TW202021017A - Wafer transfer device - Google Patents

Wafer transfer device Download PDF

Info

Publication number
TW202021017A
TW202021017A TW108119619A TW108119619A TW202021017A TW 202021017 A TW202021017 A TW 202021017A TW 108119619 A TW108119619 A TW 108119619A TW 108119619 A TW108119619 A TW 108119619A TW 202021017 A TW202021017 A TW 202021017A
Authority
TW
Taiwan
Prior art keywords
wafer
transfer device
load chamber
support
module
Prior art date
Application number
TW108119619A
Other languages
Chinese (zh)
Other versions
TWI702681B (en
Inventor
周仁
劉春
王亮
Original Assignee
大陸商瀋陽拓荊科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商瀋陽拓荊科技有限公司 filed Critical 大陸商瀋陽拓荊科技有限公司
Publication of TW202021017A publication Critical patent/TW202021017A/en
Application granted granted Critical
Publication of TWI702681B publication Critical patent/TWI702681B/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Abstract

A wafer transfer device includes a loadlock module, a front end module and a transfer chamber module. The loadlock module has a first side and a second side, and the loadlock module communicates the first side and the second side to form at least one loadlock. The loadlock is provided with at least one pair of wafer bracket, and each wafer bracket includes a main body. The main body extends in parallel with a pair of support arms, and each support arm is provided with a support ball and a center limitation block. The front end module is coupled to the first side of the loadlock module, and the transfer chamber module is coupled to the second side of the loadlock module.

Description

晶圓傳輸裝置Wafer transfer device

本發明是有關於一種涉及半導體製程設備的晶圓傳輸裝置，特別是涉及一種在使用真空端與大氣端之間的負載腔模組中使用分體設計的晶圓支架結構之晶圓傳輸裝置。The invention relates to a wafer transfer device related to semiconductor process equipment, in particular to a wafer transfer device using a wafer support structure of a split design in a load cavity module between a vacuum end and an atmospheric end.

在半導體製程設備中，進行晶圓加工時常常需要在真空壓力下進行，晶圓在傳入或傳出反應腔室時，需要一種負載腔模組作為壓力在真空與大氣狀態下的過度環境。為了達到晶圓的正常傳遞，晶圓的放置在支架上的位置必須滿足一定的精度，然而當機械手臂傳遞晶圓至負載腔模組內的晶圓支架，晶圓在負載腔室內進行處理後，晶圓的位置相對於正常傳遞位置可能存在一定的偏移。In semiconductor process equipment, wafer processing often needs to be performed under vacuum pressure. When the wafer is introduced into or out of the reaction chamber, a load chamber module is required as an excessive environment under pressure in a vacuum and atmospheric state. In order to achieve the normal transfer of the wafer, the position of the wafer placed on the holder must meet a certain accuracy. However, when the robotic arm transfers the wafer to the wafer holder in the load chamber module, the wafer is processed in the load chamber The position of the wafer may be offset from the normal transfer position.

晶圓的加工質量對其表面的顆粒度也有嚴格的要求。通常所使用的晶圓支架，一類是金屬材料支架如鋁合金，晶圓與支架接觸時產生的顆粒會影響晶圓的最終加工質量；另一類是有機材料如聚醚醚酮(polyetheretherketone，PEEK)，只能承受較低的溫度，然而加工後的晶圓通常溫度較高，造成支架上與晶圓接觸處有軟化磨損的情況，進而產生大量的顆粒影響晶圓的最終加工質量。The wafer processing quality also has strict requirements on the particle size of its surface. The commonly used wafer supports are one type of metal material supports such as aluminum alloy. The particles generated when the wafer is in contact with the support will affect the final processing quality of the wafer; the other type are organic materials such as polyetheretherketone (PEEK) It can only withstand lower temperatures. However, the processed wafers usually have a higher temperature, causing softening and abrasion at the contact between the support and the wafer, which in turn produces a large amount of particles that affect the final processing quality of the wafer.

有鑑於此，本發明揭露為一種經過改良的晶圓傳輸裝置。In view of this, the present invention discloses an improved wafer transfer device.

