TWI785663B - Sensing module and manufacturing method thereof - Google Patents

Abstract

The invention relates to a sensing module and a manufacturing method thereof, which firstly provides a transparent substrate, and then a sensor. a glue, an optical cover body disposed on a first surface of the transparent substrate. The glue is surrounded the encrypted chip and is connected with the transparent substrate and the optical cover. Finally, a light source illuminates the glue through a second surface of the transparent substrate to cure the glue for obtaining the sensing module.

Description

Structure of sensing module and manufacturing method thereof

The present invention relates to a semiconductor element and its manufacturing method, especially a structure of a sensing module and its manufacturing method.

Nowadays, the Internet of Things technology is rising, and in the Internet of Things technology, the most important development technology core is environmental sensing. The sensors used are nothing more than environmental sensors, electrical sensors, magnetic sensors or Light sensor, the sensor is in the Internet of Things technology, which captures external information for the entire Internet of Things system, and even all environmental information must be sensed, collected, and measured by the sensor, so the sensor is also With the continuous development of semiconductor technology, among many sensors, the light sensor is a very important sensing element, which is often used in the Internet of Things related control systems such as environmental monitoring systems, smart houses, and smart buildings. Sensing the illuminance of light in the surrounding environment, and combining the sensed illuminance with the calculation of communication, Internet of Things, and huge amounts of data in the cloud to provide more convenient services in life. It further combines sensor technology in technology, physics, medical treatment, etc., making human life more convenient and safer

Not only for applications in daily life, but also for applications in portable electronic devices such as smartphones or tablets, there is also research and development of ambient light sensors. The ambient light sensor in the electronic device senses the ambient brightness of the electronic device itself, and at the same time adjusts the display brightness of the electronic device. Sensing and adjusting the color tone of the user interface of the electronic device.

In recent years, the technology of wearable devices such as bracelets, smart watches, or earphones has emerged, so it is necessary to develop a corresponding embedded sensor. detector.

Furthermore, for the sake of miniaturization, generally, the sensor is a semiconductor element made by using a semiconductor process, such as a field effect transistor (FET). Further use of organic polymer materials to make organic polymer components is the mainstream of the development of semiconductor components today, and the semiconductor process technology applied to sensors is gradually developing towards organic polymer materials. However, the sense of semiconductor materials made The detection element is easily affected by foreign impurities and ambient water and oxygen, which makes it difficult to improve the sensing sensitivity, especially the light sensor made of organic polymer materials is greatly affected by foreign impurities and ambient water and oxygen.

Based on the above problems, the present invention provides a structure of a sensing module and its manufacturing method, which can simplify the manufacturing process and form a sealed cavity to isolate the environment and reduce the impact of environmental foreign impurities and environmental water and oxygen, and improve the sensor. the accuracy.

One object of the present invention is to provide a structure of a sensing module and its manufacturing method, which utilizes a first surface of the substrate to arrange components, and utilizes a second surface of the substrate to irradiate a light source so that the light from the light source can penetrate The substrate is irradiated on the colloid of the bonding element, or the light from the light source excites an optical conversion layer of the substrate to emit another light to irradiate the colloid, so as to simplify the manufacturing process and form a closed cavity, which isolates the environment and reduces the external environment The impact of impurities and ambient water and oxygen.

The invention discloses a manufacturing method of a sensing module, which provides a substrate for disposing or forming a sensor on a first surface of the substrate, and then disposing at least one glue on the first surface and surrounding it. Next to the sensor, an optical conversion element is arranged on the first surface and the substrate is bonded through the colloid from its lower edge, and finally the colloid is irradiated by a light source through the second surface of the substrate, so that the colloid curing to make a sensing module. In this way, the colloid curing method is simplified, and the colloid is irradiated in a more comprehensive manner, so that the colloid is cured more completely.

The present invention provides an embodiment, wherein the light source is a photocurable light source, and the at least one colloid is a photocurable resin.

The present invention provides an embodiment, wherein the main material of the substrate is selected from acrylic, glass, sapphire, silicon or a combination thereof, and the material of the optical conversion element is selected from silicon, germanium, zinc sulfide or a combination thereof.

The present invention provides an embodiment, which further arranges an optical lens on the optical conversion element to concentrate the incident light of the sensing module to the sensor.

The present invention provides an embodiment in the step of arranging or forming a sensor on a first surface of the substrate, the sensor being electrically connected to a printed circuit on the substrate.

