TW202241635A - Polishing assembly of processing equipment - Google Patents
Polishing assembly of processing equipment Download PDFInfo
- Publication number
- TW202241635A TW202241635A TW110115345A TW110115345A TW202241635A TW 202241635 A TW202241635 A TW 202241635A TW 110115345 A TW110115345 A TW 110115345A TW 110115345 A TW110115345 A TW 110115345A TW 202241635 A TW202241635 A TW 202241635A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- target
- base
- stand
- polishing device
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/04—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of metal, e.g. skate blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
本發明係關於一種機械設備,特別是指一種用於加工高架地板之拋光裝置。The invention relates to a kind of mechanical equipment, in particular to a polishing device for processing elevated floors.
目前高架地板裝置已廣泛應用在防靜電的機房或無塵室中。現有鋁合金壓鑄成型的高架地板經由開模、熔鋁、壓鑄、成型以及修邊等主要五道工序。由於在成型過程中,高架地板的表面和底部會有多處毛邊,這些瑕疵毛邊在安裝過程中,一方面會使得高架地板之間無法緊密貼合,也無法與平臺框架之間貼合,另一方面也不利於工人安裝,且對工人會存在一定的安全隱憂。At present, raised floor devices have been widely used in antistatic computer rooms or clean rooms. Existing raised floors formed by die-casting of aluminum alloy go through five main processes of mold opening, aluminum melting, die-casting, forming and trimming. During the forming process, there will be many burrs on the surface and bottom of the raised floor. During the installation process, these blemishes and burrs will prevent the raised floor from being tightly fitted or the platform frame. On the one hand, it is not conducive to workers' installation, and there will be certain safety concerns for workers.
現有技術主要採用人工方式針對成型後的高架地板的各表面進行微處理,故工人需將高架地板成批運送至對應之加工處,再進行處理作業,不僅生產流程不連續而導致生產效率不高,且每次加工都需浪費大量人力而費時費力。The existing technology mainly uses manual methods to micro-process the surfaces of the formed raised floors. Therefore, workers need to transport the raised floors in batches to the corresponding processing places, and then perform processing operations. Not only the production process is not continuous, but the production efficiency is not high. , and every processing needs to waste a lot of manpower and is time-consuming and laborious.
因此,如何克服上述習知技術之種種缺失,實已成為目前業界亟待克服之難題。Therefore, how to overcome the various deficiencies of the above-mentioned conventional technologies has become a difficult problem to be overcome urgently in the industry.
鑑於上述習知技術之缺失,本發明提供一種加工設備之拋光裝置,係包括:基台,係用以輸送作為目標物之高架地板,其中,該目標物係具有相對之第一表面與第二表面,該第一表面係作為地板面,且該第二表面係具有複數高度不同之骨架,並於該第二表面之角落處設有腳座;以及拋光組件,係配置於該基台上,以於該目標物通過該拋光組件時拋光該目標物之第一表面。In view of the lack of the above-mentioned prior art, the present invention provides a polishing device for processing equipment, which includes: a base platform, which is used to transport a raised floor as a target object, wherein the target object system has a first surface opposite to a second surface. a surface, the first surface is used as a floor surface, and the second surface has a plurality of frames with different heights, and feet are provided at the corners of the second surface; and a polishing component is arranged on the base, The first surface of the target is polished when the target passes through the polishing component.
前述之拋光裝置中,該基台係具有一用以遮蓋該拋光組件之罩體、及具有一用以架設該罩體之支撐架,以配合運輸該目標物,使該拋光組件位於該目標物之上方,且該罩體之頂部配置一連通該罩體內部空間之排出埠,以將該拋光組件與該目標物於拋光後所產生之雜質或異物排出。In the aforementioned polishing device, the base has a cover for covering the polishing component, and a support frame for erecting the cover, so as to cooperate with the transportation of the target, so that the polishing component is positioned on the target. Above, and the top of the cover body is equipped with a discharge port communicating with the inner space of the cover body, so as to discharge the impurities or foreign matter produced by the polishing component and the target object after polishing.
前述之拋光裝置中,復包括設於該基台上之定位組件,其限位該目標物,使該拋光組件拋光該目標物之第一表面,且該定位組件係藉由兩座體以可調整高度之方式架設一轉桿件,以於該目標物進行拋光作業之過程中,當該目標物移動至該轉桿件之下方時,該轉桿件壓緊該目標物,並可限制該目標之端側上下位移空間。In the aforementioned polishing device, it further includes a positioning component arranged on the base, which limits the target so that the polishing component polishes the first surface of the target, and the positioning component can be used by two bases. A rotating rod is set up in a height-adjusting manner, so that when the target moves below the rotating rod during the polishing operation of the target, the rotating rod presses the target and can limit the The up and down displacement space of the end side of the target.
