密封材料之親和性較低之黏著劑層。上述黏著賦予樹脂之羥值較佳為60以下,更佳為40以下,進而較佳為20以下。若處於此種範圍,則可形成與密封材料之親和性較低之黏著劑層。
C. 基材作為上述基材,例如可例舉:樹脂片材、不織布、紙、金屬箔、織布、橡膠片材、發泡片材、該等之積層體(尤其是包含樹脂片材之積層體)等。作為構成樹脂片材之樹脂,例如可例舉:聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯(PBT)、聚乙烯(PE)、聚丙烯(PP)、乙烯-丙烯共聚物、乙烯-乙酸乙烯酯共聚物(EVA)、聚醯胺(尼龍)、全芳香族聚醯胺(aramid)、聚醯亞胺(PI)、聚氯乙烯(PVC)、聚苯硫醚(PPS)、氟系樹脂、聚醚醚酮(PEEK)等。作為不織布,可例舉:包含馬尼拉麻之不織布等由具有耐熱性之天然纖維製成之不織布;聚丙烯樹脂不織布、聚乙烯樹脂不織布、酯系樹脂不織布等合成樹脂不織布等。作為金屬箔,可例舉:銅箔、不鏽鋼箔、鋁箔等。作為紙,可例舉:日本紙、牛皮紙等。
上述基材之厚度可根據所需之強度或柔軟性、以及使用目的等設定為任意適宜之厚度。基材之厚度較佳為1000 μm以下,更佳為1 μm~1000 μm,進而較佳為1 μm~500 μm,尤佳為3 μm~300 μm,最佳為5 μm~250 μm。
亦可對上述基材實施表面處理。作為表面處理,例如可例舉:電暈處理、鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、離子化輻射處理、塗佈底塗劑層之處理等。
作為上述有機塗層材料,例如可例舉塑膠硬塗材料II(CMC出版,(2004))中記載之材料。較佳地使用胺基甲酸酯系聚合物,更佳地使用聚丙烯酸胺基甲酸酯、聚酯胺基甲酸酯或該等之前驅物。其原因在於,於基材上之塗覆、塗佈簡便,且有多種工業製品可供選擇、獲取成本低廉。該胺基甲酸酯系聚合物例如為包含異氰酸酯單體與含醇性羥基之單體(例如含羥基之丙烯酸系化合物或含羥基之酯化合物)之反應混合物之聚合物。有機塗層材料亦可包含聚胺等擴鏈劑、抗老化劑、氧化穩定劑等作為任意之添加劑。有機塗層之厚度並無特別限定,例如宜為0.1 μm~10 μm左右,較佳為0.1 μm~5 μm左右,更佳為0.5 μm~5 μm左右。
D. 第 2 黏著劑層上述第2黏著劑層可為由任意適宜之黏著劑構成之黏著劑層。於一實施方式中,如上所述,第2黏著劑層進而包含熱膨脹性微小球。
上述第2黏著劑層所含之黏著劑可為硬化型黏著劑(例如活性能量線硬化型黏著劑),亦可為感壓型黏著劑。作為感壓型黏著劑,例如可例舉:丙烯酸系黏著劑、橡膠系黏著劑等。第2黏著劑層所含之黏著劑之詳情例如可參考日本專利特開2018-009050號公報之記載。於本說明書中以參考之形式援用該公報全文。
作為上述熱膨脹性微小球,只要為藉由加熱能夠膨脹或發泡之微小球,則可使用任意適宜之熱膨脹性微小球。作為上述熱膨脹性微小球,例如可使用將藉由加熱容易膨脹之物質內包於具有彈性之殼內而成之微小球。此種熱膨脹性微小球可藉由任意適宜之方法例如凝聚法、界面聚合法等製造。
作為藉由加熱容易膨脹之物質,例如可例舉:丙烷、丙烯、丁烯、正丁烷、異丁烷、異戊烷、新戊烷、正戊烷、正己烷、異己烷、庚烷、辛烷、石油醚、甲烷之鹵化物、四烷基矽烷等低沸點液體;經熱分解後氣化之偶氮二甲醯胺等。
作為構成上述殼之物質,例如可例舉由丙烯腈、甲基丙烯腈、α-氯丙烯腈、α-乙氧基丙烯腈、反丁烯二腈等腈單體;丙烯酸、甲基丙烯酸、伊康酸、順丁烯二酸、反丁烯二酸、檸康酸等羧酸單體;偏二氯乙烯;乙酸乙烯酯;(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異𦯉酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯、丙烯酸β-羧基乙酯等(甲基)丙烯酸酯;苯乙烯、α-甲基苯乙烯、氯苯乙烯等苯乙烯單體;丙烯醯胺、取代丙烯醯胺、甲基丙烯醯胺、取代甲基丙烯醯胺等醯胺單體等構成之聚合物。由該等單體構成之聚合物可為均聚物,亦可為共聚物。作為該共聚物,例如可例舉:偏二氯乙烯‐甲基丙烯酸甲酯-丙烯腈共聚物、甲基丙烯酸甲酯-丙烯腈-甲基丙烯腈共聚物、甲基丙烯酸甲酯-丙烯腈共聚物、丙烯腈-甲基丙烯腈-伊康酸共聚物等。
