TWI798612B - Data signal transmission connector and manufacturing method for socket assembly of data signal transmission connector - Google Patents

Abstract

The present invention provides a signal transmission connector and a method of manufacturing a signal transmission connector receptacle component with a structure suitable for high-speed signal transmission without signal attenuation or disturbance and without signal interference during signal transmission. The signal transmission connector of the present invention, as a signal transmission connector for electrically connecting a first electronic component formed with a first electrode and a second electronic component formed with a second electrode, includes: a base frame formed of metal, It is combined with the first electronic component and has a plurality of pedestal holes; a connection socket, which includes a plurality of signal transmission parts respectively inserted into the plurality of pedestal holes, and the signal transmission part is included in an elastic insulating material A conductive part including a plurality of conductive particles and an insulating part formed of an elastic insulating substance and supporting the conductive part separately from the base frame; and a cover, which is combined with the base frame, will be placed on the The second electronic component on the base frame pressurizes the connection socket side, so that the lower end of the conductive part is in close contact with the first electrode, and the second electrode is in close contact with the upper end of the conductive part. .

Description

Method for manufacturing signal transmission connector and socket assembly for signal transmission connector

The present invention relates to a signal transmission connector, and more specifically, to a signal transmission connector capable of connecting a first electronic component and a second electronic component so that signals can be transmitted at high speed, and a socket element for the signal transmission connector. Manufacturing method.

Recently, with the regularization of technologies of the four industrial revolutions such as self-driving cars, big data, and cloud disks, 5G services have been widely used, and connectors for high-speed signal transmission are required.

Signal transmission connectors are necessary supplies for the connection of sending and receiving wires, cables, etc., and signal attenuation and obstacles cannot occur, and there must be no signal interference during signal transmission.

At present, signal transmission connectors used in smartphones and the like mostly use BTB-type connectors. The BTB-type connector is a structure in which a signal transmission pin is bent in a U shape to connect a female part and a male part. Recently, in order to transmit signals of about 1 to 2 GHz, BTB-type connectors use a metal shielding treatment on the outer shell of the signal transmission pins, and form a ground line between the signal transmission pins to reduce signal loss or interference.

However, when transmitting ultra-high-speed signals with a frequency of 3.5 to 60 GHz, such as 5G communications, conventional BTB-type connectors have the problem of being difficult to express the characteristics required for sending and receiving signals.

That is, in the conventional BTB-type connector, signal loss and failure cannot be avoided at the U-shaped portion of the signal transmission pin. Furthermore, in the conventional BTB-type connector, the length of the signal transmission pin bent in a U-shape is relatively long, so signal loss cannot be avoided structurally. Furthermore, the conventional BTB-type connector has a structure in which a female part and a male part are combined, and therefore, structurally, a difference in signal transmission inevitably occurs depending on the position of the contact part of the female part and the male part.

[Prior Art Literature]

[Patent Document]

Patent Publication No. 2018-0037955 (2018.04.13)

Solve the problem:

The present invention is provided in consideration of the above-mentioned problems, and its purpose is to provide a signal transmission connector and a signal transmission connector and a signal transmission connector with an advantageous structure for high-speed signal transmission, which can prevent signal attenuation and obstacles, and do not cause signal interference when transmitting signals. A method of manufacturing a receptacle component for a transmission connector.

Technical scheme of the present invention is:

In order to achieve the above object, the signal transmission connector of the present invention, as a signal transmission connector for electrically connecting the first electronic component formed with the first electrode and the second electronic component formed with the second electrode, includes: a base frame, which Formed from metal, combined with the first electronic component and having a plurality of pedestal holes; a connection socket, which includes a plurality of signal transmission parts respectively inserted into the plurality of pedestal holes, and the signal transmission part includes A conductive part including a plurality of conductive particles in an elastic insulating substance and an insulating part formed of an elastic insulating substance and supporting the conductive part separately from the base frame; and a cover seat combined with the base frame to place The second electronic component placed on the base frame pressurizes the connection socket side, so that the lower end of the conductive part is in close contact with the first electrode, and the second electrode is in contact with the conductive part. The upper end is attached closely.

The base frame is formed of a metal selected from beryllium copper (BeCu), phosphor bronze, brass, and stainless steel.

The signal transmission connector of the present invention includes: an electroplating layer laminated on at least one side of the base frame.

At least one of the upper end and the lower end of the conductive part protrudes from the base frame hole.

The signal transmission connector of the present invention includes: an insulating film, which is combined with the upper surface of the base frame, and a plurality of insulating film holes formed at positions corresponding to the plurality of signal transmission parts are formed, and the The second electronic component is separately supported from above the base frame.

The base frame includes: a cleaning hole, which is formed through the base frame in a thickness direction, and is used for discharging foreign matters located between the base frame and the first electronic component.

The signal transmission connector of the present invention includes: a connection substrate, which is combined under the base frame and can be soldered to the first electronic component, and is formed with a bottom end connected to the conductive part to connect the The conductive part is a plurality of connecting substrate electrodes electrically connected to the first electrodes.

The connection substrate is formed of a flexible circuit substrate.

Fixing parts for fixing the cover are formed on both sides of the base frame, and coupling protrusions capable of engaging with the fixing parts are formed on both sides of the cover.

The pedestal includes: a pedestal bottom formed with the plurality of pedestal holes; a pair of pedestal sidewalls facing the pedestal bottom vertically arranged on both sides of the pedestal bottom, The fixing parts are respectively disposed on the pair of base frame side wall parts.

