TWI783714B - Wafer bonding apparatus - Google Patents

Abstract

A wafer bonding apparatus includes a base, at least two first positioning components, two second positioning components, a heat source and a soft pressing component. The base has a carrying region, the carrying region is adapted to carry two wafers stacked with each other, and a periphery of each of the wafers includes an arc segment and a straight line segment. The two first positioning components and the two second positioning components are disposed on the base and surround the carrying region. The two first positioning components are adapted to lean against the arc segment and the two second positioning components are adapted to lean against the straight line segment, such that the two wafers are positioned and the two straight lines are aligned to each other. The heat source is connected to the base and adapted to heat the carrying region, such that a temperature of a bonding material between the two wafers is raised. The soft pressing component is disposed above the carrying region and is capable of being elevated. The soft pressing component is adapted to be lowered toward the carrying region to press the two wafers, such that the two wafers are boned two each other through the bonding material.

Description

Wafer Bonding Equipment

The present invention relates to a bonding apparatus, and in particular to a wafer bonding apparatus.

The new generation of semiconductor materials, such as silicon carbide (SiC) and gallium nitride (GaN), have the advantages of higher performance and higher power than traditional semiconductor materials, and are suitable for 5G communications, electric vehicles and other industries. For silicon carbide wafers, before polishing and other processes, it is necessary to bond the silicon carbide wafer with another wafer as a carrier to increase the thickness, so as to prevent the wafer from being too thin and cracked during polishing and other processes. . The current method is to manually align the peripheries of two wafers and make them stick together, and then use a weight to press the two wafers and let them stand for a while. However, it is not easy to align the peripheral edges of the two wafers accurately by manual visual inspection, and the weight pressing method cannot accurately control the required pressing force and pressing time, and it is difficult to ensure the bonding quality of the wafers through a standardized operation process .

The invention provides a wafer bonding equipment, which can ensure the bonding quality of wafers through a standardized operation process.

The wafer bonding equipment of the present invention includes a stage, at least two first positioning parts, two second positioning parts, a heat source and a soft pressing part. The carrying platform has a carrying area, which is suitable for carrying two wafers stacked on top of each other. The periphery of each wafer includes an arc segment and a straight line segment. The two first locating elements and the two second locating elements are arranged on the platform and surround the carrying area. The two first positioning pieces are suitable for abutting against the arc section and the two second positioning pieces are suitable for abutting against the straight line section, so as to position the two wafers and align the two straight line sections with each other. The heat source is connected to the carrier and is suitable for heating the carrier region to increase the temperature of a bonding material between the two wafers. The soft pressing part is arranged above the bearing area in a liftable manner. The soft pressing member is suitable for moving down to the supporting area to pressurize the two wafers, so that the two wafers are bonded by the bonding material.

In one embodiment of the present invention, the above-mentioned at least two first positioning members and two second positioning members are telescopically connected to the stage. When the soft pressing member presses two wafers, the at least two first positioning members and the two second positioning members The two second positioning members are pressed down by the soft pressing member to at least partially shrink inwardly on the platform.

In an embodiment of the present invention, the above-mentioned wafer bonding equipment includes at least two position adjustment components, wherein at least two position adjustment components are arranged on the stage, and at least two first positioning members are respectively connected to the at least two position adjustment components, each The position adjustment assembly is adapted to adjust the positions of the corresponding first positioning members, so that at least two first positioning members abut against the arc section.

In an embodiment of the present invention, each of the above-mentioned position adjustment components is adapted to adjust the position of the corresponding first positioning member along the radial direction of the arc section.

In an embodiment of the present invention, the above-mentioned wafer bonding equipment includes a first driving unit, wherein the two second positioning members are connected to the first driving unit, and the first driving unit is suitable for driving the two second positioning members to the loading area Move against the straight segment.

In an embodiment of the present invention, the line connecting the above-mentioned two second positioning members is parallel to a first direction, and the first driving unit is adapted to drive the two second positioning members to move along a second direction perpendicular to the first direction. The carrying area moves.