根據本發明揭露的一實施方式，一種晶圓傳輸裝置，包含負載腔模組、設備前端模組和轉換腔模組，其中該負載腔模組具有第一側與第二側，在第一側與第二側之間連通形成至少一負載腔室，負載腔室內設有至少一對晶圓支架，每一晶圓支架包含一主體，該主體平行延伸一對支撐臂，且每一支撐臂上設有支撐球和置中限位塊；設備前端模組銜接配置於負載腔模組的第一側；轉換腔模組銜接配置於負載腔模組的第二側。According to an embodiment disclosed by the present invention, a wafer transfer device includes a load cavity module, a device front-end module, and a conversion cavity module, wherein the load cavity module has a first side and a second side, and the first side Connected with the second side to form at least one load chamber, at least one pair of wafer holders are provided in the load chamber, each wafer holder includes a main body, the main body extends a pair of support arms in parallel, and each support arm The support ball and the center limit block are provided; the front-end module of the equipment is connected to the first side of the load cavity module; the conversion cavity module is connected to the second side of the load cavity module.

在一實施例中，該對晶圓支架為分體設計，且設置於該負載腔室的相對側壁上。In an embodiment, the pair of wafer holders are of a split design, and are disposed on opposite side walls of the load chamber.

在一實施例中，支撐球和置中限位塊之材料為單晶體材料。In one embodiment, the material of the support ball and the center stop is a single crystal material.

在一實施例中，晶圓支架的主體設置於該負載腔室的相對側壁的其中一側壁。In an embodiment, the main body of the wafer holder is disposed on one of the opposite side walls of the load chamber.

在一實施例中，支撐球設置在支撐臂上遠離負載腔室的側壁，且支撐球為可旋轉或固定不會脫落。In one embodiment, the support ball is disposed on the side wall of the support arm away from the load chamber, and the support ball is rotatable or fixed so as not to fall off.

在一實施例中，置中限位塊設置在支撐臂上靠近負載腔室的側壁。In one embodiment, the centering limit block is disposed on the side wall of the support arm near the load chamber.

在一實施例中，置中限位塊具有軸心，且形成平行於軸心的限位面，以及與該軸心間具有一夾角的對中面。In an embodiment, the centering limit block has an axis, and forms a limit surface parallel to the axis, and a centering surface with an angle with the axis.

在一實施例中，置中限位塊的軸心到該對晶圓支架所支承之晶圓的圓心之距離大於晶圓的半徑。In one embodiment, the distance between the axis of the centering limit block and the center of the wafer supported by the pair of wafer supports is greater than the radius of the wafer.

在一實施例中，負載腔室內設有兩對晶圓支架，兩對晶圓支架彼此疊加安裝於負載腔室的相對側壁。In one embodiment, two pairs of wafer holders are provided in the load chamber, and the two pairs of wafer holders are superposed and installed on opposite side walls of the load chamber.

在一實施例中，該對晶圓支架的該些支撐球用於支撐一晶圓的下表面。In one embodiment, the supporting balls of the pair of wafer holders are used to support the lower surface of a wafer.

在本揭露的上述的實施例中，晶圓支架的支撐球用以支撐晶圓的下表面，晶圓支架的置中限位塊用以限制晶圓的位置，以確保每次晶圓支架支撐晶圓於相同的位置上，進而達到將晶圓2自動置中定位的功效。In the above embodiment of the present disclosure, the support ball of the wafer holder is used to support the lower surface of the wafer, and the center limit block of the wafer holder is used to limit the position of the wafer to ensure that the wafer holder is supported every time The wafers are in the same position, and then the wafer 2 is automatically centered and positioned.

對於相關領域一般技術者而言這些與其他的觀點與實施例在參考後續詳細描述與伴隨圖示之後將變得明確。These and other viewpoints and embodiments will become clear to those of ordinary skill in the related art with reference to the subsequent detailed description and accompanying drawings.

本發明提供一種用於晶圓處理設備的晶圓傳輸裝置。晶圓傳輸裝置中的負載腔室提供了一種晶圓支架結構，此晶圓支架結構具有將晶圓自動置中的功能，可以確保晶圓在傳遞過程中的精度，並且同時可以充份地減少顆粒的產生和聚集。The invention provides a wafer transfer device for wafer processing equipment. The load chamber in the wafer transfer device provides a wafer support structure, which has the function of automatically centering the wafer, which can ensure the accuracy of the wafer in the transfer process, and at the same time can be sufficiently reduced The generation and aggregation of particles.

