TWI781732B - Resin molding apparatus and method for producing resin molded product - Google Patents

Abstract

A resin molding apparatus (D) includes: a resin supply mechanism (2A) including a nozzle (23b) for ejecting liquid resin (R) to a supply target (F); a resin collection unit (2B) including: a resin-receiving member (26) configured to receive a portion of the liquid resin (R) which portion has dropped from the nozzle (23b); and a movement mechanism (29) configured to cause the resin-receiving member (26) to move in such a manner as to follow the nozzle (23b) while keeping the resin-receiving member (26) under the nozzle (23b); a mold die (M) including an upper die (UM) and a lower die (LM) facing the upper die (UM); a mold clamp mechanism (35) configured to clamp the mold die (M) with the supply target (F) between the upper die (UM) and the lower die (LM); and a control section (5) configured to control at least respective operations of the resin supply mechanism (2A) and the resin collection unit (2B).

Description

Resin molding device and manufacturing method of resin molded product

The present invention relates to a resin molding device and a method for manufacturing resin moldings.

A substrate or the like on which a semiconductor chip is mounted is usually resin-sealed and used as an electronic component. Conventionally, as a resin molding device for resin-sealing a substrate, a device provided with a resin supply mechanism having a nozzle for discharging liquid resin to a substrate as a supply object is known (for example, refer to Japanese Patent Application Laid-Open No. 2007-111862 Bulletin and Japanese Patent Application Publication No. 2012-126075).

Japanese Unexamined Patent Application Publication No. 2007-111862 discloses a technique of supplying a liquid resin to a substrate with a nozzle arranged in a vacuum chamber, moving the nozzle upward in the vacuum chamber, and then receiving the nozzle from the front end of the nozzle with a drip container. Falling liquid resin. Also, Japanese Patent Application Laid-Open No. 2007-111862 discloses a technique in which the liquid resin is discharged from the nozzle to the drip container multiple times before the liquid resin is supplied to the substrate again to prevent the incorporation of air.

Japanese Patent Laid-Open No. 2012-126075 discloses the following technology: the resin supply mechanism is configured to be able to replace the syringe (Syringe) including the nozzle, and from the replacement of the syringe to the start of use, it is rotated by the rotation mechanism so as to be positioned at the nozzle Near the tip of the discard nozzle in the discard cup below poor quality liquid resin. In addition, JP-A-2012-126075 discloses a technique in which, after supplying a liquid resin to a substrate, the nozzle is moved up and down to drop the liquid resin onto the substrate to perform a wire breaking operation.

However, in the resin molding apparatus described in Japanese Patent Application Laid-Open No. 2007-111862, the liquid resin dripped from the nozzle falls and adheres to the substrate while the nozzle is moved upward from the vacuum chamber after supplying the liquid resin to the substrate. , There may be deviations in the resin supply state of the substrate. The resin forming apparatus described in Japanese Patent Application Laid-Open No. 2012-126075 supplies the liquid resin to the substrate and then moves the nozzle up and down to drop the liquid resin dripped from the nozzle onto the substrate. When the design value is different, there may be deviations in the resin supply state of the substrate.

Therefore, a resin molding device and a method of manufacturing a resin molded article capable of supplying a liquid resin to a supply object with high precision are desired.

The resin molding device of the present invention is characterized in that the resin molding device includes: a resin supply mechanism including a nozzle for discharging liquid resin to a supply object; a resin recovery unit having a device for receiving the liquid resin dripped from the nozzle. The resin receiving member and the moving mechanism that makes the aforementioned resin receiving member located below the aforementioned nozzle move following the movement of the aforementioned nozzle; the forming mold includes an upper mold and a lower mold opposite to the upper mold; The molding die is clamped in a state where the object to be supplied is arranged between the upper die and the lower die; and the control unit controls at least operations of the resin supply mechanism and the resin recovery unit.

The method for manufacturing a resin molded article of the present invention is characterized in that the method for manufacturing a resin molded article is a method for manufacturing a resin molded article using the above-mentioned resin molding device, and includes: a resin supply step of supplying the resin to the above-mentioned supplying the object to be supplied with the liquid resin; a resin recovery step of recovering the liquid resin dripped from the nozzle using the resin recovery unit after the liquid resin is supplied to the object to be supplied in the resin supplying step; and a resin molding step , performing resin molding using the aforementioned liquid resin supplied in the aforementioned resin supplying step.

According to the present invention, it is possible to provide a resin molding device capable of supplying a liquid resin to a supply object with high precision and a method of manufacturing a resin molded product.

1: Release film cutting module

11: Resin container

12: Resin loader

13: post-processing mechanism

14: roll film

15: Membrane gripper

16: Membrane loading mechanism

2: Resin supply module

2A: Resin supply mechanism

20:Workbench

21: discharge mechanism

21a: Dispenser unit

21b: clamping mechanism

22: Sensing sensor

23: box

23a: Syringe

23b: Nozzle

26: Resin receiving cup (resin receiving component)

27: arm

28: Rotary mechanism

29: Mobile Mechanism

29a: Front and rear moving mechanism

29c: Cylinder

3: Compression molding module

30: Position sensor

35: Clamping mechanism

4: Conveyor module

41: Substrate loader

43: The first containment department

44: Second storage part

45: Mechanical arm

5: Control Department

6: Notification Department

B: Resin recovery unit

D: Resin molding device

F: Release film (supplied object)

LM: lower mold

M: forming mold

MC: lower cavity

Mo: servo motor (motor)

Pa1: central position (first position)

Pa2: nozzle retreat position (second position)

Pb: cup retreat position (retreat position)

R: liquid resin

S: Substrate

Sa: Resin-sealed front substrate

Sb: substrate sealed with resin

UM: upper mold

Fig. 1 is a schematic diagram showing a resin molding device.

