TWI788222B - extension device - Google Patents

Abstract

The expansion device of the present invention is provided with: an expansion part, which expands the sheet-like member at the first position; a moving mechanism, which makes the expansion part move from the first position along the horizontal direction in the state where the sheet-like member has been expanded by the expansion part. moving to the second position; and the heat shrinking part, which heats the slack part of the part around the wafer of the sheet member at the second position to make it shrink.

Description

Expansion device

The present invention relates to an expansion device, in particular to an expansion device for expanding a sheet-shaped component attached with a wafer and a ring-shaped component.

Conventionally, there is known an expanding device that expands a sheet member to which a wafer and a ring member are attached. Such an expansion device is disclosed in Japanese Patent No. 4288392, for example.

The aforementioned Japanese Patent No. 4288392 discloses an expanding device that expands an adhesive sheet (sheet member) attached to a wafer and a ring frame (ring member) surrounding the wafer. The expansion device is provided with a telescopic platform and a frame clamp for expanding the adhesive sheet. In this expanding device, in a state where the frame is fixed by the frame clips, the portion of the adhesive sheet to which the wafer is attached is lifted upward by the telescopic stage, thereby stretching the adhesive sheet to expand the adhesive sheet. In addition, the expansion device further includes a spray tube for thermally shrinking (heat shrinking) the slack portion of the adhesive sheet generated on the adhesive sheet due to expansion. In this expanding device, hot air is sprayed from the spray pipe to the slack portion of the adhesive sheet, whereby the slack portion of the adhesive sheet is thermally shrunk. Also, in the expansion device, the expansion of the adhesive sheet and the thermal contraction of the adhesive sheet are performed at the same position.

However, in the expansion device described in the above-mentioned Japanese Patent No. 4288392, since the expansion of the adhesive sheet and the thermal contraction of the adhesive sheet are performed at the same position, it is difficult to easily ensure the arrangement of the injection tube and the like related to the thermal contraction. The problematic point of the space of construction.

The present invention was made to solve the above-mentioned problems. One of the objects of the present invention is to provide a space for arranging heat-shrinkable structures that can be easily secured even when the sheet-like member is expanded and heat-shrunk. The expansion device.

In order to achieve the above object, the expansion device of one form of the present invention has: an expansion part, which at the first position will include the wafer, the ring-shaped member surrounding the wafer, and the wafer and the ring-shaped member are attached and have stretchability. The sheet member of the wafer ring structure of the heat-shrinkable sheet member expands; the moving mechanism moves the extension portion from the first position in the horizontal direction in the state where the sheet member has been expanded by the extension portion To the second position separated from the first position in the horizontal direction in plan view; and the thermal contraction part, which heats the slack part of the wafer surrounding part of the sheet-like member generated by the expansion of the expansion part at the second position , making it shrink.

In the expansion device according to one form of the present invention, as described above, the following components are provided: the expansion part, which attaches the wafer and the ring-shaped component and has a stretchable heat-shrinkable sheet-shaped component at the first position. Expansion; a movement mechanism that moves the expansion part along the horizontal direction to a second position that is separated from the first position in the horizontal direction in a plan view in a state where the sheet member has been expanded by the expansion part; and a thermal contraction part , at the second position, the slack portion of the sheet-like member around the wafer is heated to shrink it. Thereby, the expansion of the sheet-like member can be performed at the first position, and the heat-shrinking of the sheet-like member can be performed at the second position separated from the first position in the horizontal direction, so that the expansion and sheet-like member of the sheet-like member can be performed at different positions. Thermal shrinkage of shaped components. As a result, even when the sheet-like member is expanded and thermally shrunk, a space for arranging the heat-shrinkable structure of the sheet-like member can be easily secured at the second position. In addition, since the structure required to achieve high quality can be easily arranged at the second position, thermal shrinkage of a higher-quality sheet-like member can be easily achieved.

In addition, by performing the expansion of the sheet-shaped member and the thermal contraction of the sheet-shaped member at different positions, when there is a cooling structure for cooling the sheet-shaped member during expansion, and a removal structure for removing scatter generated during expansion, etc., It is also possible to secure a space for disposing the cooling structure and removing the structure at the first position. Thereby, when there are cooling structures, removal structures, etc., the cooling structures, removal structures, etc. required for achieving high quality can be arranged at the first position, and thus the expansion of higher quality sheet-shaped members can be achieved.

In the expansion device of the above-mentioned one aspect, it is preferable that the heat-shrinkable part is disposed at the second position above the expansion part moved by the moving mechanism. With this configuration, the heat-shrinkable portion can be disposed above the expanding portion where a space can be relatively easily secured at the second position. As a result, the structure required for achieving high quality can be more easily arranged at the second position, and thus heat shrinkage of a high-quality sheet-like member can be more easily achieved.

In this case, it is preferable that the heat-shrinkable portion is configured to be movable in the vertical direction between the upper position of the unheated sheet member and the lower position of the heated sheet member at the second position. According to such a configuration, by moving the heat-shrinkable portion to the upper position, the heat-shrinkable portion can be retracted so as not to interfere with the movement of the expansion portion, and thus the movement of the expansion portion can be easily performed. In addition, by moving the heat-shrinkable portion to the lower position, the heat-shrinkage of the sheet-shaped member can be easily performed after the expansion portion is moved to the second position.

In the expansion device of the above-mentioned one aspect, it is preferable to further include a suction unit which is arranged at the first position, and when the sheet member is expanded by the expansion unit, suction generated from the wafer due to the expansion of the sheet member is further provided. Remove the flying objects of the ring structure. With such a configuration, the spatter can be sucked and removed, so that quality defects caused by the spatter flying onto the wafer can be suppressed. In addition, unlike the case of removing the scattered matter by blowing it in the expansion device, the remaining of the scattered matter in the expansion device can be suppressed, so it can be suppressed that the scattered matter remaining in the expansion device is scattered again, causing the scattered matter to scatter to A quality defect occurs on the wafer. Also, as described above, since the expansion of the sheet member and the thermal contraction of the sheet member are performed at different positions, it is possible to secure a space for arranging the suction unit as the removal mechanism at the time of expansion.

In this case, it is preferable that the suction part includes a ring-shaped suction part body and a ring-shaped suction port, and the suction port is provided on the suction part body so as to face the outer edge of the wafer when sucking the flying matter. . With this configuration, the suction port of the suction unit is provided so as to face the outer edge of the wafer where spatter is likely to be generated, so that the spatter can be efficiently sucked by the suction unit.

In the configuration in which the above-mentioned suction part includes an annular suction port, it is preferable that the annular suction port is constituted by a plurality of suction ports arranged in a ring at predetermined intervals. With this structure, compared with the case where the ring-shaped suction port is composed of a single suction port, the suction force of each suction port can be increased, so that the splash can be sucked more effectively by the suction part. things.

In the configuration further comprising the above-mentioned suction unit, it is preferable that the suction unit is configured to be movable in the up-down direction between a lower position where the spatter is sucked and an upper position where the spatter is not sucked. According to this configuration, by moving the suction part to the upper position, the suction part can be retracted so as not to interfere with the movement of the expansion part, so that the movement of the expansion part can be easily performed. Moreover, by moving the suction part to the downward position, it is possible to easily perform suction of the scattered matter when expanding the sheet-shaped member.

In the expanding device of the above-mentioned one aspect, it is preferable to further include a cooling unit which is arranged at the first position and cools the sheet-shaped member when the sheet-shaped member is expanded by the expanding unit. With this configuration, the sheet-like member can be cooled and hardened during expansion, so it can be suppressed that the sheet-like member is soft, so only the outer peripheral part of the sheet-like member is extended, and the wafer cannot be split due to insufficient force for separating the wafer. . In addition, although there are cases where the wafer has a soft and thin film (low dielectric constant (Low-K) film and DAF (Die Attached Film, die adhesive film), etc.), and because the film is soft, even by The silicon portion of the expanded split wafer may not be split. However, if the above configuration is used, the film can be cooled and hardened during expansion, so that the phenomenon of not splitting the film can be suppressed. Also, as described above, the expansion of the sheet-like member and the thermal contraction of the sheet-like member can be performed at different positions, so a space for arranging the cooling unit as the cooling structure at the time of expansion can be ensured.

In this case, it is preferable that the moving mechanism is configured so as not to move the cooling unit from the first position, but to move the expansion unit horizontally from the first position to the second position independently of the cooling unit. According to this structure, compared with the case where a moving mechanism is comprised so that the extension part and cooling part may move together, the driving force required for a moving mechanism can be reduced. As a result, the moving mechanism can be downsized.

