SG11202001116UA - Exposure equipment and exposure method - Google Patents

Exposure equipment and exposure method

Info

Publication number
SG11202001116UA
SG11202001116UA SG11202001116UA SG11202001116UA SG11202001116UA SG 11202001116U A SG11202001116U A SG 11202001116UA SG 11202001116U A SG11202001116U A SG 11202001116UA SG 11202001116U A SG11202001116U A SG 11202001116UA SG 11202001116U A SG11202001116U A SG 11202001116UA
Authority
SG
Singapore
Prior art keywords
exposure
equipment
exposure method
exposure equipment
Prior art date
Application number
SG11202001116UA
Inventor
Jun Qian
Sihong Zhai
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11202001116UA publication Critical patent/SG11202001116UA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70016—Production of exposure light, i.e. light sources by discharge lamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
SG11202001116UA 2017-08-10 2018-08-09 Exposure equipment and exposure method SG11202001116UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710682101.5A CN107966882B (en) 2017-08-10 2017-08-10 Exposure apparatus and exposure method
PCT/CN2018/099543 WO2019029601A1 (en) 2017-08-10 2018-08-09 Exposure equipment and exposure method

Publications (1)

Publication Number Publication Date
SG11202001116UA true SG11202001116UA (en) 2020-03-30

Family

ID=61997510

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202001116UA SG11202001116UA (en) 2017-08-10 2018-08-09 Exposure equipment and exposure method

Country Status (7)

Country Link
US (1) US11119412B2 (en)
JP (1) JP7221934B2 (en)
KR (1) KR102370159B1 (en)
CN (1) CN107966882B (en)
SG (1) SG11202001116UA (en)
TW (1) TWI672566B (en)
WO (1) WO2019029601A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107966882B (en) * 2017-08-10 2020-10-16 上海微电子装备（集团）股份有限公司 Exposure apparatus and exposure method
JP7198659B2 (en) * 2018-12-26 2023-01-04 株式会社オーク製作所 Exposure device
CN111443575B (en) * 2019-01-17 2021-05-18 上海微电子装备（集团）股份有限公司 Exposure system and photoetching machine
CN113050378B (en) * 2019-12-27 2022-06-17 上海微电子装备（集团）股份有限公司 Energy adjusting device, energy adjusting method, illumination system and photoetching machine
CN116610007B (en) * 2023-07-18 2023-10-27 上海图双精密装备有限公司 Mask alignment lithography apparatus, illumination system and illumination method thereof

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US4947030A (en) * 1985-05-22 1990-08-07 Canon Kabushiki Kaisha Illuminating optical device
US5581075A (en) * 1993-10-06 1996-12-03 Nikon Corporation Multi-beam scanning projection exposure apparatus and method with beam monitoring and control for uniform exposure of large area
JPH08139009A (en) * 1994-11-14 1996-05-31 Nikon Corp Illumination optical apparatus
JP3376690B2 (en) 1994-04-28 2003-02-10 株式会社ニコン Exposure apparatus and exposure method using the same
JP3957320B2 (en) * 1996-02-23 2007-08-15 エーエスエムエル ネザーランズ ビー． ブイ． Lighting unit for optical devices
JPH09320932A (en) * 1996-05-28 1997-12-12 Nikon Corp Method and device for controlling exposure amount
KR100499864B1 (en) * 1997-06-12 2005-09-30 칼 짜이스 에스엠테 아게 Photometric device
DE19724903A1 (en) * 1997-06-12 1998-12-17 Zeiss Carl Fa Light intensity measuring arrangement
JP4289755B2 (en) * 2000-02-24 2009-07-01 キヤノン株式会社 Exposure amount control method, device manufacturing method, and exposure apparatus
JP2003203853A (en) * 2002-01-09 2003-07-18 Nikon Corp Aligner and its method, and manufacturing method for microdevice
TW200301848A (en) * 2002-01-09 2003-07-16 Nikon Corp Exposure apparatus and exposure method
JP2003295459A (en) * 2002-04-02 2003-10-15 Nikon Corp Aligner and exposing method
JP2004063988A (en) * 2002-07-31 2004-02-26 Canon Inc Illumination optical system, aligner having the system, and method of manufacturing device
JP4174307B2 (en) * 2002-12-02 2008-10-29 キヤノン株式会社 Exposure equipment
JP2004327660A (en) * 2003-04-24 2004-11-18 Nikon Corp Scanning projection aligner, exposure method, and device manufacturing method
JP2005026511A (en) * 2003-07-03 2005-01-27 Nikon Corp Aligner and exposure method
JP4775842B2 (en) * 2005-06-10 2011-09-21 大日本スクリーン製造株式会社 Pattern drawing device
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CN103293864B (en) * 2012-02-27 2015-05-13 上海微电子装备有限公司 Photoetching exposure dose control device and method
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CN107966882B (en) * 2017-08-10 2020-10-16 上海微电子装备（集团）股份有限公司 Exposure apparatus and exposure method

Also Published As

Publication number Publication date
WO2019029601A1 (en) 2019-02-14
JP7221934B2 (en) 2023-02-14
US11119412B2 (en) 2021-09-14
TW201910935A (en) 2019-03-16
TWI672566B (en) 2019-09-21
CN107966882B (en) 2020-10-16
US20210011388A1 (en) 2021-01-14
JP2020530138A (en) 2020-10-15
CN107966882A (en) 2018-04-27
KR20200026303A (en) 2020-03-10
KR102370159B1 (en) 2022-03-04

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