TWI753605B - Pad conditioner and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a pad conditioner and a manufacturing method thereof. The pad conditioner sequentially comprising a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the substrate, the abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer, each of the abrasive particles has a protrusion that exposes out of the bonding layer, and the protrusion is subjected to insulation treatment. The protective layer covers the surface of the bonding layer, and the protrusion is exposed out of the protective layer. The pad conditioner of the present invention has the protection for the bonding layer from being damaged by abrasion and hold the abrasive particles, avoiding the abrasive particles fallen off or out of position, as well as to maintain the abrasive effect and service life of the pad conditioner.

Description

Polishing pad conditioner and method of making the same

The present invention relates to a polishing pad conditioner, particularly for chemical mechanical polishing (CMP), and a method of making the same.

Chemical Mechanical Polishing (CMP) is an important process in semiconductor manufacturing. In addition to producing wafers of suitable size, CMP can flatten the wafer surface for subsequent fabrication of integrated circuits. CMP uses a polishing slurry and a polishing pad. The liquid of the polishing slurry is corrosive, and the particles in it can fill the fine grooves of the polishing pad. After being fixed, it provides mechanical friction to grind the wafer when the polishing pad rotates, reducing the Surface roughness and achieve polishing effect.

However, after a period of use, debris and hardened slurry will accumulate on the polishing pad, resulting in "glazing" or hardening of the surface, that is, the micro-grooves will be filled with hardened slurry and cannot hold the newly filled slurry. Grind the medium particles of the slurry, thereby reducing the grinding effect. In addition, when the polishing slurry on the surface of the polishing pad is hardened to a certain extent, there will be protrusions, which will destroy the overall roughness of the wafer surface during polishing, and cannot achieve the effect of wafer planarization. Therefore, polishing pads need to be fixed and trimmed with polishing pad conditioners (or polishing pad conditioners, diamond discs) to remove surface accumulations to restore the original working surface of the polishing pads, prolong the service life of the polishing pads and reduce replacement costs.

However, the working surface of the polishing pad dresser for grinding carries abrasive particles. During long-term grinding, the working surface cannot hold the abrasive particles due to wear and tear, causing the abrasive particles to fall off and dislocate. The detached abrasive particles remaining on the polishing pad will scratch the wafer, and the ectopic abrasive particles will cause uneven trimming of the polishing pad, thereby affecting the CMP process. Therefore, how to protect the surface of the polishing pad conditioner from wear and maintain the quality of the abrasive particles is the problem to be solved by the polishing pad conditioner technology.

In view of the above problems, an object of the present invention is to provide a polishing pad conditioner, which includes a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the substrate, the abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer, each of the abrasive particles has a protruding portion exposing the bonding layer, and the protruding portion is Insulation treatment. The protective layer covers the surface of the bonding layer, and the protruding portion is exposed outside the protective layer.

In a preferred embodiment, the protective layer is formed by an electrodeposition coating composition; wherein, the electrodeposition coating composition comprises a host resin, and the host resin is epoxy resin, acrylic resin, polybutadiene resin, polybutadiene resin, etc. ester resin or polyamide resin.

In a preferred embodiment, the substrate is a metal substrate, a metal alloy substrate, a stainless steel substrate or a die steel substrate.

In a preferred embodiment, the bonding layer is a brazing material, an electroplating material, a ceramic material, a metal material or a polymer material.

In a preferred embodiment, the abrasive particles are one or more abrasive particles selected from the group consisting of natural diamonds, synthetic diamonds, polycrystalline diamonds, cubic boron nitride, alumina, and silicon carbide.

In a preferred embodiment, the polishing pad conditioner has a cutting force (CR _completed ), which is compared with the cutting force (CR _initial ) of the polishing pad conditioner that has not been covered with a protective layer, and conforms to the following formula:

，即該切削力(CR_completed)與尚未覆蓋 有該保護層之拋光墊修整器之切削力(CR_initial)的變化率小於10%。

, that is, the rate of change between the cutting force (CR _completed ) and the cutting force (CR _initial ) of the pad dresser not covered with the protective layer is less than 10%.

Another object of the present invention is to provide a method for manufacturing a polishing pad conditioner, the steps of which include: (a) providing a substrate; (b) forming a polishing layer on the surface of the substrate, the polishing layer comprising a bonding layer and a plurality of abrasive particles embedded in the bonding layer, each of the abrasive particles having a protrusion exposed above the bonding layer; (c) insulating the protrusion; and (d) electrodepositing a protective layer on the surface of the bonding layer , and the insulating-treated protrusion is exposed outside the protective layer.

