JP2005026511A - Aligner and exposure method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus capable of carrying out highly accurate measurement and control of an exposed amount without being affected by external disturbance light reflected in a mask, a projection lens, and a plate or the like. <P>SOLUTION: The aligner is provided with an illumination optical system including a luminous quantity adjustment member 20 that is located in an optical path between a light source 4 and the mask M1, as optical system introducing the luminous quantity to the mask M1. The transmissivity of the luminous quantity emitted from the light source 4 thereof is changed by the position of the member 20 located in the optical path. The luminous quantity adjustment member 20 is configured such that at least one normal to an incident face and an emitting face of the member 20 is located obliquely with respect to the optical axis of the illumination optical system and movable along an in-face direction of the incident face or the emitting face. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an exposure apparatus used in a manufacturing process of a semiconductor element, a liquid crystal display element, and other microdevices, and an exposure method using the exposure apparatus.
[0002]
[Prior art]
In the manufacturing process of semiconductor elements, liquid crystal display elements, and other micro devices, the pattern that is the original image formed on the mask is illuminated with an illumination optical system, and a photosensitive agent such as photoresist is applied through the projection optical system. An exposure apparatus for projecting and exposing on a plate is used.
[0003]
Here, the illuminance or light amount of the light beam emitted from the light source provided in the exposure apparatus needs to be adjusted in accordance with the sensitivity of the photoresist applied on the plate. Therefore, there is an exposure apparatus provided with a light amount control means for controlling the light amount of a light beam emitted from the light source between the light source and the mask (see, for example, Patent Document 1).
[0004]
14 and 15 are views showing the configuration of a part (from the light source to the mask) of a conventional exposure apparatus. The light beam emitted from the light source 100 passes through the bending mirror 102, the shutter 104, and the relay lens 106, is condensed by the collimator lens 108, adjusted to an appropriate light amount by the density wedge 110 that is a light amount adjusting mechanism, The light enters the eye integrator 112. The light beam emitted from the fly eye integrator 112 passes through the condenser lens 114 and is split by the beam splitter 116. The light transmitted through the beam splitter 116 passes through the condenser lens 118 and illuminates the mask 120. On the other hand, the light reflected by the beam splitter 116 enters the light amount sensor 122. Here, the light amount sensor 122 measures the amount of light incident on the mask 120.
[0005]
[Patent Document 1]
JP-A-11-195600
[0006]
[Problems to be solved by the invention]
However, in the case of the exposure apparatus shown in FIGS. 14 and 15, the light reflected by the mask 120, the projection lens constituting the projection optical system (not shown), the plate (not shown), etc. becomes disturbance light, and this disturbance Light is repeatedly transmitted through the optical element constituting the exposure apparatus or reflected by the optical element, and part of the disturbance light enters the light amount sensor 122. Accordingly, an error occurs in the exposure amount measurement by the light amount sensor 122. That is, as shown in FIG. 14, the light reflected by the mask 120 becomes disturbance light, and this disturbance light passes through the condenser lens 118, the beam splitter 116, the condenser lens 114, and the fly eye integrator 112, and is caused by the density wedge 110. The light is reflected, passes through the fly eye integrator 112 and the condenser lens 114 again, is reflected by the beam splitter 116, and enters the light amount sensor 122.
[0007]
Further, as shown in FIG. 15, the light reflected by the mask 120 becomes disturbance light, and this disturbance light passes through the condenser lens 118, is reflected by the beam splitter 116 and the housing 124, and passes through the beam splitter 116. Is incident on the light quantity sensor 122.
[0008]
The amount of disturbance light shown in FIGS. 14 and 15 is close to a mirror surface when the pattern formed on the mask 120 is dense. Therefore, the mask 120 has a pattern surface having a low reflectance. Even if it exists, it will be about 10-20% of the light quantity of exposure light. Further, when the mask 120 does not include a pattern surface having a low reflectance, the amount of disturbance light is about 40 to 50% of the amount of exposure light. Accordingly, since the light amount sensor 122 measures a value obtained by adding the amount of disturbance light to the amount of exposure light, accurate exposure amount measurement cannot be performed. In other words, an error occurs in the measurement value by the light amount sensor 122, and the illuminance or light amount of the exposure light is adjusted based on the measurement value. Therefore, the exposure light can be made the light most suitable for the sensitivity of the resist applied to the plate. Therefore, optimal exposure cannot be performed.
[0009]
An object of the present invention is to provide an exposure apparatus and an exposure method using the exposure apparatus that can perform highly accurate exposure amount measurement and control without being affected by ambient light reflected by a mask, a projection lens, a plate, or the like. Is to provide.
[0010]
[Means for Solving the Problems]
The exposure apparatus according to claim 1 is an illumination optical system that guides a light beam emitted from a light source to a mask, and is disposed in an optical path between the light source and the mask, and changes a portion located in the optical path. In the exposure apparatus including an illumination optical system having a light amount adjustment member whose transmittance of the light flux is changed, the light amount adjustment member has at least one normal line of the incident surface and the emission surface as light of the illumination optical system. It is arranged to be inclined with respect to the axis, and is configured to be movable along the in-plane direction of the entrance surface or the exit surface.
[0011]
According to the exposure apparatus of the first aspect, since the light amount adjusting member is disposed in a state in which at least one normal line of the entrance surface and the exit surface is inclined with respect to the optical axis of the illumination optical system, the mask, It is possible to prevent light (disturbance light) reflected by a projection lens, a plate, or the like constituting the projection optical system from entering a light amount sensor that measures the amount of exposure light. That is, the disturbance light that has reached the light amount adjusting member is reflected in a direction different from the optical axis direction of the illumination optical system, so that it can be prevented from entering the light amount sensor. Therefore, the exposure light can be adjusted to the optimum illuminance or light quantity based on the accurately measured light quantity of the exposure light, and good exposure can be performed. Further, since the light amount adjustment is performed by moving the light amount adjustment member in the in-plane direction of the entrance surface or the exit surface, the light amount adjustment can be performed without operating the light amount adjustment member in a wide operating range.
[0012]
The exposure apparatus according to claim 2 is an illumination optical system that guides a light beam emitted from a light source to a mask, and is disposed in an optical path between the light source and the mask and is located in the optical path. In an exposure apparatus including an illumination optical system having a light amount adjustment member whose light transmittance is changed by changing the light beam, the light amount adjustment member has at least one normal line of the incident surface and the exit surface thereof. The predetermined inclination angle is set to be equal to or greater than ½ of a divergence angle of a light beam passing through the light amount adjusting member with respect to a plane orthogonal to the optical axis. It is characterized by being.
[0013]
According to the exposure apparatus of the second aspect, the light amount adjusting member is disposed in a state where the normal line of at least one of the entrance surface and the exit surface is tilted by a predetermined tilt angle with respect to the optical axis of the illumination optical system. Yes. In addition, in order to prevent a part of the disturbance light from traveling in the same direction as the optical axis direction of the partial illumination optical unit, the inclination angle is set to a light amount adjusting member with respect to a plane perpendicular to the optical axis of the illumination optical system. It is 1/2 or more of the divergence angle of the passing light beam. Therefore, it is possible to reliably prevent light (disturbance light) reflected by the mask, the projection lens constituting the projection optical system, the plate, and the like from entering the light amount sensor that measures the amount of exposure light. That is, the disturbance light reflected by the light amount adjusting member can be reliably advanced in a direction different from the optical axis direction of the illumination optical system, and can be reliably prevented from entering the light amount sensor. Therefore, the exposure light can be adjusted to the optimum illuminance or light quantity based on the accurately measured light quantity of the exposure light, and good exposure can be performed.