The fixing part includes: a coupling groove formed on the side wall of the base frame for inserting the coupling protrusion.

The fixing part includes: a hooking protrusion protruding from the side wall part of the base frame to the inside of the base frame, and the top of the cover is lower than the upper end of the side wall part of the base frame, and The second electronic component is pressurized toward the connection socket side.

The cover includes: a cover main body, which presses the second electronic component placed on the connection socket to the side of the connection socket; The sides extend in a downward direction, and the coupling protrusions are respectively formed on the pair of connection parts.

The cover includes: a cover main body that presses the second electronic component placed on the connection socket toward the connection socket side; a position determining portion that engages with the second electronic component, and The second electronic component can be aligned at a predetermined position on the cover main body.

And, in order to achieve the above object, the method of manufacturing a socket component for a signal transmission connector of the present invention is a socket for a signal transmission connector that electrically connects a first electronic component having a first electrode and a second electronic component having a second electrode. The manufacturing method of the element includes the following steps: (a) the step of preparing a metal pedestal formed with a plurality of pedestal holes; (b) the step of respectively arranging a conductive part and a signal transmission part in the plurality of pedestal holes, The conductive part includes a plurality of conductive particles in the elastic insulating material so that both ends thereof are electrically connected to the second electrode and the first electrode, and the signal transmission part is formed of the elastic insulating material and the an insulating portion separately supported by the conductive portion from the base frame; and (c) bending both side edges of the base frame to form the base frame to include a base frame formed with the plurality of base frame holes The shape of the bottom and a pair of base frame side wall parts which are vertically arranged on both sides of the base bottom with respect to the base frame bottom and face each other.

The method of manufacturing a socket component for a signal transmission connector according to the present invention includes the following step after the step (a): (d) arranging a connection substrate on which a plurality of connection substrate electrodes electrically connected to the first electrodes are formed on The lower surface of the pedestal, so that the plurality of connection substrate electrodes are respectively matched with the plurality of pedestal holes.

Hereinafter, the method of manufacturing the signal transmission connector and the socket component for the signal transmission connector of the present invention will be described in detail with reference to the drawings.

1 and 2 are perspective views showing a signal transmission connector according to an embodiment of the present invention; FIG. 3 is a cross-sectional view showing a signal transmission connector according to an embodiment of the present invention; FIG. 4 and FIG. 5 are separate representations of the present invention A drawing of a socket element and a cover for a signal transmission connector according to an embodiment of the present invention;

As shown in the figure, the signal transmission connector 100 of an embodiment of the present invention is used to electrically connect the first electronic component 10 and the second electronic component 20, including: a socket element 110, which is installed on the first electronic component 10 is electrically connected with the first electronic component 10 ; the cover 140 is combined with the second electronic component 20 to fix the second electronic component 20 on the socket element 110 . Here, the first electronic component 10 is an electronic component having various structures including the first electrode 11 capable of transmitting an electric signal. Furthermore, the second electronic component 20 is an electronic component having various structures including the second electrode 21 capable of transmitting an electric signal. For example, the first electronic component 10 can be a PCB mounted on a smart phone or a notebook computer, and the second electronic component 20 can be a flexible circuit board (FPCB), an antenna, a cable, and the like.

The socket element 110 includes: a base frame 112, which is combined with the first electronic component 10; a connection socket 120 and a connection substrate 125, which are used to connect the first electrode 11 of the first electronic component 10 to the second electrode of the second electronic component 20 21 electrical connection.

The pedestal 112 includes: a pedestal bottom 113, which is placed parallel to the upper surface of the first electronic component 10; The edge of 113 is formed upright with respect to base frame bottom 113 . As shown in the drawing, no base wall portion 114 or base side wall portion 115 is formed at one edge among four edges of the quadrangular base frame 112 . A base wall portion 114 is formed at one edge of four edges of the base bottom 113 . The pair of base side wall portions 115 are disposed opposite to each other on two of the four edges of the base bottom 113 .

A space surrounded by a base wall 114 and a pair of base side walls 115 is formed on the upper side of the base bottom 113 , and the cover 140 and the second electronic component 20 can be accommodated in this space. The second electronic component 20 can be placed on one side edge of the base frame bottom 113 where the base frame wall portion 114 or the base frame side wall portion 115 is not formed, thereby preventing the second electronic component 20 from being bent when placed on the base frame 112. . Also, such a structure is advantageous in reducing the mounting thickness of the signal transmission connector 100 .

As shown in the figure, preferably, the shape of the portion surrounded by the base frame wall portion 114 and the pair of base frame side wall portions 115 forms a shape corresponding to the shape of the cover base body 141 of the cover base 140 . At this time, the cover 140 can be combined with the fixed position on the base frame 112 , so it is beneficial to match the second electrode 21 of the second electronic component 20 combined with the cover 140 with the conductive part 122 formed on the base frame 112 .

A plurality of base holes 116 penetrating the base bottom 113 in the thickness direction are formed in the base bottom 113 . The plurality of base holes 116 are formed in different numbers and in various shapes depending on the arrangement shape of the first electrodes 11 formed on the first electronic component 10 or the arrangement shape of the second electrodes 21 formed on the second electronic component 20 . Preferably, in order to match the characteristic impedance of the signal transmission part 121 , the base frame bottom 113 has a thickness tolerance of +/−10 um or less.

