TWI757407B - Method and apparatus for coating substrate - Google Patents
Method and apparatus for coating substrate Download PDFInfo
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- TWI757407B TWI757407B TW107101558A TW107101558A TWI757407B TW I757407 B TWI757407 B TW I757407B TW 107101558 A TW107101558 A TW 107101558A TW 107101558 A TW107101558 A TW 107101558A TW I757407 B TWI757407 B TW I757407B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/112—Deposition methods from solutions or suspensions by spraying
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Abstract
Description
本發明係關於在同時開始進行使噴嘴之移動及塗佈液自噴嘴之吐出之情形時,可容易地使自開始塗佈之數秒鐘之期間之塗膜厚度儘可能地一定,而使基板之利用面積不會減少之基板之塗佈方法及基板之塗佈裝置。 The present invention relates to the fact that, when the movement of the nozzle and the discharge of the coating liquid from the nozzle are simultaneously started, the thickness of the coating film during a period of several seconds from the start of the coating can be easily made constant as much as possible, so that the substrate can be A method for coating a substrate and a coating apparatus for a substrate using a substrate that does not reduce the area.
於對玻璃製等之基板塗佈塗佈液之平台式塗佈機(table coater)等之塗佈裝置中,雖可將塗佈液以均勻之塗膜厚度(膜厚分佈之容許誤差為1微米以下之單位)塗佈於基板整體,但由於自噴嘴開始進行塗佈液之吐出至塗佈液之吐出流量一定為止,有數秒鐘之時間延遲,噴嘴在該期間內所移動之範圍之塗膜厚度會變薄,而無法作為產品加以利用,因此會自基板切除並加以廢棄。因此,追求不會使基板之利用面積減少之方法,而作為用於其對策之塗佈裝置與塗佈方法,已知有專利文獻1至4。 In a coating device such as a table coater that coats a coating liquid on a substrate made of glass, etc., although the coating liquid can be applied to a uniform coating film thickness (the tolerance of the film thickness distribution is 1 Units below microns) are applied to the entire substrate, but there is a time delay of several seconds from the start of the nozzle to discharge the coating liquid until the discharge flow rate of the coating liquid is constant, and the coating is applied to the range of the nozzle moved during this period. The thickness of the film is reduced and it cannot be used as a product, so it is removed from the substrate and discarded. Therefore, the method which does not reduce the utilization area of a board|substrate is requested|required, and patent documents 1 - 4 are known as a coating apparatus and a coating method for the countermeasure.
專利文獻1之「基板用塗佈裝置」,其課題在於可即時地以高精度來調整基板表面之塗佈液之塗佈量,而可減少於開始塗佈時及塗佈結束時所產生之膜厚不均勻區域,且基板用塗佈裝置具備有狹縫噴嘴、第1相機、第2相機、控制部、泵、及調壓腔室。控制部根據第1相機所拍攝之珠粒形狀與基準形狀之比較結果來控 制塗佈液自泵朝向狹縫噴嘴之供給量。又,控制部根據自第2相機所拍攝之圖像測量之距離與基準距離之比較結果而利用調壓腔室來控制狹縫噴嘴之上游側之氣壓。 The subject of the "coating device for substrates" of
專利文獻2之「藥液之塗佈方法及裝置」,其課題在於在將自狹縫吐出之藥劑塗佈於進行相對移動之基板之表面之基本構成中,包含開始塗佈時及塗佈結束時,要能整體地抑制膜厚之變動而均勻地塗佈藥液,且於自平行地並排配置有相對於進行相對移動之基板後行之第1狹縫及先行之第2狹縫之噴嘴對基板進行藥液之塗佈時,藉由以於開始塗佈時首先進行藥液自第1狹縫之吐出,接著進行藥液自第2狹縫之吐出之方式進行控制,來抑制藥液之開始塗佈時之隆起,而使基板上之面內膜厚均勻化。 The subject of "Method and Apparatus for Applying a Chemical Solution" in
專利文獻3之「塗佈裝置及塗佈方法」具備有:塗佈液供給源,其藉由將塗佈液加壓,朝向塗佈液供給系統擠出而進行供給;噴嘴,其係連接於塗佈液供給系統,而進行塗佈處理;注射泵,其係設置於塗佈液供給系統,且內部被充滿塗佈液,並僅於開始進行塗佈處理時將塗佈液吐出而供給至噴嘴,另一方面,於停止塗佈液朝向噴嘴之供給時,抑制自塗佈液供給源朝向噴嘴被傳遞之壓力的變化;注射泵填充用開關閥,其僅於對注射泵供給塗佈液時被關閉;及開關閥,其於利用注射泵開始進行塗佈處理時被關閉,而於朝向注射泵供給塗佈液時、以及對應於為了朝向噴嘴供給塗佈液而停止注射泵之塗佈液之供給被打開。 The "coating apparatus and coating method" of
專利文獻4之「塗佈裝置」,其課題在於在使用模頭(die head)之塗佈裝置中,減小於開始塗佈時會產生之膜厚不足區域,而於具備有將基材保持並加以移動之夾頭台,對基板塗佈塗佈 液之塗佈用模頭、以及以對模頭供給塗佈液之方式被連結之配管及泵之塗佈裝置中,設為如下之構成:在接近於模頭之位置之配管設置將到泵為止之配管內保持為所期望之壓力之背壓閥,並隨時對配管內施加適當之壓力,而於泵之作動開始時使吐出壓迅速地上升,而可在短時間內便確保所期望之吐出量。 In the "coating device" of
[專利文獻1]日本再公表專利2010/106979號公報 [Patent Document 1] Japanese Patent Publication No. 2010/106979
[專利文獻2]日本專利特開平11-179262號公報 [Patent Document 2] Japanese Patent Laid-Open No. 11-179262
[專利文獻3]日本專利特開2016-87601號公報 [Patent Document 3] Japanese Patent Laid-Open No. 2016-87601
[專利文獻4]日本專利特開2004-50026號公報 [Patent Document 4] Japanese Patent Laid-Open No. 2004-50026
專利文獻1存在有如下之課題:需具備拍攝珠粒形狀之第1相機與拍攝用於氣壓控制之圖像之第2相機,並且需具備進行圖像處理等複雜之處理之控制部,而使設備大型化且成本變高。
專利文獻2雖將第1及第2狹縫設置於噴嘴,並自該等狹縫依序吐出藥液來抑制開始塗佈時之藥液之隆起,但於自第1狹縫之開始吐出時,無法避免液膜厚度產生不均勻之情形。 In
專利文獻3雖僅於開始進行塗佈處理時利用注射泵朝向噴嘴供給塗佈液,藉此精密地控制開始塗裝時之吐出量,但自注射泵切換為塗佈液供給源之開關閥之開關時機之調整困難,而難以自開始塗佈時便確保一定之塗膜厚度。
專利文獻4雖於模頭附近設置背壓閥來使模頭之吐出壓之上升迅速化,但即便上述構成,塗佈液自模頭被擠出之瞬間亦存在阻力,到塗佈液被穩定地吐出為止需要數秒鐘,而難以自開始塗佈時便確保一定之塗膜厚度。 In