[0014]
The exposure apparatus according to claim 3 is an exposure apparatus including an illumination optical system having a plurality of partial illumination optical units that respectively illuminate a part of the mask based on a light beam from a light source. And a light amount adjusting member that is disposed in the optical path of the partial illumination optical unit and changes the transmittance of the light flux by changing a portion located in the optical path. And a normal line of at least one of the exit surface and the optical axis of the illumination optical system is inclined and arranged so as to be movable along the in-plane direction of the entrance surface or the exit surface. It is characterized by.
[0015]
According to the exposure apparatus of the third aspect, the light amount adjusting member provided in each partial illumination optical unit has at least one normal line of the entrance surface and the exit surface with respect to the optical axis of each partial illumination optical unit. This prevents the light (disturbance light) reflected by the mask, projection lens constituting the projection optical system, plate, etc. from entering the light quantity sensor that measures the quantity of exposure light. can do. That is, disturbance light that has reached each light amount adjusting member is reflected in a direction different from the optical axis direction of the partial illumination optical unit, so that it can be prevented from entering the light amount sensor. Therefore, the exposure light can be adjusted to the optimum illuminance or light quantity based on the accurately measured light quantity of the exposure light, and good exposure can be performed. Further, since the light amount adjustment is performed by moving the light amount adjustment member in the in-plane direction of the entrance surface or the exit surface, the light amount adjustment can be performed without operating the light amount adjustment member in a wide operating range.
[0016]
The exposure apparatus according to claim 4 is an exposure apparatus including an illumination optical system having a plurality of partial illumination optical units that respectively illuminate a part of the mask based on a light beam from a light source. And a light amount adjusting member that is disposed in the optical path of the partial illumination optical unit and changes the transmittance of the light flux by changing a portion located in the optical path. And a normal line of at least one of the emission surfaces is inclined with respect to the optical axis of the illumination optical system by a predetermined inclination angle, and the predetermined inclination angle is the light quantity with respect to a surface orthogonal to the optical axis. It is characterized by being ½ or more of the divergence angle of the light beam passing through the adjusting member.
[0017]
According to the exposure apparatus of the fourth aspect, the light amount adjusting member provided in each partial illumination optical unit has at least one normal line of the entrance surface and the exit surface with respect to the optical axis of each partial illumination optical unit. And arranged in a state inclined by a predetermined inclination angle. In addition, in order to prevent a part of the disturbance light from traveling in the same direction as the optical axis direction of the partial illumination optical unit, the inclination angle is the amount of light with respect to the surface orthogonal to the optical axis of each partial illumination optical unit. It is 1/2 or more of the divergence angle of the light beam passing through the adjusting member. Therefore, it is possible to reliably prevent light (disturbance light) reflected by the mask, the projection lens constituting the projection optical system, the plate, and the like from entering the light amount sensor that measures the amount of exposure light. That is, the disturbance light reflected by each light quantity adjusting member can be reliably advanced in a direction different from the optical axis direction of the partial illumination optical unit, and the disturbance light can be reliably prevented from entering the light quantity sensor. it can. Therefore, the exposure light can be adjusted to the optimum illuminance or light quantity based on the accurately measured light quantity of the exposure light, and good exposure can be performed.
[0018]
The exposure apparatus according to claim 5 is a mask stage for mounting the mask, a plate stage for mounting a plate, a projection optical system for projecting an image of the pattern of the mask onto the plate, and the mask. Scanning means for moving the stage and the plate stage relative to the projection optical system, and the inclination directions of the incident surface and the emission surface are parallel to the scanning directions of the mask stage and the plate stage. Alternatively, the directions are orthogonal to each other.
[0019]
According to the exposure apparatus of the fifth aspect, since the inclination directions of the incident surface and the exit surface of the light amount adjusting member are parallel or orthogonal to the scanning direction of the mask stage and the plate stage, the scanning projection exposure apparatus Each light quantity adjusting member can be easily and smoothly moved along the in-plane direction of the entrance surface or the exit surface. Therefore, good exposure can be performed with high throughput.
[0020]
The exposure apparatus according to claim 6 is an exposure apparatus including an illumination optical system that guides a light beam emitted from a light source to a mask, and is disposed in an optical path between the light source and the mask. A light beam separating unit that separates a first light beam toward the mask and a second light beam toward the light amount sensor, and a light absorbing member disposed on the opposite side of the light amount sensor with the light beam separation unit interposed therebetween. To do.
[0021]
According to the exposure apparatus of the sixth aspect, since the light absorbing member disposed on the opposite side of the light quantity sensor with the light beam separating means interposed therebetween is provided, the mask, the projection lens constituting the projection optical system, the plate, etc. It is possible to prevent the reflected light (disturbance light) from entering the light amount sensor. That is, disturbance light incident on the light absorbing member is absorbed by the light absorbing member, so that the amount of exposure light can be accurately measured. Therefore, the exposure light can be adjusted to the optimum illuminance or light quantity based on the accurately measured light quantity of the exposure light, and good exposure can be performed.
[0022]
The exposure apparatus according to claim 7 is characterized in that the light absorbing member is integrally formed on an inner surface of a housing holding the light beam separating means.
[0023]
According to the exposure apparatus of the seventh aspect, since the light absorbing member is integrally formed on the inner surface of the housing holding the light beam separating means, it is reflected by the mask, the projection lens constituting the projection optical system, the plate, and the like. The incident light (disturbance light) can be prevented from entering the light quantity sensor. That is, the disturbance light incident on the housing is absorbed by the light absorbing member. Therefore, the exposure light can be adjusted to the optimum illuminance or light quantity based on the accurately measured light quantity of the exposure light, and good exposure can be performed.
[0024]
The exposure apparatus according to claim 8 is an exposure apparatus including an illumination optical system that guides a light beam emitted from a light source to a mask, and is disposed in an optical path between the light source and the mask. A light beam separating unit that separates a first light beam directed to the mask and a second light beam directed to the light amount sensor, and disposed on the opposite side of the light amount sensor across the light beam separating unit, and orthogonal to the traveling direction of the second light beam. And a reflecting member having a reflecting surface inclined with respect to the direction.
[0025]
According to the exposure apparatus of the eighth aspect, the reflecting surface is disposed on the opposite side of the light amount sensor with the light beam separating unit interposed therebetween, and is inclined with respect to the direction orthogonal to the traveling direction of the second light beam toward the light amount sensor. Since the reflecting member is provided, it is possible to prevent light (disturbance light) reflected by the mask, the projection lens constituting the projection optical system, the plate, or the like from entering the light amount sensor. That is, the disturbance light reflected by the inclined reflecting surface travels in a direction different from the traveling direction of the light beam traveling toward the light quantity sensor. Therefore, the exposure light can be adjusted to the optimum illuminance or light quantity based on the accurately measured light quantity of the exposure light, and good exposure can be performed.
