TW202240343A - Water-cooling heat dissipation module which is arranged in a receiving space in an interior of a device housing of a computer device - Google Patents

Abstract

The present invention relates to a water-cooling heat dissipation module, which is arranged in a receiving space in an interior of a device housing of a computer device. The receiving space is provided with at least one circuit board, and the device housing is provided with at least one air-intake fan. The water-cooling heat dissipation module comprises: a heat absorption module, which comprises a water cooling head, a connecting base, and two fittings; and a water-cooling row module, which comprises a temperature reducing fan, a thermally conducting casing, a first fin assembly and a second fin assembly, which are formed of a plurality of heat dissipation fins and a plurality of spacing plates alternating with each other, and a tube having multiple circuitous curves being arranged in an interior of the thermally conductive casing, a heat dissipation gap being formed between the first fin assembly and the second fin assembly, a first section and a second section of the tube being connected with the two fittings, the water-cooling row module being arranged on a top side of the heat absorption module as being spaced therefrom by a distance in order to form an optimized spatial arrangement for the heat absorption module and the water-cooling row module arranged in the receiving space.

Description

Water Cooling Module

The present invention provides a water-cooling and heat-dissipating module, especially a water-cooling radiator module which is arranged on the top side of the heat-absorbing module at a distance, so as to form the heat-absorbing module and the water-cooling radiator module in the accommodation space. Optimized space configuration, and at the same time, through the plurality of first fin groups, the plurality of second fin groups and the tubes inserted in the heat conduction shell to achieve better cooling liquid cooling effect, and use multiple fixed The frame fixes the case and the water-cooling module, on the one hand, it can ensure the stability of the water-cooling module with a large volume and weight, and at the same time, it can be located on the top side of the heat-absorbing module to effectively use the limited space inside the computer host .

Press, with the rapid development of electronic technology and network technology, whether it is a personal computer or a computer server has become an indispensable part of people's daily life. At the same time, with the rise of the e-sports industry, the performance of computers used in e-sports must also meet the needs of online games where every second counts. The improvement of computer performance is also accompanied by the increase of the heat generated by the internal components of the computer, which has a serious impact on the performance and service life of the computer. Therefore, it is necessary to provide a good cooling device to cool down the computer components to ensure that the computer Fluency of operation.

Computer heat dissipation methods can be roughly divided into air-cooling and water-cooling systems. The air-cooling method draws cold air from the outside of the computer into the inside of the computer through multiple fans. processor, access device, interface card or power Components) for heat dissipation, and then the hot air with rising temperature is also exhausted from the outside of the computer by the fan to complete the air cooling and heat dissipation effect. The air cooling system has the advantages of simple structure and low cost, but its disadvantage is that the heat dissipation effect is relatively general And easy to accumulate a lot of dust inside the computer. In contrast, the water-cooling system has the advantage of good heat dissipation. Its method is to install a water-cooling head on the heating element. The water-cooling head is equipped with cooling fins and water-cooling fluid channels, and the water-cooling liquid in the water-cooling head absorbs the heat of the heating element. Heat, and use the water pump connected to the water-cooling head to generate water-cooling fluid flow and transport it to a water pipe, and then the water-cooling liquid with heat is transported to a water-cooling row with cooling fins and fans. Use air-cooling to cool the water-cooling liquid , and the cooled water-cooling liquid is sent back to the water-cooling head through another water pipe to complete the cooling effect of the water-cooling cycle.

The above-mentioned water-cooling circulation cooling system has the advantages of high-efficiency heat dissipation, so it is widely used in the e-sports industry or other industries that require high-performance computers or servers. However, modern computer hosts or servers are all moving toward light, thin, short, and small structure, the usable space inside the computer is also reduced, how to create the best heat dissipation effect in the limited space has become the obvious learning point that manufacturers are eager to develop.

Therefore, in view of the above-mentioned problems and deficiencies, the inventor collected relevant information, and after various evaluations and considerations, the invention of this water-cooling heat dissipation module was designed.

The main purpose of the present invention is to provide a water-cooling heat dissipation module, which is arranged in an accommodating space inside a casing of a computer mainframe, the accommodating space is provided with at least one circuit board and the casing is provided with at least one Air fan, and the water-cooled heat dissipation module includes: a heat-absorbing module, which includes a water-cooled head, a connecting seat and two joints; a water-cooled row module, which includes a cooling fan, a heat-conducting shell, and The inside of the housing is equipped with a plurality of cooling fins and a plurality of partition plates A first fin group, a second fin group, and a plurality of meandering tubes are formed by interlacing, and there is a heat dissipation gap between the first fin group and the second fin group, and the tube The first section and the second section of the body are connected with the two joints, and the water cooling module is arranged on the top side of the heat absorbing module at a distance to form the heat absorbing module and the water cooling module. The accommodating space has an optimized space configuration, and at the same time achieves optimal cooling through the plurality of first fin groups, the plurality of second fin groups and the passing tube body in the aforementioned heat conduction shell Liquid cooling effect, and the use of multiple fixing brackets to fix the chassis and water cooling module, on the one hand, it can ensure the stability of the larger volume and weight of the water cooling module, and at the same time, it can be positioned on the top side of the heat absorbing module. It can effectively utilize the limited space inside the host computer.

