TWI765896B - Load port and substrate handling system with load port - Google Patents

Load port and substrate handling system with load port Download PDF

Info

Publication number
TWI765896B
TWI765896B TW106120607A TW106120607A TWI765896B TW I765896 B TWI765896 B TW I765896B TW 106120607 A TW106120607 A TW 106120607A TW 106120607 A TW106120607 A TW 106120607A TW I765896 B TWI765896 B TW I765896B
Authority
TW
Taiwan
Prior art keywords
container
door
loading port
receiving
loading
Prior art date
Application number
TW106120607A
Other languages
Chinese (zh)
Other versions
TW201804556A (en
Inventor
夏目光夫
谷山育志
吉川雅順
Original Assignee
日商昕芙旎雅股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昕芙旎雅股份有限公司 filed Critical 日商昕芙旎雅股份有限公司
Publication of TW201804556A publication Critical patent/TW201804556A/en
Application granted granted Critical
Publication of TWI765896B publication Critical patent/TWI765896B/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

在具備旋轉機構之裝載埠中，即使在將容器之收授位置配合不具備旋轉機構之裝載埠之情況下，亦回避容器之旋轉時容器衝突至門部等。 In the loading port with the rotating mechanism, even if the receiving and receiving position of the container is matched with the loading port without the rotating mechanism, the collision of the container against the door when the container is rotated can be avoided.

裝載埠(4)具備：具有開口部(30)之基座(20)；被設置在基座(20)，開關開口部(30)之門部(21)；在與基座(20)正交之前後方向，從基座(20)朝前方突出設置，支撐載置托盤(23)的框架(22)；使載置托盤(23)在垂直軸周圍旋轉之旋轉機構(24)；及在FOUP(300)藉由OHT(400)被載置於載置托盤(23)之後，旋轉機構(24)使載置托盤(23)旋轉之前或正在旋轉當中，使門部(21)及載置托盤(23)中之至少一方遠離另一方之移動機構。因FOUP(300)和門部(21)等相對性遠離，故可以回避FOUP(300)旋轉時衝突至門部(21)等。 The loading port (4) is provided with: a base (20) having an opening (30); a door (21) provided on the base (20) to open and close the opening (30); A frame (22) for supporting the placement tray (23) in the front-back direction, protruding forward from the base (20); a rotating mechanism (24) for rotating the placement tray (23) around a vertical axis; and After the FOUP ( 300 ) is placed on the placement tray ( 23 ) by the OHT ( 400 ), before or during the rotation of the placement tray ( 23 ) by the rotating mechanism ( 24 ), the door ( 21 ) and the placement tray ( 23 ) are rotated. At least one of the trays (23) is away from the moving mechanism of the other. Since the FOUP ( 300 ) and the door ( 21 ) and the like are relatively far apart, it is possible to avoid collision with the door ( 21 ) and the like when the FOUP ( 300 ) rotates.

Description

裝載埠及具備裝載埠之基板搬運系統 Load port and substrate handling system with load port

本發明關於使收容基板之容器旋轉之旋轉機構的裝載埠，及具備該裝載埠之基板搬運系統。 The present invention relates to a loading port of a rotating mechanism for rotating a container for accommodating substrates, and a substrate conveying system provided with the loading port.

自以往所知的有在收容半導體晶圓等之基板之FOUP(Front-Opening Unified Pod)等之容器，和設置搬運基板之搬運手段的搬運室之間進行基板之取出放入之時，裝載容器之裝載埠這樣的裝置。另外，裝載埠連同上述搬運手段及搬運室，構成EFEM(Equipment Front End Module)等之基板搬運系統。 It has been conventionally known that when taking out and placing a substrate between a container such as a FOUP (Front-Opening Unified Pod) for accommodating substrates such as semiconductor wafers, and a transfer chamber provided with a transfer means for transferring substrates, the loading container such a device as the load port. In addition, the load port, together with the above-mentioned transfer means and transfer chamber, constitute a board transfer system such as EFEM (Equipment Front End Module).

通常，雖然上述容器係在被設置在容器之側面的蓋，和為了關閉該蓋被設置在裝載埠之門正對之狀態下，被載置在裝載埠，但是有在如此之方向不載置容器之情況。例如，在工場內保管容器之儲存器不具備使容器旋轉之旋轉機構之情況等下，在容器成為與平常相反方向之狀態下，有可能被載置在裝載埠。在如此之情況下，必須以容器之蓋與門正對之方式使容器旋轉，因此在專利文獻1~3揭示具備旋轉手段之裝載埠。 Usually, although the container is attached to a lid provided on the side of the container, and the lid is placed in a state facing the door of the loading port in order to close the lid, it is placed in the loading port, but there are cases where it is not placed in such a direction. The condition of the container. For example, in the case where the container for storing the container in the factory does not have a rotating mechanism for rotating the container, the container may be placed in the loading port in a state where the container is in the opposite direction from normal. In such a case, it is necessary to rotate the container so that the lid of the container and the door face each other. Therefore, Patent Documents 1 to 3 disclose loading ports provided with rotating means.

記載於專利文獻1之裝載埠具備載置容器之 載置部，和使載置部移動之移動機構，和使移動機構旋轉之旋轉機構。載置部能夠在具備叉架部之移載機(即是，在地板行走之移載機)之間進行容器之收授的收授位置，和容器之蓋連同門被開關之門開關位置之間移動。藉由旋轉機構連同載置部使容器旋轉，容器之蓋和門正對。另外，使容器旋轉之旋轉位置在收授位置和門開關位置之間。 The loading port described in Patent Document 1 is provided with a loading container. A mounting portion, a moving mechanism for moving the mounting portion, and a rotation mechanism for rotating the moving mechanism. The receiving and receiving position where the mounting part can perform receiving and receiving of the container between the transfer machine with the fork part (that is, the transfer machine that walks on the floor), and the door opening and closing position of the cover of the container and the door to be opened and closed. move between. The container is rotated by the rotating mechanism together with the mounting part, and the lid and the door of the container are facing each other. In addition, the rotation position for rotating the container is between the receiving position and the door opening and closing position.

在專利文獻2、3中雖然也與專利文獻1相同揭示具有使容器旋轉之旋轉機構的裝載埠，但是在專利文獻2、3所記載之裝載埠中，使容器旋轉之旋轉位置被設成與在搬運容器至裝載埠之裝置等之間收授容器的收授位置相同。 In Patent Documents 2 and 3, similarly to Patent Document 1, a loading port having a rotation mechanism for rotating the container is disclosed. However, in the loading ports described in Patent Documents 2 and 3, the rotation position for rotating the container is set to The receiving and receiving position of the receiving and receiving container is the same between the device etc. that transport the container to the loading port.

另外，作為在半導體工場等之工場內輸送容器之輸送手段，所知的有沿著事先設置之軌道而行走之OHT(Overhead Hoist Transfer)等之無人搬運車。在配置如此之輸送手段之工場內，混合具備旋轉機構之裝載埠，和不具有旋轉機構之裝載埠(以下，通常稱為裝載埠)之情況下，為了提升搬運效率，有希望沿著輸送手段配置雙方之裝載埠中的容器之收授位置之需求。另外，輸送手段之行走軌道和上述搬運室中配置裝載埠之壁面之距離藉由規格被設定，在例如OHT之情況，藉由SEMI規格，不因基板之大小而有所不同，被設定成在俯視下243mm前後。 In addition, as a conveyance means for conveying containers in a factory such as a semiconductor factory, an unmanned transport vehicle such as an OHT (Overhead Hoist Transfer) that travels along a rail set in advance is known. In a factory equipped with such a conveying means, in a case where a loading port with a rotating mechanism and a loading port without a rotating mechanism (hereinafter, generally referred to as a loading port) are mixed, in order to improve the conveying efficiency, it is hoped that along the conveying means Configure the requirements for receiving and receiving positions of containers in the load ports of both parties. In addition, the distance between the running rail of the conveying means and the wall surface in which the loading port is arranged in the above-mentioned transfer chamber is set by the specification. In the case of OHT, for example, the SEMI specification is set so that the size of the substrate does not vary depending on the size of the substrate. 243mm front and rear from top view.

[先行技術文獻] [Prior Technology Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2013-219159號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2013-219159

[專利文獻2]日本專利第4168724號公報 [Patent Document 2] Japanese Patent No. 4168724

[專利文獻3]日本專利第4816637號公報 [Patent Document 3] Japanese Patent No. 4816637

如專利文獻1~3所記載之裝載埠般，不以OHT等之無人搬運車所進行之容器之收授為前提，可以將收授位置設成離門開關位置非常遠之位置的情況下，可以將容器之旋轉位置設定在與收授位置相同或較收授位置靠門開關位置側。但是，依據上述規格，當在接近門開關位置之位置設定收授位置時，該些裝載埠中尺寸上，於旋轉時會容器會衝突至門或其周邊之壁面。因此，有無法沿著相同之輸送手段之軌道配置具備該些旋轉機構之裝載埠中之收授位置，和不具備旋轉機構之裝載埠中之收授位置，容器之輸送效率下降這樣的問題。 Like the loading ports described in Patent Documents 1 to 3, it is not premised on receiving and receiving containers by an unmanned guided vehicle such as OHT, and when the receiving and receiving position can be set to a position very far from the door switch position, The rotation position of the container can be set to be the same as the receiving position or closer to the door switch position than the receiving position. However, according to the above specification, when the receiving and receiving position is set at a position close to the door switch position, in the dimensions of these loading ports, the container may collide with the door or its surrounding wall surface during rotation. Therefore, there is a problem that the receiving and receiving positions in the loading port provided with the rotating mechanisms and the receiving and receiving positions in the loading port without the rotating mechanism cannot be arranged along the track of the same conveying means, and the transport efficiency of the containers is lowered.

本發明之目的係在具備旋轉機構之裝載埠中，即使在沿著與不具備旋轉機構之裝載埠中之收授位置相同之輸送手段之軌道而配置容器從輸送手段被收授至載置部之收授位置之情況下，亦迴避容器之旋轉時容器朝門等之衝突。 The object of the present invention is to arrange containers to be delivered from the delivery means to the mounting portion even if the container is arranged along the track of the delivery means at the same receiving position as the delivery position in the loading port without the rotation mechanism in the loading port provided with the rotation mechanism In the case of the receiving and delivering position, it also avoids the conflict of the container facing the door when the container is rotated.

第1發明之裝載埠具備收容基板之容器被載置的載置部，當上述載置部位於沿著事先被設置之軌道而行走且在與輸送上述容器之輸送手段之間能收授上述容器之收授位置之時，在與上述輸送手段之間收授上述容器，該裝載埠之特徵在於具備：基座，其係被豎立設置，具有開口部；門部，其係被設置在上述基座，開關上述開口部；框架，其係在與上述基座正交之前後方向中，從上述基座朝前方突出設置，支撐上述載置部；旋轉機構，其係使上述載置部在垂直軸周圍旋轉；及移動機構，其係上述容器藉由上述輸送手段被載置在上述載置部之後，上述旋轉機構使上述載置部旋轉之前或正在旋轉當中，使上述門部及上述載置部之中之至少任一方從另一方遠離。 The loading port of the first invention includes a loading portion on which a container for accommodating a substrate is placed, and when the loading portion is located along a rail provided in advance, the container can be received and received between the loading port and the conveying means for conveying the container. At the receiving and delivering position, the container is received and delivered between the conveying means, and the loading port is characterized by being provided with: a base which is erected and has an opening; and a door which is arranged on the base. a seat for opening and closing the opening; a frame for protruding forward from the base in the front-rear direction perpendicular to the base to support the placing part; and a rotation mechanism for making the placing part in the vertical direction Rotation around an axis; and a moving mechanism for causing the door and the mounting portion to be rotated before or during rotation of the mounting portion by the rotating mechanism after the container is mounted on the mounting portion by the conveying means. At least one of the divisions is kept away from the other.

