TWI750816B - Substrate processing apparatus - Google Patents
Substrate processing apparatus Download PDFInfo
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- TWI750816B TWI750816B TW109132601A TW109132601A TWI750816B TW I750816 B TWI750816 B TW I750816B TW 109132601 A TW109132601 A TW 109132601A TW 109132601 A TW109132601 A TW 109132601A TW I750816 B TWI750816 B TW I750816B
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- substrate processing
- rotary table
- processing apparatus
- sealing ring
- hooking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Abstract
本發明涉及基板處理裝置,包含:旋轉台,在旋轉台的上表面供晶片放置;環狀密封環,結合於旋轉台的上部,沿內周面形成有複數個掛接槽;複數個開閉單元,設置為以旋轉台的垂直旋轉中心為基準能夠在徑向方向上聯動,在進行鎖定動作時,掛接於掛接槽,並且在進行解鎖動作時,從掛接槽脫離,從而解除掛接;以及動力傳遞單元,設置在旋轉台的設置空間中,透過外力使開閉單元向鎖定位置或者解鎖位置聯動。The invention relates to a substrate processing device, comprising: a rotary table on which wafers are placed on the upper surface of the rotary table; an annular sealing ring combined with the upper part of the rotary table and formed with a plurality of hooking grooves along the inner peripheral surface; a plurality of opening and closing units , set up to be able to interlock in the radial direction based on the vertical rotation center of the turntable, when performing the locking action, it is hooked to the hooking groove, and when the unlocking action is performed, it is disengaged from the hooking groove, thereby releasing the hooking ; and a power transmission unit, which is arranged in the setting space of the rotary table, and causes the opening and closing unit to be linked to the locking position or the unlocking position through an external force.
Description
本發明涉及一種基板處理裝置,具體來說,涉及一種使得密封環的結合以及分離過程簡單,並且能夠減少密封環的結合誤差(扭曲等)的基板處理裝置。The present invention relates to a substrate processing apparatus, and in particular, to a substrate processing apparatus that simplifies the bonding and separation process of the seal ring and can reduce the bonding error (distortion, etc.) of the seal ring.
一般情況下,在半導體製程中需要執行蝕刻並洗滌晶片等製程,在蝕刻或洗滌晶片的製程中將使用基板處理裝置。洗滌晶片的基板處理裝置由設置為可旋轉方式且晶片放置在上部的旋轉台和以環狀結合於旋轉台的邊緣區域的密封環等構成,向放置在旋轉台的晶片供給處理液。但是,根據現有的基板處理裝置,在旋轉台的上部結合密封環的過程較繁瑣,並且結合時由於密封環的結合完成狀態不固定,有可能發生結合誤差(扭曲等),當發生誤差時,其將成為降低密封環功能的主要原因。Generally, processes such as etching and washing wafers need to be performed in the semiconductor manufacturing process, and a substrate processing apparatus is used in the process of etching or washing the wafers. The substrate processing apparatus for washing wafers is composed of a rotatable turntable on which the wafer is placed, and a seal ring connected to an edge region of the turntable in a ring shape, and supplies a processing liquid to the wafers placed on the turntable. However, according to the conventional substrate processing apparatus, the process of bonding the seal ring to the upper part of the turntable is complicated, and the bonding completion state of the seal ring is not fixed during bonding, and bonding errors (torsion, etc.) may occur. It will be the main reason for reducing the function of the sealing ring.
作為與本發明相關的先前技術文獻有韓國專利公開號第10-2016-0122067號,其公開日期為2016年10月21日,上述先前技術文獻揭露了晶片處理裝置以及用於晶片處理裝置的密封環。As a prior art document related to the present invention, there is Korean Patent Publication No. 10-2016-0122067, which was published on October 21, 2016, and the above prior art document discloses a wafer processing apparatus and a seal for the wafer processing apparatus ring.
技術問題technical problem
本發明的目的在於提供能夠減少密封環的結合誤差(扭曲等)的基板處理裝置。An object of the present invention is to provide a substrate processing apparatus capable of reducing coupling errors (twist etc.) of seal rings.
另外,本發明的目的在於提供能夠進一步提高密封環的密封性能,且能夠防止藥液滲透旋轉台與密封環之間的基板處理裝置。Another object of the present invention is to provide a substrate processing apparatus that can further improve the sealing performance of the seal ring and can prevent chemical liquid from permeating between the turntable and the seal ring.