The secondary purpose of the present invention is to further assemble an auxiliary fan for enhancing the heat dissipation effect on the opposite side of the heat conducting housing away from the cooling fan.

Another object of the present invention is that the appearance of the fixing frame is an "L" shape, and the fixing frame locks the position of the cooling fan and the heat conduction shell, and the heat conduction shell is provided with the second pipe body. The opposite side of one section to the second section.

Another object of the present invention is that the spacer plate arranged between the heat dissipation fins forms an air guide channel, and the heat dissipation gap between the first fin group and the second fin group is perpendicular to the air guide road.

Another object of the present invention is that the cooling fan of the water-cooled exhaust module exhausts air and fixes a heat dissipation plate. There are a plurality of heat dissipation holes in the heat dissipation plate, and there are holes around the heat dissipation plate for the fixing elements to pass through. The plural perforation.

1: Computer host

10:Accommodating space

11: Chassis

111: cooling plate

112: perforation

12: Circuit board

121: heating element

122: perforation

13:Intake fan

2: Heat-absorbing module

21: water block

22: Connecting seat

221: Connector

3: Water-cooled row module

31: cooling fan

32: Heat conduction shell

320: cooling gap

321: The first fin group

3211: cooling fins

3212: Partition board

322: the second fin group

3221: cooling fins

3222: Partition board

33: tube body

331: first paragraph

332: second paragraph

333: Air duct

34: Auxiliary fan

4: fixed frame

41: Fixing element

[Fig. 1] is a three-dimensional appearance view of the water-cooling heat dissipation module of the present invention.

[Fig. 2] is a three-dimensional appearance view of assembling the water-cooling heat dissipation module inside the main computer of the present invention.

[Fig. 3] is a three-dimensional exploded view of the water-cooling heat dissipation module and the computer mainframe of the present invention.

[Fig. 4] is a three-dimensional exploded view of a part of the water-cooling heat dissipation module of the present invention.

In order to achieve the above-mentioned purpose and effect, the technical means and the structure adopted by the present invention are hereby illustrated in detail with respect to the preferred embodiments of the present invention. Its features and functions are as follows, so that it can be fully understood.

Please refer to Figures 1 to 4, which are the three-dimensional appearance diagram of the water-cooling heat dissipation module of the present invention, the three-dimensional appearance diagram of assembling the water-cooling heat dissipation module inside the computer mainframe, the three-dimensional exploded view of the water-cooling heat dissipation module and the computer mainframe, and The three-dimensional exploded view of a part of the water-cooling heat dissipation module, it can be clearly seen from the figure that the water-cooling heat dissipation module of the present invention is arranged in an accommodating space 10 inside a casing 11 of a computer mainframe 1, and the accommodating space 10 is set There is at least one circuit board 12 and the casing 11 is provided with at least one intake fan 13, and the water-cooling heat dissipation module includes: a heat-absorbing module 2, a water-cooling row module 3 and a plurality of fixing frames 4, and its main The components and features are detailed as follows:

The heat-absorbing module 2 includes a water cooling head 21 that drives a cooling liquid (not shown in the figure) to circulate. The cooling liquid system is composed of water or a water cooling liquid with composite components. A connection base 22 is located on the top surface of a heating element 121 of the circuit board 12 , and one side of the connection base 22 is provided with two joints 221 for the cooling liquid to flow out and in.

The water-cooled row module 3 includes a cooling fan 31 fixed to the casing 11 through a plurality of fixing frames 4 and a plurality of fixing elements 41 (for example: screws), and one side of the cooling fan 31 is connected to A heat conduction shell 32 is fixed, and the fixing frames 4 are extended to lock the cooling fan 31 and the heat conduction shell 32. Inside the heat conduction shell 32, there are a plurality of cooling fins (3211, 3221) and a plurality of spacers. (3212, 3222) alternately form a first fin group 321 and a second fin group 322, and have a heat dissipation gap 320 between the first fin group 321 and the second fin group 322, and Between the first fin group 321 and the second fin group 322, there is a tube body 33 forming multiple meandering bends, and the tube body 33 protrudes from the first segment 331 and the second segment The second section 332 is connected with the two joints 221, and the water-cooled row module 3 is arranged on the top side of the heat-absorbing module 2 at a distance to form the heat-absorbing module 2 and the water-cooled row module 3 on the The accommodating space 10 has an optimized space configuration.

