TWI799492B - 脂環式環氧化合物製品 - Google Patents
脂環式環氧化合物製品 Download PDFInfo
- Publication number
- TWI799492B TWI799492B TW108101022A TW108101022A TWI799492B TW I799492 B TWI799492 B TW I799492B TW 108101022 A TW108101022 A TW 108101022A TW 108101022 A TW108101022 A TW 108101022A TW I799492 B TWI799492 B TW I799492B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy compound
- alicyclic epoxy
- compound product
- product
- alicyclic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2150/00—Compositions for coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Compounds (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-003224 | 2018-01-12 | ||
JP2018003224 | 2018-01-12 | ||
JP2018217675 | 2018-11-20 | ||
JP2018-217675 | 2018-11-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201936690A TW201936690A (zh) | 2019-09-16 |
TWI799492B true TWI799492B (zh) | 2023-04-21 |
Family
ID=67218300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108101022A TWI799492B (zh) | 2018-01-12 | 2019-01-10 | 脂環式環氧化合物製品 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11505640B2 (zh) |
JP (1) | JP7171619B2 (zh) |
CN (1) | CN111587267B (zh) |
TW (1) | TWI799492B (zh) |
WO (1) | WO2019138988A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7273603B2 (ja) * | 2019-04-19 | 2023-05-15 | 株式会社ダイセル | 脂環式エポキシ化合物製品 |
KR102643390B1 (ko) * | 2021-01-25 | 2024-03-08 | 한국생산기술연구원 | 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조방법, 조성물 및 용도 |
WO2024095928A1 (ja) * | 2022-11-04 | 2024-05-10 | 株式会社ダイセル | エポキシ化合物製品 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010018538A (ja) * | 2008-07-10 | 2010-01-28 | Nippon Kayaku Co Ltd | エポキシ化合物の製造方法 |
CN101671318A (zh) * | 2008-09-10 | 2010-03-17 | 山东鲁抗立科药物化学有限公司 | 一种环脂族环氧树脂及其制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3602620B2 (ja) * | 1995-09-01 | 2004-12-15 | ダイセル化学工業株式会社 | 3,4−エポキシシクロヘキシルメチル(メタ)アクリレ−トの精製方法 |
JP3760391B2 (ja) * | 1995-09-01 | 2006-03-29 | ダイセル化学工業株式会社 | エポキシ化反応粗液の精製方法 |
WO2008002416A1 (en) * | 2006-06-23 | 2008-01-03 | Dow Global Technologies Inc. | Process for producing epoxides from olefinic compounds |
JP5294772B2 (ja) * | 2008-09-18 | 2013-09-18 | 日本化薬株式会社 | エポキシ化合物の製造方法 |
JP5294771B2 (ja) * | 2008-09-18 | 2013-09-18 | 日本化薬株式会社 | エポキシ化合物の製造方法 |
JP2010155804A (ja) * | 2008-12-26 | 2010-07-15 | Showa Denko Kk | エポキシ化合物の精製方法 |
JP5748191B2 (ja) * | 2010-04-14 | 2015-07-15 | 日本化薬株式会社 | エポキシ化合物の製造方法 |
JP5875269B2 (ja) | 2011-07-13 | 2016-03-02 | 株式会社ダイセル | 硬化性エポキシ樹脂組成物 |
RU2642069C2 (ru) * | 2012-10-15 | 2018-01-24 | Мицубиси Гэс Кемикал Компани, Инк. | Новое сложноэфирное соединение алициклической дикарбоновой кислоты и способ его изготовления |
JP7273603B2 (ja) * | 2019-04-19 | 2023-05-15 | 株式会社ダイセル | 脂環式エポキシ化合物製品 |
-
2019
- 2019-01-08 US US16/961,557 patent/US11505640B2/en active Active
- 2019-01-08 JP JP2019564684A patent/JP7171619B2/ja active Active
- 2019-01-08 WO PCT/JP2019/000166 patent/WO2019138988A1/ja active Application Filing
- 2019-01-08 CN CN201980008135.3A patent/CN111587267B/zh active Active
- 2019-01-10 TW TW108101022A patent/TWI799492B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010018538A (ja) * | 2008-07-10 | 2010-01-28 | Nippon Kayaku Co Ltd | エポキシ化合物の製造方法 |
CN101671318A (zh) * | 2008-09-10 | 2010-03-17 | 山东鲁抗立科药物化学有限公司 | 一种环脂族环氧树脂及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2019138988A1 (ja) | 2019-07-18 |
JPWO2019138988A1 (ja) | 2021-01-14 |
JP7171619B2 (ja) | 2022-11-15 |
CN111587267B (zh) | 2023-11-07 |
TW201936690A (zh) | 2019-09-16 |
CN111587267A (zh) | 2020-08-25 |
US20210189058A1 (en) | 2021-06-24 |
US11505640B2 (en) | 2022-11-22 |
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