TWI766667B - Polishing assembly of processing equipment - Google Patents
Polishing assembly of processing equipment Download PDFInfo
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- TWI766667B TWI766667B TW110115345A TW110115345A TWI766667B TW I766667 B TWI766667 B TW I766667B TW 110115345 A TW110115345 A TW 110115345A TW 110115345 A TW110115345 A TW 110115345A TW I766667 B TWI766667 B TW I766667B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/04—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of metal, e.g. skate blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Abstract
Description
本發明係關於一種機械設備,特別是指一種用於加工高架地板之拋光裝置。The present invention relates to a kind of mechanical equipment, in particular to a polishing device for processing raised floors.
目前高架地板裝置已廣泛應用在防靜電的機房或無塵室中。現有鋁合金壓鑄成型的高架地板經由開模、熔鋁、壓鑄、成型以及修邊等主要五道工序。由於在成型過程中,高架地板的表面和底部會有多處毛邊,這些瑕疵毛邊在安裝過程中,一方面會使得高架地板之間無法緊密貼合,也無法與平臺框架之間貼合,另一方面也不利於工人安裝,且對工人會存在一定的安全隱憂。At present, raised floor devices have been widely used in anti-static computer rooms or clean rooms. The existing aluminum alloy die-casting raised floor goes through five main processes: mold opening, aluminum melting, die casting, forming and trimming. During the molding process, there will be many burrs on the surface and bottom of the raised floor. During the installation process, these flawed burrs will make the raised floors unable to fit closely together, and cannot fit with the platform frame, on the other hand. On the one hand, it is not conducive to the installation of workers, and there will be certain safety concerns for workers.
現有技術主要採用人工方式針對成型後的高架地板的各表面進行微處理,故工人需將高架地板成批運送至對應之加工處,再進行處理作業,不僅生產流程不連續而導致生產效率不高,且每次加工都需浪費大量人力而費時費力。The prior art mainly uses manual methods to perform micro-processing on each surface of the formed raised floor. Therefore, workers need to transport the raised floor to the corresponding processing place in batches, and then carry out the processing operation. Not only the production process is discontinuous, but the production efficiency is not high. , and each processing needs to waste a lot of manpower and time-consuming.
因此,如何克服上述習知技術之種種缺失,實已成為目前業界亟待克服之難題。Therefore, how to overcome the various deficiencies of the above-mentioned conventional technologies has become an urgent problem to be overcome in the current industry.
鑑於上述習知技術之缺失,本發明提供一種加工設備之拋光裝置,係包括:基台,係用以輸送作為目標物之高架地板,其中,該目標物係具有相對之第一表面與第二表面,該第一表面係作為地板面,且該第二表面係具有複數高度不同之骨架,並於該第二表面之角落處設有腳座;以及拋光組件,係配置於該基台上,以於該目標物通過該拋光組件時拋光該目標物之第一表面。In view of the above-mentioned deficiencies in the prior art, the present invention provides a polishing device for processing equipment, comprising: a base for conveying a raised floor as a target, wherein the target has an opposite first surface and a second surface a surface, the first surface is used as a floor surface, and the second surface is provided with a plurality of skeletons with different heights, and feet are arranged at the corners of the second surface; and a polishing component is arranged on the base, The first surface of the target object is polished when the target object passes through the polishing element.
前述之拋光裝置中,該基台係具有一用以遮蓋該拋光組件之罩體、及具有一用以架設該罩體之支撐架,以配合運輸該目標物,使該拋光組件位於該目標物之上方,且該罩體之頂部配置一連通該罩體內部空間之排出埠,以將該拋光組件與該目標物於拋光後所產生之雜質或異物排出。In the aforementioned polishing apparatus, the base has a cover for covering the polishing element, and a support frame for erecting the cover, so as to cooperate with the transportation of the target, so that the polishing element is located on the target The top of the cover is provided with a discharge port communicating with the inner space of the cover, so as to discharge impurities or foreign objects generated after the polishing component and the target object are polished.
前述之拋光裝置中,復包括設於該基台上之定位組件,其限位該目標物,使該拋光組件拋光該目標物之第一表面,且該定位組件係藉由兩座體以可調整高度之方式架設一轉桿件,以於該目標物進行拋光作業之過程中,當該目標物移動至該轉桿件之下方時,該轉桿件壓緊該目標物,並可限制該目標之端側上下位移空間。In the above-mentioned polishing device, it further includes a positioning component disposed on the base, which limits the target object, so that the polishing component polishes the first surface of the target object, and the positioning component can be fixed by two bases. A rotating rod is set up by adjusting the height, so that when the target moves to the bottom of the rotating rod during the polishing operation of the target object, the rotating rod presses the target and can restrain the object. The upper and lower displacement space of the end side of the target.