The casing 11 above is further provided with a cooling plate 111 for the cooling fan 31 of the water-cooling module 3 to exhaust and fix. The cooling plate 111 has a plurality of cooling holes, and the cooling plate 111 is surrounded by A plurality of perforations 122 for the fixing elements 41 to pass through.

The aforementioned heating element 121 refers to a central processing unit (CPU), a graphics processing unit (GPU), a storage device (Storage Device), an interface card (Interface Card) or a power element (Power Element).

The heat conducting housing 32 is further assembled with an auxiliary fan 34 for strengthening the cooling effect on the side opposite to the cooling fan 31 .

The appearance of the above-mentioned fixing frame 4 is an "L" shape, and the fixing frame 4 locks the position of the cooling fan 31 and the heat conducting shell 32, and the heat conducting shell 32 is provided with the second tube body 33. One section 331 is on the other side opposite to the second section 332, and the partition plate (3212, 3222) arranged between the cooling fins (3211, 3221) forms an air guide channel 333, and the first fin The heat dissipation gap 320 between the fin set 321 and the second fin set 322 is perpendicular to the air guide channel 333 .

When the water-cooling heat dissipation module of the present invention is to be assembled in the main computer 1, the cooling fan 31, the heat conduction housing 32 and the auxiliary fan 34 need to be assembled first, so that the three are integrated, and the plurality of holes 122 and the plurality of holes of the casing 11 are continued. After the assembly surfaces of the fixing frame 4 and the cooling fan 31 are positioned, a plurality of fixing elements 41 are used to penetrate and lock, and then the surface of the heating element 121 (such as a central processing unit) of the circuit board 12 is coated with a preset heat dissipation that can transfer heat energy After pasting, the plurality of preset fixing elements of the connection seat 22 of the heat-absorbing module 2 are locked in the plurality of preset fixing holes (not shown) of the circuit board 12 around the heating element, so that the bottom surface of the water cooling head 21 is attached to the On the surface of the heating element 121, at the same time, the water-cooled radiator module 3 is arranged on the top side of the heat-absorbing module 2 at a distance to form an optimal spatial configuration of the heat-absorbing module 2 and the water-cooled radiator module 3 in the accommodation space 10, And create the best heat dissipation effect in a limited space, and complete the assembly of the water-cooled heat dissipation module of the present invention in the computer mainframe 1 .

When the present invention is actually used, the main computer 1 is provided with a plurality of air intake fans 13 on the side of the control panel to suck the cold air from the outside into the accommodation space 10 for air cooling and cooling, while the heat generated by the heating element 121 of the circuit board 12 passes through the The thermal paste is transferred to the water-cooling head 21, and the water-cooling head 21 is provided with preset cooling fins and preset water-cooling liquid flow channels, and the water-cooling liquid in the water-cooling head 21 is used to absorb the heat of the heating element 121, and the water-cooling head 21 The connected default water pump generates water-cooling liquid flow and is delivered to the first section 331 of the pipe body 33 through a joint 221, and the water-cooling liquid of the first section 331 of the pipe body 22 flows into the first fin group 321 and passes through it. After multiple circuitous bends, turn to the second fin group 322 and flow out through the second section 332 of the tube body 33 after multiple circuitous bends, while the water-cooling liquid with thermal energy in the tube body 33 passes through the first fin group 321 and the second fin group 322 transfer heat energy to a plurality of cooling fins (3211, 3221), and then use the cooling fan 31 and auxiliary fan 34 arranged on both sides of the heat conduction housing 32 to air-cool the attached The heat energy in the plurality of heat dissipation fins (3211, 3221) is discharged to the outside through the heat dissipation plate of the casing 11, and the cooled water cooling liquid passes through the second section of the pipe body 33 332 flows back to another joint 221 to form a heat exchange cycle.

