CN113035738A - Substrate processing apparatus - Google Patents

Substrate processing apparatus Download PDF

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Publication number
CN113035738A
CN113035738A CN202011281096.5A CN202011281096A CN113035738A CN 113035738 A CN113035738 A CN 113035738A CN 202011281096 A CN202011281096 A CN 202011281096A CN 113035738 A CN113035738 A CN 113035738A
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CN
China
Prior art keywords
processing apparatus
substrate processing
groove
seal ring
rotary table
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Pending
Application number
CN202011281096.5A
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Chinese (zh)
Inventor
朴芝镐
文雄助
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Zeus Co Ltd
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Zeus Co Ltd
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Publication date
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Publication of CN113035738A publication Critical patent/CN113035738A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a substrate processing apparatus, including: a rotary table on the upper surface of which a wafer is placed; an annular seal ring coupled to an upper portion of the turntable and having a plurality of hooking grooves formed along an inner circumferential surface; a plurality of opening and closing units which are provided to be interlocked in a radial direction with a vertical rotation center of the rotary table as a reference, are hooked in the hooking grooves when performing a locking operation, and are separated from the hooking grooves when performing an unlocking operation, thereby releasing the hooking; and a power transmission unit disposed in the installation space of the rotary table and linking the opening and closing unit to the locking position or the unlocking position by an external force.

Description

Substrate processing apparatus
Technical Field
The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus which simplifies a coupling and separating process of a seal ring and can reduce a coupling error (distortion, etc.) of the seal ring.
Background
In general, a substrate processing apparatus is used in a step of etching or cleaning a wafer, such as a step of etching or cleaning a wafer, performed in a semiconductor process. The substrate processing apparatus for cleaning a wafer is constituted by a turntable rotatably provided on which the wafer is placed, a seal ring annularly coupled to an edge area of the turntable, and the like, and supplies a processing liquid to the wafer placed on the turntable. However, according to the conventional substrate processing apparatus, the process of coupling the seal ring to the upper portion of the turntable is complicated, and coupling errors (distortion and the like) may occur due to unfixed coupling completion states of the seal ring in the coupling, and when the errors occur, the coupling errors may cause a reduction in the function of the seal ring.
As a prior art document related to the present invention, there is korean laid-open patent No. 10-2016-0122067 (10/21/2016), which discloses a wafer processing apparatus and a sealing ring for the wafer processing apparatus.
Disclosure of Invention
Technical problem to be solved
The invention aims to provide a substrate processing device capable of reducing the combination error (distortion and the like) of a sealing ring.
Another object of the present invention is to provide a substrate processing apparatus capable of further improving the sealing performance of a seal ring and preventing a chemical solution from penetrating between a turntable and the seal ring.
Means for solving the problems
The substrate processing apparatus according to the present invention includes: a rotary table on the upper surface of which a wafer is placed; an annular seal ring coupled to an upper portion of the turntable, the seal ring having a plurality of hooking grooves formed along an inner circumferential surface thereof; a plurality of opening and closing units which are provided to be interlocked in a radial direction with a vertical rotation center of the rotary table as a reference, are hooked to the hooking groove when performing a locking operation, and are separated from the hooking groove when performing an unlocking operation, thereby releasing the hooking; and a power transmission unit provided in the installation space of the rotary table, and causing the opening and closing unit to be interlocked to a locking position or an unlocking position by an external force.
The turntable is further provided with a placement portion protruding along a side surface of the turntable so as to place a lower end of the seal ring, the lower end of the seal ring being placed on the placement portion, and an inner peripheral surface of the seal ring being in close contact with the side surface of the turntable.
The opening/closing unit includes: a rotating shaft disposed in a radial direction with respect to a vertical rotation center of the turntable, and having a lower end that is coupled to the turntable so as to be horizontally rotatable therethrough; a driven gear coupled to a lower end of the rotary shaft in a horizontally rotatable manner; and a lever coupled to an upper end of the rotation shaft in a horizontally rotatable manner, and hooked to the hooking groove at an eccentric end of one side when rotated to the locking position, and released from the hooking groove at an eccentric end of one side when rotated to the unlocking position.
