TWI765314B - Transfer roller, manufacturing method of transfer roller, optical film, and manufacturing method of optical film - Google Patents

Transfer roller, manufacturing method of transfer roller, optical film, and manufacturing method of optical film Download PDF

Info

Publication number
TWI765314B
TWI765314B TW109127015A TW109127015A TWI765314B TW I765314 B TWI765314 B TW I765314B TW 109127015 A TW109127015 A TW 109127015A TW 109127015 A TW109127015 A TW 109127015A TW I765314 B TWI765314 B TW I765314B
Authority
TW
Taiwan
Prior art keywords
photoresist layer
manufacturing
transfer roller
roller
etching
Prior art date
Application number
TW109127015A
Other languages
Chinese (zh)
Other versions
TW202206947A (en
Inventor
林劉恭
Original Assignee
光群雷射科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 光群雷射科技股份有限公司 filed Critical 光群雷射科技股份有限公司
Priority to TW109127015A priority Critical patent/TWI765314B/en
Publication of TW202206947A publication Critical patent/TW202206947A/en
Application granted granted Critical
Publication of TWI765314B publication Critical patent/TWI765314B/en

Links

Images

Abstract

A transfer roller, a manufacturing method of a transfer roller, an optical film, and a manufacturing method of an optical film are provided. The manufacturing method of the transfer roller includes: coating a photoresist layer on an outer surface of a roller; forming a plurality of exposure patterns on an outer surface of the photoresist layer, in which the depth of anyone of the exposure patterns less than the thickness of the photoresist layer; developing the photoresist layer to remove the exposure patterns so as to form a plurality of depressed portions and a plurality of protruding portions; anisotropic etching the photoresist layer to complete removed the depressed portions, so that the protruding portions are formed as a graphic photoresist layer; anisotropic etching the outer surface of the roller by using the graphic photoresist layer as a mask so as to formed a plurality of transfer patterns on the outer surface of the roller; and removing the graphic photoresist layer.

Description

轉印滾輪與其製造方法、及光學膜片與其製造方法Transfer roller and its manufacturing method, and optical film and its manufacturing method

本發明涉及一種滾輪及光學膜片,特別是涉及一種轉印滾輪與其製造方法、及光學膜片與其製造方法。The present invention relates to a roller and an optical film, in particular to a transfer roller and a manufacturing method thereof, and an optical film and a manufacturing method thereof.

現有的一種光學膜片的製造方法為透過轉印滾輪壓印的方法在光學膜片上轉印光學微結構,進而形成一光學膜片。然而,現有的轉印滾輪需要經由特殊的製程在金屬滾筒表面形成轉印用微結構(例如:使用電鑄方法製作轉印母模,再以轉印母模形成表面具有微結構的金屬滾筒),上述的特殊製程經常需要耗費大量的經費與時間,而使得以轉印式方法製造光學膜片的製造時間及製造成本大幅提升。An existing manufacturing method of an optical film is to transfer an optical microstructure on the optical film by means of a transfer roller imprinting method, thereby forming an optical film. However, the existing transfer roller needs to form a microstructure for transfer on the surface of the metal roller through a special process (for example: use the electroforming method to make a transfer master, and then use the transfer master to form a metal roller with a microstructure on the surface) , the above-mentioned special process often requires a lot of money and time, which greatly increases the manufacturing time and manufacturing cost of manufacturing the optical film by the transfer method.

故,如何通過轉印滾輪製造方法的設計與改良,以克服上述的缺陷,已成為該項事業所欲解決的重要課題之一。Therefore, how to overcome the above-mentioned defects through the design and improvement of the transfer roller manufacturing method has become one of the important issues to be solved by this business.

本發明實施例針對現有技術的不足提供一種轉印滾輪與其製造方法、及光學膜片與其製造方法,其能有效地改善現有轉印滾輪製造方法所可能產生的缺陷。Aiming at the deficiencies of the prior art, the embodiments of the present invention provide a transfer roller and a method for manufacturing the same, and an optical film and a method for manufacturing the same, which can effectively improve the defects that may occur in the prior art method for manufacturing the transfer roller.

本發明實施例公開一種轉印滾輪製造方法,其中包括: 一塗佈步驟:於一金屬滾筒的外表面塗佈圍繞360度的一光阻層,所述光阻層具有一厚度;一曝光步驟:將一圖案化光源照射於所述光阻層的外表面,而使得所述光阻層的所述外表面的一側形成多個曝光圖案,所述光阻層的曝光深度小於所述光阻層的厚度,而使得任一個所述曝光圖案的深度小於所述光阻層的厚度;一顯影步驟:移除所述光阻層上多個所述曝光圖案的材料,而使得所述光阻層形成對應於多個所述曝光圖案的多個凹陷部分及位於多個所述凹陷部分範圍外的多個凸起部分;一光阻蝕刻步驟:透過非等向性蝕刻手段對所述光阻層進行蝕刻,所述光阻蝕刻步驟的蝕刻深度大於任一個所述凹陷部分的厚度且小於任一個所述凸起部分的厚度,而使得多個所述凹陷部分的所述光阻層被完全移除而形成多個鏤空部分,而多個所述凸起部分的所述光阻層未被完全移除而形成多個遮蔽於所述金屬滾筒的所述外表面的多個遮蔽部分,而形成一圖案化光阻層;一滾筒蝕刻步驟:透過非等向蝕刻手段以所述圖案化光阻層為遮罩蝕刻所述金屬滾筒的所述外表面,而於所述金屬滾筒的所述外表面形成多個壓印圖形;以及一圖案化光阻移除步驟:將所述圖案化光阻層從所述金屬滾筒表面移除,進而形成一轉印滾輪。An embodiment of the present invention discloses a method for manufacturing a transfer roller, which includes: a coating step: coating a photoresist layer with a thickness of 360 degrees on the outer surface of a metal roller; the photoresist layer has a thickness; an exposure step : A patterned light source is irradiated on the outer surface of the photoresist layer, so that a plurality of exposure patterns are formed on one side of the outer surface of the photoresist layer, and the exposure depth of the photoresist layer is smaller than that of the photoresist layer. the thickness of the resist layer, so that the depth of any one of the exposure patterns is smaller than the thickness of the photoresist layer; a developing step: removing the materials of the multiple exposure patterns on the photoresist layer, so that the light The resist layer forms a plurality of concave portions corresponding to a plurality of the exposure patterns and a plurality of convex portions located outside the range of the plurality of the concave portions; a photoresist etching step: the photoresist is etched through an anisotropic etching means. The resist layer is etched, and the etching depth of the photoresist etching step is greater than the thickness of any one of the recessed portions and less than the thickness of any one of the protruding portions, so that the photoresist layers of a plurality of the recessed portions are is completely removed to form a plurality of hollow parts, and the photoresist layer of the plurality of protruding parts is not completely removed to form a plurality of shielding parts shielded on the outer surface of the metal drum, forming a patterned photoresist layer; a roller etching step: using the patterned photoresist layer as a mask to etch the outer surface of the metal roller by anisotropic etching, A plurality of imprinted patterns are formed on the outer surface; and a patterned photoresist removal step: removing the patterned photoresist layer from the surface of the metal roller, thereby forming a transfer roller.