前述之拋光裝置中,該拋光組件係包含一拋光工具、一設於該基台上之支撐結構、及一以可移動方式設於該支撐結構上以架設該拋光工具之架座,以令該架座位移該拋光工具至所需之位置。例如,該支撐結構之相對兩側之表面上配置有滑軌,且該架座上設有至少一接合該滑軌之滑塊,以令該架座上之滑塊配合該滑軌滑移,使該拋光工具直線上下位移至所需之加工位置。進一步,該架座藉由調整組件相對該支撐結構進行升降。例如,該調整組件係以一驅動器帶動一連動桿位移一用以架設該架座之固定架,以當該驅動器經由一減速機旋轉該連動桿時,令該連動桿驅動該固定架連同該架座一併升降,並使該拋光工具位移至所需之高度位置。In the aforementioned polishing device, the polishing assembly includes a polishing tool, a support structure located on the base platform, and a stand that is movably mounted on the support structure to erect the polishing tool, so that the The stand moves the polishing tool to the desired position. For example, slide rails are arranged on the surfaces of opposite sides of the support structure, and at least one slider engaging the slide rail is provided on the frame, so that the slide blocks on the frame can slide in cooperation with the slide rails, Make the polishing tool linearly move up and down to the desired processing position. Further, the stand is raised and lowered relative to the supporting structure by adjusting components. For example, the adjustment assembly uses a driver to drive a linkage rod to displace a fixed frame for erecting the stand, so that when the driver rotates the linkage rod through a reducer, the linkage rod drives the fixed frame together with the frame. The seat is raised and lowered at the same time, and the polishing tool is moved to the required height position.
或者,該拋光工具係為砂輪形式,係具有一主桿組件及複數環繞該主桿組件排設成輪狀之砂紙。例如,該主桿組件之內部係穿設連接一轉軸,且該轉軸之兩端部分別接合軸承,以令該轉軸相對該軸承轉動,且該軸承之端部係固定於該架座上。進一步,該轉軸之其中一端部係伸出該軸承而連接一馬達,以藉由該馬達驅動該轉軸旋轉,令旋轉中之該砂紙接觸移動中之目標物而掀翻,使該砂紙之砂面摩擦該目標物而夷平該目標物之第一表面之非平坦處。Alternatively, the polishing tool is in the form of a grinding wheel, which has a main rod assembly and a plurality of sandpaper arranged in a wheel shape around the main rod assembly. For example, the interior of the main rod assembly is pierced and connected with a rotating shaft, and the two ends of the rotating shaft are respectively engaged with bearings so that the rotating shaft can rotate relative to the bearings, and the ends of the bearings are fixed on the stand. Further, one end of the rotating shaft extends out of the bearing and is connected to a motor, so that the rotating shaft is driven by the motor to rotate, so that the rotating sandpaper touches the moving target and overturns, making the sand surface of the sandpaper rubbing the target to level the unevenness of the first surface of the target.
由上可知,本發明之拋光裝置,主要藉由將其與研磨裝置、翻轉裝置及整平裝置整合於一生產線上,以於單一生產線上可針對高架地板進行第一與第二表面之加工處理,以加快生產時程而提高生產效率,同時減少人力需求。It can be seen from the above that the polishing device of the present invention mainly integrates it with the grinding device, the turning device and the leveling device on a production line, so that the first and second surfaces of the raised floor can be processed on a single production line , to speed up the production schedule and improve production efficiency, while reducing manpower requirements.
再者,藉由該拋光工具為砂輪形式之設計,以於該目標物通過該定位組件後,旋轉中之砂紙會接觸移動中之目標物而掀翻,使該砂紙之砂面摩擦該目標物而夷平該目標物之第一表面之非平坦處,以達到拋光之目的,故能避免過度移除該目標物之部分第一表面而造成凹陷之問題。Furthermore, the polishing tool is designed in the form of a grinding wheel, so that after the target passes through the positioning assembly, the rotating sandpaper will touch the moving target and overturn, so that the sand surface of the sandpaper rubs against the target The non-flat part of the first surface of the target is flattened to achieve the purpose of polishing, so the problem of recess caused by excessive removal of part of the first surface of the target can be avoided.
以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「下」、「前」、「後」、「左」、「右」、「第一」、「第二」、「第三」、「第四」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, references in this specification such as "upper", "lower", "front", "rear", "left", "right", "first", "second", "third", "second The terms "four" and "one" are only used for clarity of description, and are not used to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships should also be regarded as technical content without substantial changes. The range in which the present invention can be implemented.