The lower surface of the lever further includes a tapered surface formed to be inclined upward toward the eccentric end, and the tapered surface presses and supports the lower surface of the hooking groove downward when the lever is rotated to the lock position.
Characterized in that the power transmission unit is mechanically engaged with the driven gear in a meshing manner so that the driven gear rotates to a lock position or an unlock position. The power transmission unit includes: a rotating plate which can rotate in a locking direction or an unlocking direction by taking a vertical rotation center as a reference and is provided with a plurality of guide holes which are vertically penetrated in a radial direction; and a connecting rod, one end of the length direction side of the connecting rod is combined in a sliding mode along the guide hole, and one end of the width direction of the connecting rod is provided with a movable sawtooth part so as to be meshed and combined with the driven gear. Wherein, when the rotating plate rotates in a locking direction, the connecting rod slides to the outside of the rotating plate to rotate the driven gear to a locking position, and when the rotating plate rotates in an unlocking direction, the connecting rod slides to a vertical rotation center direction of the rotating plate to rotate the driven gear to an unlocking position. Further, the guide hole is characterized by having the following shape: and a long hole shape having a length in an inclined direction toward a vertical rotation center and an edge of the rotation plate, wherein one end of the connection rod in a length direction side is provided with a guide shaft, and the guide shaft is slidably inserted into the guide hole.
In addition, the present invention further comprises: and an elastic member having both ends coupled to the installation space and the rotation plate, and applying a tensile force to a locking direction of the rotation plate.
Characterized in that, the revolving stage is gone up along the upper surface of placing portion is provided with a plurality of fastening pins perpendicularly, the sealing ring is sunken to be formed with the fastening groove in the lower extreme, for the fastening pin corresponds the insertion through unsmooth mode.
The rotary table further includes: an annular outer gasket groove formed continuously along an upper surface of the mounting portion; and an annular outer side sealing gasket correspondingly inserted into the outer side sealing gasket groove, wherein the upper end of the outer side sealing gasket, which protrudes towards the upper part of the outer side sealing gasket groove, is tightly attached to the lower end of the sealing ring.
In addition, the seal ring may have an extension portion formed to protrude along an inner circumferential surface thereof, and the turntable may further include: an annular inner gasket groove formed continuously along an edge-side upper surface of the seal ring; and an annular inner gasket inserted into the inner gasket groove, wherein an upper end of the inner gasket groove protrudes to the upper part and is closely attached to the lower surface or the inner circumferential surface of the extension part.
Effects of the invention
The present invention rotates the plurality of levers to the locking position or the unlocking position by the linear motion of the connecting pin linked with the rotational motion of the rotating plate, thereby simultaneously realizing the locking and unlocking of the levers, so that the coupling and separating processes of the seal rings are simple, and the effect of not generating coupling errors (distortion, etc.) of the seal rings is provided.
In addition, the invention can further improve the sealing performance of the sealing ring by combining the sealing gaskets with elasticity at the corresponding parts of the rotating platform and the sealing ring, and has the effect of preventing the liquid medicine from permeating between the rotating platform and the sealing ring.
Drawings
Fig. 1 is a perspective view for illustrating a substrate processing apparatus according to an embodiment of the present invention.
Fig. 2 is a perspective view for illustrating a substrate processing apparatus according to an embodiment of the present invention from below.
Fig. 3 is a front sectional view for illustrating a substrate processing apparatus according to an embodiment of the present invention.
Fig. 4 is an exploded perspective view for illustrating a state of separating a seal ring of a substrate processing apparatus according to an embodiment of the present invention.
Fig. 5 is an enlarged perspective view of a main portion for illustrating a hanging groove and a fastening groove of a seal ring in a substrate processing apparatus according to an embodiment of the present invention.
Fig. 6 is a bottom view for illustrating a power transmission unit in a substrate processing apparatus according to an embodiment of the present invention.
Fig. 7 is a top view for illustrating in detail a connection relationship of the opening and closing unit and the power transmission unit in the substrate processing apparatus according to an embodiment of the present invention.
Fig. 8 is a disassembled perspective view for illustrating the outer side gasket groove and the outer and inner side gasket grooves and the inner side gasket in the substrate processing apparatus according to an embodiment of the present invention.