Fixing portions 117 for fixing the cover 140 are respectively formed on both sides of the base frame 112 . The fixing part 117 includes a coupling groove 118 formed in the base frame side wall part 115 . The coupling protrusions 142 formed on both sides of the cover base 140 are inserted into the coupling grooves 118 to fix the cover base 140 on the base frame 112 .

The base frame 112 is formed of elastic metal. Therefore, when the cover 140 is combined with the base frame 112 , the side wall portion 115 of the base frame is elastically deformed so that the cover base 140 is smoothly combined with the base frame 112 . In addition, the metal base frame 112 can function as a shielding portion that blocks other air waves or obstructive signals around the connection socket 120 , thus improving the signal transmission efficiency of the connection socket 120 . In addition, the metal base frame 112 is electrically conductive, and therefore serves as a ground.

Preferably, the base frame 112 is made of copper alloys such as beryllium copper (BeCu), phosphor bronze, brass, and non-magnetic or weakly magnetic metals such as stainless steel. The base frame 112 formed of metal having non-magnetic or weak magnetic properties starts when the conductive particles forming the conductive portion 122 are uniformly aligned in the thickness direction of the base frame 112 during the process of forming the signal transmission portion 121 in the base frame hole 116. to a beneficial effect. The process of forming the signal transmission part 121 in the base frame hole 116 will be described below.

In addition to the illustrated structure, the base frame 112 can be changed into various other structures capable of supporting the connecting socket 120 and combining with the cover 140 .

The connection socket 120 includes a plurality of signal transmission parts 121 inserted into the plurality of base holes 116, respectively. The signal transmission part 121 includes: a conductive part 122 including a plurality of conductive particles in an elastic insulating material; and an insulating part 123 formed of an elastic insulating material and insulatingly supporting the conductive part 122 . The insulating part 123 is disposed in the base frame hole 116 in contact with the base frame 112 to separate the conductive part 122 from the base frame 112 .

The upper end of the conductive part 122 protrudes from the top of the base frame 112 , and can smoothly contact the second electrode 21 of the second electronic component 20 placed on the base frame 112 . The elastic insulating material constituting the conductive part 122 can utilize the heat-resistant polymer material of the bridge structure, for example, silicone rubber, stereoregular rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile copolymer Rubber, styrene-butadiene block copolymer rubber, styrene block copolymer rubber, polyurethane rubber, polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, soft liquid ring Oxygen rubber, etc.

In addition, the conductive particles constituting the conductive part 122 may utilize a magnetic substance that reacts with a magnetic field. For example, magnetic metal particles such as iron, nickel, cobalt, etc., or alloy particles thereof, or particles containing the metal can be used as conductive particles, or the particles can be used as core particles and coated with gold or silver on the surface of the core particles. , palladium, radium and other metals with good conductivity, or non-magnetic metal particles, glass beads and other inorganic material particles, polymer particles as core particles, and the surface of the core particles is coated with conductive magnets such as nickel and cobalt , or coated with a conductive magnet and a metal with good conductivity on the core particles.

The insulating portion 123 is formed of the same elastic insulating material as that of the conductive portion 122 .

The signal transmission part 121 is disposed in the base frame hole 116 and surrounded by the metal base frame 112, thus forming a coaxial cable structure favorable for high-speed signal transmission. That is, as shown in FIG. 8, the insulating part 123 wraps the conductive part 122, and the metal base frame 112 wraps the insulating part 123, thereby, when the signal is transmitted through the signal transmission part 121, the obstacle signal can be blocked and the loss of signal transmission can be minimized. .

As shown in FIG. 8 , for characteristic impedance matching of high-speed signal transmission, the distance d of the signal transmission part 121 from the base frame 112 to the edge of the conductive part 122 should be uniform. In the signal transmission connector 100 according to an embodiment of the present invention, a base frame hole 116 is formed on a metal base frame 112 , and a conductive portion 122 is formed in the base frame hole 116 . Therefore, it is advantageous to make the distance d from the base frame 112 to the edge of the conductive part 122 uniform, and it is easy to match the characteristic impedance of the signal transmission part 121 .

The connection substrate 125 is bonded under the base frame 112 . The connection substrate 125 includes: a plurality of connection substrate electrodes 126 in contact with the lower end of the conductive portion 122 ; and a connection substrate insulating portion 127 that supports the plurality of connection substrate electrodes 126 at intervals. The upper end of the connecting substrate electrode 126 is in contact with the lower end of the conductive portion 122 , and the lower end is in contact with the first electrode 11 , so that the conductive portion 122 and the first electrode 11 can be electrically connected. The connection substrate 125 may be fixed to the base frame 112 through the insulating portion 123 forming the connection socket 120, or fixed to the base frame 112 by bonding or other various methods.

As shown in FIG. 6 , the connection substrate 125 is soldered on the first electronic component 10 . The connection substrate 125 is soldered to the upper surface of the first electronic component 10 with solder (S), so that the socket element 110 can be firmly fixed to the first electronic component 10 .

By arranging the connection substrate 125 to be electrically connected to the connection socket 120 , the connection substrate 125 can be used as a medium for soldering the connection socket 120 and the first electronic component 10 . Thereby, the connection socket 120 can be bonded smoothly using a soldering method such as SMT.

The connection substrate 125 may be in the shape of a flexible circuit board (FPCB), or various shapes that electrically connect the conductive portion 122 of the connection socket 120 to the first electrode 11 of the first electronic component 10 .