圖1係為本發明之拋光裝置3配置於一加工設備1上之立體示意圖。如圖1所示,該加工設備1係包括:一運輸裝置1a、一研磨裝置2、該拋光裝置3、一翻轉裝置4、以及一整平裝置5。FIG. 1 is a schematic perspective view of a
於本實施例中,該加工設備1係將生產線之方向定義為左、右方向(如箭頭方向Y),且將垂直該生產線之方向定義為前、後方向(如箭頭方向X),而將沿該加工設備1之高度方向定義為上、下方向(如箭頭方向Z)。應可理解地,該方位係用於說明本實施例之配置,並無特別限制。In this embodiment, the
再者,該加工設備1可藉由人機操控介面1b以可程式邏輯控制器(Programmable Logic Controller,簡稱PLC)方式輸入加工數值,以控制加工處理之運作。Furthermore, the
所述之運輸裝置1a係用於輸送目標物9至所需之生產線之加工位置上,故該運輸裝置1a係對應該研磨裝置2、拋光裝置3、翻轉裝置4及整平裝置5配置,以令該目標物9通過該研磨裝置2、拋光裝置3、翻轉裝置4及整平裝置5上。The conveying device 1a is used to transport the
請同時參閱圖2A,於本實施例中,該運輸裝置1a係採用輸送帶方式運輸該目標物9,且該運輸裝置1a包含一支撐組件11及一設於該支撐組件11上之輸送組件10,以令該輸送組件10位移該目標物9,使該目標物9能抵達每一個加工區。例如,該支撐組件11係為腳架結構,其立設於基礎表面(如地板上)上,且該輸送組件10係具有至少一鍊條結構100及/或一長直條狀之輸送帶101,故當該目標物9置放於該鍊條結構100或輸送帶101上時,該目標物9能穩定沿該鍊條結構100或輸送帶101位移。應可理解地,有關生產線之輸送方式之配置種類繁多,如圖3A及圖4A所示之滾帶組件、如圖5A所示之鍊條組件或其它適當態樣等,並不限於上述。Please refer to FIG. 2A at the same time. In this embodiment, the transportation device 1a uses a conveyor belt to transport the
再者,該目標物9係為高架地板,如圖1A、圖1B及圖1C所示,其具有相對之第一表面9a(如地板面)與第二表面9b(如底側端部)及鄰接該第一表面9a與第二表面9b之側面9c。例如,該目標物9係大致呈矩形體(如正方形板),該目標物9底部(如該第二表面9b之側,其為高架地板底部)係具有高度不同之骨架92,93以形成蜂巢狀,並於該目標物9之第二表面9b之四個角落上形成有腳座90,以於該四個腳座90處依需求設置開孔900,供螺絲將四個腳座90固定於該高架地板用之支撐腳架上。具體地,該腳座90之端面9d係微凸出(如圖1C所示之高度差h)該目標物9之第二表面9b,且於該第一表面9a之邊緣係形成有凸出該側面9c之凸緣91。本實施例之目標物9係為高架地板,故以下將該目標物9稱為高架地板。Furthermore, the
所述之研磨裝置2係設於整個生產線之加工處理流程之最前期,其用於加工該目標物9之第二表面9b及磨平該高架地板之骨架92,93與四個腳座90之端面9d,以加工處理各該骨架92,93所需的不同高度尺寸與四個腳座90所需的相同高度尺寸。The
於本實施例中,如圖2A所示,該研磨裝置2係包含至少一(如三組)研磨組件2a、一用以配置該研磨組件2a之第一基台21及複數設於該第一基台21上之定位件22,使該研磨組件2a對應該定位件22配置並相對該定位件22升降,以穩定對該目標物9(高架地板)進行研磨加工,並於完成該目標物9之研磨處理後,令該定位件22鬆開該目標物9,使該輸送組件10移走該目標物9。例如,該第一基台21係為框架結構,且該定位件22係具有一可拉放式擋桿22a,如圖2B所示,其配置於該輸送帶101上方,以於使用時,可放下該擋桿22a,將該高架地板定位於該第一基台21之預定位置(即該研磨組件2a下方)上,並於進行研磨作業之過程中,限制該高架地板位移而避免偏離該定位件22,故於研磨作業完成後,可拉起該擋桿22a,使該輸送組件10能移動該目標物9。較佳地,可於該定位件22周圍配置至少一感應器(sensor)25,其可架設於該第一基台21或該運輸裝置1a上,以操控放下該擋桿22a之時間點,故當該感應器25感應到該目標物9時,即可放下該擋桿22a。應可理解地,有關操控該定位件22之方式繁多,並不限於感應方式。In this embodiment, as shown in FIG. 2A, the