對如上所述之課題,雖可對平台式塗佈機輸入開始塗佈時之噴嘴移動速度或吐出流量等之控制模式之經驗值,來對基板進行試塗佈,並對其進行膜厚測量,而根據測量結果來找出最適當之控制模式,但難以藉由一次的試塗佈便得到最佳之控制模式,故該試塗佈及膜厚測量作業必須重複地進行許多次。因該重複作業所造成之塗佈液、試塗佈用之基板、及作業時間之損失之累積,相當地困擾。 For the above-mentioned problem, although the experience value of the control mode such as the nozzle moving speed or discharge flow rate at the start of coating can be input to the flat-bed coater, the substrate can be tested for coating, and the film thickness can be measured. , and find the most appropriate control mode according to the measurement results, but it is difficult to obtain the best control mode by one trial coating, so the trial coating and film thickness measurement must be repeated many times. The accumulation of the coating liquid, the substrate for trial coating, and the loss of working time caused by the repeated operation is quite troublesome.
而且,於製造步驟中,除了每當進行塗佈之塗佈液之成分或黏度要變更時會進行試塗,並且於使用新的塗佈液之情形時,還必須毫無依據地以摸索之狀態重複地進行試塗。此外,即便使用相同成分之塗佈液由於亦會隨時間經過而變質,因此原先所取得之最佳塗佈模式,幾天後便無法再加以應用,必須再次重新地進行上述重複作業,而使塗佈作業需要花費相當多之工時。 Furthermore, in the manufacturing process, in addition to performing trial coating every time the composition or viscosity of the coating liquid to be applied is changed, and when a new coating liquid is used, it is necessary to grope for it without any basis. The state is repeatedly tested. In addition, even if the coating liquid of the same composition is used, it will deteriorate over time, so the best coating mode obtained before can not be applied again after a few days, and the above-mentioned repeated operation must be performed again, so that the The coating operation requires considerable man-hours.
因此,要求能提出於自開始塗佈至塗佈液之吐出穩定而可以一定之塗膜厚度進行塗佈為止之期間,可使塗膜厚度一定,從而使基板之利用面積不會減少之發明。 Therefore, there is a demand for an invention that can make the thickness of the coating film constant during the period from the start of coating until the discharge of the coating liquid is stabilized and coating can be performed with a constant coating film thickness, so that the usable area of the substrate is not reduced.
本發明係鑒於上述習知之課題而提案者,其目的在於提供在同時開始進行噴嘴之移動及塗佈液自噴嘴之吐出之情形時,可容易地使自開始塗佈的數秒鐘之期間之塗膜厚度儘可能地一定,而使基板之利用面積不會減少之基板之塗佈方法及基板之塗佈 裝置。 The present invention has been proposed in view of the above-mentioned conventional problems, and an object of the present invention is to provide a situation in which the movement of the nozzle and the discharge of the coating liquid from the nozzle are simultaneously started, so that the coating can be easily made for a period of several seconds from the start of the coating. The film thickness is fixed as much as possible, and the substrate coating method and the substrate coating device can not reduce the utilization area of the substrate.
本發明之基板之塗佈方法,其特徵在於同時開始進行吐出塗佈液之噴嘴之移動與塗佈液自該噴嘴之吐出,並於對基板塗佈塗佈液時,使上述噴嘴之移動速度逐漸地增加,而使該基板每單位面積之塗佈液量成為一定。 The method for coating a substrate according to the present invention is characterized in that the movement of the nozzle for discharging the coating liquid and the discharging of the coating liquid from the nozzle are simultaneously started, and when the coating liquid is applied to the substrate, the moving speed of the nozzle is adjusted to Gradually increase the amount of the coating liquid per unit area of the substrate to be constant.
本發明之基板之塗佈方法,其特徵在於使用與由壓力感測器所測量之吐出流量對應之測量壓力值,而該壓力感測器測量與每單位時間塗佈液自上述噴嘴之吐出流量相關之塗佈液的供給壓力,於自塗佈液之吐出開始至上述測量壓力值達到與設定吐出流量對應之既定壓力值為止之期間,使該噴嘴之移動速度對應於該測量壓力值之上升而增速。 The substrate coating method of the present invention is characterized by using a measured pressure value corresponding to the discharge flow rate measured by a pressure sensor, and the pressure sensor measures the discharge flow rate of the coating liquid from the nozzle per unit time. The supply pressure of the relevant coating liquid is made so that the moving speed of the nozzle corresponds to the increase of the measured pressure value during the period from the start of the discharge of the coating liquid until the above-mentioned measured pressure value reaches the predetermined pressure value corresponding to the set discharge flow rate. And the growth rate.