Fig. 2 is a schematic diagram showing the clamping mechanism.

Fig. 3 is a schematic plan view showing a resin recovery unit.

Fig. 4 is a schematic side view showing a resin recovery unit.

Fig. 5 is a schematic side view showing the liquid cut-off operation of the nozzle.

Fig. 6 is a flow chart of control related to resin supply.

Hereinafter, embodiments of the resin molding apparatus and the method of manufacturing a resin molded article of the present invention will be described based on the drawings. In this embodiment, as an example of a resin molding device, The resin molding apparatus D provided with the resin supply module 2 as shown in FIG. 1 is demonstrated. However, it is not limited to the following embodiment, Various deformation|transformation is possible in the range which does not deviate from the summary.

[device configuration]

A substrate or the like on which a semiconductor chip is mounted is used as an electronic component by being resin-sealed. Examples of techniques for resin-sealing molded articles include compression methods (compression molding), transfer methods, and the like. As one of the compression methods, after supplying liquid resin to the release film, the release film is placed on the lower mold of the molding die, and the molded object is immersed in the liquid resin on the release film to perform resin compression. Molded resin sealing method. The resin molding device D in this embodiment adopts a compression method, and the resin supply module 2 supplies liquid resin to a molding die, a substrate (an example of a supply object), or a release film F (an example of a supply object). device. Hereinafter, the supply object to be supplied with the liquid resin R composed of liquid resin is referred to as the release film F, and the substrate S on which the semiconductor wafer (hereinafter, sometimes referred to as "wafer") is mounted is referred to as the molding object. As an example, the direction of gravity will be described as downward, and the direction opposite to the direction of gravity will be described as upward. In addition, the Z direction shown in FIG. 1 is an up-down direction.

In FIG. 1 , a schematic diagram of a resin molding device D is shown. The resin molding device D in this embodiment includes: a release film cutting module 1, a resin supply module 2, a plurality (two in this embodiment) of compression molding modules 3, a conveying module 4, and a control unit. 5 and notification part 6. The release film cutting module 1 , the resin supply module 2 , the plurality of compression molding modules 3 and the conveying module 4 can be attached or detached independently. Moreover, although the compression molding die set 3 in this embodiment consists of two, it may consist of one or more than three.

The release film cutting module 1 cuts and separates a circular release film F in plan view from a strip-shaped film. The release film cutting module 1 includes a roll film 14 , a film gripper (film gripper) 15 and a film placement mechanism 16 . The film gripper 15 holds the end of the rolled film 14 and pulls the rolled film 14 out. The film mounting mechanism 16 cuts and separates the release film F which is circular in planar view from the roll film 14 using a cutter (not shown).

The resin supply module 2 includes: a resin supply mechanism 2A, which supplies liquid resin R for resin molding to the resin supply area on the release film F; After the liquid resin R is collected, the liquid resin R is recovered so as not to drip onto the release film F. Here, the liquid resin R is a resin that is liquid at normal temperature (room temperature). The liquid resin that becomes liquid at room temperature may be a thermoplastic resin or a thermosetting resin.

Thermosetting resins are liquid resins at room temperature, and when heated, the viscosity decreases, and when heated further, they polymerize and solidify to become cured resins. The liquid resin R in this embodiment is preferably a relatively high-viscosity thermosetting resin that does not flow rapidly at room temperature.

The resin supply mechanism 2A includes: a workbench 20, on which the release film F delivered from the release film cutting module 1 is placed; a discharge mechanism 21, which discharges the liquid resin R onto the release film F; and a weight sensor 25 . The release film F handed over from the release film cutting module 1 is sucked and held on the upper surface of the table 20 by a suction mechanism not shown.

The discharge mechanism 21 includes a dispenser unit 21 a equipped with a cartridge 23 and a clamping mechanism 21 b fastening the front end portion of the nozzle 23 b of the cartridge 23 . The dispenser unit 21a includes a pressing member (not shown) for extruding the liquid resin R in the syringe 23a containing the liquid resin R described later. Quantitative supply on the release film F.

The dispenser unit 21a equipped with the cassette 23 is comprised so that it can arbitrarily move on the XY plane (horizontal direction) which becomes the mounting surface of the release film F. Moreover, the dispenser unit 21a is comprised so that it can move to Z direction (up-down direction). The clamping mechanism 21b clamps the front end part of the nozzle 23b by a pair of clamping members, and blocks the nozzle 23b. In addition, the table 20 may be configured to be able to move arbitrarily on the XY plane in addition to the dispenser unit 21a or instead of the dispenser unit 21a. In addition, the driving source of the dispenser unit 21a is not particularly limited, for example, an electric motor such as a servo motor Mo can be used, and the clamping mechanism 21b can be operated by fluid pressure such as air supplied into a cylinder (not shown).

The cartridge 23 includes a syringe 23a containing the liquid resin R and a nozzle 23b from which the liquid resin R is discharged. A plurality of cartridges 23 (six in this embodiment) are accommodated in the resin container 11 in advance. The dispenser unit 21a is configured to be automatically replaced with a different cartridge 23 when the liquid resin R filled in the cartridge 23 is exhausted.