再者,如圖2C及圖2D所示,各該研磨組件2a係包含複數個研磨工具20、一架設該些研磨工具20之承載件24、及設於該第一基台21上並以可位移方式架設該承載件24之複數個第一支撐結構23,其中,單一研磨組件2a係設置兩個獨立之第一支撐結構23及一獨立之該承載件24,以令兩第一支撐結構23分別平行立設於該承載件24之相對兩側,使得該承載件24上之複數研磨工具20可同時由同一個動力組28驅動,如圖2A所示,以快速加工該目標物9之各骨架92,93與各腳座90至所需的高度。例如,該承載件24係呈矩形框架體,其具有複數板架240以配置該些研磨工具20,以藉由該動力組28作動該研磨工具20。具體地,該動力組28係為馬達,其設於該第一基台21頂部,以藉由作動一齒輪組29(如圖2A所示之箱體外殼)而帶動複數研磨工具20旋轉,其中,該齒輪組29之箱體外殼內係配置有複數個同步旋轉之齒輪(圖未示),分別經由一撓性管(圖未示)帶動該研磨工具20旋轉。Furthermore, as shown in Figure 2C and Figure 2D, each of the
又,如圖2C及圖2D所示,該第一支撐結構23係具有一座體23a,其上配置有一可轉動之螺桿230及一螺接該螺桿230之螺帽(圖未示),使該螺桿230藉由一如馬達之驅動組27轉動而驅動該螺帽進行上、下運動,且因該螺帽固定於該承載件24上,使得該螺桿230可驅動該承載件24升降(如箭頭方向Z),並使該研磨工具20位移至所需之高度位置。例如,該承載件24可藉由一導引結構26位移,該導引結構26包含滑軌260與滑座261,其中,該滑軌260分別固定於該第一支撐結構23之一表面之相對兩側上,且該滑座261係固定於該承載件24上,以當該螺桿230轉動而帶動該螺帽升降時,該導引結構26可帶動該承載件24及其上之研磨工具20一併在該滑軌260上沿上、下方向(如箭頭方向Z)直線移動至欲研磨加工該骨架92,93與腳座90所需的高度位置。And, as shown in Fig. 2C and Fig. 2D, this first supporting
另外,該研磨工具20上之砂輪200係具有複數砂紙,如圖2E所示,以沿轉軸排設成輪狀,且該研磨工具20藉由一齒輪箱202配合一被動軸20b連動,以令該研磨工具20藉由該齒輪組29帶動該被動軸20b旋轉,使該被動軸20b帶動該齒輪箱202之齒輪結構轉動該旋轉軸201,以驅動該些砂紙200旋轉,故於該研磨工具20旋轉時,該砂輪200之砂紙會接觸靜止中之目標物9而掀翻,使該砂紙之砂面滑過該目標物9而輕磨該目標物9之各骨架92,93與各腳座90。例如,由於該目標物9之骨架92,93與腳座90之高度不相同,故可配置多組研磨組件2a,以針對不同高度之骨架92,93與腳座90進行研磨,即單一研磨組件2a僅針對單一高度進行研磨,故本實施例中,該目標物9之第二表面9b產生三種高度,因而可配置三組研磨組件2a。In addition, the
本發明之拋光裝置3係配合該運輸裝置1a作動以用於加工該目標物9之第一表面9a(即地板面),且如圖3A、圖3B及圖3C所示,該拋光裝置3係包括至少一(如兩組)拋光組件3a、一用以配置該拋光組件3a之第二基台31及複數設於該第二基台31上之複數個(如三個)定位組件32。The
所述之第二基台31係具有一用以遮蓋該拋光組件3a之罩體31a及一用以架設該罩體31a之支撐架31b,以配合該運輸裝置1a配置,使該拋光組件3a位於該運輸裝置1a上,且該些定位組件32係分別設於該罩體31a之左、右兩側(如箭頭方向Y)及該罩體31a內。The
於本實施例中,該運輸裝置1a係採用一滾帶組件(長程型)作為輸送組件10a,以藉由馬達100c帶動多個滾輪100b,使該些滾輪100b轉動一輸送帶100a,並利用該輸送帶100a的摩擦力而穩定抓固該目標物9,因而能有效防止該目標物9於拋光過程中發生偏位。In this embodiment, the transportation device 1a adopts a roller belt assembly (long-distance type) as the conveying
所述之定位組件32係包含複數設於該第二基台31上之座體320及至少一橫跨於該座體320上之轉桿件321。The
於本實施例中,單一轉桿件321之相對兩端係以可調整高度之方式架設於兩座體320之間,以於該目標物9進行拋光作業之過程中,當該目標物9移動至該轉桿件321之下方時,該轉桿件321壓緊該目標物9,並可限制該目標物9之端側上下位移空間,故可防止該目標物9上下晃動。In this embodiment, the opposite ends of the single
所述之拋光組件3a係位於兩定位組件32之間,其包含一拋光工具30、一設於該第二基台31上之第二支撐結構33、及一設於該第二支撐結構33上以架設該拋光工具30之架座34,且該架座34係以可移動方式設於該第二支撐結構33上,以上下位移該拋光工具30至所需之位置。The polishing
於本實施例中,採用導軌與滑座之組合,於該第二支撐結構33上配置有一如槽孔狀之滑軌330,且該架座34上設有至少一接合該滑軌330之滑塊340,其中,該滑軌330分別固定於該第二支撐結構33之相對兩側之表面上,以令該架座34上之滑塊340配合該軌道330滑移,使該拋光工具30直線短距離上下位移至所需之加工位置。In this embodiment, a combination of a guide rail and a slide seat is adopted, and a slot-shaped
