TWI799577B - 電鍍設備及電鍍方法 - Google Patents

電鍍設備及電鍍方法 Download PDF

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Publication number
TWI799577B
TWI799577B TW108115766A TW108115766A TWI799577B TW I799577 B TWI799577 B TW I799577B TW 108115766 A TW108115766 A TW 108115766A TW 108115766 A TW108115766 A TW 108115766A TW I799577 B TWI799577 B TW I799577B
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TW
Taiwan
Prior art keywords
electroplating
equipment
electroplating method
electroplating equipment
Prior art date
Application number
TW108115766A
Other languages
English (en)
Other versions
TW202003887A (zh
Inventor
賈照偉
王堅
王暉
楊宏超
Original Assignee
大陸商盛美半導體設備（上海）股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商盛美半導體設備（上海）股份有限公司 filed Critical 大陸商盛美半導體設備（上海）股份有限公司
Publication of TW202003887A publication Critical patent/TW202003887A/zh
Application granted granted Critical
Publication of TWI799577B publication Critical patent/TWI799577B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
TW108115766A 2018-05-21 2019-05-07 電鍍設備及電鍍方法 TWI799577B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810487847.5 2018-05-21
CN201810487847.5A CN110512248B (zh) 2018-05-21 2018-05-21 电镀设备及电镀方法

Publications (2)

Publication Number Publication Date
TW202003887A TW202003887A (zh) 2020-01-16
TWI799577B true TWI799577B (zh) 2023-04-21

Family

ID=68616017

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108115766A TWI799577B (zh) 2018-05-21 2019-05-07 電鍍設備及電鍍方法

Country Status (7)

Country Link
US (2) US11926920B2 (zh)
JP (1) JP7505985B2 (zh)
KR (1) KR20210011983A (zh)
CN (1) CN110512248B (zh)
SG (1) SG11202011564RA (zh)
TW (1) TWI799577B (zh)
WO (1) WO2019223499A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114540921A (zh) * 2020-11-26 2022-05-27 盛美半导体设备(上海)股份有限公司 电镀装置及方法
CN114959842B (zh) * 2021-02-18 2024-06-07 日月光半导体制造股份有限公司 电镀装置及制造封装结构的方法
CN114262918A (zh) * 2021-12-02 2022-04-01 中国电子科技集团公司第十八研究所 一种晶圆电镀用的等电势装置、晶圆电镀装置及电镀方法
CN115323470B (zh) * 2022-10-11 2023-03-10 之江实验室 一种实现多片晶圆电镀的装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050067290A1 (en) * 2003-09-30 2005-03-31 Matthias Bonkass Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
US20050109611A1 (en) * 1998-07-10 2005-05-26 Woodruff Daniel J. Electroplating apparatus with segmented anode array
US20050173241A1 (en) * 2004-02-06 2005-08-11 Chalupa Radek P. Apparatus having plating solution container with current applying anodes
TW200837225A (en) * 2007-03-15 2008-09-16 Taiwan Semiconductor Mfg Apparatuses for electrochemical deposition, conductive layers on semiconductor wafer, and fabrication methods thereof
TW201634761A (zh) * 2015-01-27 2016-10-01 應用材料股份有限公司 具有適用於凹槽的接觸環密封及竊流電極的電鍍設備
TW201718955A (zh) * 2015-09-02 2017-06-01 應用材料股份有限公司 具有電流取樣電極的電鍍處理器

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JP3289459B2 (ja) * 1993-12-29 2002-06-04 カシオ計算機株式会社 メッキ方法及びメッキ装置
US6027631A (en) * 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
JP3523197B2 (ja) 1998-02-12 2004-04-26 エーシーエム リサーチ，インコーポレイティド メッキ設備及び方法
JP2001316887A (ja) 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理装置
JP2003027291A (ja) 2001-07-10 2003-01-29 Tokyo Electron Ltd 液処理装置および液処理方法
WO2005033377A2 (en) 2003-09-30 2005-04-14 Advanced Micro Devices, Inc. A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
TW200617214A (en) * 2004-08-26 2006-06-01 Surfect Technologies Inc Dynamic profile anode
US7368042B2 (en) 2004-12-30 2008-05-06 United Microelectronics Corp. Electroplating apparatus including a real-time feedback system
TWI384095B (zh) * 2007-01-29 2013-02-01 Applied Materials Inc 晶圓電化學處理設備及其方法
DE102009023769A1 (de) * 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum gesteuerten elektrolytischen Behandeln von dünnen Schichten
CN102383174B (zh) * 2010-09-01 2014-09-24 中芯国际集成电路制造(上海)有限公司 电镀阳极
TWI550139B (zh) * 2011-04-04 2016-09-21 諾菲勒斯系統公司 用於裁整均勻輪廓之電鍍裝置
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US20050109611A1 (en) * 1998-07-10 2005-05-26 Woodruff Daniel J. Electroplating apparatus with segmented anode array
US20050067290A1 (en) * 2003-09-30 2005-03-31 Matthias Bonkass Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
US20050173241A1 (en) * 2004-02-06 2005-08-11 Chalupa Radek P. Apparatus having plating solution container with current applying anodes
TW200837225A (en) * 2007-03-15 2008-09-16 Taiwan Semiconductor Mfg Apparatuses for electrochemical deposition, conductive layers on semiconductor wafer, and fabrication methods thereof
TW201634761A (zh) * 2015-01-27 2016-10-01 應用材料股份有限公司 具有適用於凹槽的接觸環密封及竊流電極的電鍍設備
TW201718955A (zh) * 2015-09-02 2017-06-01 應用材料股份有限公司 具有電流取樣電極的電鍍處理器

Also Published As

Publication number Publication date
CN110512248A (zh) 2019-11-29
JP2021525312A (ja) 2021-09-24
WO2019223499A1 (en) 2019-11-28
US20240183051A1 (en) 2024-06-06
CN110512248B (zh) 2022-04-12
JP7505985B2 (ja) 2024-06-25
US20210301416A1 (en) 2021-09-30
KR20210011983A (ko) 2021-02-02
US11926920B2 (en) 2024-03-12
SG11202011564RA (en) 2020-12-30
TW202003887A (zh) 2020-01-16

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