前述之拋光裝置中,該拋光組件係包含一拋光工具、一設於該基台上之支撐結構、及一以可移動方式設於該支撐結構上以架設該拋光工具之架座,以令該架座位移該拋光工具至所需之位置。例如,該支撐結構之相對兩側之表面上配置有滑軌,且該架座上設有至少一接合該滑軌之滑塊,以令該架座上之滑塊配合該滑軌滑移,使該拋光工具直線上下位移至所需之加工位置。進一步,該架座藉由調整組件相對該支撐結構進行升降。例如,該調整組件係以一驅動器帶動一連動桿位移一用以架設該架座之固定架,以當該驅動器經由一減速機旋轉該連動桿時,令該連動桿驅動該固定架連同該架座一併升降,並使該拋光工具位移至所需之高度位置。In the aforementioned polishing device, the polishing component includes a polishing tool, a support structure disposed on the base, and a frame movably disposed on the support structure to erect the polishing tool, so that the The holder displaces the polishing tool to the desired position. For example, sliding rails are arranged on the surfaces of opposite sides of the support structure, and at least one sliding block engaging the sliding rail is arranged on the frame base, so that the sliding block on the frame base cooperates with the sliding rail to slide, Move the polishing tool up and down in a straight line to the desired processing position. Further, the stand is lifted and lowered relative to the support structure by the adjusting assembly. For example, the adjustment assembly uses a driver to drive a linkage rod to displace a fixed frame for erecting the mount, so that when the driver rotates the linkage rod through a reducer, the linkage rod drives the fixed frame together with the frame The seat rises and falls together, and makes the polishing tool move to the desired height position.
或者,該拋光工具係為砂輪形式,係具有一主桿組件及複數環繞該主桿組件排設成輪狀之砂紙。例如,該主桿組件之內部係穿設連接一轉軸,且該轉軸之兩端部分別接合軸承,以令該轉軸相對該軸承轉動,且該軸承之端部係固定於該架座上。進一步,該轉軸之其中一端部係伸出該軸承而連接一馬達,以藉由該馬達驅動該轉軸旋轉,令旋轉中之該砂紙接觸移動中之目標物而掀翻,使該砂紙之砂面摩擦該目標物而夷平該目標物之第一表面之非平坦處。Alternatively, the polishing tool is in the form of a grinding wheel, and has a main rod assembly and a plurality of sandpapers arranged in a wheel shape around the main rod assembly. For example, a rotating shaft is connected through the inside of the main rod assembly, and the two ends of the rotating shaft are respectively engaged with bearings to make the rotating shaft rotate relative to the bearing, and the ends of the bearing are fixed on the frame seat. Further, one end of the rotating shaft extends out of the bearing and is connected to a motor, so that the rotating shaft is driven by the motor to rotate, so that the rotating sandpaper contacts the moving target and overturns, so that the sand surface of the sandpaper is turned over. Rubbing the target object flattens the unevenness of the first surface of the target object.
由上可知,本發明之拋光裝置,主要藉由將其與研磨裝置、翻轉裝置及整平裝置整合於一生產線上,以於單一生產線上可針對高架地板進行第一與第二表面之加工處理,以加快生產時程而提高生產效率,同時減少人力需求。As can be seen from the above, the polishing device of the present invention is mainly integrated with the grinding device, the turning device and the leveling device in one production line, so that the first and second surfaces of the raised floor can be processed on a single production line. , in order to speed up the production schedule and improve production efficiency, while reducing manpower requirements.
再者,藉由該拋光工具為砂輪形式之設計,以於該目標物通過該定位組件後,旋轉中之砂紙會接觸移動中之目標物而掀翻,使該砂紙之砂面摩擦該目標物而夷平該目標物之第一表面之非平坦處,以達到拋光之目的,故能避免過度移除該目標物之部分第一表面而造成凹陷之問題。Furthermore, because the polishing tool is designed in the form of a grinding wheel, after the target passes through the positioning element, the rotating sandpaper will contact the moving target and overturn, so that the sand surface of the sandpaper rubs the target. The unevenness of the first surface of the target object is leveled to achieve the purpose of polishing, so that the problem of over-removing part of the first surface of the target object and causing depressions can be avoided.
以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。The following specific embodiments are used to illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「下」、「前」、「後」、「左」、「右」、「第一」、「第二」、「第三」、「第四」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those who are familiar with the art, and are not intended to limit the implementation of the present invention. Therefore, it has no technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size should still fall within the scope of the present invention without affecting the effect and the purpose that the present invention can achieve. The technical content disclosed by the invention can be covered within the scope. At the same time, references in this specification such as "up", "down", "front", "rear", "left", "right", "first", "second", "third", "first" The terms "four" and "one" are only used for the convenience of description and are not used to limit the scope of implementation of the present invention. Changes or adjustments in their relative relationships shall also be regarded as The scope in which the present invention can be practiced.
