TWI780813B - Electrical testing carrier board device with shielding effect - Google Patents

Abstract

An electrical detection carrier device with shielding effect, comprising at least one constituent unit, each constituent unit comprising a first insulating layer, a first conductive layer attached to the first insulating layer, and a first insulating layer attached to the The first signal layer on the other side of the first insulating layer. The first insulating layer defines at least one first through hole extending from the first base plane to the second base plane. The first signal layer includes a plurality of first ground elements electrically connected to the first conductive layer through the at least one first through hole, and a plurality of first communication elements spaced apart from the first ground elements. Since the first grounding elements are electrically connected to the first conductive layer of the entire layer structure, the signal transmission of the first communication elements can be shielded by the first conductive layer, thereby optimizing the performance of electrical detection, Useful for performing high frequency tests.

Description

Electrical detection carrier board device with shielding effect

The invention relates to an electrical property detection device, in particular to an electrical property detection carrier board device with shielding effect.

Electrical Interposer is a device used to implement the electronic components to be tested, which can respond to the quality inspection of integrated circuits (IC), printed circuit boards (PCB), or other forms of electronic components. Due to the rapid changes in the technology of related industries, not only the detection performance must be able to meet the technical level, but also the requirements for detection efficiency are also increasing. At present, when performing electrical testing, if you want to improve the detection efficiency, you usually increase the test frequency to perform high-speed detection. However, while increasing the test frequency, it will inevitably be accompanied by noise that affects the signal transmission of other test pairs (Diffrential Pair). News. Therefore, how to solve the problem of noise affecting electrical signal conduction becomes the key to optimize detection performance and improve test efficiency at the same time.

Therefore, the object of the present invention is to provide a device capable of responding to high-speed detection An electrical detection carrier board device with shielding effect.

Therefore, the electrical detection carrier device with shielding effect of the present invention includes at least one constituent unit. Each constituent unit includes a first insulating layer, a first conductive layer attached to the first insulating layer, and a first signal layer attached to the first insulating layer.

The first insulating layer includes a first base, and a second base opposite to the first base, and defines at least one first through hole extending from the first base to the second base . The first conductive layer is attached to the first base surface, and the first signal layer is attached to the second base surface.

The first signal layer includes a plurality of first ground elements electrically connected to the first conductive layer through the at least one first through hole, and a plurality of first communication elements spaced apart from the first ground elements.

The effect of the present invention is that: the first grounding elements are electrically connected to the first conductive layer, enabling the first conductive layer to form a ground plane of the entire layer structure, so that the electrical properties are transmitted through the first communication elements. When detecting signals, shielding can be formed by the first conductive layer, so as to optimize the performance of electrical detection, and thus facilitate the implementation of high-frequency testing.

100: constituent unit

101:Intermediate insulation board

102: Package board

21: The first insulating layer

210: the first through hole

211: The first base

212: second base

22: The first conductive layer

220: through hole

23: The first signal layer

231: The first grounding piece

232: First communication

233: Conductor

239: Internal connection

290: The first hollow area

291: First base

292: The first connecting part

3: Substrate layer

41: Second conductive layer

42: Second insulating layer

420: second through hole

421: The third base

422: The fourth base

43: The second signal layer

431: Second grounding piece

432:Second summons

490: The second hollow area

491:Second Base

492: The second connecting part

51: Inner insulating layer

510: Inner through hole

52: Internal signal layer

520: shielded area

521:Path routing

71: Components under test

72: Drive element

Other features and effects of the present invention will be clearly presented in the implementation manner with reference to the drawings, wherein: Fig. 1 is a perspective view illustrating a first embodiment of the electrical detection carrier device with a shielding effect of the present invention; Fig. 2 is an exploded perspective view illustrating a plurality of constituent units of the first embodiment; Fig. 3 is a A side view illustrating a plurality of intermediate insulating plates and two packaging plates of the first embodiment; FIG. 4 is a partially enlarged perspective view illustrating a first insulating layer and a first signal layer of each constituent unit; FIG. 5 It is a partially enlarged cross-sectional view illustrating the shielding effect produced by the first signal layer and the first conductive layer of each constituent unit; FIG. 6 is a schematic diagram illustrating the first embodiment, a device under test and a driver The use of the electrical connection of the components; Fig. 7 is a three-dimensional exploded view illustrating a second embodiment of an electrical detection carrier device with a shielding effect; and Fig. 8 is a partially enlarged perspective view illustrating the second embodiment the first signal layer.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

