TWI776127B - Adjustment structure of water cooling head for computer water cooling and heat dissipation - Google Patents

Abstract

The present invention relates to a water-cooling head adjustment structure for computer water-cooling heat dissipation. A water-cooling heat-dissipating mechanism is arranged in an accommodating space of a computer host, and a water-cooling fluid capable of carrying heat energy is arranged inside the water-cooling heat-dissipating mechanism, including: a A water-cooled head, the bottom of which is attached to the top surface of a heating element of a circuit board; a water-cooled head connector, the bottom plate of which is fixed on the top of the water-cooled head, a middle frame and a cover plate above the bottom plate, the cover plate There is a one-dimensional moving mechanism between it and the middle frame, and the top surface of the cover plate is provided with two water inlet and outlet joints; a steering socket, one side of which is extended to connect to a water-cooling row and one water-cooling row. The bottom of the steering socket is connected with one end of two connecting pipes, the other ends of the two connecting pipes are connected to the two water inlet and outlet joints of the water cooling head joint, and the cover plate of the water cooling head joint is connected to the water pipe. The two connecting pipes and the two water inlet and outlet joints are adjusted by the one-dimensional direction moving mechanism, and the water pipes between the conventional water cooling head joints and the water cooling drain joints can be solved by the above-mentioned structure, because the central processing unit of the main board is different. The relative positions of the (CPU) are slightly different, so the rigid water pipes with fixed length and spacing will not be able to be connected smoothly, so that the water cooling mechanism is suitable for various computer hosts.

Description

Adjustment structure of water cooling head for computer water cooling and heat dissipation

The present invention provides a water-cooling head adjustment structure for computer water-cooling and heat dissipation, especially a water pipe that solves the problem between the conventional water-cooling head connector and the water-cooling drain connector, because the relative positions of the central processing units (CPUs) of different motherboards are slightly different, Therefore, the rigid water pipes with fixed length and spacing have the problem that the connection cannot be smoothly aligned, so that the water-cooling heat dissipation mechanism is suitable for various computer hosts.

Press, with the rapid development of electronic technology and network technology, both personal computers and computer servers have become an indispensable part of people's daily life. At the same time, with the rise of the e-sports industry, the performance of computers used in e-sports must also meet the demands of online games where every second counts. The improvement of computer performance is also accompanied by an increase in the heat generated by the internal components of the computer, which has a serious impact on the performance and service life of the computer. Therefore, it is necessary to provide a good cooling device to cool the computer components to ensure the computer. The smoothness of operation.

Computer cooling methods are roughly divided into air-cooled and water-cooled systems. The air-cooled method draws cold air into the computer from the outside of the computer through a plurality of fans. Processors, access devices, interface cards, and power components) for heat dissipation, and then the hot air with increased temperature is also exhausted from the outside of the computer through a fan to complete air cooling. The air cooling system has a simple structure and low cost. Advantages, but its disadvantages Its heat dissipation effect is relatively general and it is easy to accumulate a lot of dust inside the computer. On the contrary, the water-cooling system has the advantage of good heat dissipation. The method is to set a water-cooling head on the heating element, and the water-cooling head is provided with cooling fins and water-cooling liquid flow channels, and the water-cooling liquid in the water-cooling head is used to absorb the heating element. Heat, and use the water pump connected to the water-cooling head to generate the flow of water-cooled liquid and transport it to a water pipe, and then the water-cooled liquid with heat is transported by the water pipe to the water-cooled exhaust with radiator fins and fans. The water-cooled liquid is cooled by air cooling , and the cooled water-cooled liquid is sent back to the water-cooling head by conveying another water pipe to complete the cooling effect of the water-cooling cycle.

The above-mentioned water-cooling circulation cooling system has the advantages of high-efficiency heat dissipation, so it is widely used in the gaming industry or other industries that require high-efficiency computers or servers. The fixed locking point provided for the water-cooling kit is not a fixed position, so after the water-cooling head is fixed on the heating element and the water-cooling row is fixed on the computer case, the water pipe connected between the water-cooling head connector and the water-cooling row connector may be different due to different The relative position of the central processing unit (CPU) of the motherboard is slightly different, so the rigid water pipes with fixed length and spacing cannot be connected smoothly. This problem needs to be solved by those engaged in the industry.

