TWI756175B - Robotic arm for transporting semiconductor substrates - Google Patents

Abstract

The invention discloses a manipulator for conveying semiconductor substrates. The manipulator comprises a main body part, an end part extending from the main body part, a plurality of vacuum suction cups located at the end part, and a plurality of vacuum pipelines respectively connected with the plurality of vacuum suction cups . The distance between any two adjacent vacuum chucks satisfies the following condition: the vertical displacement of the semiconductor substrate due to being sucked down by one of the two adjacent vacuum chucks is greater than that between the two adjacent vacuum chucks Therefore, once one of the two adjacent vacuum chucks grips the semiconductor substrate, the other one of the two adjacent vacuum chucks also grips the semiconductor substrate.

Description

Robotic arm for transporting semiconductor substrates

The present invention relates to the field of semiconductor equipment manufacturing, in particular to a manipulator for conveying semiconductor substrates.

In semiconductor manufacturing processes, robots are widely used to transport semiconductor substrates. Typically, a robot removes a semiconductor substrate from a wafer cassette, and then places the semiconductor substrate on a chuck provided in the process chamber for supporting the semiconductor substrate. After the process in the process chamber is complete, the robot removes the semiconductor substrate from the chuck and transfers the semiconductor substrate to another process chamber or wafer cassette.

Figure 1 shows a conventional manipulator. The manipulator 100 has a fork-shaped end 101 . The end portion 101 has a rectangular base portion 1011 and two mutually parallel fingers 1012 extending from the base portion 1011 . The three vacuum suction cups 102 are respectively located on the base 1011 and the two fingers 1012, and the semiconductor substrate 103 is sucked and held on the robot by vacuum suction. The three vacuum suction cups 102 have the same height. When the robot 100 removes the semiconductor substrate 103 from the chuck 104 , the end portion 101 is driven to approach the chuck 104 , and the two fingers 1012 are located on both sides of the chuck 104 . Therefore, the spacing between the two fingers 1012 limits the size of the chuck 104 . If the size of the chuck 104 is larger to If a semiconductor substrate with a large size, such as a 12-inch semiconductor substrate, cannot be removed by the robot 100 from the chuck 104 because the distance between the two fingers 1012 is smaller than that of the chuck 104 the size of. If the size of the chuck 104 is small, the robot 100 can remove the semiconductor substrate 103 from the chuck 104 . However, if the semiconductor substrate 103 is thin or warped, the robot arm 100 has its limitations, and even cannot remove the semiconductor substrate 103 from the chuck 104 .

As shown in Figures 2a-2c and Figure 3, ideally, the semiconductor substrate 103 should be flat, as shown in Figure 2a. Therefore, the three vacuum chucks 102 of the same height can easily suck and support the semiconductor substrate 103 . But as the semiconductor substrate 103 becomes thinner and thinner, when the robot 100 supports the semiconductor substrate 103, the outer edge of the semiconductor substrate 103 hangs downward, as shown in FIG. 3 . In addition, since the semiconductor substrate 103 is warped, it is difficult to ensure that all the vacuum chucks 102 can hold the semiconductor substrate 103 . As shown in FIG. 2 b , the semiconductor substrate 103 is warped upward, so that only the vacuum chucks 102 on the base 1011 contact the semiconductor substrate 103 , and the vacuum chucks 102 on the two fingers 1012 cannot contact the semiconductor substrate 103 . As shown in FIG. 2c , the semiconductor substrate 103 is warped downward, so that only the vacuum chucks 102 on the two fingers 1012 contact the semiconductor substrate 103 , while the vacuum chucks 102 on the base 1011 cannot contact the semiconductor substrate 103 . When the semiconductor substrate 103 is warped, it is difficult to ensure that all the vacuum chucks 102 can hold the semiconductor substrate 103 , so the robot arm 100 cannot support the semiconductor substrate 103 stably, and the semiconductor substrate 103 may slip from the robot arm 100 fall, thereby reducing the reliability of the manipulator 100 .