在具備旋轉機構之裝載埠中，於容器藉由輸送手段被載置於載置部之後，在旋轉機構使載置部旋轉之前或正在旋轉當中，門部和載置部之前後方向之距離相對性地遠離。因此，在具備旋轉機構之裝載埠中，即使在沿著與不具備旋轉機構之裝載埠中之收授位置相同之輸送手段之軌道而配置容器從輸送手段被收授至載置部之收授位置之情況下，亦可以迴避容器之旋轉時容器衝突至門部或基座等之情形。 In a loading port equipped with a rotating mechanism, after the container is placed on the placing portion by the conveying means, before or during rotation of the placing portion by the rotating mechanism, the distance between the door portion and the placing portion in the front-rear direction is opposite. Sexually away. Therefore, in the loading port equipped with the rotating mechanism, even if the container is arranged along the track of the transporting means at the same receiving position as the receiving position in the loading port without the rotating mechanism, the receiving and receiving of the container from the transporting means to the placing portion is arranged. In the case of the position of the container, it can also avoid the situation that the container collides with the door or the base when the container is rotated.

第2發明之裝載部在上述第1發明中，上述移動機構係使上述載置部在與上述輸送手段之間從上述容器被收授於上述載置部之收授位置朝前後方向移動者，在 上述容器藉由上述輸送手段被載置於位於上述收授位置之上述載置部之後，且上述旋轉機構使上述載置部旋轉之前或正在旋轉當中，使上述載置部移動至較上述收授位置更於上述前方。 According to the second invention, in the above-described first invention, the moving mechanism moves the placing portion in the front-rear direction from a receiving position where the container is received from the placing portion, between the moving mechanism and the conveying means. exist After the container is placed on the placing portion at the receiving and receiving position by the conveying means, and before or during the rotating mechanism rotates the placing portion, the placing portion is moved to a position higher than the receiving portion. The location is more in front of the above.

容器被載置於載置部之後，因在旋轉手段使載置部旋轉之前，或邊旋轉，載置部藉由移動機構移動至較收授位置更前方，故可以回避容器之旋轉時容器衝突至門部或基座之情形。另外，因比起使門部後退之情形，裝載埠側之空氣難以通過開口部而進入後方之空間，故少擔心後方之空間的污染。 After the container is placed on the placing part, before the rotating means rotates the placing part, or while rotating, the placing part is moved to the front of the receiving and receiving position by the moving mechanism, so it is possible to avoid the container conflict during the rotation of the container. to the door or base. In addition, compared with the case where the door is moved backward, it is difficult for the air on the loading port side to enter the rear space through the opening, so there is less concern about contamination of the rear space.

第3發明之裝載埠在上述第2發明中，上述旋轉機構係上述移動機構使上述載置部移動至較上述收授位置更於上述前方之旋轉位置為止之後，使上述載置部旋轉。 A loading port of a third invention is the second invention, wherein the rotating mechanism rotates the mounting portion after the moving mechanism moves the mounting portion to a rotational position further ahead than the receiving position.

載置部藉由移動機構移動至較收授位置前方之旋轉位置之後，因藉由旋轉機構旋轉，故可以回避容器之旋轉時，容器衝突至門部或基座。 After the mounting part is moved to the rotation position in front of the receiving and delivering position by the moving mechanism, because the rotation mechanism is used to rotate, the container can be prevented from colliding with the door part or the base when the container is rotated.

第4發明之裝載埠在上述第3發明中，藉由上述移動機構使上述載置部突出於較上述框架更於上述前方，使上述載置部移動至上述旋轉位置。 In the loading port of a fourth invention, in the third invention, the moving mechanism causes the placing portion to protrude further forward than the frame to move the placing portion to the rotational position.

若藉由本發明時，因僅載置部突出至旋轉位置，故無須使框架突出至旋轉位置，框架之前後方向之大小成為小型，可以縮小裝載埠之設置面積。 According to the present invention, since only the mounting portion protrudes to the rotating position, the frame does not need to protrude to the rotating position, the size of the frame in the front-rear direction is small, and the installation area of the loading port can be reduced.

第5發明之裝載埠在上述第4發明中，具備 檢測位於上述框架之上述前方之障礙物的檢測手段，和上述檢測手段檢測上述障礙物之時限制上述載置部朝上述旋轉位置移動的控制手段。 The load port of the fifth invention is provided with the above-mentioned fourth invention. A detection means for detecting an obstacle located in front of the frame, and a control means for restricting the movement of the placing portion to the rotational position when the detection means detects the obstacle.

若藉由本發明時，因可以防止當人等通行接近時，載置部及容器較飛出至較框架前方，故可以確保安全性。 According to the present invention, since it is possible to prevent the placing portion and the container from flying out to the front of the frame when people and the like pass by, safety can be ensured.

第6發明之裝載埠在上述第2至第5中之任一發明中，上述移動機構具有從下方支撐上述旋轉機構，並且能夠在前後方向移動之可動部，上述載置部藉由上述旋轉機構從下方支撐，在與被形成在載置於上述載置部之上述容器之下面的噴嘴插入口連接的連接位置，和從上述容器插入口朝下方間隔開之間隔位置之間，能夠升降之氣體的注入或排出用之噴嘴，被支撐於上述可動部。 A loading port of a sixth invention is in any one of the second to fifth inventions, wherein the moving mechanism includes a movable portion that supports the rotating mechanism from below and is movable in the front-rear direction, and the placing portion is provided by the rotating mechanism. A gas supported from below and can be raised and lowered between a connection position connected to a nozzle insertion port formed on the lower surface of the container mounted on the mounting portion and a spaced position spaced downward from the container insertion port The nozzle for injection or discharge is supported by the movable part.

若藉由本發明時，因旋轉機構藉由移動機構之可動部被支撐，載置部被支撐於旋轉機構，故僅載置部藉由旋轉機構旋轉，被設置在移動機構之可動部之上面的氣體注入或排出用之噴嘴不旋轉。因此，不會有藉由被連接於噴嘴之氣體之注入或排出用之配管而妨礙旋轉機構之動作的情形，可以使載置部旋轉。 According to the present invention, since the rotating mechanism is supported by the movable portion of the moving mechanism, and the placing portion is supported by the rotating mechanism, only the placing portion is rotated by the rotating mechanism and is provided on the upper surface of the movable portion of the moving mechanism. Nozzles for gas injection or discharge do not rotate. Therefore, it is possible to rotate the mounting portion without interfering with the operation of the rotating mechanism by the piping for injection or discharge of the gas connected to the nozzle.

第7發明之裝載埠在上述第6發明中，上述移動機構使上述載置部朝被設置在上述容器之側面之蓋連同上述門部被開關之門開關位置移動之前，或正在移動當中，上述噴嘴移動至上述連接位置，開始經上述噴嘴朝上述容器注入或排出氣體。 A loading port according to a seventh invention, in the sixth invention, before or during the moving mechanism moves the loading portion toward a door opening and closing position where the lid provided on the side surface of the container and the door portion are opened and closed, the The nozzle moves to the above-mentioned connection position, and starts to inject or discharge gas into the above-mentioned container through the above-mentioned nozzle.

因氣體之注入或排出用之噴嘴被設置在可動部之上面，故即使載置部藉由移動機構移動之期間，噴嘴和載置部之前後方向的相對位置亦不變化。因此，在載置部移動至門開關位置之前或正在移動進行中，可以開始朝容器注入或排出氣體。因此，可以較載置部之移動完成後開始注入氣體等，更早完成氣體之注入等，可以縮短門部開關為止的時間。 Since the nozzle for gas injection or discharge is provided on the upper surface of the movable portion, even when the mounting portion is moved by the moving mechanism, the relative position of the nozzle and the mounting portion in the front-rear direction does not change. Therefore, before or during the movement of the placement portion to the door opening and closing position, it is possible to start injecting or discharging gas into the container. Therefore, the gas injection can be completed earlier than the start of the gas injection after the movement of the placement portion is completed, and the time until the door is opened and closed can be shortened.

第8發明之基板搬運系統具備：第1裝載埠，其係上述第1至第7中之任一發明的裝載埠，和第2裝載埠，其具備上述載置部，並且不具備上述旋轉機構，和搬運室，其具有將上述基板取出放入至上述容器之搬運手段，上述第1裝載埠之上述載置部之上述收授位置，和上述第2裝載埠之上述載置部之上述收授位置沿著上述輸送手段之上述軌道被配置。 The board conveyance system of the eighth invention includes: a first loading port which is the loading port of any one of the first to seventh inventions; and a second loading port which includes the mounting portion and does not include the rotating mechanism , and a conveying chamber having conveying means for taking out and placing the substrates into the containers, the receiving and receiving positions of the placing portions of the first loading port, and the receiving and receiving positions of the placing portions of the second loading port. The delivery position is arranged along the above-mentioned track of the above-mentioned conveying means.

針對具備旋轉機構之第1裝載埠及不具有旋轉機構之第2裝載埠，各個的裝載埠之載置部取得的收授位置沿著相同之輸送手段的行走軌道而被配置。因此，針對各個的裝載埠，可以使用相同之輸送手段而進行容器之收授。 With respect to the first loading port provided with the rotation mechanism and the second loading port not provided with the rotation mechanism, the receiving and receiving positions acquired by the mounting portions of the respective loading ports are arranged along the traveling rails of the same conveying means. Therefore, for each loading port, the same conveying means can be used for the delivery and delivery of containers.

3、3b‧‧‧EFEM 3. 3b‧‧‧EFEM

4、4a、5‧‧‧裝載埠 4, 4a, 5‧‧‧Load port

6、6b‧‧‧搬運室 6. 6b‧‧‧Transportation room

7‧‧‧搬送機器人 7‧‧‧Transfer robot

10、11、29‧‧‧控制裝置 10, 11, 29‧‧‧Control device

20、20a‧‧‧基座 20, 20a‧‧‧Pedestal

21、21a‧‧‧門部 21, 21a‧‧‧Department

22‧‧‧框架 22‧‧‧Framework

23‧‧‧載置托盤 23‧‧‧Place tray

24‧‧‧旋轉機構 24‧‧‧Rotating mechanism

25‧‧‧移動機構 25‧‧‧Mobile Mechanism

26‧‧‧感測器 26‧‧‧Sensor

29‧‧‧控制裝置 29‧‧‧Control device

30、30a‧‧‧開口部 30, 30a‧‧‧Opening

31、31a‧‧‧門 31, 31a‧‧‧door

39、40‧‧‧噴嘴通過孔 39, 40‧‧‧Nozzle through hole

47‧‧‧可動部 47‧‧‧Moveable part

55‧‧‧注入噴嘴 55‧‧‧Injection nozzle

56‧‧‧排出噴嘴 56‧‧‧Discharge nozzle

60‧‧‧移動機構 60‧‧‧Mobile Mechanism

300‧‧‧FOUP 300‧‧‧FOUP

400‧‧‧OHT 400‧‧‧OHT

401‧‧‧軌道 401‧‧‧Track

圖1(a)為包含與本實施型態有關之裝載埠之半導體裝置及其周邊之概略性的俯視圖，(b)為相同的俯視 圖。 FIG. 1( a ) is a schematic plan view of a semiconductor device including a loading port related to the present embodiment and its surroundings, and FIG. 1( b ) is a plan view of the same picture.

