TWI767701B - Circuit substrate and verification method - Google Patents

Circuit substrate and verification method Download PDF

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TWI767701B
TWI767701B TW110117310A TW110117310A TWI767701B TW I767701 B TWI767701 B TW I767701B TW 110117310 A TW110117310 A TW 110117310A TW 110117310 A TW110117310 A TW 110117310A TW I767701 B TWI767701 B TW I767701B
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wires
wire
light
circuit substrate
emitting element
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TW110117310A
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TW202244875A (en
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連翔琳
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友達光電股份有限公司
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Abstract

The circuit substrate is provided with multiple mounting regions, and the multiple mounting regions are utilized to mount light-emitting elements. The circuit substrate includes a trace layer and a wire layer. The trace layer includes multiple traces respectively corresponding to the multiple mounting regions and a common electrode. The wire layer includes multiple wires which are disposed in the multiple mounting regions respectively, and the light-emitting elements are electrically coupled in series through the multiple wires in the same mounting region. The circuit substrate is provided with wires arranged in specific sites to determine whether the abnormal short circuit is between the wires and the traces during a detection stage.

Description

電路基板以及檢測方法Circuit board and detection method

本案係關於一種電路基板以及檢測方法,特別係關於一種可被檢測是否異常短路的電路基板以及檢測方法。The present application relates to a circuit board and a detection method, and in particular, to a circuit board and a detection method that can detect whether there is an abnormal short circuit.

現今的顯示器所具有的背光燈板通常包含多個發光元件以及裝設這些發光元件的電路基板。在背光燈板的製造過程中,將發光元件裝設在電路基板之前,可以對電路基板的陣列進行檢測,以提升電路基板的品質,進而降低顯示器整體的製程成本。A backlight panel of a current display usually includes a plurality of light-emitting elements and a circuit substrate on which the light-emitting elements are mounted. In the manufacturing process of the backlight panel, before installing the light-emitting element on the circuit substrate, the array of the circuit substrate can be inspected, so as to improve the quality of the circuit substrate and reduce the overall process cost of the display.

本揭示文件提供一種電路基板。電路基板具有複數個裝設區,適用於供複數個發光元件裝設。電路基板包含走線層以及導線層。走線層包含複數條走線以及公共電極,其中該些走線以及公共電極沿第一方向延伸,並且該些走線包含複數條第一走線、複數條第二走線以及複數條第三走線。該些第一走線排列相鄰於公共電極。該些第三走線排列在該些第一走線以及該些第三走線之間。導線層包含複數條導線,其中該些導線分別設置在該些裝設區,並且在該些裝設區中之每一者包含第一導線、複數條彼此分離的第二導線、至少一第三導線以及第四導線。第一導線沿第二方向延伸,並且電性耦接公共電極,其中第一導線跨越該些第一走線。複數條彼此分離的第二導線沿第二方向延伸,其中該些第二導線跨越該些第二走線。至少一第三導線沿第一方向延伸。第四導線沿第二方向延伸,第四導線電性耦接該些走線中之一對應者。The present disclosure provides a circuit substrate. The circuit substrate has a plurality of installation areas, which are suitable for installation of a plurality of light-emitting elements. The circuit substrate includes a wiring layer and a wire layer. The wiring layer includes a plurality of wires and a common electrode, wherein the wires and the common electrodes extend along the first direction, and the wires include a plurality of first wires, a plurality of second wires and a plurality of third wires Traces. The first wirings are arranged adjacent to the common electrodes. The third wires are arranged between the first wires and the third wires. The wire layer includes a plurality of wires, wherein the wires are respectively disposed in the installation areas, and each of the installation areas includes a first wire, a plurality of second wires separated from each other, at least one third wire wire and a fourth wire. The first wire extends along the second direction and is electrically coupled to the common electrode, wherein the first wire spans the first wires. A plurality of second wires separated from each other extend along the second direction, wherein the second wires span the second wirings. At least one third wire extends along the first direction. The fourth wire extends along the second direction, and the fourth wire is electrically coupled to a corresponding one of the wires.

本揭示文件提供另一種電路基板。電路基板具有複數個裝設區,適用於供複數個發光元件裝設,電路基板包含走線層以及導線層。走線層包含複數條走線以及公共電極,其中該些走線以及公共電極沿第一方向延伸。該些走線包含複數條第一走線、複數條第二走線以及複數條第三走線。複數條第一走線,排列相鄰於公共電極。複數條第三走線,其中該些第二走線排列在該些第一走線以及該些第三走線之間。導線層包含複數條導線,其中該些導線分別設置在該些裝設區,並且在該些裝設區中之每一者包含第一導線、複數條彼此分離的第二導線、第三導線以及第四導線。第一導線,沿第二方向延伸,電性耦接公共電極,其中該第一導線跨越該些第一走線以及該些第二走線。複數條彼此分離的第二導線沿第一方向延伸。第三導線沿第二方向延伸,跨越該些第二走線。第四導線沿第二方向延伸,第四導線電性耦接該些走線中之一對應者。The present disclosure provides another circuit substrate. The circuit substrate has a plurality of installation areas, which are suitable for installation of a plurality of light-emitting elements, and the circuit substrate includes a wiring layer and a wire layer. The wiring layer includes a plurality of wirings and common electrodes, wherein the wirings and the common electrodes extend along the first direction. The traces include a plurality of first traces, a plurality of second traces and a plurality of third traces. A plurality of first traces are arranged adjacent to the common electrode. A plurality of third wirings, wherein the second wirings are arranged between the first wirings and the third wirings. The wire layer includes a plurality of wires, wherein the wires are respectively disposed in the installation areas, and each of the installation areas includes a first wire, a plurality of second wires separated from each other, a third wire, and Fourth wire. The first wire extends along the second direction and is electrically coupled to the common electrode, wherein the first wire spans the first wires and the second wires. A plurality of second wires separated from each other extend along the first direction. The third wires extend along the second direction and cross the second wires. The fourth wire extends along the second direction, and the fourth wire is electrically coupled to a corresponding one of the wires.

綜上所述,本揭示文件提供的電路基板具有導線的特定配置位置,從而在檢測階段能判斷導線是否與走線之間發生異常短路。To sum up, the circuit substrate provided by the present disclosure has specific arrangement positions of the wires, so that it can be determined whether there is an abnormal short circuit between the wires and the wires in the detection stage.

下列係舉實施例配合所附圖示做詳細說明,但所提供之實施例並非用以限制本揭露所涵蓋的範圍,而結構運作之描述非用以限制其執行順序,任何由元件重新組合之結構,所產生具有均等功效的裝置,皆為本揭露所涵蓋的範圍。另外,圖示僅以說明為目的,並未依照原尺寸作圖。為使便於理解,下述說明中相同元件或相似元件將以相同之符號標示來說明。The following examples are described in detail in conjunction with the accompanying drawings, but the provided examples are not intended to limit the scope of the present disclosure, and the description of the structure and operation is not intended to limit its execution order. The structure and the resulting device with equal efficacy are all within the scope of the present disclosure. In addition, the drawings are for illustrative purposes only, and are not drawn according to the original size. For ease of understanding, the same or similar elements in the following description will be described with the same symbols.

在全篇說明書與申請專利範圍所使用之用詞(terms),除有特別註明除外,通常具有每個用詞使用在此領域中、在此揭露之內容中與特殊內容中的平常意義。The terms used throughout the specification and the scope of the patent application, unless otherwise specified, generally have the ordinary meaning of each term used in the field, in the content disclosed herein and in the specific content.

此外,在本文中所使用的用詞『包含』、『包括』、『具有』、『含有』等等,均為開放性的用語,即意指『包含但不限於』。此外,本文中所使用之『及/或』,包含相關列舉項目中一或多個項目的任意一個以及其所有組合。In addition, the terms "comprising", "including", "having", "containing" and the like used in this document are all open-ended terms, ie, meaning "including but not limited to". In addition, the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

於本文中,當一元件被稱為『耦接』或『耦接』時,可指『電性耦接』或『電性耦接』。『耦接』或『耦接』亦可用以表示二或多個元件間相互搭配操作或互動。此外,雖然本文中使用『第一』、『第二』、…等用語描述不同元件,該用語僅是用以區別以相同技術用語描述的元件或操作。In this document, when an element is referred to as being "coupled" or "coupled," it may be referred to as "electrically coupled" or "electrically coupled." "Coupled" or "coupled" may also be used to indicate the cooperative operation or interaction between two or more elements. In addition, although terms such as "first", "second", . . . are used herein to describe different elements, the terms are only used to distinguish elements or operations described by the same technical terms.

在一些實施例中,為了讓顯示器所顯示的畫面更貼近人眼眼觀察到的真實世界,高動態範圍(High Dynamic Range;HDR)技術藉由局部背光模組的區域調光,使顯示畫面亮案對比更明顯和暗態細節更清晰。局部背光模組可以由一片玻璃基板實現,或者由少數(例如兩片)的玻璃基板實現,從而減少拼接暗紋。局部背光模組的區域調光需要將發光元件分區控制,從而達到局部背光模組的區域調光。舉例而言,若一個電路基板具有1152顆發光元件,並將1152顆發光元件區分並分別設置在288個裝設區。一個裝設區用以設置4顆發光元件,透過288個驅動電路分別驅動在288個裝設區中的發光元件,從而分別控制在288個裝設區中的發光元件的亮度。然而,為了控制每一個裝設區中的發光元件的亮度,在電路基板每一列中皆會設置與一列裝設區數量相當的走線,以提供各個裝設區各自的電位,從而達到局部調光。因此鄰近驅動電路設置位置的裝設區將會包含數量較多的走線,而在裝設區用以連接發光元件的部分導線因而會跨越這些走線,因此本揭示文件提供具有特定的走線配置的電路基板以及檢測方法以檢測前述的走線以及導線之間是否短路。 In some embodiments, in order to make the picture displayed on the display closer to the real world observed by human eyes, the High Dynamic Range (HDR) technology makes the display picture brighter through the local dimming of the local backlight module. Case contrast is more obvious and dark state details are clearer. The local backlight module can be realized by one glass substrate, or by a few (for example, two) glass substrates, so as to reduce splicing dark lines. The regional dimming of the local backlight module needs to control the light-emitting elements in zones, so as to achieve the regional dimming of the local backlight module. For example, if a circuit substrate has 1152 light-emitting elements, the 1152 light-emitting elements are divided and arranged in 288 installation areas respectively. One installation area is used for arranging 4 light-emitting elements, and the light-emitting elements in the 288 installation areas are respectively driven through 288 driving circuits, so as to control the brightness of the light-emitting elements in the 288 installation areas respectively. However, in order to control the brightness of the light-emitting elements in each installation area, each row of the circuit substrate will be provided with wires corresponding to the number of installation areas in one row, so as to provide the respective potentials of each installation area, so as to achieve local adjustment. Light. Therefore, the installation area adjacent to the installation position of the driving circuit will contain a large number of wires, and some wires used to connect the light-emitting elements in the installation area will cross these wires. Therefore, the present disclosure provides specific wires. The circuit substrate and the detection method are configured to detect whether the above-mentioned wirings and wires are short-circuited.

