TWI758450B - 黏著片及積層體的製造方法 - Google Patents

黏著片及積層體的製造方法 Download PDF

Info

Publication number
TWI758450B
TWI758450B TW107110702A TW107110702A TWI758450B TW I758450 B TWI758450 B TW I758450B TW 107110702 A TW107110702 A TW 107110702A TW 107110702 A TW107110702 A TW 107110702A TW I758450 B TWI758450 B TW I758450B
Authority
TW
Taiwan
Prior art keywords
group
resin
adhesive sheet
molecular adhesive
molecular
Prior art date
Application number
TW107110702A
Other languages
English (en)
Chinese (zh)
Other versions
TW201842119A (zh
Inventor
中山秀一
上村和恵
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201842119A publication Critical patent/TW201842119A/zh
Application granted granted Critical
Publication of TWI758450B publication Critical patent/TWI758450B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW107110702A 2017-03-30 2018-03-28 黏著片及積層體的製造方法 TWI758450B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017066676 2017-03-30
JP2017-066676 2017-03-30

Publications (2)

Publication Number Publication Date
TW201842119A TW201842119A (zh) 2018-12-01
TWI758450B true TWI758450B (zh) 2022-03-21

Family

ID=63677990

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107110702A TWI758450B (zh) 2017-03-30 2018-03-28 黏著片及積層體的製造方法

Country Status (5)

Country Link
JP (1) JP6605779B2 (fr)
KR (1) KR102314239B1 (fr)
CN (1) CN110461975B (fr)
TW (1) TWI758450B (fr)
WO (1) WO2018181518A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023080183A1 (fr) * 2021-11-05 2023-05-11
TW202342272A (zh) 2022-04-18 2023-11-01 輝能科技股份有限公司 輔助膜

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009101672A (ja) * 2007-10-26 2009-05-14 Toppan Cosmo Inc 内部にエンボス凹部を有する化粧シート
CN103080257A (zh) * 2010-09-30 2013-05-01 森邦夫 接合方法、粘接性提高剂、表面改性方法、表面改性剂及新化合物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3124995B2 (ja) * 1996-05-29 2001-01-15 日東電工株式会社 粘着剤表面官能基修飾法
JP2001139809A (ja) * 1999-11-17 2001-05-22 Hitachi Chem Co Ltd 耐熱性樹脂組成物、これを用いた接着剤フィルム及び接着剤付ポリイミドフィルム
US6632872B1 (en) * 2000-09-19 2003-10-14 3M Innovative Properties Company Adhesive compositions including self-assembling molecules, adhesives, articles, and methods
JP2005350650A (ja) * 2004-05-14 2005-12-22 Nitto Denko Corp 剥離ライナー及びそれを用いた感圧性接着テープ又はシート
US8080604B2 (en) * 2007-03-02 2011-12-20 Lintec Corporation Adhesive containing ladder-type polysilsesquioxane and adhesive sheet
EP1978024A1 (fr) * 2007-04-04 2008-10-08 Atotech Deutschland Gmbh Compositions de silane comprenant de nouveaux agents de réticulation
JP5191192B2 (ja) * 2007-08-31 2013-04-24 三協化成株式会社 分子接着剤、架橋反応性固体表面及び該架橋反応性固体表面の製造方法
JP5302309B2 (ja) 2008-06-16 2013-10-02 株式会社いおう化学研究所 積層体及び回路配線基板
KR101176954B1 (ko) * 2010-07-20 2012-08-30 한국과학기술연구원 플라스틱-유/무기 하이브리드 접착 필름 및 그 제조 방법
WO2013080925A1 (fr) * 2011-11-29 2013-06-06 東レ株式会社 Procédé de fabrication d'un film de protection de surface, et appareil de fabrication et film de protection de surface
TW201402741A (zh) * 2012-04-17 2014-01-16 Lintec Corp 接著劑組合物、接著板片及半導體裝置之製造方法
CN104349848B (zh) * 2012-06-11 2016-01-20 森邦夫 表面处理方法、表面处理剂及新型化合物
JP6497063B2 (ja) * 2014-12-22 2019-04-10 日本ゼオン株式会社 複層フィルム及びその製造方法、並びに偏光板
JP6639817B2 (ja) * 2015-06-29 2020-02-05 株式会社朝日Ｆｒ研究所 弾性基材接着体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009101672A (ja) * 2007-10-26 2009-05-14 Toppan Cosmo Inc 内部にエンボス凹部を有する化粧シート
CN103080257A (zh) * 2010-09-30 2013-05-01 森邦夫 接合方法、粘接性提高剂、表面改性方法、表面改性剂及新化合物

Also Published As

Publication number Publication date
JPWO2018181518A1 (ja) 2019-12-12
TW201842119A (zh) 2018-12-01
CN110461975B (zh) 2021-12-24
KR20190129066A (ko) 2019-11-19
WO2018181518A1 (fr) 2018-10-04
CN110461975A (zh) 2019-11-15
KR102314239B1 (ko) 2021-10-18
JP6605779B2 (ja) 2019-11-20

Similar Documents

Publication Publication Date Title
TWI772395B (zh) 黏著片及積層體的製造方法
JP5255502B2 (ja) 偏光板の製造装置および製造方法、ならびに該製造方法によって得られる偏光板および光学積層体
TWI758450B (zh) 黏著片及積層體的製造方法
JP7080180B2 (ja) ガスバリア性積層シート、ガスバリア性積層シートの製造方法、及び電子部材又は光学部材
JP6400430B2 (ja) シリコーンコート層用硬化性組成物およびシリコーンコートシート
TWI772394B (zh) 黏著片及積層體的製造方法
JP4861036B2 (ja) 剥離シートおよびその製造方法
JP4914241B2 (ja) 剥離シートおよび粘着体
WO2007094163A1 (fr) Feuille adhesive sensible a la pression destinee au marquage d'une automobile
JP4317827B2 (ja) 高離型性シリコーンゴムロールおよびその製造方法
JP7474095B2 (ja) 接着シート、及び接着シートの使用方法
WO2013145475A1 (fr) Feuille anti-adhésive
JP2004022634A (ja) ウエハ支持体及び半導体ウエハの製造方法
JP7138406B2 (ja) 接着剤組成物、接着シート、及び封止体
JP2019506312A (ja) 離型フィルムおよびその製造方法
JP2005205813A5 (fr)
CN112074579A (zh) 可缠绕和冲压的用于选择性uv活化的粘合带
TWI801544B (zh) 接合２個被黏附體的接合方法
JP2023141156A (ja) 包装フィルム用積層体及びその分解方法
TW201410825A (zh) 固定電子零件用膠帶之膠層與結構