作為上述熱膨脹性微小球,可使用無機系發泡劑或有機系發泡劑。作為無機系發泡劑,例如可例舉:碳酸銨、碳酸氫銨、碳酸氫鈉、亞硝酸銨、硼氫化鈉、各種疊氮類等。又,作為有機系發泡劑,例如可例舉:三氯單氟甲烷、二氯單氟甲烷等氟氯化烷烴系化合物;偶氮二異丁腈、偶氮二甲醯胺、偶氮二甲酸鋇等偶氮系化合物;對甲苯磺醯肼、二苯碸-3,3'-二磺醯肼、4,4'-氧基雙(苯磺醯肼)、烯丙基雙(磺醯肼)等肼系化合物;對甲苯磺醯胺基脲、4,4'-氧基雙(苯磺醯胺基脲)等胺基脲系化合物;5-嗎啉基-1,2,3,4-噻三唑等三唑系化合物;N,N'-二亞硝基五亞甲基四胺、N,N'-二甲基-N,N'-二亞硝基對苯二甲醯胺等N-亞硝基系化合物等。
上述熱膨脹性微小球亦可使用市售品。作為市售品之熱膨脹性微小球之具體例,可例舉:松本油脂製藥公司製造之商品名「Matsumoto Microsphere」(等級:F-30、F-30D、F-36D、F-36LV、F-50、F-50D、F-65、F-65D、FN-100SS、FN-100SSD、FN-180SS、FN-180SSD、F-190D、F-260D、F-2800D),日本Fillite公司製造之商品名「Expancel」(等級:053-40、031-40、920-40、909-80、930-120),吳羽化學工業公司製造「DAIFOAM」(等級:H750、H850、H1100、S2320D、S2640D、M330、M430、M520),積水化學工業公司製造「ADVANCELL」(等級:EML101、EMH204、EHM301、EHM302、EHM303、EM304、EHM401、EM403、EM501)等。
上述熱膨脹性微小球於加熱前之粒徑較佳為0.5 μm~80 μm,更佳為5 μm~45 μm,進而較佳為10 μm~20 μm,尤佳為10 μm~15 μm。因此,關於上述熱膨脹性微小球於加熱前之粒子尺寸,以平均粒徑來計,較佳為6 μm~45 μm,更佳為15 μm~35 μm。上述粒徑與平均粒徑係可藉由雷射散射法中之粒度分佈測定法求出之值。
上述熱膨脹性微小球較佳為具有適宜之強度以在體積膨脹率達到較佳為5倍以上、更佳為7倍以上、進而較佳為10倍以上之前不會破裂。於使用此種熱膨脹性微小球之情形時,可藉由加熱處理而高效率地降低黏著力。
上述黏著劑層中之熱膨脹性微小球之含有比率可根據所需之黏著力之降低性等來適當設定。相對於形成第2黏著劑層之基礎聚合物100重量份,熱膨脹性微小球之含有比率例如為1重量份~150重量份,較佳為10重量份~130重量份,進而較佳為25重量份~100重量份。
於上述黏著劑層包含熱膨脹性微小球之情形時,熱膨脹性微小球膨脹前(即加熱前)之黏著劑層之算術表面粗糙度Ra較佳為500 nm以下,更佳為400 nm以下,進而較佳為300 nm以下。若處於此種範圍,則可獲得對被黏著體之密接性優異之黏著片材。如此表面平滑性優異之黏著劑層例如可藉由將黏著劑層之厚度設為上述範圍而獲得。
於上述黏著劑層包含熱膨脹性微小球之情形時,上述黏著劑層較佳為含有由在80℃下之動態儲存模數處於5 kPa~1 MPa(更佳為10 kPa~0.8 MPa)之範圍之基礎聚合物構成的黏著劑。若為此種黏著劑層,則可形成於加熱前具有適度之黏著性、而藉由加熱黏著力易降低之黏著片材。再者,可使用動態黏彈性測定裝置(例如Rheometrics公司製造之商品名「ARES」),於頻率1 Hz、升溫速度10℃/min之測定條件下測定動態儲存模數。
