TWI784485B - High accuracy die bonding system, alignment system and method thereof - Google Patents

Abstract

A high accuracy die bonding system comprises: a supply unit providing at least one die; a receiving unit neighbored to the supply unit; a relay unit located between the supply unit and the receiving unit; a suction unit installed above the supply unit, the suction unit placed at least one die on the relay unit; a first bonding unit installed above the receiving unit; and a second bonding unit installed above the receiving unit; wherein, the first bonding unit or the second bonding unit places at least one die located in the relay unit in the receiving unit. An alignment system is disclosed. A high accuracy die bonding method is also disclosed.

Description

High precision die bonding system, alignment system and method thereof

A high-precision die bonding system, alignment system and method thereof, especially a system and method capable of improving cleanliness and die bonding precision.

The existing die bonding technology uses a vacuum suction device to suck at least one die, and then moves the sucked die to a desired bonding position, such as a wafer, a die, and a carrier. The vacuum suction device then bonds the die to the desired bonding position.

However, the vacuum suction device performs a long-distance displacement from the position where the crystal grain is sucked to the position to be bonded. For the die-bonding process that requires cleanliness, the long-distance displacement will generate fine dust due to friction between devices, and the fine dust may damage the cleanliness.

As mentioned above, how to improve the cleanliness, or shorten the moving distance of the vacuum suction device, or change the position of the vacuum suction device, there is room for improvement.

In view of this, the main purpose of the present invention is to propose a high-precision die-bonding system, alignment system and method thereof, which prevent the displacement device of the system from moving above the wafer or die, thereby improving cleanliness Purpose.

To achieve the above object, the present invention provides a high-precision die bonding system, including: a supply unit for setting a die; a receiving unit adjacent to the supply unit; a relay unit arranged between the supply unit and the supply unit Between the receiving units; a suction unit, arranged above the supply unit, the suction unit places the die on the relay unit; and an adhesive An assembly is arranged above the receiving unit; wherein, the bonding assembly places the die located in the relay unit on the receiving unit.

To sum up the above, the high-precision die bonding system and method of the present invention set the displacement device of the system not directly above or below the supply unit or the receiving unit, so when the first relay station or the second relay station moves , the dust that may be generated cannot fall on the supply unit or the receiving unit, so as to improve the cleanliness. As for the vacuum module, since it only moves up and down, there is no lateral displacement or only a slight displacement. As long as the isolation plate is properly isolated, dust can be prevented from falling from above to the receiving unit.

10, 10A, 10B: supply unit

100, 100A: supply table

101, 101A: thimble

11, 11A, 11B: suction unit

110, 110A, 110B: vacuum module

111, 111A, 111B: absorption displacement module

12, 12A, 12B: receiving unit

120: platform

13, 13A, 13B: relay unit

130, 130A, 130B: displacement module

131, 131A, 131B: the first relay station

132, 132B: the second relay station

14, 14A, 14B: the first bonding unit

140, 140A: the first vacuum module

141: The first transparent module

15, 15A, 15B: the second bonding unit

150, 150A: Second vacuum module

151:Second transparent module

154: Isolation board

16, 16A, 16B: the first upper visual unit

17, 17A, 17B: the second upper visual unit

18, 18A, 18B: the third upper visual unit

19, 19A, 19B: lower visual unit

20, 20A, 20B, 30: grain

200, 300: Grain mark

301: transparent area

21, 31: parts to be bonded

210, 310: Adhesive mark

S1~S7: steps

40: Upper Vision Unit

41: Bonding unit

410: Vacuum module

411: Transparent module

42: Undertaking unit

420: platform

43: Lower visual unit

Fig. 1 is a schematic diagram of a high-precision die-bonding system according to the first embodiment of the present invention.

Fig. 2 is a partial schematic diagram of a high-precision die-bonding system according to the first embodiment of the present invention.

FIG. 3 is a schematic flow chart of a high-precision die-bonding method according to the second embodiment of the present invention.

FIG. 4 is a schematic diagram of alignment between an adhesive mark and a die mark.

Fig. 5 is a schematic diagram of a high-precision die-bonding system according to the third embodiment of the present invention.

Fig. 6 is a partial schematic diagram of a high-precision die-bonding system according to the third embodiment of the present invention.