Fig. 9 is a front cross-sectional view for partially illustrating a state where a rod is formed with a tapered surface in a substrate processing apparatus according to an embodiment of the present invention.
Description of the reference numerals
100: a rotating table; 101: a placement section; 110: setting a space; 120: a fastening pin; 130: an outer gasket groove; 140: an inner side sealing gasket groove; 150: an outer side seal gasket; 160: an inner side gasket; 170: a first connection portion; 200: a seal ring; 201: an extension portion; 210: a hanging groove; 220: a fastening groove; 300: an opening/closing unit; 310: a rotating shaft; 320: a driven gear; 330: a rod; 331: a conical surface; 400: a power transmission unit; 410: a rotating plate; 411: a guide hole; 412: a hollow part; 413: rotating the sawtooth part; 414: a second connecting portion; 420: a connecting rod; 421: moving the serration; 422: a guide shaft; 430: a guide module; 440: an elastic member; 510: a motor; 511: a drive shaft; 520: a drive gear; c1: a vertical center of rotation; c2: the vertical center of rotation.
Detailed Description
Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings. The advantages and features of the invention and the methods of accomplishing the same may be understood by reference to the drawings and the detailed description of the embodiments. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in other various ways, and these embodiments are provided only for complete disclosure of the present invention and to fully inform those skilled in the art of the scope of the present invention, which is defined based on the claims.
In describing the present invention, a detailed description thereof will be omitted when it is determined that the gist of the present invention may be confused by related known techniques and the like.
Fig. 1 is a perspective view for illustrating a substrate processing apparatus according to an embodiment of the present invention, fig. 2 is a perspective view for illustrating a substrate processing apparatus according to an embodiment of the present invention from below, and fig. 3 is a front sectional view for illustrating a substrate processing apparatus according to an embodiment of the present invention. In addition, fig. 4 is a disassembled perspective view for illustrating a state of separating a sealing ring of a substrate processing apparatus according to an embodiment of the present invention, fig. 5 is a main part enlarged perspective view for illustrating a hanging groove and a fastening groove of a sealing ring in a substrate processing apparatus according to an embodiment of the present invention, and fig. 6 is a bottom view for illustrating a power transmission unit in a substrate processing apparatus according to an embodiment of the present invention. In addition, fig. 7 is a top view for illustrating in detail a connection relationship of the closing unit and the power transmission unit in the substrate processing apparatus according to an embodiment of the present invention, fig. 8 is a disassembled perspective view for illustrating the outer side gasket groove and the outer and inner side gasket grooves and the inner side gasket in the substrate processing apparatus according to an embodiment of the present invention, and fig. 9 is a front cross-sectional view for partially illustrating a state where the rod is formed with the tapered surface in the substrate processing apparatus according to an embodiment of the present invention.
As shown in fig. 1 to 9, the substrate processing apparatus according to an embodiment of the present invention includes a rotary table 100, a seal ring 200, an opening and closing unit 300, a power transmission unit 400, and a driving unit 500.
The upper portion of the spin stand 100 is placed on a wafer to be processed (e.g., cleaned), and a rotation shaft is coupled to a vertical rotation center of the spin stand 100 so as to be horizontally rotatable. The turntable 100 may have a disk shape, and a rotation force may be transmitted to a rotation shaft of the turntable 100 by an additional rotation driving unit (not shown). Various configurations for horizontally supporting the wafer may be applied to the turntable 100, and a placing portion 101 may be formed to protrude from an edge of the turntable 100 so that a lower end of a seal ring 200, which will be described later, can be placed. That is, when the seal ring 200 is coupled to the upper portion of the turntable 100, the inner peripheral surface of the seal ring 200 is closely attached to the side surface of the turntable 100, and the lower end of the seal ring 200 is placed on the upper surface of the placing portion 101.
The upper surface of the placing part 101 is provided with fastening pins 120, and the fastening pins 120 may be vertically disposed along the upper surface of the placing part 101 in a state in which a plurality of fastening pins 120 are separated. In which the fastening pin 120 may have a cylindrical shape whose side surfaces constitute a circumference, and the upper end of the fastening pin 120 may have a tapered shape whose diameter is gradually reduced toward the upper portion.