In the expansion device of the above-mentioned one aspect, it is preferable to further include a storage part, which is arranged in a position different from the first position and the second position in a plan view, and accommodates a plurality of wafer ring structures; and a take-out part, which is arranged in a plan view. At a position different from the first position and the second position, the wafer ring structure is taken out from the storage part, and the direction in which the take-out part takes out the wafer ring structure from the storage part is substantially parallel to the direction in which the moving mechanism moves the extension part. With this configuration, unlike the case where the direction in which the take-out part takes out the wafer ring structure from the storage part is substantially perpendicular to the direction in which the moving mechanism moves the extension part, it is possible to prevent the extension device from being in the same position as the take-out part takes out the wafer ring structure from the storage part. direction, and the direction in which the moving mechanism moves the extension part is enlarged in a direction substantially perpendicular to the direction.

Hereinafter, embodiments embodying the present invention will be described based on the drawings.

Referring to FIGS. 1 to 21 , the configuration of an extension device 100 according to an embodiment of the present invention will be described.

(The configuration of the expansion device) As shown in FIGS. 1 and 2 , the expansion device 100 is configured by dividing a wafer 210 to form a plurality of semiconductor chips. In addition, the extension device 100 is configured to form a sufficient gap between a plurality of semiconductor chips. Here, the modified layer is formed in advance on the wafer 210 by irradiating the wafer 210 with a laser having a transparent wavelength along the dicing line (street). The modified layer refers to cracks and pores formed inside the wafer 210 by laser. The method of forming the modified layer on the wafer 210 in this way is called stealth dicing.

Therefore, in the expanding device 100, the wafer 210 can be divided along the modified layer by expanding the sheet member 220. In addition, in the expanding device 100, the gap between the plural semiconductor wafers formed by dividing is expanded by expanding the sheet member 220 .

The extension device 100 includes a bottom plate 1, a box part 2, a lifting hand part 3, a suction hand part 4, a base 5, an extension part 6, a cold air supply part 7, a cooling unit 8, a debris cleaner 9, a heat shrink part 10, an ultraviolet irradiation Section 11. Furthermore, the box part 2 is an example of the "accommodating part" in the scope of the patent application. Also, the lifting hand 3 is an example of the "take-out part" within the scope of the patent application. In addition, the cold air supply part 7 and the cooling unit 8 are examples of the "cooling part" in the scope of the patent application. Also, the debris cleaner 9 is an example of the "suction part" of the scope of the patent application.

Here, let the arrangement direction of the box portion 2 and the heat shrinkable portion 10 in the horizontal direction be the X direction, let the box portion 2 side in the X direction be the X1 direction, and let the heat shrinkable portion 10 side in the X direction be X2 direction. Also, let the direction perpendicular to the X direction in the horizontal direction be the Y direction, let the box portion 2 side in the Y direction be the Y1 direction, and let the direction opposite to the Y1 direction be the Y2 direction. Moreover, let an up-down direction be a Z direction, let an up direction be a Z1 direction, and let a down direction be a Z2 direction.

＜Bottom plate＞ The bottom plate 1 is a base for setting the box part 2 and the suction hand part 4 . The bottom plate 1 has a rectangular shape that is longer in the Y direction when viewed from above.

＜Box part＞ The cassette unit 2 is configured to accommodate a plurality (five) of wafer ring structures 200 . Here, as shown in FIGS. 3 and 4 , the wafer ring structure 200 includes a wafer 210 , a sheet member 220 , and a ring member 230 .

The wafer 210 is a circular thin plate made of a crystal of a semiconductor substance that is a material of a semiconductor integrated circuit. As described above, the modification layer for modifying the inside along the dicing lines is formed inside the wafer 210 . That is, the wafer 210 is configured to be divisible along the dicing lines. The sheet member 220 is a stretchable adhesive tape. An adhesive layer is disposed on the upper surface 220 a of the sheet member 220 . The wafer 210 is attached to the adhesive layer of the sheet member 220 . The ring member 230 is a ring-shaped metal frame in plan view. A notch 240 and a notch 250 are formed on the outer side 230 a of the ring member 230 . The ring member 230 is attached to the adhesive layer of the sheet member 220 in a state surrounding the wafer 210 .

As shown in FIGS. 1 and 2 , the cassette unit 2 includes a Z-direction movement mechanism 21 , a wafer cassette 22 , and a pair of mounting units 23 . The Z-direction moving mechanism 21 is configured to move the cassette 22 in the Z-direction using the motor 21a as a drive source. Moreover, the Z direction movement mechanism 21 has the mounting table 21b which supports the wafer cassette 22 from the lower side. The wafer cassette 22 is supplied and mounted on the mounting table 21b by manual work. The wafer box 22 has a storage space that can accommodate a plurality of wafer ring structures 200 . A plurality of pairs (five pairs) of mounting parts 23 are disposed inside the cassette 22 . The annular member 230 of the wafer ring structure 200 is placed on the pair of placement parts 23 from the Z1 direction side. One of the pair of mounting parts 23 protrudes from the inner surface of the cassette 22 on the side in the X1 direction to the side in the X2 direction. The other of the pair of mounting parts 23 protrudes from the inner surface of the cassette 22 on the side in the X2 direction to the side in the X1 direction.

＜Hand improvement＞ The lifting hand part 3 is configured so that the wafer ring structure 200 can be taken out from the box part 2 . In addition, the lifting hand part 3 is configured to accommodate the wafer ring structure 200 in the cassette part 2 .

Specifically, the lifting hand 3 includes a Y-direction movement mechanism 31 and a lifting hand 32 . The Y direction movement mechanism 31 is comprised so that the lift hand 32 may move to a Y direction using the motor 31a as a drive source. The lifter 32 is configured to support the ring member 230 of the wafer ring structure 200 from the Z2 direction side.

＜Absorb hands＞ The suction hand 4 is configured to suction the annular member 230 of the wafer ring structure 200 from the Z1 direction side.

Specifically, the suction hand 4 includes an X-direction movement mechanism 41 , a Z-direction movement mechanism 42 , and a suction hand 43 . The X direction movement mechanism 41 is comprised so that the suction hand 43 may move to the X direction using the motor 41a as a drive source. The Z direction movement mechanism 42 is comprised so that the suction hand 43 may move to Z direction using the motor 42a as a drive source. The suction hand 43 is configured to support the annular member 230 of the wafer ring structure 200 from the Z1 direction side.

＜base＞ The base 5 is a base for setting the expansion part 6 , the cooling unit 8 and the ultraviolet irradiation part 11 . The base 5 has a rectangular shape that is longer in the Y direction when viewed from above.

＜Extensions＞ The extension part 6 is configured to divide the wafer 210 along the dividing line by expanding the sheet member 220 of the wafer ring structure 200 .

Specifically, the expansion part 6 includes a Z-direction movement mechanism 61 , a Y-direction movement mechanism 62 , a clamping part 63 , and an expansion ring 64 . The Z direction movement mechanism 61 is comprised so that the clamping part 63 may move to Z direction using the motor 61a as a drive source. The Y-direction moving mechanism 62 is configured to move the Z-direction moving mechanism 61 , the clamping portion 63 , and the expansion ring 64 in the Y direction using the motor 62 a as a drive source. Furthermore, the Y-direction moving mechanism 62 is an example of the "moving mechanism" within the scope of the patent application.

The clamping portion 63 is configured to hold the annular member 230 of the wafer ring structure 200 . The holding portion 63 has a lower holding portion 63a and an upper holding portion 63b. The lower holding portion 63a supports the annular member 230 from the side in the Z2 direction. The upper holding portion 63b presses the annular member 230 supported by the lower holding portion 63a from the Z1 direction side. In this way, the annular member 230 is held by the lower holding portion 63a and the upper holding portion 63b.

The expansion ring 64 is configured to expand (expand) the sheet member 220 by supporting the sheet member 220 from the side in the Z2 direction. The expansion ring 64 has a ring shape in plan view.

＜Air conditioner supply part＞ The cold air supply unit 7 is configured to supply cold air to the sheet member 220 from the Z1 direction side when the sheet member 220 is expanded by the expansion unit 6 .

Specifically, the cold air supply unit 7 has a plurality of nozzles 71 . The nozzle 71 has a cool air supply port 71a (see FIG. 5 ) through which cool air supplied from a cool air supply source (not shown) flows out. The nozzle 71 is attached to the debris cleaner 9 . The cold air supply source is a cooling device used to generate cold air. The cool air supply source supplies, for example, air cooled by a cooling device provided with a heat pump or the like. This cold air supply source is provided on the base 5 . The cold air supply source and the plurality of nozzles 71 are respectively connected by hoses (not shown).

＜Cooling unit＞ The cooling unit 8 is configured to cool the sheet member 220 from the side in the Z2 direction when the sheet member 220 is expanded by the extension portion 6 .

Specifically, the cooling unit 8 includes a cooling member 81 having a cooling body 81 a and a Peltier element 81 b, and a power cylinder 82 . The cooling body 81a is composed of a member with a large heat capacity and high thermal conductivity. Cooling body 81a is formed of metal such as aluminum. The Peltier element 81b is configured to cool the cooling body 81a. Furthermore, the cooling body 81a is not limited to aluminum, and may be other members with large heat capacity and high thermal conductivity.

The cooling unit 8 is configured to be movable in the Z direction by the power cylinder 82 . Thereby, the cooling unit 8 can move to a position where it is in contact with the sheet member 220 and a position where it is separated from the sheet member 220 .

