TWI762324B - Display apparatus - Google Patents

Abstract

A display apparatus includes a flexible substrate, a pixel array layer, a conductive line structure and a plurality of pads. The flexible substrate has a display region and a non-display region. The non-display region is on one side of the display region. The pixel array layer is on the display region. The conductive line structure is on the non-display region. The pads are on the non-display region and arranged along a direction. The pads include a plurality of first pads and a second pad. The first pads are electrically connected to the pixel array layer. The conductive line structure includes a plurality of first conductive lines connected with each other. The first conductive lines are electrically connected to the second pad.

Description

display device

The present invention relates to a display device.

With the advancement of technology, displays have developed into flexible display panels in addition to rigid flat display panels. The display can be driven by an external circuit, and its packaging can use chip on film (COF) or chip on plastic (COP) technology, which needs to pass through anisotropic conductive adhesive with high viscosity Act as an intermediary to connect the two. When there is foreign matter or offset during the packaging process, the external circuit needs to be removed and reworked again. However, the removal process requires a pulling force, which may cause the components of the display to peel off or develop micro-cracks, leading to scrapping problems and increasing production costs.

The present invention provides a display device with high rework yield.

A display device according to an embodiment of the present invention includes a flexible substrate, a plurality of pixel structures, a wire structure, and a plurality of pads. The flexible substrate has a display area and a non-display area, and the non-display area is located on one side of the display area. The pixel structures are located in the display area and are arranged in an array. The wire structure is located in the non-display area. The pads are located in the non-display area and are arranged along a direction. The pads include a plurality of first pads and a second pad, the first pads are electrically connected to the pixel structure, and the wire structure includes a plurality of first pads connected to each other. A lead, the first lead is electrically connected to the second pad.

A display device according to an embodiment of the present invention includes a flexible substrate, a plurality of pixel structures, a plurality of pads, and a driving element. The flexible substrate has a display area and a non-display area, and the non-display area is located on one side of the display area. The pixel structures are located in the display area and are arranged in an array. The pads are located in the non-display area and are arranged along a direction, the pads include a plurality of first pads, and the first pads are electrically connected to the pixel structure. The driving element is located in the non-display area. The driving element includes a base material, a metal circuit layer and a wire structure. The metal circuit layer and the wire structure are respectively arranged on two opposite surfaces of the base material. The metal circuit layer is electrically connected to the first pad, and the wire structure A plurality of first wires connected to each other are included.

Based on the above, in the display device of an embodiment of the present invention, the wire structure includes a plurality of first wires connected to each other, and the first wires are electrically connected to the second pads. When rework is required later, the first wire can be heated by applying a current to the second pad, thereby making the non-display area heat up, so that the temperature of the anisotropic conductive adhesive above it increases, and it is easy to connect with the non-display area. Separation can reduce damage to the butt pads. As a result, the yield rate of heavy industry is high.

FIG. 1 is a schematic top view of a display device 10 according to an embodiment of the present invention. Please refer to FIG. 1 , the display device 10 includes a flexible substrate 100 , and the flexible substrate 100 is mainly used to carry the components of the display device 10 . use. In this embodiment, the material of the flexible substrate 100 may be an organic polymer or other applicable materials.

The flexible substrate 100 has a display area AA and a non-display area NA, and the non-display area NA is located on one side of the display area AA. The display device 10 further includes a plurality of pixel structures PX, a plurality of first signal lines SL1 and a plurality of second signal lines SL2 on the display area AA of the flexible substrate 100 . The pixel structure PX is arranged in an array, and may include an active element T and a pixel electrode PE electrically connected to the active element T. For example, in this embodiment, the active element T can be a thin film transistor, and has a source S, a gate G, and a drain D, and the pixel electrode PE is electrically connected to the drain D. The plurality of first signal lines SL1 are parallel to the first direction d1, and the plurality of second signal lines SL2 are parallel to the second direction d2, wherein the first direction d1 and the second direction d2 intersect. For example, in this embodiment, the first direction d1 and the second direction d2 can be selectively perpendicular, but the present disclosure is not limited thereto. The plurality of pixel structures PX are electrically connected to the plurality of first signal lines SL1 and the plurality of second signal lines SL2. For example, in this embodiment, the source S of the active element T of the pixel structure PX is electrically connected to the first signal line SL1, and the gate G of the active element T of the pixel structure PX is electrically connected to the first signal line SL1. The second signal line SL2.