The weight sensor 25 measures the weight of the liquid resin R supplied on the release film F, and the weight of the resin receiving cup 26 described later. The weight sensor 25 is based on the difference between the weight of the release film F after resin supply or the resin receiving cup 26 after resin recovery and the release film F before resin supply or the resin receiving cup 26 before resin recovery. A known load sensor that measures the supplied or recovered liquid resin R.

The resin loader 12 is configured to be movable in the X direction between the release film cutting module 1 , the resin supply module 2 , and each compression molding module 3 on rails.

In addition, the resin loader 12 is configured to be movable in the Y direction within the resin supply module 2 and each compression molding module 3 on rails. The resin loader 12 can transport the release film F cut out by the release film cutting module 1 to the resin supply module 2, and hold the release film F supplied with the liquid resin R by the resin supply mechanism 2A in the resin supply module 2. The film F is transferred to the compression molding die set 3 . In addition, a post-processing mechanism 13 is attached to the resin loader 12 . The post-processing mechanism 13 can remove the used release film F from the compression molding module 3 , and discard the used release film F to a waste part (not shown) located in the release film cutting module 1 .

The resin recovery unit 2B has: a resin receiving cup 26 (an example of a resin receiving member) for receiving the liquid resin R dripped from the nozzle 23b; an arm 27 for holding the resin receiving cup 26; a rotation mechanism 28 for positioning the arm 27 on the XY plane Rotation; and the moving mechanism 29 (back and forth moving mechanism 29a), so that the resin receiving cup 26 located below the nozzle 23b moves following the movement of the nozzle 23b. The resin recovery unit 2B is supported by the casing of the resin supply module 2 . Details about the resin recovery unit 2B will be described later.

The compression molding die set 3 has at least a molding die M and a mold clamping mechanism 35 for closing the molding die M. Details about the compression molding module 3 will be described later.

The transport module 4 transports the pre-resin sealing substrate Sa (substrate before molding) on which the wafer before resin sealing is mounted, and transports the resin-sealed substrate Sb (resin molded product) after resin sealing. The conveying module 4 includes: a substrate loader 41 ; a first container 43 for storing the substrate Sa before resin sealing; a second container 44 for storing the substrate Sb after resin sealing; and a robot arm 45 . The robotic arm 45 can transfer the pre-resin-sealed substrate Sa to the substrate loader 41 in the transfer module 4 . In addition, the robot arm 45 can receive the resin-sealed substrate Sb conveyed from the substrate loader 41 . The substrate loader 41 moves in the X direction and the Y direction within the transport module 4 and each compression molding module 3 .

The delivery module 4 also includes an inspection mechanism (not shown). The inspection mechanism inspects the existence area of the wafer in the substrate S (substrate Sa before resin sealing) which is the molding object in the compression molding module 3 . The inspection mechanism checks whether the wafer actually exists in the area where the wafer is scheduled to be inspected by scanning the laser displacement meter, and stores the location where the wafer exists and the location where the wafer does not exist. Furthermore, the inspection mechanism may image the substrate S with a visible light camera or the like, and inspect the wafer presence area on the substrate S based on the imaged image.

As for the control unit 5, the software for controlling the operation of the resin molding device D includes programs stored in hardware such as HDD (Hard Disk Drive) and memory, and is controlled by an ASIC (Application Specific Integrated Circuit) of a computer. : ASIC), FPGA (Field Programmable Gate Array: Field Programmable Logic Gate Array), CPU (Central Processing Unit: Central Processing Unit) or other hardware processor execution. That is, the control unit 5 includes a processor that executes the flowchart (program) shown in FIG. 6 and the like. The notification part 6 notifies the operation of the resin molding device D, and is composed of a display and a warning light etc. which are arranged on the front surface of the conveying module 4 . In particular, the notification unit 6 in this embodiment can notify the malfunction of the resin recovery unit 2B. In this embodiment, as an example of the control form of the control part 5 and the notification form of the notification part 6, the case related to the operation|movement of the resin supply module 2 is described later.

As shown in FIG. 2 , the compression molding module 3 in this embodiment is composed of a press frame formed by integrating the lower fixed plate 31 and the upper fixed plate 33 with a plate member 32 . A movable platen 34 is provided between the lower fixed disk 31 and the upper fixed disk 33 . The movable platen 34 can move up and down along the plate member 32 . On the lower fixed plate 31, a mold clamping mechanism 35 is provided, which is composed of a ball screw or the like as a device for moving the movable platen 34 up and down. The mold clamping mechanism 35 can close the mold M by moving the movable platen 34 upward, and can open the mold M by moving the movable platen 34 downward. The drive source of the mold clamping mechanism 35 is not particularly limited, and for example, an electric motor such as a servo motor (not shown) can be used.

As the molding die M, an upper die UM and a lower die LM are arranged to face each other, and both are composed of dies and the like. An upper mold holder 39 including an upper heater 37 is disposed on the lower surface of the upper fixed platen 33 , and an upper mold UM is mounted below the upper mold holder 39 . The upper mold UM is provided with an upper mold substrate setting part (not shown) for arranging the substrate S, and the substrate S on which a chip or the like is mounted is mounted on the lower surface of the upper mold UM. A lower mold holder 38 including a lower heater 36 is disposed on the upper surface of the movable platen 34 , and a lower mold LM is provided above the lower mold holder 38 . The resin supply mechanism 2A supplies the liquid resin R coated on the release film F to the lower cavity MC by holding the release film F sucked by a suction mechanism (not shown) in the lower cavity MC. When the mold M is clamped by the mold clamping mechanism 35 and the lower mold LM is heated by the lower heater 36, the liquid resin R in the lower cavity MC is melted and solidified. That is, in a state where the pre-resin-sealed substrate Sa and the release film F as objects to be supplied are placed between the upper mold UM and the lower mold LM, the molding mold M is clamped by the mold clamping mechanism 35, and the resin is processed. seal. Thereby, the chip mounted on the pre-resin-sealed substrate Sa (pre-molding substrate) is resin-sealed in the lower cavity MC to become a resin-sealed substrate Sb (resin molded product). Hereinafter, the side of the molding die M in the Y direction shown in FIG. 1 is referred to as the front (FRONT), and the side of the substrate loader 41 in the Y direction is referred to as the rear (BACK).