The present invention provides a manipulator for conveying semiconductor substrates. The manipulator comprises a main body part, an end part extending from the main body part, a plurality of vacuum suction cups located at the end part, and a plurality of vacuum pipelines respectively connected with the vacuum suction cups. Wherein, the distance between any two adjacent vacuum suction cups satisfies the following condition: the vertical displacement of the semiconductor substrate caused by being sucked downward by one of the two adjacent vacuum suction cups is greater than that of the two adjacent vacuum suction cups warping of the semiconductor substrate between, therefore, once one of the two adjacent vacuum chucks grips the semiconductor substrate, the other of the two adjacent vacuum chucks also grips the semiconductor substrate.

As mentioned above, since the distance between any two adjacent vacuum suction cups of the robot satisfies the above conditions, once one of the two adjacent vacuum suction cups sucks the semiconductor substrate, the other one also contacts and sucks the semiconductor substrate. the semiconductor substrate. In this way, all vacuum chucks can hold the semiconductor substrate regardless of whether the semiconductor substrate is warped or not. In addition, when all the vacuum chucks hold the semiconductor substrate, the semiconductor substrate is symmetrically warped upward or downward along its centerline. Therefore, compared with the traditional manipulator, the manipulator of the present invention supports or transports the semiconductor substrate more reliably and stably, and solves the transport problem of thin and/or warped semiconductor substrates.