再者,該架座34可藉由一調整組件35相對該第二支撐結構33進行升降(朝箭頭方向Z上、下移動)。例如,該調整組件35係以一如馬達之驅動器350帶動一如升降螺桿之連動桿352位移一用以架設該架座34之固定架351。具體地,將一固定板351a固定在該固定架351上,且該固定板351a上設置一螺帽(圖未示)或內螺牙(圖略),以當該驅動器350經由一減速機353旋轉該連動桿352時,令該連動桿352驅動該固定板351a上之螺帽進行上、下運動,使得該連動桿352可驅動該固定架351連同該架座34一併升降(如箭頭方向Z),並使該拋光工具30位移至所需之高度位置。Furthermore, the
所述之拋光工具30係為砂輪形式,其具有一主桿組件30a及複數砂紙300,如圖3C所示,該複數砂紙300係環繞該架座34排設成輪狀。The polishing
於本實施例中,該主桿組件30a係包含一配置該複數砂紙300之主軸302,其內部中央位置係穿設連接一轉軸304,且該轉軸304之兩端部接合一軸承303,以令該轉軸304相對該軸承303轉動。例如,該軸承303之端部外殼係固定於該架座34上,且該轉軸304之其中一端部係伸出該軸承303而連接一馬達36,以藉由該馬達36驅動該轉軸304旋轉該主軸302。In this embodiment, the
因此,於該滾帶組件移動該目標物9通過該轉桿件321後,旋轉中之砂紙300會接觸移動中之目標物9而掀翻,使該砂紙300之砂面摩擦該目標物9而夷平該目標物9之第一表面9a之非平坦處,以達到微處理(或拋光)之目的。Therefore, after the belt assembly moves the
較佳地,該罩體31a之頂部可配置一連通該罩體31a內部空間之排出埠37,以將該砂紙300與該目標物9於摩擦後所產生之雜質或異物(如砂塵)排出,如抽吸方式。Preferably, a
所述之翻轉裝置4係配合該運輸裝置1a作動以用於針對該目標物9之第一表面9a或第二表面9b進行翻轉,例如,將研磨後的高架地板翻轉而使其第一表面9a朝上。The
於本實施例中,如圖4A及圖4B所示,該翻轉裝置4係包含一第三基台41、一設於該第三基台41上之軸結構40、一設於該第三基台41上之翻轉件42、及一連接該翻轉件42上之第三支撐結構43,且該翻轉件42之其中一端側係樞接一設於該第三基台41上之軸結構40以相對該第三基台41進行翻轉,使該第三支撐結構43受力翻轉而位於該拋光裝置3之輸送組件10a之輸送帶100a上方。例如,該運輸裝置1a係採用另一滾帶組件(短程型)作為輸送組件10c,且其支撐組件11c為設於該第三基台41上之座體狀,以將該目標物9由該研磨裝置2用之輸送組件10轉移至該翻轉裝置4用之輸送組件10c上。In this embodiment, as shown in Fig. 4A and Fig. 4B, the
再者,該翻轉件42係為馬蹄形或ㄇ字形板片體,其相對兩側可依需求配置至少一第三支撐結構43,以作為地板夾片,供限制該目標物9位移而避免偏離該翻轉件42。例如,該第三支撐結構43為ㄈ形滑軌狀或夾持型式,以當該輸送組件10c移動該目標物9至一定距離後,可利用如氣壓缸或油壓缸之調整結構45移動該第三支撐結構43,使該第三支撐結構43可穩定接合該目標物9之相對兩側面9c,以夾住支撐該目標物9。Furthermore, the turning
又,該第三基台41上可依需求配置一抵靠結構44,以抵靠該目標物9。例如,該抵靠結構44為止擋板狀,其固定於該翻轉件42上,以當該輸送組件10c移動該目標物9至一定距離後,該抵靠結構44抵靠該目標物9之另一側面9c,使該輸送組件10c停止運作而定位該目標物9。In addition, an abutting
另外,該第三基台41上係於前側或後側處設置一帶動件47,以帶動該翻轉件42進行翻轉動作。例如,該帶動件47係包含一齒輪471與一齒條470,其齒條470嚙合其齒輪471,且該齒輪471軸接一軸桿401,該軸桿401之兩端分別設置一軸承403,以令該軸桿401穿設該軸承403而連接連接件402,該軸桿401並藉由該連接件402並固定於該翻轉件42上,以當該齒條470直線移動時,會帶動該齒輪471轉動,使該齒輪471轉動該軸桿401,以翻轉該翻轉件42。具體地,藉由一動力組48(如氣壓或油壓汽缸)之推拉桿480帶動該齒條470直線進退,以轉動該齒輪471。In addition, a driving
較佳地,可於該第三基台41上配置至少一感應開關(圖略),以控制該推拉桿480之伸縮距離,使該齒條470帶動該齒輪471之旋轉角度(本案實施例之旋轉角度為180度),以穩定翻轉該翻轉件42。Preferably, at least one induction switch (not shown) can be arranged on the
所述之整平裝置5係用以壓合該目標物9之第一表面9a與第二表面9b。The