The present invention also discloses a structure of a sensing module, which includes a substrate, a sensor, at least one colloid and an optical conversion element, wherein the substrate has a printed circuit, and the sensor is disposed on the substrate On a first surface, and electrically connected to the printed circuit, the at least one colloid is arranged on the first surface of the substrate and surrounds the sensor, the optical conversion element is arranged on the first surface of the substrate and The lower edge is bonded with the at least one colloid, so that there is a closed cavity between the optical conversion element and the sensor.

The present invention provides another embodiment, which is that the at least one colloid is a photocurable resin and cured by an ultraviolet light, the material of the substrate is selected from acrylic, glass, sapphire, silicon or a combination thereof, the optical conversion element The material is selected from silicon, germanium, zinc sulfide or a combination thereof.

The present invention provides another embodiment, which further includes an optical lens disposed on a first surface of the optical conversion element to guide the incident light and concentrate it to the sensor.

The present invention provides another embodiment, in which the optical lens is a Fresnel lens.

In order to enable your review committee members to have a further understanding and understanding of the characteristics of the present invention and the achieved effects, the following examples and accompanying descriptions are hereby provided:

Some terms are used in the specification and claims to refer to specific components. However, those with ordinary knowledge in the technical field of the present invention should understand that manufacturers may use different terms to refer to the same component. Moreover, this specification and The claim item does not use the difference in name as the way to distinguish the components, but the difference in the overall technology of the components as the criterion for distinguishing. "Includes" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to". Furthermore, the term "coupled" herein includes any direct and indirect means of connection. Therefore, if it is described that a first device is coupled to a second device, it means that the first device may be directly connected to the second device, or may be indirectly connected to the second device through other devices or other connection means.

In view of the fact that the structure of the conventional sensing module and its manufacturing method are easily affected by foreign impurities and ambient water and oxygen, the accuracy of sensing is not easy to improve. Accordingly, the present invention proposes a sensing module The structure of the group and its manufacturing method are used to solve the problem of poor sensing accuracy caused by conventional technologies.

In the following, the structure of the sensor module disclosed in the present invention and the characteristics included in its manufacturing method, and the matching process structure will be further described:

First, please refer to the first figure, which is a flowchart of an embodiment of the present invention. As shown in the figure, the manufacturing method of the sensing module of the present invention

Step S10: providing a substrate;

Step S20: disposing or forming sensors on the first surface of the substrate;

Step S30: disposing colloid on the first surface of the substrate and surrounding the sensor;

Step S40: disposing the optical conversion element on the substrate and bonding the glue with the lower edge of the optical conversion element, so that there is a closed cavity between the optical conversion element and the sensor; and

Step S50: using a light source to irradiate the second surface of the substrate to irradiate and cure the colloid.

For a clearer understanding of the manufacturing method of the sensing module according to the above-mentioned embodiments of the present invention, further refer to FIG. 2 to FIG. 6 , which are schematic diagrams of some steps of an embodiment of the present invention. As shown in the figure, the sensing module 10 of the present invention includes a substrate 12 , a sensor 14 , at least one glue 16 and an optical element 18 . Wherein the optical element 18 includes an optical conversion element 182 . The sensor 14, the at least one colloid 16, and the optical element 18 are all disposed on a first surface 122 of the substrate 12, especially in this embodiment, the substrate 12 is further provided with at least one conductive film 1222 , to be electrically connected to the sensor 14, and further used to be connected to an external circuit.

In step S10, please also refer to the second figure, the material of the substrate 12 is selected from acrylic, glass, sapphire, silicon or a combination thereof, through a sputtering process (sputter) or a vacuum evaporation process (vacuum evaporation) ) to form the conductive thin film 1222 on one of the first surfaces 122 of the substrate 12, thus step S10 of this embodiment provides a conductive substrate. In step S20, please also refer to the third figure, the sensor 14 is arranged on the first surface 122 of the substrate 12, and the sensor 14 is further arranged on the conductive film 1222, so that the sensor The sensor 14 is electrically connected to the conductive film 1222. The sensor 14 of the present invention can be a light sensor for human body sensing or Internet of Things (IOT) applications, a vibration sensor for sensing objects, or a magnetic sensor In this embodiment, a finished sensor is disposed on the substrate 12 as an example. In addition, another embodiment can be formed by forming the sensor 14 through a semiconductor process or a micro-electromechanical process. on the first surface 122 of the substrate 12 . In step S30 , please also refer to FIG. 4 , disposing the at least one colloid 16 on the first surface 122 of the substrate 12 , especially disposing the at least one colloid 16 on a part of the first surface 122 .