Fig. 7 is a schematic diagram of a high-precision die-bonding system according to the fourth embodiment of the present invention.

Fig. 8 is a partial schematic diagram of a high-precision die-bonding system according to the fourth embodiment of the present invention.

Fig. 9 is an alignment system for high-precision die bonding according to the fifth embodiment of the present invention.

The first embodiment of the present invention is a high-precision die-bonding system. As shown in Figures 1 and 2, the high-precision die-bonding system has a supply unit 10, a suction unit 11, a receiving unit 12, and a relay unit. 13. A bonding assembly, a first upper visual unit 16 , a second upper visual unit 17 , a third upper visual unit 18 and a lower visual unit 19 .

The supply unit 10 has a supply table 100 and at least one ejector pin 101 . The supply table 100 is used for disposing at least one die 20 . The thimble 101 is arranged under the supply table 100, and the thimble 101 can be single or plural. If it is a single ejector pin 101 , the ejector pin 101 ejects a single die 20 disposed on the supply table 100 . If there are a plurality of ejector pins 101 , the ejector pins 101 eject a plurality of dies 20 provided on the supply table 100 . The supply table 100 can perform a lateral movement, a forward and backward movement, or a lateral and forward and backward movement.

The suction unit 11 has at least one vacuum module 110 and one suction displacement module 111 . The vacuum module 110 is disposed on one side of the suction displacement module 111 and above the supply unit 10 . The suction displacement module 111 can perform a horizontal movement, a forward and backward movement or a longitudinal movement.

The receiving unit 12 is adjacent to the supply unit 10 . The receiving unit 12 has a platform 120, and the platform 120 can be transparent or partially transparent to facilitate penetration and capture of images. The platform 120 can perform a lateral movement, a forward and backward movement, or a lateral and forward and backward movement. The supporting platform 120 is provided with a to-be-adhesive part 21 , and the to-be-bonded part 21 is transparent and has an adhesive mark 210 . The object to be bonded 21 is a wafer, a die, or a carrier.

The relay unit 13 is located between the supply unit 10 and the receiving unit 12 . The relay unit has a displacement module 130 , a first relay station 131 and a second relay station 132 . The first relay station 131 and the second relay station 132 are disposed at two opposite ends of the displacement module 130 . In this embodiment, the relay unit 13 is a double-wing design. The displacement module 130 can perform a forward and backward movement, a lateral movement or a rotational movement. The first relay station 131 and the second relay station 132 are arranged in parallel.

The bonding assembly includes a first bonding unit 14 and a second bonding unit 15 . The first bonding unit 14 is located above the receiving unit 12 . The first bonding unit 14 has at least one first A vacuum module 140 . The first vacuum module 140 has a first transparent module 141 . The first transparent module 141 can be a transparent body or a perforation.

The second bonding unit 15 is located above the receiving unit 12 and adjacent to the first bonding unit 14 . The second bonding unit 15 has at least one second vacuum module 150 . The second vacuum module 150 has at least one second transparent module 151 . The second transparent module 151 can be a transparent body or a perforation. The first bonding unit 14 and the second bonding unit 15 of the bonding assembly of the present invention are fixed or do not move in a large stroke, and the isolation plate 154 can be installed, so pollution can be reduced.

The first upper vision unit 16 is disposed above the suction unit 11 and the supply table 100 . If discussed further, the first upper vision unit 16 is located above the vacuum module 110 . The first upper visual unit 16 can have at least one visual module.

The second upper vision unit 17 is disposed above the relay unit 13 . To discuss further, the second upper vision unit 17 is located above the first relay station 131 or the second relay station 132 and adjacent to the supply unit 10 . The second upper visual unit 17 can have at least one visual module.

The third upper visual unit 18 is located above the first bonding unit 14 and the second bonding unit 15 . The third upper vision unit 18 has at least one vision module, and each vision module is located above the second vacuum module 150 or the first vacuum module 140 .

The lower vision unit 19 is located below the receiving unit 12 . If discussed further, the lower visual unit 19 has at least one visual module. The lower vision unit 19 is located below the platform 120 . If the first upper vision unit 16, the second upper vision unit 17, the third upper vision unit 18, and the lower vision unit 19 use infrared sensing cameras, the die and the parts to be bonded do not necessarily have transparent areas, as long as they are made of silicon or It is a material that can penetrate infrared rays, and it can also be used for imaging and alignment.