＜Debris Cleaner＞ The debris cleaner 9 is configured to suck debris of the wafer 210 and the like when the sheet member 220 is expanded by the expanding portion 6 .

As shown in FIG. 5 , the debris cleaner 9 includes an annular member 91 and a plurality of suction ports 92 . The annular member 91 is a member having an annular shape as viewed from the Z1 direction side. The plurality of suction ports 92 are openings for suctioning chips of the wafer 210 and the like. A plurality of suction ports 92 are formed on the lower surface of the annular member 91 on the side in the Z2 direction. Furthermore, the ring-shaped member 91 is an example of the "suction part main body" of the scope of the patent application.

As shown in FIG. 2 , the debris cleaner 9 is configured to be movable in the Z direction by a power cylinder (not shown). Thereby, the debris cleaner 9 can move to a position close to the wafer 210 and avoid the suction hand 43 moving in the X direction.

＜Heat shrink part＞ The heat-shrinkable part 10 is configured to shrink the sheet-like member 220 expanded by the expanding part 6 by heating while maintaining the gap between the plurality of semiconductor chips.

As shown in FIG. 1 , the heat shrinkable part 10 includes a Z-direction moving mechanism 110 , a heating ring 111 , an air suction ring 112 , and an expansion maintaining ring 113 . The Z-direction moving mechanism 110 is configured to move the heating ring 111 and the suction ring 112 in the Z-direction using the motor 110a as a driving source.

As shown in FIG. 6 , the heating ring 111 has a ring shape in plan view. Also, the heating ring 111 has a package heater for heating the sheet member 220 . The suction ring 112 is formed integrally with the heating ring 111 . The suction ring 112 has a ring shape in plan view. A plurality of suction ports 112a are formed on the lower surface of the suction ring 112 on the Z2 direction side. The expansion holding ring 113 is configured to press the sheet member 220 near the wafer 210 from the side in the Z1 direction so that the sheet member 220 is not shrunk by the heating of the heating ring 111 .

The expansion maintaining ring 113 has a ring shape in plan view. The expanding and maintaining ring 113 is configured to be movable in the Z direction by a power cylinder (not shown). Thereby, the expansion maintaining ring 113 can move to a position pressing the sheet member 220 and a position away from the sheet member 220 .

＜Ultraviolet irradiation department＞ The ultraviolet irradiation unit 11 is configured to irradiate the sheet member 220 with ultraviolet rays to reduce the adhesive force of the adhesive layer of the sheet member 220 . Specifically, the ultraviolet irradiation unit 11 has an ultraviolet illumination unit.

(Control configuration of extension device) As shown in FIG. 7 , the expansion device 100 includes a first control unit 12, a second control unit 13, a third control unit 14, a fourth control unit 15, a fifth control unit 16, an expansion control calculation unit 17, and an operation control calculation unit. 18. Memory unit 19.

The first control unit 12 is configured to control the heat shrinkable unit 10 . The first control unit 12 includes a CPU (Central Processing Unit, central processing unit), a storage unit including a ROM (Read Only Memory), RAM (Random Access Memory, random access memory), and the like. Furthermore, the first control unit 12 may also include, as a memory unit, a HDD (Hard Disk Drive) for storing information that is also memorized after the blocking voltage. Moreover, HDD may be provided in common with respect to the 1st control part 12, the 2nd control part 13, the 3rd control part 14, the 4th control part 15, and the 5th control part 16.

The second control unit 13 is configured to control the cold air supply unit 7 , the cooling unit 8 and the debris cleaner 9 . The second control unit 13 includes a CPU, a memory unit including a ROM, a RAM, and the like. The third control unit 14 is configured to control the extension unit 6 . The third control unit 14 includes a CPU, a memory unit including a ROM, a RAM, and the like. Furthermore, the second control unit 13 and the third control unit 14 may also include, as memory units, HDDs for storing information that is also memorized after the blocking voltage.

The 4th control part 15 is constituted by the mode of control box part 2 and lifting hand part 3. The fourth control unit 15 includes a CPU, a memory unit including a ROM, a RAM, and the like. The fifth control unit 16 is configured to control the suction hand 4 . The fifth control unit 16 includes a CPU, a memory unit including a ROM, a RAM, and the like. Furthermore, the 4th control part 15 and the 5th control part 16 may also contain the HDD etc. which store the information which is also memorized after the blocking voltage is stored, as a memory part.

The expansion control computing unit 17 is configured to perform correlation calculations for the expansion processing of the sheet member 220 based on the processing results of the first control unit 12 , the second control unit 13 , and the third control unit 14 . The extended control calculation unit 17 includes a CPU, a storage unit including a ROM, a RAM, and the like.

The operation control calculation unit 18 is configured to perform calculations related to the movement processing of the wafer ring structure 200 based on the processing results of the fourth control unit 15 and the fifth control unit 16 . The operation control computing unit 18 includes a CPU, a memory unit including a ROM, a RAM, and the like.

The memory unit 19 stores programs useful for operating the extension device 100 . The storage unit 19 includes ROM, RAM, and the like.

(Semiconductor wafer manufacturing process implemented by extension device) Hereinafter, the overall operation of the extension device 100 will be described.

In step S1 , the wafer ring structure 200 is taken out from the box part 2 . That is, after the wafer ring structure 200 accommodated in the cassette part 2 is supported by the lifting hand 32, the lifting hand 32 is moved to the side in the Y2 direction by the Y direction moving mechanism 31, thereby taking out the wafer ring structure from the cassette part 2 200. In step S2 , the wafer ring structure 200 is transferred to the extension part 6 by the suction hand 43 . That is, the wafer ring structure 200 taken out from the cassette unit 2 is moved to the side in the X2 direction by the X-direction moving mechanism 41 while being sucked by the suction hand 43 . Then, after the wafer ring structure 200 moved to the side in the X2 direction is transferred from the suction hand 43 to the clamping portion 63 , it is held by the clamping portion 63 .

In step S3 , the sheet member 220 is expanded by the expansion part 6 . At this time, the sheet member 220 of the wafer ring structure 200 held by the clamping portion 63 is cooled by the cooling unit 8 . Also, if necessary, the sheet member 220 needs to be cooled by the cold air supply unit 7 . The wafer ring structure 200 that has been cooled to a specific temperature is lowered in a state held by the clamping portion 63 by the Z-direction moving mechanism 61 . Then, the sheet member 220 is expanded by the expansion ring 64, thereby dividing the wafer 210 along the dividing line. At this time, the wafer 210 is divided while the debris is sucked by the debris cleaner 9 .

In step S4 , while maintaining the expanded state of the sheet member 220 , the expanded portion 6 is moved to the Z2 direction side of the heat-shrinkable portion 10 . That is, after the wafer 210 is divided, the wafer ring structure 200 in the state where the sheet member 220 is expanded is moved in the Y1 direction by the Y direction moving mechanism 62 . In step S5, the sheet-like member 220 is heated by the heat-shrinking part 10 to make it shrink. At this time, the wafer ring structure 200 moved along the Y1 direction is heated by the heating ring 111 in a state of being clamped by the expansion holding ring 113 and the expansion ring 64 . At this time, air is sucked by the suction ring 112 , and ultraviolet rays are irradiated by the ultraviolet irradiation unit 11 .

In step S6, the expansion part 6 is returned to the original position. That is, the wafer ring structure 200 in which the sheet member 220 has shrunk is moved to the Y2 direction side by the Y direction moving mechanism 31 . In step S7, in the state where the wafer ring structure 200 has been transferred from the extension part 6 to the lifting hand part 3 by the suction hand 43, it is moved to the X1 direction side by the X direction movement mechanism 41, and delivered To lift hand 32. In step S8 , the wafer ring structure 200 is housed in the cassette unit 2 . That is, the wafer ring structure 200 supported by the lifting hand 32 is moved to the side in the Y1 direction by the Y-direction moving mechanism 31 , whereby the wafer ring structure 200 is accommodated in the cassette unit 2 . So far, the processing of the wafer ring structure 200 is completed.

(Related components of expansion and heat shrinkage) Referring to Fig. 1 and Fig. 9 to Fig. 14, the structure related to expansion and thermal contraction will be described in detail.

Here, in this embodiment, as shown in FIG. 1 and FIGS. 9 to 14 , the expansion part 6 is configured to expand the heat-shrinkable sheet member 220 having stretchability at the first position P1. Also, the Y direction movement mechanism 62 is to make the Z direction movement mechanism 61 of the expansion part 6, the clamping part 63 and the expansion ring 64 along the horizontal direction ( Y1 direction) is configured to move from the first position P1 to the second position P2 separated from the first position P1 in the horizontal direction (Y1 direction) in plan view. In addition, the thermal contraction unit 10 heats the slack portion of the portion 220b around the wafer 210 of the sheet member 220 generated by the expansion of the expansion unit 6 at the second position P2 to shrink it (heat shrink it). constituted in a manner.