本發明之基板之塗佈方法,其特徵在於使用與由壓力感測器所測量之吐出流量對應之測量壓力值Pt,而該壓力感測器測量與每單位時間塗佈液自上述噴嘴之吐出流量相關之塗佈液的供給壓力,於使上述噴嘴以設定移動速度Vc移動並且以與設定吐出流量對應之既定壓力值Pc吐出塗佈液而對上述基板塗佈塗佈液之情形時,利用下式來算出於自塗佈液之吐出開始至上述測量壓力值Pt達到上述既定壓力值Pc為止之期間相對於該測量壓力值Pt之該噴嘴之移動速度Vt:Pt:Vt=Pc:Vc(其中,0≦Pt≦Pc)...(1)。 The substrate coating method of the present invention is characterized by using a measured pressure value Pt corresponding to a discharge flow rate measured by a pressure sensor that measures the discharge of the coating liquid from the nozzle per unit time. The supply pressure of the coating liquid related to the flow rate is used when the nozzle is moved at the set moving speed Vc and the coating liquid is discharged at a predetermined pressure value Pc corresponding to the set discharge flow rate to apply the coating liquid to the substrate. The moving speed Vt of the nozzle relative to the measured pressure value Pt during the period from the start of the discharge of the coating liquid until the measured pressure value Pt reaches the predetermined pressure value Pc is calculated by the following formula: Pt: Vt=Pc: Vc ( Among them, 0≦Pt≦Pc)...(1).
本發明之基板之塗佈方法,其特徵在於在對上述基板塗佈塗佈液前之準備時,自上述噴嘴吐出塗佈液並利用上述壓力感測器來測量上述期間之上述供給壓力,其次,以使用上述式(1)而根 據與自該壓力感測器所輸出之吐出流量對應之上述測量壓力值Pt所算出之移動速度Vt使上述噴嘴移動而對上述基板塗佈塗佈液。 The method for coating a substrate according to the present invention is characterized in that, in preparation for applying the coating liquid to the substrate, the coating liquid is discharged from the nozzle and the pressure sensor is used to measure the supply pressure during the period, and then The coating liquid is applied to the substrate by moving the nozzle at the moving speed Vt calculated from the measured pressure value Pt corresponding to the discharge flow rate output from the pressure sensor using the formula (1).
本發明之基板之塗佈方法,其特徵在於取代移動上述噴嘴而使上述基板移動。 The method for coating a substrate of the present invention is characterized in that the substrate is moved instead of moving the nozzle.
本發明之基板之塗佈裝置係被使用於上述基板之塗佈方法者,其特徵在於具備有:上述噴嘴,其一面移動一面將塗佈液吐出並塗佈於上述基板;上述壓力感測器,其測量與每單位時間塗佈液自該噴嘴之吐出流量相關之塗佈液的上述供給壓力並輸出與吐出流量對應之上述測量壓力值;及演算控制器,其使用上述式(1)而根據自該壓力感測器所輸入之上述測量壓力值,來算出上述噴嘴之移動速度並將其輸出至該噴嘴。 The apparatus for coating a substrate according to the present invention, which is used in the coating method for the substrate, is characterized by comprising: the nozzle for discharging and coating the coating liquid on the substrate while moving; the pressure sensor , which measures the above-mentioned supply pressure of the coating liquid related to the discharge flow rate of the coating liquid per unit time from the nozzle and outputs the above-mentioned measured pressure value corresponding to the discharge flow rate; and an arithmetic controller, which uses the above-mentioned formula (1) and Based on the measured pressure value input from the pressure sensor, the moving speed of the nozzle is calculated and output to the nozzle.
於本發明之基板之塗佈方法及基板之塗佈裝置中,在同時開始進行噴嘴之移動及塗佈液自噴嘴之吐出之情形時,可以容易且簡單之構成使自開始塗佈的數秒鐘之期間之塗膜厚度儘可能地一定,而可使基板之利用面積不會變少。 In the substrate coating method and substrate coating apparatus of the present invention, when the movement of the nozzle and the discharge of the coating liquid from the nozzle are simultaneously started, the configuration can be easily and simply made several seconds from the start of coating. During the period, the thickness of the coating film is as constant as possible, so that the utilization area of the substrate will not be reduced.
1‧‧‧塗佈裝置 1‧‧‧Coating device
2‧‧‧基台 2‧‧‧Abutment
3‧‧‧噴嘴 3‧‧‧Nozzle
3a‧‧‧腔室 3a‧‧‧chamber
4‧‧‧供給配管 4‧‧‧Supply piping
5‧‧‧槽 5‧‧‧Slot
6‧‧‧三向閥 6‧‧‧Three-way valve
7‧‧‧注射泵 7‧‧‧Syringe pump
7a‧‧‧馬達 7a‧‧‧motor
7b‧‧‧活塞 7b‧‧‧Piston
7c‧‧‧汽缸 7c‧‧‧Cylinder
8‧‧‧基板 8‧‧‧Substrate
9‧‧‧壓力感測器 9‧‧‧Pressure sensor
10‧‧‧演算控制器 10‧‧‧Calculation Controller
11‧‧‧塗佈液回收容器 11‧‧‧Coating liquid recovery container
12‧‧‧氣密槽 12‧‧‧Airtight groove
13‧‧‧開關閥 13‧‧‧On-off valve
14‧‧‧空氣導入配管 14‧‧‧Air inlet piping
15‧‧‧開關閥 15‧‧‧On-off valve
D‧‧‧塗佈液 D‧‧‧Coating liquid
Pc‧‧‧與設定吐出流量對應之既定壓力值 Pc‧‧‧The preset pressure value corresponding to the set discharge flow rate
Pt‧‧‧與吐出流量對應之測量壓力值 Pt‧‧‧Measured pressure value corresponding to discharge flow
P1‧‧‧第1埠口 P1‧‧‧
P2‧‧‧第2埠口 P2‧‧‧
P3‧‧‧第3埠口 P3‧‧‧
Vc‧‧‧設定移動速度 Vc‧‧‧Set movement speed
Vt‧‧‧移動速度 Vt‧‧‧movement speed
Vt1‧‧‧移動速度 Vt1‧‧‧movement speed
Vt2‧‧‧移動速度 Vt2‧‧‧movement speed
Vt3‧‧‧移動速度 Vt3‧‧‧movement speed
圖1係表示本發明之基板之塗佈方法及基板之塗佈裝置,且作用於噴嘴之塗佈液之供給壓力之測量狀態的概略圖。 FIG. 1 is a schematic diagram showing the measurement state of the supply pressure of the coating liquid acting on the nozzle, and the coating method of the substrate and the coating apparatus of the substrate according to the present invention.