圖2為裝載埠之斜視圖。 Figure 2 is an oblique view of the loading port.

圖3為裝載埠之右側面圖。 Figure 3 is a right side view of the loading port.

圖4為表示載置托盤之位置的右側面圖，(a)為中間之位置，(b)為前方之位置，(c)為表示後方之位置。 Fig. 4 is a right side view showing a position where a tray is placed, (a) is a middle position, (b) is a front position, and (c) is a rear position.

圖5為表示噴嘴之升降的右側面圖，(a)表示噴嘴位於間隔位置之狀態，(b)表示噴嘴位於連接位置之狀態。 5 : is a right side view which shows the raising/lowering of a nozzle, (a) shows the state which the nozzle is located in a spaced position, and (b) shows the state in which the nozzle is located in a connecting position.

圖6為圖1(a)之放大圖。 FIG. 6 is an enlarged view of FIG. 1( a ).

圖7為裝載埠之動作的流程圖。 FIG. 7 is a flowchart of the operation of the load port.

圖8為表示裝載埠之動作的俯視圖。 FIG. 8 is a plan view showing the operation of the loading port.

圖9為表示裝載埠之動作的右側面圖。 FIG. 9 is a right side view showing the operation of the load port.

圖10為與變形例有關之裝載埠的斜視圖。 FIG. 10 is a perspective view of a loading port according to a modification.

圖11為裝載埠之右側面圖。 Figure 11 is a right side view of the loading port.

圖12為表示裝載埠之動作的俯視圖。 FIG. 12 is a plan view showing the operation of the loading port.

圖13為與另外之變形例有關的EFEM之俯視圖。 FIG. 13 is a plan view of an EFEM according to another modification.

接著，針對本發明之實施型態，一面參照圖1~圖8，一面進行說明。另外，如圖1所示般，將複數裝載埠4、5排列之方向視為左右方向。再者，將與左右方向正交，裝載埠4、5朝向搬運室6之方向視為前後方向。在前後方向，將裝載埠4、5側視為前方，將搬運室 6側視為後方。 Next, an embodiment of the present invention will be described with reference to FIGS. 1 to 8 . In addition, as shown in FIG. 1, the direction in which the plurality of load ports 4 and 5 are arranged is regarded as the left-right direction. In addition, the direction orthogonal to the left-right direction, and the direction in which the loading ports 4 and 5 face the transfer chamber 6 is regarded as the front-rear direction. In the front-rear direction, the side of loading ports 4 and 5 is regarded as the front, and the transfer room is 6 sides are regarded as rear.

(包含裝載埠之半導體裝置及周邊之概略構成) (Schematic configuration of semiconductor device including load port and its surroundings)

圖1為被設置在半導體工場之半導體製造裝置1及其周邊之概略圖。如圖1(a)所示般，半導體製造裝置1具備對晶圓等之基板進行處理之基板處理裝置2，和在與基板處理裝置2之間收授基板之EFEM3(本發明之基板搬運系統)。半導體製造裝置1進行以下之一連串動作。首先，EFEM3係從後述之OHT400(本發明之輸送手段)等接取收容基板之FOUP300(本發明之容器)。接著，EFEM3從FOUP300取出基板，而將基板交給基板處理裝置2。基板處理裝置2進行從EFEM3接取到之基板的處理，將基板返回至EFEM3。EFEM3係將基板返回至FOUP300。之後，FOUP300藉由OHT400等被搬運。 FIG. 1 is a schematic view of a semiconductor manufacturing apparatus 1 installed in a semiconductor factory and its surroundings. As shown in FIG. 1( a ), the semiconductor manufacturing apparatus 1 includes a substrate processing apparatus 2 for processing substrates such as wafers, and an EFEM 3 (the substrate transfer system of the present invention) for receiving and receiving substrates from the substrate processing apparatus 2 . ). The semiconductor manufacturing apparatus 1 performs one of the following series of operations. First, EFEM3 receives FOUP300 (container of this invention) which accommodates a board|substrate from OHT400 (transport means of this invention) etc. mentioned later. Next, the EFEM 3 takes out the substrate from the FOUP 300 and hands the substrate to the substrate processing apparatus 2 . The substrate processing apparatus 2 processes the substrate received from the EFEM 3 and returns the substrate to the EFEM 3 . The EFEM3 system returns the substrate to the FOUP300. After that, the FOUP300 is transported by the OHT400 or the like.

基板處理裝置2具備無圖示之基板處理機構，和控制裝置10。控制裝置10控制基板處理機構，進行基板之處理或EFEM3之間的基板的收授外，在作為上位電腦之主機200等之間進行通訊。 The substrate processing apparatus 2 includes a substrate processing mechanism (not shown) and a control device 10 . The control device 10 controls the substrate processing mechanism, performs substrate processing, and transmits and receives substrates between EFEMs 3 and communicates with the host computer 200 or the like as a host computer.

EFEM3具備一台之裝載埠4(本發明之裝載埠及第1裝載埠)，和2台裝載埠5(本發明之第2裝載埠)，和搬運室6，和搬運機器人7(本發明之搬運手段)，和控制裝置11。另外，裝載埠4和裝載埠5之大的差異點，係有無後述旋轉機構24。即是，裝載埠4具備旋轉機構24，裝載埠5不具備旋轉機構24。 EFEM3 is provided with one loading port 4 (the loading port and the first loading port of the present invention), two loading ports 5 (the second loading port of the present invention), a transfer room 6, and a transfer robot 7 (the present invention). transport means), and the control device 11. In addition, the big difference between the loading port 4 and the loading port 5 is the presence or absence of the rotation mechanism 24 which will be described later. That is, the loading port 4 includes the rotating mechanism 24 , and the loading port 5 does not include the rotating mechanism 24 .

裝載埠4、5係以各個的後端部沿著後述搬運室6之前側之隔壁8之方式，被排列設置在左右方向。在裝載埠4、5載置FOUP300。另外，FOUP300係藉由OHT400在工場內被輸送。如圖1(a)、(b)所示般，OHT400沿著事先被設置在工場內之頂棚之軌道401(本發明之軌道)而行走，從上方存取至裝載埠4、5之無人搬運車。OHT400根據來自主機200之指令，將FOUP300收授至裝載埠4或裝載埠5。 The loading ports 4 and 5 are arranged in the left-right direction so that the rear end portions of the loading ports 4 and 5 follow the partition wall 8 on the front side of the transfer chamber 6 to be described later. The FOUP 300 is placed on the load ports 4 and 5 . In addition, FOUP300 is transported in the factory by OHT400. As shown in FIGS. 1( a ) and ( b ), the OHT 400 travels along the rail 401 (the rail of the present invention) of the ceiling installed in advance in the workshop, and is accessed from above to the unmanned transportation of the loading ports 4 and 5 car. The OHT 400 transmits and receives the FOUP 300 to the load port 4 or the load port 5 according to the command from the host 200 .

搬運室6構成藉由隔壁8與外部空間隔離之搬運空間9。另外，軌道401，與搬運室6之前方之隔壁8之前後方向的距離L，藉由例如SEMI規格被設定的243mm前後。 The transfer chamber 6 constitutes a transfer space 9 isolated from the external space by the partition wall 8 . In addition, the distance L in the front-rear direction between the rail 401 and the partition wall 8 in front of the conveyance chamber 6 is set in the front-rear direction of 243 mm, for example, according to the SEMI standard.

搬運機器人7被設置在搬運室6內，且在被載置於裝載埠4、5之FOUP300和基板處理裝置2之間進行基板之收授。控制裝置11除了進行搬運機器人7之控制外，在基板處理裝置2之控制裝置10、後述裝載埠4之控制裝置29及主機200等之間，進行通訊。 The transfer robot 7 is installed in the transfer chamber 6 and transfers substrates between the FOUPs 300 placed on the load ports 4 and 5 and the substrate processing apparatus 2 . The control device 11 performs communication among the control device 10 of the substrate processing device 2 , the control device 29 of the load port 4 described later, the host computer 200 , and the like, in addition to the control of the transfer robot 7 .

(裝載埠之構成) (Configuration of the load port)

接著，針對裝載埠4之構成予以說明。另外，將圖2所示之方向視為前後左右上下方向。 Next, the configuration of the load port 4 will be described. In addition, the direction shown in FIG. 2 is regarded as the front-back, left-right, up-down direction.

如圖2、圖3及圖5所示般，裝載埠4具備基座20、門部21、框架22、載置托盤23(本發明之載置部)、旋轉機構24、移動機構25、氮氣沖洗單元27和控 制裝置29(本發明之控制手段)等。 As shown in FIGS. 2 , 3 and 5 , the loading port 4 includes a base 20 , a door portion 21 , a frame 22 , a mounting tray 23 (the mounting portion of the present invention), a rotating mechanism 24 , a moving mechanism 25 , and nitrogen gas. Rinse unit 27 and control Control device 29 (control means of the present invention) and the like.

基座20在俯視下為略矩形狀之平板狀的部分。基座20被豎立配置成構成搬運室6之隔壁8之一部分。再者，在基座20之上側部分，形成在俯視下呈略矩形狀之開口部30。開口部30具有被設置在FOUP300之側面的蓋301可以前後通過的大小。 The base 20 is a substantially rectangular plate-shaped portion in plan view. The base 20 is erected so as to constitute a part of the partition wall 8 of the transfer chamber 6 . Furthermore, an opening 30 having a substantially rectangular shape in plan view is formed on the upper portion of the base 20 . The opening 30 has a size in which the cover 301 provided on the side surface of the FOUP 300 can pass back and forth.

門部21具有門31和門臂32。門31係略矩形狀之平板狀的構件，具有可以從後方塞住開口部30的大小。門31具有吸附FOUP300之蓋301之吸附部33，和開關蓋301之鎖部的卡鎖楔34。門臂32被安裝在門31之後部，係從下方支撐門31的構件。再者，門臂32被連接於門移動部35。門移動部35被設置在基座20之後方，使門31及門臂32在前後方向及上下方向移動。 The door portion 21 has a door 31 and a door arm 32 . The door 31 is a substantially rectangular plate-shaped member, and has a size that can close the opening 30 from the rear. The door 31 has a suction portion 33 for sucking the cover 301 of the FOUP 300 , and a locking wedge 34 for opening and closing the lock portion of the cover 301 . The door arm 32 is attached to the rear of the door 31 and is a member that supports the door 31 from below. Furthermore, the door arm 32 is connected to the door moving part 35 . The door moving part 35 is provided behind the base 20 and moves the door 31 and the door arm 32 in the front-rear direction and the vertical direction.