In an embodiment of the present invention, the above-mentioned first positioning member includes a guiding structure, and the guiding structure extends along the second direction.

In an embodiment of the present invention, the above-mentioned wafer bonding equipment includes a stopper and at least one elastic member, the stopper is arranged on the stage, and at least one second positioning member is movably connected to the stopper along the second direction. For the stopper, at least one elastic member is connected between the stopper and at least one second positioning member.

In an embodiment of the present invention, the above-mentioned second positioning member includes a stopper portion and a connecting portion that are connected, the connecting portion is movably connected to the stopper along the second direction, and at least one elastic member is sheathed on the connecting portion. portion and is compressed between the stopper portion and the stopper.

In an embodiment of the present invention, the above-mentioned wafer bonding equipment includes at least two second driving units, wherein at least two first positioning members are respectively connected to at least two second driving units, and each second driving unit is suitable for driving the corresponding The first positioning member moves toward the bearing area and abuts against the arc section, and the driving force of each second driving unit is smaller than that of the first driving unit.

In an embodiment of the present invention, the driving force of each of the above-mentioned second driving units is 0.2-0.7 MPa, 0.4-0.7 MPa or 0.3-0.5 MPa.

In one embodiment of the present invention, the above-mentioned wafer bonding equipment includes a hot air supply unit, wherein the carrier has a plurality of apertures in the loading area, the hot air supply unit is suitable for providing hot air, and the hot air passes through these apertures from below the loading area. flow over the carrying area to suspend the two wafers above the carrying area.

In an embodiment of the present invention, the temperature of the above-mentioned hot air is 120-150 degrees, 130-150 degrees, 130-140 degrees or 135 degrees.

In an embodiment of the present invention, the above-mentioned wafer bonding equipment includes a vacuum suction unit, wherein the stage has a plurality of holes in the loading area, and the vacuum suction unit is suitable for vacuuming these holes to generate a vacuum in the loading area The two wafers are adsorbed by the adsorption force.

In an embodiment of the present invention, the above-mentioned wafer bonding equipment includes a tilt adjustment component, wherein the tilt adjustment component is connected to the stage and is suitable for adjusting the tilt angle of the stage.

In an embodiment of the present invention, the above-mentioned inclination adjustment assembly is suitable for adjusting the inclination angle of the stage to 1-5 degrees, 2-4 degrees, 2.5-3.5 degrees or 3 degrees.

In an embodiment of the present invention, the above-mentioned wafer bonding equipment includes at least one heat-insulating element, wherein the stage has a receiving space under the carrying area, the containing space accommodates a heat source, and at least one heat-insulating element is arranged between the heat source and the containing space between at least some of the inner surfaces of the

In an embodiment of the present invention, the above-mentioned thermal break element is annular and arranged along at least part of the periphery of the heat source.

In an embodiment of the present invention, the temperature of the above-mentioned heat source is 120-200 degrees, 130-150 degrees, 143-150 degrees or 145 degrees.

In an embodiment of the present invention, the above-mentioned soft pressurizing part is an air bag.

In an embodiment of the present invention, the pressure value of the above-mentioned air bag is 0.04-0.05Mpa.

A wafer bonding equipment includes a carrier, at least two first positioning pieces, two second positioning pieces, a heat source and a soft pressing piece. The carrier has a carrying area. At least two first locating pieces and two second locating pieces are disposed on the carrier and surround the carrying area, wherein at least two first locating pieces and two second locating pieces are adapted to jointly define a positioning area, and the periphery of the positioning area includes a circle The arc segment and the straight line segment, at least two first positioning parts are suitable for moving to the arc segment and the two second positioning parts are suitable for moving to the straight line segment. The heat source is connected to the stage and adapted to heat the carrying area. The soft pressing part is liftably arranged above the bearing area, wherein the soft pressing part is suitable for moving down towards the bearing area.