現在將參考本發明之伴隨圖式詳細描述實施例。在該伴隨圖式中，相同及/或對應元件系以相同參考符號所表示。The embodiments will now be described in detail with reference to the accompanying drawings of the present invention. In the accompanying drawings, the same and/or corresponding elements are denoted by the same reference symbols.

在此將揭露各種實施例；然而，要瞭解到所揭露之實施例只用于作為可體現為各種形式之例證。此外，連接各種實施例所給予之每一範例都預期作為例示，而非用於限制。進一步的，該圖式並不一定符合尺寸比例，某些特徵系被放大以顯示特定元件之細節（且該圖式中所示之任何尺寸、材料與類似細節都預期僅為例示而非限制）。因此，在此揭露之特定結構與功能細節並不被解釋做為限制，而只是用於教導相關領域技術人員實作所揭露之實施例的基礎。Various embodiments will be disclosed here; however, it should be understood that the disclosed embodiments are only used as examples that can be embodied in various forms. In addition, each example given in connection with the various embodiments is intended to be illustrative, not limiting. Further, the drawings do not necessarily conform to the size ratio, and some features are enlarged to show the details of specific elements (and any dimensions, materials, and similar details shown in the drawings are intended to be illustrative and not limiting) . Therefore, the specific structural and functional details disclosed herein are not to be interpreted as limitations, but merely used to teach those skilled in the relevant art to implement the disclosed embodiments.

請參考第一圖，顯示本發明的一種晶圓傳輸裝置100的立體圖。本發明晶圓傳輸裝置100包含設備前端模組10、負載腔模組20和轉換腔模組30。負載腔模組20具有第一側201與第二側202，在第一側201與第二側202之間連通形成至少一負載腔室21(見第三圖所示)。設備前端模組10銜接配置於負載腔模組20的第一側201。轉換腔模組30銜接配置於負載腔模組20的第二側202。Please refer to the first figure, which shows a perspective view of a wafer transfer device 100 of the present invention. The wafer transfer device 100 of the present invention includes an equipment front-end module 10, a load cavity module 20, and a conversion cavity module 30. The load chamber module 20 has a first side 201 and a second side 202, and at least one load chamber 21 is formed between the first side 201 and the second side 202 (see FIG. 3). The device front-end module 10 is connected to the first side 201 of the load cavity module 20. The conversion cavity module 30 is connected to the second side 202 of the load cavity module 20.

請參考第二圖，顯示第一圖所示負載腔模組20的立體圖。負載腔模組20的腔體在第一側201設置前端隔離閥門22，在上表面設置蓋板23以及在第二側設置後端隔離閥門24。蓋板23用以密封在第一側201與第二側202之間所形成的負載腔室21(見第三圖所示)，而前端隔離閥門22位在第一側201以密封負載腔室21與設備前端模組10之間的連通，後端隔離閥門24位在第二側202以密封負載腔室21與轉換腔模組30之間的連通。Please refer to the second figure, which shows a perspective view of the load chamber module 20 shown in the first figure. The cavity of the load cavity module 20 is provided with a front-end isolation valve 22 on the first side 201, a cover plate 23 on the upper surface, and a rear-end isolation valve 24 on the second side. The cover plate 23 is used to seal the load chamber 21 (see the third figure) formed between the first side 201 and the second side 202, and the front end isolation valve 22 is located on the first side 201 to seal the load chamber 21 and the front-end module 10 of the device, the rear-end isolation valve 24 is located on the second side 202 to seal the communication between the load chamber 21 and the conversion chamber module 30.

