TWI797145B - 缺陷檢查系統及缺陷檢查方法 - Google Patents

缺陷檢查系統及缺陷檢查方法 Download PDF

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Publication number
TWI797145B
TWI797145B TW107125180A TW107125180A TWI797145B TW I797145 B TWI797145 B TW I797145B TW 107125180 A TW107125180 A TW 107125180A TW 107125180 A TW107125180 A TW 107125180A TW I797145 B TWI797145 B TW I797145B
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Taiwan
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image
aforementioned
column
inspection object
same position
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TW107125180A
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English (en)
Chinese (zh)
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TW201908717A (zh
Inventor
尾崎麻耶
廣瀬修
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日商住友化學股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Textile Engineering (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
TW107125180A 2017-07-24 2018-07-20 缺陷檢查系統及缺陷檢查方法 TWI797145B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-142929 2017-07-24
JP2017142929A JP6970550B2 (ja) 2017-07-24 2017-07-24 欠陥検査システム及び欠陥検査方法

Publications (2)

Publication Number Publication Date
TW201908717A TW201908717A (zh) 2019-03-01
TWI797145B true TWI797145B (zh) 2023-04-01

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TW107125180A TWI797145B (zh) 2017-07-24 2018-07-20 缺陷檢查系統及缺陷檢查方法

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JP (1) JP6970550B2 (ja)
KR (1) KR20190011200A (ja)
CN (1) CN109297971B (ja)
TW (1) TWI797145B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI786827B (zh) * 2021-09-15 2022-12-11 和碩聯合科技股份有限公司 測試資料產生方法以及測試資料產生裝置
CN113628212B (zh) * 2021-10-12 2022-03-11 高视科技(苏州)有限公司 不良偏光片识别方法、电子设备和存储介质
CN115829907B (zh) * 2022-04-18 2024-02-23 宁德时代新能源科技股份有限公司 对复合料带的隔膜进行缺陷检测的方法、装置、系统

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09284749A (ja) * 1996-04-12 1997-10-31 Furukawa Electric Co Ltd:The トンネル内壁面の撮影方法とそれを用いた撮影装置
JP2004163416A (ja) * 2002-10-23 2004-06-10 Nippon Steel Corp 欠陥検査装置
JP2007113923A (ja) * 2005-10-18 2007-05-10 Toyo Seikan Kaisha Ltd ネックリング検査装置及びネックリング検査方法
TW200825405A (en) * 2006-10-03 2008-06-16 Yokogawa Electric Corp Defect inspection system
JP2011095171A (ja) * 2009-10-30 2011-05-12 Sumitomo Chemical Co Ltd 欠陥検査システム、並びに、それに用いる、欠陥検査用撮影装置、欠陥検査用画像処理装置、欠陥検査用画像処理プログラム、記録媒体、および欠陥検査用画像処理方法
CN104956210A (zh) * 2013-01-30 2015-09-30 住友化学株式会社 图像生成装置、缺陷检查装置以及缺陷检查方法
WO2016121878A1 (ja) * 2015-01-29 2016-08-04 株式会社デクシス 光学式外観検査装置、及びこれを用いた光学式外観検査システム

Family Cites Families (13)

* Cited by examiner, † Cited by third party
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JP3476913B2 (ja) * 1994-07-08 2003-12-10 オリンパス株式会社 欠陥種別判定装置及びプロセス管理システム
JP4220595B2 (ja) * 1998-08-10 2009-02-04 株式会社日立製作所 欠陥の分類方法並びに教示用データ作成方法
DE19962122A1 (de) * 1998-12-21 2000-09-14 Hottinger Maschb Gmbh Verfahren und Vorrichtung zur Objekterkennung
JP2001134763A (ja) * 1999-11-09 2001-05-18 Hitachi Ltd 撮像画像に基づく欠陥の分類方法、および、その結果の表示方法
EP1625388A1 (de) * 2003-05-19 2006-02-15 Micro-Epsilon Messtechnik GmbH & Co. KG Verfahren und vorrichtung zur optischen qualitätsprüfung von objekten mit vor-zugsweise kreisförmig umlaufendem rand
JP2004354250A (ja) * 2003-05-29 2004-12-16 Nidek Co Ltd 欠陥検査装置
JP4694914B2 (ja) * 2005-08-03 2011-06-08 昭和電工株式会社 表面検査方法および同装置
JP4739044B2 (ja) * 2006-02-09 2011-08-03 三菱原子燃料株式会社 外観検査装置
JP4652391B2 (ja) * 2006-12-08 2011-03-16 株式会社東芝 パターン検査装置、及び、パターン検査方法
JP2008175588A (ja) * 2007-01-16 2008-07-31 Kagawa Univ 外観検査装置
JP2011145305A (ja) * 2011-04-12 2011-07-28 Sumitomo Chemical Co Ltd 欠陥検査システム、並びに、それに用いる、欠陥検査用撮影装置、欠陥検査用画像処理装置、欠陥検査用画像処理プログラム、記録媒体、および欠陥検査用画像処理方法
CN104101611A (zh) * 2014-06-06 2014-10-15 华南理工大学 一种类镜面物体表面光学成像装置及其成像方法
CN104751474A (zh) * 2015-04-13 2015-07-01 上海理工大学 一种级联式快速图像缺陷分割方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09284749A (ja) * 1996-04-12 1997-10-31 Furukawa Electric Co Ltd:The トンネル内壁面の撮影方法とそれを用いた撮影装置
JP2004163416A (ja) * 2002-10-23 2004-06-10 Nippon Steel Corp 欠陥検査装置
JP2007113923A (ja) * 2005-10-18 2007-05-10 Toyo Seikan Kaisha Ltd ネックリング検査装置及びネックリング検査方法
TW200825405A (en) * 2006-10-03 2008-06-16 Yokogawa Electric Corp Defect inspection system
JP2011095171A (ja) * 2009-10-30 2011-05-12 Sumitomo Chemical Co Ltd 欠陥検査システム、並びに、それに用いる、欠陥検査用撮影装置、欠陥検査用画像処理装置、欠陥検査用画像処理プログラム、記録媒体、および欠陥検査用画像処理方法
CN102630299A (zh) * 2009-10-30 2012-08-08 住友化学株式会社 缺陷检查用图像处理装置和缺陷检查用图像处理方法
CN104956210A (zh) * 2013-01-30 2015-09-30 住友化学株式会社 图像生成装置、缺陷检查装置以及缺陷检查方法
WO2016121878A1 (ja) * 2015-01-29 2016-08-04 株式会社デクシス 光学式外観検査装置、及びこれを用いた光学式外観検査システム

Also Published As

Publication number Publication date
JP6970550B2 (ja) 2021-11-24
KR20190011200A (ko) 2019-02-01
CN109297971A (zh) 2019-02-01
CN109297971B (zh) 2022-10-21
JP2019023589A (ja) 2019-02-14
TW201908717A (zh) 2019-03-01

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