框架22係從基座20朝前方突出設置之部分。框架22在俯視下為略矩形狀，具有大於FOUP300之面積。另外，在框架22之前面，設置感測器26(本發明之檢測手段)。感測器26係例如具有發光部和受光部之光學感測器。發光部在朝框架22之前方發出光，且在框架22之前方具有障礙物之情況下，受光部檢測藉由障礙物反射之光，將檢測訊號發送至控制裝置29。 The frame 22 is a portion protruding forward from the base 20 . The frame 22 is substantially rectangular in plan view, and has an area larger than that of the FOUP 300 . In addition, on the front face of the frame 22, a sensor 26 (detection means of the present invention) is provided. The sensor 26 is, for example, an optical sensor having a light-emitting portion and a light-receiving portion. When the light-emitting portion emits light toward the front of the frame 22 and there is an obstacle in front of the frame 22 , the light-receiving portion detects the light reflected by the obstacle, and sends a detection signal to the control device 29 .

載置托盤23係俯視下呈略矩形狀之構件，具有可以穩定地載置FOUP300之面積。載置托盤23如後述般，經旋轉機構24及移動機構25從下方被支撐於框架22。 The placement tray 23 is a substantially rectangular member in plan view, and has an area where the FOUP 300 can be placed stably. The placement tray 23 is supported by the frame 22 from below via the rotation mechanism 24 and the movement mechanism 25 as described later.

在載置托盤23之上面，設置三個定位銷36、37、38。定位銷36、37、38係於後述正規之方向載置FOUP300之情況下，配置成與被設置在FOUP300之底面之圖示的3個孔卡合。另外，圖2及圖3中之載置托盤23之方向，係FOUP300之蓋301和門31正對之狀態下的方向。即是，當定位銷36和定位銷37之前後方向之位置略相等，定位銷38位於較定位銷36、37前方之時，FOUP300之蓋301和門31正對。將載置托盤23之上述方向稱為正規之方向。 On the upper surface of the placement tray 23, three positioning pins 36, 37, and 38 are provided. The positioning pins 36 , 37 , and 38 are arranged so as to be engaged with three holes provided in the illustration on the bottom surface of the FOUP 300 when the FOUP 300 is placed in a regular direction described later. In addition, the direction in which the tray 23 is placed in FIGS. 2 and 3 is the direction in the state where the lid 301 and the door 31 of the FOUP 300 are facing each other. That is, when the position of the positioning pin 36 and the positioning pin 37 in the front and rear directions is approximately equal, and the positioning pin 38 is located in front of the positioning pins 36 and 37, the cover 301 of the FOUP 300 and the door 31 are facing each other. The above-mentioned direction in which the tray 23 is placed is referred to as a normal direction.

再者，在載置托盤23形成有從載置托盤23之上面貫通整個下面之兩個噴嘴通過孔39、40。該些噴嘴通過孔39、40被配置成載置托盤23位於正規之方向時，可以分別通過後述注入噴嘴55及排出噴嘴56。 Furthermore, the placement tray 23 is formed with two nozzle passage holes 39 and 40 penetrating the entire lower surface from the upper surface of the placement tray 23 . These nozzle passage holes 39 and 40 are arranged so that when the placement tray 23 is positioned in the normal direction, the injection nozzles 55 and the discharge nozzles 56 to be described later can pass through, respectively.

如圖3所示般，旋轉機構24具有馬達41和傳動軸42。馬達41使用例如旋轉式之氣動馬達等。馬達41被支撐於後述移動機構25之可動部47。傳動軸42係以沿著垂直方向之方式被安裝於馬達41之上部及載置托盤23之下部，從下方支撐載置托盤23，同時將馬達41之旋轉動力傳至載置托盤23。藉由具有上述構成之旋轉機構24之馬達41使傳動軸42旋轉，載置托盤23在垂直軸周圍旋轉。 As shown in FIG. 3 , the rotation mechanism 24 includes a motor 41 and a transmission shaft 42 . As the motor 41, a rotary air motor or the like is used, for example. The motor 41 is supported by a movable portion 47 of the moving mechanism 25 to be described later. The transmission shaft 42 is vertically mounted on the upper part of the motor 41 and the lower part of the placing tray 23 , supports the placing tray 23 from below, and transmits the rotational power of the motor 41 to the placing tray 23 . The drive shaft 42 is rotated by the motor 41 having the rotating mechanism 24 having the above-described configuration, and the placement tray 23 is rotated around the vertical axis.

如圖2~圖4所示般，移動機構25具有氣缸45、傳動部46、可動部47、滑軌48和軌道塊49。氣缸45使用例如構成氣缸45之桿件50能夠取得3種類之位 置的3位置氣缸。氣缸45係以桿件50在前後方向移動之方式，被設置在框架22內。傳動部46被安裝於桿件50之端部及可動部47之下部，且被配置成將氣缸45之動力傳達至可動部47。可動部47被連接於傳動部46之上部，且被設置成在前後方向移動。再者，可動部47從下方支撐旋轉機構24之馬達41。滑軌48沿著前後方向被安裝於可動部47之下部。軌道塊49被固定於框架22之上面，且以能夠前後移動之方式從下方支撐滑軌48。 As shown in FIGS. 2 to 4 , the moving mechanism 25 includes an air cylinder 45 , a transmission portion 46 , a movable portion 47 , a slide rail 48 , and a rail block 49 . The cylinder 45 can take three types of positions using, for example, the rod 50 constituting the cylinder 45. set 3-position cylinder. The air cylinder 45 is installed in the frame 22 so that the rod 50 moves in the front-rear direction. The transmission part 46 is mounted on the end of the rod 50 and the lower part of the movable part 47 , and is configured to transmit the power of the air cylinder 45 to the movable part 47 . The movable part 47 is connected to the upper part of the transmission part 46, and is provided so that it may move in the front-back direction. Furthermore, the movable portion 47 supports the motor 41 of the rotating mechanism 24 from below. The slide rail 48 is attached to the lower part of the movable part 47 along the front-rear direction. The rail block 49 is fixed to the upper surface of the frame 22, and supports the slide rail 48 from below in a manner capable of moving forward and backward.

具有上述構成之移動機構25之氣缸45藉由使桿件50在前後方向移動，載置托盤23如圖4所示般，在前後方向能在三個位置之間移動。在裝載埠4如圖1所示般被配置之狀態下，如圖4(a)所示般，當載置托盤23在前後方向位於中間之位置之時，載置托盤23位於軌道401之正下方。即是，載置托盤23可以藉由OHT400收受FOUP300。將載置托盤23之上述位置稱為收授位置。 The air cylinder 45 having the moving mechanism 25 having the above-described configuration moves the rod 50 in the front-rear direction, so that the mounting tray 23 can be moved between three positions in the front-rear direction as shown in FIG. 4 . In the state where the loading port 4 is arranged as shown in FIG. 1 , as shown in FIG. 4( a ), when the loading tray 23 is located at the middle position in the front-rear direction, the loading tray 23 is located in the right direction of the rail 401 . below. That is, the placement tray 23 can receive the FOUP 300 through the OHT 400 . The above-mentioned position of the placement tray 23 is referred to as a receiving and receiving position.

再者，如圖4(b)所示般，當載置托盤23位於較收授位置前方之時，如後述般，載置托盤23藉由旋轉機構24被迫旋轉。將該前方之位置稱為旋轉位置。而且，如圖4(c)所示般，當載置托盤23位於較收授位置後方之時，載置托盤23上之FOUP300之蓋301接近於門部21，蓋301連同門部21被開關。將該後方之位置稱為門開關位置。 Furthermore, as shown in FIG. 4( b ), when the placement tray 23 is positioned in front of the receiving position, the placement tray 23 is forcedly rotated by the rotating mechanism 24 as described later. This forward position is referred to as a rotational position. Furthermore, as shown in FIG. 4( c ), when the placing tray 23 is located behind the receiving position, the cover 301 of the FOUP 300 on the placing tray 23 is close to the door 21 , and the cover 301 and the door 21 are opened and closed. . This rear position is called a door switch position.

再者，裝載埠4係如圖5所示般，具備對 FOUP300內進行氮氣之注入及排出之氮氣沖洗單元27。氮氣沖洗單元27具有供給氮氣之氣體供給手段51和排出事先充滿於FOUP300內之氣體的排氣手段52，和配管53、54，和注入噴嘴55及排出噴嘴56(本發明之噴嘴)和馬達57、58。 Furthermore, the load port 4 is provided with a pair of The nitrogen flushing unit 27 in the FOUP 300 performs nitrogen injection and discharge. The nitrogen flushing unit 27 includes a gas supply means 51 for supplying nitrogen gas, an exhaust means 52 for discharging the gas previously filled in the FOUP 300, piping 53, 54, an injection nozzle 55, a discharge nozzle 56 (a nozzle of the present invention), and a motor 57 , 58.

注入噴嘴55被設置成從移動機構25之可動部47之上面朝上突出，且被配置成當載置托盤23位於正規之方向時，可以通過噴嘴通過孔39。注入噴嘴55被連接於配管53，再者，能夠藉由馬達57升降。配管53與氣體供給手段51連接。同樣，排出噴嘴56被配置成當載置托盤23位於正規之方向時，可以通過噴嘴通過孔40，且被連接於配管54，再者，能夠藉由馬達58升降。配管54與排氣手段52連接。 The injection nozzle 55 is provided so as to protrude upward from the upper surface of the movable portion 47 of the moving mechanism 25, and is arranged to pass through the nozzle passage hole 39 when the mounting tray 23 is positioned in the normal direction. The injection nozzle 55 is connected to the piping 53 and can be raised and lowered by the motor 57 . The piping 53 is connected to the gas supply means 51 . Similarly, the discharge nozzle 56 is arranged so as to be able to pass through the nozzle passing hole 40 when the mounting tray 23 is positioned in the normal direction, to be connected to the piping 54, and to be able to be moved up and down by the motor 58. The piping 54 is connected to the exhaust means 52 .

如圖5(a)所示般，當注入噴嘴55及排出噴嘴56最下降之時，位於與注入噴嘴55及排出噴嘴56之上端較載置托盤23下方間隔開的位置(間隔位置)。再者，如圖5(b)所述般，當注入噴嘴55及排出噴嘴56最上升時，注入噴嘴55及排出噴嘴56之上端部位於分別連接於FOUP300之底面之噴嘴插入口302、303之位置(連接位置)。 As shown in FIG. 5( a ), when the injection nozzle 55 and the discharge nozzle 56 descend the most, they are located at a position (spaced position) spaced apart from the upper ends of the injection nozzle 55 and the discharge nozzle 56 than the lower part of the mounting tray 23 . Furthermore, as shown in FIG. 5( b ), when the injection nozzle 55 and the discharge nozzle 56 are most elevated, the upper ends of the injection nozzle 55 and the discharge nozzle 56 are located between the nozzle insertion ports 302 and 303 respectively connected to the bottom surface of the FOUP 300 . location (connection location).