E. 黏著片材之製造方法本發明之黏著片材可藉由任意適宜之方法製造。本發明之黏著片材例如可例舉:於基材上直接塗佈包含丙烯酸系黏著劑之組合物之方法、或者將於任意適宜之基體上塗佈包含丙烯酸系黏著劑之組合物所形成之塗佈層轉印至基材之方法等。包含丙烯酸系黏著劑之組合物可包含任意適宜之溶劑。
於形成包含熱膨脹性微小球之黏著劑層之情形時,可於基材塗佈包含熱膨脹性微小球、黏著劑及任意適宜之溶劑之組合物而形成該黏著劑層。或可於黏著劑塗佈層撒上熱膨脹性微小球後,使用貼合機等將該熱膨脹性微小球埋入黏著劑中,而形成包含熱膨脹性微小球之黏著劑層。
作為上述黏著劑及各組合物之塗佈方法,可採用任意適宜之塗佈方法。例如可於塗佈後進行乾燥而形成各層。作為塗佈方法,例如可例舉使用多功能塗佈機(Multi Coater)、模嘴塗佈機、凹版塗佈機、敷料器等之塗佈方法。作為乾燥方法,例如可例舉自然乾燥、加熱乾燥等。加熱乾燥之情形時,加熱溫度可根據作為乾燥對象之物質之特性來設定任意適宜之溫度。
[實施例]
以下,藉由實施例具體地說明本發明,但本發明並不該等限定於實施例。實施例中之評價方法如下所述。又,於實施例中,只要無特別說明,「份」及「%」為重量基準。
(1)酸值
藉由以下之方法測定構成黏著劑層之基礎聚合物之酸值。
利用氯仿使特定量之黏著劑層膨潤後,添加過量之甲醇,分離為可溶物(溶膠)與不溶物(凝膠),利用濾紙進行過濾,回收不溶物(共進行3次該操作),加以乾燥後獲得不溶物(凝膠),將其作為測定樣品。
對於該測定樣品,依據JIS K 2501,使用電位差滴定裝置AT-500 N(京都電子工業股份有限公司製造)、作為電極之玻璃電極H-171、R-173(京都電子工業股份有限公司製造),藉由電位差滴定法測定酸值,將其作為基礎聚合物之酸值。
測定程序如下:於300 mL之三角燒瓶中添加測定樣品與混合溶劑200 mL,使之膨潤後,進行滴定。藉由相同之方法進行空白試驗,根據下式(1)算出酸值。
酸值(mgKOH/g)=(V
1-V
0)×f×0.1×56.11/S・・・(1)
S:所採集試樣之質量(g)
V
0:空白試驗中所需之滴定液之量(mL)
V
1:本試驗中所需之滴定液之量(mL)
f:滴定液之係數(f=1.002)
再者,上述測定中之測定條件如下所示。
・滴定液:0.1 mol/L之KOH醇溶液(市售品)
・混合溶劑:甲苯:水:異丙醇=500:5:495
(2)黏著力
使用2 kg手壓輥,於黏著片材(寬度20 mm×長度140 mm)之與黏著劑層相反一側之整個面經由雙面膠帶(日東電工公司製造,商品名「No.531」)貼附SUS304板。
繼而,於黏著劑層之整個表面貼附(溫度:23℃、濕度:65%,用2 kg壓輥來回滾壓1次)聚對苯二甲酸乙二酯膜(Toray公司製造,商品名「Lumirror S-10」,厚度:25 μm、寬度:30 mm)。
將以如上方式獲得之評價用試樣供於拉伸試驗。作為拉伸試驗機,使用島津製作所公司製造之商品名「Shimadzu Autograph AG-120kN」。將評價用試樣安裝於拉伸試驗機後,於23℃之環境溫度下放置30分鐘後,開始拉伸試驗。拉伸試驗之條件設為剝離角度:180°、剝離速度(拉伸速度):300 mm/min。測定自上述PET膜剝離黏著片材時之荷重,將此時之最大荷重作為黏著片材之黏著力。
(3)剪切接著力
使用日東電工股份有限公司製造之雙面膠帶No.585,將實施例1~7及比較例中獲得之黏著片材(尺寸:20 mm×20 mm)之與黏著劑層相反一側之面(實施例7中為第2黏著劑層面)貼附固定在特定之載台(20 mm×20 mm矽晶片)上,使用鑷子將5 mm×5 mm矽晶片(鏡面)以晶片角不接觸黏著劑表面層之方式垂直貼附於該黏著片材之黏著劑層表面。其後,於130℃下加熱30分鐘而使矽晶片密接於黏著劑表面,從而製作評價用樣品。