Referring to Fig. 1 and Fig. 2, it is the electrical detection carrier plate with shielding effect of the present invention One of the first embodiment of the device, this first embodiment comprises three constituent units 100 arranged at intervals, two intermediary insulating plates 101 respectively interposed between two adjacent constituent units 100, and two respectively arranged The packaging boards 102 outside the two outermost constituent units 100 . It should be explained in advance that in the first embodiment, although the case of three constituent units 100 is used for illustration, in actual implementation, an appropriate number can be matched according to the specifications of the components to be tested, or even a specific number can be used. The types of the constituent units 100 and the appropriate number of the intermediate insulating plates 101 are not limited to the types presented in the first embodiment.

2 and 3, each constituent unit 100 includes a first insulating layer 21, a first conductive layer 22 attached to one side of the first insulating layer 21, a first conductive layer 22 attached to the first insulating layer 21. The first signal layer 23 on the other side, a substrate layer 3 attached to the side of the first conductive layer 22 away from the first insulating layer 21, a substrate layer 3 attached to the substrate layer 3 opposite to the first conductive layer A second conductive layer 41 on one side of the layer 22, a second insulating layer 42 attached to the other side of the second conductive layer 41, and a second insulating layer 42 attached to the second insulating layer 42 away from the second conductive layer 41 The second signal layer 43 on one side.

3 and 4, the first insulating layer 21 includes a first base 211, and a second base 212 opposite to the first base 211, and defines a plurality of bases from the first base 211 The first through hole 210 extending to the second base surface 212 . The first conductive layer 22 and the first signal layer 23 are attached to the first base surface 211 and the second base surface 212 respectively. Similarly, the second insulating layer 42 includes a first contact with the second conductive layer 41 Three base surfaces 421 and a fourth base surface 422 opposite to the third base surface 421 define a plurality of second through holes 420 extending from the third base surface 421 to the fourth base surface 422 . That is, the second conductive layer 41 and the second signal layer 43 are attached to the third base surface 421 and the fourth base surface 422 respectively.

The first signal layer 23 includes a plurality of first ground members 231 electrically connected to the first conductive layer 22 through the first through holes 210, and a plurality of first ground members 231 spaced apart from the first ground members 231. Subpoena 232. Each first ground member 231 has a first base 291 surrounding the first hollow area 290 defining a position corresponding to the individual first through hole 210, and a first base portion 291 disposed in the individual first through hole 210 and connected to the first through hole 210. The first connecting portion 292 of the first conductive layer 22 . The first connecting portion 292 is a ring embedded in the first hollow area 290 and completely surrounds the first hollow area 290 . The second signal layer 43 includes a plurality of second ground members 431 electrically connected to the second conductive layer 41 through the second through holes 420, and a plurality of second ground members 431 spaced apart from the second ground members 431. Subpoena 432. Each second ground member 431 has a second base portion 491 surrounding a second hollow area 490 that defines a position corresponding to an individual second through hole 420, and a second base portion 491 disposed in the individual second through hole 420 and connected to the second through hole 420. The second connection portion 492 of the second conductive layer 41 . The second connecting portion 492 is a ring embedded in the second hollow area 490 and completely surrounds the second hollow area 490 .

It should be particularly noted that, in each constituent unit 100, the opposite sides of the substrate layer 3 substantially present the same structure that is symmetrical to each other, mainly to match the unit under test. In this way, a "multi-layer" test module is constructed, but in terms of simple electrical conduction, if the first conductive layer 22, the first insulating layer 21, the first signal layer 23 is a group of electrically conductive structures, and the second conductive layer 41, the second insulating layer 42, and the second signal layer 43 are a group of electrically conductive structures, and only one of the structures is actually required to achieve communication. And the electrical conduction function of grounding.