於本實施例中,如圖5A及圖5B所示,該整平裝置5係包含一第四基台51、至少一設於該第四基台51上以承載該目標物9之工作平台52、一設於該第四基台51上以架設該工作平台52之第四支撐結構53、及至少一設於該第四支撐結構53上之整平件50,以令該整平件50相對該第四基台51位移而將朝該工作平台52移動,使該整平件50壓合該目標物9。例如,該第四基台51係具有一置放於環境表面(如廠房地面)上之第一底座51a、一藉由複數(如四根)支柱510堆疊於該第一底座51a上之第二底座51b與一藉由該第四支撐結構53架設於該第二底座51b上之頂座51c,且該工作平台52位於該第二底座51b上,並使該整平件50位於該工作平台52上方。具體地,該第四支撐結構53作為導軌,且設有油壓或氣壓組件(如設於該頂座51c上之另一動力組58),其中,該動力組58驅動一壓柱580,該壓柱580之其中一端固定於該整平件50上,而另一端係活動式連接該動力組58,使得壓柱580可帶動該整平件50上下直線運動,以藉由該壓柱580伸縮帶動該整平件50而控制該整平件50之下壓距離,使該整平件50靠近或遠離該高架地板之第一表面9a,進而壓抵該高架地板之第一表面9a。In this embodiment, as shown in FIG. 5A and FIG. 5B , the
於另一實施例中,為了節省該第一底座51a與第二底座51b之間的承載體積,可於該第一底座51a與該第二底座51b之間的中間處增設一支撐用之墊高件51d,其中,該墊高件51d之體積與材質構造可依需求選擇。In another embodiment, in order to save the carrying volume between the
再者,該第四基台51與該工作平台52為靜止(或非活動式)結構,且該整平件50為活動式矩形塊體,其壓合面50a為一平整表面。應可理解地,該整平件50之壓力噸數與壓合面之平整度可依需求調整,並無特別限制。Furthermore, the
又,該運輸裝置1a採用鍊條組件作為輸送組件10b,以利於配置於該工作平台52側邊,使該運輸裝置1a可順利輸送該目標物9通過該整平裝置5。In addition, the transportation device 1a adopts a chain assembly as the
另外,該加工設備1亦可配置一控制機台1c,以獨立操控該整平裝置5(或該整平件50)之運作。In addition, the
當於生產線上使用該加工設備1時,藉由該運輸裝置1a之輸送組件10將該目標物9運送至該研磨裝置2處,以令該研磨裝置2對該目標物9之四個腳座90與多個骨架92,93進行研磨作業。待完成研磨作業後,藉由該運輸裝置1a之輸送組件10,10c將該目標物9從該研磨裝置2處運送至該翻轉裝置4處。由於前期作業係針對高架地板的底部(該目標物9之第二表面9b)進行加工處理,而後期作業需於高架地板的地板面(該目標物9之第一表面9a)進行加工處理,故於進行拋光作業前,需先將高架地板翻面。When using the
因此,藉由該輸送組件10c將該目標物9運送至該翻轉裝置4之第三支撐結構43上,再藉由該帶動件47轉動該軸結構40,以令該翻轉件42沿該軸結構40翻轉,使該目標物9翻轉180度角後而置放在該輸送組件10a之輸送帶100a上。Therefore, the
之後,藉由該輸送組件10a之輸送帶100a將該目標物9移動通過該拋光裝置3之第二基台31之加工區以進行拋光作業,即當該目標物9通過該拋光工具30時,該拋光工具30會以其砂紙300之砂面微磨該目標物9的第一表面9a。待完成拋光作業後,藉由該運輸裝置1a之輸送組件10b將該目標物9運送至該整平裝置5之工作平台52。Afterwards, the
最後,藉由該整平裝置5進行整平作業,使該整平件50下壓該目標物9之第一表面9a,且待結束該整平動作後,再藉由該運輸裝置1a之輸送組件10將該完成加工處理之目標物9推送至下一加工處或出料區。Finally, the leveling operation is performed by the
綜上所述,本發明之拋光裝置3,主要藉由將其與該研磨裝置2、翻轉裝置4及整平裝置5整合於一加工設備1之生產線上,以於單一生產線上可針對高架地板進行研磨、拋光及整平等加工處理,以加快生產時程而提高生產效率,同時減少人力付出。In summary, the
再者,藉由該拋光工具30為砂輪形式之設計,以於該目標物9通過該轉桿件321後,旋轉中之砂紙300會接觸移動中之目標物9而掀翻,使該砂紙300之砂面摩擦該目標物9而夷平該目標物9之第一表面9a之非平坦處,以達到拋光之目的,故能避免過度移除該目標物9之部分第一表面9a而造成凹陷之問題。Moreover, by the design of the polishing
上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍。The above-mentioned embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be the same as the scope of the patent application described later.
