JP2002076207A - Bga chip and cleaning system of socket connector using the bga chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a BGA chip 10, that can easily remote solder adhering or transferring to the surface treatment layer of a socket connector 20, by allowing a metal contact 12 of the BGA chip 10 to come into contact repeatedly with (to repeatedly insert into and extract from) the socket connector 20 over many times, and the oxide, and at the same time, to provide a cleaning system of the socket connector 20 that can easily recover contact failure. SOLUTION: In the inspection system of a connector that uses the ball grid array(BGA) chip 10, where the metal contact 12 is made of plastic, and inspects the performance of the BGA chip 10 and in this cleaning system of the socket connector 20, where the BGA chip 10 is detachably confronted with the socket connector 20 that is the connector coming into contact with a BGA element or the like; and the plurality of metal contacts 12 at the side of the BGA chip 10 are electrically connected to the socket connector 20, the contact 12 of the BGA chip 10 made of plastic is used once per several tens of times or several hundreds of times, at inspection of the BGA chip 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector in which a plurality of metal contacts (electrical contacts) of a BGA chip are electrically connected to a socket connector at a time. This is related to cleaning when it adheres or transfers to a contact portion of the image forming apparatus.

[0002]

2. Description of the Related Art One of the conventional connectors is a BGA (B
an all grid array chip and a socket connector (referred to as a connector that contacts a BGA element or the like) are detachably butted against each other to form a plurality of metal contacts made of spherical projections such as solder provided on one side of the BGA chip and a socket connector; Are electrically connected.
Although not shown, the BGA chip and the socket connector have a mechanism such as a socket structure and can be detachably mounted.

The BGA chip 10 is made of a rigid ceramic or silicon base and a soft resin substrate serving as a rewiring layer. Solder (PbS) is provided on one side of the soft resin substrate.
n) and a plurality of metal contacts made of spherical projections. The metal contact is formed by reflowing a solder ball on a land of a soft resin substrate. Further, as an example of the socket connector, a plurality of electric contacts are provided on one side so as to be electrically connectable to a plurality of metal contacts of the BGA chip. This electrical contact
It is provided on a conductor of a board (FPC or the like) of a socket connector, and a slit-shaped cut portion is provided in a board surrounding the conductor to provide flexibility to the conductor portion. Variations in the height of the metal contacts can be absorbed, and at least one or more mountain-shaped protrusions are provided on the electrical contacts of the socket connector so that the oxide film of the metal contacts of the BGA chip can be broken through and reliably contacted. It has become. Since the electric contact 52 is a contact portion, generally, nickel (Ni) or gold (A
u) Surface treatment such as plating is performed. Therefore, B
The relationship between the hardness of the metal contact (α) of the GA chip and the hardness of the ridge (β) of the electrical contact of the socket connector is α <β
It has become. In addition, as a socket connector, FIG.
It is also conceivable to use a probing pin such as, for example, a rigid resin plate made of a rigid material, and in the case of an electric contact, a pin having a flange portion, and implanted in the hard resin plate. Is retractably accommodated in a metal cylinder via an elastic body such as a coil spring.

[0004]

SUMMARY OF THE INVENTION A socket connector comprises:
Since the connector is used to inspect a BGA chip, several hundreds or hundreds of thousands of BGA chips are brought into contact with the socket connector. Therefore, the following problems occurred. The problem will be described with reference to FIG. (A)
FIG. 2 is a partial cross-sectional view of a state where the BGA chip and the socket connector are in contact with each other, and FIG. 2B is a partial cross-sectional view of a state where the BGA chip is separated from the socket connector. BGA
When the metal contact of the chip and the electrical contact of the socket connector come into contact with each other several hundred times, the solder (see FIG. 8B) that forms the metal contact on the surface treatment layer such as gold plating, which is conventionally applied. There is a problem to be solved such that PbSn) easily adheres, or the adhered one oxidizes (SnO ₂ ) and causes poor contact. If the solder adheres to the surface treatment layer of the electric contact, it will be dropped once every tens or hundreds of times with a brush or the like. However, in order to remove extraneous matter, it is necessary to remove the socket connector from the measuring device, disassemble it until the contact point of the connector is rubbed with a brush, etc., remove the extraneous matter, and then attach it back to the original device. In addition, it takes much time and effort to remove the deposits, and if the number of times of brushing is too frequent, the man-hour is increased, which leads to a problem that the cost is increased. At the time of the inspection of the BGA chip in the above-described state, the surface hardness (α) of the metal contact of the BGA chip, the surface hardness (β) of the mountain-like projection of the electrical contact of the socket connector, and the adhesion or adhesion to the mountain-like projection. The relationship between the transferred sediment and the hardness (γ) is α ≦ γ <β. Adhesion means soldering of metal contacts (PbSn) or oxide of solder (Sb).
nO ₂ ) is attached, and the transition is a state in which the solder of the attached metal contact is bonded to the socket connector by metal. In such a state, the deposit once adhered or transferred could not be easily removed.