控制裝置29具備CPU(Central Processing Unit)、ROM(Read Only Memory)、RAM(Random Access Memory)等。控制裝置29除了依照被儲存於ROM之程式，藉由CPU，控制裝載埠4之各機構之外， 在EFEM3之控制裝置11或主機200等之間進行通訊。 The control device 29 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. The control device 29 controls the various mechanisms of the load port 4 through the CPU according to the program stored in the ROM. Communication is performed between the control device 11 of the EFEM3 or the host 200 and the like.

接著，針對裝裝載埠5予以說明。裝載埠5之構成雖然與裝載埠4之構成大概相同，但是如上述般，在不具備旋轉機構24這樣的點，與裝載埠4之構成不同。即是，在裝載埠5中，FOUP300在蓋301與門31正對之狀態下被載置於載置托盤23。另外，裝載埠5之載置托盤23被直接性地支撐於移動機構25。再者，裝載埠5之載置托盤23在旋轉位置不移動，在收授位置和門開關位置之間被迫移動。在裝載埠4和裝載埠5中，載置托盤23之收授位置及門開關位置之前後方向之位置相同。 Next, the loading port 5 will be described. Although the configuration of the loading port 5 is substantially the same as that of the loading port 4, as described above, it is different from the configuration of the loading port 4 in that the rotation mechanism 24 is not provided. That is, in the loading port 5, the FOUP 300 is placed on the loading tray 23 in a state where the lid 301 and the door 31 are facing each other. In addition, the mounting tray 23 of the loading port 5 is directly supported by the moving mechanism 25 . Furthermore, the loading tray 23 of the loading port 5 does not move at the rotating position, but is forced to move between the receiving position and the door opening and closing position. In the loading port 4 and the loading port 5, the receiving position of the loading tray 23 and the position in the front-rear direction of the door opening and closing position are the same.

(裝載埠之動作步驟) (The action steps of the load port)

接著，如圖6所示般，針對被設置在EFEM3之裝載埠4之動作步驟，使用圖6~圖9予以說明。 Next, as shown in FIG. 6 , the operation steps of the load port 4 provided in the EFEM 3 will be described with reference to FIGS. 6 to 9 .

圖7為裝載埠4之動作的流程圖。首先，在載置托盤23上無載置FOUP300之狀態下，裝載埠4之控制裝置29與主機200通訊，取得藉由OHT400被輸送之FOUP300之資訊(S101)。另外，該FOUP300之資訊，包含與被載置於載置托盤23之時之FOUP300之方向有關的資訊。在FOUP300之蓋301以與裝載埠4之門31正對之方向被載置之情況下，作為正規之方向的主旨之資訊，從主機200被送出，在蓋301以與正規之方向相反之方向被載置之情況下，作為反方向之主旨的資訊，從主機200被送出。 FIG. 7 is a flowchart of the operation of the load port 4 . First, in a state where the FOUP 300 is not placed on the placement tray 23, the control device 29 of the loading port 4 communicates with the host computer 200 to obtain the information of the FOUP 300 conveyed by the OHT 400 (S101). In addition, the information of the FOUP 300 includes information on the orientation of the FOUP 300 when it is placed on the placement tray 23 . When the cover 301 of the FOUP 300 is placed in the direction opposite to the door 31 of the load port 4, the information of the subject of the normal direction is sent from the host 200, and the cover 301 is in the opposite direction to the normal direction. In the case of being mounted, information that is the subject of the opposite direction is sent from the host computer 200 .

接著，控制裝置29係根據從主機200接收之資訊，判定FOUP300被載置於載置托盤23之方向係正規之方向或相反方向(S102)。首先，針對FOUP300以相反方向被載置於載置托盤23之情況予以說明。 Next, the control device 29 determines that the direction in which the FOUP 300 is placed on the placement tray 23 is the normal direction or the opposite direction based on the information received from the host computer 200 (S102). First, the case where the FOUP 300 is placed on the placement tray 23 in the opposite direction will be described.

控制裝置29係在載置托盤23被配置在正規之方向之情況下，驅動旋轉機構24之馬達41，使載置托盤23旋轉以載置相反方向之FOUP300。在載置托盤23一開始被配置在相反方向之情況下，控制裝置29不使載置托盤23旋轉。再者，控制裝置29係在載置托盤23位於收授位置以外之位置之情況下，使移動機構25之氣缸45動作，而使載置托盤23移動至收授位置。在載置托盤23一開始位於收授位置之情況下，控制裝置29不使載置托盤23旋轉。即是，控制裝置29係在載置托盤23位於如圖8(a)所示之位置及方向之狀態下待機(S103)。 The control device 29 drives the motor 41 of the rotation mechanism 24 to rotate the placement tray 23 to place the FOUP 300 in the opposite direction when the placement tray 23 is arranged in the normal direction. When the placement tray 23 is initially arranged in the opposite direction, the control device 29 does not rotate the placement tray 23 . Furthermore, the control device 29 operates the air cylinder 45 of the moving mechanism 25 to move the placing tray 23 to the receiving position when the placing tray 23 is located at a position other than the receiving and receiving position. When the placement tray 23 is initially positioned at the receiving and receiving position, the control device 29 does not rotate the placement tray 23 . That is, the control device 29 stands by in a state where the placement tray 23 is located at the position and direction shown in FIG. 8( a ) ( S103 ).

此時，如圖6所示般，裝載埠4之載置托盤23在俯視下沿著軌道401被配置，FOUP300可以藉由OHT400被載置。另外，同樣，裝載埠5中之載置托盤之收授位置在俯視下也沿著軌道401而被配置。 At this time, as shown in FIG. 6 , the mounting tray 23 of the loading port 4 is arranged along the rail 401 in plan view, and the FOUP 300 can be mounted by the OHT 400 . In addition, similarly, the receiving and receiving positions of the mounting trays in the loading port 5 are also arranged along the rails 401 in plan view.

接著，如圖8(b)及圖9(a)所示般，FOUP300藉由OHT400被載置於載置托盤23(S104)。之後，如圖8(c)所示般，控制裝置29使移動機構25之氣缸45動作，使載置托盤23移動至較收授位置前方之旋轉位置，使載置托盤23遠離門31(S105)。如圖8(c)及圖9(b)所示般，在載置托盤23位於旋轉位置 之狀態下，載置托盤23突出至較框架22前方。 Next, as shown in FIG.8(b) and FIG.9(a), FOUP300 is mounted on the mounting tray 23 via OHT400 (S104). After that, as shown in FIG. 8( c ), the control device 29 operates the air cylinder 45 of the moving mechanism 25 to move the placing tray 23 to the rotational position ahead of the receiving and receiving position, so as to move the placing tray 23 away from the door 31 ( S105 ) ). As shown in FIG. 8( c ) and FIG. 9( b ), the placement tray 23 is located at the rotational position In this state, the placing tray 23 protrudes to the front of the frame 22 .

另外，雖然無圖示，但是在框架22之前方具有障礙物之情況，感測器26事先檢測障礙物而將檢測訊號發送至控制裝置29。接收檢測訊號之控制裝置29係以例如不對氣缸45發出控制訊號等，限制載置托盤23朝旋轉位置移動。因此，可以防止當人等通行接近時，載置托盤23及FOUP300飛出至較框架22前方，故可以確保安全性。 In addition, although not shown, when there is an obstacle in front of the frame 22 , the sensor 26 detects the obstacle in advance and sends a detection signal to the control device 29 . The control device 29 that receives the detection signal restricts the movement of the placing tray 23 toward the rotational position, for example, by not issuing a control signal to the air cylinder 45 . Therefore, it is possible to prevent the placement tray 23 and the FOUP 300 from flying out to the front of the frame 22 when a person or the like is passing and approaching, so that safety can be ensured.

接著，如圖8(d)、(e)及圖9(c)所示般，控制裝置29驅動旋轉機構24之馬達41，使載置托盤旋轉180°(S106)。在此，當在載置托盤23位於收授位置之狀態下，FOUP300旋轉時，雖然FOUP300衝突至裝載埠4之門31或基座20，但是因載置托盤23位於較收授位置前方之旋轉位置之時，FOUP300旋轉，故FOUP300不衝突至門31或基座20而旋轉。即是，在裝載埠4中，即使沿著與裝載埠5中之載置托盤23之收授位置相同之OHT400之軌道401而配置載置托盤23之收授位置之情況下，亦可以回避FOUP300於旋轉時衝突至門31或基座20之情形。另外，在本實施型態中，比起在後述之變形例中所示般使門部21a後退之情況下，裝載埠4側之空間通過開口部30而難以進入至搬運空間9，故少擔心搬運空間9之污染。 Next, as shown in FIGS. 8( d ), ( e ) and 9 ( c ), the control device 29 drives the motor 41 of the rotation mechanism 24 to rotate the placement tray by 180° ( S106 ). Here, when the FOUP 300 rotates when the placing tray 23 is at the receiving position, although the FOUP 300 collides with the door 31 of the loading port 4 or the base 20, the rotation of the placing tray 23 in front of the receiving position At the time of the position, the FOUP 300 rotates, so the FOUP 300 does not collide with the door 31 or the base 20 and rotates. That is, in the loading port 4, even when the receiving and receiving position of the placing tray 23 is arranged along the rail 401 of the OHT 400 which is the same as the receiving and receiving position of the placing tray 23 in the loading port 5, the FOUP 300 can be avoided. In the case of collision with the door 31 or the base 20 during rotation. In addition, in the present embodiment, compared with the case where the door portion 21a is retracted as shown in the modified example described later, the space on the side of the loading port 4 passes through the opening portion 30 and it is difficult to enter the conveyance space 9, so there is less concern. Contamination of the handling space 9.

另外，因旋轉機構24藉由移動機構25之可動部47被支撐，載置托盤23藉由旋轉機構24被支撐， 故藉由旋轉機構24旋轉僅有載置托盤23及FOUP300。即是，被設置在可動部47之上面的上述注入噴嘴55及排出噴嘴56不旋轉。因此，載置托盤23不藉由配管53、54而妨礙旋轉機構24之動作，可以旋轉。 In addition, since the rotating mechanism 24 is supported by the movable portion 47 of the moving mechanism 25, the placement tray 23 is supported by the rotating mechanism 24, Therefore, only the placement tray 23 and the FOUP 300 are rotated by the rotation mechanism 24 . That is, the above-mentioned injection nozzle 55 and discharge nozzle 56 provided on the upper surface of the movable portion 47 do not rotate. Therefore, the mounting tray 23 can be rotated without interfering with the operation of the rotation mechanism 24 by the pipes 53 and 54 .