In FIGS. 3 to 5 , schematic diagrams of the resin supply mechanism 2A and the resin recovery unit 2B are shown. As mentioned above, the resin recovery unit 2B has the resin receiving cup 26 , the arm 27 , the rotation mechanism 28 , and the movement mechanism 29 . In addition, the resin recovery unit 2B has: a sensing sensor 22 for sensing the presence or absence of the nozzle 23b when the resin receiving cup 26 is moving due to the work of the moving mechanism 29; Location.

As shown in FIGS. 3 to 4 , the resin receiving cup 26 is formed of a bottomed cylindrical translucent cup, and a resin containing space having a bottom area larger than the outer diameter of the case 23 is formed inside when viewed from above. The arm 27 is composed of a long plate-shaped member, has a rotation mechanism 28 at one end, and supports a resin receiving cup 26 at the other end. When the resin supply mechanism 2A supplies the liquid resin R onto the release film F, the arm 27 is located at the cup retracted position Pb (an example of the retracted position) outside the resin supply area of the release film F, and by operating the rotation mechanism 28 , can rotate and move on the cup retreat position Pb and the nozzle retreat position Pa2. As described later, the length of the arm 27 is set so that the arm 27 can move in the resin supply area by the forward and backward movement mechanism 29a following the movement of the nozzle 23b after the resin supply is completed. In this embodiment, the resin supply area is circular in plan view, and the movement of the nozzle 23b after the resin supply is completed is performed linearly from the center of the circle to the outside of the circle, so the length of the arm 27 is the resin receiving cup supported by its other end. 26 is moved by the forward and backward movement mechanism 29a to reach the length of the center of the resin supply area.

The rotation mechanism 28 is configured to rotate the arm 27 around the rotation shaft 28a by a driving source including an electric motor or an air cylinder (not shown), and the rotation shaft 28a and one end of the arm 27 are fixed. The sensing sensor 22 is provided at the other end of the arm 27 near the resin receiving cup 26, and is composed of a known laser sensor or the like that senses the nozzle 23b by irradiation of laser light. That is, by sensing the sensor 22, it can be sensed whether the resin receiving cup 26 is located below the nozzle 23b.

The moving mechanism 29 has a cylinder 29c, includes a forward-backward moving mechanism 29a, and moves the arm 27 straight forward and backward by fluid pressure such as air (an example of fluid) supplied into the cylinder 29c from the front-back direction. The forward and backward movement mechanism 29a makes the resin receiving cup 26 under the nozzle 23b follow the direction of the nozzle 23b. Move while moving. In this embodiment, the forward and backward moving mechanism 29a makes the arm 27 at the central position Pa1 (an example of the first position in the resin supply area) where the resin receiving cup 26 is located below the nozzle 23b that has completed the resin supply, and the resin receiving cup. 26 moves straight in the Y direction within the range of the nozzle retraction position Pa2 (an example of the second position outside the resin supply region) located below the nozzle 23b retracted to outside the resin supply region of the release film F. That is, the resin receiving cup 26 is configured to be rotatable on the XY plane between the nozzle retreat position Pa2 and the cup retreat position Pb (retreat position), and is configured to be able to follow the nozzle 23b between the center position Pa1 and the nozzle retreat position Pa2. It moves straight away. The position sensors 30a and 30b are composed of known photoelectric sensors, etc., and send a signal if the arm 27 is sensed, and stop sending a signal if the arm 27 is not sensed. The position sensors 30a and 30b in this embodiment are respectively provided at the moving start end of the arm 27 of the resin receiving cup 26 at the central position Pa1 and at the moving end of the arm 27 of the resin receiving cup 26 at the nozzle retreat position Pa2.

FIG. 4 shows a schematic side view of the resin recovery unit 2B when the resin receiving cup 26 is located at the central position Pa1. As shown in FIG. 4, the moving mechanism 29 further includes a vertical movement mechanism 29b for moving the arm 27 up and down by fluid pressure such as air.

In FIG. 5 , a side view (upper part) and a top view (lower part) showing the outline of the liquid shutoff operation of the nozzle 23b are shown. As shown in the upper part of the central figure of FIG. 5 , the front end portion of the nozzle 23b that has completed supplying the resin to the resin supply area of the release film F is blocked by the clamping mechanism 21b. At this time, the liquid resin R may remain in a stringy state or a block state at the front end of the nozzle 23b. Therefore, when the resin supply mechanism 2A finishes supplying the liquid resin R to the release film F, the rotary mechanism 28 and the moving mechanism 29 are used to move the resin receiving cup 26 below the nozzle 23b, and recover the residual liquid in the nozzle 23b to the resin receiving cup. Within 26. Here, the residual liquid in the nozzle 23b is the unnecessary liquid resin R dripped from the front end of the nozzle 23b after the supply of the resin is completed.