Based on the consideration of conductivity, the materials of the first signal line SL1 and the second signal line SL2 are generally metal materials. However, the present disclosure is not limited thereto. According to other embodiments, the first signal line SL1 and the second signal line SL2 can also use other conductive materials, such as alloys, nitrides of metal materials, oxides of metal materials, metal materials oxynitride, or other suitable materials, or stacked layers of metal materials and other conductive materials.

The display device 10 includes a plurality of pads 102. The pads 102 are located on the flexible substrate 100. For example, the pads 102 are located in the non-display area NA and arranged along the second direction d2. The pads 102 include a plurality of first pads 102A and second pads 102B. The first pads 102A are electrically connected to the pixel structure PX. For example, the first pad 102A is electrically connected to the pixel structure PX through the first signal line SL1. The display device 10 further includes a wire structure 108, and the wire structure 108 is located in the non-display area NA. In this embodiment, the wire structure 108 includes a plurality of first wires 110 connected to each other.

Fig. 2 is a schematic cross-sectional view along the line 2-2' in Fig. 1, and Fig. 3 is a schematic cross-sectional view along the line 3-3' in Fig. 1. Please refer to Fig. 1, Fig. 2 and 3 , in an embodiment, the display device 10 includes a first circuit layer 112 and a first insulating layer 114 on the flexible substrate 100 , the first circuit layer 112 and the first wires 110 are alternately arranged, and the first circuit Layer 112 is on first insulating layer 114 . For example, the first insulating layer 114 is located on the non-display area NA and the first wire 110 , and the pads 102 are located on the first insulating layer 114 . Therefore, even if the driving element (not shown) and the pad 102 are offset when engaged, the driving element will not contact the first wire 110 and cause a short circuit between the two.

The display device 10 further includes a second insulating layer 116 , an interlayer dielectric layer 118 , an insulating layer 120 and a second wiring layer 121 . The second insulating layer 116 is located on the first wiring layer 112 and the first insulating layer 114 . The interlayer dielectric layer 118 is on the second insulating layer 116 . The second wiring layer 121 penetrates through the interlayer dielectric layer 118 and the second insulating layer 116 to be electrically connected to the first signal line SL1 . In one embodiment, the display device 10 may optionally include a buffer layer BF, and the buffer layer BF is located on the flexible substrate 100 .

In one embodiment, the display device 10 further includes a signal line 122 and an electrode portion 125 , and the signal line 122 and the electrode portion 125 are located on two sides of the first signal line SL1 . The signal line 122 penetrates through the interlayer dielectric layer 118 and the second insulating layer 116 to be electrically connected to the first circuit layer 112 . The wire structure 108 further includes a connecting portion 111 , and the connecting portion 111 overlaps the second pad 102B in the normal direction of the flexible substrate 100 . The electrode portion 125 penetrates through the interlayer dielectric layer 118 , the second insulating layer 116 and the first insulating layer 114 to be electrically connected to the connecting portion 111 of the first wire 110 . The insulating layer 120 is located on the first signal line SL1, the interlayer dielectric layer 118, the signal line 122 and the electrode portion 125, and has openings to expose the second line layer 121, the signal line 122 and the electrode portion 125, so that the first pad 102A can be It is electrically connected to the second circuit layer 121 , the signal line 122 and the electrode portion 125 through the opening of the insulating layer 120 . In one embodiment, the signal line 122 is, for example, a power line.