請參考第三圖與第四圖，分別顯示第二圖所示負載腔模組20取出蓋板23後的立體圖，以及第三圖所示晶圓支架25的立體圖。同時參照第三圖和第四圖所示，每一負載腔室21內設有一對晶圓支架25用以支撐一晶圓(圖未示)，每一晶圓支架25包含一主體251，該主體251平行延伸一對支撐臂，分別為支撐臂252和支撐臂253。支撐臂253的上表面設置或形成有一支撐球26和一置中限位塊28，支撐臂252上亦設有支撐球和置中限位塊，不重複贅述。該對晶圓支架25的四個支撐球26用以支撐該晶圓的下表面，該對晶圓支架25的四個置中限位塊28用以限制該晶圓的位置，以確保每次該對晶圓支架25支撐一晶圓於相同的位置上。Please refer to the third and fourth figures, respectively, showing a perspective view of the load chamber module 20 shown in the second figure after removing the cover plate 23, and a perspective view of the wafer holder 25 shown in the third figure. Referring also to the third and fourth figures, each load chamber 21 is provided with a pair of wafer holders 25 for supporting a wafer (not shown). Each wafer holder 25 includes a main body 251, which The main body 251 extends a pair of support arms in parallel, namely a support arm 252 and a support arm 253 respectively. The upper surface of the support arm 253 is provided with or formed with a support ball 26 and a centering limit block 28. The support arm 252 is also provided with a support ball and a centering limit block, which will not be repeated here. The four supporting balls 26 of the pair of wafer holders 25 are used to support the lower surface of the wafer, and the four centering limiting blocks 28 of the pair of wafer holders 25 are used to limit the position of the wafer to ensure that each time The pair of wafer holders 25 support a wafer in the same position.

在本實施例中，該對晶圓支架25為分體設計，且分別設置於負載腔室21的相對側壁上。晶圓支架25的主體251設置於負載腔室21的相對側壁的其中一側壁，而兩晶圓支架25的支撐臂252、253相向自主體251平行延伸而出。In this embodiment, the pair of wafer holders 25 are of a split design, and are respectively disposed on opposite side walls of the load chamber 21. The main body 251 of the wafer holder 25 is disposed on one of the opposite side walls of the load chamber 21, and the support arms 252 and 253 of the two wafer holders 25 extend parallel to the main body 251 toward each other.

在本實施例中，支撐球26設置在支撐臂253上遠離負載腔室21的側壁，且支撐球26使用特殊製程安裝在該支撐臂253所預設的球槽內，俾使支撐球26為可旋轉或固定不會脫落。在本實施例中，置中限位塊28設置在支撐臂253上靠近負載腔室21的側壁，且置中限位塊28位在該支撐臂253所預設的安裝槽內，而與安裝槽為過盈配合，俾使置中限位塊28不會脫落。另一支撐臂252上支撐球和置中限位塊的位置關係和結構與支撐臂253的位置關係和結構相似，不重複贅述。In this embodiment, the support ball 26 is disposed on the side wall of the support arm 253 away from the load chamber 21, and the support ball 26 is installed in a predetermined groove of the support arm 253 using a special process, so that the support ball 26 is Can be rotated or fixed without falling off. In this embodiment, the centering limit block 28 is disposed on the support arm 253 near the side wall of the load chamber 21, and the centering limit block 28 is located in the preset mounting groove of the support arm 253, and is installed with The groove is an interference fit, so that the centering limit block 28 will not fall off. The positional relationship and structure of the support ball and the centering limit block on the other support arm 252 are similar to the positional relationship and structure of the support arm 253, and will not be repeated.

在本實施例中，支撐球26和置中限位塊28之材料為單晶體材料，因此不容易產生顆粒，且可以承受較高的溫度，同時可以降低對主體251的材料要求。In this embodiment, the material of the support ball 26 and the centering stopper 28 is a single crystal material, so it is not easy to generate particles, and it can withstand higher temperatures, and at the same time, the material requirements for the body 251 can be reduced.

請參考第五圖，顯示第四圖所示置中限位塊28的立體圖。置中限位塊28具有軸心A，且置中限位塊28形成平行於該軸心A的限位面28b，以及與該軸心A間具有一夾角的對中面28a。Please refer to the fifth figure, which shows a perspective view of the centering limiting block 28 shown in the fourth figure. The centering limit block 28 has an axis A, and the centering limit block 28 forms a limit surface 28 b parallel to the axis A, and a centering surface 28 a at an angle with the axis A.