Next, as shown in the right diagram of FIG. 5 , the nozzle 23b is moved to the nozzle retreat position outside the resin supply area of the release film F by using the driving force of the servo motor Mo of the resin supply mechanism 2A. Pa2, and utilize the fluid pressure of the air supplied to the cylinder 29c of the forward-backward movement mechanism 29a to make the resin receiving cup 26 located below the nozzle 23b move following the movement of the nozzle 23b. At this time, the control unit 5 is based on the difference in sensing time between the movement start of the arm 27 sensed by one position sensor 30a and the movement end of the arm 27 sensed by the other position sensor 30b ( Arm 27 moving time), adjust the fluid pressure of the air supplied to the cylinder 29c, so that the moving speed of the resin receiving cup 26 calculated in advance and the moving speed of the nozzle 23b become the same speed (also refer to FIG. 3 ). That is, the control unit 5 adjusts the fluid pressure of the air supplied into the cylinder 29c such that the moving speed of the arm 27 calculated based on the detection results of the position sensors 30a and 30b is equal to the moving speed of the nozzle 23b. Specifically, the time T taken to move the nozzle 23b from the center position Pa1 to the nozzle retreat position Pa2 is calculated, and the air is adjusted based on the time T so that the arm 27 moves from the center position Pa1 to the nozzle retreat position Pa2. As mentioned above, the movement of the arm 27 from the center position Pa1 to the nozzle retreat position Pa2 is sensed by the two sensors 30a, 30b.

In this way, the resin receiving cup 26 for receiving the liquid resin R is moved under the nozzle 23b by the forward and backward movement mechanism 29a following the movement of the nozzle 23b.

With this forward and backward movement mechanism 29a, the nozzle 23b can be retracted from the resin supply area while receiving the residual liquid of the nozzle 23b with the resin receiving cup 26 after the resin supply by the resin supply mechanism 2A is completed. As a result, the residual liquid of the nozzle 23b does not fall on the release film F, and it becomes a favorable resin supply state. In addition, after the nozzle 23b is blocked by the clamping mechanism 21b, the nozzle 23b is retracted from the resin supply area on the release film F while receiving the residual liquid of the nozzle 23b with the resin receiving cup 26 by the forward and backward movement mechanism 29a, so that the nozzle is eliminated. 23b is in the drawing state and the residual liquid is also recovered, so it is highly efficient. Furthermore, even in the state where the liquid resin R flows out without the clamping mechanism 21b, the liquid resin R can be recovered by the resin receiving cup 26, and the liquid resin R is prevented from falling to the resin supply area.

[Manufacturing method of resin molded products]

A method of manufacturing a resin molded product will be described mainly using FIG. 6 .

First, as shown in FIG. 1 , the pre-resin-sealed substrate Sa delivered from the first container 43 by the robot arm 45 is placed on the substrate loader 41 . At this time, the inspection mechanism inspects in advance the region where the wafer or the like exists in the substrate S (substrate Sa before resin sealing) which is the object to be molded. The control unit 5 calculates (or sets) the target supply amount and the target amount of the liquid resin R in the resin supply area of the release film F based on at least the size of the substrate S as the molding object and the area where the wafers in the substrate S exist. Supply position (resin supply rail). In addition, the release film F transferred from the release film cutting die set 1 is adsorbed and held on the upper surface of the table 20 by the suction mechanism, thereby supplying the release film F as the object to be supplied to the resin supply mechanism 2A ( #61). Next, the control unit 5 moves the dispenser unit 21a equipped with the cartridge 23 of the resin supply mechanism 2A based on the calculated target supply amount and target supply position, and supplies the liquid resin R onto the release film F from the nozzle 23b (# 62, resin supply step).

Next, after the nozzle 23b (dispenser unit 21a) reaches the end along the resin supply rail, the controller 5 moves the nozzle 23b above the central position Pa1. Then, the clamping mechanism 21b is operated to block the nozzle 23b (refer to the upper part of the left figure in FIG. 5), and then the dispenser unit 21a (nozzle 23b) is moved up and down to cut off the liquid resin R. Then, the control unit 5 determines whether the supply amount of the liquid resin R on the release film F measured by the weight sensor 25 has reached the target supply amount, that is, whether the resin supply has been completed (#63). When the supply amount of the liquid resin R on the release film F has not reached the target supply amount (No in #63), the control unit 5 activates the clamping mechanism 21b to open the nozzle 23b, and makes the resin supply mechanism 2A reach the target supply amount. The liquid resin R of the difference between the supply amount and the supply amount of the liquid resin R on the release film F (that is, the insufficient portion of the resin supply amount) is supplied to the center of the resin supply area on the release film F (#62). On the other hand, when the supply amount of the liquid resin R on the release film F becomes the target supply amount (YES in #63), the control part 5 complete|finishes resin supply.

Immediately after the supply of the resin is completed, the control unit 5 operates the rotation mechanism 28 to rotate and move the arm 27 equipped with the resin receiving cup 26 from the cup retreat position Pb (retreat position) to the nozzle retreat position Pa2 (second position), and then, Make the forward and backward moving mechanism 29a work, and make the arm equipped with the resin receiving cup 26 27 moves straight from the nozzle retreat position Pa2 to the center position Pa1 which becomes the lower part of the nozzle 23b (#64, refer to the center figure of FIG. 5). At this time, the control unit 5 operates the dispenser unit 21a or the vertical movement mechanism 29b as needed, and adjusts the height of the nozzle 23b or the arm 27 so that the resin receiving cup 26 does not collide with the nozzle 23b. When the sensor 22 detects that the nozzle 23b detects that the resin receiving cup 26 is not located under the nozzle 23b, the notification unit 6 notifies the malfunction of the resin recovery unit 2B.