Continuing from the above, the at least one colloid 16 is a photocurable resin, and its main components can be divided into two categories: free radical compound type and cationic compound type. The main component of free radical compound type photocurable resin is selected from acrylic acid, unsaturated polyester or In combination, the main component of the cationic photocurable resin is selected from epoxy, oxetane, vinyl ether or a combination thereof. The composition formula of general photocurable resin can be divided into three parts. The first part is oligomer (Oligomer), which accounts for about 50% to 80% of the composition. The properties of general oligomer are low viscosity and low viscosity. Odorless, excellent curability and low toxicity; the second part is photoreactive monomer (Reactive Monomer), accounting for about 20% to 50% of the total, and the required properties are (1) photoreactive (2 ) good hardening rate (3) good solvent power (4) low volatility; the third part is the photoinitiator (Photoinitiator), accounting for about 1% to 10% of the total, the nature of the photoinitiator In order to attract light radiation energy and induce polymerization, (2) good thermal stability; other additives and even a small amount of solvent can be added to meet the performance requirements, among which the oligomer is the preferred In addition to the above-mentioned free radical compound photocurable resin or cationic compound photocurable resin, it can be selected from acrylate or methacrylate, wherein the methacrylate includes benzyl acrylate, 2-acrylic acid Phenoxyethyl acrylate, nonylphenoxypolyethylene glycol acrylate, ethoxylated bisphenol A diacrylate, methacrylic acid-2 -Phenoxyethyl methacrylate, ethoxylated bisphenol A dimethacrylate, benzyl methacrylate, 1-phenylethyl methacrylate (1 -phenylethyl methacrylate), 2-phenoxyethyl methacrylate (2-phenoxyethyl methacrylate), 2-phenylethyl methacrylate (2-phenylethyl methacrylate), 3-phenylpropyl methacrylate (3- phenylpropyl methacrylate), 3-phenylpropyl acrylate and 2-phenoxyethyl acrylate, and combinations thereof. Referring again to the fourth figure, the at least one colloid 16 surrounds the sensor 14 and further crosses the conductive film 1222

In step S40, please also refer to the fifth figure, the optical conversion element 182 is disposed on the first surface 122 of the substrate 12, and the lower edge 1822 of the optical conversion element 182 is bonded to the at least one glue 16 Substrate 12, wherein the material of the optical conversion element is selected from silicon, germanium, zinc sulfide or a combination thereof, especially a closed cavity 1824 is formed between the optical conversion element 182 and the substrate 12, and the closed cavity 1824 can be It is an air layer or a vacuum layer.

In step S50, please also refer to the sixth figure, the light source 20 is used to emit a plurality of first light rays 22 and irradiate to a second surface 124 of the substrate 12. Since the substrate 12 of this embodiment is transparent, Therefore, the light 22 is allowed to penetrate the substrate 12 to irradiate the at least one colloid 16. Due to the photocuring properties of the colloid 16, it is cured by the irradiation of the first light 22, and the cured colloid 16 is formed. , to form the sensing module 10, the light source 20 of the present invention is a photocuring light source, and this embodiment is an example of an ultraviolet light source, so the first light rays 22 correspond to ultraviolet light, and this embodiment The example photocurable resin is the corresponding UV photocurable resin, so-called UV glue. From the above steps S10 to S50, the process efficiency of the sensor manufacturing process can be improved and the reliability of the sensor itself can be improved. In particular, the lower edge 1822 of the optical conversion element 182 is bonded to the substrate 12 through the at least one glue 16, To further protect the sensor 14, that is, after the colloid 16 is cured, it can pass through the airtight cavity 1824 to isolate the environment and reduce the impact of external impurities and water and oxygen in the environment.

As shown in Figure 7, it is a schematic diagram of the steps of another embodiment of the present invention. As shown in the figure, the substrate 12 of the present invention can be further provided with a light conversion layer 121, which can convert these first light rays 22 into second light rays 23, so as to further irradiate the colloid 16 through these second light rays 23 Correspondingly speaking, the colloid 16 is corresponding to the wavelength of the second light rays 23 for photocuring, and then after the colloid 16 is cured, it can pass through the airtight cavity 1824 to isolate the environment and reduce the external environment. The impact of impurities and environmental water and oxygen, wherein the wavelength of the second light rays 23 in this embodiment is greater than the wavelength of the first light rays 22, so in this embodiment, the wavelength range corresponding to the colloid 16 is from visible light to infrared light the wavelength range.

