TWI798606B - Heat sink structure - Google Patents
Heat sink structure Download PDFInfo
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- TWI798606B TWI798606B TW109143262A TW109143262A TWI798606B TW I798606 B TWI798606 B TW I798606B TW 109143262 A TW109143262 A TW 109143262A TW 109143262 A TW109143262 A TW 109143262A TW I798606 B TWI798606 B TW I798606B
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- base
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- joint
- dissipation fins
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
一種散熱器結構,尤指一種透過包射之方式將基座及散熱鰭片結合為一體防止熱阻現象的散熱器結構。 A heat sink structure, especially a heat sink structure that integrates a base and heat dissipation fins to prevent thermal resistance by means of enveloping.
目前常規壓鑄散熱器在5G產品、設備(諸如通訊機箱、通訊設備等)上的應用不僅散熱能力有限,同時產品體積和重量也較大,不利產品戶外安裝維護,因此為了進一步來提高產品的散熱能力,降低產品重量,高效率的散熱鰭片之出現,該散熱鰭片和底座之連接部分大多採用Epoxy膠黏或者鉚接為主,由於5G產品設備大多應用於戶外,然而採用Epoxy膠黏方式將鰭片和底座連接,存在著老化風險,此方案並不完美,目前在應用較少,採用鉚接則是目前市場上高效率散熱鰭片與底座連接的主要方式,但是由於兩個金屬件接觸面間具有天然接觸間隙,間隙間的空氣勢必導致無法抹滅的高熱阻,雖然高效率散熱鰭片帶來了可觀的散熱能力,但是熱量因該間隙之原因並無法完全從發熱元件傳導至散熱鰭片。 At present, the application of conventional die-casting radiators on 5G products and equipment (such as communication chassis, communication equipment, etc.) not only has limited heat dissipation capacity, but also has a large volume and weight, which is not conducive to outdoor installation and maintenance of products. Therefore, in order to further improve the heat dissipation of products capacity, reduce product weight, and the emergence of high-efficiency cooling fins. Most of the connection between the cooling fins and the base is glued or riveted with Epoxy. Since 5G product equipment is mostly used outdoors, Epoxy is used to glue the There is a risk of aging in the connection between the fin and the base. This solution is not perfect, and it is rarely used at present. Riveting is the main way to connect the high-efficiency heat dissipation fin and the base in the market. However, due to the contact surface of the two metal parts There is a natural contact gap between them, and the air in the gap will inevitably lead to an indelible high thermal resistance. Although the high-efficiency heat dissipation fins bring considerable heat dissipation capacity, the heat cannot be completely transferred from the heating element to the heat dissipation fin due to the gap. piece.
高效率散熱鰭片內部具有腔室,並該腔室內選擇填充工作液體或氣體,並由於該腔室內為真空狀態,故令工作液體或氣體之沸點較低的情況下可提早蒸發汽化,提升散熱鰭片的熱傳效率。 The high-efficiency heat dissipation fins have a cavity inside, and the cavity is filled with working liquid or gas, and because the cavity is in a vacuum state, the working liquid or gas can be vaporized early when the boiling point is low, improving heat dissipation The heat transfer efficiency of the fins.
高效率散熱鰭片由於內部腔室中具有工作液體或氣體,故與該基座進行結合時必須特別注意是否會破壞內部腔室的之真空氣密性,以及若要進行熱加工 時,也必須注意腔室中的工作液體是否會因受熱而蒸發,進而失去熱交換之作用。 Since the high-efficiency heat dissipation fins have working liquid or gas in the inner chamber, special attention must be paid to whether the vacuum airtightness of the inner chamber will be damaged when combined with the base, and if thermal processing is to be performed At the same time, it is also necessary to pay attention to whether the working liquid in the chamber will evaporate due to heat, and then lose the function of heat exchange.
則如何將高效率散熱鰭片與基座穩固結合不產生間隙則為首要解決的目標。 How to firmly combine the high-efficiency heat dissipation fins with the base without creating gaps is the primary goal to be solved.
爰此,為有效解決上述之問題,本發明之主要目的,係提供一種基座及散熱鰭片間不具有熱阻的散熱器結構。 Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat sink structure with no thermal resistance between the base and the heat dissipation fins.
為達上述之目的,本發明係提供一種散熱器結構,係包含:複數散熱鰭片、一基座;該等散熱鰭片具有一結合端及一自由端,鰭片內部自該結合端至該自由端之間具有一腔室並填充有一工作流體;該基座上、下兩側分別具有一結合側及一受熱側,該結合側係用一體包設之方式結合該等散熱鰭片結合端。 In order to achieve the above-mentioned purpose, the present invention provides a heat sink structure, which includes: a plurality of heat dissipation fins, a base; these heat dissipation fins have a joint end and a free end, and the inside of the fin is from the joint end to the There is a cavity between the free ends and filled with a working fluid; the upper and lower sides of the base have a joint side and a heat receiving side respectively, and the joint side is combined with the joint ends of the heat dissipation fins in an integral package .
上述結合側凸伸複數結合部,該等結合部包覆於該結合端之外部,令該等散熱鰭片得穩固與該基座結合為一體。 A plurality of joint parts protrude from the joint side, and these joint parts cover the outside of the joint end, so that the heat dissipation fins can be firmly integrated with the base.
上述工作流體係為氣體或液體。 The above working fluid system is gas or liquid.
上述該等散熱鰭片與該基座係為相同或相異材質。 The above-mentioned heat dissipation fins and the base are made of the same or different materials.