[0026]
The exposure apparatus according to claim 9 is an exposure apparatus including an illumination optical system that guides a light beam emitted from a light source to a mask, and is disposed in an optical path between the light source and the mask. A light beam separating unit that separates the first light beam toward the mask and the second light beam toward the light amount sensor is provided, and a housing that holds the light beam separation unit is disposed on the opposite side of the light amount sensor with the light beam separation unit interposed therebetween. And an inner wall surface inclined with respect to a direction orthogonal to the traveling direction of the second light beam.
[0027]
According to the exposure apparatus of the ninth aspect, the housing that holds the light beam separating unit is disposed on the opposite side of the light amount sensor with the light beam separating unit interposed therebetween, and is inclined with respect to the direction orthogonal to the traveling direction of the second light beam. Since the inner wall surface is provided, it is possible to prevent light (disturbance light) reflected by the mask, the projection lens constituting the projection optical system, the plate, or the like from entering the light amount sensor. That is, the disturbance light reflected by the inner wall surface of the inclined housing travels in a direction different from the traveling direction of the light traveling toward the light quantity sensor. Therefore, the exposure light can be adjusted to the optimum illuminance or light quantity based on the accurately measured light quantity of the exposure light, and good exposure can be performed.
[0028]
An exposure apparatus according to claim 10 is characterized in that the inner wall surface is configured to have a light absorption function.
[0029]
According to the exposure apparatus of the tenth aspect, since the inner wall surface of the housing is configured to have a light absorption function, the light reflected by the mask, the projection lens constituting the projection optical system, the plate, etc. (Disturbance light) can be prevented from entering the light quantity sensor. That is, disturbance light incident on the inner wall surface of the housing having the light absorption function is absorbed by the light absorption function of the inner wall surface of the housing. Therefore, the exposure light can be adjusted to the optimum illuminance or light quantity based on the accurately measured light quantity of the exposure light, and good exposure can be performed.
[0030]
An exposure apparatus according to an eleventh aspect is characterized in that the illumination optical system includes an optical integrator element, and the light beam separating means is disposed in an optical path between the optical integrator element and the mask.
[0031]
According to the exposure apparatus of the eleventh aspect, since the light beam separating means is arranged in the optical path between the optical integrator element forming the secondary light source and the mask, the illuminance or light amount of the light beam irradiating the mask is reduced. It can be accurately measured by the light quantity sensor. Therefore, the exposure light having the optimum illuminance or light quantity can be adjusted, and good exposure can be performed.
[0032]
An exposure method according to claim 12 is an exposure method using the exposure apparatus according to any one of claims 1 to 11, wherein an illumination step of illuminating the mask using the illumination optical system is provided. And a transfer step of transferring the pattern of the mask onto the plate.
[0033]
According to the exposure method of the twelfth aspect, the exposure light is not affected by the light (disturbance light) reflected by the mask, the projection lens constituting the projection optical system, the plate, etc., and the optimum illuminance or light amount is obtained. Since exposure is performed using an exposure apparatus that can be adjusted to high, good exposure can be performed.
[0034]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a view showing the schematic arrangement of the entire exposure apparatus according to the first embodiment of the present invention. As shown in FIG. 1, in the exposure apparatus according to this embodiment, a photosensitive material (resist) applies a pattern image of an illumination optical system IL1 that includes a light source and guides a light beam emitted from the light source to a mask M1, and a mask M1. A projection optical system PL1 that performs projection exposure on the plate P1 is provided.
[0035]
FIG. 2 is a view showing a schematic configuration from the illumination optical system IL1 to the mask M1 provided in the exposure apparatus according to this embodiment. As shown in FIG. 2, the light beam emitted from the light source 4 composed of a high-pressure mercury lamp arranged at the first focal position of the elliptical mirror 2 is reflected by the elliptical mirror 2 and the dichroic mirror 6, and is condensed by the elliptical mirror 2. The light is condensed at the second focal position of the elliptical mirror 2 by the action. The light beam condensed at the second focal position of the elliptical mirror 2 passes through the shutter 8 that can be rotated by the motor 8a, the relay lens 10, the interference filter 12, and the relay lens 14, is reflected by the reflecting mirror 16, and is collimated. Pass through. Here, the interference filter 12 is a filter that partially controls the spectral component of the transmission energy of the exposure light by the light interference effect, and passes light having a necessary wavelength according to the sensitivity of the resist applied to the plate P1. Let
[0036]
The light beam that has passed through the collimating lens 18 passes through a light control mechanism (light quantity adjusting member) 20 that is constituted by parallel plane glass having a light shielding pattern. FIG. 3 is an AA ′ arrow view of FIG. As shown in FIG. 3, the light control mechanism 20 is arranged such that the normal line (shown by a broken line in the figure) of the incident surface 20a of the light control mechanism 20 is inclined with respect to the optical axis AX of the illumination optical system IL1. And configured to be movable in the in-plane direction of the incident surface 20a. As shown in FIG. 4, the inclination angle θ1 of the dimming mechanism 20 is such that the divergence angle (or convergence angle) θ2 of the light beam passing through the dimming mechanism 20 with respect to the plane orthogonal to the optical axis of the illumination optical system IL1. It is adjusted so that it becomes 1/2 or more. As shown in FIG. 5, the light shielding pattern 20b of the light control mechanism 20 is formed on the incident surface 20a by vapor-depositing a light shielding material such as chromium. The light-shielding pattern 20b is a saddle-like pattern whose pattern width gradually varies linearly along the moving direction of the light control mechanism 20, and a plurality of the stripe-like patterns are formed on the incident surface 20b in parallel. Yes. The dimming mechanism 20 moves linearly along the moving direction shown in FIG. 5 to change the portion located in the optical path AX, and the light to be shielded by the light shielding pattern 20b and the light shielding pattern are formed. The light transmittance is changed by changing the light amount ratio of the light passing through the non-portion 20c. That is, the amount of light from the light source 4 that passes through the light control mechanism 20 can be continuously controlled.
[0037]
The light beam that has passed through the light control mechanism 20 enters a fly-eye lens 22 that is an optical integrator element. The fly-eye lens 22 is configured by arranging a large number of lens elements vertically and horizontally and densely so that the optical axes of the large number of lens elements having positive refractive power are parallel to the optical axis of the illumination optical system IL1. Has been. Therefore, the light beam incident on the fly-eye lens 22 is divided into wavefronts by a large number of lens elements, and one light source image is formed on the rear focal plane of each lens element constituting the fly-eye lens 22. That is, on the rear focal plane of the fly-eye lens 22, a substantial surface light source consisting of a large number of light source images, that is, a secondary light source is formed.
[0038]
The light beam from the secondary light source formed on the rear focal plane of the fly-eye lens 22 passes through the condenser lens 24 and enters the beam splitter 26 that is a light beam separation unit. The light beam (first light beam) that has passed through the beam splitter 26 illuminates the mask M1 almost uniformly by the condenser lens 28. The light beam from the mask M1 enters the projection optical system PL1, and the pattern image of the mask M1 is projected and exposed on the plate P1.
[0039]
On the other hand, the light beam (second light beam) reflected by the beam splitter 26 passes through the lens 30 and enters the light amount sensor 32. The light quantity sensor 32 is disposed at a position substantially conjugate with the plate P1, and is used for light quantity adjustment and light quantity monitoring during exposure.
[0040]
Here, the fly-eye lens 22, the condenser lenses 24 and 28, the beam splitter 26, and the lens 30 are held in the housing 34. An inner wall surface 34 a on the opposite side of the light quantity sensor 32 across the beam splitter 26 of the housing 34 is inclined with respect to a direction orthogonal to the traveling direction of the light beam traveling toward the light quantity sensor 32. The inner wall surface 34a is configured to have a light absorption function.