In a preferred embodiment, the insulation treatment includes physical or chemical insulation.

In a preferred embodiment, the physical insulation includes sandblasting or plasma insulation.

In a preferred embodiment, wherein the chemical insulation comprises etching insulation.

In a preferred embodiment, the etching method is etching with a chemical solution comprising one or more components selected from the group consisting of: nitric acid, aqua regia, hydrofluoric acid, sulfuric acid, hydrogen peroxide, perchloric acid Acid, hydrochloric acid, ferric chloride, acetic acid and cerium ammonium nitrate.

In a preferred embodiment, the bonding layer is formed by electroplating or brazing.

Compared with the prior art, the polishing pad conditioner of the present invention has a protective layer and abrasive particle protrusions exposed outside the protective layer, and the protective layer can prevent the metal (such as nickel) of the bonding layer from being precipitated during the CMP process It can prevent pollution, and can protect the bonding layer from being damaged by wear and hold the abrasive particles, avoid the abrasive particles falling off or out of place, and because the protruding parts of the abrasive particles are exposed outside the protective layer, the polishing effect of the polishing pad dresser can be maintained. service life. In addition, in the manufacturing method of the polishing pad dresser of the present invention, the protective layer is electrodeposited only after the protruding parts of the abrasive particles are subjected to insulation treatment. layer does not cover the protrusion, thus maintaining The cutting force of the polishing pad dresser is maintained, and the protective layer completed by electrodeposition has the advantages of thin thickness and uniform distribution. Besides protecting the bonding layer, the height of the protrusion can be adjusted and maintained as required.

1: Substrate

2: abrasive layer

21: Bonding layer

22: Abrasive particles

221: Protrusion

3: protective layer

4: Plasma nozzle

FIG. 1 is a polishing pad conditioner of the present invention.

FIG. 2 is a manufacturing method of a polishing pad conditioner of a comparative example.

FIG. 3 is a manufacturing method of the polishing pad conditioner of the present invention.

4 is a scanning electron microscope (SEM) photograph of the surface of the polishing layer of the polishing pad conditioner of Example and Comparative Example 1; (a) is the surface of the polishing layer of the polishing pad conditioner of Comparative Example 1, (b) is an embodiment The abrasive layer surface of the pad conditioner.

The following embodiments should not be construed to unduly limit the invention. Modifications and variations of the embodiments discussed herein can be made by those of ordinary skill in the art to which this invention pertains without departing from the spirit or scope of the invention, and still fall within the scope of the invention.

The terms "a" and "an" herein refer to one or more than one (ie, at least one) of the grammatical objects herein.

As shown in FIG. 1 , the polishing pad conditioner of the present invention includes a substrate 1 , a polishing layer 2 and a protective layer 3 . The abrasive layer 2 covers the surface of the substrate 1. The abrasive layer 2 includes a bonding layer 21 and a plurality of abrasive particles 22 embedded in the bonding layer 21. Each of the abrasive particles 22 has a protrusion 221 exposing the bonding layer 21, and the protrusions 221 are insulated. The protective layer 3 covers the surface of the bonding layer 21 , and the protruding portion 221 is exposed outside the protective layer 3 .

FIG. 2 provides a comparative example of a manufacturing method of a polishing pad dresser. After embedding the abrasive particles 22 in the bonding layer 21 , a protective layer 3 is applied on the surfaces of the abrasive particles 22 and the bonding layer 21 . However, after various experiments by the inventors, the inventors found that, when the polishing pad conditioner is manufactured, no matter what bonding method (eg, brazing, electroplating/electrodeposition, or sintering, etc.) is used, the abrasive particles 22 are embedded and fixed in the When the bonding layer 21 is used, the abrasive particles 22 are subjected to brazing, electroplating or sintering material residues during the bonding process, so the abrasive particles 22 have conductivity after being fixed on the bonding layer 21. Therefore, the next step is to apply a protective layer 3. When the bonding layer 21 is covered by coating or electrodeposition, the abrasive particles 22 are covered by the protective layer 3 due to their conductivity, so that they cannot be exposed outside the protective layer 3. The polishing pad dresser with protective layer 3 and the polishing pad dresser with protective layer 3 reduce the cutting force because the abrasive particles 22 are covered by the protective layer 3, thereby reducing the overall cutting force of the polishing pad dresser. Moreover, the covering The protective layer 3 on the abrasive particles 22 is easily peeled off (peeling) during polishing by the polishing pad dresser, resulting in impurities falling on the polishing pad and affecting the polishing quality.