本發明實施例公開一種轉印滾輪,其是以上述轉印滾輪製造方法所製成。The embodiment of the present invention discloses a transfer roller, which is manufactured by the above-mentioned method for manufacturing the transfer roller.

本發明實施例還公開一種光學膜片製造方法,其包括:一滾輪製造步驟:為以上述轉印滾輪製造方法製造一轉印滾輪;及一光學膜片轉印步驟:以所述轉印滾輪不間斷地滾壓於一透光膜上,以使所述透光膜形成有形狀互補於多個所述壓印圖形的多個光學微結構、進而使所述透光膜構成一光學膜片。The embodiment of the present invention also discloses a method for manufacturing an optical film, which includes: a roller manufacturing step: manufacturing a transfer roller by the above-mentioned transfer roller manufacturing method; and an optical film transfer step: using the transfer roller Uninterrupted rolling on a light-transmitting film, so that the light-transmitting film is formed with a plurality of optical microstructures whose shapes are complementary to a plurality of the embossed patterns, so that the light-transmitting film constitutes an optical film .

本發明實施例還公開一種光學膜片,其是以上述光學膜片製造方法所製成。The embodiment of the present invention also discloses an optical film, which is manufactured by the above-mentioned optical film manufacturing method.

本發明的其中一有益效果在於,本發明所提供的轉印滾輪與其製造方法、及光學膜片與其製造方法,其能夠通過“透過所述曝光步驟及所述顯影步驟在所述光阻層上形成多個所述凹陷部分和多個所述凸起部分,再透過所述光阻蝕刻步驟形成所述圖案化光阻層後,再透過非等向蝕刻手段以所述圖案化光阻層為遮罩蝕刻所述金屬滾筒外表面以形成多個所述壓印圖形”的技術方案,進而能夠透過蝕刻手段於所述轉印滾輪外表面形成轉印用的多個所述壓印圖形,以大幅降低所述轉印滾輪的製造時間及製造成本。One of the beneficial effects of the present invention is that the transfer roller and its manufacturing method, and the optical film and its manufacturing method provided by the present invention can pass through the exposure step and the developing step on the photoresist layer. After forming a plurality of the recessed parts and a plurality of the protruding parts, and then forming the patterned photoresist layer through the photoresist etching step, the patterned photoresist layer is then formed by an anisotropic etching method. The technical solution of mask etching the outer surface of the metal roller to form a plurality of the imprinting patterns, and then a plurality of the imprinting patterns for transfer can be formed on the outer surface of the transfer roller by etching means, so as to The manufacturing time and manufacturing cost of the transfer roller are greatly reduced.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。For a further understanding of the features and technical content of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

以下是通過特定的具體實施例來說明本發明所公開有關“轉印滾輪與其製造方法、及光學膜片與其製造方法”的實施方法,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方法將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is a description of the implementation method of the "transfer roller and its manufacturing method, and an optical film and its manufacturing method" disclosed in the present invention through specific specific embodiments. Those skilled in the art can understand the present invention from the content disclosed in this specification. Advantages and Effects. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following implementation method will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

請參閱圖1至圖12所示,其為本發明的實施例,需先說明的是,本實施例所對應到的附圖及其所提及的相關數量與外形,僅用來具體地說明本發明的實施方法,以便於了解本發明的內容,而非用來侷限本發明的保護範圍。Please refer to FIG. 1 to FIG. 12 , which are embodiments of the present invention. It should be noted that the drawings corresponding to this embodiment and the related numbers and shapes mentioned in this embodiment are only used for specific description. The implementation method of the present invention is used to facilitate understanding of the content of the present invention, rather than to limit the protection scope of the present invention.

本發明實施例公開一種轉印滾輪100及其製造方法,以及透過所述轉印滾輪100所轉印製成的光學膜片600及其製造方法。為便於理解所述轉印滾輪100的構造,以下將先介紹所述轉印滾輪100的製造方法(也就是,滾輪製造步驟S1),而後再說明所述轉印滾輪100的構造,以及透過所述轉印滾輪100所製造的所述光學膜片600的製造方法以及所述光學膜片600的構造。The embodiment of the present invention discloses a transfer roller 100 and a manufacturing method thereof, as well as an optical film 600 transferred by the transfer roller 100 and a manufacturing method thereof. In order to facilitate the understanding of the structure of the transfer roller 100, the following will first introduce the manufacturing method of the transfer roller 100 (that is, the roller manufacturing step S1), and then describe the structure of the transfer roller 100, The manufacturing method of the optical film 600 manufactured by the transfer roller 100 and the structure of the optical film 600 are described.