The cover 140 is combined with the base frame 112 to press the second electronic component 20 placed on the base frame 112 toward the connection socket 120 side. The cover 140 includes: a cover main body 141 that is in contact with the top of the second electronic component 20 and can pressurize the second electronic component 20; a pair of coupling protrusions 142 protruding outward from both sides of the cover main body 141; The position determination unit 144 for combining with the second electronic component 20 . The coupling protrusion 142 is inserted into the coupling groove 118 of 112 . The cover 140 is assembled to the socket element 110 in a state of being combined with the second electronic component 20 .

The cover 140 may be combined with the second electronic component 20 in various ways such as adhesive. When the cover 140 is combined with the second electronic component 20, the joint portion 22 of the second electronic component 20 is engaged with the position determining portion 144 of the cover 140, so that the second electronic component 20 can be aligned on the cover main body 141. established location. As shown in the figure, the position determination part 144 is formed in a convex shape protruding from the lower surface of the cover main body 141 , and can be inserted into the groove-shaped coupling part 22 formed in the second electronic component 20 . As described above, the second electronic component 20 is connected to the predetermined position on the cover base 140 in a predetermined posture by the position determination unit 144, so that when the cover base 140 is combined with the base frame 112, the second electronic component 20 The two terminals 21 are precisely matched with the conductive portion 122 of the connecting socket 130 .

The position determination part 144 can be changed into various structures which engage with the 2nd electronic component 20 besides the convex shape shown in figure.

The second electronic component 20 may not be combined with the cover 140 but may be arranged in contact with the cover 140 .

As shown in FIG. 6 and FIG. 7, after the socket element 110 is welded on the first electronic component 10, it is fixed on the base frame 112 by simply pressing the cover seat 140 combined with the second electronic component 20 against the base frame 112. . When the cover 140 is pressed against the base frame 112 , the pair of engagement protrusions 142 are inserted into the engagement grooves 118 respectively formed in the pair of base frame sidewalls 115 , so that the cover base 140 is fixed on the base frame 112 . In order for the coupling protrusion 142 to easily enter into the coupling groove 118 while pushing the side wall portion 115 of the base frame, as shown in the figure, the coupling protrusion 142 may be formed into an awl shape.

As mentioned above, the signal transmission connector 100 of one embodiment of the present invention is formed with a conductive part 122 having a plurality of conductive particles in an elastic insulating material, and a connecting socket 120 and a metal base for connecting the insulating part 123 supporting the conductive part 122. The frame 112 is combined, and the connection socket 120 is soldered to the first electronic component 10 through the connection substrate 125 as a medium. Furthermore, the cover 140 is fixed to the base frame 112 and pressurizes the second electronic component 20 placed on the connection socket 120 toward the connection socket 120 side. Therefore, the first electronic component 10 and the second electronic component 20 are electrically connected through the conductive portion 122 of the connection socket 120 , and high-speed signals can be transmitted without signal attenuation and obstruction, and without signal interference.

In addition, the cover 140 of the signal transmission connector 100 according to an embodiment of the present invention is located at a lower position than the upper end of the base frame 112 to press the second electronic component 20, so the mounting thickness is thinner and can be compactly mounted. Install.

Hereinafter, a method of manufacturing the receptacle component 110 of the signal transmission connector 100 according to an embodiment of the present invention will be described.

FIG. 9 schematically shows the process of manufacturing the socket element 110. As shown in FIG.

First, as shown in FIG. 9( a ), a metal base frame 112 in which a plurality of base frame holes 116 and a pair of coupling grooves 118 are formed is prepared. A plurality of base frame holes 116 are formed in the central portion of the base frame 112 , and a pair of coupling grooves 118 may be disposed toward both side edges of the base frame 112 . In this step, the base frame 112 is made of non-magnetic or weakly magnetic metals such as beryllium copper (BeCu), phosphor bronze, brass and other copper alloys or stainless steel with a thickness tolerance of +/-10um or less.

Then, as shown in b of FIG. 9 , the connection socket 120 including a plurality of signal transmission parts 121 inserted into the plurality of base frame holes 116 is formed. As described above, the signal transmission part 121 includes the conductive part 122 having a plurality of conductive particles in the elastic insulating material, and the insulating part 123 formed of the elastic insulating material and supporting the conductive part 122 separately from the base frame 112 .

Various known methods can be applied to the step of forming the signal transmission unit 121 .

For example, the method of filling the base hole 116 with a conductive particle mixture containing conductive particles in a mobile elastic insulating material, supplying a magnetic field to the conductive mixture to form the conductive part 122, and solidifying the elastic insulating material method of transformation.

At this time, the base frame 112 is formed of a metal having non-magnetic or weak magnetic properties. Therefore, in the process of supplying a magnetic field to the conductive particle mixture filled in the base frame hole 116 by using a magnet, the magnetic field supplied to the conductive particle mixture is hardly affected. The impact of the pedestal 112 . If the base frame is formed of ferromagnetic metal, the base frame exerts a large influence on the direction of the magnetic field provided to the conductive particle mixture. Therefore, in the process of supplying the magnetic field to the conductive particle mixture, the conductive particles are drawn to the base frame side of the ferromagnetic metal, etc., making it difficult to align the conductive particles contained in the conductive particle mixture. In contrast, the base frame 112 of the present invention has little effect on the magnetic field provided to the conductive particle mixture. Accordingly, the conductive particles are stably gathered in the central portion of the base frame hole 116 when a magnetic field is applied, and the conductive particles can be uniformly aligned in the thickness direction of the base frame 112 .