＜Related components of expansion＞ As shown in FIGS. 9 to 11 , the expansion part 6 is configured to hold the ring-shaped member 230 in the vertical direction (Z direction) by the clamping part 63 when the sheet-shaped member 220 is expanded. Specifically, the upper holding portion 63 b of the holding portion 63 includes a plurality of (four) sliding bodies 63 ba arranged to surround the wafer ring structure 200 . The plurality of sliding bodies 63ba are configured to slide and move toward the wafer 210 side in the horizontal direction when the annular member 230 is held. In addition, the lower holding portion 63a of the clamping portion 63 is driven by a power cylinder such as an air cylinder, and moves toward the upper holding portion 63b (a plurality of sliding moving bodies 63ba ) that has slid to the side of the wafer 210 toward the Z1 direction side. The way of rising is formed. Thereby, the annular member 230 is held and fixed between the upper holding portion 63 b and the lower holding portion 63 a of the clamping portion 63 .

In addition, the clamping portion 63 moves toward the expansion ring 64 by the driving force of the motor 61a of the Z-direction moving mechanism 61 in the state of holding the ring-shaped member 230 between the upper holding portion 63b and the lower holding portion 63a. It is configured in a manner of descending toward the Z2 direction side. By this, the sheet member 220 is pressed against the expansion ring 64, and the sheet member 220 is expanded. Furthermore, the expansion ring 64 is arranged on the Z2 direction side with respect to the sheet member 220 . Further, the expansion ring 64 is formed in a circular ring shape coaxial with the ring member 230 so as to surround the wafer 210 . Also, the diameter of the expansion ring 64 is larger than the diameter of the wafer 210 and smaller than the diameter (inner diameter) of the annular member 230 . That is, the expansion ring 64 is arranged between the wafer 210 and the ring member 230 in the horizontal direction.

In addition, in the present embodiment, at the first position P1 which is the expanded position, a debris cleaner 9 is arranged on the side in the Z1 direction with respect to the wafer ring structure 200, and the debris cleaner 9 sucks the air produced by expanding the sheet member 220. Remove the scattered matter of the wafer ring structure 200. The flying objects are, for example, fragments of the wafer 210. Because the fragments of the wafer 210 are relatively small near the outer edge 210a of the wafer 210 (refer to FIG. 12), their positions are unstable when the sheet member 220 is expanded. It is easy to become a flying object. Also, when there is a die adhesive film between the wafer 210 and the sheet member 220, the die adhesive film may become scattered matter. The debris cleaner 9 is configured to suck and remove the scattered matter by the negative pressure supplied from the negative pressure generating device.

In addition, in this embodiment, as shown in FIG. 5 and FIG. 12 , the suction port 92 of the debris cleaner 9 is connected to the circular ring when sucking the scattered matter (wafer 210 fragments, die adhesive film fragments, etc.) The outer edge 210a of the wafer 210 facing to each other is formed in a circular ring shape. Specifically, the annular suction port 92 is constituted by a plurality of suction ports 92 arranged circularly at predetermined intervals. The debris cleaner 9 is configured to suck the flying matter in a direction away from the center of the wafer 210 through the circular suction port 92 .

Also, in this embodiment, as shown in FIGS. 9 to 11 , the debris cleaner 9 is driven by a power cylinder such as an air cylinder, and can move along the vertical direction (Z direction) at the first position P1 as the extended position. ) is constituted in such a way that it moves between the lower position where the spatter is sucked and the upper position where the spatter is not sucked. The lower position is the position near the wafer 210 . Also, the upper position is a retracted position that can avoid the suction hand 43 moving in the X direction. The debris cleaner 9 is configured such that when the sheet member 220 is expanded, it descends from the upper position to the Z2 direction side to the lower position. Also, the debris cleaner 9 starts the suction action by pressing the sheet member 220 against the expansion ring 64, and at least continues the suction action until the action of pressing the sheet member 220 against the expansion ring 64 is completed (by The Z-direction moving mechanism 61 is configured in such a way that the movement to the Z2-direction side is completed).

In addition, in the present embodiment, the cold air supply part 7 and the cooling unit 8 are disposed at the first position P1 as the expansion position, which are equivalent to cooling the sheet member 220 when the sheet member 220 is expanded by the expansion part 6 . The cold air supply unit 7 is provided integrally with the debris cleaner 9 on the Z1 direction side with respect to the wafer ring structure 200 . Therefore, the cold air supply unit 7 is configured to be movable integrally with the debris cleaner 9 in the vertical direction (Z direction) between a lower position where cold air is supplied and an upper position where cold air is not supplied at the first position P1. The cold air supply part 7 is configured so that when the sheet member 220 is expanded, it descends from the upper position to the Z2 direction side to the lower position. In addition, the cold air supply unit 7 is configured to start the cold air supply operation before pressing the sheet member 220 against the expansion ring 64 , and to continue the cold air supply operation at least until the sheet member 220 is pressed against the expansion ring 64 .

In addition, the cooling unit 8 is arranged on the Z2 direction side with respect to the wafer ring structure 200 . Also, the cooling unit 8 is at the first position P1, by the driving force of the power cylinder 82 such as an air cylinder, it can be positioned between the upper position of the cooling sheet member 220 and the non-cooling sheet member 220 along the up and down direction (Z direction). The method of moving between the lower positions is formed. The cooling unit 8 is configured such that when the sheet member 220 is expanded, it rises from the lower position to the side in the Z1 direction to the upper position. In addition, the cooling unit 8 is configured to start and complete the cooling operation before the sheet member 220 is pressed against the expansion ring 64 . In addition, the cooling unit 8 is configured such that the sheet member 220 is retracted to a lower position before being pressed against the expansion ring 64 .

Also, the Y-direction moving mechanism 62 is configured in such a manner that after the expansion of the sheet member 220 by the expansion unit 6 (the action of pressing the sheet member 220 against the expansion ring 64 ) is completed, while maintaining In the state where the sheet member 220 is expanded by the part 6, the expansion part 6 (Z direction moving mechanism 61, clamping part 63 and expansion ring 64) is moved along the Y1 direction from the first position P1 where the sheet member 220 has just been expanded. It moves to the second position P2 where the thermal shrinkage of the sheet member 220 is about to be performed. At this time, the Y-direction moving mechanism 62 does not move the debris cleaner 9, the cold air supply part 7 and the cooling unit 8 from the first position P1, but is independent of the debris cleaner 9, the cold air supply part 7 and the cooling unit 8. , and make the extension part 6 move along the Y1 direction from the first position P1 to the second position P2. At this time, the debris cleaner 9 and the cold air supply unit 7 have retracted to the upper position, and the cooling unit 8 has retracted to the lower position.

The Y-direction moving mechanism 62 further has a mounting portion 62b and a rail portion 62c in addition to the motor 62a. The mounting portion 62b is configured such that the Z-direction moving mechanism 61, the clamping portion 63, and the expansion ring 64 are mounted on the upper surface. Moreover, the mounting part 62b is formed in the flat plate shape which has a substantially rectangular shape in planar view. Moreover, the mounting part 62b is movably provided on the rail part 62c. The rail part 62c is divided|separated in the X direction, and is provided in pairs. A pair of rail part 62c is provided so that it may extend between 1st position P1 and 2nd position P2 along a Y direction. The Y-direction moving mechanism 62 can move the mounting part 62b along the pair of rail parts 62c in the Y-direction by the driving force of the motor 62a, thereby making the Z-direction moving mechanism 61, the clamping part 63 and the expansion ring 64 is configured to move between the first position P1 and the second position P2 along the Y direction.

Moreover, the hole part 62ba which penetrates the mounting part 62b along the up-down direction (Z direction) is provided in the mounting part 62b. The hole portion 62ba is formed in a circular shape in plan view. Moreover, the hole part 62ba has the size which allows the cooling unit 8 to pass through in the 1st position P1. Thereby, the cooling unit 8 can be moved between an upper position and a lower position through the hole portion 62ba. Moreover, the hole part 62ba has the size which can pass the ultraviolet irradiation part 11 in 2nd position P2. Thereby, the ultraviolet irradiation part 11 can be moved between an upper position and a lower position via the hole part 62ba. Moreover, the hole portion 62ba is provided inside the expansion ring 64 . The cooling unit 8 and the ultraviolet irradiation unit 11 are configured to move inwardly of the expansion ring 64 via the hole portion 62ba.

＜Constituents related to heat shrinkage＞ In addition, in this embodiment, as shown in FIG. 13 and FIG. 14 , the heat-shrinkable portion 10 is disposed on the Z1 direction side of the expansion portion 6 moved by the Y-direction moving mechanism 62 at the second position P2 as the heat-shrinkable position. . In addition, the heating ring 111 and the suction ring 112 of the heat shrinkable part 10 are driven by the motor 110a of the Z-direction moving mechanism 110, at the second position P2, they can move along the up-down direction (Z-direction) without heating the sheet. The upper position of the sheet-like member 220 and the lower position of the heating sheet-like member 220 are configured in such a manner. In addition, the expansion retaining ring 113 of the heat shrinkable part 10 is driven by a power cylinder such as an air cylinder, and at the second position P2, the upper position of the non-pressing sheet member 220 and the pressing sheet member 220 can be moved along the vertical direction. The method of moving between the following positions is composed. In addition, the upper position is a retracted position that can avoid the expansion part 6 and the wafer ring structure 200 moving in the Y1 direction. Also, the lower position is a position near the sheet member 220 .