接著，控制裝置29驅動氮氣沖洗單元27之馬達57、58，而使注入噴嘴55及排出噴嘴56上升至連接位置而使連接於FOUP300之底部之噴嘴插入口302、303。而且，控制裝置29係控制氣體供給手段51及排氣手段52，而通過注入噴嘴55及排出噴嘴56而開始朝FOUP300注入氮氣及排出氣體(S107)。另外，如圖9(a)、(b)所示般，在載置托盤23被配置在相反相向之狀態下，因注入噴嘴55及排出噴嘴56之前後方向之位置和噴嘴通過孔39、40之前後方向之位置不一致，故無法使注入噴嘴55及排出噴嘴56連接於FOUP300。如圖9(c)所示般，藉由載置托盤23被配置在正規之方向，首先朝注入噴嘴55及排出噴嘴56之FOUP300連接。 Next, the control device 29 drives the motors 57 and 58 of the nitrogen flushing unit 27 to raise the injection nozzle 55 and the discharge nozzle 56 to the connection position and insert the nozzles connected to the bottom of the FOUP 300 into the ports 302 and 303 . Then, the control device 29 controls the gas supply means 51 and the exhaust means 52 to start injecting nitrogen gas and exhaust gas into the FOUP 300 through the injection nozzle 55 and the exhaust nozzle 56 (S107). In addition, as shown in FIGS. 9( a ) and ( b ), when the placement trays 23 are arranged in the oppositely facing state, due to the position of the injection nozzle 55 and the discharge nozzle 56 in the front and rear directions and the nozzle passage holes 39 and 40 Since the positions in the front and rear directions do not match, the injection nozzle 55 and the discharge nozzle 56 cannot be connected to the FOUP 300 . As shown in FIG.9(c), since the mounting tray 23 is arrange|positioned in the regular direction, it connects to the FOUP300 of the injection nozzle 55 and the discharge nozzle 56 first.

接著，如圖8(f)所示般，控制裝置29使氣缸45動作，使載置托盤23移動至後方之門開關位置(S108)。而且，控制位置29係停止氣體供給手段51及排氣手段52之動作，驅動馬達57、58而使注入噴嘴55及排出噴嘴56下降至間隔位置(S109)。另外，因氣體之注入及排出較載置托盤23移動至門開關位置更早開始，故可以較載置托盤23之移動完成後開始氮氣之注入等更早完成氮氣之注入等，可以縮短至後述門開關動作為 止之時間。 Next, as shown in FIG.8(f), the control apparatus 29 actuates the air cylinder 45, and moves the mounting tray 23 to the rear door switch position (S108). Then, the control position 29 stops the operation of the gas supply means 51 and the exhaust means 52, and drives the motors 57 and 58 to lower the injection nozzle 55 and the discharge nozzle 56 to the spaced position (S109). In addition, since the injection and discharge of the gas starts earlier than when the placing tray 23 is moved to the door switch position, the nitrogen injection can be completed earlier than the nitrogen injection is started after the movement of the placing tray 23 is completed. The door switch action is stop time.

接著，裝載埠4進行門開關動作(S110)。即是，控制裝置29係藉由門31之卡鎖楔34開鎖FOUP300之蓋301，使蓋301吸附於門31之吸附部33而予以保持。而且，控制裝置29使門移動部35動作，使門31及蓋301移動至後方，使門31及蓋301下降。之後，EFEM3之控制裝置11使搬運機器人7動作，而從FOUP300內取出基板而收授至基板處理裝置2，從基板處理裝置2接取處理完成之基板而返回至FOUP300內。於所需之所有基板處理完成之後，控制裝置29使門移動部35動作並使門31及蓋301上升、前進，使蓋301返回至FOUP300，藉由卡鎖楔34對蓋301上鎖，解除蓋301朝吸附部33之吸附。 Next, the door opening and closing operation of the load port 4 is performed (S110). That is, the control device 29 unlocks the cover 301 of the FOUP 300 by the locking wedge 34 of the door 31 , so that the cover 301 is attracted to the suction portion 33 of the door 31 and held. And the control apparatus 29 operates the door moving part 35, moves the door 31 and the cover 301 to the rear, and lowers the door 31 and the cover 301. After that, the control device 11 of the EFEM 3 operates the transfer robot 7 to take out the substrate from the FOUP 300 and send it to the substrate processing device 2 , and receives the processed substrate from the substrate processing device 2 and returns it to the FOUP 300 . After all required substrate processing is completed, the control device 29 activates the door moving part 35 to raise and advance the door 31 and the cover 301, so that the cover 301 returns to the FOUP 300, and the cover 301 is locked by the locking wedge 34 and released. The cover 301 is adsorbed to the adsorption part 33 .

之後，控制裝置29係將基板處理結束之主旨的資訊傳送至主機200。再者，控制裝置29係依照來自主機200之指令，進行FOUP300之移動及旋轉之控制。即是，FOUP300以照原樣之正規之方向藉由OHT400被輸送之情況下，控制裝置29控制移動機構25而使載置托盤23以照樣之方向移動至收授位置。再者，FOUP300以相反方向藉由OHT400被輸送之情況下，控制裝置29藉由移動機構25暫時使載置托盤23移動至旋轉位置。而且，控制裝置29係藉由旋轉機構24使載置托盤23反轉之後，控制移動機構25，使載置托盤23移動至收授位置。最後，FOUP300藉由從主機200接受指示的OHT400被 輸送(S111)。 After that, the control device 29 transmits to the host computer 200 information indicating that the substrate processing is completed. Furthermore, the control device 29 controls the movement and rotation of the FOUP 300 according to the command from the host 200 . That is, when the FOUP 300 is conveyed by the OHT 400 in the normal direction as it is, the control device 29 controls the moving mechanism 25 to move the placement tray 23 to the receiving and delivering position in the same direction. Furthermore, when the FOUP 300 is conveyed by the OHT 400 in the opposite direction, the control device 29 temporarily moves the placement tray 23 to the rotational position by the moving mechanism 25 . Then, the control device 29 controls the movement mechanism 25 to move the placement tray 23 to the receiving and receiving position after inverting the placement tray 23 by the rotation mechanism 24 . Finally, the FOUP 300 is activated by the OHT 400 receiving the instruction from the host 200 transport (S111).

返回步驟S102，針對FOUP300以正規之方向被載置之情形予以說明。控制裝置29係在載置托盤23被配置成相反方向之情況下，藉由旋轉機構24，使載置托盤23朝正規之方向(參照圖2)旋轉。再者，控制裝置29係在載置托盤23被配置在收授位置以外之情況下，藉由移動機構25使載置托盤23移動至收授位置。即是，控制裝置29係在載置托盤23位於正規之方且收授位置之狀態下待機(S121)。FOUP300藉由OHT400係以正規之方向被載置於載置托盤23(S122)。在此情況下，控制裝置29不進行載置托盤23朝旋轉位置移動及載置托盤23之旋轉，開始進行步驟S107之氣體的注入及氣體的排出。之後，控制裝置29進行與FOUP300被載置於相反方向之情況相同的動作。 Returning to step S102, the case where the FOUP 300 is placed in the normal direction will be described. The control device 29 rotates the placement tray 23 in the normal direction (refer to FIG. 2 ) by the rotation mechanism 24 when the placement tray 23 is arranged in the opposite direction. In addition, the control device 29 moves the placing tray 23 to the receiving and receiving position by the moving mechanism 25 when the placing tray 23 is arranged outside the receiving and receiving position. That is, the control device 29 stands by in a state in which the placing tray 23 is positioned at the regular side and the receiving position ( S121 ). The FOUP 300 is placed on the placement tray 23 in a regular direction by the OHT 400 (S122). In this case, the control device 29 does not perform the movement of the placement tray 23 to the rotational position and the rotation of the placement tray 23, and starts the injection of the gas and the discharge of the gas in step S107. After that, the control device 29 performs the same operation as when the FOUP 300 is placed in the opposite direction.

如上述般，裝載埠4即使於載置托盤23在俯視下沿著軌道401接取收授位置之情況下，亦可以回避FOUP300之旋轉時，FOUP300衝突於門31或基座20。因此，在EFEM3，裝載埠4之載置托盤23之收授位置，和不具有旋轉機構24之裝載埠5之載置托盤23之收授位置沿著相同之軌道401被配置。因此，針對各個的裝載埠4、5，可以使用相同之OHT400而進行FOUP300之收授。 As described above, the loading port 4 can avoid the FOUP 300 from colliding with the door 31 or the base 20 when the FOUP 300 rotates even when the loading tray 23 receives the receiving position along the rail 401 in plan view. Therefore, in EFEM3, the receiving and receiving positions of the loading trays 23 of the loading port 4 and the receiving and receiving positions of the loading trays 23 of the loading ports 5 without the rotating mechanism 24 are arranged along the same rail 401 . Therefore, for the respective load ports 4 and 5, the same OHT400 can be used for receiving and receiving the FOUP300.

再者，在裝載埠4之載置托盤23位於旋轉位置之狀態下，載置托盤23突出至較框架22前方。即是， 框架22不需要前後方向突出至旋轉位置，框架22之前後方向之大小成為小型化。因此，可以將裝載埠4之設置面積縮小成與裝載埠5相同程度。 Furthermore, when the mounting tray 23 of the loading port 4 is located at the rotating position, the mounting tray 23 protrudes forward of the frame 22 . That is, The frame 22 does not need to protrude to the rotational position in the front-rear direction, and the size of the frame 22 in the front-rear direction is reduced in size. Therefore, the installation area of the loading port 4 can be reduced to the same level as that of the loading port 5 .

接著，針對對上述實施型態附加變更之變形例予以說明。但是，針對具有與上述實施型態相同之構成，賦予相同符號適當省略其說明。 Next, a modification example in which the above-described embodiment is added and changed will be described. However, about the same structure as the above-mentioned embodiment, the same code|symbol is attached|subjected and the description is abbreviate|omitted suitably.

(1)如圖10~圖12所示般，即使裝載埠4a具備使門部21a遠離載置托盤23之移動機構60亦可。以下，具體性地予以說明。 (1) As shown in FIGS. 10 to 12 , the loading port 4 a may be provided with a moving mechanism 60 that separates the door portion 21 a from the mounting tray 23 . Below, it demonstrates concretely.

如圖10及圖11所示般，門部21a進一步具有旋動板61、62。基座20a之開口部30a較門部21a之門31a在上下方向更寬廣，開口部30a之上側部分藉由旋動板61，下側部分藉由旋動板62分別被堵塞。旋動板61、62係以左右方為軸分別被支撐成能夠旋動。旋動板61係上側部分被支撐於基座20a，旋動板62係下側部分被支撐於基座20a。 As shown in FIGS. 10 and 11 , the door portion 21a further includes rotating plates 61 and 62 . The opening 30a of the base 20a is wider in the vertical direction than the door 31a of the door 21a, and the upper part of the opening 30a is closed by the rotating plate 61 and the lower part is closed by the rotating plate 62, respectively. The rotating plates 61 and 62 are respectively supported so as to be able to rotate about the left and right sides. The upper part of the rotating plate 61 is supported by the base 20a, and the lower part of the rotating plate 62 is supported by the base 20a.

移動機構60具有使門部21a之門臂32a在前後方向及上下方向移動之門移動部35a，和被連接於旋動板61之馬達63，被連接於旋動板62之馬達64。馬達63、64係在堵塞開口部30a之封閉位置(圖10(a))，和開啟開口部30a之開啟位置(圖10(b))之間分別使旋動板61、62旋動。如圖10(b)所示般，旋動板61、62藉由朝後方旋動而移動至開啟位置。 The moving mechanism 60 includes a door moving portion 35a that moves the door arm 32a of the door portion 21a in the front-rear direction and the vertical direction, a motor 63 connected to the swing plate 61, and a motor 64 connected to the swing plate 62. The motors 63 and 64 respectively rotate the rotary plates 61 and 62 between the closed position for closing the opening 30a (FIG. 10(a)) and the open position for opening the opening 30a (FIG. 10(b)). As shown in FIG. 10( b ), the rotary plates 61 and 62 are moved to the open position by being rotated backward.