Illustrated with a single set of electrical conduction structure, in the first signal layer 23, a pair of adjacent first communication elements 232 are used to form a signal pair for back and forth signals, and with the one pair of first communication elements 232 A first grounding element 231 immediately adjacent to the element 232 will correspondingly play the role of grounding, so as to form a complete electrical test path with the pair of first communication elements 232 . The distribution of the contact points of the first communication elements 232 and the first ground elements 231 can of course be configured according to the requirements of the device under test, and is not limited to the configuration in the first embodiment.

Specifically, the packaging boards 102 are made of insulating material, the main purpose is to shield the first signal layer 23 or the second signal layer 43 located on the opposite outside, and to package the first embodiment into a mold. The modularized device is convenient for modular assembly with other equipment of the detection system as a whole.

Referring to FIG. 5 and in conjunction with FIG. 4 , as far as a single constituent unit 100 is concerned, it is also illustrated by a single group of electrically conductive structures on one side of the substrate layer 3. The first conductive structures passing through the first insulating layer 21 hole 210, the first connecting portion 292 of each first grounding member 231 can reach the first conductive layer 22 through the corresponding first through hole 210 The electrical connection can also form a shield in the conduction direction of the first through hole 210 by itself presenting a ring-shaped closed type, and cooperate with the first conductive layer 22 and the first grounding members 231 to electrically Connecting to form a ground plane can also achieve a shielding effect.

Referring to FIG. 5 and FIG. 6 at the same time, FIG. 6 presents the use of the first embodiment to achieve electrical connection with a device under test 71 and a driving device 72 on opposite sides. Specifically, using the first embodiment A grounding piece 231, the second grounding pieces 431, the first communication pieces 232, and the arms extending outwards of the second communication pieces 432 are respectively connected to the interface of the device under test 71 and the driving element 72. The points are electrically connected, and by confirming the transmission of electrical signals, testing can be performed on the DUT 71 . When performing detection, under the condition that the multi-directional electrical conduction can be shielded, the signals conducted in the first communication pieces 232 and the second communication pieces 432 are less likely to be interfered by noise, and thus the detection can be improved. frequency, which facilitates high-speed detection.

Referring to FIG. 7 and FIG. 8, it is a second embodiment of the electric detection carrier device with shielding effect of the present invention. For one of the two opposite sides of the substrate layer 3 (see FIG. 2 or FIG. 3), The difference between the second embodiment and the first embodiment is that the first conductive layer 22 defines a plurality of through holes 220 corresponding to the first through holes 210 respectively, and each constituent unit 100 also includes a sticker An inner insulating layer 51 attached to the side of the first conductive layer 22 away from the first insulating layer 21, and an inner signal layer 52 attached to the side of the inner insulating layer 51 opposite to the first conductive layer 22 . Wherein, the inner insulating layer 51 surrounds and defines a plurality of inner through holes 510 corresponding to the through holes 220 respectively, and the inner signal layer 52 It includes a plurality of routing lines 521 formed on the surface facing the inner insulating layer 51 and surrounding a closed shielding area 520 . The first signal layer 23 also includes a plurality of vias connected to the inner signal layer 52 in the shielding regions 520 through the first through holes 210, the through holes 220, and the inner through holes 510. Item 233.

Specifically, the routing wiring 521 can be formed by metal deposition, as long as it can form a closed line on the inner signal layer 52, and surround the corresponding first through holes 210, the through holes 220, and the inner signal layers. The position of the through hole 510 is enough to form the required shielding regions 520 , and the type is not limited to the path shown in FIG. 7 .

Each via 233 has an inner connection portion 239 extending toward the first through holes 210 , the through holes 220 , and the inner through holes 510 and connected to the inner signal layer 52 . The internal connecting portion 239 not only allows the conductive members 233 to form an electrical connection with the internal signal layer 52 through the first through holes 210, the through holes 220, and the internal through holes 510, In this way, signal transmission between layers is achieved, and because the positions where the inner vias 239 contact the inner signal layer 52 are all within the shielded regions 520 surrounded by the routing lines 521, therefore The shielding effect can also be formed by the routing wirings 521 to optimize the detection performance in the signal transmission of the vias 233 , which is beneficial to perform high-speed detection.