The present invention has been made in view of such a conventional problem, and a metal contact of a BGA chip and a socket connector repeat contact (insertion / extraction) many times to form a surface treatment layer of the socket connector. To provide a BGA chip that can easily remove attached or transferred solder and its oxide,
Another object of the present invention is to provide a socket connector cleaning system capable of easily recovering from poor contact.

[0006]

SUMMARY OF THE INVENTION The object of the present invention is to provide a metal contact 1.
2 (electric contact) made of plastic BGA (Ba
This can be achieved by using an (II Grid Array) chip 10. The BGA chip 10 itself including the metal contacts 12 (electric contacts) may be made of plastic. By manufacturing the BGA chip 10 itself with plastic as described above, the number of manufacturing steps of the BGA chip 10 can be reduced. Further, the above-mentioned object as a cleaning system for the socket connector 20 is to provide a connector inspection system for inspecting the performance of the BGA chip 10.
The chip 10 and the socket connector 20 (referred to as a connector that contacts a BGA element or the like) are detachably butted,
In the cleaning system of the socket connector 20 in which the plurality of metal contacts 12 on one side of the BGA chip 10 and the socket connector 20 are electrically connected, the inspection of the BGA chip 10 may be performed several tens or hundreds of times. This can be achieved by using the contacts 12 of the BGA chip 10 made of plastic at a time. The BGA chip 1 made of a plastic material
0 contact 12 is the contact 12 of the BGA chip 10.
(Α) and the hardness of the socket connector 20 (β)
It is better to use a material that satisfies <β. With such a hardness relationship, the contact portion of the socket connector 20 is not scraped by the contact 12 of the BGA chip 10 made of a plastic material. The electric contact 30 of the socket connector 20 is connected to the conductor 26 of the substrate 22.
In addition to the above, the substrate 22 around the conductor 26 is provided with a slit-shaped cutout 24 so that the conductor 26 has flexibility, and at least the electric contact 30 of the socket connector 20 One or more ridges 31
BGA chip 1 made of plastic when BGA chip 10 and socket connector 20 are fitted together
The zero contact 12 slides on the ridge 31 of the socket connector 20. In this way, the slits 24 are provided in the socket connector 20, and the contacts 12 of the BGA chip 10 made of plastic slide on the mountain-shaped projections 31 of the socket connector 20, so that the deposit 50 can be more reliably removed. Can be scraped off.

[0007]