In addition, the heat-shrinkable part 10 (heating ring 111, suction ring 112, and expansion-maintaining ring 113) is configured so that the sheet member 220 is lowered from the upper position to the Z2 direction side to the lower position when the sheet member 220 is heat-shrunk. Furthermore, the vertical mechanism (Z-direction movement mechanism 110 ) for the heating ring 111 and the suction ring 112 is different from the vertical mechanism (power cylinder) for the expansion and maintenance ring 113 . Therefore, the heating ring 111 , the suction ring 112 and the expanding and maintaining ring 113 can move up and down independently of each other. The expansion maintaining ring 113 is configured to sandwich the sheet member 220 between itself and the expansion ring 64 in the vertical direction (Z direction). Thereby, the expansion holding ring 113 is configured to maintain the expanded state of the portion of the sheet member 220 corresponding to the wafer 210 . In addition, the heater ring 111 heats the portion 220b of the sheet member 220 around the wafer 210 ( The outer part of the expansion maintaining ring 113) is formed by heating. In addition, the suction ring 112 is configured to absorb gas generated from the sheet member 220 by heating while the sheet member 220 is being heated by the heating ring 111 .

In addition, in this embodiment, the ultraviolet ray irradiation unit 11 is arranged at the second position P2 as the thermal shrinkage position, which is used to irradiate the sheet member 220 with ultraviolet rays when the sheet member 220 is thermally shrunk by the thermal shrinkage unit 10. . The ultraviolet irradiation unit 11 is arranged on the Z2 direction side with respect to the wafer ring structure 200 . In addition, the ultraviolet irradiating part 11 can move between the upper position where ultraviolet rays are irradiated and the lower position where ultraviolet rays are not irradiated, along the vertical direction (Z direction) by the driving force of a power cylinder 121 such as an air cylinder at the second position P2. constituted in a manner. The ultraviolet irradiation part 11 is comprised so that when the sheet-shaped member 220 heat-shrinks, it rises to the upper position from a lower position toward Z1 direction side.

Also, the Y-direction moving mechanism 62 is configured in the following manner: after the heat-shrinking action of the sheet member 220 by the heat-shrinking part 10 is completed, the expansion part 6 (the Z-direction moving mechanism 61, the clamping part 63 and the expansion ring) 64) Move along the Y2 direction from the second position P2 where thermal shrinkage has just been performed to the first position P1 where expansion has just been performed. At this time, the Y-direction moving mechanism 62 does not move the heat-shrinkable portion 10 and the ultraviolet ray irradiation portion 11 from the second position P2, but independently of the heat-shrinkable portion 10 and the ultraviolet ray irradiation portion 11, moves the expansion portion 6 along the Y2 The direction moves from the second position P2 to the first position P1. At this time, the heat shrinkable part 10 has withdrawn to the upper position, and the ultraviolet irradiation part 11 has withdrawn to the lower position.

＜The composition of the box part and the lifting hand part＞ Moreover, in this embodiment, as shown in FIG. 1, the case part 2 is arrange|positioned at the position different from the 1st position P1 and the 2nd position P2 in planar view. Moreover, the lift hand part 3 is arrange|positioned at the position different from the 1st position P1 and the 2nd position P2 in planar view. Moreover, the direction (Y2 direction) in which the lifting hand 3 takes out the wafer ring structure 200 from the cassette part 2 is substantially parallel to the direction (Y1 direction) in which the Y-direction moving mechanism 62 moves the extension part 6 . That is, the insertion/extraction direction (Y direction) of the lifting hand 3 into and out of the wafer ring structure 200 and the movement direction (Y direction) of the extension part 6 moved by the Y direction movement mechanism 62 are substantially parallel to each other. Moreover, the case part 2 is arrange|positioned in parallel with the 2nd position P2 which is a thermal contraction position in a X direction. In addition, the pick-up position of the lifting hand 3 to take out the wafer ring structure 200 is arranged side by side with the first position P1 which is an extended position in the X direction.

(take out processing) Referring to FIG. 15 , the take-out processing in the expansion device 100 will be described. The take-out process is a process performed in step S1 of the above-mentioned semiconductor wafer manufacturing process.

As shown in FIG. 15 , in step S101 , it is judged whether the lifting hand 32 of the lifting hand 3 is free. When the lifting hand 32 is not idle, the take-out process ends. Also, when the lifting hand 32 is free, go to step S102.

Then, in step S102 , it is judged whether there is a lifting hand 32 in the wafer cassette 22 of the cassette unit 2 . When there is no lifting hand 32 in the wafer cassette 22, go to step S104. Also, if there is a lifting hand 32 in the cassette 22, the process proceeds to step S103.

Then, in step S103 , the lifting hand 32 is moved from the inside of the wafer cassette 22 to the outside of the wafer cassette 22 along the Y2 direction by the Y-direction moving mechanism 31 .

Then, in step S104 , the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 , so that the wafer ring structure 200 in the wafer cassette 22 as the object to be taken out can be taken out by the lifting hand 32 . Specifically, in step S104, the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21, so that the upper surface of the lifting hand 32 is located in the wafer cassette 22 as the wafer ring structure to be taken out. The height of the lower surface of the ring member 230 of 200 slightly deviated from the Z2 direction side.

Then, in step S105, the lifting hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31, so that it is positioned in the wafer cassette 22 in front of the ring-shaped member 230 of the wafer ring structure 200 to be taken out. below.

Then, in step S106 , the wafer ring structure 200 to be taken out in the wafer cassette 22 is delivered to the lifting hand 32 . Specifically, in step S106, the wafer cassette 22 is moved in the Z2 direction by the Z-direction moving mechanism 21, so that the ring member 230 of the wafer ring structure 200 in the wafer cassette 22 is The lower surface is slightly raised from the upper surface of the pair of loading parts 23 by the lifting hands 32 .

Then, in step S107, in the state where the lower surface of the annular member 230 of the wafer ring structure 200 to be taken out is supported by the upper surface of the lifting hand 32, the lifting hand 32 is moved by the Y-direction moving mechanism 31 Move in the Y2 direction. Thus, the wafer ring structure 200 to be taken out is taken out from the cassette 22 by the lifting hand 32 . Then, the take-out process ends.

(transfer processing) Referring to FIG. 16 , the migration process in the extension device 100 will be described. The transfer process is a process performed in step S2 or S7 of the above semiconductor wafer manufacturing process.

As shown in FIG. 16 , in step S201 , the suction hand 43 of the suction hand 4 is raised by the Z-direction moving mechanism 42 .

Then, in step S202 , the suction hand 43 is moved above the wafer ring structure 200 by the X-direction moving mechanism 41 . Specifically, in the case of step S2 of the semiconductor wafer manufacturing process described above, the suction hand 43 is moved above the wafer ring structure 200 supported by the lifting hand 32 . In addition, in the case of step S7 of the semiconductor wafer manufacturing process described above, the suction hand 43 is moved above the wafer ring structure 200 supported by the extension part 6 .

Then, in step S203 , the suction hand 43 is lowered toward the wafer ring structure 200 by the Z-direction moving mechanism 42 .

Then, in step S204, the suction hand 43 suctions the annular member 230 of the wafer ring structure 200 by the negative pressure supplied from the negative pressure generating device.

Then, in step S205 , the suction hand 43 is raised by the Z-direction moving mechanism 42 .

Then, in step S206 , the suction hand 43 is moved above the transfer destination by the X-direction moving mechanism 41 . Specifically, in the case of step S2 of the above-mentioned semiconductor wafer manufacturing process, the suction hand 43 is moved above the extension portion 6 at the first position P1. Moreover, in the case of step S7 of the above-mentioned semiconductor wafer manufacturing process, the suction hand 43 is moved above the lifting hand 32 .

Then, in step S207 , the suction hand 43 is lowered toward the transfer destination (the extension part 6 or the lifting hand 32 ) by the Z-direction moving mechanism 42 .

Then, in step S208 , the suction of the ring member 230 of the wafer ring structure 200 by the suction hand 43 is released. So far, the operation of transferring the wafer ring structure 200 to the transfer destination is completed. Then, the transfer process ends.

(extended processing) Expansion processing in the expansion device 100 will be described with reference to FIGS. 17 and 18 . The expansion process is the process performed in step S3 of the above semiconductor wafer manufacturing process. The expansion process is performed at the first position P1.

As shown in FIG. 17 , in step S301 , the suction hand 43 is raised by the Z-direction moving mechanism 42 . At this time, the annular member 230 of the wafer ring structure 200 is supported by the lower holding portion 63 a of the holding portion 63 .