1:加工設備 1a:運輸裝置 1b:人機操控介面 1c:控制機台 10,10a,10b,10c:輸送組件 100:鍊條結構 100a,101:輸送帶 100b:滾輪 100c:馬達 11,11c:支撐組件 2:研磨裝置 2a:研磨組件 20:研磨工具 20b:被動軸 200:砂輪 201:旋轉軸 202:齒輪箱 21:第一基台 22:定位件 22a:擋桿 23:第一支撐結構 23a:座體 230:螺桿 24:承載件 240:板架 25:感應器 26:導引結構 260:滑軌 261:滑座 27:驅動組 28:動力組 29:齒輪組 3:拋光裝置 3a:拋光組件 30:拋光工具 30a:主桿組件 300:砂紙 302:主軸 303:軸承 304:轉軸 31:第二基台 31a:罩體 31b:支撐架 32:定位組件 320:座體 321:轉桿件 33:第二支撐結構 330:滑軌 34:架座 340:滑塊 35:調整組件 350:驅動器 351:固定架 351a:固定板 352:連動桿 353:減速機 36:馬達 37:排出埠 4:翻轉裝置 40:軸結構 401:軸桿 402:連接件 403:軸承 41:第三基台 42:翻轉件 43:第三支撐結構 44:抵靠結構 45:調整結構 47:帶動件 470:齒條 471:齒輪 48:動力組 480:推拉桿 5:整平裝置 50:整平件 50a:壓合面 51:第四基台 51a:第一底座 51b:第二底座 51c:頂座 51d:墊高件 510:支柱 52:工作平台 53:第四支撐結構 58:動力組 580:壓柱 9:目標物 9a:第一表面 9b:第二表面 9c:側面 9d:端面 90:腳座 900:開孔 91:凸緣 92,93:骨架 h:高度差 X,Y,Z:箭頭方向 1: Processing equipment 1a: transport device 1b: Man-machine control interface 1c: Control machine 10, 10a, 10b, 10c: conveying components 100: chain structure 100a, 101: conveyor belt 100b: Roller 100c: motor 11,11c: Support components 2: Grinding device 2a: Grinding components 20: Grinding tools 20b: Passive shaft 200: grinding wheel 201:Rotary axis 202: Gearbox 21: The first abutment 22: Positioning parts 22a: Barrier 23: The first supporting structure 23a: seat body 230: screw 24: Carrier 240: plate frame 25: sensor 26: Guide structure 260: slide rail 261: sliding seat 27: Drive group 28: Power group 29: gear set 3: Polishing device 3a: Polishing components 30: Polishing tools 30a: main rod assembly 300: sandpaper 302:Spindle 303: bearing 304: shaft 31: Second abutment 31a: cover body 31b: support frame 32: Positioning components 320: seat body 321:Rotary member 33: Second supporting structure 330: slide rail 34: frame 340: slider 35: Adjustment components 350: drive 351: fixed frame 351a: Fixed plate 352: linkage rod 353: Reducer 36: motor 37: discharge port 4: Flip device 40: Shaft structure 401: shaft 402: connector 403: Bearing 41: The third abutment 42: Flip pieces 43: The third support structure 44: Against the structure 45: Adjust structure 47: Driving parts 470: Rack 471: gear 48: power group 480: push-pull rod 5: Leveling device 50: leveling parts 50a: Pressing surface 51: The fourth abutment 51a: first base 51b: second base 51c: top seat 51d: Elevator 510: Pillar 52: Working platform 53: Fourth supporting structure 58: Power group 580: pressure column 9: Target 9a: first surface 9b: second surface 9c: side 9d: end face 90: foot seat 900: opening 91: Flange 92,93: Skeleton h: height difference X, Y, Z: Arrow direction
圖1係為本發明之拋光裝置配置於一加工設備上之前視立體示意圖。FIG. 1 is a front perspective schematic diagram of a polishing device of the present invention disposed on a processing equipment.
圖1A係為配置有本發明之拋光裝置的加工設備欲加工之目標物之其中一視角之立體示意圖。FIG. 1A is a schematic perspective view of an object to be processed by a processing equipment equipped with a polishing device of the present invention.
圖1B係為圖1A之另一視角之立體示意圖。FIG. 1B is a three-dimensional schematic diagram of another viewing angle of FIG. 1A .
圖1C係為圖1A之側視平面示意圖。FIG. 1C is a schematic side view of FIG. 1A .
圖2A係為圖1之研磨裝置之立體示意圖。FIG. 2A is a three-dimensional schematic diagram of the grinding device in FIG. 1 .
圖2B係為圖2A之局部立體示意圖。FIG. 2B is a partial perspective view of FIG. 2A.
圖2C係為圖2A之研磨組件之立體示意圖。FIG. 2C is a three-dimensional schematic view of the grinding assembly in FIG. 2A .
圖2D係為圖2C之分解示意圖。Fig. 2D is an exploded schematic view of Fig. 2C.
圖2E係為圖2D之研磨工具之立體示意圖。FIG. 2E is a three-dimensional schematic view of the grinding tool in FIG. 2D .
圖3A係為本發明之拋光裝置及其相關配置之立體示意圖。FIG. 3A is a three-dimensional schematic diagram of a polishing device and related configurations of the present invention.
圖3B係為圖3A之分解示意圖。FIG. 3B is an exploded schematic view of FIG. 3A.
圖3C係為圖3B之拋光組件之立體分解示意圖。FIG. 3C is an exploded perspective view of the polishing assembly in FIG. 3B .
圖4A係為圖1之翻轉裝置及其周圍配置之立體示意圖。FIG. 4A is a three-dimensional schematic diagram of the turning device of FIG. 1 and its surrounding configuration.