請參閱第1A圖,第1A圖是依據本揭示文件的電路基板100a的俯視圖的示意圖。電路基板100a包含多條走線NL、公共電極Pc以及裝設區IA。裝設區IA包含的導線WP、W1、W2以及W3用以電性串連四顆發光元件10並將四顆發光元件10電性耦接至公共電極Pc。在裝設發光元件10之後,多條走線NL中之每一者用於傳送對應的資料電壓至對應的裝設區,使各個裝設區IA中的發光元件10可以在相應的亮度顯示,藉此達到局部背光模組的區域調光。在後續實施例中會詳細說明多條走線NL之設置如何將對應的資料電壓傳送至相應的裝設區IA。Please refer to FIG. 1A . FIG. 1A is a schematic diagram of a top view of a circuit substrate 100 a according to the present disclosure. The circuit substrate 100a includes a plurality of traces NL, a common electrode Pc, and an installation area IA. The wires WP, W1, W2 and W3 included in the mounting area IA are used to electrically connect the four light-emitting elements 10 in series and electrically couple the four light-emitting elements 10 to the common electrode Pc. After the light-emitting element 10 is installed, each of the plurality of wires NL is used to transmit the corresponding data voltage to the corresponding installation area, so that the light-emitting element 10 in each installation area IA can be displayed at the corresponding brightness, Thereby, the regional dimming of the local backlight module is achieved. In the following embodiments, how the arrangement of the plurality of wires NL transmits the corresponding data voltage to the corresponding installation area IA will be described in detail.

在第1A圖所示的實施例中,電路基板100a用以裝設1152顆發光元件10,並且電路基板100a中的每個裝設區IA用以裝設4顆發光元件10。亦即,電路基板100a具有288個裝設區IA。電路基板100a中的288個裝設區IA是以18×16的矩陣排列。在每個裝設區IA中所設置的4顆發光元件是以2行×2列的矩陣排列。第1A圖僅繪示電路基板100a中第1行至第4行中2列的裝設區IA。發光元件10可以由發光二極體實施。例如,發光元件10可以是微型發光二極體(micro-LED)、次毫米發光二極體(mini-LED)或是尺寸比次毫米發光二極體大的一般發光二極體。In the embodiment shown in FIG. 1A , the circuit substrate 100 a is used for mounting 1152 light-emitting elements 10 , and each mounting area IA in the circuit substrate 100 a is used for mounting four light-emitting elements 10 . That is, the circuit board 100a has 288 mounting areas IA. The 288 mounting areas IA in the circuit board 100a are arranged in a matrix of 18×16. The four light-emitting elements arranged in each mounting area IA are arranged in a matrix of 2 rows×2 columns. FIG. 1A only shows the mounting area IA in the first row to the fourth row and two columns in the circuit substrate 100a. The light-emitting element 10 may be implemented by a light-emitting diode. For example, the light emitting element 10 may be a micro light emitting diode (micro-LED), a sub-millimeter light emitting diode (mini-LED), or a general light emitting diode larger in size than a sub-millimeter light emitting diode.

在其他實施例中,同一裝設區IA內所設置的發光元件10可以由其他數量實施。例如,二個發光元件10呈1行×2列矩陣排列。或者,六個發光元件10呈3行×2列矩陣排列。因此,這些發光元件10其中至少兩顆可以設置在裝設區IA內。並且,電路基板100a具備的裝設區IA以及發光元件10亦可由其他數量以及排列方式實施。因此第1A圖僅供舉例說明,非限制裝設區IA以及發光元件10的數量以及排列方式。In other embodiments, the light-emitting elements 10 arranged in the same installation area IA may be implemented by other numbers. For example, two light-emitting elements 10 are arranged in a matrix of 1 row×2 columns. Alternatively, the six light-emitting elements 10 are arranged in a matrix of 3 rows by 2 columns. Therefore, at least two of the light-emitting elements 10 can be disposed in the installation area IA. In addition, the mounting area IA and the light-emitting elements 10 included in the circuit board 100a may also be implemented in other numbers and arrangements. Therefore, FIG. 1A is for illustration only, and the number and arrangement of the mounting areas IA and the light-emitting elements 10 are not limited.

請一併參閱第1B圖,第1B圖繪示第1A圖中的電路基板100a在第1行第1列的裝設區IA的示意圖。如第1B圖所示,裝設區IA包含導線WP、W1、W2、W3以及WN、多條走線NL以及公共電極Pc。多條走線NL以及公共電極Pc設置在走線層,多條導線WP、W1、W2、W3以及WN設置在導線層,導線層相異於走線層,且導線層設置在走線層之上。並且,在電路基板100a的每一個裝設區IA中皆包含導線WP、W1、W2、W3以及WN以及公共電極Pc。多條走線NL以及公共電極Pc沿第一方向D1延伸。多條走線NL包含走線N1~N18,且走線N1~N18彼此電性隔絕。多條走線NL由下而上依序排列為走線N1~N18。Please also refer to FIG. 1B. FIG. 1B is a schematic diagram of the mounting area IA in the first row and the first column of the circuit board 100a in FIG. 1A. As shown in FIG. 1B , the installation area IA includes wires WP, W1 , W2 , W3 , and WN, a plurality of wires NL, and a common electrode Pc. A plurality of wires NL and a common electrode Pc are arranged on the wire layer, and a plurality of wires WP, W1, W2, W3 and WN are arranged on the wire layer. The wire layer is different from the wire layer, and the wire layer is arranged between the wire layers. superior. In addition, each mounting area IA of the circuit substrate 100a includes wires WP, W1, W2, W3, WN and a common electrode Pc. The plurality of traces NL and the common electrode Pc extend along the first direction D1. The plurality of traces NL include traces N1 to N18, and the traces N1 to N18 are electrically isolated from each other. The plurality of traces NL are sequentially arranged as traces N1 to N18 from bottom to top.

需要說明的是,在第1A圖以及第1B圖所示的實施例中,透過多條走線NL以及公共電極Pc驅動各個裝設區IA驅動的發光元件10的驅動電路是設置在電路基板100a的左側,因而在同一列中的18個裝設區IA的走線N1~N18由左而右應為依次遞減。It should be noted that, in the embodiment shown in FIG. 1A and FIG. 1B , the driving circuit for driving the light-emitting element 10 driven by each mounting area IA through the plurality of traces NL and the common electrode Pc is provided on the circuit substrate 100 a Therefore, the traces N1 to N18 of the 18 installation areas IA in the same column should be sequentially decreasing from left to right.

也就是說,電路基板100a在第1行的每一個裝設區IA內皆具有走線N1~N18;電路基板100a在第2行的每一個裝設區IA內皆具有走線N2~N18;電路基板100a在第3行的每一個裝設區IA內皆具有走線N3~N18,依此類推。That is to say, the circuit substrate 100a has traces N1-N18 in each mounting area IA in the first row; the circuit substrate 100a has traces N2-N18 in each mounting area IA in the second row; The circuit substrate 100a has traces N3-N18 in each mounting area IA in the third row, and so on.

請參閱第1C圖,第1C圖繪示第1A圖中的電路基板100a在第17行第1列的裝設區IA的示意圖。如第1C圖所示,在電路基板100a上第17行第1列的裝設區IA的走線層僅具有走線N17及N18與公共電極Pc,而不會有走線N1~N16。Please refer to FIG. 1C. FIG. 1C is a schematic diagram of the mounting area IA in the 17th row and the 1st column of the circuit board 100a in FIG. 1A. As shown in FIG. 1C , the wiring layer of the mounting area IA in the 17th row and the 1st column on the circuit substrate 100a only has the traces N17 and N18 and the common electrode Pc, but does not have the traces N1-N16.

並且,在電路基板100a同一列的裝設區IA中,多條走線NL(走線N1~N18)分別電性連接18個裝設區IA中每一者的導線WN。如此一來,電路基板100a同一列的18個裝設區IA中每一者的導線WN分別電性連接走線N1~N18。In addition, in the mounting area IA in the same row of the circuit substrate 100a, the plurality of wires NL (the wires N1-N18) are respectively electrically connected to the wires WN of each of the 18 mounting areas IA. In this way, the wires WN of each of the 18 mounting areas IA in the same row of the circuit substrate 100a are electrically connected to the wires N1-N18, respectively.

換言之,第1行裝設區IA內的導線WN電性連接至在同一列的走線N1,第2行裝設區IA內的導線WN電性連接至在同一列的走線N2,第3行裝設區IA內的導線WN電性連接在同一列的走線N3,依此類推,第18行裝設區IA內的導線WN電性連接在同一列的走線N18。In other words, the wires WN in the installation area IA in the first row are electrically connected to the wires N1 in the same column, the wires WN in the installation area IA in the second row are electrically connected to the wires N2 in the same row, and the installation area in the third row is electrically connected to the wires N2 in the same row. The wires WN in the area IA are electrically connected to the wires N3 in the same column, and so on, and the wires WN in the installation area IA of the eighteenth row are electrically connected to the wires N18 in the same row.

因此,在電路基板100a同一列的18個裝設區中,走線N1~N18分別電性連接18個裝設區IA內各自的導線WN。並且,各個裝設區IA的導線WP皆電性連接公共電極Pc。如此一來,將發光元件10裝設至電路基板100a之後,在同一個裝設區IA內的發光元件10會透過導線WP、W1、W2、W3以及WN而彼此電性串聯且能經由電路基板100a接收電流而發光。Therefore, in the 18 installation areas in the same row of the circuit substrate 100a, the wires N1-N18 are respectively electrically connected to the respective wires WN in the 18 installation areas IA. In addition, the wires WP of each installation area IA are electrically connected to the common electrode Pc. In this way, after the light-emitting elements 10 are mounted on the circuit substrate 100a, the light-emitting elements 10 in the same mounting area IA will be electrically connected in series with each other through the wires WP, W1, W2, W3 and WN and can pass through the circuit substrate 100a receives current and emits light.

並且,在裝設發光元件10之後,走線N1~N18中之每一者用於傳送對應的資料電壓至18個裝設區中之對應者,使各個裝設區IA中的發光元件10可以在相應的亮度顯示,藉此達到局部背光模組的區域調光。Moreover, after the light-emitting element 10 is installed, each of the traces N1 to N18 is used to transmit the corresponding data voltage to the corresponding one of the 18 installation areas, so that the light-emitting element 10 in each installation area IA can be Display at the corresponding brightness, thereby achieving regional dimming of the local backlight module.

在一些實施例中,當走線N1~N18電性連接外部電源的負極,而公共電極Pc電性連接外部電源的正極時,導線WN的電性為負,而導線WP的電性為正。另一方面,當走線N1~N18電性連接外部電源的正極,而公共電極Pc電性連接外部電源的負極時,導線WN的電性為正,而導線WP的電性為負。 In some embodiments, when the wires N1-N18 are electrically connected to the negative poles of the external power supply and the common electrode Pc is electrically connected to the positive poles of the external power supply, the electrical properties of the wires WN are negative and the electrical properties of the wires WP are positive. On the other hand, when the wires N1 to N18 are electrically connected to the positive pole of the external power supply, and the common electrode Pc is electrically connected to the negative pole of the external power supply, the electrical property of the wire WN is positive, and the electrical property of the wire WP is negative.