[0041]
According to the exposure apparatus of the first embodiment, adjustment is performed so that the normal line of the incident surface of the light control mechanism, that is, the surface on which the light shielding pattern is formed, is inclined with respect to the optical axis of the illumination optical system. An optical mechanism is arranged. Therefore, it is possible to prevent light (disturbance light) reflected by the mask, the projection lens constituting the projection optical system, the plate, and the like from entering the light amount sensor. For example, when disturbance light reflected by the mask passes through the condenser lens, beam splitter, and fly-eye lens along the optical axis of the illumination optical system and reaches the light adjustment mechanism, the disturbance light reflected by the light adjustment mechanism is illuminated. Since the light travels in a direction different from the optical axis of the optical system, it does not enter the fly-eye lens. Further, since the light amount adjustment is performed by linearly moving the light adjustment mechanism along the in-plane direction of the incident surface, the light amount can be adjusted without operating the light adjustment mechanism in a wide operation range.
[0042]
Further, according to the exposure apparatus of the first embodiment, 1 / of the divergence angle of the light beam passing through the dimming mechanism with respect to the plane in which the tilt angle of the dimming mechanism is orthogonal to the optical axis of the illumination optical system. When the disturbance light reaches the light control mechanism and is reflected by the light control mechanism, the disturbance light is reliably incident in a direction different from the optical axis of the illumination optical system, that is, the fly-eye lens again. It is possible to advance in a direction that does not.
[0043]
Further, according to the exposure apparatus of the first embodiment, the inner wall surface of the housing on the opposite side of the light quantity sensor across the beam splitter is inclined with respect to the direction orthogonal to the traveling direction of the light beam toward the light quantity sensor. And since it has a light absorption function, it can prevent that disturbance light injects into a light quantity sensor. For example, when disturbance light reflected by the mask is reflected by the beam splitter and enters the inner wall surface of the housing, a part of the disturbance light is absorbed by the light absorption function of the inner wall surface. In addition, disturbance light that has not been absorbed is reflected by the inner wall surface of the casing, and travels in a direction different from the traveling direction of the light toward the light quantity sensor.
[0044]
Therefore, according to the exposure apparatus of the first embodiment, it is possible to prevent disturbance light from entering the light amount sensor, so that the amount of exposure light by the light amount sensor can be accurately measured. Further, since the exposure light can be adjusted to the optimum illuminance or light quantity based on the light quantity of the exposure light accurately measured by the light quantity sensor, good exposure can be performed.
[0045]
Next, an exposure apparatus according to a second embodiment of the present invention will be described. The exposure apparatus according to the second embodiment includes a dimming mechanism 40 instead of the dimming mechanism 20 provided in the illumination optical system IL1 constituting the exposure apparatus according to the first embodiment. I have. In other respects, the configuration is the same as that of the exposure apparatus according to the first embodiment. In the description of the exposure apparatus according to the second embodiment, the same reference numerals as those used in the description of the first embodiment are assigned to the same structures as those of the exposure apparatus according to the first embodiment. The explanation will be given by using.
[0046]
FIG. 6 is a view showing a schematic configuration from the illumination optical system IL1 to the mask M1 provided in the exposure apparatus according to the second embodiment. As shown in FIG. 6, the light beam emitted from the light source 4 is reflected by the elliptical mirror 2 and the dichroic mirror 6, collected by the mirror of the elliptical mirror 2 at the second focal position of the elliptical mirror 2, the shutter 8, and the relay lens. 10, passes through the interference filter 12 and the relay lens 14, is reflected by the reflecting mirror 16, and passes through the collimating lens 18. The light beam that has passed through the collimating lens 18 passes through the light control mechanism 40.
[0047]
The light control mechanism 40 is arranged such that the normal line of the incident surface 40a of the disk-shaped light shielding plate having a light shielding pattern is inclined with respect to the optical axis of the illumination optical system IL1, and is rotatable about the motor 40b. It is configured. Similarly to the dimming mechanism 20 according to the first embodiment, the inclination angle of the dimming mechanism 40 is such that the luminous flux passing through the dimming mechanism 40 with respect to the plane orthogonal to the optical axis of the illumination optical system IL1. It is adjusted to be ½ or more of the divergence angle. A minute pattern is formed on the incident surface 40a of the light control mechanism 40 by vapor-depositing a light shielding material such as chromium. The light control mechanism 40 is rotated by driving the motor 40b to change the position located in the optical path, thereby changing the density of the pattern continuously or stepwise and changing the transmittance of the light passing therethrough. That is, the amount of light from the light source 4 that passes through the light control mechanism 40 can be controlled continuously or stepwise.
[0048]
The light beam that has passed through the light control mechanism 40 enters the fly-eye lens 22 and forms a secondary light source on the rear focal plane of the fly-eye lens 22. The light flux from the secondary light source formed on the rear focal plane of the fly-eye lens 22 passes through the condenser lens 24 and the beam splitter 26, and the mask M1 is illuminated almost uniformly by the condenser lens 28. The light from the mask M1 enters the projection optical system PL1, and the pattern image of the mask M1 is projected and exposed on the plate P1.
[0049]
On the other hand, the light beam reflected by the beam splitter 26 passes through the lens 30 and enters the light amount sensor 32. The light quantity sensor 32 is disposed at a position substantially conjugate with the plate P1, and is used for light quantity adjustment and light quantity monitoring during exposure.
[0050]
Here, the fly-eye lens 22, the condenser lenses 24 and 28, the beam splitter 26, and the lens 30 are held in the housing 34. An inner wall surface 34 a on the opposite side of the light quantity sensor 32 across the beam splitter 26 of the housing 34 is inclined with respect to a direction orthogonal to the traveling direction of the light beam traveling toward the light quantity sensor 32. The inner wall surface 34a is configured to have a light absorption function.
[0051]
According to the exposure apparatus of the second embodiment, the light control mechanism is arranged so that the normal line of the incident surface of the light control mechanism is inclined with respect to the optical axis of the illumination optical system. Therefore, it is possible to prevent light (disturbance light) reflected by the mask, the projection lens constituting the projection optical system, the plate, and the like from entering the light amount sensor. For example, when disturbance light reflected by the mask passes through the condenser lens, beam splitter, and fly-eye lens along the optical axis of the illumination optical system and reaches the light adjustment mechanism, the disturbance light reflected by the light adjustment mechanism is illuminated. Since the light travels in a direction different from the optical axis of the optical system, it does not enter the fly-eye lens.
[0052]
Further, according to the exposure apparatus of the second embodiment, 1 / of the divergence angle of the light beam passing through the dimming mechanism with respect to the plane in which the tilt angle of the dimming mechanism is orthogonal to the optical axis of the illumination optical system. When the disturbance light reaches the light control mechanism and is reflected by the light control mechanism, the disturbance light is reliably incident in a direction different from the optical axis of the illumination optical system, that is, the fly-eye lens again. It is possible to advance in a direction that does not.