Based on the above, the wafer bonding equipment of the present invention can pass through three The point positioning method accurately positions the two wafers in the correct position, and accurately aligns the straight line sections of the two wafers with each other. In addition, the present invention utilizes a soft pressing member to pressurize the wafer, thereby ensuring a uniform pressure path. Therefore, the wafer bonding equipment of the present invention ensures the bonding quality of wafers through a standardized operation process.

FIG. 1 is a perspective view of a wafer bonding apparatus according to an embodiment of the present invention. FIG. 2 is an exploded view of the wafer bonding apparatus of FIG. 1 . FIG. 3 is a partial perspective view of the wafer bonding apparatus of FIG. 1 . Please refer to FIG. 1 to FIG. 3 , the wafer bonding equipment 100 of the present embodiment includes a stage 110, three first positioning members 120, two second positioning members 130, a heat source 140, a soft pressing member 150, a driving Source 180, an electronic control unit 190. The stage 110 has a carrying area 110a, and the first positioning elements 120 and the second positioning elements 130 are disposed on the stage 110 and surround the carrying area 110a. The heat source 140 is connected to the carrier 110 and corresponds to the carrier area 110a. The soft pressing member 150 is arranged above the bearing area 110 a in a liftable manner by being driven by a driving source 180 (such as a cylinder). The electronic control unit 190 is used for the user to control the operation of the wafer bonding equipment 100 .

FIG. 4 is a top view of the wafer carrying area in FIG. 3 . FIG. 5 is a side view of the wafer carrying area in FIG. 3 . Please refer to FIG. 4 and FIG. 5 , the carrying area 110a is suitable for carrying two wafers W stacked on top of each other, and the periphery of each wafer W includes an arc segment S1 (marked in FIG. 4 ) and a straight line segment S2 (marked in FIG. 4 ). Figure 4). The three first positioning members 120 and the two second positioning members 130 are adapted to jointly define a positioning area R (marked in FIG. 4 ), and the periphery of the positioning area R includes an arc segment S1' (marked in FIG. 4 . ) and a straight line segment S2' (marked in Figure 4). The positioning area R is an area where the wafer W is scheduled to be positioned, and the arc segment S1' and the straight line segment S2' of the positioning area R correspond to the arc segment S1 and the straight line segment S2 of the wafer W, respectively. The three first positioning members 120 are adapted to move to the arc segment S1' of the positioning area R and abut against the arc segment S1 of the wafer W, so that the two wafers W can be accurately positioned by means of three-point positioning. In the correct position, and the two second positioning members 130 are suitable for moving to the straight line section S2' of the positioning area R as shown in FIG. The straight sections S2 of the circle W are aligned with each other. The heat source 140 is suitable for heating the loading area 110 a to increase the temperature of a bonding material M (shown in FIG. 5 ) between the two wafers W. The temperature of the heat source can be set to 120-200 degrees, 130-150 degrees, 143-150 degrees or 145 degrees.

FIG. 6 illustrates the expansion of the flexible compression member of FIG. 1 . The soft pressurizing member 150 is, for example, an airbag and can be inflated as shown in FIG. 6 , and moves down to the loading area 110 a to pressurize the two wafers W, so that the two wafers W pass through the bonding material M (shown in FIG. 5 ). And join. Due to the softness of the soft pressing member 150 , it can ensure that the pressure path on the wafer W is uniform. The pressure of the airbag can be set to 0.04-0.05 Mpa, the diameter of the airbag is, for example, 185 mm, and the time for pressurizing the wafer W can be set to an appropriate length of time within 1-5 minutes.

Through the above-mentioned working methods of the first positioning member 120 , the second positioning member 130 and the soft pressing member 150 , the wafer bonding apparatus 100 of this embodiment ensures the bonding quality of the wafer W through a standardized operation process.

In this embodiment, each first positioning member 120 and each second positioning member 130 can be designed to be telescopically connected to the carrier. When the soft pressurizing member 150 shown in FIG. The ground is retracted from the stage 110 to prevent the first positioning member 120 and the second positioning member 130 from hindering the soft pressurizing member 150 from pressing the wafer W. After the soft pressurizing part 150 moves away from each first positioning part 120 and each second positioning part 130, each first positioning part 120 and each second positioning part 130 can be closed by the elastic force provided by an elastic part of a suitable form. Reset up.