其中,如圖1所示,所述滾輪製造步驟S1於本實施例中包含下列幾個步驟:一塗佈步驟S11、一曝光步驟S12、一顯影步驟S13、一光阻蝕刻步驟S14、一滾筒蝕刻步驟S15、及一圖案化光阻移除步驟S16,但本發明並不限於此。舉例來說,於本發明未繪示的其他實施例中,所述滾輪製造步驟S1可進一步包含銜接於所述塗佈步驟S11的一軟烤步驟(Soft Bake),以及銜接於所述顯影步驟S13或所述光阻蝕刻步驟S14的一硬烤步驟(Hard Bake)。As shown in FIG. 1 , the roller manufacturing step S1 includes the following steps in this embodiment: a coating step S11 , an exposure step S12 , a developing step S13 , a photoresist etching step S14 , a roller The etching step S15, and a patterned photoresist removal step S16, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the roller manufacturing step S1 may further include a soft bake step connected to the coating step S11 , and a soft bake step connected to the developing step S13 or a hard bake step of the photoresist etching step S14.

如圖1及圖2所示,所述塗佈步驟S11:提供一金屬滾筒1,並透過一塗佈設備200在所述金屬滾筒1的一外表面12塗佈圍繞360度的一光阻層300。As shown in FIG. 1 and FIG. 2 , the coating step S11 : providing a metal drum 1 , and coating a photoresist layer around 360 degrees on an outer surface 12 of the metal drum 1 through a coating device 200 300.

於本實施例中,所述金屬滾筒1能夠定義有一中心軸線11,所述金屬滾筒1的所述外表面12呈圓柱形,並且所述金屬滾筒1至少於所述外表面12的部分是由鎳金屬、鉻金屬、銅金屬等類型的金屬材料或合金材料所製成。In this embodiment, the metal drum 1 can define a central axis 11, the outer surface 12 of the metal drum 1 is cylindrical, and at least the part of the metal drum 1 below the outer surface 12 is formed by Made of nickel metal, chromium metal, copper metal and other types of metal materials or alloy materials.

本實施例中使用的所述塗佈設備200,其包括一塗佈機構2、相對設置於所述塗佈機構2下方的一旋轉模組3、一直線驅動模組4、以及相對設置於所述旋轉模組3下方的一承載台5。其中,所述金屬滾筒1設置於所述旋轉模組3上,透過所述旋轉模組3帶動所述金屬滾筒1繞著其中心軸線11旋轉,所述塗佈機構2設置於所述直線驅動模組4上,透過所述直線驅動模組4能夠帶動所述塗佈機構2沿著所述中心軸線11的方向往復位移。當所述金屬滾筒1受到所述旋轉模組3驅動旋轉時,所述塗佈機構2同時受到所述直線驅動模組4驅動而沿著所述中心軸線11方向直線位移,而將光阻材料塗佈於所述金屬滾筒1的所述外表面12,進而構成所述光阻層300。The coating apparatus 200 used in this embodiment includes a coating mechanism 2, a rotary module 3 disposed below the coating mechanism 2, a linear drive module 4, and a A bearing platform 5 below the rotating module 3 . Wherein, the metal drum 1 is arranged on the rotating module 3, and the metal drum 1 is driven to rotate around its central axis 11 through the rotating module 3, and the coating mechanism 2 is arranged on the linear drive On the module 4 , the coating mechanism 2 can be driven to move back and forth along the direction of the central axis 11 through the linear drive module 4 . When the metal drum 1 is driven to rotate by the rotating module 3, the coating mechanism 2 is simultaneously driven by the linear driving module 4 to linearly displace along the direction of the central axis 11, and the photoresist material It is coated on the outer surface 12 of the metal drum 1 to form the photoresist layer 300 .

如圖2所示,於本實施例中,所述塗佈機構2是一噴塗塗佈機構,但本發明並不以此為限。舉例來說,所述塗佈機構2也可以是線棒式塗佈機構、雙面成形塗佈機構、以及封閉式刮刀塗佈機構等多種應用不同塗佈技術的塗佈機構。As shown in FIG. 2 , in this embodiment, the coating mechanism 2 is a spray coating mechanism, but the present invention is not limited to this. For example, the coating mechanism 2 may also be a wire-bar coating mechanism, a double-sided forming coating mechanism, and a closed blade coating mechanism and other coating mechanisms that apply different coating technologies.

如圖3所示,光阻材料塗佈於所述金屬滾筒1表面後,形成360度圍繞所述金屬滾筒1的所述外表面12的所述光阻層300,且所述光阻層300的厚度T介於3微米(μm)至25微米的範圍之間。特別說明,本發明的所述塗佈步驟S11是以保持光阻層300厚度的均勻性方式來實施,所以所述光阻層300無須被限制在較薄的厚度。As shown in FIG. 3 , after the photoresist material is coated on the surface of the metal roller 1 , the photoresist layer 300 surrounding the outer surface 12 of the metal roller 1 is formed 360 degrees, and the photoresist layer 300 The thickness T is in the range of 3 micrometers (µm) to 25 micrometers. In particular, the coating step S11 of the present invention is performed in a manner to maintain the uniformity of the thickness of the photoresist layer 300 , so the photoresist layer 300 does not need to be limited to a thinner thickness.

如圖4所示,所述曝光步驟S12:提供一圖案化光源302照射一圖案化光線303於所述光阻層300的一外表面。本實施例中,所述光阻層300選用正光阻層,並且所述光阻層300的外表面受到所述圖案化光線303照射而曝光的部位形成多個曝光圖案301,而任一所述曝光圖案301的深度h介於所述光阻層300的厚度T的1/3至2/3之間。特別說明,本發明所述曝光步驟S12中,由於所述光阻層300為了保有較佳的均勻度而具備較大的厚度,所以所述光阻層300的曝光深度會小於所述光阻層300的厚度T,因而使得任一個所述曝光圖案301的深度h會小於所述光阻層300的厚度T。換句話說,多個所述曝光圖案301並未完全穿透所述光阻層300,而使得任一個所述曝光圖案301朝向所述金屬滾筒1的一側的方向都會保留有未被曝光的所述光阻層300。As shown in FIG. 4 , in the exposing step S12 , a patterned light source 302 is provided to illuminate a patterned light 303 on an outer surface of the photoresist layer 300 . In this embodiment, a positive photoresist layer is selected for the photoresist layer 300 , and a plurality of exposure patterns 301 are formed on the exposed parts of the outer surface of the photoresist layer 300 irradiated by the patterned light 303 . The depth h of the exposure pattern 301 is between 1/3 to 2/3 of the thickness T of the photoresist layer 300 . In particular, in the exposure step S12 of the present invention, since the photoresist layer 300 has a larger thickness in order to maintain better uniformity, the exposure depth of the photoresist layer 300 is smaller than that of the photoresist layer Therefore, the depth h of any one of the exposure patterns 301 is smaller than the thickness T of the photoresist layer 300 . In other words, a plurality of the exposure patterns 301 do not completely penetrate the photoresist layer 300 , so that any one of the exposure patterns 301 will remain unexposed in the direction toward the side of the metal drum 1 . the photoresist layer 300 .