圖1係為本發明之拋光裝置3配置於一加工設備1上之立體示意圖。如圖1所示,該加工設備1係包括:一運輸裝置1a、一研磨裝置2、該拋光裝置3、一翻轉裝置4、以及一整平裝置5。FIG. 1 is a three-dimensional schematic diagram of the
於本實施例中,該加工設備1係將生產線之方向定義為左、右方向(如箭頭方向Y),且將垂直該生產線之方向定義為前、後方向(如箭頭方向X),而將沿該加工設備1之高度方向定義為上、下方向(如箭頭方向Z)。應可理解地,該方位係用於說明本實施例之配置,並無特別限制。In this embodiment, the processing equipment 1 defines the direction of the production line as the left and right directions (such as the arrow direction Y), and defines the direction perpendicular to the production line as the front and rear directions (such as the arrow direction X), and the The height direction along the processing equipment 1 is defined as the up and down direction (eg, the arrow direction Z). It should be understood that the orientation is used to illustrate the configuration of this embodiment, and is not particularly limited.
再者,該加工設備1可藉由人機操控介面1b以可程式邏輯控制器(Programmable Logic Controller,簡稱PLC)方式輸入加工數值,以控制加工處理之運作。Furthermore, the processing equipment 1 can input processing values in a programmable logic controller (Programmable Logic Controller, PLC for short) mode through the man-machine control interface 1b to control the operation of the processing processing.
所述之運輸裝置1a係用於輸送目標物9至所需之生產線之加工位置上,故該運輸裝置1a係對應該研磨裝置2、拋光裝置3、翻轉裝置4及整平裝置5配置,以令該目標物9通過該研磨裝置2、拋光裝置3、翻轉裝置4及整平裝置5上。The transporting device 1a is used to transport the
請同時參閱圖2A,於本實施例中,該運輸裝置1a係採用輸送帶方式運輸該目標物9,且該運輸裝置1a包含一支撐組件11及一設於該支撐組件11上之輸送組件10,以令該輸送組件10位移該目標物9,使該目標物9能抵達每一個加工區。例如,該支撐組件11係為腳架結構,其立設於基礎表面(如地板上)上,且該輸送組件10係具有至少一鍊條結構100及/或一長直條狀之輸送帶101,故當該目標物9置放於該鍊條結構100或輸送帶101上時,該目標物9能穩定沿該鍊條結構100或輸送帶101位移。應可理解地,有關生產線之輸送方式之配置種類繁多,如圖3A及圖4A所示之滾帶組件、如圖5A所示之鍊條組件或其它適當態樣等,並不限於上述。Please also refer to FIG. 2A , in this embodiment, the transport device 1 a uses a conveyor belt to transport the
再者,該目標物9係為高架地板,如圖1A、圖1B及圖1C所示,其具有相對之第一表面9a(如地板面)與第二表面9b(如底側端部)及鄰接該第一表面9a與第二表面9b之側面9c。例如,該目標物9係大致呈矩形體(如正方形板),該目標物9底部(如該第二表面9b之側,其為高架地板底部)係具有高度不同之骨架92,93以形成蜂巢狀,並於該目標物9之第二表面9b之四個角落上形成有腳座90,以於該四個腳座90處依需求設置開孔900,供螺絲將四個腳座90固定於該高架地板用之支撐腳架上。具體地,該腳座90之端面9d係微凸出(如圖1C所示之高度差h)該目標物9之第二表面9b,且於該第一表面9a之邊緣係形成有凸出該側面9c之凸緣91。本實施例之目標物9係為高架地板,故以下將該目標物9稱為高架地板。Furthermore, the
所述之研磨裝置2係設於整個生產線之加工處理流程之最前期,其用於加工該目標物9之第二表面9b及磨平該高架地板之骨架92,93與四個腳座90之端面9d,以加工處理各該骨架92,93所需的不同高度尺寸與四個腳座90所需的相同高度尺寸。The