值得注意的是,走線層相異於導線層而使多條導線WP、W1、W2以及W3與多條走線N1~N18電性隔絕;公共電極Pc與多條走線N1~N18電性隔絕;導線WN與其電性連接的走線N1~N18其中一者之外的走線N1~N18電性隔絕。然而,在一些情形中,導線層中的導線WP、W1、W2、W3及WN其中一者透過微小粒子(例如,6μ或10μ大小的粒子)與走線N1~N18其中一者發生短路而產生異常。此時,若在裝設發光元件10之前檢測出電路基板100a的異常,可以在裝設發光元件10之前汰換電路基板100a,或者是對電路基板100a進行調整以排除異常,從而減少顯示面板整體製程的成本。在本揭示中如何檢測出導線WP、W1、W2、W3及WN其中一者與走線N6~N16其中一者發生短路的異常以及檢測方法的執行,將在後續實施例進行說明。 It is worth noting that the wiring layer is different from the wiring layer so that the plurality of wires WP, W1, W2 and W3 are electrically isolated from the plurality of wires N1~N18; the common electrode Pc is electrically isolated from the plurality of wires N1~N18 Isolation: the wire WN is electrically isolated from the traces N1~N18 other than one of the traces N1~N18 to which it is electrically connected. However, in some cases, one of the wires WP, W1, W2, W3, and WN in the wire layer is generated by short-circuiting one of the wires N1-N18 with tiny particles (eg, particles of 6μ or 10μ) and one of the wires N1-N18. abnormal. At this time, if the abnormality of the circuit board 100a is detected before the light-emitting element 10 is installed, the circuit board 100a can be replaced before the light-emitting element 10 is installed, or the circuit board 100a can be adjusted to eliminate the abnormality, thereby reducing the overall display panel. Process cost. In the present disclosure, how to detect the abnormality of short circuit between one of the wires WP, W1, W2, W3 and WN and one of the wires N6-N16 and the execution of the detection method will be described in the following embodiments.

如第1B圖所示,在投影平面上,區間Z1在多條走線Na以及Nb之間,區間Z2在多條走線Nb以及Nc之間,區間Z3在區間Z1及Z2之間。並且,多條走線Na包含走線N1~N5;多條走線Nb包含走線N6~N16;多條走線Nc包含走線N17~N18。換句話說,區間Z1在走線N5與走線N6之間,區間Z2在走線N16與走線N17之間,區間Z3包含走線N6~N16。導線WP1、WP2、WP3各自具有兩個接墊P1與兩個接墊P2。導線WP具有兩個接墊P1。導線WN具有兩個接墊P2。上述的全部的接墊P1與接墊P2都是設置在區間Z1和Z2。在發光元件10裝設於電路基板100a之後,發光元件10的陽極可以分別電性連接導線WP、W3、W2及W1的接墊P1,而發光元件10的陰極可以分別電性連接導線W3、W2、W1及WN的接墊P2。As shown in FIG. 1B , on the projection plane, the zone Z1 is between the plurality of wires Na and Nb, the zone Z2 is between the plurality of wires Nb and Nc, and the zone Z3 is between the zones Z1 and Z2. In addition, the plurality of wires Na include wires N1 to N5; the plurality of wires Nb include wires N6 to N16; and the plurality of wires Nc include wires N17 to N18. In other words, the zone Z1 is between the traces N5 and N6, the zone Z2 is between the traces N16 and the traces N17, and the zone Z3 includes the traces N6 to N16. The wires WP1, WP2, and WP3 each have two pads P1 and two pads P2. The wire WP has two pads P1. The wire WN has two pads P2. All the above-mentioned pads P1 and P2 are arranged in the zones Z1 and Z2. After the light-emitting element 10 is mounted on the circuit substrate 100a, the anode of the light-emitting element 10 can be electrically connected to the pads P1 of the wires WP, W3, W2 and W1, respectively, and the cathode of the light-emitting element 10 can be electrically connected to the wires W3, W2, respectively. , W1 and WN pads P2.

如第1A圖及第1B圖所示,與發光元件10相連接的接墊P1與接墊P2分別水平(例如,沿第一方向D1)排列並設置在區間Z1和Z2內的不同位置。在設置接墊P1與接墊P2的區間Z1和Z2之間,另存在水平(例如,沿第一方向D1)延伸的區間Z3,區間Z3用以設置水平方向(例如,沿第一方向D1)的訊號走線N6~N16,於一些實施例中,區間Z1和Z2為接墊設置區域(用以連接第1A圖中的發光元件10),區間Z3做為跨線區域使用。As shown in FIG. 1A and FIG. 1B , the pads P1 and P2 connected to the light-emitting element 10 are arranged horizontally (eg, along the first direction D1 ) respectively and are arranged at different positions in the zones Z1 and Z2 . Between the zones Z1 and Z2 where the pads P1 and P2 are arranged, there is another zone Z3 extending horizontally (eg, along the first direction D1 ), and the zone Z3 is used to set the horizontal direction (eg, along the first direction D1 ) For the signal traces N6-N16, in some embodiments, the zones Z1 and Z2 are pad setting areas (used to connect the light-emitting element 10 in FIG. 1A ), and the zone Z3 is used as a jumper area.

具體來說,在一個裝設區IA內設置四顆發光元件10,第一顆發光元件10的陽極與陰極分別電性連接導線WP的接墊P1與導線W1的接墊P2。第二顆發光元件10的陽極與陰極分別電性連接導線W1的接墊P1與導線W2的接墊P2。第三顆發光元件10的陽極與陰極分別電性連接導線W2的接墊P1與導線W3的接墊P2。第四顆發光元件10的陽極與陰極分別電性連接導線W3的接墊P1與導線WN的接墊P2。因此,各個發光元件10的陽極與陰極分別電性連接相鄰的接墊P1與接墊P2,使同一個裝設區IA內的這些發光元件10可以經由導線WP、W3、W2、W1及WN而彼此電性串聯。Specifically, four light-emitting elements 10 are arranged in one installation area IA, and the anode and the cathode of the first light-emitting element 10 are electrically connected to the pads P1 of the wire WP and the pads P2 of the wire W1, respectively. The anode and the cathode of the second light-emitting element 10 are respectively electrically connected to the pad P1 of the wire W1 and the pad P2 of the wire W2. The anode and the cathode of the third light-emitting element 10 are electrically connected to the pad P1 of the wire W2 and the pad P2 of the wire W3, respectively. The anode and the cathode of the fourth light-emitting element 10 are respectively electrically connected to the pad P1 of the wire W3 and the pad P2 of the wire WN. Therefore, the anodes and cathodes of each light-emitting element 10 are electrically connected to the adjacent pads P1 and P2 respectively, so that the light-emitting elements 10 in the same mounting area IA can be connected via the wires WP, W3, W2, W1 and WN. and are electrically connected in series with each other.

需要說明的是,由於導線W1、W2及W3各自具有兩個接墊P1與兩個接墊P2,導線WP具有兩個接墊P1,導線WN具有兩個接墊P2,因此同一個裝設區IA內可以裝設八顆發光元件10。在一些實施例中,各個裝設區IA僅會裝設四顆發光元件10,因此部的接墊P1與部分的接墊P22不會電性連接任何發光元件10。It should be noted that since the wires W1, W2 and W3 each have two pads P1 and two pads P2, the wire WP has two pads P1, and the wire WN has two pads P2, so the same installation area Eight light-emitting elements 10 can be installed in the IA. In some embodiments, only four light-emitting elements 10 are installed in each mounting area IA, so part of the pads P1 and part of the pads P22 are not electrically connected to any light-emitting elements 10 .

由此可知,各條導線W1、W2及W3具有至少一個接墊P1與一個接墊P2。導線WP具有至少一個接墊P1。導線WN具有至少一個接墊P2。因此,第1B圖所示的接墊P1與接墊P2的數量減少,並且不限制以上接墊P1的數量以及接墊P2的數量。It can be seen from this that each of the wires W1, W2 and W3 has at least one pad P1 and one pad P2. The wire WP has at least one pad P1. Conductor WN has at least one pad P2. Therefore, the number of the pads P1 and P2 shown in FIG. 1B is reduced, and the above number of the pads P1 and the number of the pads P2 are not limited.

詳細而言,導線WP的第一端電性連接公共電極Pc,並且導線WP的接墊P1設置在區間Z1,使得導線WP沿第二方向D2延伸且跨越走線N1~N5。導線WN的第一端電性連接走線N1,並且導線WN的接墊P2設置在區間Z1,使導線WN沿第二方向D2延伸且跨越走線N2~N5。In detail, the first end of the wire WP is electrically connected to the common electrode Pc, and the pad P1 of the wire WP is disposed in the zone Z1, so that the wire WP extends along the second direction D2 and spans the traces N1-N5. The first end of the wire WN is electrically connected to the wire N1, and the pad P2 of the wire WN is disposed in the zone Z1, so that the wire WN extends along the second direction D2 and spans the wires N2-N5.

導線W1的接墊P2設置在區間Z1,並且導線W1的接墊P1設置在區間Z2,使導線W1沿第二方向D2延伸且跨越走線N6~N16。導線W2的接墊P1及P2皆為設置在區間Z2,使導線W2沿第一方向D1延伸。導線W3的接墊P1設置在區間Z1,並且導線W3的接墊P2設置在區間Z2,使導線W3沿第二方向D2延伸且跨越走線N6~N16。The pads P2 of the wire W1 are arranged in the zone Z1, and the pads P1 of the wires W1 are arranged in the zone Z2, so that the wires W1 extend along the second direction D2 and span the traces N6-N16. The pads P1 and P2 of the wire W2 are both disposed in the zone Z2, so that the wire W2 extends along the first direction D1. The pad P1 of the wire W3 is set in the zone Z1, and the pad P2 of the wire W3 is set in the zone Z2, so that the wire W3 extends along the second direction D2 and spans the traces N6-N16.

值得注意的是,在裝設發光元件10之前,導線W1、W2及W3皆是浮接線(floating wiring)。亦即,即使在走線N1~N18與公共電極Pc施加檢測電壓,理想情形中,導線W1、W2及W3的電位實質上不應有變化,導線W1、W2及W3係在浮接(floating)狀態。換言之,在理想情形中,在裝設發光元件10之前,導線W1、W2及W3為浮接導線。It should be noted that, before the light-emitting element 10 is installed, the wires W1 , W2 and W3 are all floating wirings. That is, even if a detection voltage is applied to the traces N1-N18 and the common electrode Pc, in an ideal situation, the potentials of the wires W1, W2 and W3 should not change substantially, and the wires W1, W2 and W3 are floating. state. In other words, in an ideal situation, before installing the light-emitting element 10 , the wires W1 , W2 and W3 are floating wires.

需要說明的是,在第1C圖所示的電路基板100a在第17行第1列的裝設區IA之中,走線層僅具有走線N17~N18,而不會有走線N1~N16。換言之,電路基板100a在第17行第1列的裝設區IA之中,區間Z3不會有走線N1~N16。因此,電路基板100a在第17行第1列的裝設區IA之中,導線層中的導線WN會電性耦接至走線N17而不會跨越走線N1~N16。It should be noted that, in the installation area IA of the circuit board 100a shown in FIG. 1C in the 17th row and the 1st column, the wiring layer only has the wirings N17-N18, but does not have the wirings N1-N16 . In other words, in the installation area IA of the 17th row and the 1st column of the circuit board 100a, there are no traces N1-N16 in the zone Z3. Therefore, in the mounting area IA of the 17th row and the 1st column of the circuit substrate 100a, the wires WN in the wire layer are electrically coupled to the traces N17 without crossing the traces N1-N16.

如此一來,在導線WP、WN、W1、W2及W3的特定位置配置情形下,電路基板100a各個裝設區IA中的導線WN全部都不會跨越走線N6~N16。In this way, when the wires WP, WN, W1, W2 and W3 are arranged at specific positions, all the wires WN in each mounting area IA of the circuit substrate 100a will not cross the wires N6-N16.