對於該評價用樣品,於測定溫度(150℃、190℃)下,使用Nordson公司製造之dage4000,於距貼附面之高度為250 μm之位置處在5 mm×5 mm矽晶片之側面安裝測定端子,以剪切速度500 μm/sec.沿與晶片水平之方向施加外力,藉此獲得荷重-位移曲線,自該荷重-位移曲線讀取最大破壞荷重,並將之作為剪切接著強度。
(4)凝膠分率
採集約0.5 g之黏著劑層(重量W1),用平均孔徑0.2 μm之多孔質聚四氟乙烯膜(重量W2)包成荷包狀,並用風箏線(重量W3)束口。將該荷包浸漬於50 mL甲苯中,於室溫(25℃)下保持7天,僅使黏著劑層中之溶膠成分溶出至上述膜外後,取出上述荷包,拭去外表面附著之甲苯,將該荷包於130℃下乾燥2小時後,測定該荷包之重量(W4)。然後,將各值代入下式中,藉此求出凝膠分率。
凝膠分率(%)=[(W4-W2-W3)/W1]×100
(5)氮氣產生量
關於黏著劑層受到加熱處理時之氮氣之產生量,係採集黏著劑層,放在瓷板上,利用微天平稱重後,對於該評價樣品,使用TN(微量總氮分析)裝置而求出。再者,關於瓷板,使用預先導入裝置內進行過空燒者。進行2次測定,求出其平均值。
再者,上述測定中之測定條件如下所示。
・溫度:熱分解爐800℃、氧化爐900℃
・載氣:O
2(300 mL/min)、Ar(300 mL/min)
・標準試樣:吡啶/甲苯溶液
・檢測器:減壓化學發光檢測器
・範圍:高濃度
(6)糊劑殘留評價
於實施例及比較例中獲得之黏著片材(尺寸:50 mm×125 mm)之黏著劑層上配置厚度0.3 mm之邊框狀隔離件(內部尺寸25 mm×95 mm),於該隔離件之內側以硬化後之樹脂厚度為0.3 mm之方式撒上顆粒狀之環氧樹脂系密封材(住友電木公司製造,G730)後,覆蓋經矽酮處理之剝離襯墊,繼而,使用真空壓縮成型機將該評價用樣品於130℃下進行600秒壓縮成型,其次,於140℃下加熱1小時使之硬化,而於黏著片材之黏著劑層上形成密封樹脂,從而形成構造體。
將藉由如上方式獲得之構造體加以冷卻,其後,利用拉伸試驗機自構造體剝離黏著片材。於拉伸試驗機上安裝構造體後,於23℃或80℃之環境溫度下放置30分鐘後,於各溫度環境下開始拉伸試驗。拉伸試驗之條件設為剝離角度:180°、剝離速度(拉伸速度):300 mm/min。自上述密封樹脂剝離黏著片材後,目視觀察上述構造體之貼附面之糊劑殘留,並根據以下之條件進行評價。
◎:於23℃及80℃兩種環境溫度下均未觀察到環氧樹脂系密封材上有糊劑殘留
○:僅於80℃環境溫度下未觀察到環氧樹脂系密封材上有糊劑殘留
×:於80℃環境溫度下觀察到環氧樹脂系密封材上有糊劑殘留
[實施例1]
將丙烯酸系共聚物A(丙烯酸2-乙基己酯與丙烯酸之共聚物,丙烯酸2-乙基己酯結構單元:丙烯酸結構單元=95:5(重量比))100重量份、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「Tetrad C」)3重量份、松香酚系黏著賦予樹脂(住友電木公司製造,商品名「SUMILITERESIN PR-12603」)10重量份、及甲苯100重量份進行混合,製備黏著劑層形成用組合物。
於作為基材之聚對苯二甲酸乙二酯膜(Toray公司製造,商品名「Lumirror S10」,厚度38 μm)之一面塗佈該黏著劑層形成用組合物,獲得由基材與黏著劑層(厚度5 μm)構成之黏著片材。
將所獲得之黏著片材供於上述評價(1)~(6)。結果示於表1。
[實施例2]
將環氧系交聯劑之調配量設為5重量份,且不調配松香酚系黏著賦予樹脂而製備黏著劑層形成用組合物,除此以外,藉由與實施例1相同之方式獲得黏著片材。將所獲得之黏著片材供於上述評價(1)~(6)。結果示於表1。
[實施例3]
