CN105868737A - Optical fingerprint recognition device and forming method thereof - Google Patents

Optical fingerprint recognition device and forming method thereof Download PDF

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Publication number
CN105868737A
CN105868737A CN201610275912.9A CN201610275912A CN105868737A CN 105868737 A CN105868737 A CN 105868737A CN 201610275912 A CN201610275912 A CN 201610275912A CN 105868737 A CN105868737 A CN 105868737A
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China
Prior art keywords
optical fingerprint
identification device
fingerprint identification
forming method
lens
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CN201610275912.9A
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Chinese (zh)
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CN105868737B (en
Inventor
赵立新
陈俭
夏欢
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Galaxycore Shanghai Ltd Corp
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Galaxycore Shanghai Ltd Corp
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1318Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing

Abstract

The invention provides an optical fingerprint recognition device and a forming method thereof. A lens array is formed through a gradually-changing luminous flux photoetching method so that requirements for manufacturing of a more exquisite and complex lens can be met, optical characters needed by the optical fingerprint recognition device are accurately guaranteed, and the optical fingerprint recognition device and the forming method thereof are suitable for a portable electronic device and are compatible with an existing chip manufacturing and packaging technology so that cost can be reduced.

Description

Optical fingerprint identification device and forming method thereof
Technical field
The present invention relates to image processing field, particularly relate to a kind of optical fingerprint identification device and forming method thereof.
Background technology
Current fingerprinting scheme has optical technology, silicon technology (condenser type/RF-type), ultrasonic technology etc..
Optical technology uses optical image-taking equipment according to the total reflection principle (FTIR) of light.Light shines the glass appearance surface being pressed with fingerprint, and reflection light is gone to obtain by imageing sensor, and the amount of reflection light depends on the degree of depth of fingerprint ridge and the paddy being pressed in glass appearance surface, and the grease between skin and glass and moisture.Light is totally reflected at the interface of glass with air after the central authorities that glass is mapped to paddy, light is reflected to imageing sensor, and the light of directive ridge is not totally reflected, but absorbed by ridge and glass contact face or diffusing reflection is to other central authorities, constitute the image of fingerprint the most on the image sensor.
But, current optical fingerprint identification device volume is relatively big, and light path is longer, it is impossible to be applied to portable electric appts, such as on mobile phone.It is applicable to the fingerprint identification device of the portable electric appts such as mobile phone on the premise of finite volume, for the optical characteristics needed for ensureing, such as resolution ratio, need to use three-dimensional surface the finest, complicated lens, but use traditional micro-processing technology, such as anisotropy or isotropism dry etching, wet etching can only process the surface of limited pattern, layered mask technology newly developed, laser three-D stereolithography, electron beam writes direct the three-dimensional micro-processing technology such as technology, then there is poor accuracy, cost is high, the problem such as yield poorly, the making requirement of this kind of high-precision device cannot be met.
Therefore, how on the premise of finite volume, take more efficiently lens production process to ensure the optical characteristics of optical fingerprint identification device and compatible with existing chip manufacturing and packaging technology, to reduce cost, be to be presently required to solve the technical problem that.
Summary of the invention
It is an object of the invention to provide a kind of optical fingerprint identification device and forming method thereof, meet the finest, complicated lens and make requirement, accurately ensure the optical characteristics needed for optical fingerprint identification device, it is applicable to portable electric appts, and it is compatible, to reduce cost with existing chip manufacturing and packaging technology.
Based on considerations above, one aspect of the present invention provides the forming method of a kind of optical fingerprint identification device, including: lead to light quantity photoetching method by gradual change and form lens arra.
Preferably, the forming method of described optical fingerprint identification device also includes: form black glue-line between adjacent lens.
Preferably, the forming method of described optical fingerprint identification device also includes: form silicon light hurdle between adjacent lens.
Preferably, the forming method of described optical fingerprint identification device also includes: is provided above cover-plate glass in described silicon light hurdle, there is space between described cover-plate glass and described silicon light hurdle.
Another aspect of the present invention provides a kind of optical fingerprint identification device, leads to, including by gradual change, the lens arra that light quantity photoetching method is formed.
