TWI800578B - 用於錫或錫合金電鍍之包含抑製劑之組成物 - Google Patents

用於錫或錫合金電鍍之包含抑製劑之組成物 Download PDF

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Publication number
TWI800578B
TWI800578B TW107145678A TW107145678A TWI800578B TW I800578 B TWI800578 B TW I800578B TW 107145678 A TW107145678 A TW 107145678A TW 107145678 A TW107145678 A TW 107145678A TW I800578 B TWI800578 B TW I800578B
Authority
TW
Taiwan
Prior art keywords
tin
composition
suppressing agent
alloy electroplating
tin alloy
Prior art date
Application number
TW107145678A
Other languages
English (en)
Other versions
TW201934809A (zh
Inventor
亞歷山大 福路格
馬可 亞諾
馬塞 派翠克 琴勒
納迪尼 安傑哈德特
Original Assignee
德商巴斯夫歐洲公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商巴斯夫歐洲公司 filed Critical 德商巴斯夫歐洲公司
Publication of TW201934809A publication Critical patent/TW201934809A/zh
Application granted granted Critical
Publication of TWI800578B publication Critical patent/TWI800578B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
TW107145678A 2017-12-20 2018-12-18 用於錫或錫合金電鍍之包含抑製劑之組成物 TWI800578B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
??17209034.2 2017-12-20
EP17209034 2017-12-20
EP17209034.2 2017-12-20

Publications (2)

Publication Number Publication Date
TW201934809A TW201934809A (zh) 2019-09-01
TWI800578B true TWI800578B (zh) 2023-05-01

Family

ID=60702399

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107145678A TWI800578B (zh) 2017-12-20 2018-12-18 用於錫或錫合金電鍍之包含抑製劑之組成物

Country Status (8)

Country Link
US (1) US11459665B2 (zh)
EP (1) EP3728702B1 (zh)
JP (1) JP2021508359A (zh)
KR (1) KR102653074B1 (zh)
CN (1) CN111492095A (zh)
IL (1) IL275266A (zh)
TW (1) TWI800578B (zh)
WO (1) WO2019121092A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106543448A (zh) * 2016-09-30 2017-03-29 湖北绿色家园精细化工股份有限公司 一种紫外光高速固化树枝状树脂及其发散法制备方法及其应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201042095A (en) * 2009-04-07 2010-12-01 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
TW201533287A (zh) * 2014-02-18 2015-09-01 Tsudakoma Ind Co Ltd 多幅織機中的織布卷取裝置

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US4135991A (en) 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
GB1567235A (en) 1978-05-15 1980-05-14 Pmd Chemicals Ltd Electrodeposition of tin or tin/lead alloys
US4871429A (en) 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5174887A (en) 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
JP3301707B2 (ja) 1997-01-20 2002-07-15 ディップソール株式会社 錫−銀合金酸性電気めっき浴
JP4296358B2 (ja) 1998-01-21 2009-07-15 石原薬品株式会社 銀及び銀合金メッキ浴
US7628903B1 (en) 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
US6818545B2 (en) 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
TWI245402B (en) 2002-01-07 2005-12-11 Megic Corp Rod soldering structure and manufacturing process thereof
TWI240979B (en) 2004-10-28 2005-10-01 Advanced Semiconductor Eng Bumping process
JP5558675B2 (ja) * 2007-04-03 2014-07-23 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 金属メッキ組成物
JP5503111B2 (ja) * 2007-04-03 2014-05-28 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 金属メッキ組成物および方法
KR100921919B1 (ko) 2007-11-16 2009-10-16 (주)화백엔지니어링 반도체 칩에 형성되는 구리기둥-주석범프 및 그의 형성방법
JP5583894B2 (ja) 2008-06-12 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
EP2199315B1 (en) 2008-12-19 2013-12-11 Basf Se Composition for metal electroplating comprising leveling agent
WO2010115757A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
US8956523B2 (en) * 2011-09-06 2015-02-17 Rohm And Haas Electronic Materials Llc Metal plating compositions and methods
US8980077B2 (en) 2012-03-30 2015-03-17 Rohm And Haas Electronic Materials Llc Plating bath and method
US20150122662A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
WO2016020216A1 (en) 2014-08-06 2016-02-11 Basf Se Improved process for preparing polymeric, ionic imidazolium compounds
JP6956641B2 (ja) * 2015-06-24 2021-11-02 クアンタムスケイプ バテリー， インク． 複合電解質
US20190016858A1 (en) 2016-01-12 2019-01-17 Basf Se Process for preparing polymeric imidazolium compounds without or with less monoaldehyde
CN108603070B (zh) * 2016-02-08 2021-03-05 关西涂料株式会社 阳离子电沉积涂料组合物的制备方法
JP6834070B2 (ja) * 2016-06-13 2021-02-24 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法
US11926918B2 (en) * 2016-12-20 2024-03-12 Basf Se Composition for metal plating comprising suppressing agent for void free filing
EP3631051B1 (en) 2017-06-01 2021-10-13 Basf Se Composition for tin alloy electroplating comprising leveling agent

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201042095A (en) * 2009-04-07 2010-12-01 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
TW201533287A (zh) * 2014-02-18 2015-09-01 Tsudakoma Ind Co Ltd 多幅織機中的織布卷取裝置

Also Published As

Publication number Publication date
JP2021508359A (ja) 2021-03-04
KR20200100675A (ko) 2020-08-26
EP3728702B1 (en) 2021-09-22
IL275266A (en) 2020-07-30
KR102653074B1 (ko) 2024-03-29
EP3728702A1 (en) 2020-10-28
US20210079548A1 (en) 2021-03-18
CN111492095A (zh) 2020-08-04
US11459665B2 (en) 2022-10-04
TW201934809A (zh) 2019-09-01
WO2019121092A1 (en) 2019-06-27

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