The second embodiment of the present invention is a high-precision die bonding method, as shown in FIG. 3 .

Step S1, providing at least one die. As shown in FIG. 1 and FIG. 2 , the ejector pin 101 ejects the die 20 to be ejected from the supply table 100 . The first upper vision unit 16 captures the image information of the ejected die 20 and sends the image information to the suction unit 20 . The vacuum module 110 of the suction unit 11 sucks the die 20 according to the image information. The vacuum module 110 sucks at least one die 20 or a plurality of dies 20 .

To discuss further, the supply table 100 of the supply unit 10 performs a forward-backward displacement, a lateral displacement, or a lateral and forward-backward movement, so as to move the die 20 to be sucked to the bottom of the vacuum module 110 .

After the die 20 to be sucked moves below the vacuum module 110, the first upper vision unit 16 captures the image information of the die 20 to be ejected, and the ejector pin 101 ejects the die according to the image information 20.

The first upper vision unit 16 captures the image information of the ejected die 20 and sends the image information to the suction unit 20 . The vacuum module 110 of the suction unit 11 sucks the die 20 according to the image information.

Step S2, transferring at least one die to a relay unit. The suction displacement module 111 moves the vacuum module 110 with the die 20 sucked to the top of the first relay platform 131 of the relay unit 13 .

The second upper vision unit 17 captures the image information of the die 20 and the first relay station 131 of the relay unit 13, and transmits the image information to the suction unit 11, so that the vacuum module 110 places the die 20 on the The first relay station 131.

After the vacuum module 110 places the die 20 on the first relay station 131 , the suction displacement module 111 moves the vacuum module 110 back to the original position to suck the die 20 again.

The displacement module 130 performs a rotation action, so that the first relay platform 131 is rotated to the top of the platform 120 , and the second relay platform 132 is rotated to the top of the supply platform 100 . The displacement module 130 then moves the first relay platform 131 to the bottom of the first bonding unit 14 .

Step S3, aligning the position of at least one die and the receiving unit. The third upper vision unit 18 captures the image information of the die 20 and provides the image information to the first bonding unit 14 so that the first vacuum module 140 absorbs the die 20 located on the first relay station 131 .

After the first vacuum module 140 absorbs the die 20, the support platform 120 adjusts the position of the first vacuum module 120 so that the desired bonding member 21 of the support platform 120 can be moved to where the die 20 is to be placed. Location. The position adjustment is a lateral displacement, a front-rear displacement or a lateral and front-rear displacement.

After the platform 120 stops moving, please refer to FIG. 4 , the third upper vision unit 18 passes through the first transparent module 141 to capture the die mark 200 located on the die 20 and the part 21 to be bonded. The upper image information of the adhesive mark 210 .

The lower vision unit 19 captures the lower image information of the bonding mark 210 and the die mark 200 through the platform 120 . The platform is transparent or partially transparent to facilitate penetration and capture of images.

The upper image information and the lower image information can determine whether the die 20 is located on the platform 120 where the die 20 is to be placed.

If yes, go to step S5.

If not, the first vacuum module 140 performs a position adjustment so that the die mark 200 is aligned with the bonding mark 210 . The position adjustment can be an angular rotation, an axial movement or a lateral movement. The third upper vision unit 18 captures the upper image information again, and the lower vision unit 19 captures the lower image information again, so as to determine whether the die 20 is located at the position where the die 20 is to be placed on the platform 120 .

If it is judged from the lower image information of the upper image information captured again that the die mark 200 has been aligned with the adhesive mark 210, then go to step S5.

Step S4, providing at least one die again. The supply stage 100 of the supply unit 10 performs a lateral movement, a forward and backward movement, or a lateral and forward movement, so as to move the die 20 to be sucked to the bottom of the vacuum module 110 .

After the die 20 to be sucked moves below the vacuum module 110, the first upper vision unit 16 captures the image information of the die 20 to be ejected, and the ejector pin 101 ejects the die again according to the image information. grain 20.