本實施例中,所述圖案化光源302能夠為一光源裝置(例如:LED或雷射二極體)產生的光線穿透過光罩而形成,但本發明並不以此為限。舉例來說,所述圖案化光源302也能夠是雷射光源或紫外光LED通過微菱鏡聚焦所形成的圖案化光源。In this embodiment, the patterned light source 302 can be formed by passing light generated by a light source device (eg, an LED or a laser diode) through a photomask, but the invention is not limited thereto. For example, the patterned light source 302 can also be a laser light source or a patterned light source formed by focusing an ultraviolet LED through a micro-rhomb mirror.

如圖5所示,所述顯影步驟S13:去除所述光阻層300上多個所述曝光圖案301的材料,而使得所述光阻層300上形成對應於多個所述曝光圖案301的多個凹陷部分304,以及位於多個所述凹陷部分304範圍外的多個凸起部分305。更詳細地說,於本實施例中,所述顯影步驟S13可以使用對應於所述光阻層300材料的顯影劑進行,當進行所述顯影步驟S13時,所述光阻層300上多個所述曝光圖案301的材料能夠被所述顯影劑溶解移除,因而形成多個所述凹陷部分304,而在多個所述曝光圖案301範圍以外的所述光阻層300材料則不會被所述顯影劑溶解,因而形成多個所述凸起部分305。As shown in FIG. 5 , in the developing step S13 , the material of the plurality of exposure patterns 301 on the photoresist layer 300 is removed, so that the photoresist layer 300 is formed on the photoresist layer 300 corresponding to the plurality of exposure patterns 301 . A plurality of recessed portions 304 , and a plurality of raised portions 305 located outside of the plurality of recessed portions 304 . In more detail, in this embodiment, the developing step S13 may be performed using a developer corresponding to the material of the photoresist layer 300 . When the developing step S13 is performed, multiple The material of the exposure pattern 301 can be dissolved and removed by the developer, thereby forming a plurality of the recessed portions 304, while the material of the photoresist layer 300 outside the range of the plurality of the exposure patterns 301 will not be removed by the developer. The developer dissolves, thereby forming a plurality of the raised portions 305 .

如圖6所示,所述光阻蝕刻步驟S14:是透過非等向性蝕刻手段(如:電漿蝕刻)對所述光阻層300進行蝕刻,而使得所述光阻層300被蝕刻後形成一圖案化光阻層400。更詳細地說,在所述光阻蝕刻步驟S14中,光阻層300蝕刻深度是大於任一個所述凹陷部分304的厚度,並且小於任一個所述凸起部分305的厚度,因此使得多個所述凹陷部分304的所述光阻層300被完全移除,而多個凸起部分305的所述光阻層300未被完全移除而殘留於所述金屬滾筒1的所述外表面12,而形成所述圖案化光阻層400。所述圖案化光阻層400中對應於多個所述凹陷部分304的位置會形成多個鏤空部分401,而使得所述金屬滾筒1的所述外表面12從多個所述鏤空部分401暴露出來,而所述圖案化光阻層400對應於多個所述凸起部分305的位置會形成覆蓋於所述金屬滾筒1的所述外表面12的多個遮蔽部分402。As shown in FIG. 6 , the photoresist etching step S14 is to etch the photoresist layer 300 through anisotropic etching means (eg, plasma etching), so that the photoresist layer 300 is etched A patterned photoresist layer 400 is formed. In more detail, in the photoresist etching step S14, the etching depth of the photoresist layer 300 is greater than the thickness of any one of the concave portions 304 and less than the thickness of any one of the protruding portions 305, so that multiple The photoresist layer 300 of the recessed portion 304 is completely removed, while the photoresist layer 300 of the plurality of convex portions 305 is not completely removed and remains on the outer surface 12 of the metal roller 1 , and the patterned photoresist layer 400 is formed. A plurality of hollow portions 401 are formed in the patterned photoresist layer 400 at positions corresponding to the plurality of the concave portions 304 , so that the outer surface 12 of the metal drum 1 is exposed from the plurality of the hollow portions 401 Then, the positions of the patterned photoresist layer 400 corresponding to the protruding portions 305 will form a plurality of shielding portions 402 covering the outer surface 12 of the metal drum 1 .

本實施例中,所述光阻蝕刻步驟S14是使用電漿蝕刻手段蝕刻所述光阻層300,但本發明不限於此。舉例來說,其他非等向蝕刻手段均能夠被應用於實施所述光阻蝕刻步驟S14。In this embodiment, the photoresist etching step S14 is to use a plasma etching method to etch the photoresist layer 300 , but the present invention is not limited thereto. For example, other anisotropic etching methods can be applied to implement the photoresist etching step S14.

由於非等向性蝕刻手段具有蝕刻方向可控制的特點,使得所述光阻層300能夠以大致上沿著和所述金屬滾筒1的所述外表面12的法線方向被蝕刻,因此能夠確保所述光阻蝕刻步驟S14所形成的所述圖案化光阻層400的多個所述鏤空部分401和多個所述遮蔽部分402的形狀的正確性,並且減少了所述圖案化光阻層400產生缺陷的機會。Since the anisotropic etching means has the feature of controllable etching direction, the photoresist layer 300 can be etched in a direction substantially along the normal direction to the outer surface 12 of the metal drum 1 , thus ensuring The shapes of the hollow portions 401 and the shielding portions 402 of the patterned photoresist layer 400 formed in the photoresist etching step S14 are correct, and the patterned photoresist layer is reduced 400 chance of producing a defect.

