TWI758182B - 膜構造體及其製造方法 - Google Patents

膜構造體及其製造方法 Download PDF

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Publication number
TWI758182B
TWI758182B TW110116965A TW110116965A TWI758182B TW I758182 B TWI758182 B TW I758182B TW 110116965 A TW110116965 A TW 110116965A TW 110116965 A TW110116965 A TW 110116965A TW I758182 B TWI758182 B TW I758182B
Authority
TW
Taiwan
Prior art keywords
film
piezoelectric
piezoelectric film
pzt
plane
Prior art date
Application number
TW110116965A
Other languages
English (en)
Chinese (zh)
Other versions
TW202134058A (zh
Inventor
木島健
Original Assignee
日商前進材料科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商前進材料科技股份有限公司 filed Critical 日商前進材料科技股份有限公司
Publication of TW202134058A publication Critical patent/TW202134058A/zh
Application granted granted Critical
Publication of TWI758182B publication Critical patent/TWI758182B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/093—Forming inorganic materials
    • H10N30/097—Forming inorganic materials by sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
TW110116965A 2017-05-26 2017-07-07 膜構造體及其製造方法 TWI758182B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2017/020525 2017-05-26
PCT/JP2017/020525 WO2018216225A1 (ja) 2017-05-26 2017-05-26 膜構造体及びその製造方法

Publications (2)

Publication Number Publication Date
TW202134058A TW202134058A (zh) 2021-09-16
TWI758182B true TWI758182B (zh) 2022-03-11

Family

ID=64396567

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110116965A TWI758182B (zh) 2017-05-26 2017-07-07 膜構造體及其製造方法
TW106122905A TWI728147B (zh) 2017-05-26 2017-07-07 膜構造體及其製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106122905A TWI728147B (zh) 2017-05-26 2017-07-07 膜構造體及其製造方法

Country Status (3)

Country Link
JP (2) JP6881790B2 (ja)
TW (2) TWI758182B (ja)
WO (1) WO2018216225A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7421710B2 (ja) 2019-04-03 2024-01-25 Ｉ－ＰＥＸ Ｐｉｅｚｏ Ｓｏｌｕｔｉｏｎｓ株式会社 膜構造体
CN117643204A (zh) * 2021-07-12 2024-03-01 富士胶片株式会社 压电膜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103733366A (zh) * 2011-08-08 2014-04-16 松下电器产业株式会社 压电体元件
JP2016042505A (ja) * 2014-08-14 2016-03-31 株式会社ユーテック 強誘電体セラミックス及びその製造方法
TW201707970A (zh) * 2015-03-02 2017-03-01 三井化學股份有限公司 膜捲層體及其製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3728465B2 (ja) * 1994-11-25 2005-12-21 株式会社神戸製鋼所 単結晶ダイヤモンド膜の形成方法
CN100421275C (zh) * 2002-05-15 2008-09-24 精工爱普生株式会社 压电致动器及液体喷头
JP2008042069A (ja) * 2006-08-09 2008-02-21 Matsushita Electric Ind Co Ltd 圧電体素子とその製造方法
JP2008218620A (ja) * 2007-03-02 2008-09-18 Matsushita Electric Ind Co Ltd 圧電体薄膜素子、圧電体薄膜素子の製造方法、インクジェットヘッド、およびインクジェット式記録装置
JP6347086B2 (ja) 2014-02-18 2018-06-27 アドバンストマテリアルテクノロジーズ株式会社 強誘電体セラミックス
US20170158571A1 (en) * 2014-07-16 2017-06-08 Youtec Co., Ltd. Ferroelectric ceramics and manufacturing method of same
JP6596634B2 (ja) 2014-10-23 2019-10-30 アドバンストマテリアルテクノロジーズ株式会社 強誘電体セラミックス、電子部品及び強誘電体セラミックスの製造方法
JP6488468B2 (ja) * 2014-12-26 2019-03-27 アドバンストマテリアルテクノロジーズ株式会社 圧電膜及び圧電セラミックス
JP6814915B2 (ja) * 2015-09-18 2021-01-20 アドバンストマテリアルテクノロジーズ株式会社 強誘電体メモリ及びその製造方法、強誘電体膜及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103733366A (zh) * 2011-08-08 2014-04-16 松下电器产业株式会社 压电体元件
JP2016042505A (ja) * 2014-08-14 2016-03-31 株式会社ユーテック 強誘電体セラミックス及びその製造方法
TW201707970A (zh) * 2015-03-02 2017-03-01 三井化學股份有限公司 膜捲層體及其製造方法

Also Published As

Publication number Publication date
JP7307302B2 (ja) 2023-07-12
TW202134058A (zh) 2021-09-16
JP2021121026A (ja) 2021-08-19
WO2018216225A1 (ja) 2018-11-29
JP6881790B2 (ja) 2021-06-02
TW201900415A (zh) 2019-01-01
JPWO2018216225A1 (ja) 2020-05-21
TWI728147B (zh) 2021-05-21

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