接著參考第六圖，顯示第四圖所示支撐臂253的局部放大側視圖。當機械手臂承載一晶圓200進入負載腔室21，並位移至本發明晶圓支架25的上方後，該機械手臂會下降使該晶圓200由本發明晶圓支架25所支撐。由於置中限位塊28的軸心A與對中面28a具有一夾角，因此當晶圓200的位置有偏移時，隨該機械手臂的下降該晶圓200的邊緣會沿對中面28a向下滑落，使晶圓200之圓心O到達由4個置中限位塊28所限制之中心位置，因此達到將晶圓200自動置中定位的功能。此外，置中限位塊28的軸心A到晶圓支架25所支承之晶圓200的圓心O之距離R大於晶圓的半徑r。Next, referring to the sixth figure, a partially enlarged side view of the support arm 253 shown in the fourth figure is shown. After the robot arm carries a wafer 200 into the load chamber 21 and is displaced above the wafer holder 25 of the present invention, the robot arm will lower so that the wafer 200 is supported by the wafer holder 25 of the present invention. Since the axis A of the centering stopper 28 has an angle with the centering surface 28a, when the position of the wafer 200 deviates, the edge of the wafer 200 will follow the centering surface 28a as the robot arm descends Sliding down makes the center O of the wafer 200 reach the center position limited by the four centering limit blocks 28, thus achieving the function of automatically positioning the wafer 200 in the center. In addition, the distance R between the axis A of the centering stopper 28 and the center O of the wafer 200 supported by the wafer holder 25 is greater than the radius r of the wafer.

請參考第七圖，顯示另一實施例之雙層晶圓支架的立體圖。負載腔室21內設有兩對晶圓支架，分別為晶圓支架254和晶圓支架255，晶圓支架254和晶圓支架255。兩對晶圓支架彼此疊加安裝於該負載腔室21的相對側壁。然而，晶圓支架安裝之數量可視該負載腔室21的內部空間而決定。每對晶圓支架可以承載一片晶圓，透過晶圓支架彼此疊加安裝，可以提高負載腔室的傳送效率，使得設備前端模組至轉換腔模組之間經由負載腔室可以一次傳遞多片晶圓，以提高處理的產能。Please refer to the seventh figure for a perspective view of a double-layer wafer holder according to another embodiment. Two pairs of wafer holders are provided in the load chamber 21, namely a wafer holder 254 and a wafer holder 255, and a wafer holder 254 and a wafer holder 255. Two pairs of wafer holders are mounted on opposite side walls of the load chamber 21 on top of each other. However, the number of wafer holders installed depends on the internal space of the load chamber 21. Each pair of wafer holders can carry one wafer, and the wafer holders can be stacked on top of each other to improve the transmission efficiency of the load chamber, so that multiple wafers can be transferred at a time from the front-end module of the equipment to the conversion chamber module through the load chamber Round to increase processing capacity.

雖然已經以一或多個實施例描述本發明之負載腔室，要瞭解到本發明揭露內容並不限制於所揭露的實施例。本發明于器涵蓋在申請專利範圍之精神與觀點中所包含的各種修改與類似配置，應給予此觀點最廣泛的詮釋，以包含所有之修改與類似結構。本發明揭露內容也包含下述申請專利範圍中的所有任何實施例。Although the load chamber of the present invention has been described in one or more embodiments, it should be understood that the disclosure content of the present invention is not limited to the disclosed embodiments. The present invention covers various modifications and similar configurations included in the spirit and viewpoint of the scope of patent application, and this viewpoint should be given the widest interpretation to include all modifications and similar structures. The disclosure of the present invention also includes all the embodiments within the scope of the following patent applications.

100:晶圓傳輸裝置 10:設備前端模組 20:負載腔模組 201:第一側 202:第二側 21:負載腔室 22:前端隔離閥門 23:蓋板 24:後端隔離閥門 25:晶圓支架 251:主體 252:支撐臂 253:支撐臂 254:晶圓支架255:晶圓支架 26:支撐球 28:置中限位塊 28a:對中面 28b:限位面 200:晶圓 A:軸心R:半徑r:半徑 O:圓心 100: Wafer transfer device 10: Equipment front-end module 20: Load cavity module 201: first side 202: second side 21: load chamber 22: Front end isolation valve 23: Cover 24: Rear isolation valve 25: Wafer holder 251: Subject 252: Support arm 253: Support arm 254: Wafer holder 255: Wafer holder 26: Support ball 28: Center limit block 28a: centering 28b: limit surface 200: Wafer A: axis R: radius r: radius O: center of circle