Preferably, described optical fingerprint identification device also includes the black glue-line between adjacent lens.
Preferably, described optical fingerprint identification device also includes the silicon light hurdle between adjacent lens.
Preferably, described optical fingerprint identification device also includes being positioned at the cover-plate glass above described silicon light hurdle, there is space between described cover-plate glass and described silicon light hurdle.
Optical fingerprint identification device of the present invention and forming method thereof, lead to light quantity photoetching method by gradual change and form lens arra, the finest, complicated lens can be met and make requirement, accurately ensure the optical characteristics needed for optical fingerprint identification device, it is applicable to portable electric appts, and it is compatible, to reduce cost with existing chip manufacturing and packaging technology.
Accompanying drawing explanation
Reading the following detailed description to non-limiting example by referring to accompanying drawing, the other features, objects and advantages of the present invention will become more apparent upon.
Fig. 1-Figure 10 is the process schematic of the forming method of the optical fingerprint identification device according to the embodiment of the present invention one;
Figure 11-Figure 18 is the process schematic of the forming method of the optical fingerprint identification device according to the embodiment of the present invention two.
In the drawings, running through different diagrams, same or similar reference represents same or analogous device (module) or step.
Detailed description of the invention
For solving above-mentioned the problems of the prior art, the present invention provides a kind of optical fingerprint identification device and forming method thereof, lead to light quantity photoetching method by gradual change and form lens arra, the finest, complicated lens can be met and make requirement, accurately ensure the optical characteristics needed for optical fingerprint identification device, it is applicable to portable electric appts, and compatible, to reduce cost with existing chip manufacturing and packaging technology.
In the specific descriptions of following preferred embodiment, by with reference to constituting the accompanying drawing appended by a present invention part.Appended accompanying drawing has been illustrated by way of example and has been capable of specific embodiment.The embodiment of example is not intended as the limit all embodiments according to the present invention.It is appreciated that without departing from the scope of the present invention, it is possible to use other embodiments, it is also possible to carry out the structural or amendment of logicality.Therefore, following specific descriptions are the most nonrestrictive, and the scope of the present invention is defined by the claims appended hereto.
The present invention provides a kind of optical fingerprint identification device and forming method thereof, including: lead to light quantity photoetching method by gradual change and form lens arra.
Light quantity photoetching technique is led in gradual change, it is also called gray scale photoetching (Gray-tone Lithography) technology, it is modulated into different shapes by grayscale mask machining beams energy density distribution, being exposed photoresist, microdevice is once-forming, it is not necessary to mobile mask or mobile processed wafer, it is heat-treated also without to photoresist, have only to mask plate is carried out the lithographic equipment of certain coding and standard, mutually the most compatible with other IC technique, it is achieved the making of system chip structure.Gray scale photoetching uses grayscale mask modulation homogeneous radiation, single exposure development can form the micro-optical device of arbitrary surfaces, and can guarantee that device surface is smooth, eliminate the alignment error in binary system photoetching process and multistep photoetching, the shortcoming of layered mask, the performance of device is only relevant with exposure dose with quality, unrelated with process, repeatable strong.
Therefore, lead to light quantity photoetching method by gradual change and form lens arra, the finest, complicated lens can be met and make requirement, accurately ensure the optical characteristics needed for optical fingerprint identification device, it is applicable to portable electric appts, and compatible, to reduce cost with existing chip manufacturing and packaging technology.
Below in conjunction with specific embodiment, the present invention is expanded on further.
Embodiment one
Fig. 1-Figure 10 is the process schematic of the forming method of the optical fingerprint identification device according to the embodiment of the present invention one.
As shown in Figure 1-Figure 3, it is provided that silicon substrate 110, on silicon substrate 110, groove array 111 is formed.Preferably, on groove array 111, silicon dioxide layer, silicon nitride layer or titanium layer 112 are formed, as the stop-layer of subsequent etching.
As Figure 4-Figure 6, transparent substrates 120, image sensor chip 130 are provided, after bonding transparent substrates 120 and image sensor chip 130, the back side of thinning image sensor chip 130, leading to light quantity photoetching method by gradual change again and form lens arra 150 on transparent substrates 120, this lens arra 150 is corresponding to the photosensitive array (not shown) of image sensor chip 130.Preferably, on lens arra 150, diaphragm 151 is formed after forming the step of lens arra 150, to ensure that lens arra is not damaged by subsequent etch step.