To sum up, the electrical detection carrier device with shielding effect of the present invention can be connected to the first conductive layer 22 and the second When the conductive layer 41 achieves an electrical connection, it forms a ground plane Even using the first grounding elements 231, the second grounding elements 431, and the vias 233, shielding is also formed in the layer-to-layer conduction, so as to avoid electrical signal Objects subject to noise interference are also beneficial to perform high-frequency detection and improve detection efficiency. Therefore, can really reach the purpose of the present invention.

But what is described above is only an embodiment of the present invention, and should not limit the scope of the present invention. All simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by the patent of the present invention.

100: constituent unit

101:Intermediate insulation board

102: Package board

21: The first insulating layer

210: the first through hole

212: second base

23: The first signal layer

231: The first grounding piece

232: First communication

3: Substrate layer

Claims (10)

An electrical detection carrier device with shielding effect, comprising at least one constituent unit, each constituent unit comprising: A first insulating layer, including a first base, and a second base opposite to the first base, and defining at least one first via extending from the first base to the second base hole; a first conductive layer attached to the first base surface of the first insulating layer; and A first signal layer, attached to the second base surface of the first insulating layer, and including a plurality of first grounding elements electrically connected to the first conductive layer through the at least one first through hole, and a plurality of a first communication member spaced apart from the first grounding members. The electrical detection carrier device with shielding effect as described in claim 1, wherein each first ground member of the first signal layer has a first through hole arranged in an individual one and connected to the first conductive The first connection part of the layer. The electrical detection substrate device with shielding effect as described in claim 2, wherein each first ground member of the first signal layer has a first hollow area surrounding and defining a position corresponding to an individual first through hole The first base part, the first connection part is a ring embedded in the first hollow area and completely surrounds the first hollow area. The electrical detection carrier device with shielding effect as described in Claim 1 comprises a plurality of constituent units, and a plurality of intermediate insulating plates respectively arranged between two adjacent constituent units. The electrical detection carrier device with shielding effect as described in claim 4, wherein each constituent unit also includes: a substrate layer attached to a side of the first conductive layer away from the first insulating layer; a second conductive layer attached to the side of the substrate layer opposite to the first conductive layer; A second insulating layer, attached to the second conductive layer and including a third base surface contacting the second conductive layer, and a fourth base surface opposite to the third base surface, and defining at least one self- the third base extends to the second through hole of the fourth base; and A second signal layer, attached to the fourth base surface of the second insulating layer, and including a plurality of second grounding elements electrically connected to the second conductive layer through the at least one second through hole, and a plurality of a second communication piece spaced apart from the second grounding pieces. The electrical detection carrier device with shielding effect as described in claim 5, wherein, each second ground member of the second signal layer has a second through-hole arranged in an individual, and connected to the second conductive The second connecting portion of the layer. According to the electrical detection carrier device with shielding effect as described in claim 6, each second ground member of the second signal layer has a second hollow area surrounding a second hollow area defining a position corresponding to an individual second through hole Two base parts, the second connection part is a ring embedded in the second hollow area and completely surrounds the second hollow area. The electrical detection carrier device with shielding effect as described in Claim 4, wherein the first conductive layer defines a plurality of through holes corresponding to the first through holes, and each constituent unit further includes: an inner insulating layer, attached to a side of the first conductive layer away from the first insulating layer, surrounding and defining a plurality of inner through holes corresponding to the through holes; and an inner signal layer, attached to the side of the inner insulating layer opposite to the first conductive layer, and including a plurality of routing wirings formed on the surface facing the inner insulating layer and surrounding a closed shielding area; The first signal layer also includes a plurality of vias connected to the inner signal layer in the shielding regions through the first through holes, the through holes, and the inner through holes. The electrical detection carrier device with shielding effect as described in claim 8, wherein each via of the first signal layer has a direction toward the first through holes, the through holes, and the inner through holes extending and connected to the internal connection portion of the internal signal layer. The electrical detection carrier device with shielding effect as described in claim 4 further includes two packaging boards respectively arranged outside the two outermost constituent units.

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