於本實施例中,如圖2A所示,該研磨裝置2係包含至少一(如三組)研磨組件2a、一用以配置該研磨組件2a之第一基台21及複數設於該第一基台21上之定位件22,使該研磨組件2a對應該定位件22配置並相對該定位件22升降,以穩定對該目標物9(高架地板)進行研磨加工,並於完成該目標物9之研磨處理後,令該定位件22鬆開該目標物9,使該輸送組件10移走該目標物9。例如,該第一基台21係為框架結構,且該定位件22係具有一可拉放式擋桿22a,如圖2B所示,其配置於該輸送帶101上方,以於使用時,可放下該擋桿22a,將該高架地板定位於該第一基台21之預定位置(即該研磨組件2a下方)上,並於進行研磨作業之過程中,限制該高架地板位移而避免偏離該定位件22,故於研磨作業完成後,可拉起該擋桿22a,使該輸送組件10能移動該目標物9。較佳地,可於該定位件22周圍配置至少一感應器(sensor)25,其可架設於該第一基台21或該運輸裝置1a上,以操控放下該擋桿22a之時間點,故當該感應器25感應到該目標物9時,即可放下該擋桿22a。應可理解地,有關操控該定位件22之方式繁多,並不限於感應方式。In this embodiment, as shown in FIG. 2A , the
再者,如圖2C及圖2D所示,各該研磨組件2a係包含複數個研磨工具20、一架設該些研磨工具20之承載件24、及設於該第一基台21上並以可位移方式架設該承載件24之複數個第一支撐結構23,其中,單一研磨組件2a係設置兩個獨立之第一支撐結構23及一獨立之該承載件24,以令兩第一支撐結構23分別平行立設於該承載件24之相對兩側,使得該承載件24上之複數研磨工具20可同時由同一個動力組28驅動,如圖2A所示,以快速加工該目標物9之各骨架92,93與各腳座90至所需的高度。例如,該承載件24係呈矩形框架體,其具有複數板架240以配置該些研磨工具20,以藉由該動力組28作動該研磨工具20。具體地,該動力組28係為馬達,其設於該第一基台21頂部,以藉由作動一齒輪組29(如圖2A所示之箱體外殼)而帶動複數研磨工具20旋轉,其中,該齒輪組29之箱體外殼內係配置有複數個同步旋轉之齒輪(圖未示),分別經由一撓性管(圖未示)帶動該研磨工具20旋轉。Furthermore, as shown in FIG. 2C and FIG. 2D, each of the grinding
又,如圖2C及圖2D所示,該第一支撐結構23係具有一座體23a,其上配置有一可轉動之螺桿230及一螺接該螺桿230之螺帽(圖未示),使該螺桿230藉由一如馬達之驅動組27轉動而驅動該螺帽進行上、下運動,且因該螺帽固定於該承載件24上,使得該螺桿230可驅動該承載件24升降(如箭頭方向Z),並使該研磨工具20位移至所需之高度位置。例如,該承載件24可藉由一導引結構26位移,該導引結構26包含滑軌260與滑座261,其中,該滑軌260分別固定於該第一支撐結構23之一表面之相對兩側上,且該滑座261係固定於該承載件24上,以當該螺桿230轉動而帶動該螺帽升降時,該導引結構26可帶動該承載件24及其上之研磨工具20一併在該滑軌260上沿上、下方向(如箭頭方向Z)直線移動至欲研磨加工該骨架92,93與腳座90所需的高度位置。2C and 2D , the
另外,該研磨工具20上之砂輪200係具有複數砂紙,如圖2E所示,以沿轉軸排設成輪狀,且該研磨工具20藉由一齒輪箱202配合一被動軸20b連動,以令該研磨工具20藉由該齒輪組29帶動該被動軸20b旋轉,使該被動軸20b帶動該齒輪箱202之齒輪結構轉動該旋轉軸201,以驅動該些砂紙200旋轉,故於該研磨工具20旋轉時,該砂輪200之砂紙會接觸靜止中之目標物9而掀翻,使該砂紙之砂面滑過該目標物9而輕磨該目標物9之各骨架92,93與各腳座90。例如,由於該目標物9之骨架92,93與腳座90之高度不相同,故可配置多組研磨組件2a,以針對不同高度之骨架92,93與腳座90進行研磨,即單一研磨組件2a僅針對單一高度進行研磨,故本實施例中,該目標物9之第二表面9b產生三種高度,因而可配置三組研磨組件2a。In addition, the
本發明之拋光裝置3係配合該運輸裝置1a作動以用於加工該目標物9之第一表面9a(即地板面),且如圖3A、圖3B及圖3C所示,該拋光裝置3係包括至少一(如兩組)拋光組件3a、一用以配置該拋光組件3a之第二基台31及複數設於該第二基台31上之複數個(如三個)定位組件32。The
所述之第二基台31係具有一用以遮蓋該拋光組件3a之罩體31a及一用以架設該罩體31a之支撐架31b,以配合該運輸裝置1a配置,使該拋光組件3a位於該運輸裝置1a上,且該些定位組件32係分別設於該罩體31a之左、右兩側(如箭頭方向Y)及該罩體31a內。The
於本實施例中,該運輸裝置1a係採用一滾帶組件(長程型)作為輸送組件10a,以藉由馬達100c帶動多個滾輪100b,使該些滾輪100b轉動一輸送帶100a,並利用該輸送帶100a的摩擦力而穩定抓固該目標物9,因而能有效防止該目標物9於拋光過程中發生偏位。In this embodiment, the conveying device 1a adopts a roller belt assembly (long-range type) as the conveying
所述之定位組件32係包含複數設於該第二基台31上之座體320及至少一橫跨於該座體320上之轉桿件321。The
於本實施例中,單一轉桿件321之相對兩端係以可調整高度之方式架設於兩座體320之間,以於該目標物9進行拋光作業之過程中,當該目標物9移動至該轉桿件321之下方時,該轉桿件321壓緊該目標物9,並可限制該目標物9之端側上下位移空間,故可防止該目標物9上下晃動。In this embodiment, the opposite ends of the single
所述之拋光組件3a係位於兩定位組件32之間,其包含一拋光工具30、一設於該第二基台31上之第二支撐結構33、及一設於該第二支撐結構33上以架設該拋光工具30之架座34,且該架座34係以可移動方式設於該第二支撐結構33上,以上下位移該拋光工具30至所需之位置。The polishing