上述該等散熱鰭片與該基座係先透過一體包射之方式進行相互結合,該等散熱鰭片再進行填水與抽真空作業。 The above-mentioned heat dissipation fins and the base are firstly combined with each other through integral injection, and then the heat dissipation fins are filled with water and vacuumized.
該等散熱鰭片與該基座係先透過一體包射之方式進行相互結合,該等散熱鰭片再進行填水與抽真空作業,藉此既可維持該等散熱鰭片內部腔室中的工作液體或氣體之穩定避免蒸發外,同時可解決基座與散熱鰭片間具有熱阻之情事產生。 The heat dissipation fins and the base are first combined with each other by means of one-piece injection, and then the heat dissipation fins are filled with water and vacuumized, so as to maintain the internal chamber of the heat dissipation fins. The stability of the working liquid or gas can avoid evaporation, and at the same time, it can solve the problem of thermal resistance between the base and the cooling fins.
1:散熱器結構 1: radiator structure
11:散熱鰭片 11: cooling fins
111:結合端 111: binding end
112:自由端 112: free end
113:腔室 113: chamber
12:基座 12: base
121:結合側 121: Combined side
1211:結合部 1211: junction
122:受熱側 122: Heating side
2:工作流體 2: Working fluid
第1圖係為本發明之散熱器結構第一實施例之立體分解圖;第2圖係為本發明之散熱器結構第一實施例之組合剖視圖。 Figure 1 is an exploded perspective view of the first embodiment of the radiator structure of the present invention; Figure 2 is a combined sectional view of the first embodiment of the radiator structure of the present invention.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above-mentioned purpose of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.
請參閱第1、2圖,係為本發明之散熱器結構第一實施例之立體分解及組合剖視圖,所述散熱器結構1,係包含:複數散熱鰭片11、一基座12;該等複數散熱鰭片11之兩端分別具有一結合端111及一自由端112,該散熱鰭片之結合端111至該自由端112間具有一呈真空狀態之腔室113,該腔室113內填充有一工作流體2,所述工作流體2可係為氣體或液體。
Please refer to Figures 1 and 2, which are three-dimensional exploded and assembled cross-sectional views of the first embodiment of the radiator structure of the present invention. The
所述基座12之上、下兩側分別具有一結合側121及一受熱側122,該受熱側122係與至少一發熱源接觸,該結合側121則對應該等散熱鰭片11之結合端111,並透過包射之方式將結合端111結合為一體,即所述結合側121凸伸複數結合部1211,該等結合部1211包覆於該結合端111之外部,該結合端111可呈倒T字型或L型或其他幾何形狀其中任一,本實施例係以倒T型做為說明實施例,但並不引以為限,並該結合部1211透過一體包射之方式完整包覆於該呈倒T字型之結合端111外部周圍,令該等散熱鰭片11穩固且無間隙與該基座12結合為一體,並透過該結合端111之設計可防止該散熱鰭片11被拔出脫離該基座12之結合部1211。
The upper and lower sides of the
該等散熱鰭片11與該基座12係為相同或相異材質,係可為銅、鋁、不銹鋼、其中任一或及其組合,該等散熱鰭片11與該基座12係先透過一體包射之方式進行結合,待一體包射結合後再令該等散熱鰭片11進行填水與抽真空作業。
The
而預先進行基座12與該等散熱鰭片11一體包射之作業,其主要目的在於為了防止所述散熱鰭片11內部的工作流體2在基座12以及散熱鰭片11一體包射之作業時因高溫影響下,令內部工作流體2產生蒸發進而令其內部汽液循環熱交換失效,故待兩者一體包射結合作業完成後,再針對該散熱鰭片11進行填入工作流體2及抽真空作業,最後將其封閉。
The main purpose of performing the integral injection of the
本發明主要提供一種具有高效率熱傳導效率散熱鰭片11,該散熱鰭片11內部具有腔室113,並填充有工作流體2(液體、氣體),並在填充工作流體2前,先將該散熱鰭片11與該基座12透過一體包射之方式進行結合,藉此令該散熱鰭片11與該基座12得以結合為一體而無間隙之產生,因此可避免熱阻之產生,並且待一體包射完成後再對該散熱鰭片11之腔室113進行填入工作流體2及抽真空等作業,如此可避免散熱鰭片11與該基座12進行一體包射作業時,高溫破壞腔室內部的工作流體2令其蒸發汽化之情事發生者。
The present invention mainly provides a
1:散熱器結構 1: radiator structure
11:散熱鰭片 11: cooling fins
111:結合端 111: binding end
112:自由端 112: free end
113:腔室 113: chamber
12:基座 12: base
121:結合側 121: Combined side
1211:結合部 1211: junction
122:受熱側 122: Heating side
2:工作流體 2: Working fluid
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160252312A1 (en) * | 2013-05-15 | 2016-09-01 | Osram Sylvania Inc. | Two Piece Aluminum Heat Sink |
TWM590262U (en) * | 2019-09-23 | 2020-02-01 | 威銓博科技股份有限公司 | Heat sink with isothermal plate |
TW202012868A (en) * | 2019-08-13 | 2020-04-01 | 黃崇賢 | Cooling fin stamping and riveting structure |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160252312A1 (en) * | 2013-05-15 | 2016-09-01 | Osram Sylvania Inc. | Two Piece Aluminum Heat Sink |
TW202012868A (en) * | 2019-08-13 | 2020-04-01 | 黃崇賢 | Cooling fin stamping and riveting structure |
TWM590262U (en) * | 2019-09-23 | 2020-02-01 | 威銓博科技股份有限公司 | Heat sink with isothermal plate |
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