In addition, in the process of forming the signal transmission part 121, it is possible to fill the base frame hole 116 with an elastic insulating substance with mobility and solidify, thereby first forming the insulating part 123, and after the insulating part 123 is perforated, the A method of forming the conductive portion 122 in the insulating portion 123 . At this time, the conductive part 122 may be formed by filling the hole of the insulating part 123 with a slurry-shaped conductive particle mixture and solidifying it.

In addition, the conductive particles can be aligned in the thickness direction of the base frame 112 by supplying a magnetic field using a magnet to the conductive particle mixture filled inside the insulating portion 123 . In the above process, the base frame 112 formed of non-magnetic or weakly magnetic metal has almost no influence on the magnetic field provided to the conductive particle mixture, so the conductive particles can be uniformly arranged inside the insulating part 123, thereby enabling The conductive portion 122 having good signal transmission characteristics is formed.

Then, as shown in FIG. 9( c), the side edges of the base frame 112 are bent to form a pair of base frame side wall portions 115 having coupling grooves 118 . The base frame 112 is bent as described above, and the base frame 112 is formed in a shape including a base frame bottom 113 formed with a plurality of base frame holes 116 and a pair of base frame side wall portions 115 upright and opposite to the base frame bottom 113.

Although not shown in the figure, after the base frame 112 is bent and formed, the connection substrate 125 formed with a plurality of connection substrate electrodes 126 is bonded to the lower surface of the base frame 112 .

10 to 17 show various modifications of the signal transmission connector of the present invention.

First, the signal transmission connector 200 shown in FIG. 10 and FIG. 11 is used to electrically connect the first electronic component 10 and the second electronic component 20, including: being installed on the first electronic component 10 and connected to the first electronic component 10 The electrically connected socket element 210 ; combined with the second electronic component 20 to fix the second electronic component 20 on the cover 140 of the socket element 210 . The socket element 210 includes a base frame 112 and a connection socket 120 .

Compared with the signal transmission connector 100 described above, the above-mentioned signal transmission connector 200 omits the connection substrate 125 , and the base frame 112 , the connection socket 120 and the cover 140 are the same as above. As shown in the figure, the upper end of the conductive part 122 of the connection socket 120 protrudes upward from the upper surface of the base frame bottom 113 , and the lower end protrudes downward from the lower surface of the base frame bottom 113 .

The base frame 112 of the socket element 210 can be fixed on the first electronic component 10 by being welded on the first electronic component 10 by means of SMT or the like.

As shown in FIG. 11 , the base frame 112 is fixed to the first electronic component 10 by solder S, so that the lower end of the conductive portion 122 of the connection socket 120 is in contact with the first electrode 11 of the first electronic component 10 . In this state, when the cover 140 combined with the second electronic component 20 is combined with the base frame 112, the second electrode 21 of the second electronic component 20 is in contact with the upper end of the conductive part 122. 11 and the second electrode 21 are electrically connected through the conductive portion 122 .

The above-mentioned signal transmission connector 200 includes a conductive part 122 containing a plurality of conductive particles in an elastic insulating material and a connection socket 120 that supports an insulating part 123 of the conductive part 122, which is combined with the base frame 112, and the cover seat 140 is fixed on the base frame. rack 112, and the second electronic component 20 placed on the connection socket 120 is pressed toward the connection socket 120 side. Therefore, the conductive part 122 is in contact with the first electrode 11 of the first electronic component 10 and the second electrode 22 of the second electronic component 20, and high-speed transmission is performed between the first electronic component 10 and the second electronic component 20 without signal interference. Signal.

Moreover, the signal transmission connector 300 shown in FIG. 12 and FIG. 13 is used to electrically connect the first electronic component 10 and the second electronic component 20, including: being installed on the first electronic component 10 and connected to the first electronic component 10 electrically connected socket element 310 ; combined with the second electronic component 20 to fix the second electronic component 20 on the cover 140 of the socket element 310 . The socket element 310 includes a base frame 312 and a connection socket 120 .

In the signal transmission connector 300 described above, compared with the signal transmission connector 200 described above, the structure of the base frame 312 is deformed.

The base frame 312 includes a cleaning hole 313 penetrating through the base frame bottom 113 in a thickness direction on one side of the base frame bottom 113 . The cleaning hole 313 is used to discharge foreign matter located between the base frame bottom 113 and the first electronic component 10 .

As shown in FIG. 13 , in order to solder the base frame 312 to the first electronic component 10 , an analyte F may be placed on the first electronic component 10 . The aerosol (F) has mobility, so it can infiltrate between the first electrode 11 and the conductive part 122 . At this time, the impedance between the first electrode 11 and the conductive part 122 increases, and the electrical connection between the first electrode 11 and the conductive part 122 is badly affected. Therefore, preferably, the analyte (F) between the first electronic component 10 and the base frame 312 is removed.

If there is foreign matter such as agarose (F) between the first electronic component 10 and the base frame 312, a tool (T) capable of absorbing foreign matter can be used to remove the foreign matter such as the agarose F from the cleaning hole 313 of the base frame 312. The discharge is between the first electronic component 10 and the chassis 312 .

The number and formation positions of the cleaning holes 313 can be changed variously.

Moreover, the signal transmission connector 400 shown in FIG. 14 is compared with the signal transmission connector 200 shown in FIG. 10, and further includes plating layers 410, 420, and the base frame 112, connection socket 120 and cover seat 140 are the same as above.