Then, the control unit 5 operates the forward and backward movement mechanism 29a, and the arm 27 equipped with the resin receiving cup 26 located below the nozzle 23b follows the movement of the nozzle 23b based on the driving force of the servo motor Mo of the resin supply mechanism 2A, from the center position to the center position. Pa1 (within the resin supply area) moves straight to the nozzle retreat position Pa2 (outside the resin supply area) (#65, resin recovery step, refer to the right diagram of Fig. 5). During this movement, the control unit 5 is based on the difference between the movement start of the arm 27 sensed by one position sensor 30a and the sensing time of the movement end of the arm 27 sensed by the other position sensor 30b. difference, calculate the moving speed of the resin receiving cup 26, and pre-adjust the fluid pressure of the air supplied to the cylinder 29c (refer to FIG. The movement of the nozzle 23b moves. Thereby, when the nozzle 23b moves, the residual liquid of the nozzle 23b will be prevented from dripping on the release film F carelessly further. Assuming that the moving speed of the resin receiving cup 26 is not within a predetermined range when the forward and backward movement mechanism 29a is in operation, the notification unit 6 notifies the malfunction of the resin recovery unit 2B. In addition, as a result of sensing by the sensing sensor 22, when the resin receiving cup 26 is not located below the nozzle 23b, the notification unit 6 notifies the malfunction of the resin recovery unit 2B. After the nozzle 23b reaches the nozzle retreat position Pa2, the control unit 5 rotates and moves the arm 27 equipped with the resin receiving cup 26 to the cup retreat position Pb using the rotation mechanism 28 (#66). Specifically, the control unit 5 operates the rotation mechanism 28 to rotate and move the arm 27 on which the resin receiving cup 26 is mounted from the nozzle retreat position Pa2 (second position) to the cup retreat position Pb (retreat position).

Next, as shown in FIGS. 1 to 2 , the control unit 5 first supplies the pre-resin-sealed substrate Sa to the upper mold UM using the substrate loader 41, and then holds the release film F supplied with the liquid resin R in the resin loader 12. And transferred to the compression molding die set 3, and supplied to the lower mold LM.

That is, the substrate Sa before resin sealing is arranged on the upper mold UM, and the release film F is arranged on the lower mold LM. Then, the upper mold UM and the lower mold LM are clamped by the clamping mechanism 35, and the resin-sealed substrate Sb is resin-molded (#67, resin molding step). After the resin molding is completed, use the substrate loader 41 to transport the resin-sealed substrate Sb from the compression molding module 3 to the delivery module 4, and the robot arm 45 receives the resin-sealed substrate Sb from the substrate loader 41 and stores it in the first Two receiving parts 44 (refer to FIG. 1 ). The control unit 5 determines whether to continue the supply of the liquid resin R on the release film F, and if the resin supply is to be continued (Yes in #68), the control up to #61~#67 is executed, and if the resin supply is not to be continued ( No in #68) to end.

[another embodiment]

Hereinafter, for easy understanding, the same terms and symbols will be used for the same members as those in the above-mentioned embodiment.

<1> In the above-mentioned embodiment, the resin receiving member is constituted by the bottomed cylindrical resin receiving cup 26, but as long as it is a member that receives the residual liquid of the nozzle 23b, it can also be composed of a plate-shaped member, etc., without special limitation. . In addition, the resin receiving cup 26 may be placed in an inclined posture, and a drip prevention flange may be provided on the lower part of the resin receiving cup 26 so that the residual liquid of the nozzle 23b in a broken state does not adhere to the resin receiving cup 26. side.

<2> In the above-mentioned embodiment, the resin supply mechanism 2A and the resin recovery unit 2B are composed of different drives, but they may be integrally driven by, for example, the driving force of one electric motor. In this case, it is preferable to arrange|position the resin receiving cup 26 so that it may adjoin the discharge mechanism 21 from a viewpoint of downsizing of an apparatus.

<3> In the above-mentioned embodiment, the resin receiving cup 26 at the cup retreat position Pb is arranged on the rear side and the rotating shaft 28a is arranged on the front side, but the resin receiving cup 26 at the cup retreat position Pb may also be arranged on the On the front side, the rotating shaft 28a is arranged on the rear side. In this case, by operating the rotation mechanism 28, the resin receiving cup 26 can be moved from the cup retreat position Pb (retreat position) to the central position Pa1 (first position) at one time, and the movement operation of the arm 27 can be simplified.

<4> In the above-mentioned embodiment, after the resin supply is completed, the resin receiving cup 26 is arranged below the nozzle 23b, and the forward and backward movement mechanism 29a follows the movement of the nozzle 23b that has completed the resin supply, so that the resin receiving cup equipped with The arm 27 of 26 moves straight along the Y direction, but it is also possible to arrange the resin receiving cup 26 below the nozzle 23b at the moment when the resin is to be cut during the resin supply, so that the resin receiving cup 26 moves following the nozzle 23b. For example, in the case of discontinuously supplying the resin onto the release film F, when the dispenser unit 21a (nozzle 23b) moves to the next resin supply position, the resin receiving unit equipped with it may follow the movement of the nozzle 23b. The arm 27 of the cup 26 moves. In addition, when a plurality of coating lines exist in parallel on the release film F, the forward and backward movement mechanism 29a can also make the arm 27 equipped with the resin receiving cup 26 move from the end point of one coating line to the next coating line. The starting point moves straight along the Y direction.