Therefore, in view of the above-mentioned problems and deficiencies, the inventor collected relevant information, and after various evaluations and considerations, the invention of designing this water-cooling head adjustment structure for computer water-cooling heat dissipation was born.

The main purpose of the present invention is to provide a water cooling head adjustment structure for computer water cooling and heat dissipation. Included: A water block with a sticker on the bottom a top surface of a heating element of a circuit board; a water-cooled head connector, the bottom plate of which is fixed on the top of the water-cooled head, a middle frame and a cover plate are arranged above the bottom plate, and the cover plate and the middle frame are between It has a one-dimensional moving mechanism, and the top surface of the cover plate is provided with two water inlet and outlet joints; a steering socket, one side of which is extended with two water pipes connected to a water cooling row and a water cooling row socket, and the steering connection The bottom of the base is connected with one end of two connecting pipes, and the other ends of the two connecting pipes are connected to the two water inlet and outlet joints of the water cooling head joint, and the cover plate of the water cooling head joint is moved by the one-dimensional direction The mechanism adjusts the two connecting pipes and the two water inlet and outlet joints in one position, and solves the water pipes between the conventional water-cooling head joints and water-cooling drain joints by the above-mentioned structure, because the relative positions of the central processing units (CPUs) of different motherboards There is a slight difference, so the rigid water pipes with fixed length and spacing will not be able to be connected smoothly, so that the water cooling mechanism is suitable for all kinds of computer mainframes.

The secondary purpose of the present invention is that a plurality of first adjustment holes are further cut inside the cover plate of the water-cooled head socket, and the inside of the middle frame located under the cover plate is further cut with holes smaller than the first adjustment holes. A plurality of second adjustment holes of the holes, so that when the first adjustment hole and the second adjustment holes are in alignment, an annular fixing portion is formed on the outer edge of the second adjustment holes, and the plurality of fixing pieces are passed through. The first adjustment holes are fixed on the upper surface of the annular fixing portions.

Another object of the present invention is to form an included angle between the two water pipes and the two connecting pipes of the steering socket between 60° and 120°.

Another object of the present invention is that the heating element refers to a central processing unit, a graphics processing unit, an access device, an interface card and a power element.

1: computer host

10: Accommodating space

11: circuit board

111: Heating element

2: Water cooling mechanism

21: water cooling head

22: Water cooling head connector

221: inlet and outlet water joints

2210: Engagement cavity

222: Bottom plate

223: Middle frame

2230: Second adjustment hole

2231: Ring fixed part

224: Cover

2240: The first adjustment hole

225: Fixtures

23: Steering socket

24: Water cooling row

241: Water cooling row socket

25: Water pipes

26: connecting pipe

[Fig. 1] is a three-dimensional appearance view of the computer water-cooling heat dissipation adjustment device of the present invention.

[Fig. 2] is a three-dimensional exploded structural view of the computer water-cooling heat dissipation adjustment device of the present invention.

[Fig. 3] is a perspective exploded structural view of the water cooling head connector of the present invention.

[Fig. 4] is a three-dimensional appearance view of the water cooling head connector of the present invention.

[FIG. 5] is a top view of the structure of the cover plate of the water-cooled head connector of the present invention moved to the first position.

[Fig. 6] is a top plan view of the cover plate of the water cooling head connector of the present invention moved to the second position.

[Fig. 7] is a top view of the structure of the cover plate of the water cooling head joint seat of the present invention moved to the third position.

In order to achieve the above objects and effects, the technical means and structures adopted by the present invention are described in detail with reference to the preferred embodiments of the present invention, and the features and functions are as follows, so as to be fully understood.