圖式所示之結構大小比例並不限制本發明的實際實施。 第一圖為一種根據本揭露一實施例之晶圓傳輸裝置的立體圖； 第二圖為第一圖之負載腔模組的立體圖； 第三圖為第二圖之負載腔模組取出蓋板後的立體圖； 第四圖為第三圖之晶圓支架的立體圖； 第五圖為第四圖之置中限位塊的立體圖； 第六圖為第四圖之支撐臂的局部放大側視圖； 第七圖為另一實施例之雙層晶圓支架的立體圖。The structure size ratio shown in the drawings does not limit the actual implementation of the present invention. The first figure is a perspective view of a wafer transfer device according to an embodiment of the present disclosure; The second figure is a perspective view of the load cavity module of the first figure; The third figure is a perspective view of the load cavity module of the second figure after the cover plate is taken out; The fourth figure is a perspective view of the wafer holder of the third figure; The fifth picture is a perspective view of the center limit block of the fourth picture; Figure 6 is a partially enlarged side view of the support arm of Figure 4; FIG. 7 is a perspective view of a double-layer wafer holder according to another embodiment.

20:負載腔模組 20: Load cavity module

21:負載腔室 21: load chamber

23:蓋板 23: Cover

25:晶圓支架 25: Wafer holder

Claims (10)

一種晶圓傳輸裝置，包含： 一負載腔模組，具有一第一側與一第二側，在該第一側與該第二側之間連通形成至少一負載腔室，該負載腔室內設有至少一對晶圓支架，每一晶圓支架包含一主體，該主體平行延伸一對支撐臂，且每一支撐臂上設有一支撐球和一置中限位塊；一設備前端模組，銜接配置於該負載腔模組的該第一側；以及 一轉換腔模組，銜接配置於該負載腔模組的該第二側。A wafer transfer device, including: A load chamber module has a first side and a second side, and at least one load chamber is formed between the first side and the second side, and at least a pair of wafer holders are provided in the load chamber, Each wafer support includes a main body, and the main body extends a pair of support arms in parallel, and each support arm is provided with a support ball and a centering limit block; an equipment front-end module is connected to the load cavity module The first side; and a conversion cavity module connected to the second side of the load cavity module. 如請求項1所述之晶圓傳輸裝置，其中該對晶圓支架為分體設計，且設置於該負載腔室的相對側壁上。The wafer transfer device according to claim 1, wherein the pair of wafer supports are of a split design, and are disposed on opposite side walls of the load chamber. 如請求項1所述之晶圓傳輸裝置，其中該支撐球和該置中限位塊之材料為單晶體材料。The wafer transfer device according to claim 1, wherein the materials of the support ball and the centering stop block are single crystal materials. 如請求項1所述之晶圓傳輸裝置，其中該晶圓支架的該主體設置於該負載腔室的相對側壁的其中一側壁。The wafer transfer device according to claim 1, wherein the main body of the wafer holder is disposed on one of the opposite side walls of the load chamber. 如請求項4所述之晶圓傳輸裝置，其中該支撐球設置在該支撐臂上遠離該負載腔室的該側壁，且該支撐球為可旋轉或固定不會脫落。The wafer transfer device according to claim 4, wherein the support ball is disposed on the support arm away from the side wall of the load chamber, and the support ball is rotatable or fixed so as not to fall off. 如請求項5所述之晶圓傳輸裝置，其中該置中限位塊設置在該支撐臂上靠近該負載腔室的該側壁。The wafer transfer device according to claim 5, wherein the center limit block is disposed on the support arm near the side wall of the load chamber. 如請求項1所述之晶圓傳輸裝置，其中該置中限位塊具有一軸心，且形成一平行於該軸心的限位面，以及一與該軸心間具有一夾角的對中面。The wafer transfer device according to claim 1, wherein the centering limit block has an axis, and forms a limit surface parallel to the axis, and a centering with an angle to the axis surface. 如請求項7所述之晶圓傳輸裝置，其中該置中限位塊的軸心到一該對晶圓支架所支承之晶圓的圓心之距離大於該晶圓的半徑。The wafer transfer device according to claim 7, wherein the distance between the axis of the centering limit block and the center of a wafer supported by the pair of wafer supports is greater than the radius of the wafer. 如請求項1所述之晶圓傳輸裝置，其中該負載腔室內設有兩對晶圓支架，兩對晶圓支架彼此疊加安裝於該負載腔室的相對側壁。The wafer transfer device according to claim 1, wherein two pairs of wafer holders are provided in the load chamber, and the two pairs of wafer holders are superposed and installed on opposite side walls of the load chamber. 如請求項1所述之晶圓傳輸裝置，其中該對晶圓支架的該些支撐球用於支撐一晶圓的下表面。The wafer transfer device according to claim 1, wherein the support balls of the pair of wafer supports are used to support the lower surface of a wafer.
TW108119619A 2018-11-22 2019-06-06 Wafer transfer device TWI702681B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811396522.2A CN111211082B (en) 2018-11-22 2018-11-22 Wafer transmission device
CN201811396522.2 2018-11-22

