TWI800969B - 切斷裝置 - Google Patents
切斷裝置 Download PDFInfo
- Publication number
- TWI800969B TWI800969B TW110140537A TW110140537A TWI800969B TW I800969 B TWI800969 B TW I800969B TW 110140537 A TW110140537 A TW 110140537A TW 110140537 A TW110140537 A TW 110140537A TW I800969 B TWI800969 B TW I800969B
- Authority
- TW
- Taiwan
- Prior art keywords
- cutting device
- cutting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Nonmetal Cutting Devices (AREA)
- Details Of Cutting Devices (AREA)
- Scissors And Nippers (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-194384 | 2020-11-24 | ||
JP2020194384A JP2022083115A (ja) | 2020-11-24 | 2020-11-24 | 切断装置及び切断品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202221776A TW202221776A (zh) | 2022-06-01 |
TWI800969B true TWI800969B (zh) | 2023-05-01 |
Family
ID=81754313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110140537A TWI800969B (zh) | 2020-11-24 | 2021-11-01 | 切斷裝置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2022083115A (ko) |
KR (1) | KR20230088771A (ko) |
CN (1) | CN116669901A (ko) |
TW (1) | TWI800969B (ko) |
WO (1) | WO2022113573A1 (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017147304A (ja) * | 2016-02-16 | 2017-08-24 | 株式会社ディスコ | 切削方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011040542A (ja) * | 2009-08-10 | 2011-02-24 | Disco Abrasive Syst Ltd | パッケージ基板の分割方法 |
JP5709593B2 (ja) * | 2011-03-09 | 2015-04-30 | 株式会社ディスコ | 加工装置 |
JP6037372B2 (ja) * | 2011-08-03 | 2016-12-07 | 株式会社ディスコ | パッケージ基板分割装置 |
JP2015191993A (ja) | 2014-03-28 | 2015-11-02 | 株式会社東京精密 | 半導体製造装置及び半導体の製造方法 |
JP6640142B2 (ja) * | 2017-03-31 | 2020-02-05 | Towa株式会社 | 切断装置、半導体パッケージの貼付方法及び電子部品の製造方法 |
-
2020
- 2020-11-24 JP JP2020194384A patent/JP2022083115A/ja active Pending
-
2021
- 2021-10-19 WO PCT/JP2021/038660 patent/WO2022113573A1/ja active Application Filing
- 2021-10-19 CN CN202180077160.4A patent/CN116669901A/zh active Pending
- 2021-10-19 KR KR1020237016363A patent/KR20230088771A/ko unknown
- 2021-11-01 TW TW110140537A patent/TWI800969B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017147304A (ja) * | 2016-02-16 | 2017-08-24 | 株式会社ディスコ | 切削方法 |
Also Published As
Publication number | Publication date |
---|---|
CN116669901A (zh) | 2023-08-29 |
JP2022083115A (ja) | 2022-06-03 |
TW202221776A (zh) | 2022-06-01 |
WO2022113573A1 (ja) | 2022-06-02 |
KR20230088771A (ko) | 2023-06-20 |
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