將環氧系交聯劑之調配量設為5重量份而製備黏著劑層形成用組合物,除此以外,藉由與實施例1相同之方式獲得黏著片材。將所獲得之黏著片材供於上述評價(1)~(6)。結果示於表1。
[實施例4]
將環氧系交聯劑之調配量設為10重量份而製備黏著劑層形成用組合物,除此以外,藉由與實施例1相同之方式獲得黏著片材。將所獲得之黏著片材供於上述評價(1)~(6)。結果示於表1。
[實施例5]
將丙烯酸系共聚物B(丙烯酸2-乙基己酯與丙烯酸羥基乙酯之共聚物,丙烯酸2-乙基己酯結構單元:丙烯酸羥基乙酯結構單元=100:4(重量比))100重量份、異氰酸酯系交聯劑(Nippon Polyurethane Industry公司製造,商品名「Coronate L」)3重量份、松香酚系黏著賦予樹脂(住友電木公司製造,商品名「SUMILITERESIN PR-12603」)10重量份、及甲苯100重量份進行混合,製備黏著劑層形成用組合物。
於作為基材之聚對苯二甲酸乙二酯膜(Toray公司製造,商品名「Lumirror S10」,厚度38 μm)之一面塗佈該黏著劑層形成用組合物,獲得由基材與黏著劑層(厚度5 μm)構成之黏著片材。
[實施例6]
將丙烯酸系共聚物A(丙烯酸2-乙基己酯與丙烯酸之共聚物,丙烯酸2-乙基己酯結構單元:丙烯酸結構單元=95:5(重量比))100重量份、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「Tetrad C」)5重量份、萜烯酚系黏著賦予樹脂(YASUHARA Chemicals公司製造,商品名「YS POLYSTER S145」)10重量份、及甲苯100重量份進行混合,製備黏著劑層形成用組合物。
於作為基材之聚對苯二甲酸乙二酯膜(Toray公司製造,商品名「Lumirror S10」,厚度38 μm)之一面塗佈該黏著劑層形成用組合物,獲得由基材與黏著劑層(厚度10 μm)構成之黏著片材。
將所獲得之黏著片材供於上述評價(1)~(6)。結果示於表1。
[實施例7]
將丙烯酸系共聚物C(丙烯酸2-乙基己酯、丙烯酸乙酯、甲基丙烯酸甲酯及丙烯酸羥基乙酯之共聚物,丙烯酸2-乙基己酯結構單元:丙烯酸乙酯結構單元:甲基丙烯酸甲酯結構單元:丙烯酸結構單元=30:70:5:4(重量比))100重量份、熱膨脹性微小球(松本油脂製藥公司製造,商品名「Matsumoto Microsphere F-190D」)30重量份、異氰酸酯系交聯劑(Tosoh公司製造,商品名「Coronate L」)1.4重量份、黏著賦予劑(YASUHARA Chemicals公司製造,商品名「Mighty Ace G125」)10重量份、及甲苯100重量份進行混合而製備黏著劑層形成用組合物,於實施例3之黏著片材之聚對苯二甲酸乙二酯膜之與黏著劑層相反一側之面塗佈該黏著劑層形成用組合物而形成第2黏著劑層(厚度45 μm),獲得雙面黏著片材。將所獲得之雙面黏著片材之黏著劑層供於上述評價(1)~(6)。結果示於表1。
[比較例1]
將丙烯酸系共聚物(丙烯酸2-乙基己酯與丙烯酸之共聚物,丙烯酸2-乙基己酯結構單元:丙烯酸結構單元=95:5(重量比))100重量份、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「Tetrad C」)0.5重量份、萜烯酚系黏著賦予樹脂(YASUHARA Chemicals公司製造,商品名「YS POLYSTER S145」)10重量份、及甲苯100重量份進行混合,製備黏著劑層形成用組合物。
於作為基材之聚對苯二甲酸乙二酯膜(Toray公司製造,商品名「Lumirror S10」,厚度38 μm)之一面塗佈該黏著劑層形成用組合物,獲得由基材與黏著劑層(厚度10 μm)構成之黏著片材。
[表1]
實施例1 | 實施例2 | 實施例3 | 實施例4 | 實施例5 | 實施例6 | 實施例7 | 比較例1 | |||