圖2係說明圖1之測量所得到之塗佈液之供給壓力與噴嘴之移動速度之關係的曲線圖。 FIG. 2 is a graph illustrating the relationship between the supply pressure of the coating liquid and the moving speed of the nozzle obtained by the measurement of FIG. 1 .
圖3係表示利用圖1所示之基板之塗佈方法及塗佈裝置對基板塗佈塗佈液之情況的概略圖。 FIG. 3 is a schematic diagram showing a state in which a coating liquid is applied to a substrate using the method for coating the substrate and the coating apparatus shown in FIG. 1 .
圖4係表示圖1及圖3所示之基板之塗佈裝置之變形例,且對基板塗佈塗佈液之情況的概略圖。 FIG. 4 is a schematic view showing a modification of the coating apparatus for the substrate shown in FIGS. 1 and 3 and applying a coating liquid to the substrate.
以下,參照隨附圖式對本發明之基板之塗佈方法及基板之塗佈裝置較佳之實施形態詳細地說明。圖1係表示本實施形態之基板之塗佈方法及基板之塗佈裝置,且作用於噴嘴之塗佈液之供給壓力之測量狀態的概略圖,圖2係說明圖1之測量所得到之塗佈液之供給壓力與噴嘴之移動速度之關係的曲線圖,而圖3係表示利用圖1所示之基板之塗佈方法及塗佈裝置對基板塗佈塗佈液之情況的概略圖。 Hereinafter, the preferred embodiments of the substrate coating method and the substrate coating apparatus of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a schematic diagram showing the state of measurement of the supply pressure of the coating liquid applied to the nozzle for the coating method of the substrate and the coating apparatus for the substrate according to the present embodiment, and FIG. 2 illustrates the coating obtained by the measurement in FIG. 1 . Fig. 3 is a graph showing the relationship between the supply pressure of the liquid distribution and the moving speed of the nozzle, and Fig. 3 is a schematic diagram showing a situation in which the coating liquid is applied to the substrate using the substrate coating method and the coating apparatus shown in Fig. 1 .
如圖1所示,本實施形態之基板之塗佈裝置1具備有:噴嘴3,其係移動自如地被設置於基台2上方,而吐出塗佈液D;供給配管4,其係連接於噴嘴3,用以對噴嘴3供給塗佈液D;及槽5,其係連接於供給配管4,而貯存有朝供給配管4被流通之塗佈液D。 As shown in FIG. 1 , a
於本實施形態中,於供給配管4設置有三向閥6,該三向閥6於槽5側連接有第1埠口P1,且第3埠口P3被連接於噴嘴3側。於三向閥6之第2埠口P2連接有注射泵7。注射泵7抽吸被貯存於槽5之塗佈液D,並對所抽吸之塗佈液D進行流量控制而將其朝向噴嘴3送出。 In the present embodiment, the
三向閥6於注射泵7抽吸塗佈液D時,第1埠口P1與第2埠口P2在第3埠口P3被關閉之狀態下相連通。又,三向閥6於注射泵7送出塗佈液D時,第2埠口P2與第3埠口P3在第1埠口P1被關閉之狀態下相連通。藉此,槽5之塗佈液D係藉由注 射泵7之作動被供給至噴嘴3。 When the three-way valve 6 sucks the coating liquid D by the
再者,該動作除了使用1個三向閥6以外,亦可以能得到相同功能之方式組合2個二向閥之形式來實現。 Furthermore, in addition to using one three-way valve 6, this action can also be realized by combining two two-way valves so that the same function can be obtained.
注射泵7具有藉由馬達7a而以精密之衝程所驅動之活塞7b,而於抽吸塗佈液D時,使塗佈液D無間隙地被充滿於該汽缸7c內,並於送出塗佈液D時,以較高之供給量控制精度將塗佈液D供給至噴嘴3。塗佈液D亦可為高黏度者等任何種類。 The
此外,如圖3所示,於對基板8塗佈塗佈液D時,基板8被設置於基台2上表面,噴嘴3相對於該基板8被相對移動,自噴嘴3所吐出之塗佈液D便被塗佈於基板8。 In addition, as shown in FIG. 3 , when the coating liquid D is applied to the
在同時開始進行噴嘴3之移動與塗佈液D自該噴嘴3之吐出而將自噴嘴3所吐出之塗佈液D塗佈於基板8時,如上所述般,於自開始塗佈時至塗佈液D之吐出穩定為止之期間(初始階段),難以得到一定之塗膜厚度,其後,若塗佈液D之吐出穩定(穩定階段),便可以一定之塗膜厚度進行塗佈。 When the movement of the
詳細而言,由於在穩定階段,塗佈液D以一定之供給壓力被供給至噴嘴3,藉此使塗佈液D自噴嘴3以一定流量被吐出,因此若使噴嘴3以一定之移動速度移動,基板8每單位面積之塗佈液量便會成為一定,其結果,可得到一定之塗膜厚度。 In detail, in the stable stage, the coating liquid D is supplied to the
相對於此,由於在初始階段,即便對噴嘴3供給塗佈液D之供給壓力產生變化(逐漸地增加),自噴嘴3所吐出之塗佈液D無法成為一定流量,亦使噴嘴3同時移動,因此難以得到一定之塗膜厚度。 On the other hand, even if the supply pressure for supplying the coating liquid D to the
本實施形態之基板之塗佈方法及塗佈裝置,係設為於 初始階段能儘可能地得到一定之塗膜厚度者。 The coating method and coating apparatus for the substrate of the present embodiment are set so as to obtain a constant coating film thickness as much as possible in the initial stage.