The first upper vision unit 16 captures the image information of the ejected die 20 and sends the image information to the suction unit 20 . The vacuum module 110 of the suction unit 11 sucks the die 20 according to the image information.

The displacement module 130 moves the second relay table 132 to the lower part of the vacuum module 110 which has sucked the die 20 .

Step S5, placing at least one die on the receiving unit. As described in step S3. The first vacuum module 140 of the first bonding unit 14 is used to place the picked-up die 20 on the platform 120 of the receiving unit 12 to be bonded.

Step S6, transferring at least one die to the relay unit again. As described in step S4 , the pick-up unit 11 places the picked-up die 20 on the second relay station 132 .

Step S7, aligning the position of at least one die and the receiving unit again. The third upper vision unit 18 captures the image information of the die 20 and provides the image information to the second bonding unit 15 so that the second vacuum module 140 absorbs the die 20 located on the second relay station 132 .

After the second vacuum module 150 absorbs the die 20, the support platform 120 adjusts the position of the second vacuum module 150 so that the support platform 120 can move to the desired placement of the die 20 s position. The position adjustment can be a lateral movement, a forward and backward movement or a lateral and forward and backward movement.

After the stage 120 moves to the position where the die 20 is to be placed, the third upper vision unit 18 captures the upper part of the die mark 200 and the adhesive mark 210 through the second transparent module 151 of the second bonding unit 15 Image information. The lower vision unit 19 captures the lower image information of the die mark 200 and the bonding mark 210 through the platform 12 .

Based on the upper image information and the lower image information, it is judged whether the die mark 200 and the bonding mark 210 are aligned. If they are aligned, the second bonding unit 15 places the die 20 on the platform 12 . If not aligned, the second vacuum module 150 of the second bonding unit 15 performs position adjustment to align the die mark 200 with the bonding mark 210 . The position is adjusted to an angle rotation, a lateral movement or a forward and backward movement, and the upper image information and the lower image information are captured again, so as to determine whether the die 20 is located at the desired position of the die 20 on the platform 120, that is, Adhesives 21.

If it is judged from the lower image information of the upper image information captured again, the die mark 200 has been aligned with the bonding mark 210, and the second vacuum module 150 of the second bonding unit 15 places the die 20 on the platform 120 The position where the die is to be placed is the bonding part 21 .

If the second bonding unit 14 has placed the die 20 behind the part to be bonded 21 of the platform 12 , go back to step S1 .

The third embodiment of the present invention is a high-precision die-bonding system, as shown in Figures 5 and 6, the high-precision die-bonding system has a supply unit 10A, a suction unit 11A, a receiving unit 12A, and a relay unit 13A, a first bonding unit 14A, a second bonding unit 15A, a first upper visual unit 16A, a second upper visual unit 17A, a third upper visual unit 18A and a lower visual unit 19A.

In the third embodiment, the supply unit 10A, the suction unit 11A, the receiving unit 12A, the relay unit 13A, the first bonding unit 14A, the second bonding unit 15A, the upper visual unit 16A, the second upper visual unit 17A, the 3. The arrangement of the upper vision unit 18A and the lower vision unit 19A is the same as the above-mentioned first embodiment of the high-precision die bonding system of the present invention, so it will not be repeated here, but will be stated first.

The difference between the third embodiment and the above-mentioned first embodiment is that the relay unit 13A only has a first relay station 131A and a displacement module 130A, and the first relay station 131A is located in one of the displacement modules 130A. side, so that the relay unit 13A in this embodiment is designed as a single wing.

A high-precision die-bonding method according to the second embodiment of the present invention is shown in FIG. 3 .

Step S1, providing at least one die. As shown in FIG. 5 , the ejector pin 101A ejects the die 20A to be ejected from the supply table 100A. The first upper vision unit 16A captures the image information of the ejected die 20A, and transmits the image information to the suction unit 20A. The vacuum module 110A of the pick-up unit 11A picks up the die 20A according to the image information. The vacuum module 110A sucks at least one die 20A or a plurality of dies 20A.

Step S2, transferring at least one die to a relay unit. The suction displacement module 111A moves the vacuum module 110A with the die 20A sucked to the top of the first relay platform 131A of the relay unit 13A.