技術解決方案technical solutions
根據本發明的基板處理裝置,包含:旋轉台,在旋轉台的上表面供晶片放置;環狀的密封環,結合於旋轉台的上部,沿密封環的內周面形成有複數個掛接槽;複數個開閉單元,設置為能夠以旋轉台的垂直旋轉中心為基準在徑向方向上聯動,在進行鎖定動作時,開閉單元掛接於掛接槽,在進行解鎖動作時,開閉單元從掛接槽脫離,從而解除掛接;以及動力傳遞單元,設置在旋轉台的設置空間,透過外力使開閉單元向鎖定位置或者解鎖位置聯動。The substrate processing apparatus according to the present invention includes: a rotary table on which wafers are placed on the upper surface of the rotary table; an annular sealing ring coupled to the upper part of the rotary table, and a plurality of hooking grooves are formed along the inner peripheral surface of the sealing ring ; A plurality of opening and closing units are arranged to be able to be linked in the radial direction with the vertical rotation center of the turntable as a reference. When performing a locking action, the opening and closing units are hooked to the hooking groove, and when performing an unlocking action, the opening and closing units are removed from the hook. The connecting groove is disengaged, thereby releasing the hooking; and the power transmission unit is arranged in the installation space of the rotary table, and the opening and closing unit is linked to the locking position or the unlocking position through an external force.
較佳地,旋轉台具有沿旋轉台的側面突出的放置部,以放置密封環的下端,密封環的下端放置在放置部上,並且密封環的內周面緊貼於旋轉台的側面。Preferably, the rotary table has a placement portion protruding along the side surface of the rotary table to place the lower end of the sealing ring, the lower end of the sealing ring is placed on the placement portion, and the inner peripheral surface of the sealing ring is closely attached to the side surface of the rotary table.
開閉單元包含:旋轉軸,以旋轉台的垂直旋轉中心為基準在徑向上配置,並且旋轉軸的下端以能夠水平旋轉的方式貫通結合於旋轉台;從動齒輪,以能夠水平旋轉的方式結合於旋轉軸的下端;以及桿,以能夠水平轉動的方式結合於旋轉軸的上端,在向鎖定位置轉動時,向一側偏心的一端掛接於掛接槽,在向解鎖位置轉動時,向一側偏心的一端脫離掛接槽,從而解除掛接。The opening and closing unit includes: a rotating shaft, which is arranged in the radial direction based on the vertical rotation center of the rotating table, and the lower end of the rotating shaft is penetratingly coupled to the rotating table in a horizontally rotatable manner; a driven gear is coupled to the rotating table in a horizontally rotatable manner The lower end of the rotating shaft; and the rod, which is combined with the upper end of the rotating shaft in a horizontally rotatable manner. When rotating to the locking position, the eccentric end to one side is hooked to the hooking groove, and when rotating to the unlocking position, it is connected to one side. The eccentric end of the side is released from the hooking slot, thereby releasing the hooking.
桿的下表面進一步具有錐形面,錐形面朝向偏心的一端向上傾斜而形成,在桿向鎖定位置轉動時,錐形面向下方加壓支承掛接槽的下表面。The lower surface of the lever further has a tapered surface, and the tapered surface is formed to be inclined upward toward the eccentric end. When the lever is rotated to the locking position, the tapered surface presses downward to support the lower surface of the hooking groove.
較佳地,動力傳遞單元與從動齒輪機械地咬合結合,使得從動齒輪向鎖定位置或者解鎖位置轉動。動力傳遞單元包含:旋轉板,以垂直旋轉中心為基準向鎖定方向或者解鎖方向能夠轉動,在徑向上,上下貫通形成有複數個導向孔;以及連接桿,連接桿的長度方向側的一端沿導向孔以能夠滑動的方式進行結合,連接桿的寬度方向的一端形成有移動鋸齒部,以與從動齒輪咬合結合。其中,當旋轉板向鎖定方向轉動時,連接桿向旋轉板的外側滑動,從而使從動齒輪轉動到鎖定位置,並且當旋轉板向解鎖方向轉動時,連接桿向旋轉板的垂直旋轉中心方向滑動,從而使從動齒輪轉動到解鎖位置。另外,導向孔具有如下形狀:朝向旋轉板的垂直旋轉中心和邊緣具有傾斜方向的長度的長孔形狀,連接桿的長度方向側的一端具有導向軸,導向軸以能夠滑動的方式插入導向孔的內部。Preferably, the power transmission unit is mechanically engaged with the driven gear, so that the driven gear rotates to the locked position or the unlocked position. The power transmission unit includes: a rotating plate, which is rotatable in the locking direction or the unlocking direction with the vertical rotation center as a reference, and a plurality of guide holes are formed through the vertical direction in the radial direction; The holes are slidably coupled, and a moving serration is formed at one end of the connecting rod in the width direction to engage with the driven gear. Wherein, when the rotating plate rotates in the locking direction, the connecting rod slides to the outside of the rotating plate, so that the driven gear rotates to the locked position, and when the rotating plate rotates in the unlocking direction, the connecting rod moves in the direction of the vertical rotation center of the rotating plate. Slide so that the driven gear turns to the unlocked position. In addition, the guide hole has a shape of an elongated hole having a length in the oblique direction toward the vertical rotation center and the edge of the rotary plate, and one end on the longitudinal side of the connecting rod has a guide shaft which is slidably inserted into the guide hole. internal.