As shown in figs. 7 to 9, the groove surface of silicon substrate 110 is bonded with transparent substrates 120, make groove array 111 corresponding to lens arra 150, thinning and etch the non-recessed face of silicon substrate 110, stop at stop-layer 112, thus between adjacent lens, form silicon light hurdle 113.Silicon material is used to make light hurdle, it is ensured that the making required precision on light hurdle, including height, opening size, the precision etc. of contraposition, to ensure the effect that is in the light on light hurdle.Further preferably, as shown in Figure 6, it is also possible between the adjacent lens of transparent substrates 120, form black glue-line 140, this black glue-line 140 is between silicon light hurdle 113 and the transparent substrates 120 being subsequently formed, as the auxiliary on silicon light hurdle 113, to realize preferably being in the light effect.
As shown in Figure 10, remove the stop-layer 112 in groove array 111 and diaphragm 151(successively for example with dry etching), expose lens arra 150.Preferably, on silicon light hurdle 113, cover-plate glass 160 is set, this cover-plate glass 160 is adhesively fixed in the non-photo-sensing region (not shown) of chip perimeter, and ensure that cover-plate glass 160 exists space in photosensitive region and between silicon light hurdle 113, so that conditioned reflex during light arrival cover-plate glass 160 is unaffected.
Hereafter, existing method for packing, such as CSP(wafer-level package can be passed through), TSV(silicon through hole) etc. technology be packaged, to form the optical fingerprint identification device of the present invention.
Embodiment two
Figure 11-Figure 18 is the process schematic of the forming method of the optical fingerprint identification device according to the embodiment of the present invention two.
As shown in figure 11, it is provided that silicon substrate 210, it is preferable that on silicon substrate 210, form silicon dioxide layer, silicon nitride layer or titanium layer 211, as the stop-layer of subsequent etching.
As shown in Figure 12-Figure 14, transparent substrates 220, image sensor chip 230 are provided, after bonding transparent substrates 220 and image sensor chip 230, the back side of thinning image sensor chip 230, leading to light quantity photoetching method by gradual change again and form lens arra 250 on transparent substrates 220, this lens arra 250 is corresponding to the photosensitive array (not shown) of image sensor chip 230.Preferably, on lens arra 250, diaphragm 251 is formed after forming the step of lens arra 250, to ensure that lens arra is not damaged by subsequent etch step.
As shown in Figure 15-Figure 17, by the stop-layer 211 on silicon substrate 210 towards transparent substrates 220, by printing opacity glue-line 270, silicon substrate 210 is bonded with transparent substrates 220, printing opacity glue-line 270 covers lens arra 250, thinning and etch silicon substrate 210 and form the via-hole array 212 corresponding to lens arra 250, stop at stop-layer 211, thus between adjacent lens, form silicon light hurdle 213.Silicon material is used to make light hurdle, it is ensured that the making required precision on light hurdle, including height, opening size, the precision etc. of contraposition, to ensure the effect that is in the light on light hurdle.Further preferably, as shown in figure 14, it is also possible between the adjacent lens of transparent substrates 220, form black glue-line 240, this black glue-line 240 is between silicon light hurdle 213 and the transparent substrates 220 being subsequently formed, as the auxiliary on silicon light hurdle 213, to realize preferably being in the light effect.
As shown in figure 18, removing the stop-layer 211 in via-hole array 212 successively, printing opacity glue-line 270 and diaphragm 251(are for example with dry etching), expose lens arra 250.Preferably, on silicon light hurdle 213, cover-plate glass 260 is set, this cover-plate glass 260 is adhesively fixed in the non-photo-sensing region (not shown) of chip perimeter, and ensure that cover-plate glass 260 exists space in photosensitive region and between silicon light hurdle 213, so that conditioned reflex during light arrival cover-plate glass 260 is unaffected.
Hereafter, existing method for packing, such as CSP(wafer-level package can be passed through), TSV(silicon through hole) etc. technology be packaged, to form the optical fingerprint identification device of the present invention.
Optical fingerprint identification device of the present invention and forming method thereof, lead to light quantity photoetching method by gradual change and form lens arra, the finest, complicated lens can be met and make requirement, accurately ensure the optical characteristics needed for optical fingerprint identification device, it is applicable to portable electric appts, and it is compatible, to reduce cost with existing chip manufacturing and packaging technology.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and without departing from the spirit or essential characteristics of the present invention, it is possible to realize the present invention in other specific forms.Therefore, in any case from the point of view of, embodiment all should be regarded as exemplary, and be nonrestrictive.Additionally, it will be evident that " an including " word is not excluded for other elements and step, and wording " one " is not excluded for plural number.In device claim, multiple elements of statement can also be realized by an element.The first, the second word such as grade is used for representing title, and is not offered as any specific order.