Please refer to FIG. 3 and FIG. 4 , the wafer bonding apparatus 100 of this embodiment includes three position adjustment components 160 . The position adjustment components 160 are disposed on the stage 110 , and the first positioning members 120 are respectively connected to the position adjustment components 160 . Each position adjustment assembly 160 can adjust the position of the corresponding first positioning member 120, so that the first positioning member 120 abuts against the circular arc section S1 of the periphery of the wafer W at a predetermined position, so as to securely adjust the wafer W. Three point positioning. Through the design of the position adjustment component 160 , the position of each first positioning member 120 can be finely adjusted to cope with wafers W of different diameters, and the applicable diameter range is, for example, 149-151 mm. Specifically, each position adjustment assembly 160 is designed to drive the corresponding first positioning member 120 to move along the radial direction of the arc segment S1 , so as to adjust the position of the corresponding first positioning member 120 . After the position adjustment of the corresponding first positioning member 120 is completed by using each position adjustment component 160 , these position adjustment components 160 can be fixed by screw locks or other methods.

Please refer to FIG. 3 to FIG. 5 , in the present embodiment, the wafer bonding apparatus 100 includes a first driving unit 170 . The first driving unit 170 is, for example, a cylinder. The two second positioning members 130 are connected to the first driving unit 170. The first driving unit can drive the two second positioning members 130 to move to the carrying area 110a and abut against the linear section of the wafer W. S2. Specifically, the line connecting the two second positioning members 130 is parallel to a first direction D1 (marked in FIG. 4 ), and the first driving unit 170 is adapted to drive the two second positioning members 130 along a direction perpendicular to the first direction D1. The second direction D2 (marked in FIG. 4 and FIG. 5 ) moves toward the carrying area 110 a, so that the linear section S2 of the wafer W is aligned along the first direction D1 by the pushing of the two second positioning members 130 .

FIG. 7 is a block diagram of some components of the wafer bonding apparatus in FIG. 1 . Please refer to FIG. 7 , the wafer bonding apparatus 100 of this embodiment may further include a hot air supply unit H. Referring to FIG. The loading area 110a of the carrier 110 is, for example, a porous ceramic disc with a plurality of pores. The hot air supply unit H is connected to the bottom of the openings of the loading area 110a through a suitable air flow path, and is suitable for supplying hot air. The hot air flows from below the loading area 110a through the holes to above the loading area 110a, so that the two wafers W are suspended above the loading area 110a. Thereby, the frictional force between the loading area 110 a and the wafer W can be prevented from obstructing the positioning of the wafer W by the first positioning member 120 and the second positioning member 130 . The lifting force of the hot air acting on the wafer W must at least be greater than the total weight of the two wafers W, so as to suspend the two wafers W smoothly. In addition, the temperature of the hot air can be set at 120-150 degrees, 130-150 degrees, 130-140 degrees or 135 degrees, so as to keep the bonding material M between the wafers W in a heated state.

As shown in FIG. 7 , the wafer bonding apparatus 100 of this embodiment may further include a vacuum unit V. As shown in FIG. After the wafer W is positioned by the first positioning member 120 and the second positioning member 130, the vacuum suction unit V can vacuum the pores of the loading area 110a, so as to generate a vacuum suction force in the loading area 110a to adsorb and fix the wafer W. Wafer W.

FIG. 8 illustrates the inclination of the stage in FIG. 1 . Please refer to FIG. 1 and FIG. 8 , in this embodiment, the wafer bonding equipment 100 further includes at least one inclination adjustment assembly A (shown as two), the inclination adjustment assembly A is connected to the stage 110 and is suitable for The inclination angle of the stage 110 is adjusted as shown. By tilting the stage 110 , the floating wafer W (shown in FIG. 4 and FIG. 5 ) on the carrying area 110 a of the stage 110 can lean against the first positioning member 120 obliquely without drifting unexpectedly. The inclination adjustment component A of this embodiment is, for example, in the form of a screw, which is suitable for adjusting the inclination angle of the stage 110 to 1-5 degrees, 2-4 degrees, 2.5-3.5 degrees or 3 degrees.