Different from the manufacturing method of the polishing pad conditioner of the comparative example, as shown in FIG. 3 , the manufacturing method of the polishing pad conditioner of the present invention includes the following steps: (a) providing a substrate 1 ; (b) forming a polishing layer 2 On the surface of the substrate 1, the abrasive layer 2 includes a bonding layer 21 and a plurality of abrasive particles 22 embedded in the bonding layer 21, each of the abrasive particles 22 has a protrusion 221 exposed above the bonding layer 21; ( c) Insulation treatment of the protruding portion 221 (the insulation treatment shown in FIG. 4 uses plasma as an example, and the protruding portion 221 is sprayed by the plasma shower head 4 for insulation treatment. However, the insulation treatment of the present invention is not limited to the use of plasma ); and (d) electrodepositing a protective layer 3 on the surface of the bonding layer 21 , and the insulating protrusions 221 are exposed outside the protective layer 3 . Due to the insulating treatment of the protruding portion 221 in the step (c), the surface of the protruding portion 221 has been completely insulated. When the protective layer 3 is electrodeposited in the subsequent step (d), the charged resin colloidal particles in the solution migrate under the action of the electric field due to the electrodeposition system. to the surface of the opposite charged electrode, and the surface of the protrusion 221 has been insulated, so the protective layer 3 cannot be formed on the protrusion The protruding portion 221 will be exposed outside the protective layer 3, so that the abrasive particles 22 can maintain the original cutting force, and the protective layer 3 will not peel off (peeling) during grinding and generate impurities situation. Moreover, because the protective layer 3 covers the bonding layer 21 , the bonding layer 21 can be protected from being damaged by friction during grinding, so that the bonding layer 21 can firmly hold the abrasive particles 221 and avoid the abrasive particles 221 Exfoliation or ectopic, and because the grinding slurry in CMP is usually corrosive, such as acid etching solution, the protective layer 3 can protect the bonding layer 21 from being eroded by the etching solution and precipitate metals (such as nickel), preventing contamination .

，即該切削力(CR_completed)與尚未覆蓋 有該保護層之拋光墊修整器之切削力(CR_initial)的變化率小於10%。利用本發明之拋光墊修整器之製造方法所製得的拋光墊修整器，在電沉積該保護層3於該結合層21後，對該拋光墊修整器的切削力影響小。本發明之拋光墊修整器的切削力為300μm/hr以上，較佳為320μm/hr以上，更佳為330μm/hr以上；上述之切削力僅為例式而非限制性，本發明領域中具有通常知識者可依照需求，調整並獲得所需的拋光墊修整器的切削力。 After testing, the polishing pad conditioner of the present invention has a cutting force (CR _completed ), which is compared with the cutting force (CR _initial ) of the polishing pad conditioner that has not been covered with the protective layer 3 (ie, the bonding layer 21 has not been covered with the protective layer). 3), the rate of change of its cutting force conforms to the following formula:

, that is, the rate of change between the cutting force (CR _completed ) and the cutting force (CR _initial ) of the pad dresser not covered with the protective layer is less than 10%. The polishing pad conditioner manufactured by the manufacturing method of the polishing pad conditioner of the present invention has little influence on the cutting force of the polishing pad conditioner after electrodepositing the protective layer 3 on the bonding layer 21 . The cutting force of the polishing pad conditioner of the present invention is above 300 μm/hr, preferably above 320 μm/hr, more preferably above 330 μm/hr; Usually the knowledgeable person can adjust and obtain the required cutting force of the pad conditioner according to the needs.

Materials and manufacturing methods that can be used to construct the polishing pad conditioner of the present invention will be described below. It should be noted that the materials and techniques disclosed herein are only exemplary, and other materials and techniques not described are within the scope of the present invention. can be used.

In the polishing pad dresser of the present invention, the base material 1 is made of one or more of stainless steel, metal materials, plastic materials and ceramic materials. In fact, as long as the base material 1 can carry the polishing layer 2 poles Yes, the preferred material can be metal substrate, metal alloy substrate, stainless steel substrate or die steel substrate. Specifically, the metal substrate includes but is not limited to copper, iron, aluminum, titanium or tin, etc.; the metal alloy substrate includes but is not limited to iron alloy, copper alloy, aluminum alloy, titanium alloy or magnesium alloy.