At least one mountain-like projection 31 is provided on the electrical contact 30 of the socket connector 20 and the metal contact 12 of the BGA chip 10 at the time of cleaning is connected to the B contact.
The hardness between the metal contact 12 (α) of the GA chip 10 and the tip (β) of the mountain-shaped projection 31 of the electric contact 30 of the socket connector 20 is set to α <β, and the hardness of the contact between the BGA chip 10 and the socket connector 20 is increased. By sliding the metal contact 12 of the BGA chip 10 on the electric contact 30 of the socket connector 20, the deposit 50 (solder or the like) attached at the time of the contact is removed forward (eliminated so as to be scraped off). ). The reason why the contact 12 of the BGA chip 10 slides on the electric contact 30 of the socket connector 20 when the BGA chip 10 and the socket connector 20 are fitted will be described. As described above, the elastic material 39 such as silicon rubber is disposed on the back side of the metal conductor 38 and the slit-shaped cutout 24 is formed in the substrate 22 around the conductor 26 of the socket connector 20. Provided, BGA
The contact force that presses the electrical contact 30 of the socket connector 20 against the metal contact 12 of the chip 10 displaces the electrical contact 30 of the socket connector 20 downward, and the contact position is displaced and slid. The movement of this sliding will be described with reference to FIG. The contact 12 of the BGA chip 10 is pressed against the electrical contact 30 of the socket connector 20 with a certain force, and the position where the BGA chip 10 and the socket connector 20 come into contact is point X (the state of FIG. 2). Thereafter, when the socket connector 20 is continuously pressed with a certain force, the elastic material layer 39 and the slit-shaped cut portion 24 are provided in the socket connector 20 as described above. When the electric contact 30 is displaced downward in FIG. 5, the electric contact 30 of the socket connector 20 is pushed down from the point X to the point X ′. However, since the BGA chip 10 is guided by the socket structure, the BGA chip 10 does not move greatly in the front, rear, left and right directions, and the contact 12 of the BGA chip 10 is moved only to be pressed vertically downward. Therefore,
When the electric contact 30 of the socket connector 20 is displaced, the contact is made at the point Y (the state in FIG. 4). That is,
The contact 12 of the BGA chip 10 is
Is moved from the point X ′ to the point Y with a constant force. This movement is sliding, and the moving direction is the sliding direction.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, a BGA chip of the present invention and a system for cleaning a socket connector using the BGA chip will be described. FIG. 1 is a partially enlarged plan view of a socket connector according to an embodiment, and FIG. 2 is a partially enlarged longitudinal sectional side view of a connector according to the present invention. FIG. 3 is a partially enlarged cross-sectional view of the electrical connector according to the present invention. FIG. 4 is a partially enlarged longitudinal sectional side view of the connector according to the present invention in a state where the BGA chip slides on the electrical contact of the socket connector. FIG. 5 shows the BGA chip sliding on the electrical contact of the socket connector. It is explanatory drawing of a state. FIG. 6A is a cross-sectional side view in which a contact made of plastic is attached to a BGA chip, and FIG. 6B is a cross-sectional side view of a state in which the entire BGA chip is made of plastic.

First, the BGA chip 10, which is the point of the present invention, will be described. 2 to 4 show one embodiment of the BGA chip 10 according to the present invention, in which 10 is a BG made of metal or plastic material.
A chip and 12 are a plurality of contacts formed on a single side of the BGA chip 10 and formed of spherical protrusions made of a plastic material. The contact 12 made of plastic is fixed by press-fitting or bonding as shown in FIG. In this embodiment, only the contact portion is shown.
It is preferable that the BGA chip 10 itself is entirely made of a plastic material as shown in FIG. Thus, the BGA chip 1
By making 0 integrally with plastic material,
It is easy to reduce the number of steps such as fixing the metal contact 12 and to obtain the positional accuracy of the metal contact 12. The above-mentioned plastic material is appropriately selected in consideration of hardness, dimensional stability, workability, cost, and the like of the contact portion of the socket connector 20, which is a mating connector. Generally, polybutylene terephthalate (PBT) or polyamide is used. (66PA,
46PA), liquid crystal polymer (LCP), polycarbonate (PC), and synthetic materials thereof.
BG in which the contact 12 is made of a plastic material in this way
The A chip 10 is provided with the electric contact 3 of the socket connector 20
This is for cleaning the zero part.

Next, a connector 1 using the above-described BGA chip 10 and a socket connector 20 fitted with the BGA chip 10 will be described. This connector 1
Is composed of a BGA chip 10 and a socket connector 20. In this connector 1, although not shown, B
The GA chip 10 and the socket connector 20 have a mechanism such as a socket structure as in the prior art, and can be detachably mounted. The socket connector will be described. Reference numeral 20 denotes a socket connector formed of a substrate 22 made of a soft resin having appropriate rigidity, reference numeral 26 denotes a conductor formed of a disk-shaped metal layer provided on one side of the substrate 22, and reference numeral 28 denotes a conductor of the substrate 22. A protective coating layer made of an insulating material or the like provided on the formation side, 30 is an electric contact provided on the conductor 26, and 31 is a mountain-like projection provided on the electric contact 30. The electric contact 30 is provided so as to be able to be electrically connected to the plurality of metal contacts 12 of the BGA chip 10, and is provided on the substrate 22 (FPC) of the socket connector 20.
1, etc.), and the substrate 22 around the conductor 26 is provided with a slit-shaped cutout 24 as shown in FIG. 1 so that the conductor 26 has flexibility.
With this structure, variations in the height of the metal contacts 12 of the BGA chip 10 can be absorbed.