[0053]
Further, according to the exposure apparatus of the second embodiment, the inner wall surface of the housing on the opposite side of the light quantity sensor across the beam splitter is in a direction perpendicular to the traveling direction of the light beam toward the light quantity sensor. Since it is inclined and has a light absorption function, disturbance light can be prevented from entering the light amount sensor. For example, when disturbance light reflected by the mask is reflected by the beam splitter and enters the inner wall surface of the housing, a part of the disturbance light is absorbed by the light absorption function of the inner wall surface. In addition, disturbance light that has not been absorbed is reflected by the inner wall surface of the casing, and travels in a direction different from the traveling direction of the light toward the light quantity sensor.
[0054]
Therefore, according to the exposure apparatus according to the second embodiment, it is possible to prevent disturbance light from entering the light amount sensor, so that the amount of exposure light can be accurately measured by the light amount sensor. Further, since the exposure light can be adjusted to the optimum illuminance or light quantity based on the light quantity of the exposure light accurately measured by the light quantity sensor, good exposure can be performed.
[0055]
In addition, according to the exposure apparatus of the second embodiment, the circular dimming mechanism is configured to be rotatable about the motor 40b provided at the center thereof, and thus the dimming mechanism is configured. It can be simple.
[0056]
Next, an exposure apparatus according to a third embodiment of the present invention will be described. In the third embodiment, a plurality of (five) catadioptric partial projection optical units (PM1, PM1) that partially project a part of the pattern of the mask M2 onto the plate P2 as the photosensitive substrate. A pattern image formed on the mask M2 by moving the mask M2 and the plate P2 synchronously in the scanning direction with respect to the projection optical system PL2 composed of PM3 to PM5 and one partial projection optical unit (not shown). A step-and-scan scanning projection exposure apparatus that performs scanning exposure will be described as an example.
[0057]
FIG. 7 is a perspective view showing a schematic configuration of the entire scanning projection exposure apparatus according to the third embodiment. In the following description, the XYZ orthogonal coordinate system shown in FIG. 7 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the plate P2, and the Z axis is set to a direction orthogonal to the plate P2. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z-axis is set vertically upward. In this embodiment, the direction (scanning direction) in which the plate P2 is moved is set in the X-axis direction.
[0058]
This scanning projection exposure apparatus includes a light source 50 composed of a high-pressure mercury lamp. The light beam emitted from the light source 50 arranged at the first focal position of the elliptical mirror 52 is reflected by the elliptical mirror 52 and the reflecting mirror 54, and is condensed at the second focal position of the elliptical mirror 52. pass. In the vicinity of the pupil plane of the relay lens system 56, a wavelength selection filter (not shown) that passes only a light beam in a desired wavelength region is disposed. The light beam emitted from the relay lens system 56 is condensed on the entrance 58 a of the light guide fiber 58. Here, the light guide fiber 58 is, for example, a random light guide fiber configured by randomly bundling a large number of fiber strands, and includes an entrance port 58a and five exit ports 58b, 58c, 58d, 58e, and 58f. ing. The light beam incident on the incident port 58a of the light guide fiber 58 propagates through the inside of the light guide fiber 58, and then is divided and emitted from the five exit ports 58b, 58c, 58d, 58e, and 58f, and enters the illumination optical system IL2. A plurality of partial illumination optical units (in this embodiment, five partial illumination optical units IM1 to IM5) are incident respectively. Here, the five partial illumination optical units IM1 to IM5 illuminate five illumination areas on the mask M2, respectively. These five illumination areas are arranged along two rows extending in a direction (Y-axis direction) crossing the scanning direction (X-axis direction), respectively, and each illumination region row is separated by a predetermined distance with respect to the scanning direction. ing.
[0059]
FIG. 8 is a diagram showing a schematic configuration of the partial illumination optical unit IM1 of the scanning projection exposure apparatus according to this embodiment. In addition, since the structure of partial illumination optical unit system IM2-IM5 is the same as the structure of partial illumination optical unit IM1, description is abbreviate | omitted.
[0060]
The light beam emitted from the emission port 58b of the light guide fiber 58 passes through a collimating lens 60b and a light control mechanism (light quantity adjusting member) 62b configured by a parallel plane glass having a light shielding pattern. Fig.9 (a) is an arrow directional view of AA 'of FIG. As shown in FIG. 9A, in the dimming mechanism 62b, the normal line (indicated by a dotted line in the figure) of the incident surface 63b of the dimming mechanism 62b is the optical axis of the partial illumination optical unit IM1, that is, the Z-axis direction. Is configured to be movable in the in-plane direction of the incident surface 63b and the X-axis direction. The tilt angle of the light control mechanism 62b is ½ of the divergence angle of the light beam passing through the light control mechanism 62b with respect to the plane (XY plane) orthogonal to the optical axis (Z-axis direction) of the partial illumination optical unit IM1. It is adjusted to be above. In addition, the inclination direction of the light control mechanism 62b is a direction orthogonal to the scanning direction (X-axis direction) of a mask stage and a plate stage described later. The tilt direction of the light control mechanism 62b may be a direction parallel to the scanning direction (X-axis direction) of the mask stage and the plate stage, as shown in FIG. 9B.
[0061]
The light shielding pattern of the incident surface 63b of the light control mechanism 62b is formed on the incident surface 63b by vapor-depositing a light shielding material such as chromium as shown in FIG. The shading pattern is a saddle-like pattern whose pattern width gradually varies linearly along the moving direction of the dimming mechanism 62b, and a plurality of the stripe-like patterns are formed in parallel on the incident surface 62b. . The dimming mechanism 62b moves along the moving direction shown in FIG. 5 to change the portion located in the optical path, and passes through the light blocked by the light blocking pattern and the portion where the light blocking pattern is not formed. The light transmittance ratio is changed to change the light transmittance. That is, the amount of light from the light source 50 that passes through the light control mechanism 62b can be controlled.
[0062]
The light beam that has passed through the light control mechanism 62b is incident on a fly-eye lens 64b that is an optical integrator element. The fly-eye lens 64b is formed by arranging the multiple lens elements vertically and horizontally and densely so that the optical axes of the multiple lens elements having positive refractive power are parallel to the optical axis of the partial illumination optical unit IM1. It is configured. Accordingly, the light beam incident on the fly-eye lens 64b is divided into wavefronts by a large number of lens elements, and one light source image is formed on the rear focal plane of each lens element constituting the fly-eye lens 64b. That is, a substantial surface light source consisting of a large number of light source images, that is, a secondary light source is formed on the rear focal plane of the fly-eye lens 64b.
[0063]
The light beam from the secondary light source formed on the rear focal plane of the fly-eye lens 64b passes through the condenser lens 66b and enters the beam splitter 68b, which is a light beam separation unit. The light beam (first light beam) that has passed through the beam splitter 68b illuminates the illumination area of the mask M2 almost uniformly by the condenser lens 70b. On the other hand, the light beam (second light beam) reflected by the beam splitter 68b passes through the lens 72b and enters the light amount sensor 74b. The light quantity sensor 74b is disposed at a position substantially conjugate with the plate P2, and is used for light quantity adjustment and light quantity monitoring during exposure.
[0064]
Here, the fly-eye lens 64b, the condenser lenses 66b and 70b, the beam splitter 68b, and the lens 72b are held in the housing 76b. An inner wall surface 77b on the opposite side of the light quantity sensor 74b across the beam splitter 68b of the casing 76b is inclined with respect to a direction orthogonal to the traveling direction of the light beam traveling toward the light quantity sensor 74b. The inner wall surface 77b is configured to have a light absorption function.