Then, in step S302, the plurality of sliding bodies 63ba of the upper holding portion 63b are moved horizontally toward the wafer 210 side.

Then, in step S303 , the lower holding portion 63 a is raised while supporting the annular member 230 of the wafer ring structure 200 . Thereby, the annular member 230 is held and fixed between the upper holding portion 63b and the lower holding portion 63a.

Then, in step S304 , the debris cleaner 9 and the cooling air supply part 7 are lowered toward the wafer ring structure 200 by the power cylinder.

Then, in step S305 , it is determined whether it is necessary to supply cold air to the sheet member 220 through the cold air supply part 7 for cooling. When it is necessary to supply cold air to the sheet member 220 by the cold air supply part 7 for cooling, the process proceeds to step S305a. Then, in step S305a, the cool air supply unit 7 is caused to start supplying the cool air to the sheet member 220 . Furthermore, in the case of cooling by the cold air supply part 7, the cooling by the cooling unit 8 is also performed in the following step S307. Then, go to step S306. In addition, when it is not necessary to supply cold air to the sheet member 220 by the cold air supply unit 7 for cooling, the process of step S305a is not performed, and the process proceeds to step S306.

Then, in step S306 , it is judged whether the sheet member 220 needs to be cooled by the cooling unit 8 . When it is necessary to cool the sheet member 220 by the cooling unit 8, go to step S307. Then, in step S307 , in addition to cooling the sheet member 220 by the cold air supply part 7 , the sheet member 220 is further cooled by the cooling unit 8 . Then, go to step S308. Also, when it is not necessary to cool the sheet-like member 220 by the cooling unit 8, the process of step S307 is not performed, and the process proceeds to step S308.

Then, as shown in FIG. 18 , in step S308 , the debris cleaner 9 is caused to start suctioning the spatter.

Then, in step S309 , the clamping portion 63 is rapidly lowered by the Z-direction moving mechanism 61 to press the sheet member 220 against the expansion ring 64 , thereby implementing the expansion of the sheet member 220 . Thus, the wafer 210 on the sheet member 220 is divided into a plurality of semiconductor chips in a matrix, and the gaps between the plurality of semiconductor chips are enlarged. Moreover, in step S309, the clamping part 63 is lowered from the expansion start position to the expansion completion position.

Then, in step S310 , the cool air supply unit 7 stops supplying the cool air to the sheet member 220 . Furthermore, when it is judged in step 305 that it is not necessary to supply cold air to the sheet member 220 by the cold air supply part 7 for cooling, the process of step S310 is not performed, and the process proceeds to step S311.

Then, in step S311, the debris cleaner 9 is stopped from sucking the scattered matter.

Then, in step S312, the debris cleaner 9 and the cold air supply part 7 are raised together by the power cylinder. Then, the expansion processing ends. Then, while maintaining the expanded state of the sheet member 220, the expanding part 6 (the Z-direction moving mechanism 61, the clamping part 63 and the expanding ring 64) is moved from the first position P1 to the first position by the Y-direction moving mechanism 62. 2 position P2.

(heat shrink treatment) Referring to FIG. 19 and FIG. 20 , the heat shrinking process in the expansion device 100 will be described. The thermal shrinkage treatment is a treatment performed in step S5 of the above semiconductor wafer manufacturing process.

As shown in FIG. 19 , in step S401 , the ultraviolet irradiation unit 11 is raised by the power cylinder 121 .

Then, in step S402, the expansion maintaining ring 113 is lowered by the power cylinder. Thereby, the sheet member 220 is sandwiched between the expansion maintaining ring 113 and the expansion ring 64 .

Then, in step S403 , the heating ring 111 and the suction ring 112 are lowered by the Z-direction moving mechanism 110 . Furthermore, the vertical mechanism (Z-direction movement mechanism 110 ) for the heating ring 111 and the suction ring 112 is different from the vertical mechanism (power cylinder) for the expansion and maintenance ring 113 .

Then, in step S404, the air suction ring 112 is started to inhale.

Then, in step S405 , the heating ring 111 is started to heat the sheet member 220 , and the ultraviolet irradiation unit 11 is started to irradiate the sheet member 220 with ultraviolet rays. When the heating ring 111 heats the sheet member 220, the slack in the portion 220b of the sheet member 220 around the wafer 210 is shrunk and removed. Moreover, the adhesive force of the adhesive layer of the sheet-shaped member 220 is reduced by making the ultraviolet irradiation part 11 irradiate ultraviolet-ray to the sheet-shaped member 220.

Then, in step S406, it is judged whether the heating time of the heating ring 111 for heating the sheet member 220 reaches the set time. When the heating time of the heating ring 111 for heating the sheet member 220 does not reach the set time, the process of step S406 is repeated. In addition, when the heating time of the heating ring 111 for heating the sheet member 220 reaches the set time, the process proceeds to step S407.

Then, in step S407 , the heating ring 111 is stopped from heating the sheet member 220 .

Then, in step S408 , the clamping portion 63 is raised at a low speed by the Z-direction moving mechanism 61 .

Then, in step S409, it is determined whether the clamping portion 63 has risen to the expanding start position. When the clamping portion 63 has not risen to the expansion start position, the process of step S409 is repeated. In addition, when the clamping portion 63 has risen to the expansion start position, the process proceeds to step S410.

Furthermore, in the processing of steps S406 to S409, an example in which the operation of heating the sheet member 220 by the heating ring 111 and the operation of raising the clamping part 63 by the Z-direction moving mechanism 61 is performed once is shown. However, the constitution of thermal shrinkage is not limited to this. For example, the operation of heating the sheet-shaped member 220 by the heating ring 111 and the operation of raising the clamping portion 63 by the Z-direction moving mechanism 61 may be performed in plural times. That is, while repeating the operation of heating the sheet member 220 by the heating ring 111 and the operation of raising the clamping part 63 by the Z-direction moving mechanism 61, the clamping part 63 may be raised to the expansion start position.

Then, in step S410 , the air intake ring 112 is stopped, and the ultraviolet irradiation unit 11 is stopped from irradiating the sheet member 220 with ultraviolet rays.

Then, in step S411 , the heating ring 111 and the suction ring 112 are raised by the Z-direction moving mechanism 110 .

Then, in step S412, the expansion maintaining ring 113 is raised by the power cylinder.

Then, in step S413 , the ultraviolet irradiation unit 11 is lowered by the power cylinder 121 . Then, the heat shrinking treatment is ended. Then, the extension part 6 (the Z-direction movement mechanism 61 , the clamping part 63 , and the extension ring 64 ) is moved from the second position P2 to the first position P1 by the Y-direction movement mechanism 62 . Then, the expanded and heat-shrunk wafer ring structure 200 is transferred from the expanded part 6 at the first position P1 to the lifting hand 32 by the suction hand 43 .

(containment and processing) Referring to FIG. 21 , storage processing in the expansion device 100 will be described. The storage process is the process performed in step S8 of the above-mentioned semiconductor wafer manufacturing process.

As shown in FIG. 21 , in step S501 , it is judged whether the lifting hand 32 of the lifting hand 3 is free. When the lifting hand 32 is not free, the containment process ends. Also, when the lifting hand 32 is free, go to step S502.

Then, in step S502 , it is judged whether there is a lifting hand 32 in the wafer cassette 22 of the cassette unit 2 . When there is no lifting hand 32 in the wafer cassette 22, go to step S504. Also, when there is a lifting hand 32 in the wafer cassette 22, the process proceeds to step S503.

Then, in step S503 , the lifting hand 32 is moved from the inside of the wafer cassette 22 to the outside of the wafer cassette 22 along the Y2 direction by the Y-direction moving mechanism 31 .

Then, in step S504 , the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 , so that the wafer ring structure 200 on the lifting handle 32 as the accommodation object can be accommodated in the wafer cassette 22 . Specifically, in step S504, the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 so that the wafer cassette 22 on the lifting handle 32 is placed under the ring-shaped member 230 of the wafer ring structure 200 to be accommodated. The surface is located at the height of the upper surface of a pair of loading parts 23 in the wafer cassette 22 which is slightly off to the Z1 direction side.

Then, in step S505, the lifting hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31, so that the lower surface of the annular member 230 of the wafer ring structure 200 on the lifting hand 32 is positioned at the wafer ring structure 200. The storage position in the round box 22 (directly above the pair of loading parts 23).

Then, in step S506 , the wafer ring structure 200 on the lifting hand 32 as the storage object is delivered to a pair of loading parts 23 in the wafer cassette 22 . Specifically, in step S506, the wafer cassette 22 is moved in the Z1 direction by the Z-direction moving mechanism 21, so that the upper surface of the lifting hand 32 is slightly lower than the upper surface of the pair of loading parts 23. Location.

Then, in step S508, in a state where the lower surface of the annular member 230 of the wafer ring structure 200 to be accommodated is supported by the upper surface of the pair of mounting parts 23, the Y-direction moving mechanism 31 lifts the The hand 32 moves in the Y2 direction. Thereby, the lifting hand 32 is taken out in the state in which the wafer ring structure 200 to be accommodated is accommodated in the wafer cassette 22 . Then, the containment process ends.