在裝設發光元件10之前,為了檢測導線層中的導線WP、W1、W2、W3其中一者是否與走線N6~N16其中一者發生異常短路,將進行檢測流程S200。請參閱第2圖。第2圖為依據本揭示實施例的檢測流程S200的示意圖。第2圖包含步驟S210、S220、S230、S240、S241、S242以及S243。在一些實施例中,步驟S210~S240可以由電子束檢測(Electrons Beam inspection;EBI)或是由PDI公司的電壓影像光學系統(Voltage Imaging optical subsystem;VIOS)實施。Before installing the light-emitting element 10, in order to detect whether one of the wires WP, W1, W2, and W3 in the wire layer is abnormally short-circuited with one of the wires N6-N16, a detection process S200 is performed. See Figure 2. FIG. 2 is a schematic diagram of a detection process S200 according to an embodiment of the present disclosure. FIG. 2 includes steps S210, S220, S230, S240, S241, S242, and S243. In some embodiments, steps S210-S240 may be implemented by electron beam inspection (Electrons Beam inspection; EBI) or by a voltage imaging optical system (Voltage Imaging optical subsystem; VIOS) of PDI Corporation.

在步驟S210中,施加第一檢測電壓至公共電極Pc。並且,在步驟S220中,施加第二檢測電壓至走線N1~N18。第一檢測電壓相異於第二檢測電壓,並且第一檢測電壓的絕對值大於第二檢測電壓的絕對值。In step S210, a first detection voltage is applied to the common electrode Pc. And, in step S220, the second detection voltage is applied to the wires N1-N18. The first detection voltage is different from the second detection voltage, and the absolute value of the first detection voltage is greater than the absolute value of the second detection voltage.

在步驟S230中,藉由液晶檢測盒檢測導線WP、W1、W2、W3及WN各自的接墊P1及P2亮度。在這個步驟中,延續步驟S210的操作,維持施加第一檢測電壓至公共電極Pc與施加第二檢測電壓至走線N 1~N18,並將液晶檢測盒設置在電路基板100a之上。如此,液晶檢測盒的各個畫素中的液晶會依據電路基板100a上的電位/電場而偏轉(例如,接收第一檢測電壓的導線WP與接收第二檢測電壓的導線WN),因此液晶檢測盒會對應於電路基板100a中各個位置的電位/電場大小而顯示檢測畫面,換句話說,液晶檢測盒所顯示的檢測畫面會依據電路基板100a中各個位置的電位/電場大小會而呈現不同的亮度/灰階。In step S230, the brightness of the pads P1 and P2 of the wires WP, W1, W2, W3 and WN, respectively, is detected by the liquid crystal detection cell. In this step, continuing the operation of step S210, maintaining the application of the first detection voltage to the common electrode Pc and the application of the second detection voltage to the traces N1-N18, and disposing the liquid crystal detection cell on the circuit substrate 100a. In this way, the liquid crystal in each pixel of the liquid crystal detection cell is deflected according to the potential/electric field on the circuit substrate 100a (for example, the wire WP receiving the first detection voltage and the wire WN receiving the second detection voltage), so the liquid crystal detection cell The detection screen will be displayed corresponding to the magnitude of the potential/electric field at each position in the circuit substrate 100a. In other words, the detection screen displayed by the liquid crystal detection box will show different brightness according to the magnitude of the potential/electric field at each position in the circuit substrate 100a. /grayscale.

舉例而言,在液晶檢測盒所顯示的檢測畫面中,導線WP的接墊P1在第一預期值,導線WN的接墊P2在第二預期值。由於第二檢測電壓的絕對值大於第一檢測電壓的絕對值,因此第一預期值大於第二預期值。並且,在後續實施例中,將接收第一檢測電壓的導線WP的接墊P1透過液晶檢測盒所呈現的亮度視為第一預期值(例如,白色),將接收第二檢測電壓的導線WN的接墊P2透過液晶檢測盒所呈現的亮度視為第二預期值(例如,灰色),並將理論上未接收電壓的導線W1及W3的接墊P1及P2透過液晶檢測盒所呈現的亮度視為第三預期值(例如,黑色)。For example, in the detection screen displayed by the liquid crystal detection box, the pad P1 of the wire WP is at the first expected value, and the pad P2 of the wire WN is at the second expected value. Since the absolute value of the second detection voltage is greater than the absolute value of the first detection voltage, the first expected value is greater than the second expected value. In addition, in the following embodiments, the brightness presented by the pad P1 of the wire WP receiving the first detection voltage through the liquid crystal detection cell is regarded as the first expected value (for example, white), and the wire WN receiving the second detection voltage is regarded as the first expected value. The brightness presented by the pad P2 through the liquid crystal detection cell is regarded as the second expected value (eg, gray), and the brightness presented by the pads P1 and P2 of the wires W1 and W3 that theoretically do not receive voltage through the liquid crystal detection cell Treated as the third expected value (eg, black).

在步驟S240中,判斷導線W1及W3各自的接墊P1及P2在檢測畫面中的亮度是否在第三預期值。在這個步驟中,由於在步驟S210以及步驟S220中分別施加第一檢測電壓以及第二檢測電壓至公共電極Pc以及走線N1~N18,若在一個裝設區IA中的導線W1及導線W3其中一者與走線N6~N16其中一者發生異常短路,第二檢測電壓就會經由前述的走線N6~N16其中一者傳送至導線W1及導線W3其中一者,使導線W1及導線W3其中一者的電位升高。此時,導線W1及導線W3其中一者的接墊P1及P2在檢測畫面中的亮度便會相異於第三預期值(例如,黑色)。In step S240, it is determined whether the brightness of the respective pads P1 and P2 of the wires W1 and W3 in the detection screen is at a third expected value. In this step, since the first detection voltage and the second detection voltage are respectively applied to the common electrode Pc and the wires N1-N18 in the steps S210 and S220, if the wire W1 and the wire W3 in one installation area IA are among the One is abnormally short-circuited with one of the traces N6-N16, and the second detection voltage is transmitted to one of the wire W1 and the wire W3 through one of the above-mentioned traces N6-N16, so that the wire W1 and the wire W3 are among the The potential of one rises. At this time, the brightness of the pads P1 and P2 of one of the wire W1 and the wire W3 in the detection screen will be different from the third expected value (eg, black).

換言之,若電路基板100a未發生異常短路而是在理想狀態,導線WP的接墊P1在檢測畫面中的亮度應為第一預期值(例如,白色),導線WN的接墊P2在檢測畫面中的亮度應為第二預期值(例如,灰色),導線W1、W2及W3的接墊P1及P2在檢測畫面中的亮度應為第三預期值(例如,黑色)。In other words, if the circuit substrate 100a is not abnormally short-circuited but is in an ideal state, the brightness of the pad P1 of the wire WP in the detection screen should be the first expected value (eg, white), and the pad P2 of the wire WN in the detection screen. should be the second expected value (eg, gray), and the brightness of the pads P1 and P2 of the wires W1, W2 and W3 in the detection screen should be the third expected value (eg, black).

因此,假設導線W3與走線N15發生異常短路,第二檢測電壓經由走線N15傳送至導線W3。此時,在由液晶檢測盒所顯示的檢測畫面中,導線W3的接墊P1及P2的亮度會相異於第三預期值(例如,黑色),而可能會顯示第二預期值(例如,灰色)或小於第二預期值(例如,深灰色)。Therefore, assuming that the wire W3 and the wire N15 are abnormally short-circuited, the second detection voltage is transmitted to the wire W3 through the wire N15. At this time, in the detection screen displayed by the liquid crystal detection cell, the brightness of the pads P1 and P2 of the wire W3 will be different from the third expected value (for example, black), and may display the second expected value (for example, gray) or less than a second expected value (eg, dark gray).

在另一些實施例中,導線W1及導線W3其中一者的接墊P1及P2在檢測畫面中的亮度會相異於其他裝設區內IA導線W1及導線W3的接墊P1及P2在檢測畫面的亮度,從而判斷導線W1及導線W3其中一者是否與走線N6~N16其中一者發生異常短路。In other embodiments, the brightness of the pads P1 and P2 of one of the wire W1 and the wire W3 in the detection screen will be different from that of the pads P1 and P2 of the IA wire W1 and the wire W3 in the other installation areas during the detection The brightness of the screen is used to determine whether one of the wires W1 and W3 is abnormally short-circuited with one of the wires N6 to N16.

舉例而言,若一個裝設區IA內導線W1的接墊P1及P2在檢測畫面中的亮度相異於其他裝設區IA內導線W1的接墊P1及P2在檢測畫面中的亮度,則判斷導線W1與走線N6~N16其中一者發生異常短路。如此一來,可以在裝設發光元件10之前汰換電路基板100a,藉此減少整體製程的成本。並且,可以篩選出合格的電路基板100a,從而提升背光燈板與顯示器的良率。For example, if the brightness of the pads P1 and P2 of the wire W1 in one installation area IA in the detection screen is different from the brightness of the pads P1 and P2 of the wire W1 in the other installation area IA in the detection screen, then It is judged that there is an abnormal short circuit between the wire W1 and one of the traces N6~N16. In this way, the circuit substrate 100a can be replaced before the light-emitting element 10 is installed, thereby reducing the cost of the overall process. In addition, qualified circuit substrates 100a can be screened out, thereby improving the yield of the backlight panel and the display.

在另一些實施例中,導線W1及導線W3各自是由複數條金屬線並聯而成。在本揭示的實施例中,這些金屬線的線寬約為10~30μm,這些金屬線中之相鄰兩者之間的間距約為5~15μm,並且導線W1及導線W3各自是由大約由10條金屬線組成。如此,若在步驟S240中判斷導線W1及導線W3其中一者與走線N6~N16其中一者發生異常短路之後,便可進行步驟S242,判斷與走線N6~N16發生異常短路的導線W1及W3的金屬線其中一者。In other embodiments, the wire W1 and the wire W3 are each formed by a plurality of metal wires in parallel. In the embodiment of the present disclosure, the line width of the metal lines is about 10-30 μm, the distance between two adjacent ones of the metal lines is about 5-15 μm, and the wires W1 and W3 are each formed by about Consists of 10 metal wires. In this way, if it is determined in step S240 that one of the wires W1 and W3 is abnormally short-circuited with one of the wires N6-N16, step S242 can be performed to determine the wires W1 and the wires W1 that are abnormally short-circuited with the wires N6-N16. One of the metal wires of W3.

舉例而言,在步驟S240中判斷在一個裝設區IA中的導線W1與走線N6~N16其中一者發生異常短路。接續,藉由光學顯微鏡透過高解析度光學影像檢測在此裝設區IA中的導線W1與走線N6~N16,以判斷與走線N6~N16其中一者異常短路的導線W1中的金屬線。並且,接續步驟S243,切斷與走線N6~N16其中一者發生異常短路的導線W1中的金屬線。其中,切斷金屬線可以由雷射切割實施。For example, in step S240, it is determined that one of the wires W1 and the wires N6-N16 in one installation area IA is abnormally short-circuited. Then, use an optical microscope to detect the wire W1 and the wires N6-N16 in the installation area IA through a high-resolution optical image, so as to determine the metal wire in the wire W1 that is abnormally short-circuited with one of the wires N6-N16 . In addition, following step S243, the metal wire in the wire W1 that is abnormally short-circuited with one of the wires N6 to N16 is cut off. The cutting of the metal wire may be implemented by laser cutting.

