CN110520798B - 物体交换装置、物体处理装置、平板显示器的制造方法、元件制造方法、物体交换方法、以及物体处理方法 - Google Patents
物体交换装置、物体处理装置、平板显示器的制造方法、元件制造方法、物体交换方法、以及物体处理方法 Download PDFInfo
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- CN110520798B CN110520798B CN201880023081.3A CN201880023081A CN110520798B CN 110520798 B CN110520798 B CN 110520798B CN 201880023081 A CN201880023081 A CN 201880023081A CN 110520798 B CN110520798 B CN 110520798B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017071087 | 2017-03-31 | ||
JP2017-071087 | 2017-03-31 | ||
PCT/JP2018/011656 WO2018180969A1 (ja) | 2017-03-31 | 2018-03-23 | 物体交換装置、物体処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体交換方法、及び物体処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110520798A CN110520798A (zh) | 2019-11-29 |
CN110520798B true CN110520798B (zh) | 2021-11-16 |
Family
ID=63675828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201880023081.3A Active CN110520798B (zh) | 2017-03-31 | 2018-03-23 | 物体交换装置、物体处理装置、平板显示器的制造方法、元件制造方法、物体交换方法、以及物体处理方法 |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN110520798B (ja) |
TW (1) | TWI765999B (ja) |
WO (1) | WO2018180969A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1828828A (zh) * | 2005-02-28 | 2006-09-06 | 东京毅力科创株式会社 | 基板处理装置、基板处理方法和基板处理程序 |
WO2013031222A1 (ja) * | 2011-08-30 | 2013-03-07 | 株式会社ニコン | 物体搬送装置、物体処理装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体の搬送方法、及び物体交換方法 |
CN104662478A (zh) * | 2012-08-08 | 2015-05-27 | 株式会社尼康 | 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG115602A1 (en) * | 2003-01-09 | 2005-10-28 | Disco Corp | Conveying device for a plate-like workpiece |
ATE429031T1 (de) * | 2003-08-07 | 2009-05-15 | Nikon Corp | Belichtungsverfahren |
CN101020539B (zh) * | 2007-03-23 | 2011-04-20 | 苏州安泰空气技术有限公司 | 悬浮传输装置 |
US20110244396A1 (en) * | 2010-04-01 | 2011-10-06 | Nikon Corporation | Exposure apparatus, exchange method of object, exposure method, and device manufacturing method |
US20120064461A1 (en) * | 2010-09-13 | 2012-03-15 | Nikon Corporation | Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method |
JP5741927B2 (ja) * | 2011-05-13 | 2015-07-01 | 株式会社ニコン | 物体搬出方法、物体交換方法、物体保持装置、物体交換システム、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
JP5843161B2 (ja) * | 2011-05-13 | 2016-01-13 | 株式会社ニコン | 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
JP6171984B2 (ja) * | 2014-03-07 | 2017-08-02 | 株式会社ダイフク | 物品支持装置 |
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2018
- 2018-03-23 CN CN201880023081.3A patent/CN110520798B/zh active Active
- 2018-03-23 WO PCT/JP2018/011656 patent/WO2018180969A1/ja active Application Filing
- 2018-03-29 TW TW107110826A patent/TWI765999B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1828828A (zh) * | 2005-02-28 | 2006-09-06 | 东京毅力科创株式会社 | 基板处理装置、基板处理方法和基板处理程序 |
WO2013031222A1 (ja) * | 2011-08-30 | 2013-03-07 | 株式会社ニコン | 物体搬送装置、物体処理装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、物体の搬送方法、及び物体交換方法 |
CN104662478A (zh) * | 2012-08-08 | 2015-05-27 | 株式会社尼康 | 物体交换方法、物体交换系统、曝光装置、平面显示器的制造方法、及组件制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201842413A (zh) | 2018-12-01 |
TWI765999B (zh) | 2022-06-01 |
WO2018180969A1 (ja) | 2018-10-04 |
CN110520798A (zh) | 2019-11-29 |
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