於如上述般以一定之塗膜厚度將塗佈液D塗佈於基板8之情形時,必須使基板8每單位面積之塗佈液量一定。朝向基板8之塗佈液量,雖只要控制、管理塗佈液D自噴嘴3之吐出流量即可,但極難利用流量計等來精密地控制、管理塗佈液D自噴嘴3之吐出流量。 In the case where the coating liquid D is applied to the
本案發明人等發現且確認到即便現有設備,塗佈液D自噴嘴3之吐出流量、具體而言每單位時間塗佈液D自噴嘴3之吐出流量亦與作用於噴嘴3之塗佈液D之供給壓力有充分之關連性,並著眼於可藉由利用後述之壓力感測器9測量該供給壓力,來控制、管理塗佈液D自噴嘴3之吐出流量,從而完成本發明。 The inventors of the present application discovered and confirmed that even with the existing equipment, the discharge flow rate of the coating liquid D from the
於將塗佈液D塗佈於基板8時,存在有如下之情形:相對於可得到一定之塗膜厚度之穩定階段,在塗佈液D自噴嘴3之吐出流量被設定(設定吐出流量)(決定與設定吐出流量對應之供給壓力之既定壓力值Pc(上限值))之同時,設定移動速度Vc(上限值)被設定為噴嘴3之移動速度之情形(下述之第1實施例);僅供給壓力考量與設定吐出流量對應之既定壓力值Pc(上限值),噴嘴3以達到與設定吐出流量對應之既定壓力值Pc時之移動速度作為一定之移動速度被移動之情形(下述之第2實施例);及不考量與設定吐出流量對應之既定壓力值Pc,噴嘴3以供給壓力成為一定時之一定供給壓力,而且將達到一定供給壓力時之移動速度作為一定之移動速度被移動之情形(下述之第3實施例)。 When the coating liquid D is applied to the
第1實施例係設定吐出流量及設定移動速度Vc被分別設定為塗佈液D之吐出流量及噴嘴3之移動速度分別設定之情形。設定吐出流量存在有對應於與其對應之設定吐出流量之既定壓力值Pc,且對應於該設定吐出流量之既定壓力值Pc係作為與吐出流量對應之測量壓力值Pt而由壓力感測器9所測量。
The first embodiment is a case where the set discharge flow rate and the set moving speed Vc are respectively set as the discharge flow rate of the coating liquid D and the moving speed of the
本實施形態之基板之塗佈方法及塗佈裝置具備有:壓力感測器9(參照圖1),其測量塗佈液D之供給壓力;及筆記型電腦等之演算控制器10(參照圖3),其輸入與由壓力感測器9所測量之吐出流量對應之測量壓力值Pt,算出噴嘴3之移動速度Vt,並將所算出之移動速度Vt輸出至噴嘴3來進行該速度控制。
The coating method and coating apparatus for a substrate according to the present embodiment are provided with a pressure sensor 9 (see FIG. 1 ) for measuring the supply pressure of the coating liquid D, and an arithmetic controller 10 (see FIG. 1 ) such as a notebook computer. 3), which inputs the measured pressure value Pt corresponding to the discharge flow rate measured by the
如圖1所示,壓力感測器9測量作用於吐出塗佈液D之噴嘴3之塗佈液D的供給壓力,並將與所測量之吐出流量對應之測量壓力值Pt朝向演算控制器10輸出。亦即,壓力感測器9測量噴嘴3為了吐出塗佈液D而於噴嘴3內部之腔室3a產生之壓力或於供給配管4內部產生之壓力,來作為供給壓力。
As shown in FIG. 1 , the
因此,壓力感測器9被設置於噴嘴3。
Therefore, the
利用壓力感測器9測量供給壓力來取得與吐出流量對應之測量壓力值Pt之作業,係於對基板8塗佈塗佈液D前之塗佈準備時所進行。於塗佈準備時,於噴嘴3正下方之基台2上放置承接盤等之塗佈液回收容器11,或者將噴嘴3移動至離開開基台2之位置而於無基板之狀態下,藉由注射泵7將塗佈液D朝向噴嘴3送出,並利用壓力感測器9來測量至供給壓力成為與設定吐出流量對應之既定壓力值Pc為止之變化。 The operation of measuring the supply pressure with the
與藉由壓力感測器9所得到之吐出流量對應之測量壓力值Pt,自注射泵7之啟動(對應於噴嘴3之移動開始時間點)至供給壓力成為與設定吐出流量對應之既定壓力值Pc為止,隨著時間經過,例如以毫秒單位被依次輸出多數個。此處,所謂對應於吐出流量之測量壓力值Pt,係指自塗佈液D之吐出開始t秒後之測量壓力值。對應於吐出流量之測量壓力值Pt係自壓力感測器9被輸入演算控制器10。 The measured pressure value Pt corresponding to the discharge flow rate obtained by the
演算控制器10使用與隨著時間經過之複數個吐出流量對應之測量壓力值Pt,並利用下式(1)進行演算,來算出噴嘴3之隨著時間經過之複數個移動速度Vt,並將該等加以儲存。而且其次,於基台2載置基板8,並以該所記憶之移動速度Vt來控制噴嘴3之移動。此處,所謂移動速度Vt,係指分別對應於與複數個吐出流量對應之測量壓力值Pt者,且為自塗佈液D之吐出開始t秒後之移動速度。 The
在穩定階段,於以與設定吐出流量對應之既定壓力值Pc(一定)及設定移動速度Vc(一定)對基板8進行塗佈時,基板8每單位面積之塗佈液量係由設定移動速度Vc相對於與設定吐出流量對應之既定壓力值Pc之關係所規定。亦即,設定移動速度Vc相對於與設定吐出流量對應之既定壓力值Pc之值越大(越快),基板8每單位面積之塗佈液量便越減少,而塗膜厚度越薄,相反地,設定移動速度Vc之值越小(越慢),塗佈液量便越增大而使塗膜厚度變厚。於初始階段,該關係亦相同。 In the stabilization stage, when the
因此,初始階段之移動速度Vt相對於與吐出流量對 應之測量壓力值Pt之關係、和穩定階段之設定移動速度Vc相對於與設定吐出流量對應之既定壓力值Pc之關係,可應用以下之式(1)。 Therefore, for the relationship between the moving speed Vt in the initial stage and the measured pressure value Pt corresponding to the discharge flow rate, and the relationship between the set moving speed Vc in the stable stage and the predetermined pressure value Pc corresponding to the set discharge flow rate, the following equations can be applied (1).