The electroplating layers 410, 420 are for matching the characteristic impedance of the connection socket 120, or for soldering the base frame 112 to the first electronic component 10, metals such as gold (Au), nickel (Ni), and tin (Sn) can be used on the base frame. At least one side of the bottom 113 is formed.

The electroplating layer 410 on the base frame bottom 113 is formed for the characteristic impedance matching of the connecting socket 120 . The plating layer 410 for characteristic impedance matching may be formed of gold Au or a metal having excellent conductivity.

The plating layer 420 under the base frame bottom 113 is formed for soldering of the base frame 112 . The plating layer 420 for soldering may be formed of a metal suitable for soldering, such as nickel Ni or tin Sn.

The drawings show that the electroplating layers 410 and 420 are formed on both the upper and lower sides of the base frame bottom 113 , but the electroplating layers may be formed on only one side of the base frame bottom 113 .

The signal transmission connector 500 shown in FIG. 15 includes: a socket element 510 electrically connected to the first electronic component 10 ; and a cover 520 combined with the second electronic component 20 to fix the second electronic component 20 on the socket element 510 . The socket component 510 includes a base frame 512 , a connection socket 120 , and an insulating film 530 . The connection socket 120 includes a plurality of signal transmission parts 121, and its detailed configuration is the same as above.

The base frame 512 includes a base frame bottom 513 having a plurality of base frame holes 515; A fixing portion 516 for fixing the cover 520 is formed on the base frame side wall portion 514 . The fixing portion 516 includes a hooking protrusion 517 protruding from the base frame side wall portion 514 toward the inside of the base frame 512 . As shown in the figure, the hooking protrusion 517 may be formed in a shape in which the upper part is inclined.

The cover seat 520 includes a cover seat main body 521 ; and a pair of coupling protrusions 522 protruding outward from both sides of the cover seat main body 521 . The cover 520 is fixed to the base frame 512 in a state where the second electronic component 20 is pressed toward the base frame 512 so that the coupling protrusion 522 is hooked to the hook protrusion 517 of the base frame 512 . When the cover 520 is fixed to the base frame 512 , the upper surface of the cover main body 521 is lower than the end of the fixing portion 516 , so that the second electronic component 20 can be pressurized toward the base frame 112 .

The insulating film 530 is bonded to the upper surface of the base frame 512 to separate and support the second electronic component 20 from the upper surface of the base frame 512 . The insulating film 530 is formed with a plurality of insulating film holes 531 formed at positions corresponding to the plurality of conductive parts 122 . The conductive part 122 is connected to the second electrode 21 of the second electronic component 20 through the insulating film hole 531 . The insulating film 530 is formed of an insulating material. The insulating film 530 can be combined with the base frame 512 in various ways such as bonding.

The position of the cover 520 of the signal transmission connector 500 of this embodiment is lower than the upper end of the base frame 512 so that the second electronic component 20 can be pressurized. Therefore, the installation thickness is relatively thin and can be installed compactly.

The signal transmission connector 600 shown in FIG. 16 includes: a socket element 610 electrically connected to the first electronic component 10 ; and a cover 620 combined with the second electronic component 20 to fix the second electronic component 20 on the socket element 110 . The socket element 610 includes a base frame 612 and a connection socket 120 . The connection socket 120 includes a plurality of signal transmission parts 121, and its detailed configuration is the same as that described above.

A plurality of base frame holes 614 in which the signal transmission unit 121 is arranged are formed in the base frame 612 . Fixing portions 616 for fixing the cover 620 are formed on both sides of the base frame 612 . The fixing portion 616 includes a hooking protrusion 617 for hooking the cover 620 .

The cover 620 includes: a cover main body 621 ; a pair of connecting portions 622 respectively extending downward from both sides of the cover main body 621 ; and coupling protrusions 623 respectively formed on the pair of connecting portions 622 . The coupling protrusion 623 protrudes from the end of the connecting portion 622 toward the inner side of the cover base 620 so as to be hooked to the hooking protrusion 617 of the base frame 612 . The cover 620 wraps a part of the base frame 612 and is fixed to the base frame 612 in such a manner that the coupling protrusion 623 is hooked to the hooking protrusion 617 .

The signal transmission connector 700 shown in FIG. 17 includes: a socket element 710 electrically connected to the first electronic component 10 ; and a cover 720 combined with the second electronic component 20 to fix the second electronic component 20 on the socket element 710 . The socket element 710 includes a base frame 712 and a connecting socket 120 . The connecting socket 120 includes a plurality of signal transmission parts 121, and its detailed structure is the same as above.

The base frame 712 includes: a base frame bottom 713 having a plurality of base frame holes 715 formed therein; A fixing portion 716 for fixing the cover 720 is formed on the base frame side wall portion 714 . The fixing portion 716 includes a hooking protrusion 717 protruding from the base frame side wall portion 714 toward the inside of the base frame 712 .

The cover 720 includes: a cover main body 721 ; and a pair of coupling protrusions 722 protruding outward from both sides of the cover main body 721 . The cover base 720 is fixed to the base frame 712 by hooking the coupling protrusion 722 to the hooking protrusion 717 of the base frame 712 .

The signal transmission connector 800 shown in FIG. 18 includes: a socket element 810 installed on the first electronic component 10 and electrically connected to the first electronic component 10; combined with the second electronic component 20 to fix the second electronic component 20 on Cover seat 840 of socket element 810 .