圖12係FOUP300被載置於相反方向之情況 之裝載埠4a之動作的俯視圖。首先，至控制裝置29使載置托盤23成為相反方向，並且在收授位置待機(圖12(a))，FOUP300以相反方向被載置於載置托盤23(圖12(b))為止，與上述實施型態相同。 Figure 12 shows the case where the FOUP 300 is placed in the opposite direction A top view of the operation of the loading port 4a. First, until the control device 29 turns the placement tray 23 in the opposite direction and waits at the receiving and receiving position ( FIG. 12( a )), and the FOUP 300 is placed on the placement tray 23 in the opposite direction ( FIG. 12( b )), It is the same as the above-mentioned embodiment.

接著，控制裝置29如圖12(c)所示般，控制移動機構60使門31a後退，並且使旋動板61、62朝後方旋動。即是，在該變形例中，藉由使旋動板61、62朝後方旋動，使門部21a從載置托盤23相對性地遠離。接著，控制裝置29係如圖12(d)、(e)所示般，控制旋轉機構24，使載置托盤23旋轉。在該變形例中，載置托盤23不從收授位置移動，如圖12(d)所示般，可以FOUP300之旋轉時，FOUP300衝突至門31a或基座20a。另外，即使控制裝置29控制移動機構25a而使載置托盤23移動至旋轉位置，並且控制移動機構60而進行使門31a後退等亦可。 Next, as shown in FIG.12(c), the control apparatus 29 controls the movement mechanism 60 to make the door 31a retreat, and rotates the rotating plates 61 and 62 toward the back. That is, in this modification, by rotating the rotating plates 61 and 62 rearward, the door portion 21 a is relatively separated from the placing tray 23 . Next, as shown in FIGS. 12( d ) and (e), the control device 29 controls the rotation mechanism 24 to rotate the placement tray 23 . In this modification, the placement tray 23 does not move from the receiving and receiving position, and as shown in FIG. 12( d ), when the FOUP 300 is rotated, the FOUP 300 may collide with the door 31 a or the base 20 a. In addition, the control device 29 may control the movement mechanism 25a to move the placement tray 23 to the rotation position, and control the movement mechanism 60 to retract the door 31a, or the like.

載置托盤23之旋轉完成後，控制裝置29如圖12(f)所示般，控制移動機構60，使門31a前進，並使旋動板61、62移動至封閉位置。再者，控制裝置29控制移動機構25a而使載置托盤23移動至門開關位置。之後的裝載埠4a之動作與上述實施型態相同。 After the rotation of the mounting tray 23 is completed, as shown in FIG. 12(f), the control device 29 controls the moving mechanism 60 to advance the door 31a and move the rotary plates 61 and 62 to the closed position. Furthermore, the control device 29 controls the movement mechanism 25a to move the placement tray 23 to the door switch position. The subsequent operations of the loading port 4a are the same as those of the above-mentioned embodiment.

(2)旋轉機構24使載置托盤23旋轉之角度不限定於180°，即使為例如旋轉90°之構亦可。在圖13所示之EFEM3b中，兩台之裝載埠5沿著搬運室6b之前方之壁面而被配置，對此，裝載埠4係沿著搬運室6b之左 方的壁面而被設置。如此之情況下，藉由裝載埠4在使裝載托盤23從正規之方向旋轉90°之狀態下待機，能夠在與OHT400之間進行FOUP300之收授。而且，在FOUP300藉由OHT400被載置於載置托盤23之後，控制裝置29藉由移動機構25使載置托盤23移動至旋轉位置，藉由旋轉機構24使載置托盤23旋轉90°。 (2) The angle at which the rotation mechanism 24 rotates the placement tray 23 is not limited to 180°, and may be, for example, a structure that rotates 90°. In the EFEM 3b shown in FIG. 13, the two load ports 5 are arranged along the front wall surface of the transfer chamber 6b, and the load port 4 is along the left side of the transfer chamber 6b. set on a square wall. In this case, the FOUP 300 can be received and received between the OHT 400 and the OHT 400 by the loading port 4 standing by in a state in which the loading tray 23 is rotated 90° from the normal direction. Then, after the FOUP 300 is placed on the placement tray 23 by the OHT 400 , the control device 29 moves the placement tray 23 to the rotating position by the moving mechanism 25 , and rotates the placement tray 23 by 90° by the rotating mechanism 24 .

(3)裝載埠4之其他構成也可以是變更。例如，裝載埠4具備氮氣沖洗單元27，即使無氣體之注入及排出之動作步驟亦可。再者，即使將框架22之前後方向之大小，增大成即使載置托盤23位於旋轉位置之時，亦不會從框架22突出至前方之程度亦可。並且，載置FOUP300之載置部並不限定於載置托盤23。例如，即使如上述專利文獻2(日本專利文獻4168724號公報)所記載般在俯視呈三角形狀者亦可，若為載置FOUP300者亦可。 (3) Other configurations of the load port 4 may be changed. For example, the loading port 4 is provided with a nitrogen flushing unit 27, even if there is no operation step of gas injection and discharge. Furthermore, even if the size of the frame 22 in the front-rear direction is increased, even when the mounting tray 23 is at the rotating position, it may not protrude forward from the frame 22 . In addition, the placement portion on which the FOUP 300 is placed is not limited to the placement tray 23 . For example, as described in the above-mentioned Patent Document 2 (Japanese Patent Document 4168724 A), it may be triangular in plan view, or the FOUP 300 may be placed thereon.

旋轉機構24之構成並限定於本實施型態，若為使載置托盤23在垂直軸周圍旋轉即可。再者，移動機構25之構成並不限定於本實施型態者，若為使載置托盤23在三個位置之間於前後方向移動者即可。感測器26即使為例如超音波檢測器等亦可。 The structure of the rotation mechanism 24 is not limited to this embodiment, and it is sufficient to rotate the placement tray 23 around the vertical axis. In addition, the structure of the moving mechanism 25 is not limited to that of this embodiment, and what is necessary is just to move the placement tray 23 in the front-rear direction between three positions. The sensor 26 may be, for example, an ultrasonic detector or the like.

(4)於移動機構25使載置托盤23移動至旋轉位置之前，即使旋轉機構24使載置托盤23旋轉亦可。即是，即是在FOUP300不衝突至門31或基座20之時序，於旋轉機構24正在使載置托盤23旋轉當中，移動機 構25使載置托盤23移動至前方亦可。 (4) Before the moving mechanism 25 moves the placing tray 23 to the rotating position, the rotating mechanism 24 may rotate the placing tray 23 . That is, at the timing when the FOUP 300 does not collide with the door 31 or the base 20, while the rotating mechanism 24 is rotating the placing tray 23, the moving machine The mechanism 25 may move the placement tray 23 to the front.

(5)裝載埠4之控制裝置29不一定要組裝於裝載埠4內，即使裝載埠4之控制兼用基板處理裝置2之控制裝置10或EFEM3之控制裝置11亦可。 (5) The control device 29 of the load port 4 does not have to be assembled in the load port 4, even the control device 10 of the substrate processing device 2 or the control device 11 of the EFEM 3 may also be used for the control of the load port 4.

(6)其他之構成也可以適當變更。例如，在EFEM3中，裝載埠4、5之台數並不限定於3台。再者，即使將裝載埠5所有置換成裝載埠4亦可。被注入於FOUP300之氣體即使為氮以外之惰性氣體亦可。收容基板之容器並不限定於FOUP300，例如即使為用以在工場間輸送基板之FOSB(Front Opening Shipping Box)等亦可。具備裝載埠4、5和搬運室6之搬運系統並不限定於EFEM3，例如即使為在複數容器間進行基板之取出放入的分類器等亦可。搬運基板之搬運手段並不限定於搬運機器人7。輸送容器之輸送手段並不限定於OHT400，若為沿著事先被設置之軌道而輸送容器即可。上述軌道和搬運室6之前方之隔壁8的前後方向之距離L並不限定於243mm前後。 (6) Other structures can also be appropriately changed. For example, in EFEM3, the number of load ports 4 and 5 is not limited to three. Furthermore, even if all the load ports 5 are replaced with the load ports 4 . The gas injected into the FOUP300 may be an inert gas other than nitrogen. The container which accommodates a board|substrate is not limited to FOUP300, For example, it may be FOSB (Front Opening Shipping Box) etc. which are used for conveying a board|substrate between factories. The conveyance system including the load ports 4 and 5 and the conveyance chamber 6 is not limited to the EFEM 3, and may be, for example, a sorter for taking out and inserting substrates between a plurality of containers, or the like. The conveyance means for conveying the substrate is not limited to the conveyance robot 7 . The conveying means for conveying the container is not limited to the OHT400, and the container may be conveyed along a rail set in advance. The distance L in the front-rear direction between the rail and the partition wall 8 in front of the transfer chamber 6 is not limited to the front and rear of 243 mm.

4‧‧‧裝載埠 4‧‧‧Load port

20‧‧‧基座 20‧‧‧Pedestal

22‧‧‧框架 22‧‧‧Framework

23‧‧‧載置托盤 23‧‧‧Place tray

24‧‧‧旋轉機構 24‧‧‧Rotating mechanism

25‧‧‧移動機構 25‧‧‧Mobile Mechanism

31‧‧‧門 31‧‧‧door

47‧‧‧可動部 47‧‧‧Moveable part

300‧‧‧FOUP 300‧‧‧FOUP

301‧‧‧蓋 301‧‧‧Cap

Claims (6)