On the other hand, the buffer layer BF, the first insulating layer 114 , the second insulating layer 116 , the gate electrode G, the interlayer dielectric layer 118 , the source electrode S, the drain electrode D and the insulating layer 120 can be formed by any conventional technology in the technical field. Any buffer layer, any gate insulating layer, any gate electrode, any interlayer insulating layer, any source electrode, any drain electrode and any insulating layer known to the knowledgeable can be used for the pixel array layer. , and the buffer layer BF, the first insulating layer 114, the second insulating layer 116, the gate electrode G, the interlayer dielectric layer 118, the source electrode S, the drain electrode D and the insulating layer 120 can be obtained by any conventional method in the technical field. formed by any method known to the knowledgeable.

The first wire 110 is electrically connected to the second pad 102B. For example, the first wire 110 is electrically connected to the second pad 102B through the electrode portion 125 . When rework is required later, the first wire 110 can be heated by applying a current to the second pad 102B, thereby heating the non-display area NA, thereby increasing the temperature of the anisotropic conductive adhesive (not shown) above it. And it is easy to separate from the non-display area NA, which can reduce the damage of the butt pad 102 (eg, the first pad 102A). As a result, the yield rate of heavy industry is high.

In this embodiment, the wire structure 108 is not connected to the first signal line SL1 and the second signal line SL2. For example, the potential of the wire structure 108 is floating. Thereby, the electrical properties between the wire structure 108 and the pixel structure PX are independent, in other words, the signals between the two are independent. As mentioned above, the first wire 110 can be heated by applying a current to the second pad 102B. Therefore, the wire structure 108 does not affect the thrust condition provided by the driving element (not shown) to the pixel structure PX.

For example, FIG. 4 is a schematic cross-sectional view of a display device 10a according to an embodiment of the present invention. Referring to FIG. 4 , the display device 10 a further includes a driving element 200 and an anisotropic conductive adhesive 202 . The driving element 200 is located in the non-display area NA and is electrically connected to the pads 102 , and the driving element 200 includes a substrate 204 and is located on the substrate 204 of the plurality of wires 206 . The anisotropic conductive adhesive 202 is located between the driving element 200 and the pad 102 to fix the two. The properties of the anisotropic conductive adhesive 202 are related to its temperature. For example, when the temperature of the anisotropic conductive adhesive 202 is lower than the glass transition temperature, it is in a glass state, and higher than the glass transition temperature, it is in a rubber state. In this embodiment, by applying a current to the second pad 102B, the first wire 110 is heated, so that the non-display area NA is heated, so that the anisotropic conductive adhesive 202 reaches the glass transition temperature. In this way, The anisotropic conductive adhesive 202 is in a rubber state and is easily separated from the non-display area NA, thereby reducing damage to the butt pad 102 (eg, the first pad 102A). As a result, the yield rate of heavy industry is high.

Please go back to FIG. 1 and FIG. 2, since the first insulating layer 114 is located on the non-display area NA and the first wires 110, the pads 102 are on the first insulating layer 114, and the wire structures 108 (eg, the first wires 110) The confirmation of the conductive particle indentation state of the anisotropic conductive adhesive (not shown) after the driving element and the pad 102 are joined is not affected.

The first wire 110 has a first portion 110A located between two adjacent first pads 102A, whereby the anisotropic conductive adhesive (not shown) can be heated uniformly, so that the anisotropy near the first pads 102A can be uniformly heated. The conductive adhesive (not shown) has a uniform high temperature and is easily separated from the non-display area NA.