Pt:Vt=Pc:Vc(其中,0≦Pt≦Pc)...(1) Pt: Vt=Pc: Vc (wherein, 0≦Pt≦Pc)...(1)
若以初始階段之噴嘴3之移動速度Vt對式(1)進行整理,便成為Vt=(Vc/Pc)×Pt…(2)。 If the formula (1) is arranged with the moving speed Vt of the
上述式(2)之意思為:若初始階段之移動速度Vt相對於與吐出流量對應之測量壓力值Pt為一定之比率(Vc/Pc),基板8每單位面積之塗佈液量便成為一定,而使塗膜厚度被保持為一定。然後,使用由壓力感測器9對初始階段之數秒鐘以毫秒單位所測量之複數個與吐出流量對應之測量壓力值Pt,並藉由式(2)進行演算,藉此算出複數個移動速度Vt(圖2及圖3中,以Vt1、Vt2、Vt3來表示)。 The meaning of the above formula (2) is: if the moving speed Vt in the initial stage is a constant ratio (Vc/Pc) to the measured pressure value Pt corresponding to the discharge flow rate, the amount of coating liquid per unit area of the
例如,於吐出流量Q為100cc/min時之Pc=100kPa、Vc=25mm/s之情形時,於初始階段塗佈液剛自噴嘴3吐出後之Pt=10kPa(Q=10cc/min)時之移動速度Vt被算出為2.5mm/s,而Pt=80kPa(Q=80cc/min)時之移動速度Vt被算出為20mm/s。 For example, when Pc=100kPa and Vc=25mm/s when the discharge flow rate Q is 100cc/min, when Pt=10kPa (Q=10cc/min) immediately after the coating liquid is discharged from the
於利用演算控制器10並根據於準備時1次之吐出可得到之複數個與吐出流量對應之測量壓力值Pt可得到壓力變化之函數f(Pt)來作為試驗式之情形時,如圖2所示,亦可藉由將既定壓力值Pc相對於設定移動速度Vc之比值(Vc/Pc)設為倍率而與該函數f(Pt)相乘,而得到所移動之噴嘴3之速度變化之函數f(Vt)。 When using the
於第1實施例之情形時,上述初始階段可改說法為「自塗佈液D之吐出開始(噴嘴3之移動開始)至與吐出流量對應之 測量壓力值Pt到達對應於設定吐出流量之既定壓力值Pc為止之數秒鐘左右的期間」。然後,結束準備,自正式朝向基板8之塗佈起,於初始階段,根據由演算控制器10所算出之移動速度Vt,並對應於與吐出流量對應之測量壓力值Pt自「0」之值上升地,使噴嘴3之移動速度自速度「0」增速,而只要基板8每單位面積之塗佈液量一定,塗膜厚度便會一定。 In the case of the first embodiment, the above initial stage can be rephrased as “from the start of the discharge of the coating liquid D (the start of the movement of the nozzle 3) until the measured pressure value Pt corresponding to the discharge flow rate reaches a predetermined value corresponding to the set discharge flow rate. The period of several seconds until the pressure value Pc". Then, after finishing the preparation, starting from the actual application to the
經過初始階段,只要與吐出流量對應之測量壓力值Pt成為對應於設定吐出流量之既定壓力值Pc(穩定階段),噴嘴3便以設定移動速度Vc被移動。 After the initial stage, when the measured pressure value Pt corresponding to the discharge flow rate becomes the predetermined pressure value Pc corresponding to the set discharge flow rate (stable stage), the
根據第1實施例之基板之塗佈方法及塗佈裝置,同時開始進行噴嘴3之移動及塗佈液D自該噴嘴3之吐出而於對基板8塗佈塗佈液D之情形時,利用壓力感測器9來測量初始階段之塗佈液D之供給壓力之變化,並對與所測量之吐出流量對應之測量壓力值Pt,應用以下之式(1)Pt:Vt=Pc:Vc(其中,0≦Pt≦Pc)...(1) According to the substrate coating method and coating apparatus of the first embodiment, when the movement of the
由於利用演算控制器10來算出噴嘴3之移動速度Vt,並將所算出之移動速度Vt輸出至噴嘴3而控制初始階段之塗佈,因此可使自開始塗佈之數秒鐘的期間之塗膜厚度儘可能地一定。藉此,可使基板8之利用面積不會減少。 Since the moving speed Vt of the
