TWI778581B - Oled像素形成用掩模、掩模支撐模板及框架一體型掩模 - Google Patents
Oled像素形成用掩模、掩模支撐模板及框架一體型掩模 Download PDFInfo
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- TWI778581B TWI778581B TW110113624A TW110113624A TWI778581B TW I778581 B TWI778581 B TW I778581B TW 110113624 A TW110113624 A TW 110113624A TW 110113624 A TW110113624 A TW 110113624A TW I778581 B TWI778581 B TW I778581B
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020200062444A KR102358270B1 (ko) | 2020-05-25 | 2020-05-25 | Oled 화소 형성용 마스크, 마스크 지지 템플릿 및 프레임 일체형 마스크 |
KR10-2020-0062444 | 2020-05-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202144907A TW202144907A (zh) | 2021-12-01 |
TWI778581B true TWI778581B (zh) | 2022-09-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110113624A TWI778581B (zh) | 2020-05-25 | 2021-04-15 | Oled像素形成用掩模、掩模支撐模板及框架一體型掩模 |
Country Status (3)
Country | Link |
---|---|
KR (2) | KR102358270B1 (ko) |
CN (1) | CN113725389A (ko) |
TW (1) | TWI778581B (ko) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201735244A (zh) * | 2016-03-24 | 2017-10-01 | 台灣積體電路製造股份有限公司 | 深溝槽隔離結構及其形成方法 |
US20200056279A1 (en) * | 2016-10-07 | 2020-02-20 | Dai Nippon Printing Co., Ltd. | Method of manufacturing deposition mask, intermediate product to which deposition mask is allocated, and deposition mask |
KR20200040471A (ko) * | 2018-10-10 | 2020-04-20 | 주식회사 오럼머티리얼 | 마스크의 제조 방법 및 프레임 일체형 마스크의 제조 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009068082A (ja) * | 2007-09-14 | 2009-04-02 | Sony Corp | 蒸着マスクの作製方法および蒸着マスク |
KR102506005B1 (ko) * | 2017-09-28 | 2023-03-08 | 삼성디스플레이 주식회사 | 마스크 조립체 및 마스크 조립체의 제조 방법 |
CN112424972A (zh) * | 2018-08-29 | 2021-02-26 | 悟勞茂材料公司 | 掩模的制造方法、掩模及框架一体型掩模 |
KR102138800B1 (ko) * | 2019-05-13 | 2020-07-28 | 주식회사 오럼머티리얼 | 마스크 및 프레임 일체형 마스크 |
-
2020
- 2020-05-25 KR KR1020200062444A patent/KR102358270B1/ko active IP Right Grant
-
2021
- 2021-04-15 TW TW110113624A patent/TWI778581B/zh active
- 2021-05-08 CN CN202110500020.5A patent/CN113725389A/zh active Pending
- 2021-10-29 KR KR1020210147000A patent/KR102458729B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201735244A (zh) * | 2016-03-24 | 2017-10-01 | 台灣積體電路製造股份有限公司 | 深溝槽隔離結構及其形成方法 |
US20200056279A1 (en) * | 2016-10-07 | 2020-02-20 | Dai Nippon Printing Co., Ltd. | Method of manufacturing deposition mask, intermediate product to which deposition mask is allocated, and deposition mask |
KR20200040471A (ko) * | 2018-10-10 | 2020-04-20 | 주식회사 오럼머티리얼 | 마스크의 제조 방법 및 프레임 일체형 마스크의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
CN113725389A (zh) | 2021-11-30 |
KR102458729B1 (ko) | 2022-10-26 |
KR20210145488A (ko) | 2021-12-02 |
TW202144907A (zh) | 2021-12-01 |
KR102358270B1 (ko) | 2022-02-07 |
KR20210145695A (ko) | 2021-12-02 |
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