TWI754931B - Fpc用導電性黏著片材及使用此片材之fpc - Google Patents

Fpc用導電性黏著片材及使用此片材之fpc Download PDF

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Publication number
TWI754931B
TWI754931B TW109115674A TW109115674A TWI754931B TW I754931 B TWI754931 B TW I754931B TW 109115674 A TW109115674 A TW 109115674A TW 109115674 A TW109115674 A TW 109115674A TW I754931 B TWI754931 B TW I754931B
Authority
TW
Taiwan
Prior art keywords
conductive adhesive
fpc
adhesive sheet
conductive
reinforcing plate
Prior art date
Application number
TW109115674A
Other languages
English (en)
Chinese (zh)
Other versions
TW202033700A (zh
Inventor
野村直宏
櫻木喬規
竹山早苗
後藤信弘
Original Assignee
日商藤森工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商藤森工業股份有限公司 filed Critical 日商藤森工業股份有限公司
Publication of TW202033700A publication Critical patent/TW202033700A/zh
Application granted granted Critical
Publication of TWI754931B publication Critical patent/TWI754931B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Structure Of Printed Boards (AREA)
TW109115674A 2015-04-17 2016-04-07 Fpc用導電性黏著片材及使用此片材之fpc TWI754931B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-084928 2015-04-17
JP2015084928A JP6280518B2 (ja) 2015-04-17 2015-04-17 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ

Publications (2)

Publication Number Publication Date
TW202033700A TW202033700A (zh) 2020-09-16
TWI754931B true TWI754931B (zh) 2022-02-11

Family

ID=57251926

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105110861A TWI754611B (zh) 2015-04-17 2016-04-07 Ｆｐｃ用導電性黏著片材及使用此片材之ｆｐｃ
TW109115674A TWI754931B (zh) 2015-04-17 2016-04-07 Fpc用導電性黏著片材及使用此片材之fpc

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW105110861A TWI754611B (zh) 2015-04-17 2016-04-07 Ｆｐｃ用導電性黏著片材及使用此片材之ｆｐｃ

Country Status (4)

Country Link
JP (1) JP6280518B2 (ja)
KR (3) KR101764754B1 (ja)
CN (1) CN106042519B (ja)
TW (2) TWI754611B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109890124B (zh) * 2017-12-06 2024-03-19 昆山雅森电子材料科技有限公司 多层异向穿刺型导电布胶及使用其的fpc补强屏蔽结构
JPWO2022049937A1 (ja) * 2020-09-03 2022-03-10
CN111968536B (zh) * 2020-09-09 2022-06-10 武汉华星光电半导体显示技术有限公司 屏蔽带及显示模组的制备方法
WO2024185835A1 (ja) * 2023-03-08 2024-09-12 タツタ電線株式会社 積層体及び電磁波シールドフィルム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW552300B (en) * 1999-04-06 2003-09-11 Tomoegawa Paper Co Ltd Electrically conductive adhesive composition, electrically conductive adhesive sheet and use thereof
TW201440630A (zh) * 2013-02-28 2014-10-16 Fujimori Kogyo Co 撓性印刷電路板用電磁波遮蔽材

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61222299A (ja) 1985-03-28 1986-10-02 日本光フアイバ株式会社 電磁波シ−ルド用テ−プもしくはシ−ト
JPH07122883A (ja) 1993-10-21 1995-05-12 Nitto Denko Corp 電磁波シ−ルド材
JPH1197879A (ja) * 1997-09-19 1999-04-09 Bridgestone Corp 電磁波シールド性光透過窓材
JP3535412B2 (ja) * 1999-04-06 2004-06-07 株式会社巴川製紙所 導電性接着剤組成物、導電性接着剤シート及びそれを用いた電磁波シールド材料ならびに電磁波シールド性フレキシブルプリント基板。
JP4956867B2 (ja) * 2001-04-27 2012-06-20 大日本印刷株式会社 フラットケーブル用シールド材及びシールド付きフラットケーブル
JP4759899B2 (ja) * 2001-09-28 2011-08-31 大日本印刷株式会社 電磁波シールド材および電磁波シールド付きフラットケーブル
JP2004212496A (ja) * 2002-12-27 2004-07-29 Nippon Aerosil Co Ltd 混合粒子
JP4825830B2 (ja) * 2008-03-11 2011-11-30 住友電気工業株式会社 金属補強板を備えたフレキシブルプリント配線板
JP6254386B2 (ja) * 2013-08-29 2017-12-27 共同印刷株式会社 感圧接着剤組成物
CN107922804A (zh) * 2015-09-07 2018-04-17 株式会社巴川制纸所 导电性粘接剂组合物、导电性粘接片和使用了其的配线器件

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW552300B (en) * 1999-04-06 2003-09-11 Tomoegawa Paper Co Ltd Electrically conductive adhesive composition, electrically conductive adhesive sheet and use thereof
TW201440630A (zh) * 2013-02-28 2014-10-16 Fujimori Kogyo Co 撓性印刷電路板用電磁波遮蔽材

Also Published As

Publication number Publication date
KR20170092502A (ko) 2017-08-11
KR101848635B1 (ko) 2018-04-13
KR101764754B1 (ko) 2017-08-03
KR20160123990A (ko) 2016-10-26
JP2016207738A (ja) 2016-12-08
KR101953555B1 (ko) 2019-03-04
TW202033700A (zh) 2020-09-16
JP6280518B2 (ja) 2018-02-14
KR20180040129A (ko) 2018-04-19
CN106042519A (zh) 2016-10-26
TWI754611B (zh) 2022-02-11
CN106042519B (zh) 2020-05-05
TW201702336A (zh) 2017-01-16

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