<5> In this embodiment, the up and down moving mechanism 29b can also move up and down following the dispenser unit 21a (nozzle 23b), that is, under the condition that the distance between the nozzle 23b and the resin receiving cup 26 is constant, the device equipped with The arm 27 of the resin receiving cup 26 moves up and down. If the distance between the nozzle 23b and the resin receiving cup 26 is kept constant by the up-and-down movement mechanism 29b, when the nozzle 23b is moved up and down to cut off the liquid, the liquid resin R can be reliably prevented from flying to the outside of the resin receiving cup 26 and causing damage. There is a problem of dripping onto the release film F.

<6> In the above embodiment, the discharge mechanism 21 of the resin supply mechanism 2A is vertical (Z direction), but the discharge mechanism 21 of the resin supply mechanism 2A may be horizontal (Y direction).

<7> As shown in Figure 3, the moving mechanism (back and forth moving mechanism 29a) in the above-mentioned embodiment makes the resin receiving member (resin receiving cup 26) in the first position (central position Pa1) in the resin supply area and the resin supply Move straight between the second position (nozzle retreat position Pa2) outside the area. However, the first position may be any position as long as it is within the resin supply area, and similarly, the second position may be any position as long as it is outside the resin supply area. In addition, the forward and backward movement mechanism 29a may also follow the arc movement of the nozzle 23b or meandering movement instead of the straight movement.

<8> In the above-mentioned embodiment, the release film cutting module 1 and the resin supply module 2 are respectively provided, and are configured as two modules, but the release film cutting module 2 may also be provided inside the resin supply module 2. The mechanism is configured as a module.

<9> The substrate S in the above-mentioned embodiment may be in any shape such as a circle or a rectangle. The size of the substrate S is not particularly limited, and a large-sized substrate (for example, 300 mm in diameter, 300 mm square, etc. the substrate).

<10> In the above-mentioned embodiment, the compression method of die down was described, but it can also be used as the compression method of die up, in which molded objects such as substrates are made of resin The object to be supplied of the resin is supplied in the supply mechanism 2A. In addition, the mold release film F may be omitted, and the molding die M may be used as a supply object for supplying the resin in the resin supply mechanism 2A.

[Summary of the above-mentioned embodiment]

Hereinafter, the outline of the resin molding apparatus D demonstrated in the said embodiment, the manufacturing method of a resin molded article, and the resin material supply method is demonstrated.

(1) The characteristic configuration of the resin molding device D is as follows. The resin molding device D includes: a resin supply mechanism 2A including a nozzle 23b for discharging liquid resin R to a supply object (release film F); a resin recovery unit 2B, There is a resin receiving member (resin receiving cup 26) for receiving liquid resin R dripped from the nozzle 23b, and the resin receiving member located below the nozzle 23b follows the nozzle 23b. The moving mechanism 29 that moves and moves (back and forth moving mechanism 29a); Forming mold M includes upper mold UM and lower mold LM opposite to upper mold UM; Clamping mechanism 35 disposes the supply object on upper mold UM and upper mold UM. In the state between the lower molds LM, the molding mold M is clamped; and the control unit 5 controls at least the operation of the resin supply mechanism 2A and the resin recovery unit 2B.

The higher the viscosity of the liquid resin R is, the longer the drawing state of the nozzle 23b is maintained after the resin supply mechanism 2A stops supplying the resin, so the residual liquid in the nozzle 23b falls to the release film F, and the resin is supplied to the release film F. The state (resin supply amount and resin supply position) varies. In this configuration, the resin receiving cup 26 for receiving the liquid resin R is positioned below the nozzle 23b, and the resin receiving cup 26 is moved following the movement of the nozzle 23b by the forward and backward movement mechanism 29a.

With this forward and backward movement mechanism 29a, after the resin supply mechanism 2A stops the resin supply, the nozzle 23b can be retracted from the resin supply area while receiving the residual liquid of the nozzle 23b with the resin receiving cup 26. As a result, the residual liquid of the nozzle 23b does not fall on the release film F, and it becomes a favorable resin supply state. In this manner, it is possible to provide a resin molding device D capable of supplying the liquid resin R to a supply object with high precision.

(2) It is also possible that the resin recovery unit 2B also has an arm 27 for holding the resin receiving member (resin receiving cup 26), and the resin supply mechanism 2A has a motor (servo motor Mo), and the nozzle 23b is moved by the driving force of the motor, and moves The mechanism (back and forth movement mechanism 29a) has a cylinder 29c, and the arm 27 moves by the fluid pressure of the fluid supplied into the cylinder 29c, thereby moving the resin receiving member.

If the arm 27 that holds the resin receiving cup 26 is moved by the fluid pressure supplied into the cylinder 29c as in this configuration, it will be driven differently from the servo motor Mo of the resin supply mechanism 2A, so the resin recovery unit 2B can be retrofitted. . In addition, the resin recovery unit 2B can be configured inexpensively if it is a driving form based on fluid pressure.

(3) It is also possible that the resin recovery unit 2B also has a rotating mechanism 28 that rotates the arm 27, and the moving mechanism (back and forth moving mechanism 29a) makes the resin receiving member (resin receiving cup 26) move in the resin Directly move between the first position (central position Pa1) in the supply area and the second position (nozzle retreat position Pa2) outside the resin supply area, and the rotation mechanism 28 rotates the arm 27 so that the resin receiving member is at the retreat position (cup retreat position). position Pb) and the first position or the second position.