Please refer to Figures 1 to 4, which are the three-dimensional appearance view, the three-dimensional exploded structure diagram, the three-dimensional exploded structure diagram of the water-cooling head connector, and the three-dimensional appearance view of the water-cooling head connector according to the present invention. It can be clearly seen from the above that the objects and devices used in the present invention include a computer host 1 and a water-cooled heat dissipation mechanism 2. The water-cooled heat dissipation mechanism 2 is arranged in the accommodation space 10 of the computer host 1, and the water-cooled heat dissipation mechanism 2 is internally provided. There is a water-cooled fluid (not shown in the figure) that can carry heat energy. The water-cooled fluid system refers to a water-cooled fluid with anti-corrosion and antibacterial properties. The connection relationship and operation instructions of the aforementioned mechanisms are as follows:

A water block 21, the bottom of which is attached to the top surface of a heating element 111 of a circuit board 11, the heating element 111 refers to a central processing unit (CPU), a graphics processing unit (GPU), an access device (for example: dynamic Random Access Memory (DRAM), Hard Disk Drive (HDD) or Solid State Drive (SSD)), interface cards (such as video interface cards or other heat-prone interface cards), and power components (such as power components used in power supplies).

A water block connector 22, the bottom plate 222 of which is fixed on the top of the water block 21, a middle frame 223 and a cover plate 224 are arranged above the bottom plate 222, and there is a one-dimensional direction between the cover plate 224 and the middle frame 223 ( Refers to the X-axis or Y-axis direction) moving mechanism, and the top surface of the cover plate 224 is provided with two water inlet and outlet joints 221 .

A plurality of first adjustment holes 2240 are further cut inside the cover plate 224 of the water-cooled head connector 22 , and a plurality of first adjustment holes 2240 are further cut inside the middle frame 223 below the cover plate 224 with a diameter smaller than the first adjustment holes 2240 The plurality of second adjustment holes 2230, so that when the first adjustment holes 2240 and the second adjustment holes 2230 are aligned, an annular fixing portion 2231 is formed on the outer edge of the second adjustment holes 2230, and the A plurality of fixing members 225 are inserted through the first adjustment holes 2240 and fixed on the upper surface of the annular fixing portions 2231 .

A steering socket 23 extends from one side of two water pipes 25 connected to a water cooling socket 241 of a water cooling row 24, and the bottom of the steering socket 23 is connected with one end of two connecting pipes 26. The two connecting pipes The other end of the 26 is connected to the two water inlet and outlet joints 221 of the water-cooled header 22, and the cover plate 224 of the water-cooled header 22 utilizes the one-dimensional moving mechanism to connect the two connecting pipes 26 and the two The water inlet and outlet joints 221 are adjusted in position.

The two water pipes 25 and the two connecting pipes 26 of the steering socket 23 form an included angle between 60° and 120°, although the two water pipes 25 of the steering socket 23 and the two connecting pipes 26 are disclosed in this case. The included angle formed between the connecting pipes 26 is close to 90°, but in order to meet the space utilization requirement of the accommodating space 10 of the computer host 1 , the included angle range is set to be between 60° and 120°, which is a reasonable configuration requirement.

The water pipe 25 and the connecting pipe 26 are made of glass or copper. Of course, the present invention is not limited to the first two materials, for example, a hard material water pipe with a hollow interior that can flow water cooling liquid is within the protection scope of the present invention.