The second upper vision unit 17A captures the image information of the die 20A and the first relay station 131A of the relay unit 13A, and transmits the image information to the suction unit 11A, so that the vacuum module 110A places the die 20A on the The first relay station 131A.

After the vacuum module 110A places the die 20A on the first relay station 131A, the vacuum displacement module 111A moves the vacuum module 110A back to the original position to suck the die 20A again.

Step S3, aligning the positions of at least one die and one receiving unit. It is the step S3 described in the above-mentioned high-precision die bonding method of the present invention, so it will not be repeated here, but will be stated first.

Step S4, providing at least one die again. The supply stage 100A of the supply unit 10A performs a lateral movement, a forward and backward movement, or a lateral and forward movement, so as to move the die 20A to be sucked to the bottom of the vacuum module 110A.

After the die 20A to be sucked moves below the vacuum module 110A, the first upper vision unit 16A captures the image information of the die 20A to be ejected, and the ejector pin 101A ejects the die according to the image information 20A.

The first upper vision unit 16A captures the image information of the ejected die 20A, and transmits the image information to the suction unit 20A. The vacuum module 110A of the pick-up unit 11A picks up the die 20A according to the image information.

The displacement module 130A moves the first relay platform 131A to the lower part of the vacuum module 110A which has absorbed the die 20A.

Step S5, placing at least one die on the receiving unit. It is the step S5 described in the above-mentioned high-precision die bonding method of the present invention, so it will not be repeated here, but will be stated first.

Step S6, transferring at least one die to the relay unit again. The vacuum module 110A of the suction unit 11A places the sucked die 20A on the first relay station 131A.

Step S7, aligning the positions of at least one die and one receiving unit again. The third upper vision unit 18A captures the image information of the die 20A, and provides the image information to the second bonding unit 15A, so that the second vacuum module 140A absorbs the die 20A located on the first relay station 131A.

After the second vacuum module 150A absorbs the die 20A, the support platform 120A adjusts the position of the second vacuum module 150A so that the support platform 120A can move to the position where the die 20A is to be placed. 21A.

As described in step S3, it can be determined whether the die 20A is located at the position where the die is to be placed on the platform 120A according to the upper image information and the lower image information. The bonding member 21A for placing the die on the platform 120A.

Based on the upper image information and the lower image information, it is judged whether the die mark and the bonding mark are aligned. If they are aligned, the second bonding unit 15A places the die 20A on the platform 12A. If not aligned, the second vacuum module 150A of the second bonding unit 15A performs a position adjustment to align the die marks with the bonding marks. The position adjustment is an angular rotation, a lateral movement or a back and forth movement. And capture the upper image information and the lower image information again, so as to determine whether the die 20A is located at the position where the die is to be placed on the platform 120A.

If it is judged from the lower image information of the upper image information captured again, the die mark has been aligned with the bonding mark, and the second vacuum module 150A of the second bonding unit 15A places the die 20A on the platform 120A as desired. where the grains are placed.

If the second bonding unit 14A has placed the die 20A behind the platform 12A, go back to step S1.

The fourth embodiment of the present invention is a high-precision die-bonding system. As shown in Figures 7 and 8, the high-precision die-bonding system has a supply unit 10B, a suction unit 11B, a receiving unit 12B, and a relay unit. 13B, a first bonding unit 14B, a second bonding unit 15B, a first upper visual unit 16B, a second upper visual unit 17B, a third upper visual unit 18B and a lower visual unit 19B.

In the fourth embodiment, supply unit 10B, suction unit 11B, receiving unit 12B, relay unit 13B, first bonding unit 14B, second bonding unit 15B, first upper The arrangement of the vision unit 16B, the second upper vision unit 17B, the third upper vision unit 18B, and the lower vision unit 19B is the same as the first embodiment of the high-precision die-bonding system of the present invention described above, so no further details are given here. To repeat, let me explain first.

The difference between the fourth embodiment and the above-mentioned first embodiment is that the relay unit 13B has a first relay station 131B, a second relay station 132B and a displacement module 130B, and the first relay station 131B and the second relay station 131B The two relay units 132B are arranged on two opposite sides of the displacement module 130B. The first relay unit 131B and the second relay unit 132B are arranged in a staggered position, so that the relay unit 13B in this embodiment is designed in a staggered position.