如此,即便在製程中導線W1或W3透過微小粒子(例如,6µm~10µm的粒子)與走線N6~N16其中一者發生異常短路,透過步驟S210、S220、S230、S240、S242以及S243便可判斷並切斷發生異常短路的導線W1或W3中的金屬線。進一步來說,由於單條金屬線寬可設置為10~30μm,切斷單條金屬線後對導線W1或W3的電阻的影響小於0.2歐姆的變化量,因此可以忽略不計。如此一來,可以在裝設發光元件10之前維修電路基板100a,藉此減少整體製程的成本。In this way, even if the wires W1 or W3 pass through tiny particles (for example, particles of 6µm~10µm) and one of the wires N6~N16 is abnormally short-circuited during the process, the steps S210, S220, S230, S240, S242 and S243 can Determine and cut off the metal wire in the wire W1 or W3 that has an abnormal short circuit. Further, since the width of a single metal line can be set to be 10-30 μm, the influence on the resistance of the wire W1 or W3 after cutting the single metal line is less than the change of 0.2 ohms, so it can be ignored. In this way, the circuit substrate 100a can be repaired before installing the light-emitting element 10, thereby reducing the cost of the overall process.

值得注意的是,由於電路基板100a中各個裝設區IA的大小相對液晶顯示器電路基板的畫素的大小大非常多,因而光學顯微鏡較難同時檢測電路基板100a中的多個裝設區IA,而可能僅能一次檢測電路基板100a中的一個裝設區的部分位置,因此本揭示文件需要透過步驟S210~S240來同時檢測電路基板100a中各個裝設區IA的導線W1及W3與走線N6~N16是否異常短路。It is worth noting that since the size of each installation area IA in the circuit substrate 100a is much larger than the size of the pixel of the liquid crystal display circuit substrate, it is difficult for an optical microscope to detect the multiple installation areas IA in the circuit substrate 100a at the same time. However, it may only be possible to detect a part of the position of one installation area in the circuit substrate 100a at one time. Therefore, the present disclosure needs to simultaneously detect the wires W1 and W3 and the trace N6 of each installation area IA in the circuit substrate 100a through steps S210-S240. Whether ~N16 is abnormally short-circuited.

在一些實施例中,亦可判斷導線WP與走線N1~N5是否發生異常短路。舉例而言,若導線WP與走線N4發生異常短路,第一檢測電壓經由導線WP傳送至走線N4。此時,在由液晶檢測盒所顯示的檢測畫面中,走線N4的亮度會相異於第二預期值(例如,灰色),而可能會顯示為第一預期值(例如,白色)或小於第一預期值且大於第二預期值的亮度/灰階(例如,淺灰色)。In some embodiments, it can also be determined whether the wire WP and the wires N1-N5 are abnormally short-circuited. For example, if the wire WP and the wire N4 are abnormally short-circuited, the first detection voltage is transmitted to the wire N4 through the wire WP. At this time, in the detection screen displayed by the liquid crystal detection box, the brightness of the trace N4 will be different from the second expected value (eg, gray), and may be displayed as the first expected value (eg, white) or less than Brightness/grayscale (eg, light gray) of the first expected value and greater than the second expected value.

在步驟S230藉由液晶檢測盒檢測電路基板100a上所有導線WP各自的接墊P1在檢測畫面的亮度。若一個裝設區IA內導線WP的接墊P1在檢測畫面中的亮度小於其他裝設區IA內的導線WP的接墊P1在檢測畫面中的亮度,便判斷在此裝設區IA內的導線WP與走線N1~N5其中一者發生短路。如此一來,可以篩選出合格的電路基板100a,從而提升背光燈板與顯示器的良率。In step S230, the liquid crystal detection cell is used to detect the brightness of the screen on the respective pads P1 of all the wires WP on the circuit substrate 100a. If the brightness of the pads P1 of the wires WP in one installation area IA in the detection screen is lower than the brightness of the pads P1 of the wires WP in the other installation areas IA in the detection screen, it is determined that the brightness of the pads P1 in the installation area IA is The wire WP is short-circuited with one of the traces N1 to N5. In this way, qualified circuit substrates 100a can be screened out, thereby improving the yield of the backlight panel and the display.

請參閱第3A圖,第3A圖是依據本揭示文件的電路基板100b的俯視圖的示意圖。第3A圖僅繪示電路基板100b中第1行至第4行中2列的裝設區IA。電路基板100b用以裝設1152顆發光元件10,並且電路基板100b中的每個裝設區IA用以裝設4顆發光元件10。電路基板100b中的288個裝設區IA是以18行×16列的矩陣排列,在每個裝設區IA中所設置的4顆發光元件是以2行×2列的矩陣排列。電路基板100b的裝設區IA的排列方式相似於電路基板100a,並且在電路基板100b中待裝設的發光元件10亦相似於在電路基板100a中待裝設的發光元件10,在此不再贅述。Please refer to FIG. 3A. FIG. 3A is a schematic diagram of a top view of the circuit substrate 100b according to the present disclosure. FIG. 3A only shows the mounting area IA in the first row to the fourth row and two columns in the circuit substrate 100b. The circuit substrate 100b is used for mounting 1152 light-emitting elements 10 , and each mounting area IA in the circuit substrate 100b is used for mounting four light-emitting elements 10 . The 288 mounting areas IA in the circuit substrate 100b are arranged in a matrix of 18 rows×16 columns, and the four light-emitting elements arranged in each mounting area IA are arranged in a matrix of 2 rows×2 columns. The arrangement of the mounting area IA of the circuit substrate 100b is similar to that of the circuit substrate 100a, and the light-emitting elements 10 to be mounted in the circuit substrate 100b are also similar to the light-emitting elements 10 to be mounted in the circuit substrate 100a, which are not repeated here. Repeat.

請一併參閱第3B圖,第3B圖繪示電路基板100b在第1行第1列的裝設區IA的示意圖。如第3B圖所示,裝設區IA包含導線WP、W1、W2、W3以及WN、多條走線NL以及公共電極Pc。多條走線NL以及公共電極Pc設置在走線層,並且多條走線WL包含走線N1~N18。多條導線WP、W1、W2、W3以及WN設置在導線層,導線層相異於走線層。在第3B圖中導線WP、W1、W2、W3以及WN的設置方式與第1B圖中的導線WP、W1、W2、W3以及WN的設置方式為鏡像對稱。換句話說,第1B圖中導線WP、W1、W2、W3及WN從公共電極Pc至走線N1沿逆時針方向依序排列。在第3B圖中導線WP、W1、W2、W3及WN從公共電極Pc至走線N1沿順時針的方向依序排列。Please also refer to FIG. 3B. FIG. 3B is a schematic diagram of the mounting area IA of the circuit board 100b in the first row and the first column. As shown in FIG. 3B, the installation area IA includes wires WP, W1, W2, W3, and WN, a plurality of wires NL, and a common electrode Pc. The multiple wirings NL and the common electrode Pc are disposed on the wiring layer, and the multiple wirings WL include the wirings N1 to N18. A plurality of wires WP, W1, W2, W3 and WN are arranged on the wire layer, and the wire layer is different from the wiring layer. The arrangement of the wires WP, W1, W2, W3, and WN in Fig. 3B is mirror-symmetrical to the arrangement of the wires WP, W1, W2, W3, and WN in Fig. 1B. In other words, the wires WP, W1, W2, W3 and WN in FIG. 1B are sequentially arranged in the counterclockwise direction from the common electrode Pc to the wiring N1. In FIG. 3B, the wires WP, W1, W2, W3 and WN are sequentially arranged in a clockwise direction from the common electrode Pc to the wiring N1.

在第3A圖以及第3B圖所示的實施例中,也是將導線W1及W3設置為跨越走線N6~N16,因此亦可透過步驟S210~S230判斷導線W1及W3與走線N6~N16之間是否發生異常短路。並且,導線W1及W3亦可各自由多條金屬線組成,以在導線W1及W3與走線N6~N16之間發生異常短路時,透過步驟S242及243判斷並切斷發生異常短路的金屬線,便可在裝設發光元件10之前維修異常短路的電路基板100b,從而提升背光燈板與顯示器的良率。In the embodiment shown in FIG. 3A and FIG. 3B, the wires W1 and W3 are also set to cross the wires N6-N16, so it is also possible to determine the difference between the wires W1 and W3 and the wires N6-N16 through steps S210-S230. Whether an abnormal short circuit occurs between them. In addition, the wires W1 and W3 can also each be composed of a plurality of metal wires, so that when an abnormal short circuit occurs between the wires W1 and W3 and the traces N6-N16, the steps S242 and 243 are used to determine and cut off the abnormal short circuit metal wire. , the abnormal short circuit substrate 100b can be repaired before the light-emitting element 10 is installed, thereby improving the yield rate of the backlight panel and the display.

請參閱第4A圖,第4A圖是依據本揭示文件的電路基板100c的俯視圖的示意圖。第4A圖僅繪示電路基板100c中第1行至第4行中2列的裝設區IA。電路基板100c用以裝設1152顆發光元件10,並且電路基板100b中的每個裝設區IA用以裝設4顆發光元件10。電路基板100c中的288個裝設區IA是以18行×16列的矩陣排列,在每個裝設區IA中所設置的4顆發光元件是以2行×2列的矩陣排列。電路基板100c的裝設區IA的排列方式相似於電路基板100a,並且在電路基板100c中待裝設的發光元件10亦相似於在電路基板100a中待裝設的發光元件10,在此不再贅述。Please refer to FIG. 4A. FIG. 4A is a schematic diagram of a top view of the circuit substrate 100c according to the present disclosure. FIG. 4A only shows the mounting area IA in the first row to the fourth row and two columns in the circuit substrate 100c. The circuit substrate 100c is used for mounting 1152 light-emitting elements 10 , and each mounting area IA in the circuit substrate 100b is used for mounting four light-emitting elements 10 . The 288 mounting areas IA in the circuit substrate 100c are arranged in a matrix of 18 rows×16 columns, and the four light-emitting elements arranged in each mounting area IA are arranged in a matrix of 2 rows×2 columns. The arrangement of the mounting area IA of the circuit substrate 100c is similar to that of the circuit substrate 100a, and the light-emitting element 10 to be mounted in the circuit substrate 100c is also similar to the light-emitting element 10 to be mounted in the circuit substrate 100a, which is not repeated here. Repeat.

請一併參閱第4B圖,第4B圖繪示電路基板100c在第1行第1列的裝設區IA的示意圖。如第4B圖所示,裝設區IA包含導線WP、W1、W2、W3以及WN、多條走線NL以及公共電極Pc。多條走線NL以及公共電極Pc設置在走線層,並且多條走線NL包含走線N1~N18。多條導線WP、W1、W2、W3以及WN設置在導線層,導線層相異於走線層。並且,在投影平面上,區間Z1在走線N5與走線N6之間,區間Z2在走線N16與走線N17之間。區間Z3在區間Z1以及Z2之間。Please also refer to FIG. 4B. FIG. 4B is a schematic diagram of the mounting area IA of the circuit board 100c in the first row and the first column. As shown in FIG. 4B , the installation area IA includes wires WP, W1 , W2 , W3 and WN, a plurality of wires NL and a common electrode Pc. The multiple wirings NL and the common electrode Pc are disposed on the wiring layer, and the multiple wirings NL include the wirings N1 to N18. A plurality of wires WP, W1, W2, W3 and WN are arranged on the wire layer, and the wire layer is different from the wiring layer. Moreover, on the projection plane, the interval Z1 is between the route N5 and the route N6, and the interval Z2 is between the route N16 and the route N17. Zone Z3 is between zones Z1 and Z2.

與第1B圖之實施例中電路基板100a相較,第4B圖之實施例中電路基板100c不同之處在於,導線WP、WN、W1、W2及W3的排列方式。Compared with the circuit substrate 100a of the embodiment of FIG. 1B, the circuit substrate 100c of the embodiment of FIG. 4B is different in the arrangement of the wires WP, WN, W1, W2 and W3.