較佳地,本發明進一步包含:彈性部件,彈性部件的兩端結合於設置空間和旋轉板,向旋轉板的鎖定方向作用拉力。Preferably, the present invention further comprises: an elastic member, two ends of the elastic member are combined with the setting space and the rotating plate, and act a pulling force in the locking direction of the rotating plate.
較佳地,旋轉台上沿放置部的上表面垂直設置有複數個緊固銷,密封環在下端凹陷形成有緊固槽,以供緊固銷透過凹凸方式對應插入。Preferably, a plurality of fastening pins are vertically arranged on the rotary table along the upper surface of the placing portion, and the lower end of the sealing ring is recessed with fastening grooves for corresponding insertion of the fastening pins through concave-convex manner.
旋轉台進一步具有:環狀的外側密封墊槽,沿放置部的上表面連續形成;以及環狀的外側密封墊,對應插入外側密封墊槽,外側密封墊的向外側密封墊槽的上部突出的上端緊貼於密封環的下端。The rotary table further has: an annular outer gasket groove, which is continuously formed along the upper surface of the placement portion; and an annular outer gasket, which is inserted into the outer gasket groove correspondingly, and the outer gasket protrudes toward the upper part of the outer gasket groove. The upper end is in close contact with the lower end of the sealing ring.
另外,密封環上沿內周面突出形成有延伸部,旋轉台可以進一步包含:環狀的內側密封墊槽,內側密封墊槽沿密封環的邊緣側上表面連續形成;以及環狀的內側密封墊,內側密封墊對應插入內側密封墊槽,向內側密封墊槽的上部突出的上端緊貼於延伸部的下表面或者內周面。In addition, an extension portion is formed on the seal ring to protrude along the inner peripheral surface, and the rotary table may further include: an annular inner gasket groove, the inner gasket groove is continuously formed along the upper surface of the edge side of the seal ring; and an annular inner seal The inner gasket is inserted into the inner gasket groove correspondingly, and the upper end protruding to the upper part of the inner gasket groove is closely attached to the lower surface or inner peripheral surface of the extension part.
發明的效果effect of invention
本發明利用與旋轉板的旋轉運動聯動的連接銷的直線運動,使得複數個桿向鎖定位置或者解鎖位置轉動,從而同時實現桿的鎖定以及解鎖,所以密封環的結合以及分離過程簡單,具有不產生密封環的結合誤差(扭曲等)的效果。The present invention utilizes the linear motion of the connecting pin linked with the rotational motion of the rotating plate to make the plurality of rods rotate to the locking position or the unlocking position, thereby simultaneously realizing the locking and unlocking of the rods, so the combination and separation process of the sealing ring is simple, and it has the advantages of This has the effect of producing a coupling error (twist, etc.) of the seal ring.
另外,本發明透過在旋轉台和密封環的對應部位結合本身具有彈性的密封墊,從而能夠進一步提高密封環的密封性能,具有能夠防止藥液滲透旋轉台與密封環之間的效果。In addition, the present invention can further improve the sealing performance of the sealing ring by combining the sealing gasket with its own elasticity at the corresponding parts of the rotary table and the sealing ring, and has the effect of preventing the liquid medicine from penetrating between the rotary table and the sealing ring.
在下文中,將參照附圖詳細說明根據本發明的實施例。參照附圖以及詳細說明的實施例可以明確的示出本發明的優點以及特徵和實現這些優點及特徵的方法。但是,本發明並不限定於下面所揭露的複數個實施例,可以進一步以其它的各種方式實現,這些實施例僅用於完整地揭露本發明,是為了向本領域具有通常知識者完整地告知本發明的保護範圍而提供的,本發明的保護範圍基於申請專利範圍來定義。Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention and methods for achieving these advantages and features can be clearly illustrated with reference to the accompanying drawings and the detailed description of the embodiments. However, the present invention is not limited to the plurality of embodiments disclosed below, and can be further implemented in other various ways. These embodiments are only used to completely disclose the present invention, and are intended to fully inform those with ordinary knowledge in the art Provided for the protection scope of the present invention, the protection scope of the present invention is defined based on the scope of the patent application.
另外,在說明本發明的過程中,當判斷為相關的習知技術等有可能混淆本發明的宗旨時,將省略其詳細說明。In addition, in the course of describing the present invention, if it is judged that the related conventional techniques and the like may obscure the gist of the present invention, the detailed description thereof will be omitted.