圖4B係為圖1之翻轉裝置之立體示意圖。FIG. 4B is a three-dimensional schematic diagram of the turning device of FIG. 1 .
圖5A係為圖1之整平裝置及其周圍配置之立體示意圖。FIG. 5A is a three-dimensional schematic diagram of the leveling device and its surrounding configuration in FIG. 1 .
圖5B係為圖5A之局部立體分解示意圖。FIG. 5B is a partially exploded perspective view of FIG. 5A .
10a:輸送組件 10a: Conveyor assembly
100a:輸送帶 100a: conveyor belt
100b:滾輪 100b: Roller
100c:馬達 100c: motor
11:支撐組件 11: Support components
3a:拋光組件 3a: Polishing components
31a:罩體 31a: cover body
31b:支撐架 31b: support frame
32:定位組件 32: Positioning components
320:座體 320: seat body
321:轉桿件 321:Rotary member
33:第二支撐結構 33: Second supporting structure
34:架座 34: frame
36:馬達 36: motor
37:排出埠 37: discharge port
9:目標物 9: Target
Claims (10)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110115345A TWI766667B (en) | 2021-04-28 | 2021-04-28 | Polishing assembly of processing equipment |
| CN202110837992.3A CN115246089A (en) | 2021-04-28 | 2021-07-23 | Polishing device of processing equipment |
| CN202121699762.7U CN215617004U (en) | 2021-04-28 | 2021-07-23 | Polishing device of processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110115345A TWI766667B (en) | 2021-04-28 | 2021-04-28 | Polishing assembly of processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI766667B TWI766667B (en) | 2022-06-01 |
| TW202241635A true TW202241635A (en) | 2022-11-01 |
Family
ID=79892131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110115345A TWI766667B (en) | 2021-04-28 | 2021-04-28 | Polishing assembly of processing equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN215617004U (en) |
| TW (1) | TWI766667B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI766667B (en) * | 2021-04-28 | 2022-06-01 | 惠亞工程股份有限公司 | Polishing assembly of processing equipment |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM325894U (en) * | 2007-06-13 | 2008-01-21 | Jian-Huei Yang | Device for formation of ablated wood sheet |
| JP2009078307A (en) * | 2007-09-25 | 2009-04-16 | Ahresty Corp | Polishing work table device with powder dust collector |
| CN207548366U (en) * | 2017-12-14 | 2018-06-29 | 湖北金成光电科技股份有限公司 | A kind of wood board polishing machine |
| TWM565089U (en) * | 2018-05-22 | 2018-08-11 | 黃建德 | Floor unit grinder |
| CN208773187U (en) * | 2018-05-28 | 2019-04-23 | 湖北润长佳工艺陶瓷有限公司 | A kind of two-sided grinding device of ceramic tile |
| CN111215904A (en) * | 2020-03-03 | 2020-06-02 | 惠亚科技(东台)有限公司 | Processing equipment |
| TWI766667B (en) * | 2021-04-28 | 2022-06-01 | 惠亞工程股份有限公司 | Polishing assembly of processing equipment |
-
2021
- 2021-04-28 TW TW110115345A patent/TWI766667B/en active
- 2021-07-23 CN CN202121699762.7U patent/CN215617004U/en active Active
- 2021-07-23 CN CN202110837992.3A patent/CN115246089A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TWI766667B (en) | 2022-06-01 |
| CN115246089A (en) | 2022-10-28 |
| CN215617004U (en) | 2022-01-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206405849U (en) | A kind of cabinet-wood sanding apparatus | |
| TWI792287B (en) | Processing equipment | |
| KR101277315B1 (en) | Tilt Adjustment With Rotation Shifter For A Road Boundary Stone Cutting Device | |
| TW202241635A (en) | Polishing assembly of processing equipment | |
| TWI766668B (en) | Grinding assembly of processing equipment | |
| TWM614889U (en) | Grinding assembly of processing equipment | |
| TWM598746U (en) | Processing equipment | |
| TWM618882U (en) | Polishing assembly of processing equipment | |
| TWM616906U (en) | Processing equipment | |
| TWI724804B (en) | Milling edge device | |
| CN210588504U (en) | Glass product surface polishing device | |
| CN207841026U (en) | Polishing machine | |
| CN111573267A (en) | A slate unloading device | |
| CN105197602B (en) | Layered brick placement attitude adjustment device of automatic brick stacking machine | |
| TWI718015B (en) | Processing equipment | |
| TWI749587B (en) | Multiplex device for floor processing | |
| CN212946971U (en) | Seven various plastic-aluminum panels processing with adjustable angle of polishing are with edging device | |
| TW202335766A (en) | Milling height device | |
| CN208005353U (en) | A kind of glass linear double-edge milling edge polisher | |
| CN219684954U (en) | Synchronous lifting mechanism for sand belt sander | |
| TW202132197A (en) | Turning device | |
| CN222154932U (en) | Flat grinder convenient to unloading | |
| CN220561104U (en) | Edging device is used in panel processing | |
| CN222371194U (en) | A grinder for mold production | |
| CN222791522U (en) | A self-moving resin plate edge grinding device |