FIG. 9 is a partial perspective view of the wafer bonding apparatus of FIG. 1 . FIG. 10 shows a perspective view of the structure of FIG. 9 at another viewing angle. Please refer to FIG. 2 , FIG. 9 and FIG. 10 , the wafer bonding equipment 100 of this embodiment further includes thermal insulation elements C1 and C2 . The carrier 110 has a storage space CS (marked in FIG. 2 ) below the loading area 110a. The storage space CS accommodates the heat source 140. The thermal insulation elements C1 and C2 are arranged between the heat source 140 and the inner surface of the storage space CS to prevent the heat source from The heat of 140 is transferred to parts other than the carrying area 110a. In this embodiment, the thermal insulation elements C1 and C2 are, for example, ring-shaped and disposed along at least part of the periphery of the heat source 140 . Specifically, the heat-insulating element C1 is, for example, a heat-insulating mica sheet, and the heat-insulating element C2 is, for example, a heat-insulating washer.

The present invention does not limit the quantity of the first positioning member 120 , which is illustrated below with the help of figures. FIG. 11 is a top view of a wafer carrying area in a carrying area according to another embodiment of the present invention. The difference between the embodiment shown in FIG. 11 and the embodiment shown in FIG. 4 lies in that the number of the first positioning members 120 of the embodiment shown in FIG. 11 is two, and the two first positioning members 120 and the second positioning member 130 are in common The wafer W is positioned in a three-point positioning manner. That is to say, when there are two first positioning members 120, the second positioning member 130 is not only used for aligning the straight line segment S2 of the periphery of the wafer W, but also used to cooperate with the two first positioning members. Step 120 performs three-point positioning of the wafer W. In the case where the finely adjustable distance of the first positioning member 120 is limited, if the number of the first positioning member 120 is three as shown in FIG. 4 , the applicable wafer size range will be limited. The embodiment shown in FIG. 11 avoids this problem by designing the number of the first positioning members 120 to be two.

FIG. 12 is a partial perspective view of a wafer bonding apparatus according to another embodiment of the present invention. The difference between the embodiment shown in FIG. 12 and the previous embodiments is that each of the two first positioning members 120' in FIG. 12 includes a guiding structure G, and the guiding structure G extends along the second direction D2 and is suitable for guiding The wafer is guided so that the wafer is adjusted to have a correct orientation by being guided by the guiding structure G during the process of being pushed by the second positioning member 130 ′.

In addition, the wafer bonding equipment of this embodiment further includes a stopper B and two elastic members E. The stopper B is disposed on the platform 110, the second positioning member 130' is movably connected to the stopper B along the second direction D2, and the two elastic members E correspond to the two second positioning members 130' respectively, and each elastic member E It is connected between the stopper B and the corresponding second positioning member 130'. In detail, the second positioning member 130' includes a stopper 132 and a connecting part 134 connected to each other, the connecting part 134 is movably connected to the stopper B along the second direction D2, and the elastic member E is sheathed on the connecting part 134 and is compressed between the stopper 132 and the stopper B. In this way, when the first driving unit 170 drives the second positioning member 130' to push against the wafer, the elastic member E can play a buffering role to prevent the wafer from being broken due to excessive thrust.

In this embodiment, the wafer bonding apparatus may further include a plurality of second driving units 170 ′ (such as cylinders), and the first positioning members 120 ′ are respectively connected to the second driving units 170 ′. Each second driving unit 170' is adapted to drive the corresponding first positioning member 120' to move to the carrying area 110a, for example , the first positioning member 120' moves to the carrying area 110a and abuts against the arc segment S1, and each second positioning member 120' The driving force of the second driving unit 170 ′ is, for example, smaller than that of the first driving unit 170 . For example, the driving force of each second driving unit 170 ′ is 0.2-0.7 MPa, preferably 0.4-0.7 MPa, most preferably 0.3-0.5 MPa. By configuring the second driving unit 170 ′ to have a small driving force, the second driving unit 170 ′ can have a buffering effect, preventing the wafer from breaking due to an excessive driving force.