A high-precision die-bonding method according to the second embodiment of the present invention is shown in FIG. 3 .

Step S1, providing at least one die. It is like step S1 described in the above-mentioned high-precision die bonding method of the present invention, so it will not be repeated here, but will be stated first.

Step S2, transferring at least one die to a relay unit. The suction displacement module 111B moves the vacuum module 110B with the die 20B sucked to the top of the first relay platform 131B of the relay unit 13B.

The second upper vision unit 17B captures the image information of the die 20B and the first relay station 131B of the relay unit 13B, and transmits the image information to the suction unit 11B, so that the vacuum module 110B places the die 20B on the The first relay station 131B.

After the vacuum module 110B places the die 20B on the first relay station 131B, the vacuum displacement module 111B moves the vacuum module 110B back to the original position to suck the die 20B again.

The displacement module 130B moves the first relay platform 131B to the top of the support platform 120B, and moves the second relay platform 132B to the top of the supply platform 100B. The displacement module 130B then moves the first relay platform 131B to the bottom of the first bonding unit 14B.

In this embodiment, steps S3 to S7 are as described in the above-mentioned high-precision die bonding method of the present invention, so they will not be repeated here, but will be stated first.

Fig. 9 is an alignment system for high-precision die bonding according to the fifth embodiment of the present invention. Fig. 9 shows the alignment of bonding marks and a die mark. The alignment system for high-precision die bonding of the present invention is suitable for a die 30 with a die mark 300. The alignment system includes an upper vision unit 40, a bonding unit 41, a receiving unit 42 and a lower vision unit. 43.

The bonding unit 41 has a vacuum module 410 , and the vacuum module 410 has a transparent module 411 . The transparent module 411 is a transparent body or a perforation.

The upper visual unit 40 is disposed above the adhesive unit 41 .

The receiving unit 42 has a platform 420 . The platform 420 is transparent. The support platform 420 is provided for a desired adhesive member 31 , the desired adhesive member 31 is transparent, and the desired adhesive member 31 has at least one adhesive mark 310 .

The above-mentioned die 30 has at least one transparent region 301 , and the die mark 300 is located in the transparent region 301 .

As mentioned above, the vacuum module 410 sucks the die 30 . The upper vision unit 40 captures the upper image information of the die mark 301 and the adhesive mark 310 through the transparent module 411 and the transparent area 301 . The lower vision unit 43 captures the lower image information of the bonding mark 310 and the die mark 301 through the platform 420 and the part to be bonded 31 . Based on the upper image information and the lower image information, it is known whether the die 30 is aligned with the mounting block 420 to be bonded 31 . When the alignment system used for high-precision die bonding requires precise alignment, the bonding unit 41 or the platform 420 is moved sideways to perform alignment, so as to achieve precise alignment between the die 30 and the part 31 to be bonded bit.

To sum up the above, the high-precision die bonding system and method of the present invention set the displacement device of the system not directly above or below the supply unit or the receiving unit, so the vacuum mold When the group, the first relay station or the second relay station is moving, the dust that may be generated cannot fall on the supply unit or the receiving unit, so as to improve the cleanliness.

In addition, the moving distance of the first vacuum module or the second vacuum module is very small, so the dust that may be generated is very small, so the cleanliness can also be maintained.

Furthermore, the design of the relay unit, the first bonding unit and the second bonding unit in the present invention can provide at least one die to the receiving unit at a time, so as to increase the speed of die bonding.

Furthermore, the alignment method used in the present invention uses the alignment between the die mark and the bonding mark, so the precision of die bonding can be improved.

Second, the first bonding unit and the second bonding unit of the bonding assembly of the present invention do not move or move in large strokes, and can be equipped with a separation plate, so pollution can be reduced. At the same time, for precision, the first bonding unit and the second bonding unit of the bonding assembly can move slightly laterally. Therefore, the present invention has the characteristics of low pollution and high precision.