於本實施例中,採用導軌與滑座之組合,於該第二支撐結構33上配置有一如槽孔狀之滑軌330,且該架座34上設有至少一接合該滑軌330之滑塊340,其中,該滑軌330分別固定於該第二支撐結構33之相對兩側之表面上,以令該架座34上之滑塊340配合該軌道330滑移,使該拋光工具30直線短距離上下位移至所需之加工位置。In this embodiment, a combination of a guide rail and a sliding seat is used, a sliding
再者,該架座34可藉由一調整組件35相對該第二支撐結構33進行升降(朝箭頭方向Z上、下移動)。例如,該調整組件35係以一如馬達之驅動器350帶動一如升降螺桿之連動桿352位移一用以架設該架座34之固定架351。具體地,將一固定板351a固定在該固定架351上,且該固定板351a上設置一螺帽(圖未示)或內螺牙(圖略),以當該驅動器350經由一減速機353旋轉該連動桿352時,令該連動桿352驅動該固定板351a上之螺帽進行上、下運動,使得該連動桿352可驅動該固定架351連同該架座34一併升降(如箭頭方向Z),並使該拋光工具30位移至所需之高度位置。Furthermore, the
所述之拋光工具30係為砂輪形式,其具有一主桿組件30a及複數砂紙300,如圖3C所示,該複數砂紙300係環繞該架座34排設成輪狀。The polishing
於本實施例中,該主桿組件30a係包含一配置該複數砂紙300之主軸302,其內部中央位置係穿設連接一轉軸304,且該轉軸304之兩端部接合一軸承303,以令該轉軸304相對該軸承303轉動。例如,該軸承303之端部外殼係固定於該架座34上,且該轉軸304之其中一端部係伸出該軸承303而連接一馬達36,以藉由該馬達36驅動該轉軸304旋轉該主軸302。In this embodiment, the main rod assembly 30a includes a main shaft 302 on which the plurality of
因此,於該滾帶組件移動該目標物9通過該轉桿件321後,旋轉中之砂紙300會接觸移動中之目標物9而掀翻,使該砂紙300之砂面摩擦該目標物9而夷平該目標物9之第一表面9a之非平坦處,以達到微處理(或拋光)之目的。Therefore, after the rolling belt assembly moves the
較佳地,該罩體31a之頂部可配置一連通該罩體31a內部空間之排出埠37,以將該砂紙300與該目標物9於摩擦後所產生之雜質或異物(如砂塵)排出,如抽吸方式。Preferably, the top of the
所述之翻轉裝置4係配合該運輸裝置1a作動以用於針對該目標物9之第一表面9a或第二表面9b進行翻轉,例如,將研磨後的高架地板翻轉而使其第一表面9a朝上。The
於本實施例中,如圖4A及圖4B所示,該翻轉裝置4係包含一第三基台41、一設於該第三基台41上之軸結構40、一設於該第三基台41上之翻轉件42、及一連接該翻轉件42上之第三支撐結構43,且該翻轉件42之其中一端側係樞接一設於該第三基台41上之軸結構40以相對該第三基台41進行翻轉,使該第三支撐結構43受力翻轉而位於該拋光裝置3之輸送組件10a之輸送帶100a上方。例如,該運輸裝置1a係採用另一滾帶組件(短程型)作為輸送組件10c,且其支撐組件11c為設於該第三基台41上之座體狀,以將該目標物9由該研磨裝置2用之輸送組件10轉移至該翻轉裝置4用之輸送組件10c上。In this embodiment, as shown in FIGS. 4A and 4B , the
再者,該翻轉件42係為馬蹄形或ㄇ字形板片體,其相對兩側可依需求配置至少一第三支撐結構43,以作為地板夾片,供限制該目標物9位移而避免偏離該翻轉件42。例如,該第三支撐結構43為ㄈ形滑軌狀或夾持型式,以當該輸送組件10c移動該目標物9至一定距離後,可利用如氣壓缸或油壓缸之調整結構45移動該第三支撐結構43,使該第三支撐結構43可穩定接合該目標物9之相對兩側面9c,以夾住支撐該目標物9。Furthermore, the flipping
又,該第三基台41上可依需求配置一抵靠結構44,以抵靠該目標物9。例如,該抵靠結構44為止擋板狀,其固定於該翻轉件42上,以當該輸送組件10c移動該目標物9至一定距離後,該抵靠結構44抵靠該目標物9之另一側面9c,使該輸送組件10c停止運作而定位該目標物9。In addition, an abutting
另外,該第三基台41上係於前側或後側處設置一帶動件47,以帶動該翻轉件42進行翻轉動作。例如,該帶動件47係包含一齒輪471與一齒條470,其齒條470嚙合其齒輪471,且該齒輪471軸接一軸桿401,該軸桿401之兩端分別設置一軸承403,以令該軸桿401穿設該軸承403而連接連接件402,該軸桿401並藉由該連接件402並固定於該翻轉件42上,以當該齒條470直線移動時,會帶動該齒輪471轉動,使該齒輪471轉動該軸桿401,以翻轉該翻轉件42。具體地,藉由一動力組48(如氣壓或油壓汽缸)之推拉桿480帶動該齒條470直線進退,以轉動該齒輪471。In addition, a driving
較佳地,可於該第三基台41上配置至少一感應開關(圖略),以控制該推拉桿480之伸縮距離,使該齒條470帶動該齒輪471之旋轉角度(本案實施例之旋轉角度為180度),以穩定翻轉該翻轉件42。Preferably, at least one inductive switch (not shown) can be configured on the