The socket component 810 includes: a base frame 812 combined with the first electronic component 10 ; and a connecting socket 120 for electrically connecting the first electrode 11 of the first electronic component 10 with the second electrode 21 of the second electronic component 20 . Here, the connection socket 120 includes a plurality of signal transmission parts 121 formed through the base frame 812, and its detailed structure is the same as above.

The base frame 812 includes: a base frame bottom 813 placed parallel to the upper surface of the first electronic component 10 on the upper surface of the first electronic component 10; 814 and a pair of pedestal sidewalls 815.

A space surrounded by a base wall 814 and a pair of base side walls 815 is formed on the upper side of the base bottom 813 , and the cover 840 and the second electronic component 20 can be accommodated in this space. The second electronic component 20 can be placed on one edge side of the base frame bottom 813 where the base frame wall portion 814 or the base frame side wall portion 815 is not formed. Therefore, when the second electronic component 20 is placed on the base frame 812, no Bending deformation.

A plurality of base holes 816 penetrating through the base bottom 813 in the thickness direction are formed in the base bottom 813 . The signal transmission part 121 to which the socket 120 is connected is disposed on the base frame hole 816 .

Fixing portions 817 for fixing the cover 840 are respectively formed on both sides of the base frame 812 . The fixing portion 817 includes a coupling groove 818 formed in the side wall portion 815 of the base frame. The coupling protrusions 842 formed on both sides of the cover base 840 are inserted into the coupling grooves 818 so that the cover base 840 is fixed on the base frame 812 .

The function of the cover 840 is to combine with the base frame 812 to press the second electronic component 20 placed on the base frame 812 toward the connection socket 820 side. The cover 840 includes: a cover main body 841 contacting the top of the second electronic component 20 to pressurize the second electronic component 20; a pair of coupling protrusions 842 protruding outward from both sides of the cover main body 841; The position determination unit 844 combined with the second electronic component 20 . The coupling protrusion 842 is inserted into the coupling groove 818 of the base frame 812 . The cover 840 is attached to the socket element 810 in a state of being connected to the second electronic component 20 .

The cover 840 may be combined with the second electronic component 20 through various methods such as bonding. When the cover 840 is combined with the second electronic component 20, the joint portion 22 of the second electronic component 20 is engaged with the position determining portion 844 of the cover 840, so that the second electronic component 20 can be aligned on the cover main body 841. the established location. As shown in the figure, the position determining portion 844 is formed in a convex shape that can be inserted into the groove-shaped coupling portion 22 formed in the second electronic component 20 . As mentioned above, the second electronic component 20 can be combined with the predetermined position on the cover base 840 by the position determination part 844 at a predetermined position on the cover base 840, so that when the cover base 840 is combined with the base frame 812, the second electronic component 20 can be The second terminal 21 and the conductive part 822 of the connection socket 830 are precisely matched.

In addition to the illustrated structure, the position determining portion 844 may be modified in various other structures such that it engages with a bonding portion formed on the second electronic component 20 or an edge of the second electronic component 20 .

The present invention has been described above with preferred examples, but the scope of the present invention is not limited to the shapes described and illustrated above.

For example, the structures of the fixing portion formed on the base frame and the coupling protrusion formed on the cover for coupling between the base frame and the cover are not limited to those shown in the drawings, and may be variously changed.

The present invention has been described above with preferred embodiments for illustrating the principles of the present invention, but the present invention is not limited to the structures and functions illustrated and described above. Those skilled in the technical field of the present invention should understand that various changes and modifications can be made to the present invention without departing from the spirit and scope of the appended claims.

The beneficial effects of the present invention are:

In the signal transmission connector of the present invention, a connection socket formed with a conductive part including a plurality of conductive particles in an elastic insulating material and an insulating part supporting the conductive part is combined with a metal base frame, and the conductive part is connected to the first electronic component. The first electrode is connected, and the cover is fixed to the base frame to pressurize the second electronic component placed on the connection socket toward the connection socket side. Therefore, the first electronic component is electrically connected to the second electronic component through the conductive portion of the connection socket, and signal attenuation and obstruction do not occur.

Furthermore, the base frame supporting the plurality of conductive parts in the signal transmission connector of the present invention is made of metal and functions as a shielding part capable of blocking other surrounding air waves or obstacle signals, thus facilitating high-speed signal transmission.

Furthermore, in the signal transmission connector of the present invention, on the base frame combined with the first electronic component, the cover seat combined with the second electronic component is fixed on the base frame by simple pressing. Therefore, assembly is easy, and the work of electrically connecting the first electronic component and the second electronic component can be performed simply and quickly.

Moreover, the signal transmission connector of the present invention can be manufactured with a thinner thickness than the conventional BTB type connector, and therefore occupies less installation space. Therefore, it is widely applicable to thin and small electronic devices such as smart phones, tablet computers, and laptop computers.