10: supply unit 100: Supply Desk 101: Thimble 11: suction unit 110: Vacuum Module 111: Suction Displacement Module 12: Undertaking unit 120: platform 13: Relay unit 130: Displacement Module 131: The first repeater 132: Second relay station 14: The first bonding unit 140: The first vacuum module 141: The first transparent module 15: Second bonding unit 150: Second Vacuum Module 151: Second transparent module 154: isolation board 16: The first visual unit 17: Second Upper Vision Unit 18: Third Upper Vision Unit 19: Lower Visual Unit 20: grain 21: To glue parts

Claims (17)

A high-precision die bonding system, comprising: a supply unit for setting a crystal grain; a receiving unit adjacent to the supply unit; a relay unit arranged between the supply unit and the receiving unit; unit, arranged above the supply unit, the suction unit places the die on the relay unit; and a bonding assembly, arranged above the receiving unit; wherein, the bonding assembly will be positioned on the relay unit The crystal grain of the unit is placed on the receiving unit; wherein, the relay unit has a displacement module and a first relay station, and the first relay station is arranged on one side of the displacement module; wherein, the The suction unit has at least one vacuum module and a suction displacement module, and the vacuum module is arranged on one side of the suction displacement module; wherein, the displacement module and the suction displacement module are both arranged on the supply unit or Not directly above or below the receiving unit. The high-precision die bonding system as described in Claim 1, wherein the supply unit has a supply table and at least one thimble, the thimble is arranged under the supply table, the supply table is used for setting the die, and the thimble is The die is ejected. The high-precision die bonding system as described in Claim 2, wherein the supply table can perform a lateral movement, a forward and backward movement, or a lateral and forward and backward movement. The high-precision die-bonding system according to claim 1, wherein the receiving unit has a platform. The high-precision die-bonding system as described in Claim 4, wherein the platform is transparent or partially transparent to facilitate the penetration and capture of images, and the platform can perform a lateral movement, a forward and backward movement, or a lateral and forward and backward movement move. The high-precision die bonding system as described in claim 1, wherein the relay unit further has a second relay station, the second relay station is set on the other side of the displacement module, and the first relay station The station and the second relay station are in a parallel arrangement or a dislocation arrangement, and the displacement module can perform a forward and backward movement, a lateral movement or a rotational movement. The high-precision die bonding system as described in Claim 1, wherein the bonding assembly has a first bonding unit and a second bonding unit; the first bonding unit has at least one first vacuum module, and the first vacuum module The set has a first transparent module; the second bonding unit has at least one second vacuum module, and the second vacuum module has at least one second transparent module. The high-precision die-bonding system as described in Claim 1 further has a first upper vision unit, a second upper vision unit, a third vision unit and a lower vision unit, the first upper vision unit is set on the Above the suction unit, the second upper visual unit is located above the relay unit, the third upper visual unit is located above the first bonding unit and the second bonding unit, and the lower visual unit is located on the receiving unit below. A high-precision die bonding method, comprising the following steps: providing a supply unit for setting a die to a suction unit, and the suction unit picks up the die; the pick-up unit transfers the picked-up die to a relay unit ; the relay unit moves the die under a bonding assembly, and the bonding assembly absorbs the die; Move a receiving unit to the position where the die is to be placed, and the die is aligned with the position where the die is to be placed on the receiving unit; the supply unit provides another die to the suction unit again, and the suction unit absorbs the die die; placing the other die on the receiving unit, the bonding assembly places the die on the receiving unit at the position where the die is to be placed; transfers the other die to the relay unit , the suction unit places the other die on the relay unit; the relay unit moves the other die below the bonding assembly; and the bonding assembly sucks the other die, the receiving The unit moves to the position where the die is to be placed, the other die is aligned to the position where the die is to be placed, and the bonding assembly places the other die at the position where the die is to be placed ; Wherein, in the step of transferring the crystal grain to a relay unit, the following steps are further included: a suction displacement module is to move the vacuum module with the crystal grain to the first relay of the relay unit above the table; a second upper vision unit captures the image information of the die and the first relay station, and sends the image information to the suction unit, so that the vacuum module places the die on the The first relay platform; the displacement module of the relay unit performs a rotation action so that the first relay platform is rotated to the top of the bearing platform of the receiving unit; or, the displacement module performs a rotation Rotation action, so that the first relay platform is rotated to the top of the platform, and a second relay platform is rotated to the top of one of the supply platforms of the supply unit, and the displacement module then the stepping table moves to the bottom of one of the first