詳細而言,在第4B圖所示的電路基板100c中,導線WP的第一端電性連接公共電極Pc,並且導線WP的接墊P1設置在區間Z2,使得導線WP沿第二方向D2延伸且跨越走線N1~N5以及走線N6~N16。導線WN的第一端電性連接走線N1,並且導線WN的接墊P2設置在區間Z1,使導線WN沿第二方向D2延伸且跨越走線N2~N5。導線W1的接墊P1及接墊P2設置在區間Z2,使導線W1沿第一方向D1延伸。導線W2的接墊P2設置在區間Z2,並且導線W2的接墊P1設置在區間Z1,使導線W1沿第二方向D2延伸且跨越走線N6~N16。導線W3的接墊P1及接墊P2設置在區間Z2,使導線W3沿第二方向D2延伸。In detail, in the circuit substrate 100c shown in FIG. 4B, the first end of the wire WP is electrically connected to the common electrode Pc, and the pad P1 of the wire WP is arranged in the zone Z2, so that the wire WP extends along the second direction D2 And it crosses the traces N1~N5 and the traces N6~N16. The first end of the wire WN is electrically connected to the wire N1, and the pad P2 of the wire WN is disposed in the zone Z1, so that the wire WN extends along the second direction D2 and spans the wires N2-N5. The pads P1 and P2 of the wire W1 are arranged in the zone Z2, so that the wire W1 extends along the first direction D1. The pad P2 of the wire W2 is set in the zone Z2, and the pad P1 of the wire W2 is set in the zone Z1, so that the wire W1 extends along the second direction D2 and spans the traces N6-N16. The pads P1 and P2 of the wire W3 are arranged in the zone Z2, so that the wire W3 extends along the second direction D2.

在裝設發光元件10之前,為了檢測電路基板100c的導線層中的導線WP、W1、W2、W3及WN其中一者是否與與多條走線N6~N16其中一者發生異常短路,亦可進行如第2圖所示的檢測流程S200。第2圖的檢測流程S200包含步驟S210、S220、S230、S240、S241、S242以及S243。Before installing the light-emitting element 10, in order to detect whether one of the wires WP, W1, W2, W3 and WN in the wire layer of the circuit substrate 100c is abnormally short-circuited with one of the plurality of wires N6-N16, the The detection flow S200 shown in FIG. 2 is performed. The detection flow S200 in FIG. 2 includes steps S210 , S220 , S230 , S240 , S241 , S242 and S243 .

在步驟S210中,施加第一檢測電壓至公共電極Pc。並且,在步驟S220中,施加第二檢測電壓至走線N1~N18。第一檢測電壓相異於第二檢測電壓,並且第一檢測電壓的絕對值大於第二檢測電壓的絕對值。In step S210, a first detection voltage is applied to the common electrode Pc. And, in step S220, the second detection voltage is applied to the wires N1-N18. The first detection voltage is different from the second detection voltage, and the absolute value of the first detection voltage is greater than the absolute value of the second detection voltage.

在步驟S230中,藉由液晶檢測盒檢測導線WP、W1、W2、W3及WN各自的接墊P1及P2亮度。在這個步驟中,延續步驟S210的操作,維持施加第一檢測電壓至公共電極Pc與施加第二檢測電壓至走線N1~N18,並將液晶檢測盒設置在電路基板100c之上。如此,液晶檢測盒的各個畫素中的液晶會依據電路基板100c上的電位/電場而偏轉(例如,接收第一檢測電壓的導線WP與接收第二檢測電壓的導線WN),因此液晶檢測盒會對應於電路基板100c中各個位置的電位/電場大小而顯示檢測畫面,換句話說,檢測畫面依據電路基板100c中各個位置的電位/電場大小會呈現不同的亮度/灰階。In step S230, the brightness of the pads P1 and P2 of the wires WP, W1, W2, W3 and WN, respectively, is detected by the liquid crystal detection cell. In this step, continuing the operation of step S210, maintaining the application of the first detection voltage to the common electrode Pc and the application of the second detection voltage to the traces N1-N18, and disposing the liquid crystal detection cell on the circuit substrate 100c. In this way, the liquid crystal in each pixel of the liquid crystal detection cell is deflected according to the potential/electric field on the circuit substrate 100c (for example, the wire WP receiving the first detection voltage and the wire WN receiving the second detection voltage), so the liquid crystal detection cell The detection screen is displayed corresponding to the potential/electric field at each position in the circuit substrate 100c. In other words, the detection screen presents different brightness/gray scales according to the potential/electric field at each position in the circuit substrate 100c.

舉例而言,在液晶檢測盒所顯示的檢測畫面中,接收第一檢測電壓的導線WP的接墊P1在第一預期值,接收第二檢測電壓的導線WN的接墊P2在第二預期值。由於第二檢測電壓的絕對值大於第一檢測電壓的絕對值,因此第一預期值大於第二預期值。並且,在後續實施例中,將接收第一檢測電壓的導線WP的接墊P1透過液晶檢測盒的感測而顯示的亮度視為第一預期值(例如,白色),將接收第二檢測電壓的導線WN的接墊P2透過液晶檢測盒的感測所顯示顯示的亮度視為第二預期值(例如,灰色),並將理論上未接收電壓的導線W1及W3的接墊P1及P2透過液晶檢測盒的感測所顯示的亮度視為第三預期值(例如,黑色)。For example, in the detection screen displayed by the liquid crystal detection box, the pad P1 of the wire WP receiving the first detection voltage is at the first expected value, and the pad P2 of the wire WN receiving the second detection voltage is at the second expected value . Since the absolute value of the second detection voltage is greater than the absolute value of the first detection voltage, the first expected value is greater than the second expected value. Moreover, in subsequent embodiments, the brightness displayed by the pad P1 of the wire WP receiving the first detection voltage through the sensing of the liquid crystal detection cell is regarded as the first expected value (eg, white), and the second detection voltage will be received. The brightness displayed by the pad P2 of the wire WN through the sensing of the liquid crystal detection cell is regarded as the second expected value (eg, gray), and the pads P1 and P2 of the wires W1 and W3, which theoretically do not receive voltage, pass through The brightness displayed by the sensing of the liquid crystal cell is regarded as the third expected value (eg, black).

在步驟S240中,判斷導線WP的接墊P1及導線W2的接墊P1及P2在檢測畫面中的亮度是否在各自的預期值。在這個步驟中,由於在步驟S210以及步驟S220中分別施加第一檢測電壓以及第二檢測電壓至公共電極Pc以及走線N1~N18,若在一個裝設區IA中的導線WP與走線N6~N16其中一者發生異常短路,第一檢測電壓就會經由導線WP傳送至走線N6~N16其中一者,使走線N6~N16其中一者電位上升。此時,導線WP的接墊P1在檢測畫面中的亮度會相異於第一預期值(例如,白色),而可能會顯示為第一預期值(例如,灰色)。In step S240, it is determined whether the brightness of the pads P1 of the wire WP and the pads P1 and P2 of the wire W2 in the detection screen is at their respective expected values. In this step, since the first detection voltage and the second detection voltage are respectively applied to the common electrode Pc and the wires N1-N18 in the steps S210 and S220, if the wires WP and the wires N6 in one installation area IA are One of the ~N16 is abnormally short-circuited, and the first detection voltage is transmitted to one of the traces N6 to N16 through the wire WP, so that the potential of one of the traces N6 to N16 rises. At this time, the brightness of the pad P1 of the wire WP in the detection screen may be different from the first expected value (eg, white), and may be displayed as the first expected value (eg, gray).

舉例而言,若導線WP與走線N12發生異常短路,第一檢測電壓經由導線WP傳送至走線N12。此時,導線WP的接墊P1在檢測畫面中的亮度可能會顯示在小於第一預期值的亮度/灰階(例如,灰色)。For example, if the wire WP and the wire N12 are abnormally short-circuited, the first detection voltage is transmitted to the wire N12 through the wire WP. At this time, the brightness of the pad P1 of the wire WP may be displayed at a brightness/gray scale (eg, gray) lower than the first expected value in the detection screen.

另一方面,若在一個裝設區IA中的導線W2與走線N6~N16其中一者發生異常短路,第二檢測電壓就會經由走線N6~N16其中一者傳送至導線W2,使導線W2的電位上升。此時,導線W2的接墊P1及P2在檢測畫面中的亮度會相異於第二預期值(例如,灰色),而可能會顯示為第一預期值(例如,白色)或是小於第一預期值且大於第二預期值的亮度/灰階(例如,淺灰色)。On the other hand, if the wire W2 and one of the wires N6-N16 in one installation area IA are abnormally short-circuited, the second detection voltage will be transmitted to the wire W2 through one of the wires N6-N16, so that the wire The potential of W2 rises. At this time, the brightness of the pads P1 and P2 of the wire W2 in the detection screen will be different from the second expected value (eg, gray), and may be displayed as the first expected value (eg, white) or less than the first value Brightness/grayscale (eg, light gray) of the expected value and greater than the second expected value.

舉例而言,若導線W2與走線N12發生異常短路,第二檢測電壓經由走線N12傳送至導線WP。此時,導線WP的接墊P1在檢測畫面中的亮度可能會顯示為小於第一預期值且大於第二預期值的亮度/灰階(例如,淺灰色)。For example, if the wire W2 and the wire N12 are abnormally short-circuited, the second detection voltage is transmitted to the wire WP through the wire N12. At this time, the brightness of the pad P1 of the wire WP in the detection screen may be displayed as a brightness/gray scale (eg, light gray) that is less than the first expected value and greater than the second expected value.

在另一些實施例中,導線WP及導線W2各自是由複數條金屬線並聯而成。在本揭示的實施例中,這些金屬線的線寬約為10~30μm,這些金屬線中之相鄰兩者之間的間距約為5~15μm,並且導線WP及導線W2各自是由大約由10條金屬線組成。如此,若在步驟S240中判斷導線W1及導線W3其中一者與走線N6~N16其中一者發生異常短路之後,便可進行步驟S242,判斷與走線N6~N16發生異常短路的導線WP及W2的金屬線其中一者。In other embodiments, the wire WP and the wire W2 are each formed by a plurality of metal wires in parallel. In the embodiment of the present disclosure, the line width of the metal lines is about 10-30 μm, the distance between two adjacent ones of the metal lines is about 5-15 μm, and the wire WP and the wire W2 are each formed by about Consists of 10 metal wires. In this way, if it is determined in step S240 that one of the wires W1 and W3 is abnormally short-circuited with one of the wires N6-N16, step S242 can be performed to determine the wires WP and the wires N6-N16 that are abnormally short-circuited. One of the metal wires of W2.

舉例而言,在步驟S240中判斷在一個裝設區IA中的導線WP與走線N6~N16其中一者發生異常短路。接續,藉由光學顯微鏡檢測在此裝設區IA中的導線WP與走線N6~N16,以判斷與走線N6~N16其中一者異常短路的導線WP中的金屬線。並且,接續步驟S243,切斷與走線N6~N16其中一者發生異常短路的導線WP中的金屬線。For example, in step S240, it is determined that the wire WP in one installation area IA is abnormally short-circuited with one of the wires N6-N16. Then, the wire WP and the wires N6-N16 in the installation area IA are detected by an optical microscope to determine the metal wire in the wire WP that is abnormally short-circuited with one of the wires N6-N16. And, following step S243, the metal wire in the wire WP that is abnormally short-circuited with one of the wires N6-N16 is cut off.