100‧‧‧Robot

101‧‧‧End

1011‧‧‧Base

1012‧‧‧finger

102‧‧‧Vacuum Suction Cup

103‧‧‧Semiconductor substrate

104‧‧‧Chuck

300‧‧‧Robot

301‧‧‧Main part

302‧‧‧End part

3021‧‧‧End edge

303a‧‧‧The first set of vacuum suction cups

303b‧‧‧Second set of vacuum suction cups

303c‧‧‧The third set of vacuum suction cups

304‧‧‧Semiconductor substrate

309‧‧‧Chuck

400‧‧‧Robot

401‧‧‧Main part

402‧‧‧Terminal part

4021‧‧‧End edge

403a‧‧‧The first set of vacuum suction cups

403b‧‧‧Second set of vacuum suction cups

403c‧‧‧The third set of vacuum suction cups

404‧‧‧Semiconductor substrate

409‧‧‧Chuck

500‧‧‧Robot

501‧‧‧Main part

502‧‧‧End part

3021‧‧‧End edge

503a‧‧‧The first set of vacuum suction cups

503b‧‧‧Second set of vacuum suction cups

503c‧‧‧The third set of vacuum suction cups

505‧‧‧Vacuum Line

506‧‧‧Main vacuum line

507‧‧‧Opening

508‧‧‧Opening

600‧‧‧Robot

601‧‧‧Main part

602‧‧‧End part

603a‧‧‧The first set of vacuum suction cups

603b‧‧‧Second set of vacuum suction cups

603c‧‧‧The third set of vacuum suction cups

605‧‧‧Vacuum Line

703a‧‧‧The first set of vacuum suction cups

703b‧‧‧Second set of vacuum suction cups

703c‧‧‧The third set of vacuum suction cups

Figure 1 shows a bottom view of a traditional robot taking semiconductor substrates from a chuck; Figures 2a-2c show a traditional robot transporting semiconductor substrates; Figure 3 shows a traditional robot transporting semiconductor substrates; Figure 4 Shown is a perspective view of a robot transporting semiconductor substrates according to an embodiment of the present invention; Figure 5 shows a bottom view of a robot taking semiconductor substrates from a chuck; Figure 6 shows a robot transporting semiconductor substrates Figure 7 shows the right side view of the robot transporting the semiconductor substrate; Figure 8 shows a partial enlarged view of part A in Figure 7; Figure 9 shows the robot transporting another embodiment of the present invention. A perspective view of a semiconductor substrate; Figure 10 shows a bottom view of a robot taking semiconductor substrates from a chuck; Figure 11 shows a front view of a robot transporting semiconductor substrates; Figure 12 shows a robot transporting semiconductors The right side view of the substrate; Fig. 13 is a partial enlarged view of B part in Fig. 12; Fig. 14 is a perspective view of a robot conveying a semiconductor substrate according to another embodiment of the present invention; Figure 14 is a cross-sectional view of line CC; Figure 16 is a partial enlarged view of part D in Figure 15; Figure 17 is a cross-sectional view of the vacuum pump opening connected to the main vacuum pipe of the robot; Figure 18 shows this A perspective view of a robot transporting a semiconductor substrate according to yet another embodiment of the invention; Fig. 19 shows the distance between any two adjacent vacuum suction cups on the robot, wherein the two adjacent vacuum suction cups are aligned with the center of the semiconductor substrate; Fig. 20 shows the distance between the two adjacent vacuum suction cups in Fig. 19. Partial enlarged view; Figure 21 shows a partial enlarged view of the F part in Figure 19; Figure 22 shows the distance between any two adjacent vacuum suction cups on the robot, wherein one vacuum suction cup and the center of the semiconductor substrate Aligned, another vacuum chuck is distributed on one side of the vacuum chuck aligned with the center of the semiconductor substrate.

The present invention provides a manipulator for conveying semiconductor substrates. The manipulator comprises a main body part, an end part extending from the main body part, a plurality of vacuum suction cups located at the end part, and a plurality of vacuum pipelines respectively connected with the vacuum suction cups. Wherein, the distance between any two adjacent vacuum suction cups satisfies the following condition: the vertical displacement of the semiconductor substrate caused by being sucked downward by one of the two adjacent vacuum suction cups is greater than that of the two adjacent vacuum suction cups warping of the semiconductor substrate between, therefore, once one of the two adjacent vacuum chucks grips the semiconductor substrate, the other of the two adjacent vacuum chucks also grips the semiconductor substrate.

Since the distance between any two adjacent vacuum chucks of the robot satisfies the above conditions, once one of the two adjacent vacuum chucks sucks the semiconductor substrate, the other one also contacts and sucks the semiconductor substrate. . In this way, regardless of whether the semiconductor substrate is warped, all Both vacuum chucks can hold semiconductor substrates. In addition, when all the vacuum chucks hold the semiconductor substrate, the semiconductor substrate is symmetrically warped upward or downward along its centerline. Therefore, compared with the traditional manipulator, the manipulator of the present invention supports or transports the semiconductor substrate more reliably and stably, and solves the transport problem of thin and/or warped semiconductor substrates.

Figures 4-8 show a specific implementation manner of the robot for transporting the semiconductor substrate according to the present invention. As shown in FIG. 4 , the manipulator 300 includes a main body portion 301 and an end portion 302 extending from the main body portion 301 . The main body portion 301 and the end portion 302 are generally rectangular in shape. The end edge 3021 of the end portion 302 is designed to be rounded to match the chuck 309 . The chuck 309 supports the semiconductor substrate 304 . Robot 300 removes semiconductor substrate 304 from chuck 309 . As is well known, the robot 300 is suitable not only for transporting the semiconductor substrate 304 between two chucks 309, but also for transporting the semiconductor substrate 304 between the chuck 309 and the wafer cassette. The end portion 302 is provided with a plurality of vacuum suction cups to suck and support the semiconductor substrate 304 by means of vacuum suction. The plurality of vacuum chucks are grouped into groups, and in one embodiment, the plurality of vacuum chucks are grouped into at least three groups, each group comprising at least one vacuum chuck. The first set of vacuum pads 303a is aligned with the center of the semiconductor substrate 304, and the second set of vacuum pads 303b and the third set of vacuum pads 303c are symmetrically distributed on both sides of the first set of vacuum pads 303a. The distance between the first set of vacuum pads 303a and the second set of vacuum pads 303b is the same as the distance between the first set of vacuum pads 303a and the third set of vacuum pads 303c. The second set of vacuum pads 303b and the third set of vacuum pads 303c have the same height.