圖1是用於示出根據本發明一實施例的基板處理裝置的立體圖,圖2是用於從下方示出根據本發明一實施例的基板處理裝置的立體圖,圖3是用於示出根據本發明一實施例的基板處理裝置的正面剖視圖。另外,圖4是用於示出根據本發明一實施例的基板處理裝置的分離密封環的狀態的立體分解圖,圖5是用於示出根據本發明一實施例的基板處理裝置中密封環的掛接槽和緊固槽的主要部分放大立體圖,圖6是用於示出根據本發明一實施例的基板處理裝置中動力傳遞單元的仰視圖。另外,圖7是用於詳細示出根據本發明一實施例的基板處理裝置中開閉單元和動力傳遞單元的連接關係的俯視圖,圖8是用於示出根據本發明一實施例的基板處理裝置中外側密封墊槽以及外側密封墊和內側密封墊槽以及內側密封墊的立體分解圖,圖9是用於局部示出根據本發明一實施例的基板處理裝置中桿形成有錐形面的狀態的正面剖視圖。1 is a perspective view for illustrating a substrate processing apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view for illustrating a substrate processing apparatus according to an embodiment of the present invention from below, and FIG. 3 is a perspective view for illustrating a substrate processing apparatus according to an embodiment of the present invention A front cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention. In addition, FIG. 4 is an exploded perspective view for illustrating a state in which the seal ring of the substrate processing apparatus according to an embodiment of the present invention is separated, and FIG. 5 is an exploded perspective view for illustrating a seal ring in the substrate processing apparatus according to an embodiment of the present invention. 6 is a bottom view for illustrating a power transmission unit in a substrate processing apparatus according to an embodiment of the present invention. In addition, FIG. 7 is a plan view for illustrating the connection relationship between the opening and closing unit and the power transmission unit in the substrate processing apparatus according to an embodiment of the present invention in detail, and FIG. 8 is a plan view for illustrating the substrate processing apparatus according to an embodiment of the present invention. An exploded perspective view of the middle and outer gasket grooves, and the outer and inner gasket grooves and the inner gasket, and FIG. 9 is a partial view for illustrating a state in which a taper surface is formed on a rod in a substrate processing apparatus according to an embodiment of the present invention. front sectional view.
如圖1至圖9所繪示出的,根據本發明一實施例的基板處理裝置包含旋轉台100、密封環200、開閉單元300、動力傳遞單元400以及驅動單元500。As shown in FIGS. 1 to 9 , the substrate processing apparatus according to an embodiment of the present invention includes a rotary table 100 , a