(Effect of this embodiment) In this embodiment, the following effects can be obtained.

In this embodiment, as described above, the following member is provided: the expansion part 6, which expands the sheet-shaped member 220 having the stretchability and heat shrinkability on which the wafer 210 and the ring-shaped member 230 are attached at the first position P1. Y-direction moving mechanism 62, which, in the state where the sheet member 220 has been expanded by the expansion part 6, moves the expansion part 6 along the horizontal direction to the second position separated from the first position P1 in the horizontal direction in plan view. position P2; and the heat shrinking part 10, which heats the slack part of the part 220b of the sheet member 220 around the wafer 210 at the second position P2 to make it shrink. Thereby, the expansion of the sheet-shaped member 220 can be performed at the first position P1, and the thermal contraction of the sheet-shaped member 220 can be performed at the second position P2 separated from the first position P1 in the horizontal direction, so that the sheet-shaped member 220 can be formed at different positions. Expansion of the member 220 and thermal contraction of the sheet member 220 . As a result, even when the sheet member 220 is expanded and thermally shrunk, a space for arranging the heat shrinkable structure of the sheet member 220 can be easily secured at the second position P2. In addition, since a structure required for achieving high quality can be easily arranged at the second position P2, thermal shrinkage of the sheet-shaped member 220 of higher quality can be easily achieved.

In addition, by expanding the sheet member 220 and thermally shrinking the sheet member 220 at different positions, the cooling structure for cooling the sheet member 220 when the expansion exists, and the removal structure for removing the spatter generated during the expansion, etc. In some cases, a space for arranging a cooling structure, a removal structure, and the like can also be secured at the first position P1. Thereby, when there are cooling structures, removal structures, etc., cooling structures, removal structures, etc. required for achieving high quality can be arranged at the first position P1, and thus expansion of higher-quality sheet-shaped member 220 can be achieved.

Moreover, in this embodiment, as mentioned above, the heat contraction part 10 is arrange|positioned at the 2nd position P2 above the expansion part 6 moved by the Y direction movement mechanism 62. As shown in FIG. Thereby, at the second position P2, the heat-shrinkable part 10 can be disposed above the expansion part 6 where a space can be relatively easily secured. As a result, the structure required to achieve high quality can be more easily arranged at the second position P2, and thus heat shrinkage of the high-quality sheet-shaped member 220 can be more easily achieved.

Also, in the present embodiment, as described above, the heat-shrinkable part 10 can move in the vertical direction between the upper position of the unheated sheet member 220 and the lower position of the heated sheet member 220 at the second position P2. constituted in a manner. In this way, by moving the heat-shrinkable part 10 to the upper position, the heat-shrinkable part 10 can be retracted so as not to interfere with the movement of the expansion part 6, so that the movement of the expansion part 6 can be easily performed. Moreover, by moving the heat-shrinkable part 10 to the downward position, after moving the expansion part 6 to the 2nd position P2, heat-shrinking of the sheet-shaped member 220 can be performed easily.

In addition, in this embodiment, as described above, the expanding device 100 includes the debris cleaner 9, and the debris cleaner 9 is arranged at the first position P1. Spatters from the wafer ring structure 200 are removed from the component 220 . Thereby, since the spatter can be sucked and removed, it is possible to suppress occurrence of a quality defect due to the spatter being scattered onto the wafer 210 . In addition, unlike the case of removing the scattered matter by blowing it in the expansion device 100, the remaining of the scattered matter in the expansion device 100 can be suppressed, so it is possible to prevent the scattered matter remaining in the expansion device 100 from flying again and causing scattering. The particles are scattered onto the wafer 210 to cause a quality defect. Also, as described above, since the expansion of the sheet member 220 and the thermal contraction of the sheet member 220 are performed at different positions, it is possible to secure a space for disposing the debris cleaner 9 as a removal structure at the time of expansion.

Also, in this embodiment, as described above, the debris cleaner 9 includes an annular ring member 91 and an annular suction port 92. The outer edges of the wafer 210 face each other. Thereby, the suction port 92 of the debris cleaner 9 is provided so as to face the outer edge of the wafer 210 where the spatter is likely to be generated, and thus the spatter can be efficiently sucked by the debris cleaner 9 .

In addition, in the present embodiment, as described above, the annular suction port 92 is constituted by a plurality of suction ports 92 arranged in a ring at predetermined intervals. Thereby, compared with the case where the ring-shaped suction port 92 is constituted by a single suction port 92, the respective suction force of each suction port 92 can be increased, so that the debris cleaner 9 can more effectively suck Suction flying debris.

In addition, in the present embodiment, as described above, the debris cleaner 9 is configured to be movable in the vertical direction between a lower position where the spatter is sucked and an upper position where the spatter is not sucked. In this way, by moving the debris cleaner 9 to the upper position, the debris cleaner 9 can be retracted so as not to interfere with the movement of the expansion part 6, so that the movement of the expansion part 6 can be easily performed. Moreover, by moving the debris cleaner 9 to the downward position, when the sheet member 220 is expanded, it is possible to easily perform suction of the scattered matter.

In addition, in this embodiment, as described above, the expansion device 100 includes the cold air supply unit 7 and the cooling unit 8, which are arranged at the first position P1, and when the sheet member 220 is expanded by the expansion unit 6, the sheet member 220 is cooled. . Thereby, the sheet-like member 220 can be cooled and hardened during expansion, so it can be suppressed that the sheet-like member 220 is soft, so only the outer peripheral portion of the sheet-like member 220 is extended, and insufficient splitting force is generated on the wafer 210 so that it cannot be split. Wafer 210. Also, although there are cases where the wafer 210 has a soft and thin film layer (Low-K film, DAF, etc.), and because the film layer is soft, even if the silicon portion of the wafer 210 is divided by expansion, there is a film layer that is not divided. However, if the above structure is adopted, the film layer can be cooled and hardened during expansion, so that the phenomenon that the film layer is not divided can be suppressed. Also, as described above, the expansion of the sheet member 220 and the thermal contraction of the sheet member 220 can be performed at different positions, so the space for disposing the cold air supply part 7 and the cooling unit 8 as the cooling structure during expansion can be ensured.

Also, in this embodiment, as described above, the Y-direction moving mechanism 62 does not move the cold air supply part 7 and the cooling unit 8 from the first position P1, but independently of the cold air supply part 7 and the cooling unit 8, so that The extension part 6 is configured to move from the first position P1 to the second position P2 along the horizontal direction. Thereby, compared with the case where the Y-direction moving mechanism 62 is comprised so that the extension part 6 may move together with the cold air supply part 7 and the cooling unit 8, the driving force required for the Y-direction moving mechanism 62 can be reduced. As a result, the Y-direction moving mechanism 62 can be downsized.

In addition, in this embodiment, as described above, the expansion apparatus 100 includes: the cassette part 2, which is arranged at a position different from the first position P1 and the second position P2 in plan view, and accommodates a plurality of wafer ring structures 200; The hand part 3 is arranged at a position different from the first position P1 and the second position P2 in plan view, and takes out the wafer ring structure 200 from the cassette part 2 . Moreover, the direction in which the lifting hand 3 takes out the wafer ring structure 200 from the cassette 2 is substantially parallel to the direction in which the Y-direction moving mechanism 62 moves the extension part 6 . Thereby, unlike the case where the direction in which the lifting hand 3 takes out the wafer ring structure 200 from the cassette 2 is substantially perpendicular to the direction in which the Y-direction moving mechanism 62 moves the extension 6, the extension device 100 can be restrained from interfering with the lifting hand 3. The direction in which the wafer ring structure 200 is taken out from the cassette part 2 and the direction in which the extension part 6 is moved by the Y-direction moving mechanism 62 are enlarged in a direction substantially perpendicular to each other.

[variation example] In addition, regarding the embodiment disclosed this time, it should be considered that it is an illustration and restrictive at no point. The scope of the present invention is shown not by the description of the above-mentioned embodiments but by the claims, and all changes (modifications) within the meaning and scope equivalent to the claims are included.

For example, in the above-mentioned embodiment, the example in which the thermal contraction part is arranged at the second position above the expansion part was shown, but the present invention is not limited thereto. In the present invention, the heat-shrinkable portion may also be disposed below the expansion portion at the second position.

In addition, in the above-mentioned embodiment, the example in which the heat-shrinkable part has the heater ring was shown, but this invention is not limited to this. In the present invention, as long as the sheet-shaped member can be heated, the heat-shrinkable portion may have a heating portion other than the heating ring.

In addition, in the above-mentioned embodiment, an example was shown in which the heat-shrinkable part has the suction ring and the expansion maintenance ring, but the present invention is not limited thereto. In the present invention, the heat-shrinkable part may not have the air suction ring and the expansion maintenance ring.