[0065]
As shown in FIG. 7, the light from the illumination area of the mask M2, that is, the illumination area corresponding to the partial illumination optical unit IM1, is arranged so as to correspond to each illumination area, and the image of a part of the pattern of the mask M2 is plated. Of the plurality of partial projection optical units (in this embodiment, four partial projection optical units PM1, PM3, PM4, and PM5 and one partial projection optical unit (not shown)) that respectively project onto P2, partial projection optics A pattern image of the mask M2 is formed on the plate P2 through the unit PM1. The image at this time is an erect image.
[0066]
The light that has passed through the partial illumination optical units IM2 to IM5 illuminates each illumination area of the mask M2 substantially uniformly by the condenser lens provided in each of the partial illumination optical units IM2 to IM5. The light is incident on one partial projection optical unit (not shown) and three partial projection optical units PM3 to PM5 provided corresponding to the units IM2 to IM5. The light that has passed through each partial projection optical unit forms a pattern image of the mask M2 on the plate P2.
[0067]
Here, the mask M2 is fixed by a mask holder (not shown) and is placed on a mask stage (not shown). The mask stage is provided with a movable mirror MIF. Laser light emitted from a mask stage laser interferometer (not shown) enters and reflects on the movable mirror MIF. The position of the mask stage is measured and controlled based on the interference of the incident and reflected laser light. The plate P2 is fixed by a plate holder (not shown), and is placed on a plate stage (not shown). The plate stage is provided with a movable mirror PIF. Laser light emitted from a plate stage laser interferometer (not shown) enters and reflects on the movable mirror PIF. The position of the plate stage is measured and controlled based on the interference of the reflected laser beam.
[0068]
A pair of alignment systems AL for aligning the mask M2 and the plate P2 are provided above the mask M2. For the alignment AL, for example, a method of obtaining a relative position between a mask alignment mark formed on the mask M2 and a plate alignment mark formed on the plate P2 by image processing is used.
[0069]
According to the exposure apparatus of the third embodiment, the normal surface of the incident surface of the light control mechanism provided in each partial illumination optical unit, that is, the surface on which the light shielding pattern is formed, is set to each part. A light control mechanism is arranged so as to be inclined with respect to the optical axis of the illumination optical unit. Therefore, it is possible to prevent light (disturbance light) reflected by the mask, the projection lens constituting the partial projection optical system, the plate, and the like from entering the light amount sensor. For example, when disturbance light reflected by the mask passes through the condenser lens, beam splitter, and fly-eye lens along the optical axis of the partial illumination optical unit and reaches the light adjustment mechanism, the disturbance light reflected by the light adjustment mechanism is Since the light travels in a direction different from the optical axis of the partial illumination optical unit, it does not enter the fly-eye lens.
[0070]
Further, according to the exposure apparatus of the third embodiment, the divergence angle of the light beam passing through the dimming mechanism with respect to the plane in which the inclination angle of the dimming mechanism is orthogonal to the optical axis of each partial illumination optical unit. Therefore, when disturbance light reaches the light adjustment mechanism and is reflected by the light adjustment mechanism, the disturbance light is reliably transmitted in a direction different from the optical axis of the partial illumination optical unit, that is, fly-eye. It can be advanced in a direction that does not re-enter the lens.
[0071]
Further, according to the exposure apparatus of the third embodiment, the inner wall surface of the housing on the opposite side of the light quantity sensor across the beam splitter is in a direction perpendicular to the traveling direction of the light beam toward the light quantity sensor. Since it is inclined and has a light absorption function, disturbance light can be prevented from entering the light amount sensor. For example, when disturbance light reflected by the mask is reflected by the beam splitter and enters the inner wall surface of the housing, a part of the disturbance light is absorbed by the light absorption function of the inner wall surface. In addition, disturbance light that has not been absorbed is reflected by the inner wall surface of the casing, and travels in a direction different from the traveling direction of the light toward the light quantity sensor.
[0072]
Therefore, according to the exposure apparatus according to the third embodiment, disturbance light can be prevented from entering the light quantity sensors of the respective partial illumination optical units, and therefore the light quantity of the exposure light can be measured by the light quantity sensors. Can be done accurately. Further, the amount of light emitted from each partial illumination optical unit and illuminating a predetermined illumination area of the mask can be accurately measured by each light amount sensor, and based on the measured amount of light, Since the light emitted from each partial illumination optical unit can be precisely adjusted to an optimum illuminance or light amount for each partial illumination optical unit, good exposure can be performed.
[0073]
In the exposure apparatus according to the third embodiment, the tilt direction of the light control mechanism provided in each partial illumination optical unit is parallel or orthogonal to the scanning direction of the mask stage and the plate stage. Therefore, in the scanning exposure apparatus, the light control mechanism can be easily and smoothly moved along the in-plane direction of the incident surface.
[0074]
Moreover, according to the exposure apparatus concerning 3rd Embodiment, each partial illumination optical unit IM1-IM5 is arrange | positioned so that a several illumination area | region may be formed along two rows extended in the direction crossing a scanning direction. Since the linear movement direction of the dimming mechanism in each of the partial illumination optical units IM1 to IM5 is substantially the scanning direction, the dimming mechanism can be arranged without interfering between adjacent partial illumination optical units. it can. Further, the light quantity sensors in the partial illumination optical units IM1 to IM5 are arranged so as to be outside from the partial illumination optical units IM1 to IM5 along the scanning direction (on the side opposite to the partial illumination optical units in another row). Therefore, the light quantity sensor can be arranged without interfering between the adjacent partial illumination optical units.
[0075]
In the exposure apparatus according to the third embodiment, one light source is used. However, a light source may be provided for each illumination field. Further, a plurality of light sources may be provided, and light beams from the many light sources may be divided into respective illumination fields by a light guide fiber such as an optical fiber having good randomness.
[0076]
In the exposure apparatus according to each of the above-described embodiments, the light control mechanism is disposed between the collimator lens and the fly-eye lens, but any position in the optical path between the light source and the mask. It suffices if they are arranged.
[0077]
Moreover, in the exposure apparatus concerning each above-mentioned embodiment, you may use the light control mechanism 80 comprised by the parallel plane glass which has a light shielding pattern as shown in FIG. The light-shielding pattern 80a of the light control mechanism 80 shown in FIG. 10 is formed such that a minute pattern is formed by vapor-depositing a light-shielding material such as chromium, and the density of the pattern gradually varies linearly. Yes. The dimming mechanism 80 moves along the moving direction shown in FIG. 10 to change the portion located in the optical path, and passes through the light shielded by the light shielding pattern 80a and the portion where the light shielding pattern is not formed. The light transmittance is changed by changing the light quantity ratio of the light to be transmitted.
[0078]
Further, in the exposure apparatus according to each of the above-described embodiments, a dimming mechanism in which a light-shielding pattern is formed on a plane-parallel glass is used. However, as shown in FIG. A metal plate 82 having an opening 82a may be used. As shown in FIG. 11, by changing the size of the opening 82a of the metal plate 82 and moving it along the moving direction shown in FIG. 11, the portion located in the optical path is changed and transmission of light passing therethrough is achieved. Let the rate change. Alternatively, the size of the openings in the metal plate may be the same, the density of the openings may be varied, the portion located in the optical path may be changed, and the transmittance of the light passing therethrough may be changed. The shape of the opening is not limited to a circle, and may be a rectangle, a triangle, or the like.