所述之整平裝置5係用以壓合該目標物9之第一表面9a與第二表面9b。The
於本實施例中,如圖5A及圖5B所示,該整平裝置5係包含一第四基台51、至少一設於該第四基台51上以承載該目標物9之工作平台52、一設於該第四基台51上以架設該工作平台52之第四支撐結構53、及至少一設於該第四支撐結構53上之整平件50,以令該整平件50相對該第四基台51位移而將朝該工作平台52移動,使該整平件50壓合該目標物9。例如,該第四基台51係具有一置放於環境表面(如廠房地面)上之第一底座51a、一藉由複數(如四根)支柱510堆疊於該第一底座51a上之第二底座51b與一藉由該第四支撐結構53架設於該第二底座51b上之頂座51c,且該工作平台52位於該第二底座51b上,並使該整平件50位於該工作平台52上方。具體地,該第四支撐結構53作為導軌,且設有油壓或氣壓組件(如設於該頂座51c上之另一動力組58),其中,該動力組58驅動一壓柱580,該壓柱580之其中一端固定於該整平件50上,而另一端係活動式連接該動力組58,使得壓柱580可帶動該整平件50上下直線運動,以藉由該壓柱580伸縮帶動該整平件50而控制該整平件50之下壓距離,使該整平件50靠近或遠離該高架地板之第一表面9a,進而壓抵該高架地板之第一表面9a。In this embodiment, as shown in FIG. 5A and FIG. 5B , the
於另一實施例中,為了節省該第一底座51a與第二底座51b之間的承載體積,可於該第一底座51a與該第二底座51b之間的中間處增設一支撐用之墊高件51d,其中,該墊高件51d之體積與材質構造可依需求選擇。In another embodiment, in order to save the bearing volume between the
再者,該第四基台51與該工作平台52為靜止(或非活動式)結構,且該整平件50為活動式矩形塊體,其壓合面50a為一平整表面。應可理解地,該整平件50之壓力噸數與壓合面之平整度可依需求調整,並無特別限制。Furthermore, the
又,該運輸裝置1a採用鍊條組件作為輸送組件10b,以利於配置於該工作平台52側邊,使該運輸裝置1a可順利輸送該目標物9通過該整平裝置5。In addition, the transporting device 1a adopts a chain assembly as the conveying
另外,該加工設備1亦可配置一控制機台1c,以獨立操控該整平裝置5(或該整平件50)之運作。In addition, the processing equipment 1 can also be equipped with a
當於生產線上使用該加工設備1時,藉由該運輸裝置1a之輸送組件10將該目標物9運送至該研磨裝置2處,以令該研磨裝置2對該目標物9之四個腳座90與多個骨架92,93進行研磨作業。待完成研磨作業後,藉由該運輸裝置1a之輸送組件10,10c將該目標物9從該研磨裝置2處運送至該翻轉裝置4處。由於前期作業係針對高架地板的底部(該目標物9之第二表面9b)進行加工處理,而後期作業需於高架地板的地板面(該目標物9之第一表面9a)進行加工處理,故於進行拋光作業前,需先將高架地板翻面。When the processing equipment 1 is used on the production line, the
因此,藉由該輸送組件10c將該目標物9運送至該翻轉裝置4之第三支撐結構43上,再藉由該帶動件47轉動該軸結構40,以令該翻轉件42沿該軸結構40翻轉,使該目標物9翻轉180度角後而置放在該輸送組件10a之輸送帶100a上。Therefore, the
之後,藉由該輸送組件10a之輸送帶100a將該目標物9移動通過該拋光裝置3之第二基台31之加工區以進行拋光作業,即當該目標物9通過該拋光工具30時,該拋光工具30會以其砂紙300之砂面微磨該目標物9的第一表面9a。待完成拋光作業後,藉由該運輸裝置1a之輸送組件10b將該目標物9運送至該整平裝置5之工作平台52。Afterwards, the
最後,藉由該整平裝置5進行整平作業,使該整平件50下壓該目標物9之第一表面9a,且待結束該整平動作後,再藉由該運輸裝置1a之輸送組件10將該完成加工處理之目標物9推送至下一加工處或出料區。Finally, the leveling operation is performed by the
綜上所述,本發明之拋光裝置3,主要藉由將其與該研磨裝置2、翻轉裝置4及整平裝置5整合於一加工設備1之生產線上,以於單一生產線上可針對高架地板進行研磨、拋光及整平等加工處理,以加快生產時程而提高生產效率,同時減少人力付出。To sum up, the
再者,藉由該拋光工具30為砂輪形式之設計,以於該目標物9通過該轉桿件321後,旋轉中之砂紙300會接觸移動中之目標物9而掀翻,使該砂紙300之砂面摩擦該目標物9而夷平該目標物9之第一表面9a之非平坦處,以達到拋光之目的,故能避免過度移除該目標物9之部分第一表面9a而造成凹陷之問題。Furthermore, because the
上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍。The above embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the right of the present invention should be the same as the scope of the patent application described later.