From the above-mentioned disclosures in Figures 1 to 4, it can be understood that the present invention is a water-cooling heat dissipation module, which is arranged in an accommodating space inside a casing of a computer mainframe, and the accommodating space is provided with at least one circuit board And the casing is provided with at least one intake fan, and the water-cooling heat dissipation module includes: a heat-absorbing module, which includes a water-cooling head, a connecting seat and two joints; a water-cooling row module, which includes a cooling fan 1. A heat-conducting shell, inside the heat-conducting shell is provided with a first fin group composed of a plurality of cooling fins and a plurality of spacers interlaced, a second fin group and a plurality of circuitously bent tubes, and There is a heat dissipation gap between the first fin group and the second fin group, and the first section and the second section of the pipe body are connected to the two joints, and the water cooling module is separated by a The distance is set on the top side of the heat-absorbing module to form an optimized spatial configuration of the heat-absorbing module and the water-cooled radiator module in the accommodating space, and at the same time through the plurality of first fins in the heat-conducting housing Fin set, a plurality of second fin sets, and tubes inserted in to achieve the best heat dissipation effect of the cooling liquid, and a plurality of fixing brackets are used to fix the case and the water cooling module, on the one hand, it can ensure a large volume and weight The stability of the water-cooling module can be improved, and at the same time, it can be located on the top side of the heat-absorbing module to effectively use the limited space inside the computer host. The present invention is applied in the fields of miniaturized computer mainframes and servers, and has excellent practicability, so a patent application is filed to seek patent protection.

The above is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be included in the present invention in the same way. Within the scope of the patent, I will cooperate with Chen Ming.

To sum up, the above-mentioned water-cooling heat dissipation module of the present invention can really achieve its effect and purpose when used, so the present invention is an invention with excellent practicability. In order to meet the requirements for the application of the invention patent, the application is filed according to the law. I hope that the review committee will approve this case as soon as possible to protect the hard work of the inventor. If the Judging Committee of Junjun Bureau has any doubts, please feel free to send us a letter to instruct us. The inventor will definitely cooperate with his best, and we really appreciate it.

1: Computer host

10:Accommodating space

11: Chassis

111: cooling plate

112: perforation

12: Circuit board

121: heating element

122: perforation

13:Intake fan

2: Heat-absorbing module

21: water block

22: Connecting seat

221: Connector

3: Water-cooled row module

31: cooling fan

32: Heat conduction shell

33: tube body

331: first paragraph

332: second paragraph

34: Auxiliary fan

4: fixed frame

41: Fixing element

Claims (7)

A water-cooling heat dissipation module, which is arranged in an accommodating space inside a casing of a computer host, at least one circuit board is provided in the accommodating space and at least one air intake fan is provided in the casing, and the water-cooling heat dissipation The module system includes: A heat-absorbing module, which includes a water cooling head that drives the cooling liquid to circulate, and a connecting seat fixed on the top surface of a heating element of the circuit board is arranged outside the water cooling head. One side of the connecting seat is provided with a the outlet and inlet connections of the cooling liquid; and A water-cooled row module, which includes a cooling fan fixed to the casing through a plurality of fixing frames and a plurality of fixing elements, one side of the cooling fan is connected and fixed with a heat conduction shell, and the fixing frames extend and lock the cooling fan With the heat conduction shell, a first fin group and a second fin group composed of a plurality of cooling fins and a plurality of partition plates are arranged in the heat conduction housing, and the first fin group and the There is a heat dissipation gap between the second fin group, and a tube body forming multiple meandering bends is pierced between the first fin group and the second fin group, and the tube body protrudes from the heat conduction shell The first section and the second section of the body are connected with the two joints, and the water cooling module is arranged on the top side of the heat absorbing module at a distance to form the heat absorbing module and the water cooling module. The accommodating space has an optimized space configuration. The water-cooled heat dissipation module as described in Claim 1, wherein the heat conduction housing is further assembled with an auxiliary fan for enhancing the heat dissipation effect on the opposite side away from the cooling fan. The water-cooling heat dissipation module as described in claim 1, wherein the appearance of the fixing frame is an "L" shape, and the fixing frame locks the position of the cooling fan and the heat-conducting shell, which is the heat-conducting shell The other side of the first section of the pipe body opposite to the second section is provided. The water-cooled heat dissipation module as described in claim 1, wherein the partition plate provided between the heat dissipation fins forms an air guide channel, and the heat dissipation between the first fin group and the second fin group The gap is perpendicular to the air duct. The water-cooling heat dissipation module as described in claim 1, wherein the casing is further provided with a heat dissipation plate for the cooling fan of the water-cooling exhaust module to exhaust and fix, and the heat dissipation plate has a plurality of heat dissipation holes, and A plurality of perforations are provided around the cooling plate for the fixing elements to pass through. The water-cooled heat dissipation module as described in Claim 1, wherein the heating element refers to a central processing unit, a graphics processing unit, an access device, an interface card or a power element. The water-cooled heat dissipation module as described in claim 1, wherein the cooling liquid system is composed of water or a water-cooling liquid with composite components.

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