100:Wafer bonding equipment 110: carrier 110a: Loading area 120, 120': the first positioning piece 130, 130': the second positioning piece 132: stop part 134: connection part 140: heat source 150: soft pressure parts 160: Position adjustment component 170: The first drive unit 170': Second drive unit 180: drive source 190: Electronic control unit A: Angle adjustment components B: stopper C1, C2: Thermal break element CS: hold space D1, D2, P: directions E: Elastic parts G: guide structure H: Hot air supply unit M: Joining material R: positioning area S1, S1': arc section S2, S2': Straight line segment V: vacuum unit W: Wafer

FIG. 1 is a perspective view of a wafer bonding apparatus according to an embodiment of the present invention. FIG. 2 is an exploded view of the wafer bonding apparatus of FIG. 1 . FIG. 3 is a partial perspective view of the wafer bonding apparatus of FIG. 1 . FIG. 4 is a top view of the wafer carrying area in FIG. 3 . FIG. 5 is a side view of the wafer carrying area in FIG. 3 . FIG. 6 illustrates the expansion of the flexible compression member of FIG. 1 . FIG. 7 is a block diagram of some components of the wafer bonding apparatus in FIG. 1 . FIG. 8 illustrates the inclination of the stage in FIG. 1 . FIG. 9 is a partial perspective view of the wafer bonding apparatus of FIG. 1 . FIG. 10 shows a perspective view of the structure of FIG. 9 at another viewing angle. FIG. 11 is a top view of a wafer carrying area in a carrying area according to another embodiment of the present invention. FIG. 12 is a partial perspective view of a wafer bonding apparatus according to another embodiment of the present invention.

100:Wafer bonding equipment

110: carrier

110a: Loading area

120: The first positioning part

130: the second positioning part

150: soft pressure parts

160: Position adjustment component

170: The first drive unit

180: drive source

190: Electronic control unit

A: Angle adjustment components

Claims (22)