In one embodiment, alignment marks 126 are provided on opposite sides of the non-display area NA, and the alignment marks 126 are, for example, located between the pads 102 and the edge of the flexible substrate 100 . The normal direction of the flexible substrate 100 is overlapped with the alignment marks 126 , so that the driving elements can be accurately arranged on the pads 102 of the non-display area NA. In this embodiment, the first wire 110 further has a second portion 110B located between the edge of the flexible substrate 100 and the second pad 102B. By applying a current to the second portion 110B, the non-display area NA can be ensured. The opposite sides of the NA are heated, so that the temperature of the anisotropic conductive adhesive (not shown) above it increases and is easily separated from the opposite sides of the non-display area NA, thereby reducing the damage to the butt pad 102 (eg, the first pad 102A). . As a result, the yield rate of heavy industry is high.

In this embodiment, the top-view shape of the first conducting wire 110 is not a straight line, in other words, it is an irregular shape. For example, the top view shape of the first wire 110 is a sawtooth shape. Since the resistance value is positively related to the length of the object, thereby, the first wire 110 can have an increased resistance value.

，其中E為能量，P為功率，t為時間，I為電流，R為電阻， 。如此能量公式所示，能量與電阻值呈正相關。因此，電阻值的提升將有助於提升能量。因此，本發明之實施例的第一導線110可藉由提升電阻值來實現能量提升的效果，提升的能量使非顯示區NA發熱效果良好。於其他實施例中，第一導線110的俯視形狀可為S型(見第5圖)、方格型(見第6圖)或其他異型。於其他實施例中，第一導線110的俯視形狀可為直線(見第7圖)。 It can be understood that the energy provided by the first wire 110 satisfies the

, where E is energy, P is power, t is time, I is current, R is resistance, . As shown in this energy formula, energy is positively related to resistance value. Therefore, the increase in resistance value will help to increase the energy. Therefore, the first wire 110 of the embodiment of the present invention can achieve the effect of increasing the energy by increasing the resistance value, and the increased energy makes the non-display area NA have a good heating effect. In other embodiments, the top view shape of the first wire 110 may be an S-shape (see FIG. 5 ), a square shape (see FIG. 6 ), or other special shapes. In other embodiments, the top view shape of the first wire 110 may be a straight line (see FIG. 7 ).

The wire structure 108 has a sheet resistance of 50 to 1900 ohms per unit area (Ω/□). In this embodiment, the material of the wire structure 108 includes polysilicon or indium tin oxide, the sheet resistance of polysilicon is 65.7 ohms/unit area (Ω/□), and the sheet resistance of indium tin oxide is 1700 ohms/unit area (Ω/□) ). Thereby, the wire structure 108 has a high sheet resistance. Therefore, the wire structure 108 of the embodiment of the present invention can achieve the effect of increasing the energy by increasing the resistance value, and the increased energy makes the non-display area NA have a good heating effect.

In addition, as shown in the energy formula above, energy is positively correlated with time and current. Therefore, the energy of the wire structure 108 can also be controlled by the process. The increased energy can make the non-display area NA have a good heating effect.

FIG. 8 is a schematic top view of a display device 10b according to another embodiment of the present invention. FIG. 9 is a schematic cross-sectional view along the line 9-9' of FIG. 8. Please refer to FIGS. 8 and 9. The difference between the display device 10b and the display device 10 of FIG. 1 is that the first wires 110 are also It includes a third portion 110C, the third portion 110C overlaps the first pad 102A in the normal direction of the flexible substrate 100 , and the first circuit layer 112 is located on the second insulating layer 116 . Therefore, when rework is required later, the anisotropic conductive adhesive (not shown) above can be uniformly heated by applying a current to the first wire 110, so that the heating effect of the non-display area NA is good.

The first insulating layer 114 also covers the third portion 110C of the first wire 110 , in other words, the first insulating layer 114 is located between the third portion 110C of the first wire 110 and the pad 102 . ) and the pad 102 are offset when they are engaged, the driving element will not contact the third portion 110C of the first wire 110 to cause a short circuit between the two, and the third portion 110C of the first wire 110 will not affect the driving element and the pad. 102 Confirmation of the conductive particle indentation status of the anisotropic conductive adhesive (not shown) after bonding.