Claims (8)

1. the forming method of an optical fingerprint identification device, it is characterised in that including: lead to light quantity photoetching method by gradual change and form lens arra.
The forming method of optical fingerprint identification device the most according to claim 1, it is characterised in that also include: form black glue-line between adjacent lens.
The forming method of optical fingerprint identification device the most according to claim 1, it is characterised in that also include: form silicon light hurdle between adjacent lens.
The forming method of optical fingerprint identification device the most according to claim 3, it is characterised in that also include: be provided above cover-plate glass in described silicon light hurdle, there is space between described cover-plate glass and described silicon light hurdle.
5. an optical fingerprint identification device, it is characterised in that include leading to, by gradual change, the lens arra that light quantity photoetching method is formed.
Optical fingerprint identification device the most according to claim 5, it is characterised in that also include the black glue-line between adjacent lens.
Optical fingerprint identification device the most according to claim 5, it is characterised in that also include the silicon light hurdle between adjacent lens.
Optical fingerprint identification device the most according to claim 7, it is characterised in that also include being positioned at the cover-plate glass above described silicon light hurdle, there is space between described cover-plate glass and described silicon light hurdle.
CN201610275912.9A 2016-04-29 2016-04-29 Optical fingerprint identification device and forming method thereof Active CN105868737B (en)

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CN109416736A (en) * 2018-09-21 2019-03-01 深圳市汇顶科技股份有限公司 Optical image acquisition unit, optical image acquisition system and electronic equipment
CN111095278A (en) * 2019-10-24 2020-05-01 深圳市汇顶科技股份有限公司 Fingerprint identification device and electronic equipment

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Publication number Priority date Publication date Assignee Title
CN107748878A (en) * 2017-11-13 2018-03-02 苏州大成电子科技有限公司 A kind of fingerprint identification method
CN109416736A (en) * 2018-09-21 2019-03-01 深圳市汇顶科技股份有限公司 Optical image acquisition unit, optical image acquisition system and electronic equipment
CN111095278A (en) * 2019-10-24 2020-05-01 深圳市汇顶科技股份有限公司 Fingerprint identification device and electronic equipment
CN111095278B (en) * 2019-10-24 2023-09-05 深圳市汇顶科技股份有限公司 Fingerprint identification device and electronic equipment

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