旋轉台100的上部供處理(例如,洗滌等)對象晶片放置,旋轉台100的垂直旋轉中心以能夠水平旋轉的方式結合有旋轉軸。其中,旋轉台100可以具有圓板形狀,旋轉台100的旋轉軸可以透過額外的旋轉驅動部(未圖示出)傳遞有旋轉力。對於旋轉台100,可以應用用於水平支承晶片的各種方式的結構,旋轉台100的邊緣可以突出形成有放置部101,以便能夠放置後述的密封環200的下端。也就是說,在旋轉台100的上部結合有密封環200的情況下,密封環200的內周面緊貼於旋轉台100的側面,密封環200的下端放置在放置部101的上表面。The upper part of the
放置部101的上表面設置有緊固銷120,緊固銷120可以沿放置部101的上表面以複數個緊固銷120分開的狀態垂直設置。其中,緊固銷120可以具有側面構成圓周的圓柱形狀,緊固銷120的上端可以具有隨著朝向上部去直徑逐漸減小的錐形。The upper surface of the placing portion 101 is provided with a fastening
緊固銷120是與後述的密封環200的緊固槽220透過凹凸方式對應插入而構成,可以形成與緊固槽220相同的數量。The tightening
密封環200對應地結合於旋轉台100的上部,密封環200可以具有與旋轉台100的邊緣對應的環狀。其中,密封環200的中心可以上下貫通形成中空,沿密封環200的內周面可以連續突出形成延伸部201。The
延伸部201的上表面可以具有朝向中心方向高度逐漸減小的錐形,延伸部201的下表面放置在旋轉台的上表面。也就是說,延伸部201的突出的末端可以緊貼於旋轉台100的上表面,密封環200的下端可以放置在放置部101的上表面。這時,密封環200的內周面可以緊貼於旋轉台100的側面,密封環200的下端放置在放置部101的上表面。The upper surface of the
在密封環200的內周面上可以沿圓周方向隔開預定間隔凹陷形成有複數個掛接槽210。掛接槽210是用於供後述的桿330的一端插入以及使後述的桿330的一端脫離的部件,掛接槽210可以以密封環200的中心為基準沿著徑向凹陷形成。密封環200的下端凹陷形成有緊固槽220,以便能夠供上述的緊固銷120的上端對應插入。A plurality of hooking
如圖3所繪示出,當將密封環200結合於旋轉台100的上部時,透過緊固槽220的下部垂直插入有緊固銷120,所以密封環200不會向側方晃動。而且,可以沿放置部101的上表面連續形成環狀的外側密封墊槽130,如圖3所示,外側密封墊槽130可以位於緊固銷120的外圍。As shown in FIG. 3 , when the
同時,外側密封墊150可以對應地插入外側密封墊槽130,外側密封墊150的上端向外側密封墊槽130的上部突出,從而緊密地緊貼於密封環200的下端。其中,外側密封墊150可以採用具有彈性還原力的材料(橡膠、樹脂系列等),根據需要可以形成一列或者多列的外側密封墊槽130和外側密封墊150。外側密封墊槽130的下部朝側方可以凹陷形成有在半徑方向上更寬地進行延伸的掛台,外側密封墊150的下端也可以突出有對應的掛接突起。如圖3所示,這樣的外側密封墊150透過本身的彈性與密封環200的下端緊密地緊貼,進而實現密封以防止在密封環200與放置部101之間流入藥液(未圖示出)。At the same time, the
如圖3和圖8所繪示出,旋轉台100的上表面可以沿邊緣側上表面連續形成有內側密封墊槽140。同時,內側密封墊160可以對應地插入內側密封墊槽140中,內側密封墊160的上端可以緊密地緊貼於上述的延伸部201的下表面或者內周面。其中,內側密封墊160可以使用具有彈性的材料(橡膠、樹脂等),可以根據需要形成一列或者複數列的內側密封墊槽140和內側密封墊160。As shown in FIGS. 3 and 8 , an
內側密封墊槽140的下部朝側方可以凹陷以形成在半徑方向上更寬地進行延伸的掛台,內側密封墊160的下端也可以突出有對應的掛接突起。如圖3所繪示,這樣的內側密封墊160透過本身的彈性與密封環200的延伸部201緊密地緊貼,所以可以實現密封以防止在密封環200與旋轉台100之間流入藥液(未圖示出),透過以多種方式調節內側密封墊160和外側密封墊150的硬度,從而以多種方式調節密封環200的密封力。The lower part of the
另一方面,雖然沒有具體說明,但是旋轉台100的內部也可以設置有用於使晶片(未圖示)水平定位的獨立的結構(例如,吸附結構、支承結構等)。On the other hand, although not specifically described, an independent structure (eg, a suction structure, a support structure, etc.) for horizontally positioning a wafer (not shown) may be provided inside the
開閉單元300是用於將密封環200掛接在旋轉台100的上端或者從旋轉台100的解除掛接的部件,其設置為以旋轉台100的垂直旋轉中心為基準能夠在徑向方向上聯動。這樣的開閉單元300在進行鎖定(Locking)動作時,將掛接於密封環200的掛接槽210,在進行解鎖(Unlocking)動作時,將脫離密封環200的掛接槽210從而解除掛接。更加詳細地,如圖3和圖7所繪示,開閉單元300可以具有旋轉軸310、從動齒輪320以及桿(lever)330。The opening and
旋轉軸310以旋轉台100的垂直旋轉中心C1為基準在徑向方向上配置,其下端以能夠水平旋轉的方式貫通結合於旋轉台100。這時,旋轉軸310的下端可以垂直位於設置空間110內部,從動齒輪320可以結合於旋轉軸310的下端。The