在一些實施例中,可透過電子計算機擷取檢測畫面,並運行演算法以自檢測畫面中提取各條導線WP、W1、W2、W3及WN各自的接墊P1及P2在檢測畫面中各自的畫面區塊,從而利用電子計算機運行檢測流程S200以自動判斷各條導線WP、W1、W2、W3是否與走線N6~N16發生異常短路。In some embodiments, the detection picture can be captured by an electronic computer, and an algorithm can be run to extract from the detection picture the respective pads P1 and P2 of each wire WP, W1, W2, W3 and WN in the detection picture. screen block, so that the electronic computer is used to run the detection process S200 to automatically determine whether the wires WP, W1, W2, W3 are abnormally short-circuited with the wires N6-N16.

請參閱第5A圖,第5A圖是依據本揭示文件的電路基板100d的俯視圖的示意圖。第5A圖僅繪示電路基板100d中第1行至第4行中2列的裝設區IA。電路基板100d用以裝設1152顆發光元件10,並且電路基板100d中的每個裝設區IA用以裝設4顆發光元件10。電路基板100d中的288個裝設區IA是以18行×16列的矩陣排列,在每個裝設區IA中所設置的4顆發光元件是以2行×2列的矩陣排列。電路基板100d的裝設區IA的排列方式相似於電路基板100a,並且在電路基板100d中待裝設的發光元件10亦相似於在電路基板100a中待裝設的發光元件10,在此不再贅述。Please refer to FIG. 5A, which is a schematic diagram of a top view of a circuit substrate 100d according to the present disclosure. FIG. 5A only shows the mounting area IA in the first row to the fourth row and two columns in the circuit substrate 100d. The circuit substrate 100 d is used for mounting 1152 light-emitting elements 10 , and each mounting area IA in the circuit substrate 100 d is used for mounting four light-emitting elements 10 . The 288 mounting areas IA in the circuit substrate 100d are arranged in a matrix of 18 rows×16 columns, and the four light-emitting elements arranged in each mounting area IA are arranged in a matrix of 2 rows×2 columns. The arrangement of the mounting area IA of the circuit substrate 100d is similar to that of the circuit substrate 100a, and the light-emitting element 10 to be mounted in the circuit substrate 100d is also similar to the light-emitting element 10 to be mounted in the circuit substrate 100a, which is not repeated here. Repeat.

請一併參閱第5B圖,第5B圖繪示電路基板100d在第1行第1列的裝設區IA的示意圖。如第5B圖所示,裝設區IA包含導線WP、W1、W2、W3以及WN、多條走線NL以及公共電極Pc。多條走線NL以及公共電極Pc設置在走線層,並且多條走線NL包含走線N1~N18。多條導線WP、W1、W2、W3以及WN設置在導線層,導線層相異於走線層。在第5B圖中導線WP、W1、W2、W3以及WN的設置方式與第4B圖中的導線WP、W1、W2、W3以及WN的設置方式為鏡像對稱。換句話說,第5B圖中導線WP、W1、W2、W3及WN從公共電極Pc至走線N1沿逆時針方向依序排列。在第4B圖中導線WP、W1、W2、W3及WN從公共電極Pc至走線N1沿順時針的方向依序排列。Please also refer to FIG. 5B. FIG. 5B is a schematic diagram of the mounting area IA of the circuit board 100d in the first row and the first column. As shown in FIG. 5B , the installation area IA includes wires WP, W1 , W2 , W3 and WN, a plurality of wires NL and a common electrode Pc. The multiple wirings NL and the common electrode Pc are disposed on the wiring layer, and the multiple wirings NL include the wirings N1 to N18. A plurality of wires WP, W1, W2, W3 and WN are arranged on the wire layer, and the wire layer is different from the wiring layer. The arrangement of the wires WP, W1, W2, W3 and WN in Fig. 5B is mirror-symmetrical to the arrangement of the wires WP, W1, W2, W3 and WN in Fig. 4B. In other words, the wires WP, W1, W2, W3 and WN in Fig. 5B are sequentially arranged in the counterclockwise direction from the common electrode Pc to the wiring N1. In FIG. 4B, the wires WP, W1, W2, W3 and WN are sequentially arranged in a clockwise direction from the common electrode Pc to the wiring N1.

在第5A圖以及第5B圖所示的電路基板100d中,仍然是由導線WP及W2跨越走線N6~N16,因此亦可透過步驟S210~S230判斷導線WP及W2與走線N6~N16之間是否發生異常短路。並且,導線WP及W2亦可各自由多條金屬線組成,以在WP及W2與走線N6~N16之間發生異常短路時,透過步驟S242及243判斷並切斷發生異常短路的金屬線,便可在裝設發光元件10之前維修異常短路的電路基板100d,從而提升背光燈板與顯示器的良率。In the circuit board 100d shown in FIG. 5A and FIG. 5B, the wires WP and W2 still cross the wires N6-N16, so it is also possible to determine the relationship between the wires WP and W2 and the wires N6-N16 through steps S210-S230. Whether an abnormal short circuit occurs between them. In addition, the wires WP and W2 can also be composed of a plurality of metal wires, so that when an abnormal short circuit occurs between WP and W2 and the wires N6-N16, through steps S242 and 243, it is determined and cut off the metal wire with the abnormal short circuit. The abnormally short circuited circuit substrate 100d can be repaired before the light-emitting element 10 is installed, thereby improving the yield of the backlight panel and the display.

需要說明的是,在其他的實施例中,假設用以接收第二檢測電壓的導線WN會跨越在區間Z3(跨線區)中用以接收第二檢測電壓的走線N6~N16,則無論導線WN與其跨越的走線N6~N16之間是否發生異常短路,導線WN的接墊P2在檢測畫面中仍會符合第二預期值(例如,灰色)。也就是說,導線WN的接墊P2不能設置在區間Z2,只能設置在區間Z1,使導線WN不會跨越走線N6~N16,如此一來,在步驟S210~S240可以檢測用以接收第一檢測電壓的導線WP、浮接的導線W1、W2或W3是否與用以接收第二檢測電壓的走線N6~N16發生異常短路。It should be noted that, in other embodiments, it is assumed that the wire WN used for receiving the second detection voltage crosses the traces N6-N16 used for receiving the second detection voltage in the zone Z3 (cross-wire zone), no matter Whether an abnormal short circuit occurs between the wire WN and the traces N6 to N16 it crosses, the pad P2 of the wire WN will still meet the second expected value (eg, gray) in the detection screen. That is to say, the pad P2 of the wire WN cannot be set in the zone Z2, but can only be set in the zone Z1, so that the wire WN will not cross the traces N6~N16. In this way, in steps S210~S240, it can be detected for receiving the first Whether a wire WP for detecting the voltage, the floating wire W1, W2 or W3 is abnormally short-circuited with the wires N6-N16 for receiving the second detecting voltage.

換言之,假設此電路基板中的導線WN與跨線區(即區間Z3)當中的走線N6~N16在投影位置上交錯重疊,此時導線WN與走線N6~N16就有可能發生異常短路。並且,由於在步驟S220中導線WN與走線N1~N18均是接收第二檢測電壓,即使導線WN的接墊P2與走線N6~N16發生異常短路,透過液晶檢測盒所顯示的檢測畫面中導線WN的接墊P2仍會符合第二預期值(例如,灰色) 並通過測試,無法分辨導線WN的接墊P2是接收到正確的走線N1上的第二檢測電壓,還是異常接收到走線N6~N16上的第二檢測電壓。In other words, it is assumed that the wire WN in the circuit substrate and the wires N6-N16 in the cross-line area (ie, the zone Z3) are staggered and overlapped at the projected position, and then the wire WN and the wires N6-N16 may be abnormally short-circuited. In addition, since the wire WN and the wires N1-N18 both receive the second detection voltage in step S220, even if the pad P2 of the wire WN and the wires N6-N16 are abnormally short-circuited, the detection screen displayed through the liquid crystal detection box will not be detected. The pad P2 of the wire WN will still meet the second expected value (eg, gray) and pass the test, and it is impossible to distinguish whether the pad P2 of the wire WN receives the correct second detection voltage on the trace N1 or abnormally receives the wire. The second detection voltage on lines N6~N16.

此時,若將發生異常短路的電路基板正常出貨,則可能使發光元件10接收到錯誤的驅動電壓。因此,於本揭示文件的上述實施例中如第1B、3B、4B及5B圖所示,導線WN與位在跨線區(即區間Z3)的多條走線Nb(例如走線N6~N16)在投影位置上不重疊,使得導線WN不會與走線N6~N16發生無法經由步驟S210~S240所檢測的異常短路,並且可以藉由步驟S210~S240檢測用以接收第一檢測訊號的導線WP或是浮接的導線W1、W2、W3是否與在跨線區(即區間Z3)的走線Nb(例如走線N6~N16)發生異常短路,從而在裝設發光元件10之前可以篩選出走線與導線之間發生異常短路的電路基板。At this time, if the circuit board in which the abnormal short-circuit has occurred is shipped normally, the light-emitting element 10 may receive an erroneous driving voltage. Therefore, as shown in Figures 1B, 3B, 4B and 5B in the above-mentioned embodiments of the present disclosure, the wire WN and the plurality of wires Nb (for example, wires N6-N16) located in the jumper region (ie, the zone Z3) ) do not overlap in the projected position, so that the wires WN and the wires N6-N16 do not have abnormal short circuits that cannot be detected by steps S210-S240, and the wires for receiving the first detection signal can be detected by steps S210-S240 Whether the WP or the floating wires W1, W2, W3 are abnormally short-circuited with the traces Nb (such as traces N6-N16) in the cross-line area (ie, the zone Z3), so that the light-emitting element 10 can be filtered out before installing the light-emitting element 10. A circuit board with an abnormal short circuit between wires.

綜上所述,本揭示文件提供的電路基板100a、100b、100c及100d具有導線WP、WN、W1、W2、W3的特定配置位置。由於導線WN在檢測階段接與走線N1~N18接收一樣的第二檢測訊號,若將導線WN設置為跨越走線N6~N16,則無法在檢測階段判斷導線WN與走線走線N6~N16之間是否有異常短路。因此,電路基板100a、100b、100c及100d中導線WP、WN、W1、W2、W3的特定配置位置使導線WN的設置不重疊在區間Z3(跨線區)的走線N6~N16,從而在檢測階段能判斷導線WP、W1、W2或W3是否與走線N6~N16之間發生異常短路。To sum up, the circuit substrates 100a, 100b, 100c and 100d provided by the present disclosure have specific arrangement positions of the wires WP, WN, W1, W2 and W3. Since the wire WN receives the same second detection signal as that received by the wires N1~N18 in the detection stage, if the wire WN is set to cross the wires N6~N16, it is impossible to judge the wire WN and the wires N6~N16 in the detection stage. Whether there is an abnormal short circuit between them. Therefore, the specific arrangement positions of the wires WP, WN, W1, W2 and W3 in the circuit substrates 100a, 100b, 100c and 100d make the arrangement of the wires WN not overlap the wires N6 to N16 in the zone Z3 (cross-wire zone), so that the In the detection stage, it can be judged whether there is an abnormal short circuit between the wires WP, W1, W2 or W3 and the traces N6~N16.

雖然本揭露已以實施方式揭露如上,然其並非用以限定本揭露,任何本領域通具通常知識者,在不脫離本揭露之精神和範圍內,當可作各種之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although the present disclosure has been disclosed as above in embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. The scope of protection disclosed shall be determined by the scope of the appended patent application.