如圖7所示,所述滾筒蝕刻步驟S15:透過非等向蝕刻手段(如:電漿蝕刻)並且以所述圖案化光阻層400為遮罩而對所述金屬滾筒1的所述外表面12進行蝕刻,並且於所述金屬滾筒1的所述外表面12對應於所述圖案化光阻層400的每一所述鏤空部分401的位置形成多個壓印圖形13。如圖8所示,本實施例中,當所述滾筒蝕刻步驟S15完成後,所述金屬滾筒1的所述外表面12上的任一個所述壓印圖形13的深度d介於0.2微米(μm)至0.6微米之間,任一個所述壓印圖形13的寬度w介於0.3微米至0.8微米之間,並且相鄰的任兩個所述壓印圖形13的間距p介於0.6微米至1.6微米之間。As shown in FIG. 7 , the roller etching step S15 : using the patterned photoresist layer 400 as a mask to remove the outer surface of the metal roller 1 by anisotropic etching means (eg, plasma etching) The surface 12 is etched, and a plurality of embossing patterns 13 are formed on the outer surface 12 of the metal drum 1 at positions corresponding to each of the hollow portions 401 of the patterned photoresist layer 400 . As shown in FIG. 8 , in this embodiment, after the drum etching step S15 is completed, the depth d of any one of the imprint patterns 13 on the outer surface 12 of the metal drum 1 is between 0.2 μm ( μm) to 0.6 μm, the width w of any one of the embossed patterns 13 is between 0.3 μm to 0.8 μm, and the distance p between any two adjacent embossed patterns 13 is between 0.6 μm to 0.8 μm between 1.6 microns.

特別說明,本實施例中,所述滾筒蝕刻步驟S15是使用高密度電漿源 (High density plasma, HDP)並以反應式離子蝕刻手段(Reactive Ion Etch, RIE)進行。但本發明實施例不限於此,舉例來說,所述滾筒蝕刻步驟S15也能夠採用磁場強化活性離子蝕刻手段(Magnetic Enhanced RIE, MERIE),或者透過脈衝電場強化的技術手段,增強蝕刻的效率並控制蝕刻的方向。In particular, in this embodiment, the roller etching step S15 is performed by using a high density plasma source (High density plasma, HDP) and a reactive ion etching method (Reactive Ion Etch, RIE). However, the embodiment of the present invention is not limited to this. For example, the drum etching step S15 can also use magnetic field enhanced reactive ion etching (Magnetic Enhanced RIE, MERIE), or technical means enhanced by pulsed electric field to enhance the etching efficiency and improve the efficiency of the etching process. Controls the direction of etching.

如圖8所示,所述圖案化光阻移除步驟S16:當所述滾筒蝕刻步驟S15完成後,將所述金屬滾筒1的所述外表面12上的所述圖案化光阻層400移除,而使得所述金屬滾筒1形成一轉印滾輪100。如圖9至圖11所示,透過所述滾輪製造步驟S1所製成的所述轉印滾輪100的外表面上具有以前述各步驟所形成的多個所述壓印圖形13。As shown in FIG. 8 , the patterned photoresist removal step S16 : after the roller etching step S15 is completed, the patterned photoresist layer 400 on the outer surface 12 of the metal roller 1 is removed. In this way, the metal roller 1 forms a transfer roller 100 . As shown in FIG. 9 to FIG. 11 , the outer surface of the transfer roller 100 manufactured through the roller manufacturing step S1 has a plurality of the embossing patterns 13 formed in the foregoing steps.

如圖9至圖12所示,本發明實施例也公開一種光學膜片600的製造方法,其包括有透過所述滾輪製造步驟S1製造所述轉印滾輪100,且透過所述轉印滾輪100進行一光學膜片轉印步驟S2。所述光學膜片轉印步驟S2是以所述轉印滾輪100不間斷地滾壓於一透光膜500上,以使所述透光膜500形成有形狀互補於所述轉印滾輪100上多個所述壓印圖形13的多個光學微結構601,而使得所述透光膜500構成一光學膜片600。As shown in FIG. 9 to FIG. 12 , an embodiment of the present invention also discloses a method for manufacturing an optical film 600 , which includes manufacturing the transfer roller 100 through the roller manufacturing step S1 , and passing through the transfer roller 100 An optical film transfer step S2 is performed. In the optical film transfer step S2 , the transfer roller 100 is continuously rolled on a transparent film 500 , so that the transparent film 500 is formed with a shape complementary to the transfer roller 100 . The plurality of optical microstructures 601 of the embossed pattern 13 make the light-transmitting film 500 constitute an optical film 600 .

需要說明的是,由於在本實施例中,由於所述光學膜片600上的多個所述光學微結構601的形狀互補於所述轉印滾輪100上的多個所述壓印圖形13,因此所述光學膜片600上的任一所述光學微結構601會形成高度介於0.2微米至0.6微米之間、寬度介於0.3微米至0.8微米之間的凸出形狀的微結構,且任兩相鄰的所述光學微結構601的間距介於0.6微米至1.6微米之間。It should be noted that, in this embodiment, since the shapes of the plurality of optical microstructures 601 on the optical film 600 are complementary to the shapes of the plurality of embossing patterns 13 on the transfer roller 100, Therefore, any one of the optical microstructures 601 on the optical film 600 will form a microstructure with a convex shape with a height between 0.2 μm and 0.6 μm and a width between 0.3 μm and 0.8 μm. The distance between two adjacent optical microstructures 601 is between 0.6 μm and 1.6 μm.