從動齒輪320與旋轉軸310能夠一起水平旋轉,並與後述的連接桿420的移動鋸齒部421咬合結合。The driven
桿330是以能夠水平轉動的方式結合於旋轉軸310的上端的部件,向一側偏心的一端可以轉動到鎖定位置或者解鎖位置。其中,桿330在向鎖定位置轉動時,向一側偏心的一端掛接於掛接槽210,在向解鎖位置轉動時,從掛接槽210脫離,從而解除掛接。也就是說,當桿330與掛接槽210掛接時,密封環200可以固定地位於旋轉台100的上部,當桿330與掛接槽210解除掛接時,可以從旋轉台100分離密封環200。The
另一方面,如圖9所繪示,桿330的下表面可以進一步形成有朝向偏心的一端向上傾斜的錐形面331。在桿330向鎖定位置轉動時,這樣的錐形面331向下方加壓掛接槽210的下表面,所以密封環200的下端可以緊密地緊貼於外側密封墊150的上端。On the other hand, as shown in FIG. 9 , the lower surface of the
動力傳遞單元400設置於旋轉台100的設置空間110內,透過外力向鎖定位置或者解鎖位置驅動上述旋轉桿。更加詳細地,如圖6所繪示,動力傳遞單元400可以具有旋轉板410以及複數個連接桿420。The
旋轉板410以垂直旋轉中心C為基準能夠向鎖定或者解鎖方向轉動,轉動時可以作用離心力,且旋轉板410在徑向上上下貫通形成有複數個導向孔411。其中,旋轉板410可以具有圓板形狀,旋轉板410的垂直旋轉中心C1可以上下貫通形成有中空部412。The
導向孔411可以具有如下形狀:朝向旋轉板410的垂直旋轉中心C和旋轉板410的邊緣具有傾斜方向的長度的長孔形狀。也就是說,導向孔411的長度方向側的兩端朝向旋轉板410的垂直旋轉中心C方向和旋轉板410的邊緣側傾斜定位,所以透過旋轉板410的雙向轉動,後述的導向軸422可以向鎖定位置或者解鎖位置直線移動。The
另外,旋轉板410的內周面可以形成有轉動鋸齒部413,以便與後述的驅動齒輪520咬合。轉動鋸齒部413可以按照與旋轉板410的旋轉半徑相同的曲率排列,透過傳遞至轉動鋸齒部413的旋轉力,旋轉板410可以向鎖定或者解鎖方向轉動。In addition, the rotating
而且,旋轉台100的設置空間110內可以進一步結合彈性部件440。彈性部件440的兩端結合於設置空間110和旋轉板410,可以向旋轉板410的鎖定方向作用拉力。其中,彈性部件440可以具有盤簧形狀,設置空間110內部可以設置有第一連接部170,以便連接彈性部件440的一端,旋轉板410的內周面可以形成有第二連接部414,以便連接彈性部件440的相反側的另一端。這樣的彈性部件440可以向旋轉板410的鎖定旋轉方向作用拉伸彈力,並且可以根據需要以實現各種的彈性部件440的設置位置以及拉伸彈力作用方向。Moreover, the
連接桿420是用於在設置空間110內將旋轉板410的旋轉運動轉換為直線運動後傳遞至開閉單元300的部件,以旋轉板410的垂直旋轉中心C為基準,在徑向方向上進行往返移動。其中,連接桿420的長度方向側的一端沿著導向孔411以能夠滑動的方式進行結合,連接桿420寬度方向的一端沿長度方向形成有移動鋸齒部421,以便與從動齒輪320咬合結合。The connecting
移動鋸齒部421沿連接桿420的長度方向排列,並與從動齒輪320的垂直旋轉中心C2以正交的方式咬合結合。The moving
另外,與移動鋸齒部421反向的連接桿420的長度方向側的一端可以具有導向軸422,該導向軸422以能夠滑動方式插入導向孔411的內部。導向軸422能夠以垂直貫通結合在導向孔411的狀態沿導向孔411的長度方向滑動。導向軸422可以進一步具有在沿導向孔411移動時用於減少摩擦的軸承。In addition, one end on the longitudinal direction side of the connecting
當旋轉板410向鎖定方向轉動時,連接桿420將向旋轉板410的外側滑動,從而使從動齒輪320轉動到鎖定位置。相反地,當旋轉板410向解鎖方向轉動時,向旋轉板410的垂直旋轉中心C1方向滑動,從而使從動齒輪320轉動到解鎖位置。When the
另外,旋轉台100的設置空間110可以進一步包含用於可滑動地支承連接桿420的導向模組430。導向模組430可滑動地支承連接桿420的外部,使得連接桿420可以在不會向寬度方向晃動的情況下朝向鎖定以及解鎖方向移動。In addition, the
驅動單元500是用於使旋轉板410向鎖定位置或者解鎖位置轉動的部件,並且可以包含馬達510以及驅動齒輪520。The driving unit 500 is a member for rotating the
馬達510是設置於設置空間從而產生驅動力的部件,可以與驅動齒輪520機械性地連接,驅動齒輪520以能夠水平旋轉的方式結合於馬達510的驅動軸。其中,驅動齒輪520以與轉動鋸齒部413咬合結合的狀態,使旋轉板410移動到鎖定位置或者解鎖位置。The
在下文中,將參照圖3和圖6以及圖7,以說明根據本發明一實施例的基板處理裝置的密封環結合過程。Hereinafter, referring to FIG. 3 , FIG. 6 and FIG. 7 , a sealing ring bonding process of a substrate processing apparatus according to an embodiment of the present invention will be described.