In the polishing pad conditioner of the present invention, the bonding layer 21 is used to support the interlayers of the abrasive particles 22 and adhere to the substrate 1 . The abrasive particles 22 are mainly embedded and fixed in the bonding layer 21 . The bonding layer 21 can be formed by various methods, such as resin organic bonding method, electroplating method, brazing method electrodeposition, and the material includes brazing material, electroplating material, ceramic material, metal material or polymer material, and the present invention is not limited to and so on. Specifically, the brazing material, the electroplating material or the metal material includes at least one selected from the group consisting of iron, cobalt, nickel, chromium, manganese, silicon, aluminum, and combinations thereof; the polymer material includes a ring Oxygen resin, polyester resin, polyacrylic resin or phenolic resin; the ceramic material contains various metal oxides, nitrides, carbides, borides, silicides or combinations thereof, such as silicon carbide, silicon nitride, nitride Aluminum, alumina, titanium carbide, titanium boride or boron carbide, etc.

In the polishing pad conditioner of the present invention, the abrasive particles 22 are one or more abrasive particles 22 selected from the group consisting of natural diamonds, synthetic diamonds, polycrystalline diamonds, cubic boron nitride, alumina and silicon carbide. The “protruding portion 221 of the abrasive particle 22” referred to herein refers to the portion of the upper end of the abrasive particle 22 that is not covered by the protective layer 3, and its shape may be but not limited to pyramid shape, conical shape, arc shape, cylindrical shape , blade-shaped or angular column shape.

The term “the protruding portion 221 is insulated” as used herein means that the abrasive particles 22 are embedded and fixed on the bonding layer 21 through a bonding process, and the protruding portion 221 of the abrasive particles 22 is subjected to brazing, electroplating or other processes during the bonding process. The residues of the sintered material, therefore, are electrically conductive, and are therefore subjected to further insulation treatment after the bonding process, the insulation treatment including physical or chemical insulation. The physical insulation includes sandblasting or plasma insulation. The principle is, for example, sandblasting or plasma to clean the conductive material on the protruding portion 221 so that it does not have conductivity. Wherein, the particle size of the sandblasting particles used in the sandblasting method is about 50-200 μm , and the temperature of the plasma method is about 150-350 degrees. The chemical insulation includes insulation by etching, which is etched with a chemical solution, so that the conductive substances on the protruding portion 221 are removed after etching by the chemical solution; the chemical solution includes but is not limited to nitric acid, aqua regia, hydrofluoric acid, Sulfuric acid, hydrogen peroxide, perchloric acid, hydrochloric acid, ferric chloride, acetic acid, cerium ammonium nitrate, potassium chloride, potassium iodide, ammonium persulfate, ammonium chloride, or combinations thereof. Preferably, the chemical solution comprises one or more components selected from the group consisting of nitric acid, aqua regia, hydrofluoric acid, sulfuric acid, hydrogen peroxide, perchloric acid, hydrochloric acid, ferric chloride, acetic acid and ammonium nitrate cerium. After the above-mentioned insulating treatment, the surface of the protruding portion 221 is insulated and not charged, and the subsequent protective layer 3 cannot be electrodeposited on the surface of the protruding portion 221 , so the protruding portion 221 can be exposed outside the protective layer 3 .

In the polishing pad conditioner of the present invention, the protective layer 3 is preferably formed of an electrodeposition coating composition, and electrodeposition is a surface treatment, which involves immersing the polishing pad conditioner in the electrodeposition coating composition, and applying the electrodeposition coating composition. The abrasive layer 2 is placed between electrodes and a current is applied, and the electrodeposition coating composition is deposited on the surface of the bonding layer 21 due to the electrical action to form a uniform protective layer 3 . Although other surface treatments (such as spray coating or spin coating) can also be used, electrodeposition coating can be used to obtain a uniform and thin protective layer 3; a thin protective layer 3 can help maintain the abrasive particles 22 and the There is a considerable height distance between the protective layers 3 to maintain the cutting force of the abrasive particles 22. The preferred thickness of the protective layer 3 can be but not limited to 10-30 μm , and the thickness difference of each position is preferably controlled at 1.0~3.0 μm , more preferably 1.5 μm . The electrodeposition coating composition comprises a host resin, and the host resin is epoxy resin, acrylic resin, polybutadiene resin, polyester resin or polyamide resin. Specific examples include: amine-modified epoxy resin (such as diethyltriamine-containing modified epoxy resin), carboxyl- and hydroxyl-containing acrylic resin or epoxidized polybutadiene resin, etc., and the present invention is not limited thereto Wait.