[實施例的有益效果][Advantageous effects of the embodiment]

本發明的其中一有益效果在於,本發明所提供的轉印滾輪與其製造方法、及光學膜片與其製造方法,其能夠通過“透過所述曝光步驟及所述顯影步驟在所述光阻層上形成多個所述凹陷部分和多個所述凸起部分,再透過所述光阻蝕刻步驟形成所述圖案化光阻層後,再透過非等向蝕刻手段以所述圖案化光阻層為遮罩蝕刻所述金屬滾筒外表面以形成多個所述壓印圖形”的技術方案,進而能夠透過蝕刻手段於所述轉印滾輪外表面形成轉印用的多個所述壓印圖形,以大幅降低所述轉印滾輪的製造時間及製造成本。One of the beneficial effects of the present invention is that the transfer roller and its manufacturing method, and the optical film and its manufacturing method provided by the present invention can pass through the exposure step and the developing step on the photoresist layer. After forming a plurality of the recessed parts and a plurality of the protruding parts, and then forming the patterned photoresist layer through the photoresist etching step, the patterned photoresist layer is then formed by an anisotropic etching method. The technical solution of mask etching the outer surface of the metal roller to form a plurality of the imprinting patterns, and then a plurality of the imprinting patterns for transfer can be formed on the outer surface of the transfer roller by etching means, so as to The manufacturing time and manufacturing cost of the transfer roller are greatly reduced.

更詳細地說,於本發明所提供的轉印滾輪製造方法中,所述光阻層的厚度能夠大於多個所述曝光圖案的深度,使得光阻層能夠具備較大的厚度(例如3微米至25微米),而能夠提高所述光阻層的均勻性。並且能夠透過控制多個所述曝光圖案的深度和所述光阻層厚度的比例(例如光阻層厚度1/3至2/3之間),並搭配非等向性的電漿蝕刻手段使得所述光阻層被蝕刻後形成所述圖案化光阻層,其能夠提高圖案化光阻層圖形的正確性,並減少圖案化光阻層的缺陷。In more detail, in the method for manufacturing a transfer roller provided by the present invention, the thickness of the photoresist layer can be greater than the depth of the plurality of exposure patterns, so that the photoresist layer can have a larger thickness (for example, 3 microns) to 25 microns), which can improve the uniformity of the photoresist layer. And by controlling the ratio of the depth of the exposure patterns and the thickness of the photoresist layer (for example, between 1/3 and 2/3 of the thickness of the photoresist layer), and with anisotropic plasma etching methods, The patterned photoresist layer is formed after the photoresist layer is etched, which can improve the correctness of the pattern of the patterned photoresist layer and reduce the defects of the patterned photoresist layer.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

100:轉印滾輪 1:金屬滾筒 11:中心軸線 12:外表面 13:壓印圖形 200:塗佈設備 2:塗佈機構 3:旋轉模組 4:直線位移模組 5:承載台 300:光阻層 301:曝光圖案 302:圖案化光源 303:圖案化光線 304:凹陷部分 305:凸起部分 400:圖案化光阻層 401:鏤空部分 402:遮蔽部分 500:透光膜 600:光學膜片 601:光學微結構 T:光阻層厚度 h:曝光圖案深度 w:寬度 d:深度 p:間距 S1:滾輪製造步驟 S11:塗佈步驟 S12:曝光步驟 S13:顯影步驟 S14:光阻蝕刻步驟 S15:滾筒蝕刻步驟 S16:圖案化光阻移除步驟 S2:光學膜片轉印步驟100: transfer roller 1: Metal Roller 11: Central axis 12: Outer surface 13: Embossed graphics 200: Coating equipment 2: Coating mechanism 3: Rotary module 4: Linear displacement module 5: Bearing platform 300: photoresist layer 301: Exposure Pattern 302: Patterned Light Source 303: Patterned Light 304: sunken part 305: Raised part 400: Patterned photoresist layer 401: hollow part 402: shaded part 500: translucent film 600: Optical film 601: Optical Microstructure T: thickness of photoresist layer h: exposure pattern depth w: width d: depth p: spacing S1: Roller manufacturing steps S11: Coating step S12: Exposure step S13: Development step S14: Photoresist etching step S15: Roller etching step S16: Patterned photoresist removal step S2: Optical film transfer step

圖1為本發明實施例的轉印滾輪製造方法的步驟流程示意圖。FIG. 1 is a schematic flowchart of steps of a method for manufacturing a transfer roller according to an embodiment of the present invention.

圖2為本發明實施例使用光阻塗怖設備的示意圖。FIG. 2 is a schematic diagram of a photoresist coating device according to an embodiment of the present invention.

圖3為本發明實施例的塗佈光阻層的金屬滾筒的立體示意圖。3 is a schematic perspective view of a metal roller coated with a photoresist layer according to an embodiment of the present invention.

圖4為本發明實施例透過圖案化光源照射光阻層以形成曝光圖案的動作示意圖。FIG. 4 is a schematic diagram of an operation of irradiating a photoresist layer through a patterned light source to form an exposure pattern according to an embodiment of the present invention.

圖5為本發明實施例透過顯影步驟顯影後的光阻層的剖面示意圖。5 is a schematic cross-sectional view of a photoresist layer developed through a developing step according to an embodiment of the present invention.

圖6為本發明實施例透過光阻蝕刻步驟形成圖案化光阻層的動作示意圖。FIG. 6 is a schematic diagram of an operation of forming a patterned photoresist layer through a photoresist etching step according to an embodiment of the present invention.

圖7為本發明實施例透過滾筒蝕刻步驟於金屬滾筒表面形成壓印圖形的動作示意圖。FIG. 7 is a schematic diagram of the operation of forming an imprint pattern on the surface of a metal drum through a drum etching step according to an embodiment of the present invention.

圖8為本發明實施例移除光阻層後的金屬滾筒的局部剖面示意圖。8 is a schematic partial cross-sectional view of the metal roller after removing the photoresist layer according to an embodiment of the present invention.

圖9及圖10為本發明實施例的轉印滾輪壓印透光膜以構成光學膜片的動作示意圖。9 and FIG. 10 are schematic diagrams of the operation of the transfer roller imprinting the light-transmitting film to form an optical film according to an embodiment of the present invention.

圖11為從圖10的XI部分所取的局部放大剖面示意圖。FIG. 11 is a schematic partial enlarged cross-sectional view taken from part XI of FIG. 10 .

圖12為從圖10的XII部分所取的局部放大剖面示意圖。FIG. 12 is a partially enlarged schematic cross-sectional view taken from XII of FIG. 10 .