A wafer bonding apparatus comprising: A carrier has a carrying area, wherein the carrying area is suitable for carrying two wafers stacked on top of each other, and the periphery of each wafer includes an arc section and a straight line section; At least two first locating pieces and two second locating pieces are arranged on the platform and surround the bearing area, wherein the at least two first locating pieces are suitable for abutting against the arc section and the two second locating pieces are suitable for abutting against the straight line segment to position the two wafers and align the two straight line segments with each other; a heat source connected to the stage and adapted to heat the carrying area to heat up a bonding material between the two wafers; and a soft pressure member, which can be raised and lowered above the bearing area, wherein the soft pressure member is suitable for moving down to the bearing area to pressurize the two wafers, so that the two wafers can be bonded by the bonding material join together. The wafer bonding equipment according to claim 1, wherein the at least two first positioning members and the two second positioning members are telescopically connected to the stage, when the soft pressing member presses the two wafers, The at least two first positioning parts and the two second positioning parts are pressed down by the soft pressing part and are at least partially retracted into the platform. The wafer bonding equipment as claimed in claim 1, comprising at least two position adjustment components, wherein the at least two position adjustment components are arranged on the carrier, and the at least two first positioning members are respectively connected to the at least two position adjustment components, Each of the position adjustment components is adapted to adjust the position of the corresponding first positioning member, so that the at least two first positioning members abut against the arc section. The wafer bonding apparatus as claimed in claim 3, wherein each of the position adjustment components is adapted to adjust the position of the corresponding first positioning member along the radial direction of the arc segment. The wafer bonding equipment as claimed in claim 1, comprising a first driving unit, wherein the two second positioning members are connected to the first driving unit, and the first driving unit is suitable for driving the two second positioning members toward the The carrying area moves against the straight section. The wafer bonding equipment according to claim 5, wherein the line connecting the two second positioning members is parallel to a first direction, and the first driving unit is adapted to drive the two second positioning members along a line perpendicular to the first direction A second direction moves toward the carrying area. The wafer bonding apparatus as claimed in claim 6, wherein at least one of the first positioning members includes a guiding structure, and the guiding structure extends along the second direction. Wafer bonding equipment according to claim 6, comprising a stopper and at least one elastic member, the stopper is arranged on the stage, and at least one second positioning member is movably connected to the second position along the second direction The stopper, the at least one elastic member is connected between the stopper and the at least one second positioning member. The wafer bonding apparatus as claimed in claim 8, wherein the at least one second positioning member includes a stopper portion and a connecting portion connected thereto, and the connecting portion is movably connected to the stopper along the second direction, The at least one elastic member is sheathed on the connecting portion and compressed between the stopper portion and the stopper. The wafer bonding equipment as claimed in claim 5, comprising at least two second drive units, wherein the at least two first positioning members are respectively connected to the at least two second drive units, and each of the second drive units is suitable for driving the corresponding The first positioning member moves toward the bearing area and abuts against the arc section, and the driving force of each of the second driving units is smaller than that of the first driving unit. The wafer bonding apparatus according to claim 10, wherein the driving force of each of the second driving units is 0.2~0.7MPa, 0.4~0.7MPa or 0.3~0.5MPa. The wafer bonding equipment according to claim 1, comprising a hot air supply unit, wherein the carrier has a plurality of holes in the loading area, the hot air supply unit is suitable for providing hot air, and the hot air passes through the loading area from below The pores flow over the carrying area, so that the two wafers are suspended above the carrying area. The wafer bonding equipment according to claim 7, wherein the temperature of the hot air is 120-150 degrees, 130-150 degrees, 130-140 degrees or 135 degrees. The wafer bonding equipment as claimed in claim 1, comprising a vacuum suction unit, wherein the stage has a plurality of pores in the loading area, and the vacuum suction unit is suitable for vacuuming the pores, so that in the loading area A vacuum adsorption force is generated to adsorb the two wafers. The wafer bonding apparatus as claimed in claim 1, comprising an inclination adjustment assembly, wherein the inclination adjustment assembly is connected to the stage and is adapted to adjust the inclination of the stage. The wafer bonding apparatus according to claim 15, wherein the inclination adjustment component is suitable for adjusting the inclination angle of the stage to 1-5 degrees, 2-4 degrees, 2.5-3.5 degrees or 3 degrees. The wafer bonding equipment as claimed in claim 1, comprising at least one heat-insulating element, wherein the stage has an accommodating space under the carrying area, the accommodating space accommodates the heat source, and the at least one heat-insulating element is arranged on the heat source and at least part of the inner surface of the accommodating space. The wafer bonding apparatus as claimed in claim 17, wherein the thermal break element is annular and disposed along at least part of the periphery of the heat source. The wafer bonding equipment as described in Claim 1, wherein the temperature of the heat source is 120-200 degrees, 130-150 degrees, 143-150 degrees or 145 degrees. The wafer bonding apparatus as claimed in claim 1, wherein the soft pressurizing member is an air bag. The wafer bonding equipment as claimed in item 20, wherein the pressure value of the air bag is 0.04~0.05Mpa. A wafer bonding apparatus comprising: A carrying platform has a carrying area; At least two first positioning pieces and two second positioning pieces are arranged on the platform and surround the carrying area, wherein the at least two first positioning pieces and the two second positioning pieces are adapted to jointly define a positioning area, and the positioning The periphery of the area includes a circular arc section and a straight line section, the at least two first positioning members are adapted to move to the arc section and the two second positioning members are suitable to move to the straight line section; a heat source connected to the carrier and adapted to heat the carrier area; and A soft pressing part is disposed above the carrying area in a liftable manner, wherein the soft pressing part is suitable for moving down toward the carrying area.

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