20: Second electronic component 100,200,300,400,500,600,700,800: signal transmission connector 110,210,310,510,610,710,810: socket components 112,312,512,612,712,812: base frame 113,513,713,813: Base frame bottom 115,514,714,815: pedestal side wall 117,516,616,716,817: fixed part 120:Connect socket 121: Signal transmission department 122: Conductive part 123: insulation part 125: Connecting the substrate 126: Connect the substrate electrodes 140,520,620,720,840: cover seat 141,521,621,721,841: Cover body 142,522,623,722,842: combined bumps 313: cleaning hole 410,420: Plating layer 530: insulating film

1 and 2 are perspective views showing a signal transmission connector according to an embodiment of the present invention;

3 is a sectional view showing a signal transmission connector according to an embodiment of the present invention;

4 and 5 are separate drawings showing a socket element and a cover for a signal transmission connector according to an embodiment of the present invention;

FIG. 6 shows a state in which a socket element for a signal transmission connector according to an embodiment of the present invention is mounted on a first electronic component;

FIG. 7 shows a state where a signal transmission connector according to an embodiment of the present invention connects a first electronic component to a second electronic component;

8 is a plan view showing part of a socket element for a signal transmission connector according to an embodiment of the present invention;

FIG. 9 shows a manufacturing process of a socket element for a signal transmission connector according to an embodiment of the present invention;

10 to 18 show various modifications of the signal transmission connector of the present invention.

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

20: Second electronic component

100: Signal transmission connector

110: socket element

140: cover seat

Claims (10)

A signal transmission connector, as a signal transmission connector for electrically connecting a first electronic component formed with a first electrode and a second electronic component formed with a second electrode, is characterized in that it includes: a base frame, which is made of non- formed of a metal having magnetic or weak magnetic properties, combined with the first electronic component and having: a base frame bottom formed with a plurality of base frame holes; a pair of base frame side wall portions erectly arranged with respect to the base frame bottom opposite to the two sides of the base frame bottom; and, the fixing parts are arranged on the pair of base frame side walls respectively; the connection sockets include a plurality of signal transmission parts respectively inserted into the plurality of base frame holes , and the signal transmission part includes a conductive part formed by arranging a plurality of conductive particles in the thickness direction of the base frame in an elastic insulating material, and is formed of an elastic insulating material and separates the conductive part from the base frame an insulating part supported separately; a cover seat, which is combined with the base frame, and the cover seat includes: a cover seat main body, which adds the second electronic component placed on the base frame to the side of the connection socket; Press, so that the lower end of the conductive part is in close contact with the first electrode, and the second electrode is in close contact with the upper end of the conductive part; and, combined with protrusions, formed on both sides of the cover body , capable of engaging with the fixing portion; and a connection substrate, which is formed of a flexible circuit substrate, is combined on the underside of the base frame and can be soldered to the first electronic component, and is formed with the lower end of the conductive portion a plurality of connection substrate electrodes that are in contact to electrically connect the conductive portion and the first electrode; In addition, the cover is formed with a position determining portion that engages with the second electronic component so that the second electronic component can be aligned at a predetermined position on the cover main body. The signal transmission connector according to claim 1, wherein the base frame is formed of a metal selected from beryllium copper (BeCu), phosphor bronze, brass, and stainless steel. The signal transmission connector according to claim 1 is characterized by comprising: a plating layer laminated on at least one side of the base frame. In the signal transmission connector according to claim 1, at least one of the upper end and the lower end of the conductive part protrudes from the base hole. The signal transmission connector according to claim 1 is characterized in that it includes: an insulating film that is bonded to the upper surface of the base frame and has a plurality of connectors formed at positions corresponding to the plurality of signal transmission parts. The insulating film has holes, and separates and supports the second electronic component from the upper side of the base frame. According to the signal transmission connector described in patent scope 1, the base frame includes: a cleaning hole, which is formed through the base frame in the thickness direction, and is used to discharge the an electronic component Foreign matter in between. According to the signal transmission connector described in claim 1, the fixing portion includes a coupling groove formed in the side wall portion of the base frame for inserting the coupling protrusion. The signal transmission connector according to claim 1, wherein the fixing portion includes a hooking protrusion protruding from the side wall portion of the base frame toward the inner side of the base frame, and the cover The upper surface of the seat is lower than the upper end of the side wall portion of the base frame, and pressurizes the second electronic component toward the connection socket. According to the signal transmission connector described in patent claim 1, the cover base includes: a pair of connecting parts extending downward from both sides of the cover base main body, and the coupling protrusion are respectively formed on the pair of connection parts. A method of manufacturing a socket component for a signal transmission connector, as a method of manufacturing a socket component for a signal transmission connector that electrically connects a first electronic component having a first electrode and a second electronic component having a second electrode, wherein: The method includes the steps of: (a) a step of preparing a base frame formed of a metal having non-magnetic or weak magnetic properties, the base frame including a plurality of base frame holes formed in a central portion, and an inclined base frame A pair of joints set sideways on both sides of the groove; (b) the step of respectively providing a conductive part and a signal transmission part in the plurality of pedestal holes, and the conductive part is elastically connected to the second electrode and the first electrode at both ends respectively The insulating material contains a plurality of conductive particles, and the conductive particle mixture is supplied with a magnetic field to align the plurality of conductive particles in the thickness direction of the base frame, and the signal transmission part is formed of an elastic insulating material and the an insulating portion separately supported from the conductive portion from the base frame; (c) molding the base frame by bending both side edges of the base frame to form a pair of base frame side wall portions having the coupling groove a step of including a base frame bottom formed with the plurality of base frame holes and a shape of the pair of base frame side wall portions facing to the base frame bottom arranged upright on both sides of the base frame bottom; and (d) arranging a connection substrate formed of a flexible circuit board formed with a plurality of connection substrate electrodes electrically connected to the first electrode on the lower surface of the base frame so that the plurality of connection substrate electrodes are respectively matched with the plurality of pedestal holes.

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