TWI752162B - 聚醯胺樹脂組成物及成形該聚醯胺樹脂組成物而成之成形體 - Google Patents

聚醯胺樹脂組成物及成形該聚醯胺樹脂組成物而成之成形體 Download PDF

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Publication number
TWI752162B
TWI752162B TW107103226A TW107103226A TWI752162B TW I752162 B TWI752162 B TW I752162B TW 107103226 A TW107103226 A TW 107103226A TW 107103226 A TW107103226 A TW 107103226A TW I752162 B TWI752162 B TW I752162B
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TW
Taiwan
Prior art keywords
acid
polyamide
resin composition
mass
semi
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TW107103226A
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English (en)
Chinese (zh)
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TW201835224A (zh
Inventor
正木辰典
上川泰生
三井淳一
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日商尤尼吉可股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/24—Derivatives of hydrazine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW107103226A 2017-02-03 2018-01-30 聚醯胺樹脂組成物及成形該聚醯胺樹脂組成物而成之成形體 TWI752162B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-018075 2017-02-03
JP2017018075 2017-02-03

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Publication Number Publication Date
TW201835224A TW201835224A (zh) 2018-10-01
TWI752162B true TWI752162B (zh) 2022-01-11

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TW107103226A TWI752162B (zh) 2017-02-03 2018-01-30 聚醯胺樹脂組成物及成形該聚醯胺樹脂組成物而成之成形體

Country Status (4)

Country Link
JP (1) JP7129086B2 (fr)
CN (1) CN110177839B (fr)
TW (1) TWI752162B (fr)
WO (1) WO2018143110A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112592582B (zh) * 2019-10-01 2024-01-02 尤尼吉可株式会社 聚酰胺树脂组合物和由其构成的成型体及车载照相机用部件
CN112574557B (zh) * 2020-11-27 2022-07-12 珠海万通特种工程塑料有限公司 一种半芳香族聚酰胺组合物及其制备方法和应用
CN115466508B (zh) * 2022-09-30 2023-06-16 珠海万通特种工程塑料有限公司 一种无卤阻燃半芳香族聚酰胺复合材料及其制备方法与应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201120140A (en) * 2009-06-05 2011-06-16 Ems Patent Ag Flame-retardant semiaromatic polyamide molding compositions
JP2014521765A (ja) * 2011-07-27 2014-08-28 ディーエスエム アイピー アセッツ ビー．ブイ． 難燃性ポリアミド組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4514533A (en) * 1983-09-27 1985-04-30 Canusa Coating Systems Limited Hindered phenolic norbornane-2,3-dicarboximides and stabilized compositions
CA1334117C (fr) * 1988-04-28 1995-01-24 Hiroyuki Wakabayashi Polymere renforce de fibres de verre
JP2649406B2 (ja) * 1989-02-15 1997-09-03 東燃化学株式会社 繊維強化ポリマー組成物
BE1003675A3 (fr) * 1990-02-23 1992-05-19 Solvay Compositions stabilisees a base de polyamides et objets faconnes a partir de ces compositions.
JP4681382B2 (ja) 2005-07-28 2011-05-11 帝人化成株式会社 熱可塑性樹脂組成物
JP5548625B2 (ja) * 2008-03-03 2014-07-16 クラリアント・ファイナンス・（ビーブイアイ）・リミテッド 耐燃性、非腐食性、良好な流動性のポリアミドおよびポリエステル成形材料を製造する方法
CN102050760A (zh) * 2009-10-29 2011-05-11 中国石油化工股份有限公司 受阻酚类衍生物抗氧剂的催化制备方法
TWI563034B (en) * 2011-05-13 2016-12-21 Dsm Ip Assets Bv Flame retardant semi-aromatic polyamide composition and moulded products made therefrom
JP2013064032A (ja) * 2011-09-15 2013-04-11 Unitika Ltd ポリアミド樹脂組成物およびそれを成形してなる成形体
KR20140099138A (ko) * 2013-02-01 2014-08-11 제일모직주식회사 광안정성 및 내변색성이 우수한 폴리아미드 수지 조성물
JP5654104B2 (ja) 2013-08-28 2015-01-14 三井化学株式会社 押出成型品
WO2017082231A1 (fr) * 2015-11-12 2017-05-18 ユニチカ株式会社 Composition de résine de polyamide et article moulé obtenu par moulage de cette dernière

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201120140A (en) * 2009-06-05 2011-06-16 Ems Patent Ag Flame-retardant semiaromatic polyamide molding compositions
JP2014521765A (ja) * 2011-07-27 2014-08-28 ディーエスエム アイピー アセッツ ビー．ブイ． 難燃性ポリアミド組成物

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Publication number Publication date
TW201835224A (zh) 2018-10-01
CN110177839A (zh) 2019-08-27
JP7129086B2 (ja) 2022-09-01
CN110177839B (zh) 2022-03-01
JPWO2018143110A1 (ja) 2019-11-21
WO2018143110A1 (fr) 2018-08-09

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