In one embodiment of the invention, the first set of vacuum The height of the suction cups 303a is lower than the heights of the third set of vacuum suction cups 303c and the second set of vacuum suction cups 303b. As shown in FIGS. 5-8 , when the robot 300 is used to transport the semiconductor substrate 304 , the robot 300 is driven close to the chuck 309 and is located on one side of the chuck 309 . One vacuum chuck sucks the semiconductor substrate 304 downward under vacuum suction, and another vacuum chuck close to the above vacuum chuck sucks the semiconductor substrate 304 under vacuum suction. In this way, all of the vacuum chucks located at the end portion 302 hold the semiconductor substrate 304 . Since the height of the first group of vacuum chucks 303a is lower than that of the third group of vacuum chucks 303c and the second group of vacuum chucks 303b, when all the groups of vacuum chucks hold the semiconductor substrate 304, the semiconductor substrate 304 is along the center of the semiconductor substrate 304 The line-symmetric upward warping improves the stability of the transportation of the semiconductor substrate 304 . Warpage of the semiconductor substrate 304 does not affect loading and unloading of the semiconductor substrate 304 .

Figures 9-13 show another specific implementation manner of the robot for conveying the semiconductor substrate according to the present invention. As shown in FIG. 9 , the manipulator 400 includes a main body portion 401 and an end portion 402 extending from the main body portion 401 . The body portion 401 and the end portion 402 are generally rectangular in shape. The end edge 4021 of the end portion 402 is designed in a circular arc shape to mate with the chuck 409 , which supports the semiconductor substrate 404 . The end portion 402 is provided with a plurality of vacuum suction cups to suck and support the semiconductor substrate 404 by means of vacuum suction. The plurality of vacuum suction cups are divided into groups, and in one embodiment, the plurality of vacuum suction cups are divided into at least three groups, each group comprising at least one vacuum suction cup. The first group of vacuum chucks 403a is aligned with the center of the semiconductor substrate 404, the second group of vacuum chucks 403b and the third group of vacuum chucks 403c are symmetrical Distributed on both sides of the first group of vacuum suction cups 403a. The distance between the first set of vacuum pads 403a and the second set of vacuum pads 403b is the same as the distance between the first set of vacuum pads 403a and the third set of vacuum pads 403c. The second set of vacuum pads 403b and the third set of vacuum pads 403c have the same height.

Compared with the manipulator 300, the manipulator 400 is different in that the height of the first group of vacuum suction cups 403a is higher than that of the third group of vacuum suction cups 403c and the second group of vacuum suction cups 403b. As shown in FIGS. 10-13 , when the robot 400 is used to transport the semiconductor substrate 404 , the robot 400 is driven close to the chuck 409 and is located on one side of the chuck 409 . One vacuum chuck sucks down the semiconductor substrate 404 under vacuum suction, and another vacuum chuck close to the above vacuum chuck sucks the semiconductor substrate 404 under vacuum suction. In this way, all of the vacuum chucks located at the end portion 402 hold the semiconductor substrate 404 . Since the height of the first group of vacuum chucks 403a is higher than that of the third group of vacuum chucks 403c and the second group of vacuum chucks 403b, when all the vacuum chucks 403a, 403b, 403c suck the semiconductor substrate 404, the semiconductor substrate 404 will move along the semiconductor substrate 404. The centerline of the bottom 404 is warped downward symmetrically, thereby improving the transport stability of the semiconductor substrate 404 . Warpage of the semiconductor substrate 404 does not affect loading and unloading of the semiconductor substrate 404 .