[0079]
Moreover, you may use what is not parallel plane glass as a light control mechanism, for example, wedge-shaped glass. In this case, when the pattern formed of a light shielding material such as chrome is formed on the entrance surface of the wedge-shaped glass, the normal of the entrance surface is inclined and reflected with respect to the optical axis of the illumination optical system. The light control mechanism is arranged as described above. On the other hand, when a pattern formed by vapor deposition of a light shielding material such as chrome is formed on the exit surface of the wedge-shaped glass, the normal of the exit surface is reflected with an inclination with respect to the optical axis of the illumination optical system. Arrange the light control mechanism.
[0080]
In the exposure apparatus according to each of the embodiments described above, a pattern is formed from a light-shielding material such as chrome on the incident surface of parallel plane glass as a light control mechanism, but a pattern is formed on the exit surface of parallel plane glass. May be. In this case, the light control mechanism is arranged in a state where the normal line of the exit surface is inclined with respect to the optical axis of the illumination optical system, and is configured to be movable in the in-plane direction of the exit surface. .
[0081]
In the exposure apparatus according to each of the above-described embodiments, the inner wall surface of the housing is inclined with respect to the direction orthogonal to the traveling direction of the light beam traveling toward the light quantity sensor, and has an absorption function. The light absorbing member may be provided separately from the housing. In this case, the separate light absorbing member is disposed on the opposite side of the light amount sensor with the beam splitter interposed therebetween. In this case, it is desirable to incline the separate light absorbing member with respect to the direction orthogonal to the traveling direction of the light beam traveling toward the light quantity sensor.
[0082]
Moreover, you may comprise so that the reflection member with a separate reflective surface from a housing | casing may be provided. In this case, the separate reflecting member is disposed on the opposite side of the light amount sensor with the beam splitter interposed therebetween, and is inclined with respect to the direction orthogonal to the traveling direction of the light beam toward the light amount sensor.
[0083]
In the exposure apparatus according to each of the above-described embodiments, the dimming mechanism is used as a means for preventing the influence of disturbance light reflected by the mask, the projection lens constituting the projection optical system, and the plate. The direction of the light beam traveling toward the light quantity sensor on the inner wall surface of the housing arranged on the opposite side of the light quantity sensor across the beam splitter However, it is also possible to use these two means separately.
[0084]
In the exposure apparatus according to the above-described embodiment, the reticle (mask) is illuminated by the illumination device (illumination process), and the transfer pattern formed on the mask is exposed to the photosensitive substrate using the projection optical system (exposure). Step), a micro device (semiconductor element, imaging element, liquid crystal display element, thin film magnetic head, etc.) can be manufactured. FIG. 12 is a flowchart of an example of a technique for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a plate or the like as a photosensitive substrate using the exposure apparatus according to the above-described embodiment. Will be described with reference to FIG.
[0085]
First, in step 301 of FIG. 12, a metal film is deposited on one lot of plates. In the next step 302, a photoresist is applied on the metal film on the one lot of plates. Thereafter, in step 303, using the exposure apparatus according to the above-described embodiment, the pattern image on the mask is sequentially exposed and transferred to each shot area on the plate of the one lot via the projection optical system. . Thereafter, in step 304, the photoresist on the one lot of plates is developed, and in step 305, the resist pattern is etched on the one lot of plates to form a pattern on the mask. Corresponding circuit patterns are formed in each shot area on each plate.
[0086]
Thereafter, a device pattern such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer. According to the semiconductor device manufacturing method described above, since exposure is performed using exposure light adjusted to an optimum illuminance or light amount without being affected by ambient light, a semiconductor device having an extremely fine circuit pattern can be throughput. Can get well. In steps 301 to 305, a metal is vapor-deposited on the plate, a resist is applied on the metal film, and exposure, development, and etching processes are performed. Prior to these processes, the process is performed on the plate. It is needless to say that after forming a silicon oxide film, a resist may be applied on the silicon oxide film, and steps such as exposure, development, and etching may be performed.
[0087]
In the exposure apparatus according to the above-described embodiment, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. In FIG. 13, in a pattern forming process 401, a so-called photolithography process is performed in which a mask pattern is transferred and exposed to a photosensitive substrate (such as a glass substrate coated with a resist) using the exposure apparatus of the present embodiment. By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate undergoes steps such as a developing step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step 402.
[0088]
Next, in the color filter forming step 402, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three of R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. Then, after the color filter forming step 402, a cell assembling step 403 is executed. In the cell assembly step 403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step 401, the color filter obtained in the color filter formation step 402, and the like. In the cell assembly step 403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern formation step 401 and the color filter obtained in the color filter formation step 402, and a liquid crystal panel (liquid crystal cell) is obtained. ).
[0089]
Thereafter, in a module assembling step 404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, the exposure apparatus according to the above-described embodiment is used and exposure is performed using exposure light that is adjusted to an optimum state. A liquid crystal display element can be obtained with high throughput.
[0090]
【The invention's effect】
According to the exposure apparatus of the present invention, since the light amount adjusting member is arranged in a state where the normal line of at least one of the entrance surface and the exit surface is inclined with respect to the optical axis of the illumination optical system, the mask, the projection optical system It is possible to prevent light (disturbance light) reflected by the projection lens, plate, etc. constituting the light from entering the light amount sensor that measures the amount of exposure light. Further, since the light amount adjustment is performed by moving the light amount adjustment member in the in-plane direction of the entrance surface or the exit surface, the light amount adjustment can be performed without operating the light amount adjustment member in a wide operating range.
[0091]
Further, according to the exposure apparatus of the present invention, since the light absorbing member disposed on the opposite side of the light quantity sensor with the light beam separating means interposed therebetween is provided, the light is reflected by the mask, the projection lens constituting the projection optical system, the plate, etc. The incident light (disturbance light) can be prevented from entering the light quantity sensor.
[0092]
Further, according to the exposure apparatus of the present invention, the reflection having a reflecting surface that is disposed on the opposite side of the light amount sensor with the light beam separating unit interposed therebetween and is inclined with respect to a direction orthogonal to the traveling direction of the second light beam toward the light amount sensor. Since the member is provided, it is possible to prevent light (disturbance light) reflected by the mask, the projection lens constituting the projection optical system, the plate, or the like from entering the light amount sensor.
[0093]
Further, according to the exposure apparatus of the present invention, the housing that holds the light beam separation means is disposed on the opposite side of the light quantity sensor with the light beam separation means interposed therebetween, and is inclined with respect to the direction orthogonal to the traveling direction of the second light beam. Since the inner wall surface is provided, it is possible to prevent light (disturbance light) reflected by the mask, the projection lens constituting the projection optical system, the plate, etc. from entering the light amount sensor.
[0094]
Further, according to the exposure apparatus of the present invention, since the inner wall surface of the housing is configured to have a light absorption function, light reflected by the mask, the projection lens constituting the projection optical system, the plate, etc. (disturbance) Light) can be prevented from entering the light quantity sensor. Therefore, according to the exposure apparatus of the present invention, the exposure light can be adjusted to the optimum illuminance or light amount based on the accurately measured light amount of the exposure light, and good exposure can be performed.