[specific embodiment]

The following examples provide the manufacturing method of the polishing pad dresser of the present invention. It should be understood that the examples are only for illustration and are not intended to limit the present invention.

Example. Pad conditioner with insulated protrusions of the present invention

Use molten nickel-chromium alloy and diamond particles to form an abrasive layer on the surface of a stainless steel; make the molten nickel-chromium alloy coat part of the oblique side of each of the diamond particles by surface tension to embed the diamond particles into the support and fixed. Plasma insulating treatment of the protrusions of each of the diamond particles insulates the surface of the protrusions. Finally, an epoxy resin (Bipezhi International Co., Ltd. (PPG)) is electrodeposited on the surface of the bonding layer to form a protective layer, and the polishing pad conditioner of the present invention is obtained.

Comparative Example 1. Pad conditioner without insulation treatment on protrusions

The manufacturing method of the polishing pad conditioner of Comparative Example 1 is the same as that of the embodiment, the only difference is that the protruding portion of each diamond particle is not insulated in Comparative Example 1.

Test 1. Cutting force

The cutting force of the polishing pad conditioners of Example and Comparative Example 1 was tested respectively, and the rate of change of cutting force was calculated by the following formula:

；結果如下表1所示。

; The results are shown in Table 1 below.

Table 1

As shown in Table 1, after the bonding layer of the polishing pad conditioner of the embodiment is covered with the protective layer, the cutting force change rate is less than 10%, which means that even after being covered by the protective layer, the cutting force of the polishing pad conditioner of the embodiment will not decrease. In contrast, after the abrasive layer of the polishing pad conditioner of Comparative Example 1 was covered with the protective layer, the cutting force change rate was greater than 10%, which decreased from 318 μm /hr to 202 μm /hr. The difference between Example 1 and Comparative Example 1 is whether the protective layer has protrusions covering the diamond particles. It can be seen from Comparative Example 1 that when the protective layer covers the protrusions, the cutting force of the pad dresser is greatly reduced.

Test 2. Scanning Electron Microscope (SEM) Photographs of the Abrasive Layer Surface of the Pad Conditioner

Use scanning electron microscope (SEM) to photograph the surface of the abrasive layer of the polishing pad conditioner of Example and Comparative Example 1, the results are shown in Figure 4; Figure 4(a) is the surface of the abrasive layer of the polishing pad conditioner of Comparative Example 1, Figure 4 (b) is the surface of the abrasive layer of the polishing pad conditioner of the embodiment. As shown in FIG. 4( b ), the abrasive particle protruding portion of the polishing pad dresser of the embodiment has a sharper cutting surface because the protective layer cannot be electrodeposited on its surface due to the insulating treatment. In contrast, as shown in Fig. 4(a), the abrasive particle protrusions of the polishing pad conditioner of Comparative Example 1 have not undergone insulation treatment, and the protective layer is electrodeposited on the surface, so the cutting surface is relatively rounded without sharp cutting noodle.

Comparative Example 2. Pad conditioner without protective layer

Use molten nickel-chromium alloy and diamond particles to form an abrasive layer on the surface of a stainless steel; make the molten nickel-chromium alloy coat part of the oblique side of each of the diamond particles by surface tension to embed the diamond particles into the support and Fixed, that is, to obtain a polishing pad conditioner without a protective layer.

Test 3. Metal Precipitation Comparison

The polishing pad conditioners of Example and Comparative Example 2 were soaked in 3% nitric acid solution respectively, and the amount of metal in the soaked 3% nitric acid solution was tested after 24 hours. The results are shown in Table 2 below.

Table 2

As shown in Table 2, the 3% nitric acid liquid stock solution contains low concentrations of chromium, iron, nickel and cobalt, and the polishing pad dresser of the embodiment is soaked, although chromium, iron, nickel and cobalt are precipitated, but the concentrations are not high. In contrast, the polishing pad conditioner of Comparative Example 2 has very high precipitation concentrations of chromium, iron, nickel and cobalt because there is no protective layer.

