TWI800924B - 三維記憶體裝置 - Google Patents

三維記憶體裝置 Download PDF

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Publication number
TWI800924B
TWI800924B TW110134679A TW110134679A TWI800924B TW I800924 B TWI800924 B TW I800924B TW 110134679 A TW110134679 A TW 110134679A TW 110134679 A TW110134679 A TW 110134679A TW I800924 B TWI800924 B TW I800924B
Authority
TW
Taiwan
Prior art keywords
memory device
dimension memory
dimension
memory
Prior art date
Application number
TW110134679A
Other languages
English (en)
Other versions
TW202315075A (zh
Inventor
葉騰豪
Original Assignee
旺宏電子股份有限公司
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Publication date
Application filed by 旺宏電子股份有限公司 filed Critical 旺宏電子股份有限公司
Priority to TW110134679A priority Critical patent/TWI800924B/zh
Publication of TW202315075A publication Critical patent/TW202315075A/zh
Application granted granted Critical
Publication of TWI800924B publication Critical patent/TWI800924B/zh

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TW110134679A 2021-09-16 2021-09-16 三維記憶體裝置 TWI800924B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110134679A TWI800924B (zh) 2021-09-16 2021-09-16 三維記憶體裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110134679A TWI800924B (zh) 2021-09-16 2021-09-16 三維記憶體裝置

Publications (2)

Publication Number Publication Date
TW202315075A TW202315075A (zh) 2023-04-01
TWI800924B true TWI800924B (zh) 2023-05-01

Family

ID=86943031

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110134679A TWI800924B (zh) 2021-09-16 2021-09-16 三維記憶體裝置

Country Status (1)

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TW (1) TWI800924B (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140038400A1 (en) * 2010-11-17 2014-02-06 Samsung Electronics Co., Ltd. 3d semiconductor devices and methods of fabricating same
US20140192594A1 (en) * 2013-01-09 2014-07-10 Macronix International Co., Ltd. P-channel 3d memory array
TW201503287A (zh) * 2013-03-14 2015-01-16 Crossbar Inc 用於記憶單元的低溫原位摻雜矽基導體材料

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140038400A1 (en) * 2010-11-17 2014-02-06 Samsung Electronics Co., Ltd. 3d semiconductor devices and methods of fabricating same
US20140192594A1 (en) * 2013-01-09 2014-07-10 Macronix International Co., Ltd. P-channel 3d memory array
TW201503287A (zh) * 2013-03-14 2015-01-16 Crossbar Inc 用於記憶單元的低溫原位摻雜矽基導體材料

Also Published As

Publication number Publication date
TW202315075A (zh) 2023-04-01

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