而且,於將塗佈液D塗佈於基板8之塗佈準備時,使用上述構成之塗佈裝置1,僅實施一次上述順序之塗佈方法,便可利用所算出之噴嘴3之移動速度Vt來確立對應於使用之塗佈液D之最佳之噴嘴3之移動的控制模式,不需要進行試塗,而可消除伴隨著試塗之塗佈液、試塗用之基板、作業時間之損失之累積,從 而可不費工而容易地且迅速地開始進行塗佈作業。 In addition, in preparation for coating the
於第1實施例之基板之塗佈方法及塗佈裝置中,只要增設壓力感測器9及演算控制器10即可,可相較於如專利文獻1般使用複數台相機或進行圖像處理之控制部之情形,以簡易之設備且低成本地構成。 In the substrate coating method and coating apparatus of the first embodiment, it is only necessary to add a
又,第1實施例由於為使用一般之噴嘴3之移動速度控制,因此相較於如專利文獻2般自2個狹縫以2個階段來吐出藥液之構成及方法,噴嘴3之構成簡單並且亦可使吐出控制容易化。 In addition, since the first embodiment uses the general moving speed control of the
又,第1實施例由於僅藉由噴嘴3之移動速度控制來進行塗佈,而未伴隨著注射泵7之塗佈液D之供給量控制,因此可相較於如專利文獻3或專利文獻4般關於塗佈液之供給來進行控制之情形,容易地且高精度地使塗膜厚度一定。 In addition, since the first embodiment performs coating only by controlling the moving speed of the
第2實施例係未設定噴嘴3之移動速度,而僅設定對應於設定吐出流量之既定壓力值Pc,噴嘴3將達到與設定吐出流量對應之既定壓力值Pc時之移動速度作為一定之移動速度而被移動之情形。 In the second embodiment, the moving speed of the
於該情形時,壓力感測器9自注射泵7之啟動(與噴嘴3之移動開始時間點對應),至與所測量之吐出流量對應之測量壓力值Pt成為對應於設定吐出流量之既定壓力值Pc為止進行測量,且該時間被使用於塗佈控制。 In this case, from the start of the syringe pump 7 (corresponding to the movement start time point of the nozzle 3) to the measured pressure value Pt corresponding to the measured discharge flow rate, the
而且,於初始階段,對應於與吐出流量對應之測量壓力值Pt自「0」之值上升至與設定吐出流量對應之既定壓力值Pc,使噴嘴3之移動速度自速度「0」增速,而使基板8每單位面積之 塗佈液量一定。藉此,可使初始階段之塗膜厚度儘可能地一定。經過初始階段,於與吐出流量對應之測量壓力值Pt成為與設定吐出流量對應之既定壓力值Pc之穩定階段,噴嘴3以成為與設定吐出流量對應之既定壓力值Pc時之一定之移動速度被移動。 Then, in the initial stage, the moving speed of the
第3實施例係不需設定噴嘴3之移動速度及與設定吐出流量對應之既定壓力值Pc,穩定階段之塗佈作業以於供給壓力成為一定時之一定供給壓力、以及噴嘴3以達到一定供給壓力時之移動速度作為一定之(穩定階段之)移動速度被移動之情形。 In the third embodiment, it is not necessary to set the moving speed of the
如後述之圖4所說明般,上述情形相當於取代注射泵7而使用氣密槽12,並僅藉由塗佈液之供給壓力來決定流量之情形。 As described in FIG. 4 to be described later, the above situation corresponds to a situation in which the
於第3實施例中,使噴嘴3之移動速度自開始時間點之速度「0」逐漸地增速,並於供給壓力成為一定之時間點,基板8每單位面積之塗佈液量成為一定,且塗膜厚度成為一定。 In the third embodiment, the moving speed of the
如上所述,於「自塗佈液D之吐出開始至噴嘴3之塗佈液D之吐出量穩定成一定(供給壓力成為一定)為止之數秒鐘左右的期間(初始階段)」,由於所吐出之塗佈液D之量因噴嘴3之吐出部周邊之塗佈液D之黏度或流路之阻力及其他因素而較少,因此,對應於該量較少之情況而使噴嘴3緩慢地移動,並且,對應於塗佈液D之量逐漸地增加而使噴嘴3之移動逐漸地增速。上述情況於圖2及圖3中,以Vt1<Vt2<Vt3來表示。 As described above, in "a period of about several seconds (initial stage) from the start of the discharge of the coating liquid D until the discharge amount of the coating liquid D from the
藉此,於基板8之每單位面積中,塗佈液量成為一定,而塗膜厚度成為一定。只要經過初始階段,供給壓力成為一定, 而使塗佈液D自噴嘴3之吐出量成為一定,噴嘴3便以吐出量(供給壓力)成為一定時之一定之移動速度被移動。 Thereby, the amount of the coating liquid per unit area of the
即便為以上所說明之第2及第3實施例,亦可得到與第1實施例相同之作用效果。 Even in the second and third embodiments described above, the same functions and effects as those of the first embodiment can be obtained.