The fastening pins 120 are configured to be inserted into fastening grooves 220 of a seal ring 200, which will be described later, in a concave-convex manner, and may be formed in the same number as the fastening grooves 220.
The seal ring 200 is correspondingly coupled to an upper portion of the turntable 100, and the seal ring 200 may have a ring shape corresponding to an edge of the turntable 100. The center of the sealing ring 200 may be vertically penetrated to form a hollow, and the extension 201 may be continuously protruded along the inner circumferential surface of the sealing ring 200.
The upper surface of the extension 201 may have a tapered shape in which the height is gradually reduced toward the center, and the lower surface of the extension 201 is placed on the upper surface of the turntable. That is, the protruding end of the extension 201 may be closely attached to the upper surface of the turntable 100, and the lower end of the seal ring 200 may be placed on the upper surface of the placing part 101. In this case, the inner circumferential surface of the seal ring 200 may be closely attached to the side surface of the turntable 100, and the lower end of the seal ring 200 may be placed on the upper surface of the placing section 101.
A plurality of catching grooves 210 may be concavely formed on an inner circumferential surface of the seal ring 200 at predetermined intervals in a circumferential direction. The hooking groove 210 is a member into which one end of a rod 330, which will be described later, is inserted and from which one end of the rod 330, which will be described later, is removed, and the hooking groove 210 may be formed to be recessed in a radial direction with respect to the center of the seal ring 210. The lower end of the packing ring 200 is concavely formed with a fastening groove 220 so that the upper end of the fastening pin 120 can be correspondingly inserted.
As shown in fig. 3, when the seal ring 200 is coupled to the upper portion of the turntable 100, the fastening pin 120 is vertically inserted through the lower portion of the fastening groove 220, so that the seal ring 200 does not laterally swing. Also, a ring-shaped outer gasket groove 130 may be continuously formed along the upper surface of the placing part 101, and as shown in fig. 3, the outer gasket groove 130 may be located at the outer periphery of the fastening pin 120.
Meanwhile, the outer gasket 150 may be correspondingly inserted into the outer gasket groove 130, and an upper end of the outer gasket 150 protrudes to an upper portion of the outer gasket groove 130, thereby closely adhering to a lower end of the sealing ring 200. The outer gasket 150 may be made of a material having elastic reducing force (rubber, resin, etc.), and one or more rows of the outer gasket groove 130 and the outer gasket 150 may be formed as necessary. A hanging platform extending in a wider radial direction may be formed in a concave manner at a lower portion of the outer gasket groove 130 toward a side, and a corresponding hanging protrusion may protrude from a lower end of the outer gasket 150. As shown in fig. 3, since the outer gasket 150 is tightly attached to the lower end of the seal ring 200 by its own elasticity, a shield is provided to prevent a chemical solution (not shown) from flowing between the seal ring 200 and the placing portion 101.
As shown in fig. 3 and 8, the upper surface of the rotary table 100 may be continuously formed with an inner gasket groove 140 along the edge side upper surface. Meanwhile, the inner gasket 160 may be correspondingly inserted into the inner gasket groove 140, and the upper end of the inner gasket 160 may be closely attached to the lower surface or the inner circumferential surface of the extension 201. The inner gasket 160 may be made of a material having elastic reducing force (rubber, resin, etc.), and one or more rows of the inner gasket groove 140 and the inner gasket 160 may be formed as necessary.
A hanging platform extending in a wider radial direction may be formed in a concave manner at a lower portion of the inner gasket groove 140 toward a side, and a corresponding hanging protrusion may protrude from a lower end of the inner gasket 160. As shown in fig. 3, since the inner seal 140 is tightly adhered to the extension 201 of the seal ring 200 by its own elasticity, it is possible to shield the seal from the chemical solution (not shown) flowing between the seal ring 200 and the turntable 100, and to adjust the sealing force of the seal ring 200 in various ways by adjusting the hardness of the inner seal 140 and the outer seal 150 in various ways.