1:加工設備1: Processing equipment
1a:運輸裝置1a: Transport device
1b:人機操控介面1b: Human-machine control interface
1c:控制機台1c: control machine
10,10a,10b,10c:輸送組件10, 10a, 10b, 10c: Conveyor components
100:鍊條結構100: Chain structure
100a,101:輸送帶100a, 101: Conveyor belts
100b:滾輪100b: Roller
100c:馬達100c: Motor
11,11c:支撐組件11,11c: Support components
2:研磨裝置2: Grinding device
2a:研磨組件2a: Grinding components
20:研磨工具20: Grinding Tools
20b:被動軸20b: Passive axis
200:砂輪200: Grinding wheel
201:旋轉軸201: Rotary axis
202:齒輪箱202: Gearbox
21:第一基台21: The first abutment
22:定位件22: Positioning pieces
22a:擋桿22a: Stop lever
23:第一支撐結構23: The first support structure
23a:座體23a: seat body
230:螺桿230: Screw
24:承載件24: Carrier
240:板架240: Plate Rack
25:感應器25: Sensor
26:導引結構26: Guide structure
260:滑軌260: slide rail
261:滑座261: Slider
27:驅動組27: Drive group
28:動力組28: Power Pack
29:齒輪組29: Gear Set
3:拋光裝置3: Polishing device
3a:拋光組件3a: Polished Components
30:拋光工具30: Polishing Tools
30a:主桿組件30a: Main rod assembly
300:砂紙300: sandpaper
302:主軸302: Spindle
303:軸承303: Bearing
304:轉軸304: Spindle
31:第二基台31: Second abutment
31a:罩體31a: cover body
31b:支撐架31b: Support frame
32:定位組件32: Positioning components
320:座體320: seat body
321:轉桿件321: Turning Rod Parts
33:第二支撐結構33: Second support structure
330:滑軌330: Slide rail
34:架座34: stand
340:滑塊340: Slider
35:調整組件35: Adjusting Components
350:驅動器350: Drive
351:固定架351: Fixtures
351a:固定板351a: Fixed plate
352:連動桿352: Link rod
353:減速機353: Reducer
36:馬達36: Motor
37:排出埠37: Outlet port
4:翻轉裝置4: Flip device
40:軸結構40: Shaft structure
401:軸桿401: Shaft
402:連接件402: Connector
403:軸承403: Bearing
41:第三基台41: Third abutment
42:翻轉件42: Flip Pieces
43:第三支撐結構43: Third Support Structure
44:抵靠結構44: Against the structure
45:調整結構45: Adjust the structure
47:帶動件47: Drive parts
470:齒條470: rack
471:齒輪471: Gear
48:動力組48: Power Pack
480:推拉桿480: Push-pull rod
5:整平裝置5: Leveling device
50:整平件50: leveling piece
50a:壓合面50a: Pressing surface
51:第四基台51: Fourth abutment
51a:第一底座51a: First base
51b:第二底座51b: Second base
51c:頂座51c: Top seat
51d:墊高件51d: Elevator
510:支柱510: Pillar
52:工作平台52: Work Platform
53:第四支撐結構53: Fourth Support Structure
58:動力組58: Power Pack
580:壓柱580: Pressure column
9:目標物9: Target
9a:第一表面9a: First surface
9b:第二表面9b: Second surface
9c:側面9c: side
9d:端面9d: end face
90:腳座90: Foot seat
900:開孔900: Opening
91:凸緣91: Flange
92,93:骨架92,93: Skeleton
h:高度差h: height difference
X,Y,Z:箭頭方向X,Y,Z: Arrow direction
圖1係為本發明之拋光裝置配置於一加工設備上之前視立體示意圖。FIG. 1 is a schematic perspective view of the polishing apparatus of the present invention before being disposed on a processing equipment.
圖1A係為配置有本發明之拋光裝置的加工設備欲加工之目標物之其中一視角之立體示意圖。FIG. 1A is a perspective view of the object to be processed by the processing equipment equipped with the polishing apparatus of the present invention.