As shown in the eighth figure, it is a structural schematic view of another embodiment of the present invention, wherein the difference between the eighth figure and the fifth figure is that the optical element 18 of the eighth figure is further provided with a second optical lens 184, wherein the first The material of the second optical lens 184 can also be silicon, germanium, zinc sulfide or a combination thereof. The second optical lens 184 of the present embodiment is arranged on an upper surface 1826 of the optical conversion element 182, through which the second optical lens 184 Concentrating and refracting a plurality of external incident light 30 to concentrate the incident light 30 to the sensor 14, especially the sealing between the optical conversion element 182 and the substrate 12 of the present invention is formed by the colloid 16 The cavity 1824 is more conducive to the conduction of the incident light 30 in the optical conversion element 182 , especially when the sealed cavity 1824 is a vacuum layer, the detection sensitivity of the sensor 14 can be further improved.

As shown in Figure 9, it is a structural schematic diagram of another embodiment of the present invention, wherein the difference between Figure 8 and Figure 9 is that the optical element 18 in Figure 8 is divided into the optical conversion element 182 and the second The optical lens 184, and the ninth figure is integrated into the optical element 18, that is, the optical conversion element 182 and the second optical lens 184 are integrated, thus reducing the interface to avoid total reflection inside the optical element 18 occur. The optical conversion element 182 and the second optical lens 184 of the above-mentioned present invention can be further bonded through another colloid of the same composition as the colloid 16 .

In the above embodiment, by using the optical element 18 or the optical conversion element 182 of the present invention, foreign impurities are isolated from ambient water and oxygen, thereby improving the sensing sensitivity, and the optical conversion element 182 can be used to further filter the incident light 30 The wavelength corresponds to the sensing wavelength range of the sensor 14, and can further concentrate the irradiation range of the incident light 30 on the sensor 14, that is, further functions as a filter and a lens. Infrared (English: Infrared, referred to as IR) is an electromagnetic wave with a wavelength between microwave and visible light. Its wavelength is between 760 nanometers (nm) and 1 millimeter (mm). It is an invisible light with a wavelength longer than red light. The frequencies are approximately in the range of 430 THz to 300 GHz.

However, the sensor 14 of the present invention can be an infrared sensor, which can be applied to 1:near-infrared imaging applications according to the sensing wavelength range, the wavelength range is from 700 nm to 900 nm, and it uses special dyes The emulsion produces a photochemical reaction, which converts the light change in this wavelength range into a chemical change to form an image, or it can be used in 2: near-infrared electronic photosensitive applications, with a wavelength range of 700 nm to 2,000 nm, using silicon-based The compound crystals produced photoelectric reactions to form electronic images. Even for far-infrared electronic photosensitive applications, the wavelength range is 3000 nm to 4000 nm and 8000 nm to 14000 nm, especially the human body infrared sensing is currently applied to 8000 nm to 14000 nm, so the optical conversion element 182 is It further has a wavelength filtering function, thus filtering the wavelength of the incident light 30 into a wavelength within the sensing wavelength range corresponding to the sensor 14, and the sensor 14 can be a matrix photosensor, so the The conductive film 1222 will present a plurality of contacts. The infrared sensor can increase the sensing sensitivity under vacuum, therefore, when the sensor 14 of the present invention is an infrared sensor, and when the airtight cavity 1824 is a vacuum layer, the sensor 14 Sensing sensitivity will be improved.

Therefore, the present invention is novel, progressive and can be used in industry. It should meet the patent application requirements of my country's patent law. I file an invention patent application in accordance with the law. I pray that the bureau will grant the patent as soon as possible. I sincerely pray.

However, the above-mentioned ones are only preferred embodiments of the present invention, and are not used to limit the scope of the present invention. For example, all equal changes and modifications are made according to the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention. , should be included in the patent application scope of the present invention.

10: Sensing module 12: Substrate 121: Light conversion layer 122: first surface 124: second surface 14: Sensor 16: colloid 18: Optical components 182: Optical conversion element 1822: lower edge 1824: Closed cavity 1826: upper surface 184: second optical lens 1222: conductive circuit 20: light source 22: light 30: incident light S10~S50: steps

The first figure: it is a flowchart of an embodiment of the present invention; The second figure A and the second figure B: it is a schematic diagram of some steps of an embodiment of this creation; The third figure A and the third figure B: it is a schematic diagram of some steps of an embodiment of this creation; The fourth figure A and the fourth figure B: it is a schematic diagram of some steps of an embodiment of this creation; The fifth figure A and the fifth figure B: it is a schematic diagram of some steps of an embodiment of this creation; Figure 6: It is a schematic diagram of some steps of an embodiment of the present invention; The seventh figure: it is a schematic diagram of some steps of another embodiment of the present invention; Figure 8: It is a schematic structural view of another embodiment of the present invention; and Figure 9: It is a structural schematic diagram of another embodiment of the present invention.

