TWI765999B - 物體交換裝置、物體處裡裝置、平板顯示器的製造方法、元件製造方法、物體交換方法以及物體處理方法 - Google Patents

物體交換裝置、物體處裡裝置、平板顯示器的製造方法、元件製造方法、物體交換方法以及物體處理方法 Download PDF

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Publication number
TWI765999B
TWI765999B TW107110826A TW107110826A TWI765999B TW I765999 B TWI765999 B TW I765999B TW 107110826 A TW107110826 A TW 107110826A TW 107110826 A TW107110826 A TW 107110826A TW I765999 B TWI765999 B TW I765999B
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TW
Taiwan
Prior art keywords
substrate
support portion
support
exchange
supported
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TW107110826A
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English (en)
Chinese (zh)
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TW201842413A (zh
Inventor
青木保夫
牛島康之
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日商尼康股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW107110826A 2017-03-31 2018-03-29 物體交換裝置、物體處裡裝置、平板顯示器的製造方法、元件製造方法、物體交換方法以及物體處理方法 TWI765999B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-071087 2017-03-31
JP2017071087 2017-03-31

Publications (2)

Publication Number Publication Date
TW201842413A TW201842413A (zh) 2018-12-01
TWI765999B true TWI765999B (zh) 2022-06-01

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TW107110826A TWI765999B (zh) 2017-03-31 2018-03-29 物體交換裝置、物體處裡裝置、平板顯示器的製造方法、元件製造方法、物體交換方法以及物體處理方法

Country Status (3)

Country Link
CN (1) CN110520798B (ja)
TW (1) TWI765999B (ja)
WO (1) WO2018180969A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031222A1 (ja) * 2011-08-30 2013-03-07 株式会社ニコン 物体搬送装置、物体処理装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体の搬送方法、及び物体交換方法
WO2014024483A1 (ja) * 2012-08-08 2014-02-13 株式会社ニコン 物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG115602A1 (en) * 2003-01-09 2005-10-28 Disco Corp Conveying device for a plate-like workpiece
ATE429031T1 (de) * 2003-08-07 2009-05-15 Nikon Corp Belichtungsverfahren
JP4378301B2 (ja) * 2005-02-28 2009-12-02 東京エレクトロン株式会社 基板処理装置及び基板処理方法及び基板処理プログラム
CN101020539B (zh) * 2007-03-23 2011-04-20 苏州安泰空气技术有限公司 悬浮传输装置
US20110244396A1 (en) * 2010-04-01 2011-10-06 Nikon Corporation Exposure apparatus, exchange method of object, exposure method, and device manufacturing method
US20120064461A1 (en) * 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method
JP5843161B2 (ja) * 2011-05-13 2016-01-13 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP5741927B2 (ja) * 2011-05-13 2015-07-01 株式会社ニコン 物体搬出方法、物体交換方法、物体保持装置、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6171984B2 (ja) * 2014-03-07 2017-08-02 株式会社ダイフク 物品支持装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031222A1 (ja) * 2011-08-30 2013-03-07 株式会社ニコン 物体搬送装置、物体処理装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体の搬送方法、及び物体交換方法
WO2014024483A1 (ja) * 2012-08-08 2014-02-13 株式会社ニコン 物体交換方法、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
CN104662478A (zh) * 2012-08-08 2015-05-27 株式会社尼康 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法

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Publication number Publication date
CN110520798B (zh) 2021-11-16
WO2018180969A1 (ja) 2018-10-04
TW201842413A (zh) 2018-12-01
CN110520798A (zh) 2019-11-29

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