Through the above-mentioned specific embodiment, the polishing pad conditioner manufactured by the insulating treatment of the protrusions can maintain the cutting force without reducing the grinding effect because the protrusions of the diamond particles are not covered by a protective layer, and the polishing pad conditioner can be maintained. Grinding ability. And, when the bonding layer of the pad conditioner is covered with a protective layer, the metal of the bonding layer can be protected from being precipitated.

In summary, the polishing pad conditioner of the present invention has a protective layer, which can prevent the metal (eg nickel) of the bonding layer from being precipitated during the CMP process to prevent contamination, and protect the bonding layer from being damaged by wear and hold the abrasive particles. , to prevent the abrasive particles from falling off or out of position, and to prevent the protective layer of the polishing pad dresser from peeling off (peeling) during polishing, resulting in impurities falling on the polishing pad, which can maintain the polishing effect and prolong the service life. In addition, in the manufacturing method of the polishing pad conditioner of the present invention, insulating treatment and electrodeposition are used, and the insulating treatment can insulate the protrusions of the abrasive particles, so that the protective layer will not cover the protrusions during subsequent electrodeposition, and electrodeposition is used. The completed protective layer has the advantages of thin thickness and uniform distribution, and can maintain the height of the protrusion, that is, maintain the cutting force of the polishing pad conditioner. Therefore, the polishing pad conditioner of the present invention is suitable for use in CMP and has industrial applicability.

The present invention has been described in detail above, but what has been described above is only a preferred embodiment of the present invention, and should not limit the scope of implementation of the present invention, that is, all claims made according to the scope of the patent application of the present invention are equal Changes and modifications should still fall within the scope of the patent of the present invention.

1: Substrate

2: abrasive layer

21: Bonding layer

22: Abrasive particles

221: Protrusion

3: protective layer

Claims (11)

A polishing pad conditioner, comprising: a base material; an abrasive layer covering the surface of the base material, the abrasive layer comprising a bonding layer and a plurality of abrasive particles embedded in the bonding layer, each grinding The particle has a protruding part exposing the bonding layer, and the protruding part is treated with insulation; and a protective layer, the protective layer covers the surface of the bonding layer, the protruding part is exposed outside the protective layer; wherein the polishing The pad conditioner has a cutting force (CR _completed ), and the cutting force (CR _completed ) and the polishing pad not yet covered with the protection layer are compared with the cutting force (CR _initial ) of the polishing pad conditioner not yet covered with the protection layer. The change rate of the cutting force (CR _initial ) of the dresser is less than 10%. The polishing pad conditioner as claimed in claim 1, wherein the protective layer is formed by an electrodeposition coating composition; wherein, the electrodeposition coating composition comprises a host resin, and the host resin is epoxy resin, acrylic resin, polymer resin Butadiene resin, polyester resin or polyamide resin. The polishing pad conditioner of claim 1, wherein the substrate is a metal substrate, a metal alloy substrate, a stainless steel substrate or a die steel substrate. The polishing pad conditioner as claimed in claim 1, wherein the bonding layer is a brazing material, an electroplating material, a ceramic material, a metal material or a polymer material. The polishing pad conditioner of claim 1, wherein the abrasive particles are one or more abrasive particles selected from the group consisting of natural diamonds, synthetic diamonds, polycrystalline diamonds, cubic boron nitride, alumina, and carbides silicon. A method of manufacturing a polishing pad conditioner, the steps comprising: (a) providing a substrate; (b) forming an abrasive layer on the surface of the substrate, the abrasive layer comprising a bonding layer and a plurality of abrasive particles embedded in the bonding layer, each of the abrasive particles has a protruding portion exposed above the bonding layer; (c) insulating the protrusion; and (d) electrodepositing a protective layer on the surface of the bonding layer, and the insulating protrusion is exposed outside the protective layer. The manufacturing method of claim 6, wherein the insulating treatment includes physical or chemical insulating. The manufacturing method of claim 7, wherein the physical insulation comprises sandblasting or plasma insulation. The manufacturing method of claim 7, wherein the chemical insulation comprises etching insulation. The manufacturing method of claim 9, wherein the etching method is etching with a chemical solution, and the chemical solution comprises one or more components selected from the group consisting of: nitric acid, aqua regia, hydrofluoric acid, sulfuric acid, peroxide Hydrogen, perchloric acid, hydrochloric acid, ferric chloride, acetic acid and cerium ammonium nitrate. The manufacturing method according to any one of claims 6 to 10, wherein the bonding layer is formed by electroplating or brazing.

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