In addition, in the above-mentioned embodiment, the example in which the extension device is provided with the debris cleaner (suction unit) was shown, but the present invention is not limited thereto. In the present invention, the expansion device may not have a suction unit.

In addition, in the above-mentioned embodiment, the example in which the debris cleaner (suction unit) has the ring-shaped suction port facing the outer edge of the wafer was shown, but the present invention is not limited thereto. In the present invention, the shape of the suction port of the suction unit may be any shape as long as it can suck the flying matter.

In addition, in the above-mentioned embodiment, the example in which the annular suction port is constituted by a plurality of suction ports was shown, but the present invention is not limited thereto. In the present invention, the annular suction port can also be composed of a single suction port.

In addition, in the above-mentioned embodiment, the example in which the expansion device is provided with the cold air supply part and the cooling means (cooling part) was shown, but this invention is not limited to this. In the present invention, the expansion device may include only any one of the cold air supply unit and the cooling unit as the cooling unit. In addition, the extension device does not need to include a cooling unit.

In addition, in the above-mentioned embodiment, the example in which the direction in which the lifting hand (extracting part) takes out the wafer ring structure from the cassette part (accommodating part) is substantially parallel to the direction in which the Y-direction moving mechanism (moving mechanism) moves the extension part is shown. , but the present invention is not limited thereto. In the present invention, the direction in which the take-out part takes out the wafer ring structure from the storage part may also intersect with the direction in which the moving mechanism moves the extension part.

In addition, in the above-mentioned embodiment, for convenience of explanation, an example was shown in which control processing was described using a flow-driven flowchart in which processing is performed sequentially according to the processing flow, but the present invention is not limited thereto. In the present invention, control processing can also be performed by event-driven processing that executes processing in units of events. In this case, a complete event-driven method may be used for processing, or a combination of event-driven and process-driven processing may be used.

1: Bottom plate 2: box part 3: Raise the hands 4: Absorb hands 5: base 6: Expansion 7: Air-conditioning supply department 8: cooling unit 9: Debris Cleaner 10: heat shrinking part 11: Ultraviolet irradiation department 12: 1st Control Department 13:Second control department 14: 3rd Control Division 15: 4th Control Department 16: 5th Control Department 17: Extended Control Computing Department 18:Operation control computing department 19: Memory Department 21:Z direction moving mechanism 21a: Motor 22:Wafer box 23: A pair of loading parts 31:Y direction moving mechanism 31a: motor 32: Lifting hands 41: X direction moving mechanism 41a: motor 42:Z direction moving mechanism 42a: motor 43: Adsorption hand 61:Z direction moving mechanism 61a: Motor 62:Y direction moving mechanism 62a: Motor 62b: loading part 62ba: hole 62c: track department 63: clamping part 63a: Lower holding part 63b: Upper holding part 63ba: Sliding moving body 64: Extended ring 71: Nozzle 71a: Cooling air supply port 81: Cooling components 81a: cooling body 81b: Peltier element 82: power cylinder 91: ring member 92: suction port 100: Expansion device 110:Z direction moving mechanism 110a: motor 111: heating ring 112: suction ring 112a: suction port 113: Expansion maintenance ring 121: power cylinder 200: wafer ring structure 210: Wafer 210a: the outer edge of the wafer 220: sheet component 220a: the upper surface of the sheet member 220b: The part around the wafer of the sheet-like component 230: ring member 230a: the outer side of the ring member 240: Gap 250: Gap P1: the first position P2: second position

Fig. 1 is a top view of an expansion device of an embodiment. Fig. 2 is a side view of an expansion device of an embodiment. Fig. 3 is a top view of the wafer ring structure of the expansion device of an embodiment. Fig. 4 is a sectional view along line 101-101 of Fig. 3 . Fig. 5 is a bottom view of the debris cleaner of the expansion device of an embodiment. Fig. 6 is a bottom view of the heat shrinkable part of the expansion device in one embodiment. Fig. 7 is a block diagram showing the configuration of the control class of the expansion device according to one embodiment. FIG. 8 is a flow chart showing the semiconductor wafer manufacturing process of the expansion device according to one embodiment. Fig. 9 is a side view showing the state before the wafer holding ring structure of the expansion device according to one embodiment. FIG. 10 is a side view showing the state of the wafer ring structure of the expansion device according to one embodiment. Fig. 11 is a side view showing a state of an expanding sheet-shaped member of an expanding device according to an embodiment. 12 is a side view showing a wafer ring structure, a debris cleaner, and an expansion ring of an expansion device according to an embodiment. Fig. 13 is a side view showing a state before heat-shrinking a sheet-like member in an expanding device according to an embodiment. Fig. 14 is a side view showing a state in which a sheet-shaped member is thermally shrunk in an expanding device according to an embodiment. Fig. 15 is a flow chart showing extraction processing of an expansion device according to an embodiment. Fig. 16 is a flow chart showing the migration process of the extension device according to one embodiment. Fig. 17 is a flowchart showing the expansion processing of the expansion device according to one embodiment. FIG. 18 is a flowchart of steps subsequent to the flowchart of FIG. 17 . Fig. 19 is a flow chart showing the heat shrinking process of the expansion device according to one embodiment. FIG. 20 is a flow chart of steps subsequent to the flow chart of FIG. 19 . Fig. 21 is a flow chart showing storage processing of an extension device according to one embodiment.

1: Bottom plate

2: box part

3: Raise the hands

4: Absorb hands

5: base

6: Expansion

9: Debris Cleaner

10: heat shrinking part

11: Ultraviolet irradiation department

21:Z direction moving mechanism

21a: Motor

31:Y direction moving mechanism

31a: motor

32: Lifting hands

41: X direction moving mechanism

41a: motor

42:Z direction moving mechanism

42a: motor

43: Adsorption hand

61:Z direction moving mechanism

61a: Motor

62:Y direction moving mechanism

63: clamping part

63b: Upper holding part

100: Expansion device

110:Z direction moving mechanism

110a: motor

111: heating ring

112: suction ring

113: Expansion maintenance ring

200: wafer ring structure

210: Wafer

220: sheet component

230: ring member

P1: the first position

P2: second position

Claims (10)

An expansion device, which includes: an expansion part, which, at a first position, includes a wafer, a ring member surrounding the wafer, and a stretchable heat-shrinkable device on which the wafer and the ring member are attached. The above-mentioned sheet-shaped member of the wafer ring structure of the sheet-shaped member is expanded; the moving mechanism, in the state where the above-mentioned sheet-shaped member has been expanded by the above-mentioned expanded part, makes the above-mentioned expanded part along and is provided with the above-mentioned wafer ring. The bottom plate of the box part of the structure moves from the above-mentioned first position in the horizontal direction parallel to the above-mentioned first position to the second position separated from the above-mentioned first position in the above-mentioned horizontal direction in a plan view; The slack portion of the sheet-like member surrounding the wafer generated by the expansion of the expansion portion is heated and shrunk. The expansion device according to claim 1, wherein the heat-shrinkable part is disposed at the second position above the expansion part after being moved by the moving mechanism. The expansion device according to claim 2, wherein the heat-shrinkable part is in the manner of being able to move along the vertical direction between an upper position where the aforementioned sheet-like member is not heated and a lower position where the aforementioned sheet-like member is heated at the aforementioned second position constitute. The expansion device according to any one of claims 1 to 3, further comprising a suction part, the suction part is arranged at the first position, and the sheet-like member is expanded by the expansion part At this time, the flying matter generated from the above-mentioned wafer ring structure due to the expansion of the above-mentioned sheet-shaped member is sucked and removed. As the expansion device of claim 4, wherein the above-mentioned suction part includes a ring-shaped suction part body and a ring-shaped suction port, the above-mentioned suction port is arranged on the above-mentioned suction part body, and when the above-mentioned flying objects are sucked, it will be in contact with the above-mentioned crystal The outer edges of the circle face each other. The expansion device according to claim 5, wherein the above-mentioned circular suction port is composed of a plurality of suction ports arranged in a ring at specific intervals. The extended device according to claim 4, wherein the suction part is configured to be movable along the vertical direction between a lower position for sucking the scattered matter and an upper position for not sucking the scattered matter. The expanding device according to any one of claims 1 to 3, further comprising a cooling unit, the cooling unit being disposed at the first position, and cooling the sheet-like member when expanding the sheet-like member by the expanding unit. The expansion device according to claim 8, wherein the moving mechanism does not move the cooling part from the first position, but independently of the cooling part, moves the expansion part along the horizontal direction from the first position The way to the above-mentioned second position constitutes. The expansion device according to any one of claims 1 to 3, further comprising: the above-mentioned box part, which is arranged in a position different from the above-mentioned first position and the above-mentioned second position in a plan view, and accommodates a plurality of the above-mentioned wafer ring structures; and a take-out part, which is disposed in a position different from the first position and the second position in plan view, and takes out the wafer ring structure from the storage part; and the take-out part takes out the wafer ring structure from the storage part in a direction It is substantially parallel to the direction in which the moving mechanism moves the expanding portion.

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