S1:滾輪製造步驟S1: Roller manufacturing steps

S11:塗佈步驟S11: Coating step

S12:曝光步驟S12: Exposure step

S13:顯影步驟S13: Development step

S14:光阻蝕刻步驟S14: Photoresist etching step

S15:滾筒蝕刻步驟S15: Roller etching step

S16:圖案化光阻移除步驟S16: Patterned photoresist removal step

Claims (8)

一種轉印滾輪製造方法,其中包括:一塗佈步驟:於一金屬滾筒的外表面塗佈圍繞360度的一光阻層,所述光阻層具有一厚度;一曝光步驟:將一圖案化光源照射於所述光阻層的外表面,而使得所述光阻層的所述外表面的一側形成多個曝光圖案,所述光阻層的曝光深度小於所述光阻層的厚度,而使得任一個所述曝光圖案的深度小於所述光阻層的厚度;一顯影步驟:移除所述光阻層上多個所述曝光圖案的材料,而使得所述光阻層形成對應於多個所述曝光圖案的多個凹陷部分及位於多個所述凹陷部分範圍外的多個凸起部分;一光阻蝕刻步驟:透過非等向性蝕刻手段對所述光阻層進行蝕刻,所述光阻蝕刻步驟的蝕刻深度大於任一個所述凹陷部分的厚度且小於任一個所述凸起部分的厚度,而使得多個所述凹陷部分的所述光阻層被完全移除而形成多個鏤空部分,而多個所述凸起部分的所述光阻層未被完全移除而形成多個遮蔽於所述金屬滾筒的所述外表面的多個遮蔽部分,而形成一圖案化光阻層;一滾筒蝕刻步驟:透過非等向蝕刻手段以所述圖案化光阻層為遮罩蝕刻所述金屬滾筒的所述外表面,而於所述金屬滾筒的所述外表面形成多個壓印圖形;以及一圖案化光阻移除步驟:將所述圖案化光阻層從所述金屬滾筒的所述表面移除,進而形成一轉印滾輪;其中,所述光阻層的厚度介於3微米(μm)至25微米之間;所述曝光步驟中,任一個所述曝光圖案的深度介於所述光阻層厚度的1/3至2/3之間。 A method for manufacturing a transfer roller, comprising: a coating step: coating a photoresist layer around 360 degrees on the outer surface of a metal roller, the photoresist layer has a thickness; an exposure step: patterning a The light source is irradiated on the outer surface of the photoresist layer, so that one side of the outer surface of the photoresist layer forms a plurality of exposure patterns, and the exposure depth of the photoresist layer is less than the thickness of the photoresist layer, so that the depth of any one of the exposure patterns is smaller than the thickness of the photoresist layer; a developing step: removing the materials of the plurality of exposure patterns on the photoresist layer, so that the photoresist layer is formed corresponding to a plurality of concave portions of the exposure patterns and a plurality of convex portions located outside the range of the plurality of concave portions; a photoresist etching step: etching the photoresist layer by anisotropic etching means, The etching depth of the photoresist etching step is greater than the thickness of any one of the recessed portions and less than the thickness of any one of the protruding portions, so that the photoresist layers of the plurality of recessed portions are completely removed to form A plurality of hollow parts, and the photoresist layer of a plurality of the protruding parts are not completely removed to form a plurality of shielding parts shielded on the outer surface of the metal drum to form a pattern A photoresist layer; a roller etching step: etching the outer surface of the metal roller by using the patterned photoresist layer as a mask by anisotropic etching means, and forming multiple layers on the outer surface of the metal roller and a patterned photoresist removing step: removing the patterned photoresist layer from the surface of the metal roller to form a transfer roller; wherein, the photoresist layer is The thickness is between 3 micrometers (μm) and 25 micrometers; in the exposure step, the depth of any one of the exposure patterns is between 1/3 to 2/3 of the thickness of the photoresist layer. 如請求項1所述的轉印滾輪製造方法,其中,任一個所述壓印圖形的深度介於0.2微米至0.6微米之間,任一個所述壓印圖形的寬度介於0.3微米至0.8微米之間。 The method for manufacturing a transfer roller according to claim 1, wherein the depth of any one of the embossed patterns is between 0.2 μm and 0.6 μm, and the width of any one of the embossed patterns is between 0.3 μm and 0.8 μm between. 如請求項2所述的轉印滾輪製造方法,其中,相鄰的任兩個所述壓印圖形的間距介於0.6微米至1.6微米之間。 The method for manufacturing a transfer roller according to claim 2, wherein the distance between any two adjacent imprint patterns is between 0.6 micrometers and 1.6 micrometers. 如請求項1所述的轉印滾輪製造方法,其中,所述光阻蝕刻步驟為採用電漿蝕刻手段進行。 The method for manufacturing a transfer roller according to claim 1, wherein the photoresist etching step is performed by plasma etching. 如請求項1所述的轉印滾輪製造方法,其中,所述滾筒蝕刻步驟為採用高密度電漿源並以反應式離子蝕刻手段進行。 The method for manufacturing a transfer roller according to claim 1, wherein the roller etching step is performed using a high-density plasma source and a reactive ion etching method. 一種轉印滾輪,所述轉印滾輪具有一金屬滾筒,所述金屬滾筒的一外表面形成多個壓印圖形;其中,所述金屬滾筒的所述外表面的多個所述壓印圖形是以如請求項1所述的轉印滾輪製造方法所製成。 A transfer roller, the transfer roller has a metal drum, and an outer surface of the metal drum forms a plurality of imprinting patterns; wherein, the plurality of imprinting patterns on the outer surface of the metal drum are Manufactured by the method of manufacturing a transfer roller as claimed in claim 1. 一種光學膜片製造方法,包括:一滾輪製造步驟:為以請求項1所述的轉印滾輪製造方法製造一轉印滾輪;一光學膜片轉印步驟:以所述轉印滾輪不間斷地滾壓於一透光膜上,以使所述透光膜形成有形狀互補於多個所述壓印圖形的多個光學微結構、進而使所述透光膜構成一光學膜片。 An optical film manufacturing method, comprising: a roller manufacturing step: manufacturing a transfer roller by the transfer roller manufacturing method described in claim 1; an optical film transfer step: using the transfer roller to continuously Rolling is carried out on a light-transmitting film, so that the light-transmitting film is formed with a plurality of optical microstructures whose shapes are complementary to a plurality of the embossing patterns, so that the light-transmitting film constitutes an optical film. 一種光學膜片,所述光學膜片包括有一透光膜,所述透光膜上具有多個光學微結構,其中多個所述光學微結構是以如請求項7所述的光學膜片製造方法所製成。 An optical film, the optical film includes a light-transmitting film, and the light-transmitting film has a plurality of optical microstructures, wherein the plurality of the optical microstructures are manufactured by the optical film according to claim 7 method made.
TW109127015A 2020-08-10 2020-08-10 Transfer roller, manufacturing method of transfer roller, optical film, and manufacturing method of optical film TWI765314B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW109127015A TWI765314B (en) 2020-08-10 2020-08-10 Transfer roller, manufacturing method of transfer roller, optical film, and manufacturing method of optical film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109127015A TWI765314B (en) 2020-08-10 2020-08-10 Transfer roller, manufacturing method of transfer roller, optical film, and manufacturing method of optical film