一種裝載埠，具備收容基板之容器被載置的載置部，上述載置部在與沿著事先被設置之軌道行走，且輸送上述容器之輸送手段之間進行收授，該裝載埠之特徵在於具備：基座，其係被豎立設置，具有開口部；門部，其係被設置在上述基座，開關上述開口部；框架，其係在與上述基座正交之前後方向中，從上述基座朝前方突出設置，支撐上述載置部；旋轉機構，其係使上述載置部在垂直軸周圍旋轉；移動機構，其係上述容器藉由上述輸送手段被載置在上述載置部之後，上述旋轉機構使上述載置部旋轉之前或正在旋轉當中，使上述容器從上述門部遠離；及控制部，上述控制部係使上述載置部從上述輸送手段接取上述容器的收授位置，朝較上述收授位置更前方，且使上述門部和上述容器間隔開，並使旋轉的間隔位置移動之後，朝較上述收授位置更後方，且被設置在上述容器之側面之蓋連同上述門部被開關的門開關位置移動。 A loading port includes a loading portion on which a container for accommodating a substrate is placed, and the loading portion communicates with a conveying means that travels along a rail set in advance and conveys the container, and features of the loading port It is provided with: a base that is erected and has an opening; a door that is installed on the base to open and close the opening; The base is provided to protrude forward and supports the placement portion; a rotation mechanism for rotating the placement portion around a vertical axis; and a moving mechanism for the container to be placed on the placement portion by the conveying means After that, the rotating mechanism moves the container away from the door before or during the rotation of the placing portion; and a control portion that causes the placing portion to receive the container from the conveying means. The position is further forward than the above-mentioned receiving position, and the door and the above-mentioned container are spaced apart, and after moving the rotating spaced position, the cover is provided on the side surface of the above-mentioned container to the rear of the above-mentioned receiving and receiving position. The door switch position that is opened and closed together with the above door portion moves. 如請求項1之裝載埠，其中上述移動機構係藉由使上述載置部突出於較上述框架更於上述前方，使上述載置部移動至上述間隔位置。 The loading port of claim 1, wherein the moving mechanism moves the placing portion to the spaced position by causing the placing portion to protrude further forward than the frame. 一種裝載埠，具備收容基板之容器被載置的載置部，上述載置部在與沿著事先被設置之軌道行走，且輸送上述容器之輸送手段之間進行收授，該裝載埠之特徵在於具備：基座，其係被豎立設置，具有開口部；門部，其係被設置在上述基座，開關上述開口部；框架，其係在與上述基座正交之前後方向中，從上述基座朝前方突出設置，支撐上述載置部；旋轉機構，其係使上述載置部在垂直軸周圍旋轉；及移動機構，其係上述容器藉由上述輸送手段被載置在上述載置部之後，上述旋轉機構使上述載置部旋轉之前或正在旋轉當中，使上述容器從上述門部遠離，上述移動機構係在下述位置進行移動：從上述輸送手段接取上述容器的收授位置；藉由使上述載置部較上述框架更前方，而使上述載置部較上述收授位置更前方，且使上述門部和上述容器間隔開，並使旋轉的間隔位置；和較上述收授位置更後方，且被設置在上述容器之側面之蓋連同上述門部被開關的門開關位置，該裝載埠進一步具備：檢測手段，檢測位於上述框架之上述前方的障礙物；和控制手段，上述檢測手段檢測到上述障礙物之情況 下，限制上述載置部朝上述間隔位置移動。 A loading port includes a loading portion on which a container for accommodating a substrate is placed, and the loading portion communicates with a conveying means that travels along a rail set in advance and conveys the container, and features of the loading port It is provided with: a base that is erected and has an opening; a door that is installed on the base to open and close the opening; The base is provided protruding forward and supports the placing portion; a rotation mechanism for rotating the placing portion around a vertical axis; and a moving mechanism for placing the container on the placing portion by the conveying means before or during the rotation of the mounting part, the rotating mechanism moves the container away from the door part, and the moving mechanism moves at the following position: the receiving position where the container is received from the conveying means; By making the placing part more forward than the frame, making the placing part more forward than the receiving position, and making the door part and the container spaced apart and rotating the spaced position; The position is further rearward, and the cover provided on the side surface of the container together with the door opening and closing position of the door portion is opened and closed, the loading port is further provided with: detection means for detecting obstacles located in the front of the frame; and control means for the above The detection means detects the above obstacles Next, the movement of the above-mentioned placing portion to the above-mentioned spaced position is restricted. 如請求項3之裝載埠，其中上述移動機構具有從下方支撐上述旋轉機構，並且能夠在上述前後方向移動之可動部，上述載置部藉由上述旋轉機構從下方支撐，在與被形成在載置於上述載置部之上述容器之下面的噴嘴插入口連接的噴嘴連接位置，和從上述噴嘴插入口朝下方間隔開之噴嘴間隔位置之間，能夠升降之氣體的注入或排出用之噴嘴，被支撐於上述可動部。 The loading port of claim 3, wherein the moving mechanism has a movable portion that supports the rotating mechanism from below and is movable in the front-rear direction, and the placing portion is supported from below by the rotating mechanism, and is formed on the loading port. A nozzle for injecting or discharging gas that can be raised and lowered between a nozzle connection position where the nozzle insertion port is connected to the lower surface of the container of the mounting portion, and a nozzle spacing position spaced downward from the nozzle insertion port, is supported by the movable portion. 如請求項4之裝載埠，其中上述移動機構使上述載置部朝門開關位置移動之前，或正在移動當中，上述噴嘴移動至上述連接位置，開始經上述噴嘴朝上述容器注入或排出氣體。 The loading port of claim 4, wherein before the moving mechanism moves the loading portion toward the door opening and closing position, or during the movement, the nozzle moves to the connection position, and starts to inject or discharge gas into the container through the nozzle. 一種基板搬運系統，其特徵為具備：第1裝載埠，其係如請求項1~5中之任一項所記載之裝載埠；第2裝載埠，其具備上述載置部，並且不具備上述旋轉機構；及搬運室，其具有將上述基板取出放入至上述容器之搬運手段，上述第1裝載埠之上述載置部之上述收授位置，和上 述第2裝載埠之上述載置部之上述收授位置沿著上述輸送手段之上述軌道被配置。 A substrate conveying system, comprising: a first load port which is the load port described in any one of claims 1 to 5; a rotation mechanism; and a transport chamber having transport means for taking out and placing the substrate into the container, the receiving and receiving position of the mounting portion of the first loading port, and an upper The said receiving and receiving position of the said mounting part of the said 2nd loading port is arrange|positioned along the said rail of the said conveyance means.
TW106120607A 2016-07-08 2017-06-20 Load port and substrate handling system with load port TWI765896B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-136175 2016-07-08
JP2016136175A JP6882656B2 (en) 2016-07-08 2016-07-08 Board transfer system with load port and load port

Publications (2)

Publication Number Publication Date
TW201804556A TW201804556A (en) 2018-02-01
TWI765896B true TWI765896B (en) 2022-06-01

Family

ID=60946489

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106120607A TWI765896B (en) 2016-07-08 2017-06-20 Load port and substrate handling system with load port

Country Status (4)

Country Link
JP (2) JP6882656B2 (en)
KR (2) KR102414029B1 (en)
CN (2) CN107591352B (en)
TW (1) TWI765896B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10403514B1 (en) * 2018-04-12 2019-09-03 Asm Ip Holding B.V. Substrate transporting system, storage medium and substrate transporting method
JP7256358B2 (en) * 2018-05-24 2023-04-12 シンフォニアテクノロジー株式会社 Substrate storage container management system, substrate storage container management method
JP7085467B2 (en) * 2018-12-11 2022-06-16 平田機工株式会社 Load lock chamber
JP6856692B2 (en) * 2019-03-28 2021-04-07 平田機工株式会社 Load port
CN110406910B (en) * 2019-07-10 2021-02-02 深圳市华星光电半导体显示技术有限公司 High-altitude annular trolley system
JP7422577B2 (en) 2020-03-23 2024-01-26 平田機工株式会社 Load port and control method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200941632A (en) * 2006-10-02 2009-10-01 Shinko Electric Co Ltd Clamping mechanism
CN101651112A (en) * 2008-08-13 2010-02-17 东京毅力科创株式会社 Foup opening/closing device and probe apparatus
JP2013219159A (en) * 2012-04-07 2013-10-24 Hirata Corp Carry-in/out apparatus and carry-in/out method of container for housing substrate
WO2016098930A1 (en) * 2014-12-19 2016-06-23 주식회사 썬닉스 Multidirectional wafer transfer system

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4816637B1 (en) 1969-02-28 1973-05-23
US5443348A (en) * 1993-07-16 1995-08-22 Semiconductor Systems, Inc. Cassette input/output unit for semiconductor processing system
US5944475A (en) * 1996-10-11 1999-08-31 Asyst Technologies, Inc. Rotated, orthogonal load compatible front-opening interface
JPH11129175A (en) * 1997-10-30 1999-05-18 Sankyo Seiki Mfg Co Ltd Articulated robot
JP4168724B2 (en) 2002-10-15 2008-10-22 神鋼電機株式会社 Load port
US7578650B2 (en) * 2004-07-29 2009-08-25 Kla-Tencor Technologies Corporation Quick swap load port
US20060045663A1 (en) * 2004-08-05 2006-03-02 Ravinder Aggarwal Load port with manual FOUP door opening mechanism
JP4816637B2 (en) * 2005-03-08 2011-11-16 株式会社安川電機 Load port and load port control method
US8821099B2 (en) * 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
JP4904995B2 (en) * 2006-08-28 2012-03-28 シンフォニアテクノロジー株式会社 Load port device
US7585142B2 (en) * 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
JP6014982B2 (en) * 2011-09-28 2016-10-26 シンフォニアテクノロジー株式会社 Side load port, EFEM
SG11201503376TA (en) * 2012-11-02 2015-06-29 Murata Machinery Ltd Communication device, communication equipment and communication system
JP6260109B2 (en) * 2013-05-16 2018-01-17 シンフォニアテクノロジー株式会社 Load port device
JP5776828B1 (en) * 2014-08-08 2015-09-09 Tdk株式会社 Installation table for gas purge unit, load port device and purge target container
JP2015035612A (en) * 2014-09-24 2015-02-19 シンフォニアテクノロジー株式会社 Nozzle driving unit and gas injection device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200941632A (en) * 2006-10-02 2009-10-01 Shinko Electric Co Ltd Clamping mechanism
CN101651112A (en) * 2008-08-13 2010-02-17 东京毅力科创株式会社 Foup opening/closing device and probe apparatus
JP2013219159A (en) * 2012-04-07 2013-10-24 Hirata Corp Carry-in/out apparatus and carry-in/out method of container for housing substrate
WO2016098930A1 (en) * 2014-12-19 2016-06-23 주식회사 썬닉스 Multidirectional wafer transfer system

Also Published As

Publication number Publication date
TW201804556A (en) 2018-02-01
KR102481186B1 (en) 2022-12-26
CN107591352A (en) 2018-01-16
JP2018006705A (en) 2018-01-11
JP6882656B2 (en) 2021-06-02
JP2021119617A (en) 2021-08-12
CN107591352B (en) 2023-08-15
JP7148825B2 (en) 2022-10-06
TW202234565A (en) 2022-09-01
CN116978843A (en) 2023-10-31
KR20220097367A (en) 2022-07-07
KR102414029B1 (en) 2022-06-29
KR20180006312A (en) 2018-01-17

Similar Documents

Publication Publication Date Title
TWI765896B (en) Load port and substrate handling system with load port
US11270900B2 (en) Apparatus and method for handling wafer carrier doors
US7445415B2 (en) Direct tool loading
US9815624B2 (en) Inter-floor transport facility
US7661919B2 (en) Discontinuous conveyor system
JP5506979B2 (en) Buffered loader for lot size reduction
KR101463473B1 (en) Transfer device
JP6332133B2 (en) Container transfer equipment
JP6566051B2 (en) Storage device and transport system
US7796049B2 (en) Overhead traveling vehicle having ID reader
JP2016216137A5 (en)
JP2019214437A (en) Article mounting member, stocker provided with the same, and conveying vehicle system
JP7322924B2 (en) Goods storage facility
JP4314780B2 (en) Automated guided vehicle system
JP2013165177A (en) Stocker device
KR200380341Y1 (en) A Load Port Having Function For Carring Out POD
KR100557302B1 (en) A load port having function for carring out pod
JP7327640B2 (en) GRIPPER DEVICE, CARRIER, AND CONVEYING METHOD
JP2003124282A (en) Substrate carrying in and out equipment