Publications (2)

Publication Number Publication Date
TW202021017A true TW202021017A (en) 2020-06-01
TWI702681B TWI702681B (en) 2020-08-21

Family

ID=70785844

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108119619A TWI702681B (en) 2018-11-22 2019-06-06 Wafer transfer device

Country Status (2)

Country Link
CN (1) CN111211082B (en)
TW (1) TWI702681B (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6116848A (en) * 1997-11-26 2000-09-12 Brooks Automation, Inc. Apparatus and method for high-speed transfer and centering of wafer substrates
KR100790792B1 (en) * 2006-08-23 2008-01-02 코닉시스템 주식회사 Wafer transfer device
US20080099451A1 (en) * 2006-10-30 2008-05-01 Richard Lewington Workpiece rotation apparatus for a plasma reactor system
CN106571329A (en) * 2015-10-12 2017-04-19 沈阳拓荆科技有限公司 Wafer substrate support rack structure
CN106611722A (en) * 2015-10-21 2017-05-03 沈阳拓荆科技有限公司 A two-chamber double-layer support structure integrating positioning and centring functions
CN105789091B (en) * 2016-03-16 2020-04-24 沈阳拓荆科技有限公司 Load lock chamber and multi-chamber processing system using the same

Also Published As

Publication number Publication date
TWI702681B (en) 2020-08-21
CN111211082B (en) 2022-10-25
CN111211082A (en) 2020-05-29

Similar Documents

Publication Publication Date Title
TWI665746B (en) Compact substrate processing tool with multi-station processing and pre-processing and/or post-processing stations
US8382088B2 (en) Substrate processing apparatus
KR102161685B1 (en) Mixed-platform apparatus, systems, and methods for substrate processing
US10468278B2 (en) Substrate transfer method and substrate processing apparatus
TWI714085B (en) Dual load lock chamber and processing system including the dual load lock chamber
WO2015094743A1 (en) Substrate support apparatus having reduced substrate particle generation
US20200176288A1 (en) Systems and Methods for Workpiece Processing
TWI797253B (en) Apparatus for handling various sized substrates
US20110110751A1 (en) Vacuum processing system and vacuum processing method of semiconductor processing substrate
TWM589358U (en) Semiconductor process module top ring
WO2021204050A1 (en) Semiconductor processing device
TW202000548A (en) Multi-cassette carrying case
US20190259647A1 (en) Deposition ring for processing reduced size substrates
TWI702681B (en) Wafer transfer device
US20230282492A1 (en) Substrate processing system and substrate transfer apparatus and method
US6860711B2 (en) Semiconductor-manufacturing device having buffer mechanism and method for buffering semiconductor wafers
CN114975208B (en) Wafer picking and placing method and thinning machine
US20130269615A1 (en) Vertical wafer boat
KR102183985B1 (en) Dual blade robot including vertically offset and horizontally overlapping frog leg linkages, and systems and methods including the same
US20190259635A1 (en) Process kit for processing reduced sized substrates
KR20090024598A (en) High speed substrate processing system