Publications (2)

Publication Number Publication Date
TW202206947A TW202206947A (en) 2022-02-16
TWI765314B true TWI765314B (en) 2022-05-21

Family

ID=81323322

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109127015A TWI765314B (en) 2020-08-10 2020-08-10 Transfer roller, manufacturing method of transfer roller, optical film, and manufacturing method of optical film

Country Status (1)

Country Link
TW (1) TWI765314B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI829601B (en) * 2023-06-14 2024-01-11 光群雷射科技股份有限公司 Manufacturing method of metal roller having seamless pattern

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI808747B (en) * 2022-05-06 2023-07-11 鉅侖科技股份有限公司 Membrane device manufacturing method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121312A (en) * 1991-10-25 1993-05-18 Nippon Telegr & Teleph Corp <Ntt> Pattern forming method
US20050241573A1 (en) * 2004-03-26 2005-11-03 Tomonari Ogawa Gravure coating apparatus, and optical film
JP2006095443A (en) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd Gravure coating method, apparatus and optical film
US20080076069A1 (en) * 2006-09-22 2008-03-27 Tokyo Electron Limited Method of patterning an anti-reflective coating by partial developing
WO2013137176A1 (en) * 2012-03-12 2013-09-19 旭化成株式会社 Mold, resist laminate and manufacturing process therefor, and microrelief structure
TW201349612A (en) * 2012-03-16 2013-12-01 Jx Nippon Oil & Energy Corp Manufacturing method and manufacturing device for fabricating substrate having concave-convex pattern by using film-shaped mold, and manufacturing method for device provided with the substrate
KR20160092359A (en) * 2015-01-27 2016-08-04 삼성전기주식회사 Gravure roller and gravure printing apparatus including the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121312A (en) * 1991-10-25 1993-05-18 Nippon Telegr & Teleph Corp <Ntt> Pattern forming method
US20050241573A1 (en) * 2004-03-26 2005-11-03 Tomonari Ogawa Gravure coating apparatus, and optical film
JP2006095443A (en) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd Gravure coating method, apparatus and optical film
US20080076069A1 (en) * 2006-09-22 2008-03-27 Tokyo Electron Limited Method of patterning an anti-reflective coating by partial developing
WO2013137176A1 (en) * 2012-03-12 2013-09-19 旭化成株式会社 Mold, resist laminate and manufacturing process therefor, and microrelief structure
TW201349612A (en) * 2012-03-16 2013-12-01 Jx Nippon Oil & Energy Corp Manufacturing method and manufacturing device for fabricating substrate having concave-convex pattern by using film-shaped mold, and manufacturing method for device provided with the substrate
KR20160092359A (en) * 2015-01-27 2016-08-04 삼성전기주식회사 Gravure roller and gravure printing apparatus including the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI829601B (en) * 2023-06-14 2024-01-11 光群雷射科技股份有限公司 Manufacturing method of metal roller having seamless pattern

Also Published As

Publication number Publication date
TW202206947A (en) 2022-02-16

Similar Documents

Publication Publication Date Title
JP5570688B2 (en) Fine resist pattern forming method and nanoimprint mold structure
JP5299139B2 (en) Manufacturing method of mold for nanoimprint
TWI261732B (en) Composite optical lithography method for patterning lines of significantly different widths
TWI765314B (en) Transfer roller, manufacturing method of transfer roller, optical film, and manufacturing method of optical film
JP2015004994A (en) Method for fabricating mask for near-field lithography
KR100956409B1 (en) Method for manufacturing hybrid nano-imprint mask and method for manufacturing electro-device using the same
TW201726289A (en) Method for manufacturing deposition mask
JP4674105B2 (en) Circuit pattern transfer apparatus and method
JP2010537258A (en) Lithographic method for continuous direct writing of images
US7582396B2 (en) Hybrid phase-shift mask and manufacturing method thereof
JP2011066153A (en) Template with identification mark and method of manufacturing the same
CN114077160A (en) Transfer roller and manufacturing method thereof, and optical film and manufacturing method thereof
TWI742901B (en) Manufacturing method of transfer roller and manufacturing method of transfer film
TW201421169A (en) Manufacturing method for microstructure, and microstructure
JP5428401B2 (en) Method for producing convex pattern formed body
US10859903B1 (en) Alternating phase shift mask
JP2012009776A (en) Method of manufacturing substrate
TWI723947B (en) Manufacturing method of optical film in transfer manner and manufacturing method of transfer mother die
CN114488687A (en) Transfer roller manufacturing method and transfer film manufacturing method
JP5187524B2 (en) Photomask substrate manufacturing method
JP2012220919A (en) Photomask
JP2012148447A (en) Method for manufacturing board
JP2001215687A (en) Photomask and its manufacturing method
Cheng et al. Combined nanoimprint and photolithography technique with a hybrid mold
JP2011210862A (en) Method of manufacturing substrate and exposure apparatus