圖1B係為圖1A之另一視角之立體示意圖。FIG. 1B is a schematic perspective view of FIG. 1A from another perspective.
圖1C係為圖1A之側視平面示意圖。FIG. 1C is a schematic side plan view of FIG. 1A .
圖2A係為圖1之研磨裝置之立體示意圖。FIG. 2A is a schematic three-dimensional view of the polishing apparatus of FIG. 1 .
圖2B係為圖2A之局部立體示意圖。FIG. 2B is a partial perspective view of FIG. 2A .
圖2C係為圖2A之研磨組件之立體示意圖。FIG. 2C is a schematic three-dimensional view of the grinding assembly of FIG. 2A .
圖2D係為圖2C之分解示意圖。FIG. 2D is an exploded schematic view of FIG. 2C .
圖2E係為圖2D之研磨工具之立體示意圖。FIG. 2E is a schematic perspective view of the grinding tool of FIG. 2D .
圖3A係為本發明之拋光裝置及其相關配置之立體示意圖。FIG. 3A is a schematic perspective view of the polishing apparatus of the present invention and its related configuration.
圖3B係為圖3A之分解示意圖。FIG. 3B is an exploded schematic view of FIG. 3A .
圖3C係為圖3B之拋光組件之立體分解示意圖。FIG. 3C is a schematic exploded perspective view of the polishing assembly of FIG. 3B .
圖4A係為圖1之翻轉裝置及其周圍配置之立體示意圖。FIG. 4A is a perspective view of the inversion device of FIG. 1 and its surrounding configuration.
圖4B係為圖1之翻轉裝置之立體示意圖。FIG. 4B is a schematic perspective view of the inversion device of FIG. 1 .
圖5A係為圖1之整平裝置及其周圍配置之立體示意圖。FIG. 5A is a perspective view of the leveling device of FIG. 1 and its surrounding configuration.
圖5B係為圖5A之局部立體分解示意圖。FIG. 5B is a partial perspective exploded schematic view of FIG. 5A .
10a:輸送組件 10a: Conveying components
100a:輸送帶 100a: Conveyor belt
100b:滾輪 100b: Roller
100c:馬達 100c: Motor
11:支撐組件 11: Support components
3a:拋光組件 3a: Polished Components
31a:罩體 31a: cover body
31b:支撐架 31b: Support frame
32:定位組件 32: Positioning components
320:座體 320: seat body
321:轉桿件 321: Turning Rod Parts
33:第二支撐結構 33: Second support structure
34:架座 34: stand
36:馬達 36: Motor
37:排出埠 37: Outlet port
9:目標物 9: Target
Claims (8)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110115345A TWI766667B (en) | 2021-04-28 | 2021-04-28 | Polishing assembly of processing equipment |
CN202121699762.7U CN215617004U (en) | 2021-04-28 | 2021-07-23 | Polishing device of processing equipment |
CN202110837992.3A CN115246089A (en) | 2021-04-28 | 2021-07-23 | Polishing device of processing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110115345A TWI766667B (en) | 2021-04-28 | 2021-04-28 | Polishing assembly of processing equipment |
Publications (2)
Publication Number | Publication Date |
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TWI766667B true TWI766667B (en) | 2022-06-01 |
TW202241635A TW202241635A (en) | 2022-11-01 |
Family
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Application Number | Title | Priority Date | Filing Date |
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TW110115345A TWI766667B (en) | 2021-04-28 | 2021-04-28 | Polishing assembly of processing equipment |
Country Status (2)
Country | Link |
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CN (2) | CN215617004U (en) |
TW (1) | TWI766667B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM325894U (en) * | 2007-06-13 | 2008-01-21 | Jian-Huei Yang | Device for formation of ablated wood sheet |
JP2009078307A (en) * | 2007-09-25 | 2009-04-16 | Ahresty Corp | Polishing work table device with powder dust collector |
TWM565089U (en) * | 2018-05-22 | 2018-08-11 | 黃建德 | Floor unit honing machine |
-
2021
- 2021-04-28 TW TW110115345A patent/TWI766667B/en active
- 2021-07-23 CN CN202121699762.7U patent/CN215617004U/en active Active
- 2021-07-23 CN CN202110837992.3A patent/CN115246089A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM325894U (en) * | 2007-06-13 | 2008-01-21 | Jian-Huei Yang | Device for formation of ablated wood sheet |
JP2009078307A (en) * | 2007-09-25 | 2009-04-16 | Ahresty Corp | Polishing work table device with powder dust collector |
TWM565089U (en) * | 2018-05-22 | 2018-08-11 | 黃建德 | Floor unit honing machine |
Also Published As
Publication number | Publication date |
---|---|
CN215617004U (en) | 2022-01-25 |
CN115246089A (en) | 2022-10-28 |
TW202241635A (en) | 2022-11-01 |
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