In the socket connector 20, for example, a metal layer portion such as a copper foil applied in advance on one side of the
For example, a desired conductor 26 is provided as shown in FIG. 2 by processing by a printed wiring pattern forming method which is one of the substrate manufacturing techniques. The BGA chip 10 of the conductor 26
The electric contact 30 is made of a material having good conductivity
Is provided. The electric contact 30 is connected to the conductor 2
6 is provided by plating or the like. As the material of the conductor 26, any material may be used as long as it has good conductivity, and examples thereof include brass, beryllium copper, and phosphor bronze. The electrical contact 30 is a portion that contacts the electrical contact 12 of the BGA chip. The plating applied to the conductor 26 is first copper plating, then nickel plating layer 35, and finally gold plating layer 33. You are.

At the time of contact with the BGA chip and the metal contact 12 of the BGA chip 10 at the time of the test, the socket connector 2 is pierced so as to break through the oxide film of the metal contact 12.
It is preferable that at least one or more mountain-shaped projections 31 are provided on the zero electrical contact 30 and the tip end is sharpened to some extent. That is, the mountain-shaped protrusion 31 is for breaking through the oxide film of the metal contact 12. In consideration of the above-described operation and role, it is preferable that the sliding direction of the metal contact 12 of the BGA chip 10 and the mountain-shaped projection 31 of the socket connector 20 be arranged in parallel. By arranging in this manner, it is possible to reliably break through the oxide film of the metal contact 12 at the time of contact. In addition, by providing the mountain-shaped protrusion 31 on the electric contact 30, when the BGA chip 10 and the socket connector 20 are fitted, not only the oxide film of the metal contact 12 is pierced, but also the deposit 50 is surely removed. The metal contact 12 of the next BGA chip 10 can be brought into contact with the cleaned portion. At the time of cleaning the projections 31 of the electric contacts 30 of the socket connector 20, the BGA chip 10 in which the above-described metal contacts 12 are made of a plastic material is used.
The deposit 50 adhered or transferred to the electric contact 30 of the socket connector 20 can be removed by making the socket connector 20 contact and slide.

Finally, a description will be given of a system for cleaning the socket connector 20 using the BGA chip 10 using the contacts 12 made of the plastic described above. BGA using contacts 12 made of plastic
The chip 10 and the socket connector 20 for inspecting the BGA chip 10 as a product have the above-described structure.
The BGA chip 10 as a product is made of rigid ceramics or a silicon base and a soft resin substrate as a rewiring layer as described in the related art, and a solder (PbSn) or the like is provided on one side of the soft resin substrate. And a plurality of metal contacts 12 comprising spherical projections.
Are formed by reflowing a solder ball on a land of a soft resin substrate. In the inspection system of the connector 1 for inspecting the performance of the BGA chip 10, the cleaning system of the connector 1, when inspecting the BGA chip 10 as a product, at a rate of once every hundreds or thousands of times. By using the BGA chip 10 in which metal contacts are made of a plastic material,
The deposit 50 adhered or transferred to the surface of the electrical contact 30 of the socket connector 20 can be removed. That is, a system can be provided in which the cleaning of the socket connector 20 is incorporated in the inspection process using the BGA chip 10 that can be cleaned in the inspection process. The contact (α) of the BGA chip 10 made of the plastic of the present invention and the electric contact 30 of the socket connector 20 at the time of cleaning
The hardness relationship with the tip (β) of the mountain-like projection 31 is set to α <β. By adopting such a hardness relationship, the tip of the mountain-shaped protrusion 31 of the electrical contact 30 of the socket connector 20 is not cut off even if it is mistaken.