Please refer to FIGS. 5 to 7 , each of which is a top view of the cover plate of the water-cooled head connector moving to the first, second, and third positions of the present invention, which reveal the position of the one-dimensional moving mechanism of the water-cooled head connector 22 For the adjustment mechanism, in order to adjust and assemble the two connecting pipes 26 extended by the steering socket 23 and the two water inlet and outlet joints 221 of the water cooling head socket 22, the first adjustment hole 2240 in the cover plate 224 and the first adjustment hole 2240 in the middle frame 223 are used. The second adjustment hole 2230 and the fixing member 225 are relatively locked at the position of the annular fixing portion 2231 , and the position of the cover plate 224 is adjusted by moving in the X-axis direction. 5 shows the annular fixing portion 2231 where the fixing member 225 is locked at the central position of the first adjusting hole 2240 and the second adjusting hole 2230. At this time, the cover plate 224 and the two water inlet and outlet connectors 221 disposed thereon are also It is located in the central position of the water-cooling head connector base 22; and Figure 6 shows that the cover plate 224 and the two water inlet and outlet connectors 221 disposed on it are moved to the right in the position shown in Figure 5, which can correspond to the steering connector located on the right. The two connecting pipes 26 of the seat 23 are connected and assembled, and the fixing member 225 is locked at the left position of the first adjusting hole 2240 at this time, but the locking position of the lower end of the fixing member 225 is still corresponding to the center of the second adjusting hole 2230 Fig. 7 shows the cover plate 224 and the two water inlet and outlet joints 221 disposed on it. When the position in Fig. 5 is moved to the left, it can correspond to the steering socket 23 located to the left. The second connecting pipe 26 is connected and assembled, and the fixing member 225 is locked at the right position of the first adjusting hole 2240 at this time, but the locking position of the lower end of the fixing member 225 is still corresponding to the central position of the second adjusting hole 2230. The annular fixing portion 2231 achieves a one-dimensional moving mechanism through the aforementioned disclosure. Although the above disclosure is the movement adjustment in the X-axis direction, those skilled in the art can also make simple structural changes or rotation directions to form the movement in the Y-axis direction. Dynamic adjustment is also within the protection scope of the present invention.

The heat dissipation operation method of the water-cooling head adjustment structure for the water cooling and heat dissipation of the computer disclosed above is as follows: a water-cooling head 21 is arranged on the heating element 111, and the water-cooling head 21 is provided with a heat-dissipating fin (not shown in the figure) and a water-cooling liquid flow channel. (not shown in the figure), use the water cooling liquid in the water cooling head 21 to absorb the heat of the heating element 111, and use the water pump (not shown in the figure) connected to the water cooling head 21 to generate the water cooling liquid flow and deliver it to the water cooling head connector 22 , the water cooling head connector 22 transmits the water cooling liquid to the steering connector 23 through the connecting pipe 26, and the steering connector 23 makes a turn of the water cooling liquid and transfers it to one of the two water pipes 25, and the The water pipe 25 transmits the water-cooled liquid with heat to the water-cooled exhaust socket 241 first, and then the water-cooled exhaust socket 241 is transported to the water-cooled exhaust 24 with a heat sink (not shown in the figure) and a fan (not shown in the figure) to utilize the air. The cooling method is used to cool the water cooling liquid, and the cooled water cooling liquid is sent back to the water cooling head 21 through another water pipe 25, the steering socket 23, the connecting pipe 26, and the water cooling head socket 22 to complete the cooling effect of the water cooling cycle.

From the disclosure of the above-mentioned Figures 1 to 7, it can be understood that the present invention is a water cooling head adjustment structure for computer water cooling and heat dissipation. A water-cooled fluid capable of carrying heat energy is provided, including: a water-cooled head, the bottom of which is attached to the top surface of a heating element of a circuit board; There is a middle frame and a cover plate above, a one-dimensional direction moving mechanism is arranged between the cover plate and the middle frame, and the top surface of the cover plate is provided with two water inlet and outlet joints; a steering socket, one side of which extends with Connected to two water pipes of a water-cooling row socket of a water-cooling row, and the bottom of the steering socket is connected with one end of two connecting pipes, and the other ends of the two connecting pipes are connected to the two inlet and outlet water of the water-cooling head joint. joints, and the cover plate of the water-cooled head joint seat uses the one-dimensional direction moving mechanism to adjust the two connecting pipes and the two water inlet and outlet joints in one position, with the above-mentioned structure Solve the problem that the water pipes between the conventional water-cooled head connector and water-cooled drain connector cannot be connected smoothly because the relative positions of the central processing units (CPUs) of different motherboards are slightly different. , and make the water cooling mechanism suitable for all kinds of computer mainframes. The solution provided by the present invention has excellent practicability in the field of assembly of water-cooled heat dissipation systems, so a patent application is filed to seek patent protection.