FIG. 10 is a schematic top view of a display device 10c according to another embodiment of the present invention. FIG. 11 is a schematic cross-sectional view along the line 11-11' in FIG. 10. The difference between the display device 10c and the display device 10b in FIG. 8 is that the pad 102 further includes a third pad 102C, and the wire structure 108 further includes Including a plurality of second wires 128 on the first insulating layer 114, the second wires 128 are electrically connected to the third pads 102C, and the second wires 128 include a first portion 128A, the first portion 128A along the flexible substrate 100 The direction of the normal line of is overlapped with the first portion 110A of the first conductive line 110 . With the two-layer structure formed by the first wire 110 and the second wire 128, when rework is required later, the first wire 110 and the second wire can be made by applying a current to the second pad 102B and the third pad 102C. 128, whereby the effect of heating the non-display area NA is good. In one embodiment, the second wire 128 further includes a second portion 128B, and the second portion 128B overlaps the third portion 110C of the first wire 110 along the normal direction of the flexible substrate 100 . Thereby, the effect of uniformly heating the anisotropic conductive adhesive (not shown) can be improved. In this embodiment, the display device 10 c further includes an electrode portion 130 , the second insulating layer 116 is located on the second wire 128 , and the electrode portion 130 penetrates through the interlayer dielectric layer 118 and the second insulating layer 116 to electrically connect with the second wire 128 . sexual connection.

FIG. 12 is a schematic top view of a display device 10d according to another embodiment of the present invention. FIG. 13 is a schematic cross-sectional view along the line 13-13' in FIG. 12. The difference between the display device 10d and the display device 10b in FIG. 8 is that the pads 102 of the display device 10d further include a fourth pad 102D. The wire structure 108 further includes a third wire 132, and the fourth pad 102D and the third wire 132 are located on the non-display area NA. The display device 10d further includes the electrode portion 134 . For example, the fourth pad 102D is located between the second pad 102B and the edge of the flexible substrate 100 , the third wire 132 is connected to the wire structure 108 , for example, the third wire 132 is electrically connected through the electrode portion 134 The third wire 132 . In this way, a simple probe can be used to input current to the fourth pad 102D to provide the current of the wire structure 108b, which can facilitate subsequent rework.

FIG. 14 is a schematic top view of a display device 20 according to another embodiment of the present invention, FIG. 15 is a schematic cross-sectional view along the line 15-15' of FIG. 14, and FIG. 16 is a cross-sectional view along the section of FIG. 14. Schematic cross-sectional view of line 16-16'. Please refer to FIGS. 14 , 15 and 16 together, the display device 20 includes a flexible substrate 100 and a plurality of pixel structures PX. The flexible substrate 100 has a display area AA and a non-display area NA, and the non-display area NA is located on one side of the display area AA. The pixel structures PX are located in the display area AA and are arranged in an array.

The display device 20 further includes a plurality of pads 102. The pads 102 are located in the non-display area NA and are arranged along the first direction d1. The pads 102 include a plurality of first pads 102A, and the first pads 102A are electrically connected to the display area. Prime structure PX.

The display device 20 further includes a driving element 300 and an anisotropic conductive adhesive 302, and the driving element 300 is located in the non-display area NA. The driving element 300 includes a base material 304 , a metal circuit layer 306 and a wire structure 308 , and the metal circuit layer 306 and the wire structure 308 are respectively disposed on two opposite surfaces of the base material 304 . For example, the wire structure 308 is located on the front side of the substrate 304 , and the metal circuit layer 306 is located on the back side of the substrate 304 . The metal circuit layer 306 is electrically connected to the first pad 102A for transmitting signals to the first pad 102A.