[0014]

As is apparent from the above description, the following excellent effects can be obtained by the cleaning system for a BGA chip or socket connector of the present invention. (1) At the time of cleaning, by using the BGA chip 10 in which the metal contact 12 is made of a plastic material, the deposit 50 adhered or transferred to the contact portion of the socket connector 20 can be easily removed. (2) B made of plastic at the time of cleaning
Contact 12 (α) of GA chip 10 and socket connector 2
By setting the hardness of the contact portion (β) of 0 to α <β, the contact portion of the socket connector 20 is not damaged or scraped even if it is wrong. (3) BG made of plastic during cleaning
When the contact 12 of the A chip 10 is slid, the deposit 50 adhered or transferred to the contact portion of the socket connector 20 can be more reliably removed. (4) By providing the mountain-shaped protrusion 31 on the electric contact 30, when the BGA chip 10 and the socket connector 20 are fitted, not only the oxide film of the metal contact 12 is broken but also
After the deposit 50 is surely cleaned, the next BG
The metal contact 12 of the A chip 10 can be contacted. (5) Metal contact 1 of BGA chip 10 during cleaning
2 is made of a plastic material.
The hardness of the metal contact 12 (α) of the GA chip 10 and the contact portion (β) of the socket connector 20 can be set to α <β. (6) When inspecting the BGA chip 10 of a product, the BGA chip 10 in which the metal contacts 12 are made of a plastic material is used at a rate of once every tens or hundreds of times, so that the electrical connection of the socket connector 20 is improved. Contact 3
The deposit 50 adhered or transferred to the surface of No. 0 can be removed, and can be easily cleaned in the inspection process without being removed and cleaned.

[Brief description of the drawings]

FIG. 1 is a partially enlarged plan view of a socket connector according to an embodiment.

FIG. 2 is a partially enlarged longitudinal sectional side view of the connector according to the present invention.

FIG. 3 is a partial enlarged cross-sectional view of the connector according to the present invention.

FIG. 4 is a partially enlarged longitudinal sectional side view of the connector according to the present invention in a state where the BGA chip slides on the electric contact of the socket connector.

FIG. 5 is an explanatory view showing a state in which the BGA chip slides on the electric contacts of the socket connector.

FIG. 6A is a cross-sectional side view in which a contact made of plastic is attached to a BGA chip. (B) It is a sectional side view in the state where the whole BGA chip was manufactured with plastic.

FIG. 7 is a partially enlarged longitudinal sectional side view of a socket connector using probing pins and the like and a BGA chip.

FIG. 8A is a partial cross-sectional view showing a state in which a BGA chip and a socket connector are in contact with each other. FIG. 3B is a partial cross-sectional view illustrating a state where the BGA chip is separated from the socket connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Connector 10 BGA chip 12 Metal contact 20 and 201 Socket connector 22 Substrate 24 Slit cutout 26 Conductor 28 Protective coating layer 30 and 42 Electrical contact 31 Mountain protrusion 32 Opening 33 Gold plating layer 34 Lead wire 35 Nickel plating layer 36 Tongue-shaped movable small piece part 38 Metal conductor part 39 Elastic material layer 40 Through hole 44 Flange part 46 Contact cylinder 48 Elastic body 50 Deposit

Claims (5)

[Claims] 1. A BGA (Ball Grid) wherein a metal contact (electric contact) is made of plastic.
Array) chips. 2. The BGA chip according to claim 1, wherein the BGA chip including metal contacts (electric contacts) is made of plastic. 3. A connector inspection system for inspecting the performance of the BGA chip, wherein the BGA chip and a socket connector (referred to as a connector that contacts a BGA element or the like) are detachably butted to each other to check the performance of the BGA chip. In a cleaning system for a socket connector in which a plurality of metal contacts on one side are electrically connected to the socket connector, the inspection of the BGA chip may be performed at a rate of once every tens or hundreds of times. The BGA manufactured by
A socket connector cleaning system using a contact point of a chip. 4. The BGA made of a plastic material
4. The cleaning method for a socket connector according to claim 3, wherein the contact of the chip is made of a material such that the hardness between the contact (α) of the BGA chip and the socket connector (β) has a relation of α <β. system. 5. An electric contact of the socket connector is provided on a conductor of a substrate, and a slit-shaped cut portion is provided in a substrate around the conductor to make the conductor portion flexible. At least one or more mountain-shaped protrusions are provided on the electrical contacts of the socket connector, and when the BGA chip and the socket connector are fitted, the contacts of the BGA chip made of plastic are placed on the mountain-shaped protrusions of the socket connector. The cleaning system for a socket connector according to claim 3, wherein the socket connector slides.