,n是真空管路505的數量。每條真空管路505足夠細。儘管所有的真空管路505都與主真空管道506連接，由於每條真空管路505足夠細，即使有一條真空管路505有泄漏，其他條真空管路505也不會受影響，與這些真空管路505相連的真空吸盤仍然可以吸住並支撐半導體襯底。 As shown in FIGS. 14-17 , a plurality of vacuum lines 505 are provided on the main part 501 and the end part 502 of the manipulator 500 . The main body portion 501 is provided with a main vacuum line 506 . Each vacuum line 505 extends from the main vacuum line 506 to the vacuum suction cups. The plurality of vacuum pipelines 505 are respectively connected to the plurality of vacuum suction cups 503a, 503b, 503c and the main vacuum pipeline 506, and the main vacuum pipeline 506 is connected to the vacuum pump. As shown in FIGS. 16 and 17 , the opening 507 at one end of each vacuum line 505 connected to the main vacuum line 506 is a square with side length a, and the opening 508 at the end of the vacuum pump connected to the main vacuum line 506 is a diameter d round. The relationship between a and d satisfies the following equation:

, n is the number of vacuum lines 505 . Each vacuum line 505 is thin enough. Although all the vacuum lines 505 are connected to the main vacuum line 506, since each vacuum line 505 is thin enough, even if one of the vacuum lines 505 leaks, the other vacuum lines 505 will not be affected. The vacuum chuck can still hold and support the semiconductor substrate.

As shown in FIG. 18 , in another specific embodiment of the present invention, a plurality of vacuum pipelines 605 are provided on the main part 601 and the end part 602 of the manipulator 600 , and the plurality of vacuum pipelines 605 are respectively connected with a plurality of vacuum suction cups 603 a , 603b, 603c are connected to the vacuum pump.

，其中，x是任意兩個相鄰的真空吸盤之間的距離，這裏的兩個相鄰的真空吸盤屬於第一組真空吸盤703a，R是這兩個相鄰真空吸盤之間的半導體襯底的翹曲形成的圓弧的半徑，H1是這兩個相鄰真空吸盤的高度。 As shown in Figure 19-21, the distance between any two adjacent vacuum suction cups satisfies the following equation:

, where x is the distance between any two adjacent vacuum suction cups, where the two adjacent vacuum suction cups belong to the first group of vacuum suction cups 703a, and R is the semiconductor substrate between the two adjacent vacuum suction cups The radius of the arc formed by the warping, H1 is the height of the two adjacent vacuum suction cups.

，其中，L是 任意兩個相鄰的真空吸盤之間的距離，這裏的兩個相鄰的真空吸盤中的一個屬於第一組真空吸盤703a，另一個真空吸盤屬於第二組真空吸盤703b或第三組真空吸盤703c，R 是這兩個相鄰真空吸盤之間的半導體襯底的翹曲形成的圓弧的半徑，H2是屬於第二組真空吸盤703b或第三組真空吸盤703c的真空吸盤的高度，x1是屬於第二組真空吸盤703b或第三組真空吸盤703c的真空吸盤與穿過半導體襯底中心且垂直於第一組真空吸盤703a的軸線之間的垂直距離。 As shown in Figure 22, the distance between any two adjacent vacuum chucks satisfies the following equation:

, where L is the distance between any two adjacent vacuum suction cups, where one of the two adjacent vacuum suction cups belongs to the first group of vacuum suction cups 703a, and the other vacuum suction cup belongs to the second group of vacuum suction cups 703b or The third group of vacuum chucks 703c, R is the radius of the arc formed by the warpage of the semiconductor substrate between these two adjacent vacuum chucks, and H2 is the vacuum belonging to the second group of vacuum chucks 703b or the third group of vacuum chucks 703c The height of the chuck, x1 is the vertical distance between a vacuum chuck belonging to the second group of vacuum chucks 703b or the third group of vacuum chucks 703c and an axis passing through the center of the semiconductor substrate and perpendicular to the first group of vacuum chucks 703a.

Although the present invention is described with specific embodiments, examples and applications, obvious changes and substitutions in the art will still fall within the protection scope of the present invention.