圖4係表示圖1及圖3所示之基板之塗佈裝置的變形例,且對基板8塗佈塗佈液D之情況的概略圖。 FIG. 4 is a schematic view showing a modification of the coating apparatus for the substrate shown in FIGS. 1 and 3 , and a state in which coating liquid D is applied to the
於上述實施形態中,對使用三向閥6,利用注射泵7將塗佈液D自槽5抽吸,並朝將其向噴嘴3送出之情形進行說明,但於該變形例中,於噴嘴3,經由具備有開關閥15之供給配管4而連接有貯存有塗佈液D之氣密槽12。於氣密槽12,經由開關閥13而連接有加壓用之空氣導入配管14。然後,將開關閥13打開,利用自空氣導入配管14所導入之加壓用空氣而以一定壓力對氣密槽12內部加壓,並打開開關閥15,藉此使塗佈液D被供給至噴嘴3,而自噴嘴3被吐出。 In the above-described embodiment, the case where the three-way valve 6 is used and the coating liquid D is sucked from the
壓力感測器9與上述實施形態同樣地,被設置於噴嘴3或供給配管4。即便如上述之變形例,當然亦可發揮與上述實施形態相同之作用效果。 The
此外,於上述實施形態中,雖已對使噴嘴3相對於被設置於基台2上之基板8進行相對移動之情形進行說明,但其並不限定於此,亦可使設置有基板8之基台2相對於一定設置之噴嘴3進行相對移動。於該情形時,與上述噴嘴3之移動速度之說明同樣地,只要控制被載置於基台2之基板8之移動速度即可。 In addition, in the above-mentioned embodiment, although the case where the
1‧‧‧塗佈裝置 1‧‧‧Coating device
2‧‧‧基台 2‧‧‧Abutment
3‧‧‧噴嘴 3‧‧‧Nozzle
4‧‧‧供給配管 4‧‧‧Supply piping
5‧‧‧槽 5‧‧‧Slot
6‧‧‧三向閥 6‧‧‧Three-way valve
7‧‧‧注射泵 7‧‧‧Syringe pump
7a‧‧‧馬達 7a‧‧‧motor
7b‧‧‧活塞 7b‧‧‧Piston
7c‧‧‧汽缸 7c‧‧‧Cylinder
8‧‧‧基板 8‧‧‧Substrate
9‧‧‧壓力感測器 9‧‧‧Pressure sensor
10‧‧‧演算控制器 10‧‧‧Calculation Controller
D‧‧‧塗佈液 D‧‧‧Coating liquid
Vc‧‧‧設定移動速度 Vc‧‧‧Set movement speed
Vt1‧‧‧移動速度 Vt1‧‧‧movement speed
Vt2‧‧‧移動速度 Vt2‧‧‧movement speed
Vt3‧‧‧移動速度 Vt3‧‧‧movement speed
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11226471A (en) * | 1998-02-19 | 1999-08-24 | Toshiba Corp | Liquid coating device and liquid coating method |
JP2007144279A (en) * | 2005-11-25 | 2007-06-14 | Toshiba Corp | Apparatus for applying sealing agent and method for manufacturing liquid crystal panel |
TW201529182A (en) * | 2013-10-03 | 2015-08-01 | Tokyo Electron Ltd | Coating device |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11179262A (en) | 1997-12-25 | 1999-07-06 | Toshiba Corp | Liquid chemical coating method and device therefor |
WO2003005424A1 (en) * | 2001-07-03 | 2003-01-16 | Tokyo Electron Limited | Coating device and coating method |
JP4197107B2 (en) | 2002-07-18 | 2008-12-17 | 大日本印刷株式会社 | Coating equipment |
TWI313193B (en) * | 2006-01-19 | 2009-08-11 | Tokyo Electron Limite | Coating method, coating apparatus and memory medium |
JP4884871B2 (en) * | 2006-07-27 | 2012-02-29 | 東京エレクトロン株式会社 | Coating method and coating apparatus |
JP5154879B2 (en) * | 2007-10-01 | 2013-02-27 | 武蔵エンジニアリング株式会社 | Liquid material coating apparatus, coating method and program |
JP4297290B2 (en) | 2007-12-21 | 2009-07-15 | 横浜ゴム株式会社 | Pneumatic tire manufacturing method |
JP5062002B2 (en) * | 2008-03-31 | 2012-10-31 | 住友化学株式会社 | Coating method and coating apparatus |
WO2010146928A1 (en) * | 2009-06-19 | 2010-12-23 | タツモ株式会社 | Substrate coating apparatus |
JP5023171B2 (en) * | 2010-02-17 | 2012-09-12 | 東京エレクトロン株式会社 | Coating processing method, recording medium recording program for executing coating processing method, and coating processing apparatus |
JP2012071244A (en) * | 2010-09-28 | 2012-04-12 | Dainippon Screen Mfg Co Ltd | Pattern forming method and pattern forming apparatus |
KR101847219B1 (en) * | 2011-03-16 | 2018-04-09 | 도쿄엘렉트론가부시키가이샤 | Method of coating firm and apparatus for coating firm and storage medium |
KR101621215B1 (en) * | 2011-12-01 | 2016-05-16 | 다즈모 가부시키가이샤 | Coating device and coating method |
JP6057370B2 (en) * | 2013-02-27 | 2017-01-11 | 東レエンジニアリング株式会社 | Coating method and coating apparatus |
JP6339865B2 (en) * | 2013-08-30 | 2018-06-06 | 東京エレクトロン株式会社 | Coating film forming device |
JP5782172B1 (en) * | 2014-10-29 | 2015-09-24 | 中外炉工業株式会社 | Coating apparatus and coating method |
JP6426491B2 (en) | 2015-02-13 | 2018-11-21 | 中外炉工業株式会社 | Coating apparatus and coating method |
JP6450650B2 (en) * | 2015-06-16 | 2019-01-09 | 東京エレクトロン株式会社 | Processing apparatus, processing method, and storage medium |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11226471A (en) * | 1998-02-19 | 1999-08-24 | Toshiba Corp | Liquid coating device and liquid coating method |
JP2007144279A (en) * | 2005-11-25 | 2007-06-14 | Toshiba Corp | Apparatus for applying sealing agent and method for manufacturing liquid crystal panel |
TW201529182A (en) * | 2013-10-03 | 2015-08-01 | Tokyo Electron Ltd | Coating device |
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