S10~S50: steps

Claims (16)

A method for manufacturing a sensing module, comprising: providing a substrate; disposing or forming a sensor on a first surface of the substrate; disposing at least one colloid on a part of the first surface, and surrounding the A sensor; an optical conversion element is arranged on the substrate and the at least one colloid is bonded to a lower edge of the optical conversion element, so that there is a closed cavity between the optical conversion element and the sensor; an optical lens is arranged On the optical conversion element, the incident light of the sensing module is concentrated to the sensor; and a light source is used to irradiate a second surface of the substrate, so that a plurality of light rays of the light source penetrate the substrate, to irradiate and cure to the at least one colloid. The manufacturing method of the sensing module according to claim 1, wherein the light source is a photocurable light source, and the at least one colloid is a photocurable resin. The manufacturing method of the sensing module as described in claim 2, wherein the main component of the photocurable resin is acrylic acid, unsaturated polyester or a combination thereof, or selected from epoxy, oxetane, vinyl ether or its combination. The manufacturing method of the sensing module as described in Claim 1, wherein the main material of the substrate is acrylic, glass, sapphire, silicon or a combination thereof, and the material of the optical conversion element is silicon, germanium, zinc sulfide or combination. The manufacturing method of the sensing module as described in Claim 1, wherein in the step of arranging or forming a sensor on the first surface of the substrate, the sensor is further formed by a semiconductor process or a micro-electromechanical process The sensor is on the first surface of the substrate. The manufacturing method of the sensing module according to claim 1, wherein in the step of disposing or forming a sensor on the first surface of the substrate, the sensor is electrically connected to one of the substrates printed circuit. A method of manufacturing a sensing module, comprising: providing a substrate, the substrate has a light conversion layer; disposing or forming a sensor on a first surface of the substrate; disposing at least one colloid on a part of the first surface and surrounding the sensor; arranging an optical conversion element on the substrate and bonding the at least one colloid with a lower edge of the optical conversion element, so that there is a closed cavity between the optical conversion element and the sensor; and using a light source to irradiate the On a second surface of the substrate, the plurality of first light rays from the light source excite the plurality of second light rays from the light conversion layer to irradiate and cure the at least one colloid. The manufacturing method of the sensing module according to claim 7, wherein the light source is a photocurable light source, and the at least one colloid is a photocurable resin. The manufacturing method of the sensing module as described in Claim 8, wherein the main component of the photocurable resin photocurable resin is acrylic acid, unsaturated polyester or a combination thereof, or selected from epoxy, oxetane, Vinyl ether or combinations thereof. The manufacturing method of the sensing module as described in Claim 7, wherein the main material of the substrate is acrylic, glass, sapphire, silicon or a combination thereof, and the material of the optical conversion element is silicon, germanium, zinc sulfide or combination. The manufacturing method of the sensing module as described in Claim 7, wherein in the step of arranging or forming a sensor on the first surface of the substrate, the sensor is further formed by a semiconductor process or a micro-electromechanical process The sensor is on the first surface of the substrate. The manufacturing method of the sensing module as described in Claim 7 further includes: disposing an optical lens on the optical conversion element to concentrate the incident light of the sensing module to the sensor. The manufacturing method of the sensing module as claimed in item 7, wherein in the step of arranging or forming a sensor on the first surface of the substrate, the sensor is electrically connected to one of the substrates printed circuit. A structure of a sensing module, which includes: A substrate has a printed circuit; a sensor is arranged on a first surface of the substrate and is electrically connected to the printed circuit; at least one glue is arranged on a first surface of the substrate and surrounds the sensor detector; an optical conversion element, disposed on a first surface of the substrate and bonded to the at least one colloid with a lower edge, so that there is a closed cavity between the optical conversion element and the sensor; and an optical The lens is arranged on one of the first surfaces of the optical conversion element to guide the incident light and concentrate it to the sensor. The structure of the sensing module as described in claim 14, wherein the at least one colloid is a photocurable resin and is cured by a photocurable light source, and the material of the substrate is selected from acrylic, glass, sapphire, silicon or Combination, the material of the optical conversion element is selected from silicon, germanium, zinc sulfide or a combination thereof. The structure of the sensing module according to claim 14, wherein the optical lens is a Fresnel lens.

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