The wire structure 308 includes a plurality of first wires 310 connected to each other. In one embodiment, the driving element 300 may include a chip 312. When rework is required later, a current may be applied to the first wires 310 through the chip 312 to make the non-display area NA generate heat, thereby causing the anisotropic conductive adhesive 302 below it to be heated. As the temperature increases, it is easy to be separated from the non-display area NA, which reduces damage to the butt pads 102 (eg, the first pads 102A). As a result, the yield rate of heavy industry is high. In addition, since the temperature of the anisotropic conductive adhesive 302 is increased through the wire structure 308 of the driving element 300 , the influence on the elements on the flexible substrate 100 can be reduced.

The driving element 300 further includes a circuit 314, the circuit 314 is located on the front surface of the substrate 304, and the bumps 312a, 312b, 312c of the chip 312 are respectively connected to the circuit 314, the wire structure 308 and the metal circuit layer 306. In one embodiment, the driving element 300 may include an insulating layer 316 and an insulating layer 318 , and the insulating layer 316 is located on the backside of the substrate 304 . In this way, the metal circuit layer 306 can be protected to prevent the metal circuit layer 306 from being damaged due to collision. The insulating layer 318 is located on the wire structure 308 and the line 314 . In this way, the wire structure 308 and the circuit 314 can be protected, and the wire structure 308 can be prevented from being damaged due to collision.

In this embodiment, the top-view shape of the first conducting wire 310 is not a straight line, in other words, it is an irregular shape. For example, the top view shape of the first wire 310 is a sawtooth shape. Since the resistance value is positively related to the length of the object, thereby, the first wire 310 can have an increased resistance value. The first wire 310 in the embodiment of the present invention can achieve the effect of increasing the energy by increasing the resistance value, and the increased energy makes the non-display area NA have a good heating effect. In other embodiments, the top-view shape of the first wire 310 may be an S-shape (see FIG. 5 ), a square shape (see FIG. 6 ), or other special shapes. In other embodiments, the top view shape of the first wire 310 may be a straight line (see FIG. 7 ).

To sum up, in the display device according to an embodiment of the present invention, the wire structure includes a plurality of first wires connected to each other, and the first wires are electrically connected to the second pads. When rework is required later, the first wire can be heated by applying current to the second pad, thereby making the non-display area heat up, so that the temperature of the anisotropic conductive adhesive above it increases and it is easy to separate from the non-display area. , which can reduce the damage of the butt pad. As a result, the yield rate of heavy industry is high.

2-2', 3-3': section line 10, 10a, 10b, 10c, 10d: Display device 9-9', 11-11': section line 13-13', 15-15': Section line 18-18': Section Line 20: Display device 100: Flexible substrate 102: Pad 102A: First pad 102B: Second pad 102C: Third pad 102D: Fourth pad 108: Wire Structure 110: First wire 110A: Part One 110B: Part II 110C: Part Three 111: Connection part 112: The first circuit layer 114: first insulating layer 116: Second insulating layer 118: Interlayer dielectric layer 120: Insulation layer 121: Second circuit layer 122: Signal line 125: Electrode part 126: Alignment mark 128: Second wire 128A: Part 1 128B: Part II 130: Electrode part 132: Third wire 134: Electrode part 200: Drive element 202: Anisotropic Conductive Adhesive 204: Substrate 206: Wire 300: Drive Components 302: Anisotropic conductive adhesive 304: Substrate 306: Metal circuit layer 308: Wire Structure 310: First wire 312: Wafer 312a, 312b, 312c: bumps 314: Line 316: Insulation layer 318: Insulation layer AA: display area BF: buffer layer D: drain d1: first direction d2: the second direction G: gate NA: non-display area PX: pixel structure S: source SL1: The first signal line SL2: The second signal line T: Active element