首先,在將密封環200結合在旋轉台100的上部的情況下,如圖3所繪示,旋轉台100的緊固銷120被插入密封環200的緊固槽220。之後,如果使馬達510的驅動軸511旋轉,則透過馬達510的旋轉力,驅動齒輪520向鎖定方向旋轉,同時旋轉板410向鎖定方向轉動。這時,旋轉板410的導向孔411向鎖定位置移動,同時連接桿420的導向軸422沿導向孔411的長度方向滑動。與此同時,連接桿420移動到鎖定位置,與連接桿420的移動鋸齒部421咬合的從動齒輪320向鎖定方向旋轉。這時,透過從動齒輪320的轉動,旋轉軸310向鎖定方向轉動,同時桿330的偏心的一端向鎖定方向轉動,並插入掛接槽210。在該狀態下,透過桿330的偏心的一端與掛接槽210的結合,變成密封環200未向旋轉台100的上部分離的狀態。First, when the
另外,透過緊固銷120與緊固槽220的結合,密封環200可以排列在正確位置,透過緊固銷120的支承力,密封環200不會向側方晃動。而且,外側密封墊150的上端緊密地緊貼於密封環200的下端,同時,內側密封墊160的上端緊密地緊貼於形成在密封環200的內周面的延伸部201的下表面或者內周面。相反地,當從旋轉台100的上部分離密封環200時,可以使馬達510的驅動軸511向解鎖方向旋轉,按照與上述的鎖定順序相反的順序驅動。In addition, through the combination of the
最後,利用與根據本發明一實施例的旋轉板410的旋轉運動聯動的連接桿420的直線運動,使複數個桿330轉動到鎖定位置或者解鎖位置,從而同時實現桿330的鎖定以及解鎖,密封環200的結合以及分離過程簡單,且可以消除密封環200的結合誤差(扭曲等)。Finally, using the linear motion of the connecting
另外,根據本發明一實施例的基板處理裝置在旋轉台100和密封環200的對應位置分別結合本身具有彈性的內側密封墊160以及外側密封墊150,從而能夠進一步提高密封環200的密封性能,且能夠防止在旋轉台100與密封環200之間滲透藥液。In addition, in the substrate processing apparatus according to an embodiment of the present invention, the
綜上所述,針對了根據本發明的基板處理裝置的具體實施例進行了說明,但是,可以理解的是,在不脫離本發明的範圍內可以有各種變形實施。因此,本發明的範圍不限定於所說明的實施例,應該基於所附的申請專利範圍以及與申請專利範圍等同的內容來確定。也就是說,上述的實施例在所有方面均為例示性的,應該解釋為非限定性的,並且應透過申請專利範圍以限定本發明的保護範圍,而不是透過上述地詳細說明限定,從申請專利範圍的含義以及範圍和與其等同的概念導出的所有變更或者變形的方式均包含在本發明的保護範圍內。In summary, the specific embodiments of the substrate processing apparatus according to the present invention have been described, but it is understood that various modifications can be made without departing from the scope of the present invention. Therefore, the scope of the present invention is not limited to the described embodiments, but should be determined based on the appended claims and equivalents. That is, the above-described embodiments are illustrative in all respects, and should be construed as non-limiting, and the scope of protection of the present invention should be limited by the scope of the patent application, rather than by the detailed description above. All changes or modifications derived from the meaning of the patent scope and the scope and equivalent concepts thereof are included in the protection scope of the present invention.
100:旋轉台 101:放置部 110:設置空間 120:緊固銷 130:外側密封墊槽 140:內側密封墊槽 150:外側密封墊 160:內側密封墊 170:第一連接部 200:密封環 201:延伸部 210:掛接槽 220:緊固槽 300:開閉單元 310:旋轉軸 320:從動齒輪 330:桿 331:錐形面 400:動力傳遞單元 410:旋轉板 411:導向孔 412:中空部 413:轉動鋸齒部 414:第二連接部 420:連接桿 421:移動鋸齒部 422:導向軸 430:導向模組 440:彈性部件 500:驅動單元 510:馬達 511:驅動軸 520:驅動齒輪 C,C1,C2:垂直旋轉中心100: Rotary table 101: Placement Department 110: Setup Space 120: Fastening pin 130: Outer gasket groove 140: Inner gasket groove 150: Outer gasket 160: Inside gasket 170: The first connection part 200: sealing ring 201: Extensions 210: Mounting slot 220: Fastening slot 300: Opening and closing unit 310: Rotary axis 320: driven gear 330: Rod 331: Conical Surface 400: Power Transmission Unit 410: Rotary Plate 411: Pilot hole 412: hollow part 413: Turn the saw tooth 414: Second connector 420: connecting rod 421:Move the sawtooth 422: Guide shaft 430: Guide Module 440: elastic parts 500: Drive unit 510: Motor 511: Drive shaft 520: Drive Gear C, C1, C2: vertical rotation center
圖1是用於示出根據本發明一實施例的基板處理裝置的立體圖。 圖2是用於從下方示出根據本發明一實施例的基板處理裝置的立體圖。 圖3是用於示出根據本發明一實施例的基板處理裝置的正面剖視圖。 圖4是用於示出根據本發明一實施例的基板處理裝置的分離密封環的狀態的立體分解圖。 圖5是用於示出根據本發明一實施例的基板處理裝置中密封環的掛接槽和緊固槽的主要部分放大立體圖。 圖6是用於示出根據本發明一實施例的基板處理裝置中動力傳遞單元的仰視圖。 圖7是用於詳細示出根據本發明一實施例的基板處理裝置中開閉單元和動力傳遞單元的連接關係的俯視圖。 圖8是用於示出根據本發明一實施例的基板處理裝置中外側密封墊槽以及外側密封墊和內側密封墊槽以及內側密封墊的立體分解圖。 圖9是用於局部示出根據本發明一實施例的基板處理裝置中桿形成有錐形面的狀態的正面剖視圖。FIG. 1 is a perspective view for illustrating a substrate processing apparatus according to an embodiment of the present invention. 2 is a perspective view for illustrating a substrate processing apparatus according to an embodiment of the present invention from below. 