The above description is only a preferred embodiment of the present invention, which does not limit the scope of the patent of the present invention. Therefore, any simple modifications and equivalent structural changes made by using the contents of the description and drawings of the present invention should be similarly included in the Within the scope of the patent of the present invention, it is hereby stated.

To sum up, the above-mentioned water cooling head adjustment structure for computer water cooling and heat dissipation of the present invention can indeed achieve its efficacy and purpose when it is used. Therefore, the present invention is an invention with excellent practicability. In order to meet the application requirements for an invention patent, The application is filed in accordance with the law, and I hope that the review committee will approve the case as soon as possible to protect the inventor's hard work.

22: Water cooling head connector

221: inlet and outlet water joints

2210: Engagement cavity

222: Bottom plate

223: Middle frame

2230: Second adjustment hole

2231: Ring fixed part

224: Cover

2240: The first adjustment hole

225: Fixtures

Claims (7)

A water cooling head adjustment structure for computer water cooling and heat dissipation, which comprises a water cooling heat dissipation mechanism arranged in an accommodating space of a computer host, and a water cooling fluid capable of carrying heat energy is arranged inside the water cooling heat dissipation mechanism, and the water cooling heat dissipation mechanism , including: a water-cooled head, the bottom of which is attached to the top surface of a heating element of a circuit board; a water-cooled head connector, the bottom plate of which is fixed on the top of the water-cooled head, and a middle frame and a cover plate above the bottom plate , There is a one-dimensional moving mechanism between the cover plate and the middle frame, and the top surface of the cover plate is provided with two water inlet and outlet joints, and the inside of the cover plate of the water cooling head joint is further cut with a plurality of first adjustment holes , and the inside of the middle frame under the cover plate is further cut with a plurality of second adjustment holes with a diameter smaller than the first adjustment holes, so that the first adjustment holes and the second adjustment holes are in alignment At the time, an annular fixing part is formed on the outer edge of the second adjustment holes, and a plurality of fixing parts are inserted through the first adjustment holes and fixed on the upper surface of the annular fixing parts; and a steering socket, One end of two connecting pipes is connected to the bottom of the steering socket, and the other end of the two connecting pipes is connected to the water cooling head socket. The two water inlet and outlet joints, and the cover plate of the water cooling head joint seat is adjusted by the one-dimensional direction moving mechanism for the two connecting pipes and the two water inlet and outlet joints, and moves in a one-dimensional direction to adjust When the cover is in the position, the fixing member is locked at the center, left or right of the first adjustment holes, and the lower end of the fixing member is locked at the central position of the second adjustment holes. department. As claimed in claim 1, the water-cooling head adjustment structure for computer water cooling and heat dissipation, wherein an angle between 60° and 120° is formed between the two water pipes of the steering socket and the two connecting pipes angle. As claimed in claim 1, the water-cooling head adjustment structure for computer water cooling and heat dissipation, wherein the connecting structure of the connecting pipe and the water inlet and outlet joints is one of the outer pipe walls of the connecting pipe, which is positioned inside the water inlet and outlet joints, through abutting against it. The side wall of the joint cavity, or the inner pipe wall of the joint pipe is sleeved on the outer wall of the water inlet and outlet joints. As in claim 1 of the water cooling head adjustment structure for computer water cooling and heat dissipation, the connecting pipe refers to a hollow water pipe made of glass or copper. As claimed in claim 1, the water-cooling head adjustment structure for computer water cooling and heat dissipation, wherein the water pipe refers to a hollow water pipe made of glass or copper. As claimed in claim 1, the water-cooling head adjustment structure for computer water-cooling heat dissipation, wherein the water-cooling fluid system applied to the water-cooling heat-dissipating mechanism refers to a water-cooling liquid with anti-corrosion and antibacterial properties. According to the adjustment structure of the water cooling head for water cooling and heat dissipation of the computer of claim 1, the heating elements refer to the central processing unit, the graphics processing unit, the access device, the interface card and the power element.

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