If, as in this configuration, the resin receiving cup 26 is moved to the center position Pa1, the nozzle retracted position Pa2, or the cup retracted position Pb by operating the rotating mechanism 28 and the forward and backward moving mechanism 29a, it is completed by using the resin supply mechanism 2A. After the resin is supplied, the resin receiving cup 26 located at the cup retreat position Pb can be quickly positioned below the nozzle 23b in the resin supply area (center position Pa1). As a result, the residual liquid of the nozzle 23b can be reliably recovered.

(4) It is also possible that the resin recovery unit 2B further has at least two position sensors 30a, 30b respectively arranged at the moving start end and the moving end of the arm 27, and the control unit 5 adjusts the fluid pressure so that the position sensor The moving speed of the resin receiving member (resin receiving cup 26 ) calculated from the detection results of 30a and 30b is equal to the moving speed of the nozzle 23b.

When the retraction speed of the nozzle 23b to the outside of the resin supply area is constant, if the fluid pressure is adjusted as in this configuration, the moving speed of the resin receiving cup 26 calculated based on the detection results of the position sensors 30a and 30b is the same as that of the nozzle. When the moving speed of 23b becomes constant, the state where the resin receiving cup 26 exists under the nozzle 23b can be well maintained with a simple control form.

(5) It is also possible that the resin recovery unit 2B further has a sensing sensor 22 for sensing the nozzle 23b, and the sensing sensor 22 senses the nozzle 23b when the resin receiving member (resin receiving cup 26) is moving.

If the sensing sensor 22 senses the nozzle 23b when the forward and backward movement mechanism 29a is working as in this configuration, the resin receiving cup 26 can reliably receive the residual liquid of the nozzle 23b.

(6) The method of manufacturing a resin molded product using the above-mentioned resin molding device is characterized in that the method of manufacturing a resin molded product includes: a resin supply step, using the resin supply mechanism 2A to supply the target object (release film F) Supply liquid resin R; Resin recovery step, in the resin In the supply step, after the liquid resin R is supplied to the object to be supplied, the resin recovery unit 2B is used to recover the liquid resin R dripped from the nozzle 23b; and in the resin molding step, resin molding is performed using the liquid resin R supplied in the resin supply step .

In this method, the residual liquid in the nozzle 23b is recovered in the resin recovery step, so that the residual liquid in the nozzle 23b does not fall on the release film F, and the state of supplying the resin to the release film F (resin supply amount and resin supply position) become good. In this manner, it is possible to provide a method of manufacturing a resin molded article capable of supplying the liquid resin R to a supply object with high precision.

Industrial availability

The present invention can be used for a resin molding device and a method for manufacturing a resin molded product.

1: Release film cutting module

11: Resin container

12: Resin loader

13: post-processing mechanism

14: roll film

15: Membrane gripper

16: Membrane loading mechanism

2: Resin supply module

2A: Resin supply mechanism

2B: Resin recovery unit

20:Workbench

21: discharge mechanism

21a: Dispenser unit

21b: clamping mechanism

23: box

23a: Syringe

23b: Nozzle

25: Weight sensor

26: Resin receiving cup

27: arm

28: Rotary mechanism

29: Mobile Mechanism

3: Compression molding module

35: Clamping mechanism

4: Conveyor module

41: Substrate loader

43: The first containment department

44: Second storage part

45: Mechanical arm

5: Control Department

6: Notification Department

D: Resin molding device

F: Release film (supplied object)

LM: lower mold

M: forming mold

MC: lower cavity

Mo: servo motor (motor)

R: liquid resin

S: Substrate

Sa: Resin-sealed front substrate

Sb: substrate sealed with resin

Claims (5)

A resin molding device, comprising: a resin supply mechanism including a nozzle for discharging liquid resin to a supply object, and a motor for moving the nozzle with the driving force of the motor; The resin receiving member for the aforementioned liquid resin and the moving mechanism for moving the aforementioned resin receiving member located below the aforementioned nozzle following the movement of the aforementioned nozzle, and having an arm for holding the aforementioned resin receiving member, the aforementioned moving mechanism has a cylinder, and the aforementioned arm The fluid pressure of the fluid supplied to the cylinder is used to move, thereby moving the resin receiving member; the forming mold includes an upper mold and a lower mold opposed to the upper mold; Clamping the forming mold in a state where the object is arranged between the upper mold and the lower mold; and a control unit controlling at least the operation of the resin supply mechanism and the resin recovery unit. The resin molding device according to claim 1, wherein the resin recovery unit further has a rotation mechanism for rotating the arm, and the moving mechanism makes the resin receiving member a first position in the resin supply area and a second position outside the resin supply area. Directly moving between positions, the rotation mechanism rotates the arm to move the resin receiving member between the retracted position and the first position or the second position. The resin molding device according to claim 1 or 2, wherein the resin recovery unit further has at least two position sensors respectively arranged at the moving start end and the moving end of the arm, The control unit adjusts the fluid pressure so that the moving speed of the resin receiving member calculated based on the detection results of each of the position sensors and the moving speed of the nozzle become equal. The resin molding device according to claim 1 or 2, wherein the resin recovery unit further has a sensing sensor for sensing the nozzle, and the sensing sensor senses the nozzle when the resin receiving member is moving. . A method of manufacturing a resin molded product, which uses the resin molding device described in any one of Claims 1 to 4, the method of manufacturing the resin molded product includes: a resin supply step, using the resin supply mechanism to supply the object to be supplied supplying the liquid resin; a resin recovery step of recovering the liquid resin dripped from the nozzle using the resin recovery unit after the liquid resin is supplied to the object to be supplied in the resin supplying step; and a resin molding step of using the The aforementioned liquid resin supplied in the resin supply step is used for resin molding.

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