300‧‧‧Robot

301‧‧‧Main part

302‧‧‧End part

3021‧‧‧End edge

303a‧‧‧The first set of vacuum suction cups

303b‧‧‧Second set of vacuum suction cups

303c‧‧‧The third set of vacuum suction cups

Claims (8)

A manipulator for conveying semiconductor substrates, comprising: a main body part; an end part extending from the main body part; a plurality of vacuum suction cups arranged on the end part; a plurality of vacuum suction cups respectively connected with the plurality of vacuum suction cups Vacuum pipeline, the plurality of vacuum pipelines are connected to the main vacuum pipeline, the main vacuum pipeline is connected to the vacuum pump, and the diameter of the multiple vacuum pipelines is smaller than that of the main vacuum pipeline, so that even if one of the multiple vacuum pipelines leaks, The other strips of the plurality of vacuum lines are also not affected; wherein, the distance between any two adjacent vacuum suction cups satisfies the following condition: the semiconductor substrate is lowered by one of the two adjacent vacuum suction cups. The vertical displacement caused by suction is greater than the warpage of the semiconductor substrate between the two adjacent vacuum chucks, so once one of the two adjacent vacuum chucks picks up the semiconductor substrate, the two adjacent vacuum chucks The other one of the suction cups also sucks the semiconductor substrate; the opening of one end of each vacuum pipeline connected with the main vacuum pipeline is a square, the side length of the square is a, and the opening of one end of the vacuum pump connected to the main vacuum pipeline is A circle with a diameter d, the relationship between a and d satisfies the following equation:

, n is the number of vacuum lines. The manipulator according to claim 1, wherein the plurality of vacuum suction cups are divided into at least three groups, and each group includes at least one vacuum suction cup. The manipulator according to claim 2, wherein the first set of vacuum suction cups is aligned with the center of the semiconductor substrate, and the second set of vacuum suction cups and the third set of vacuum suction cups are symmetrically distributed on both sides of the first set of vacuum suction cups , the distance between the first set of vacuum suction cups and the second set of vacuum suction cups is the same as the distance between the first set of vacuum suction cups and the third set of vacuum suction cups The distances between the discs are the same, and the second set of vacuum pads and the third set of vacuum pads have the same height. The manipulator according to claim 3, wherein the distance between any two adjacent vacuum suction cups satisfies the following equation:

, where x is the distance between any two adjacent vacuum suction cups, which belong to the first group of vacuum suction cups, and R is the warpage of the semiconductor substrate between these two adjacent vacuum suction cups The radius of the arc formed by the curve, H1 is the height of the two adjacent vacuum suction cups. The manipulator according to claim 3, wherein the distance between any two adjacent vacuum suction cups satisfies the following equation:

, where L is the distance between any two adjacent vacuum suction cups, one of the two adjacent vacuum suction cups belongs to the first group of vacuum suction cups, and the other vacuum suction cup in the two adjacent vacuum suction cups belongs to the first group of vacuum suction cups belongs to the second group of vacuum suction cups or the third group of vacuum suction cups, R is the radius of the arc formed by the warpage of the semiconductor substrate between these two adjacent vacuum suction cups, and H2 belongs to the second group of vacuum suction cups or the third group of vacuum suction cups The height of the other vacuum chuck of the vacuum chuck, x1 is the axis of the other vacuum chuck belonging to the second group of vacuum chucks or the third group of vacuum chucks and the axis passing through the center of the semiconductor substrate and perpendicular to the first group of vacuum chucks vertical distance between. The manipulator according to claim 3, wherein the height of the first group of vacuum suction cups is lower than the height of the second group of vacuum suction cups and the height of the third group of vacuum suction cups, and when all groups of vacuum suction cups suck the semiconductor substrate downward, The semiconductor substrate is warped upward symmetrically along the center line of the semiconductor substrate. The manipulator according to claim 3, wherein the height of the first set of vacuum suction cups is higher than the height of the second set of vacuum suction cups and the height of the third set of vacuum suction cups, and when all sets of vacuum suction cups suck the semiconductor substrate downward, The semiconductor substrate is warped downward symmetrically along the centerline of the semiconductor substrate. The manipulator according to claim 1, wherein the main vacuum pipeline is provided in the main body part, and the plurality of vacuum pipelines are provided in the main body part and the end part, and connect the main vacuum pipeline and the corresponding vacuum suction cups.

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