Various aspects of the present disclosure can be understood by reading the following detailed description and corresponding drawings. It should be noted that various features in the drawings are not drawn to scale according to standard practice in the industry. In fact, the dimensions of the described features may be arbitrarily increased or decreased to facilitate clarity of discussion. FIG. 1 is a schematic top view of a display panel according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view taken along line 2-2' of Fig. 1 . Fig. 3 is a schematic cross-sectional view taken along line 3-3' in Fig. 1 . FIG. 4 is a schematic cross-sectional view of a display device according to an embodiment of the present invention. FIG. 5 is a schematic plan view of the first lead wire. FIG. 6 is a schematic plan view of the first lead wire. FIG. 7 is a schematic plan view of the first lead wire. FIG. 8 is a schematic top view of a display device according to another embodiment of the present invention. Fig. 9 is a schematic cross-sectional view taken along line 9-9' of Fig. 8 . FIG. 10 is a schematic top view of a display device according to another embodiment of the present invention. Fig. 11 is a schematic cross-sectional view taken along line 11-11' of Fig. 10. FIG. 12 is a schematic top view of a display device according to another embodiment of the present invention. Fig. 13 is a schematic cross-sectional view taken along line 13-13' of Fig. 12 . FIG. 14 is a schematic top view of a display device according to another embodiment of the present invention. Fig. 15 is a schematic cross-sectional view taken along line 15-15' of Fig. 14 . Fig. 16 is a schematic cross-sectional view taken along line 16-16' of Fig. 14 .

Domestic storage information (please note in the order of storage institution, date and number) none Foreign deposit information (please note in the order of deposit country, institution, date and number) none

2-2', 3-3': section line

10: Display device

100: Flexible substrate

102: Pad

102A: First pad

102B: Second pad

108: Wire Structure

110: First wire

110A: Part One

110B: Part II

111: Connection part

122: Signal line

126: Alignment mark

AA: display area

D: drain

d1: first direction

d2: the second direction

G: gate

NA: non-display area

PE: pixel electrode

PX: pixel structure

S: source

SL1: The first signal line

SL2: The second signal line

T: Active element

Claims (10)

A display device, comprising: a flexible substrate having a display area and a non-display area, wherein the non-display area is located on one side of the display area; a plurality of pixel structures located in the display area and arranged in an array; a wire structure located in the non-display area; and a plurality of pads located in the non-display area and arranged along a direction, wherein the pads include a plurality of first pads and a second pad, the first pads are electrically connected to the pixel structures , the wire structure includes a plurality of first wires connected to each other, and the first wires are electrically connected to the second pad. The display device of claim 1, wherein the first wires have a first portion located between two adjacent first pads, and an edge of the flexible substrate and the second pad between a second part. The display device of claim 2, further comprising: A first insulating layer is located in the non-display area, wherein the first insulating layer is located on the first wires, and the pads are located on the first insulating layer. The display device of claim 3, wherein the pads further comprise a third pad, the wire structure further comprises a plurality of second wires on the first insulating layer, the second wires are electrically connected to the third pad, and the second wires include: A first portion overlaps the first portion of the first wires along the normal direction of the flexible substrate. The display device of claim 4, wherein the first wires further include a third portion, and the third portion overlaps the first pads in the normal direction of the flexible substrate. The display device of claim 5, wherein the second wires further comprise: A second portion overlaps the third portion of the first wires along the normal direction of the flexible substrate. The display device according to claim 1, wherein the material of the wire structure comprises polysilicon or indium tin oxide. The display device of claim 1, further comprising: a driving element located in the non-display area and electrically connected to the pads; and An anisotropic conductive adhesive is located between the driving element and the pads. A display device, comprising: a flexible substrate having a display area and a non-display area, wherein the non-display area is located on one side of the display area; a plurality of pixel structures located in the display area and arranged in an array; a plurality of pads located in the non-display area and arranged along a direction, wherein the pads include a plurality of first pads, the first pads are electrically connected to the pixel structures; and A driving element located in the non-display area, wherein the driving element includes a substrate, a metal circuit layer and a wire structure, the metal circuit layer and the wire structure are respectively disposed on two opposite surfaces of the substrate, the metal circuit layer In electrical connection with the first pads, the wire structure includes a plurality of first wires connected to each other. The display device according to claim 9, wherein the top-view shape of the first wires is non-linear.

Images