TWI801103B - 覆銅積層板、聚醯亞胺樹脂及其製造方法 - Google Patents

覆銅積層板、聚醯亞胺樹脂及其製造方法 Download PDF

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Publication number
TWI801103B
TWI801103B TW111102752A TW111102752A TWI801103B TW I801103 B TWI801103 B TW I801103B TW 111102752 A TW111102752 A TW 111102752A TW 111102752 A TW111102752 A TW 111102752A TW I801103 B TWI801103 B TW I801103B
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TW
Taiwan
Prior art keywords
copper
manufacturing
polyimide resin
clad laminate
clad
Prior art date
Application number
TW111102752A
Other languages
English (en)
Other versions
TW202330722A (zh
Inventor
廖德超
黃威儒
張宏毅
劉家霖
魏千凱
Original Assignee
南亞塑膠工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南亞塑膠工業股份有限公司 filed Critical 南亞塑膠工業股份有限公司
Priority to TW111102752A priority Critical patent/TWI801103B/zh
Priority to CN202210195652.XA priority patent/CN116515107A/zh
Application granted granted Critical
Publication of TWI801103B publication Critical patent/TWI801103B/zh
Publication of TW202330722A publication Critical patent/TW202330722A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW111102752A 2022-01-22 2022-01-22 覆銅積層板、聚醯亞胺樹脂及其製造方法 TWI801103B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW111102752A TWI801103B (zh) 2022-01-22 2022-01-22 覆銅積層板、聚醯亞胺樹脂及其製造方法
CN202210195652.XA CN116515107A (zh) 2022-01-22 2022-03-01 覆铜积层板、聚酰亚胺树脂及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111102752A TWI801103B (zh) 2022-01-22 2022-01-22 覆銅積層板、聚醯亞胺樹脂及其製造方法

Publications (2)

Publication Number Publication Date
TWI801103B true TWI801103B (zh) 2023-05-01
TW202330722A TW202330722A (zh) 2023-08-01

Family

ID=87405191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111102752A TWI801103B (zh) 2022-01-22 2022-01-22 覆銅積層板、聚醯亞胺樹脂及其製造方法

Country Status (2)

Country Link
CN (1) CN116515107A (zh)
TW (1) TWI801103B (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5480965A (en) * 1992-05-25 1996-01-02 Mitsui Toatsu Chemicals, Inc. Readily soluble, amorphous polyimide, and preparation process of same
CN109734910A (zh) * 2019-01-24 2019-05-10 银禧工程塑料（东莞）有限公司 一种聚酰亚胺及其制备方法和应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000319390A (ja) * 1999-05-10 2000-11-21 Mitsui Chemicals Inc ポリアミド酸、ポリイミドおよびそれらの製造方法
US7193030B2 (en) * 2003-06-18 2007-03-20 Mitsubishi Gas Chemical Company, Inc. Acid anhydride and polyimide using the same
JP5338469B2 (ja) * 2008-05-14 2013-11-13 三菱瓦斯化学株式会社 ポリイミドおよびポリアミック酸
WO2010073952A1 (ja) * 2008-12-26 2010-07-01 三菱瓦斯化学株式会社 樹脂複合銅箔
TWI544031B (zh) * 2015-07-07 2016-08-01 律勝科技股份有限公司 聚醯亞胺樹脂及其製造方法與薄膜
TWI572479B (zh) * 2015-07-07 2017-03-01 律勝科技股份有限公司 包含聚醯亞胺樹脂之金屬積層板及其製造方法
CN106977716A (zh) * 2015-09-30 2017-07-25 荒川化学工业株式会社 树脂组合物、胶粘剂、膜状胶粘材料、胶粘片、带树脂的铜箔、覆铜层叠板、布线板
TWI609897B (zh) * 2017-02-15 2018-01-01 律勝科技股份有限公司 聚醯亞胺樹脂及其製造方法與薄膜
CN107353401B (zh) * 2017-08-24 2020-06-30 宋立旺 一种双羟基聚苯醚及其制备方法
CN109161014B (zh) * 2018-07-13 2021-11-02 湘潭大学 一种低分子量双端羟基聚苯醚树脂的制备方法
JP7093282B2 (ja) * 2018-09-29 2022-06-29 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板
CN109517164B (zh) * 2018-10-29 2020-06-16 广东省石油与精细化工研究院 一种双端羟基聚苯醚低聚物的合成方法
CN110669218B (zh) * 2019-10-09 2022-03-29 广东东溢新材料科技有限公司 一种改性聚酰亚胺、粘合组合物及其制备方法和应用

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5480965A (en) * 1992-05-25 1996-01-02 Mitsui Toatsu Chemicals, Inc. Readily soluble, amorphous polyimide, and preparation process of same
CN109734910A (zh) * 2019-01-24 2019-05-10 银禧工程塑料（东莞）有限公司 一种聚酰亚胺及其制备方法和应用

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Publication number Publication date
TW202330722A (zh) 2023-08-01
CN116515107A (zh) 2023-08-01

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