3 is a front cross-sectional view for illustrating a substrate processing apparatus according to an embodiment of the present invention. 4 is an exploded perspective view for illustrating a state in which a seal ring of a substrate processing apparatus according to an embodiment of the present invention is separated. 5 is an enlarged perspective view of a main part for illustrating a hooking groove and a fastening groove of a seal ring in a substrate processing apparatus according to an embodiment of the present invention. 6 is a bottom view for illustrating a power transmission unit in a substrate processing apparatus according to an embodiment of the present invention. 7 is a plan view for illustrating in detail the connection relationship between the opening and closing unit and the power transmission unit in the substrate processing apparatus according to an embodiment of the present invention. 8 is an exploded perspective view for illustrating an outer gasket groove and an outer gasket and an inner gasket groove and an inner gasket in a substrate processing apparatus according to an embodiment of the present invention. 9 is a front cross-sectional view for partially showing a state in which the rod is formed with a tapered surface in the substrate processing apparatus according to an embodiment of the present invention.
100:旋轉台100: Rotary table
200:密封環200: sealing ring
201:延伸部201: Extensions
Claims (12)
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KR10-2019-0173775 | 2019-12-24 | ||
KR1020190173775A KR20210082293A (en) | 2019-12-24 | 2019-12-24 | Substrate processing apparatus |
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TW202127565A TW202127565A (en) | 2021-07-16 |
TWI750816B true TWI750816B (en) | 2021-12-21 |
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KR (1) | KR20210082293A (en) |
CN (1) | CN113035738A (en) |
TW (1) | TWI750816B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201615902A (en) * | 2014-10-16 | 2016-05-01 | 荏原製作所股份有限公司 | Substrate holder and plating apparatus |
TW201803693A (en) * | 2016-07-13 | 2018-02-01 | 迪思科股份有限公司 | Chuck table mechanism to rotatably and suctionably support a chuck table without using a tube and shorten maintenance time |
TW201809504A (en) * | 2016-07-28 | 2018-03-16 | 納博特斯克股份有限公司 | Gear device which is connected to a motor and includes a connection wall, an input shaft and a gear structural body |
TW201903814A (en) * | 2017-03-22 | 2019-01-16 | 日商東京威力科創股份有限公司 | Substrate processing device |
TW201929084A (en) * | 2017-12-01 | 2019-07-16 | 日商東京威力科創股份有限公司 | Support assembly and support assembly assembling method |
-
2019
- 2019-12-24 KR KR1020190173775A patent/KR20210082293A/en not_active Application Discontinuation
-
2020
- 2020-09-21 TW TW109132601A patent/TWI750816B/en active
- 2020-11-16 CN CN202011281096.5A patent/CN113035738A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201615902A (en) * | 2014-10-16 | 2016-05-01 | 荏原製作所股份有限公司 | Substrate holder and plating apparatus |
TW201803693A (en) * | 2016-07-13 | 2018-02-01 | 迪思科股份有限公司 | Chuck table mechanism to rotatably and suctionably support a chuck table without using a tube and shorten maintenance time |
TW201809504A (en) * | 2016-07-28 | 2018-03-16 | 納博特斯克股份有限公司 | Gear device which is connected to a motor and includes a connection wall, an input shaft and a gear structural body |
TW201903814A (en) * | 2017-03-22 | 2019-01-16 | 日商東京威力科創股份有限公司 | Substrate processing device |
TW201929084A (en) * | 2017-12-01 | 2019-07-16 | 日商東京威力科創股份有限公司 | Support assembly and support assembly assembling method |
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CN113035738A (en) | 2021-06-25 |
KR20210082293A (en) | 2021-07-05 |
TW202127565A (en) | 2021-07-16 |
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