bonding units of the bonding assembly; and Alternatively, the displacement module moves the first relay platform to the top of the platform, and the second relay platform is moved to the top of the supply platform, and the displacement module then moves the first relay platform Move to the bottom of the first bonding unit. The high-precision die bonding method as described in Claim 9, wherein in the step of providing the die, it further includes the following steps: one of the supply units of the supply unit performs a front-back displacement, a lateral displacement, or a lateral and front-rear displacement move to move the grains to be sucked to the bottom of the vacuum module of the suction unit; a first upper vision unit is to capture the image information of the grains to be ejected, and at least one thimble is based on the image information, to eject the die; and the first upper vision unit captures the image information of the ejected die, and transmits the image information to the suction unit, and the vacuum module sucks the die according to the image information grain. The high-precision die bonding method as described in Claim 9, wherein in the step of transferring the die to the relay unit again, the suction unit is to suck the die located in the supply unit, and place the die at the second relay station; or the suction unit places the sucked die on the first relay station. The high-precision die bonding method as described in Claim 9, wherein in the step of aligning the position of the die and the receiving unit, the following steps are further included: a third upper vision unit is to capture the image information of the die , the image information is provided to the first bonding unit, so that a first vacuum module of the first bonding unit is located on the die of the first intermediate station; the platform is moved to the place where the die is to be placed position; the third upper vision unit is through one of the first transparent modules of the first vacuum module to capture the upper image information of the die mark of the die and the bonding mark of a part to be bonded on the platform ; The lower vision unit captures the lower image information of the bonding mark and the die mark through the platform; the upper image information and the lower image information can determine whether the die is located on the platform where the die is to be placed. If yes, go to the step of placing the die on the receiving unit; if no, the first vacuum module performs a position adjustment so that the die mark is aligned with the bonding mark; the The third upper vision unit captures the upper image information again, and the lower vision unit captures the lower image information again to determine whether the die is located at the position where the die is to be placed; and if the die mark has been placed Align the bonding mark, and then go to the step of placing the die on the receiving unit. The high-precision die bonding method as described in claim 12, wherein in the step of re-aligning the position of the die and the receiving unit, the third upper vision unit captures the image information of the die, and the The image information is provided to a second bonding unit of the bonding assembly, so that a second vacuum module of the second bonding unit absorbs the die located on the second relay station; or the third upper vision unit is capturing the image information of the die, and providing the image information to the second bonding unit, so that the second vacuum module absorbs the die located on the first intermediate platform; the platform is moved to the The position where the die is to be placed, the third upper vision unit passes through a second transparent module of the second bonding unit to capture the upper image information, and the lower vision unit passes through the platform to capture The lower image information; by using the upper image information and the lower image information, it is judged whether the die mark and the bonding mark are aligned, and if they are aligned, the second bonding unit places the die on the substrate platform; if the second bonding unit has placed the die behind the platform, return to the step of providing the die. The high-precision die bonding method as described in Claim 9, wherein in the step of aligning the positions of the die and the receiving unit, the part to be bonded is set on the platform, and the part to be bonded is transparent. An alignment system for high-precision die bonding, suitable for a die with a die mark, including: a bonding unit with a vacuum module, the vacuum module has a transparent module; an upper vision unit, It is arranged above the bonding unit; a receiving unit has a platform for setting a part to be bonded, and the part to be bonded has a bonding mark; and a visual unit is arranged under the receiving unit; wherein, The vacuum module absorbs the die, the upper vision unit passes through the transparent module and the die to capture the upper image information of the die mark and the bonding mark; the lower vision unit passes through the platform , to capture the die mark and the bonding mark, and use the upper image information and the lower image information to know whether the die is aligned with the platform. The alignment system for high-precision die bonding as described in claim 15, wherein the die has a transparent area, the die mark is located in the transparent area, and the platform is transparent or partially transparent for image Penetration and extraction; the transparent module is a transparent body or a perforation. The alignment system for high-precision die bonding as described in claim 15 further includes moving the bonding unit or the platform sideways to perform alignment, so as to achieve precise alignment between the die and the part to be bonded bit.

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