黏著劑組合物成分調配量 (重量份) | 預聚物 | 聚合物A (2EHA/AA=95/5) | 100 | 100 | 100 | 100 | 100 | 100 | 100 | |
聚合物B (2EHA/HEA=100/4) | 100 | |||||||||
交聯劑 | 環氧交聯劑 (Tetrad C) | 3 | 5 | 5 | 10 | 5 | 5 | 0.5 | ||
異氰酸酯系交聯劑 (Coronate L) | 3 | |||||||||
黏著賦予劑 | 松香酚系黏著賦予樹脂 (SUMILITERESIN PR-12603) | 10 | 10 | 10 | 10 | 10 | ||||
萜烯酚系黏著賦予樹脂 (YS POLYSTER S145) | 10 | 10 | ||||||||
評價 | 酸值(mgKOH/g) | 9.5 | 3.7 | 3.8 | 0.12 | 0.01 | 3.6 | 3.8 | 16.6 | |
黏著力(N/20 mm) | 0.68 | 0.12 | 0.23 | 0.11 | 0.84 | 0.22 | 0.22 | 7.24 | ||
剪切接著力@150℃(g) | 1067 | 918 | 965 | 948 | 901 | 960 | 957 | 226 | ||
剪切接著力@190℃(g) | 535 | 505 | 493 | 463 | 443 | 498 | 489 | 294 | ||
剪切接著力@150℃/黏著力(g/(N/20 mm)) | 1569 | 7650 | 4196 | 8618 | 1073 | 4364 | 4350 | 31 | ||
凝膠分率(%) | 88.5 | 98 | 92.5 | 95 | 86.5 | 92 | 92.4 | 83 | ||
氮氣產生量 | 0.19 | 0.31 | 0.31 | 0.62 | 0.26 | 0.31 | 0.31 | 0.049 | ||
糊劑殘留評價 | ○ | ◎ | ◎ | ◎ | ○ | ◎ | ◎ | × |
10:基材
20:黏著劑層
30:第2黏著劑層
100,200:黏著片材
圖1係本發明之一實施方式之黏著片材之概略剖視圖。
圖2係本發明之另一實施方式之黏著片材之概略剖視圖。
10:基材
20:黏著劑層
100:黏著片材
Claims (9)
- 一種黏著片材,其具備基材與配置於該基材之至少一側之黏著劑層,該黏著劑層含有丙烯酸系黏著劑,該丙烯酸系黏著劑包含酸值為16mgKOH/g以下之基礎聚合物、以及含N原子之環氧系交聯劑,該基礎聚合物包含源自含羧基之單體之結構單元,該黏著劑層受加熱處理時之氮氣之產生量為0.05wt%~1.0wt%。
- 如請求項1之黏著片材,其具備:上述基材、配置於該基材之一側之上述黏著劑層、及配置於該基材之與該黏著劑層相反一側之第2黏著劑層。
- 如請求項1或2之黏著片材,其在上述黏著劑層貼附有矽晶片時在150℃下之剪切接著力B相對於將上述黏著劑層貼附於聚對苯二甲酸乙二酯時在23℃下之黏著力A的比(剪切接著力B/黏著力A)為32.0g/(N/20mm)以上。
- 如請求項1或2之黏著片材,其中上述基礎聚合物為丙烯酸系聚合物之交聯體。
- 如請求項1或2之黏著片材,其中上述黏著劑層之凝膠分率為75%以 上。
- 如請求項4之黏著片材,其中上述交聯劑之調配量相對於上述丙烯酸系聚合物之羧基為0.08莫耳當量~2莫耳當量。
- 如請求項1或2之黏著片材,其中上述黏著劑層之厚度為1μm~300μm。
- 如請求項1或2之黏著片材,其為在半導體晶片之樹脂密封步驟中可使用之暫時固定材。
- 如請求項8之黏著片材,其係於上述黏著片材上使密封樹脂硬化時使用。
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