為使本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附符號之說明如下: 100a,100b,100c,100d:電路基板 10:發光元件 IA:裝設區 WP,WN,W1,W2,W3:導線 NL,Na,Nb,Nc:多條走線 N1~N18:走線 Pc:公共電極 P1,P2:接墊 Z1~Z3:區間 D1:第一方向 D2:第二方向 S200:檢測流程 S210,S220,S230,S240,S241,S242,S243:步驟 In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the descriptions of the appended symbols are as follows: 100a, 100b, 100c, 100d: circuit board 10: Light-emitting elements IA: Installation area WP,WN,W1,W2,W3: Wire NL,Na,Nb,Nc: Multiple traces N1~N18: wiring Pc: common electrode P1, P2: pads Z1~Z3: interval D1: first direction D2: Second direction S200: Detection process S210, S220, S230, S240, S241, S242, S243: Steps

為使本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1A圖是依據本揭示文件的電路基板的俯視圖的示意圖。 第1B圖繪示第1A圖中的電路基板在第1行第1列的裝設區的示意圖。 第1C圖繪示第1A圖中的電路基板在第17行第1列的裝設區IA的示意圖。 第2圖為依據本揭示實施例的檢測流程的示意圖。 第3A圖是依據本揭示文件的電路基板的俯視圖的示意圖。 第3B圖繪示第3A圖中的電路基板在第1行第1列的裝設區的示意圖。 第4A圖是依據本揭示文件的電路基板的俯視圖的示意圖。 第4B圖繪示第4A圖中的電路基板在第1行第1列的裝設區的示意圖。 第5A圖是依據本揭示文件的電路基板的俯視圖的示意圖。 第5B圖繪示第5A圖中的電路基板在第1行第1列的裝設區的示意圖。 In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows: FIG. 1A is a schematic diagram of a top view of a circuit substrate according to the present disclosure. FIG. 1B is a schematic diagram of the installation area of the circuit board in the first row and the first column in FIG. 1A . FIG. 1C is a schematic diagram of the mounting area IA of the circuit board in the 17th row and the 1st column of the circuit board in FIG. 1A . FIG. 2 is a schematic diagram of a detection process according to an embodiment of the present disclosure. FIG. 3A is a schematic diagram of a top view of a circuit substrate according to the present disclosure. FIG. 3B is a schematic diagram of the installation area of the circuit board in the first row and the first column in FIG. 3A . FIG. 4A is a schematic diagram of a top view of a circuit substrate according to the present disclosure. FIG. 4B is a schematic diagram of the installation area of the circuit board in the first row and the first column in FIG. 4A . FIG. 5A is a schematic diagram of a top view of a circuit substrate according to the present disclosure. FIG. 5B is a schematic diagram of the installation area of the circuit board in the first row and the first column in FIG. 5A .

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date and number) none Foreign deposit information (please note in the order of deposit country, institution, date and number) none

100a:電路基板 100a: circuit substrate

10:發光元件 10: Light-emitting elements

WP,WN,W1,W2,W3:導線 WP,WN,W1,W2,W3: Wire

NL,Na,Nb,Nc:多條走線 NL,Na,Nb,Nc: Multiple traces

N1~N18:走線 N1~N18: wiring

Pc:公共電極 Pc: common electrode

P1,P2:接墊 P1, P2: pads

Z1~Z3:區間 Z1~Z3: interval

D1:第一方向 D1: first direction

D2:第二方向 D2: Second direction

Claims (11)

一種電路基板,具有複數個裝設區,適用於供複數個發光元件裝設,該電路基板包含: 一走線層,包含複數條走線以及一公共電極,其中該些走線以及該公共電極沿一第一方向延伸,並且該些走線包含: 複數條第一走線,排列相鄰於該公共電極; 複數條第二走線,其中該些第一走線排列在該些第二走線以及該公共電極之間;以及 複數條第三走線,其中該些第二走線排列在該些第一走線以及該些第三走線之間; 一導線層,包含複數條導線,其中該些導線分別設置在該些裝設區,並且在該些裝設區中之其中一者包含: 一第一導線,沿一第二方向延伸,電性耦接該公共電極,其中該第一導線跨越該些第一走線; 複數條彼此分離的第二導線,沿該第二方向延伸,其中該些第二導線跨越該些第二走線; 至少一第三導線,沿該第一方向延伸;以及 一第四導線,沿該第二方向延伸,該第四導線電性耦接該些走線中之一對應者。 A circuit substrate, which has a plurality of installation areas, is suitable for installation of a plurality of light-emitting elements, and the circuit substrate comprises: A wiring layer includes a plurality of wirings and a common electrode, wherein the wirings and the common electrode extend along a first direction, and the wirings include: a plurality of first traces arranged adjacent to the common electrode; a plurality of second wires, wherein the first wires are arranged between the second wires and the common electrode; and a plurality of third wires, wherein the second wires are arranged between the first wires and the third wires; A conductor layer includes a plurality of conductors, wherein the conductors are respectively arranged in the installation areas, and one of the installation areas includes: a first wire extending along a second direction and electrically coupled to the common electrode, wherein the first wire spans the first wires; a plurality of second wires separated from each other extending along the second direction, wherein the second wires span the second wirings; at least one third wire extending along the first direction; and A fourth wire extends along the second direction, and the fourth wire is electrically coupled to a corresponding one of the wires. 如第1項所述之電路基板,其中該些裝設區其中一者用以裝設一第一發光元件、一第二發光元件、一第三發光元件以及一第四發光元件,該第一發光元件、該第二發光元件、該第三發光元件以及該第四發光元透過該第一導線、該些第二導線以及該第三導線件而彼此串聯。The circuit substrate according to item 1, wherein one of the mounting areas is used for mounting a first light-emitting element, a second light-emitting element, a third light-emitting element and a fourth light-emitting element, the first light-emitting element The light-emitting element, the second light-emitting element, the third light-emitting element and the fourth light-emitting element are connected in series with each other through the first wire, the second wires and the third wire. 如第1項所述之電路基板,其中該第四導線不重疊該些第二走線。The circuit substrate of item 1, wherein the fourth wire does not overlap the second wires. 如第1項所述之電路基板,其中當該公共電極接收一第一檢測電壓時並且該些走線接收一第二檢測電壓時,該些第二導線係在浮接狀態,其中該第一檢測電壓相異於該第二檢測電壓。The circuit substrate of item 1, wherein when the common electrode receives a first detection voltage and the traces receive a second detection voltage, the second wires are in a floating state, wherein the first The detection voltage is different from the second detection voltage. 如第1項所述之電路基板,其中該些第二導線各自是由複數條金屬線並聯而成。The circuit substrate according to item 1, wherein each of the second wires is formed of a plurality of metal wires in parallel. 一種檢測方法,用以檢測如請求項5所述之電路基板,該檢測方法包含: 施加一第一檢測電壓至該公共電極; 施加一第二檢測電壓至該些走線,其中該第二檢測電壓相異於該第一檢測電壓; 藉由一液晶檢測盒依據該些導線各自的接墊的電位顯示一檢測畫面; 判斷該些第二導線各自的接墊在該檢測畫面中的亮度是否在預期值; 若該些第二導線其中一者的接墊在該檢測畫面中的亮度相異於預期值; 判斷與該些走線其中一者短路的該些第二導線其中該者中該些金屬線其中一者;以及 切斷與該些走線中之該者短路的該些第二導線中之該者的該些金屬線中之該者。 A detection method for detecting the circuit substrate as claimed in claim 5, the detection method comprising: applying a first detection voltage to the common electrode; applying a second detection voltage to the traces, wherein the second detection voltage is different from the first detection voltage; A detection screen is displayed by a liquid crystal detection box according to the potentials of the respective pads of the wires; judging whether the brightness of the respective pads of the second wires in the detection screen is at the expected value; if the brightness of the pad of one of the second wires in the detection screen is different from the expected value; Determining one of the metal wires among the second wires that are short-circuited with one of the wires; and The one of the metal wires of the one of the second wires that is shorted to the one of the traces is cut off. 一種檢測方法,用以檢測如請求項1所述之電路基板,該檢測方法包含: 施加一第一檢測電壓至該公共電極; 施加一第二檢測電壓至該些走線,其中該第二檢測電壓相異於該第一檢測電壓; 藉由一液晶檢測盒依據該些導線各自的接墊的電位顯示一檢測畫面;以及 判斷該些導線各自的接墊在該檢測畫面中的亮度是否在預期值。 A detection method for detecting the circuit substrate as claimed in claim 1, the detection method comprising: applying a first detection voltage to the common electrode; applying a second detection voltage to the traces, wherein the second detection voltage is different from the first detection voltage; Displaying a detection screen according to the potentials of the respective pads of the wires through a liquid crystal detection box; and It is judged whether the brightness of the respective pads of the wires in the detection screen is at the expected value. 一種電路基板,具有複數個裝設區,適用於供複數個發光元件裝設,該電路基板包含: 一走線層,包含複數條走線以及一公共電極,其中該些走線以及該公共電極沿一第一方向延伸,並且該些走線包含: 複數條第一走線,排列相鄰於該公共電極; 複數條第二走線,其中該些第一走線排列在該些第二走線以及公共電極之間;以及 複數條第三走線,其中該些第二走線排列在該些第一走線以及該些第三走線之間; 一導線層,包含複數條導線,其中該些導線分別設置在該些裝設區,並且在該些裝設區中之其中一者包含: 一第一導線,沿一第二方向延伸,電性耦接該公共電極,其中該第一導線跨越該些第一走線以及該些第二走線; 複數條彼此分離的第二導線,沿該第一方向延伸; 一第三導線,沿該第二方向延伸,跨越該些第二走線;以及 一第四導線,沿該第二方向延伸,該第四導線電性耦接該些走線中之一對應者。 A circuit substrate, which has a plurality of installation areas, is suitable for installation of a plurality of light-emitting elements, and the circuit substrate comprises: A wiring layer includes a plurality of wirings and a common electrode, wherein the wirings and the common electrode extend along a first direction, and the wirings include: a plurality of first traces arranged adjacent to the common electrode; a plurality of second wires, wherein the first wires are arranged between the second wires and the common electrode; and a plurality of third wires, wherein the second wires are arranged between the first wires and the third wires; A conductor layer includes a plurality of conductors, wherein the conductors are respectively arranged in the installation areas, and one of the installation areas includes: a first wire extending along a second direction and electrically coupled to the common electrode, wherein the first wire spans the first wires and the second wires; a plurality of second wires separated from each other, extending along the first direction; a third wire extending along the second direction and crossing the second wires; and A fourth wire extends along the second direction, and the fourth wire is electrically coupled to a corresponding one of the wires. 如第8項所述之電路基板,其中該些裝設區其中一者用以裝設一第一發光元件、一第二發光元件、一第三發光元件以及一第四發光元件,該第一發光元件、該第二發光元件、該第三發光元件以及該第四發光元透過該第一導線、該些第二導線以及該第三導線件而彼此串聯。The circuit substrate according to item 8, wherein one of the mounting areas is used for mounting a first light-emitting element, a second light-emitting element, a third light-emitting element and a fourth light-emitting element, the first light-emitting element The light-emitting element, the second light-emitting element, the third light-emitting element and the fourth light-emitting element are connected in series with each other through the first wire, the second wires and the third wire. 如第8項所述之電路基板,其中該第四導線不重疊該些第二走線。The circuit substrate of item 8, wherein the fourth wire does not overlap the second wires. 如第8項所述之電路基板,其中該第一導線以及該第三導線各自是由複數條金屬線並聯而成。The circuit substrate according to item 8, wherein the first wire and the third wire are each formed of a plurality of metal wires in parallel.
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