[0095]
Further, according to the exposure method of the present invention, the exposure light is not affected by the light (disturbance light) reflected by the mask, the projection lens constituting the projection optical system, the plate, etc., so that the optimum illuminance or light amount is obtained. Since exposure is performed using an exposure apparatus that can be adjusted, good exposure can be performed.
[Brief description of the drawings]
FIG. 1 is a view showing a schematic arrangement of an entire exposure apparatus according to a first embodiment of the present invention.
FIG. 2 is a view showing a configuration of an illumination optical system of the exposure apparatus according to the first embodiment of the present invention.
FIG. 3 is a view showing an arrangement state of a light control mechanism constituting the exposure apparatus according to the first embodiment.
FIG. 4 is a view for explaining an arrangement inclination angle of a light control mechanism constituting the exposure apparatus according to the first embodiment of the present invention.
FIG. 5 is a view for explaining a light control mechanism constituting the exposure apparatus according to the first embodiment of the present invention.
FIG. 6 is a view showing a configuration of an illumination optical system of an exposure apparatus according to a second embodiment of the present invention.
FIG. 7 is a view showing a schematic arrangement of an entire exposure apparatus according to a third embodiment of the present invention.
FIG. 8 is a view showing a configuration of an illumination optical system of an exposure apparatus according to a third embodiment of the present invention.
FIG. 9 is a view showing an arrangement state of a light control mechanism constituting an exposure apparatus according to a third embodiment.
FIG. 10 is a view for explaining another light control mechanism constituting the exposure apparatus according to the embodiment.
FIG. 11 is a view for explaining another light control mechanism constituting the exposure apparatus according to the embodiment;
FIG. 12 is a flowchart of a method of manufacturing a semiconductor device as a micro device according to an embodiment.
FIG. 13 is a flowchart of a method of manufacturing a liquid crystal display element as a micro device according to an embodiment.
FIG. 14 is a view showing a configuration of an illumination optical system constituting a conventional exposure apparatus.
FIG. 15 is a view showing a configuration of an illumination optical system constituting a conventional exposure apparatus.
[Explanation of symbols]
IL ... illumination optical system, PL ... projection optical system, M1 ... mask, P1 ... plate, 2 ... elliptical mirror, 4 ... light source, 6 ... dichroic mirror, 8 ... shutter, 10, 14 ... relay lens, 12 ... interference filter, DESCRIPTION OF SYMBOLS 16 ... Reflector, 18 ... Collimating lens, 20 ... Light control mechanism, 22 ... Fly eye lens, 24 ... Condenser lens, 26, 28 ... Beam splitter, 30 ... Lens, 32 ... Light quantity sensor, 34 ... Case, 58 ... Light guide fiber, IM1 to IM5, partial illumination optical unit, MIF, PIF, movable mirror, PM1, PM5, partial projection optical unit, AL, alignment system.

Claims (12)

An illumination optical system that guides a light beam emitted from a light source to a mask, disposed in an optical path between the light source and the mask, and changing a portion located in the optical path to change the transmittance of the light beam In an exposure apparatus including an illumination optical system having a light amount adjustment member to be changed,
The light amount adjusting member is arranged such that a normal line of at least one of the incident surface and the exit surface is inclined with respect to the optical axis of the illumination optical system, and along the in-plane direction of the incident surface or the exit surface An exposure apparatus configured to be movable. An illumination optical system that guides a light beam emitted from a light source to a mask, disposed in an optical path between the light source and the mask, and changing a portion located in the optical path to change the transmittance of the light beam In an exposure apparatus including an illumination optical system having a light amount adjustment member to be changed,
The light amount adjusting member is arranged such that at least one normal line of the incident surface and the exit surface is inclined by a predetermined inclination angle with respect to the optical axis of the illumination optical system, and the predetermined inclination angle is An exposure apparatus, wherein the exposure apparatus has a divergence angle of ½ or more of a light beam passing through the light amount adjusting member with respect to an orthogonal surface. In an exposure apparatus including an illumination optical system having a plurality of partial illumination optical units that respectively illuminate a part on a mask based on a light flux from a light source,
The partial illumination optical unit includes a light amount adjusting member that is disposed in the optical path of the partial illumination optical unit and changes the transmittance of the light flux by changing a portion located in the optical path.
The light amount adjusting member is disposed such that a normal line of at least one of the incident surface and the exit surface is inclined with respect to the optical axis of the illumination optical system, and along the in-plane direction of the incident surface or the exit surface An exposure apparatus configured to be movable. In an exposure apparatus including an illumination optical system having a plurality of partial illumination optical units that respectively illuminate a part on a mask based on a light flux from a light source,
The partial illumination optical unit includes a light amount adjusting member that is disposed in the optical path of the partial illumination optical unit and changes the transmittance of the light flux by changing a portion located in the optical path.
The light amount adjusting member is arranged such that at least one normal line of the incident surface and the exit surface is inclined by a predetermined inclination angle with respect to the optical axis of the illumination optical system, and the predetermined inclination angle is An exposure apparatus, wherein the exposure apparatus has a divergence angle of ½ or more of a light beam passing through the light amount adjusting member with respect to an orthogonal surface. A mask stage on which the mask is placed;
A plate stage on which the plate is placed;
A projection optical system that projects an image of the pattern of the mask onto the plate;
Scanning means for moving the mask stage and the plate stage relative to the projection optical system;
5. The exposure apparatus according to claim 3, wherein the incident surface and the exit surface are inclined in a direction parallel or orthogonal to a scanning direction of the mask stage and the plate stage. In an exposure apparatus having an illumination optical system for guiding a light beam emitted from a light source to a mask,
A light beam separating means disposed in an optical path between the light source and the mask, and separating the light beam into a first light beam directed to the mask and a second light beam directed to the light amount sensor;
An exposure apparatus comprising: a light absorbing member disposed on the opposite side of the light amount sensor with the light beam separating unit interposed therebetween. 7. The exposure apparatus according to claim 6, wherein the light absorbing member is integrally formed on an inner surface of a housing that holds the light beam separating means. In an exposure apparatus having an illumination optical system for guiding a light beam emitted from a light source to a mask,
A light beam separating means disposed in an optical path between the light source and the mask, and separating the light beam into a first light beam directed to the mask and a second light beam directed to the light amount sensor;
An exposure apparatus comprising: a reflecting member disposed on the opposite side of the light amount sensor with the light beam separating unit interposed therebetween and having a reflecting surface inclined with respect to a direction orthogonal to the traveling direction of the second light beam. In an exposure apparatus having an illumination optical system for guiding a light beam emitted from a light source to a mask,
A light beam separating unit disposed in an optical path between the light source and the mask and separating the light beam into a first light beam traveling toward the mask and a second light beam traveling toward the light amount sensor;
The housing that holds the light beam separation means includes an inner wall surface that is disposed on the opposite side of the light amount sensor with the light beam separation means interposed therebetween and is inclined with respect to a direction orthogonal to the traveling direction of the second light beam. A featured exposure apparatus. The exposure apparatus according to claim 9, wherein the inner wall surface is configured to have a light absorption function. The illumination optical system includes an optical integrator element,
The exposure apparatus according to any one of claims 6 to 10, wherein the light beam separating unit is disposed in an optical path between the optical integrator element and the mask. An exposure method using the exposure apparatus according to any one of claims 1 to 11,
An illumination step of illuminating the mask using the illumination optical system;
A transfer step of transferring the mask pattern onto a plate.

Images