On the other hand, although not specifically described, a separate structure (suction structure, support structure, etc.) for horizontally positioning the wafer (not shown) may be provided inside the turntable 100.
The opening and closing unit 300 is a member for hanging the seal ring 200 on the upper end of the turntable 100 or releasing the seal ring from the turntable 100, and is provided to be interlocked in the radial direction with respect to the vertical rotation center of the turntable 100. The opening/closing unit 300 is configured to be hooked in the hooking groove 210 of the seal ring 200 during a Locking (Locking) operation, and to be released from the hooking groove 210 of the seal ring 200 during an Unlocking (Unlocking) operation. More specifically, as shown in fig. 3 and 7, the opening and closing unit 300 may include a rotation shaft 310, a driven gear 320, and a lever (lever) 330.
The rotary shaft 310 is disposed in the radial direction with reference to the vertical rotation center C1 of the turntable 100, and the lower end thereof is coupled to the turntable 100 so as to penetrate therethrough in a horizontally rotatable manner. In this case, the lower end of the rotation shaft 310 may be vertically positioned inside the installation space 110, and the driven gear 320 may be coupled to the lower end of the rotation shaft 310.
The driven gear 320 is horizontally rotatable together with the rotary shaft 310, and is engaged with a moving serration 421 of the coupling rod 420, which will be described later.
The lever 330 is a member coupled to the upper end of the rotary shaft 310 to be horizontally rotatable, and one end eccentric to one side thereof may be rotated to a locking position or an unlocking position. The lever 330 is hooked to the hooking groove 210 at an eccentric end toward one side when rotated to the locking position, and is released from the hooking groove 210 when rotated to the unlocking position. That is, the seal ring 200 may be fixedly positioned on the turntable 100 when the lever 330 is hooked to the hooking groove 210, and the seal ring 200 may be separated from the turntable 100 when the lever 330 is unhooked from the hooking groove 210.
On the other hand, as shown in fig. 9, the lower surface of the rod 330 may be further formed with a tapered surface 331 inclined upward toward the eccentric end. When the lever 330 is rotated to the locking position, the tapered surface 331 presses the lower surface of the hooking groove 210 downward, so that the lower end of the seal ring 200 can be closely adhered to the upper end of the outer packing 150.
The power transmission unit 400 is installed in the installation space 110 of the turntable 100, and drives the rotating lever to the locking position or the unlocking position by an external force. In more detail, as shown in fig. 6, the power transmission unit 400 may include a rotating plate 410 and a plurality of connecting rods 420.
The rotating plate 410 is rotatable in a locking or unlocking direction with reference to a vertical rotation center C, and a plurality of guide holes 411 are formed to penetrate vertically in a radial direction by centrifugal force when rotated. The rotating plate 410 may have a circular plate shape, and the hollow portion 412 may be formed to vertically penetrate through the vertical rotation center C1 of the rotating plate 410.
The guide hole 411 may have the following shape: the long hole shape having a length in an oblique direction toward the vertical rotation center C of the rotation plate 410 and the edge of the rotation plate 410. That is, since both ends of the guide hole 411 in the longitudinal direction are positioned to be inclined toward the vertical rotation center C of the rotating plate 410 and the edge of the rotating plate 410, the guide shaft 422, which will be described later, can be linearly moved to the locking position or the unlocking position by the bidirectional rotation of the rotating plate 410.
In addition, the inner circumferential surface of the rotating plate 410 may be formed with a rotating serration 413 so as to be engageable with a driving gear 520, which will be described later. The rotation serrations 413 may be arranged at the same curvature as the rotation radius of the rotation plate 410, and the rotation plate 410 may be rotated in the locking or unlocking direction by the rotation force transmitted to the rotation serrations 413.
The elastic member 440 may be coupled to the installation space 110 of the turntable 100. Both ends of the elastic member 440 are coupled to the installation space 110 and the rotation plate 410, and a tensile force may be applied in a locking direction of the rotation plate 410. Wherein, the elastic member 440 may have a coil spring shape, the first connection part 170 may be provided inside the installation space 110 to connect one end of the elastic member 440, and the inner circumferential surface of the rotation plate 410 may be formed with the second connection part 414 to connect the other end of the opposite side of the elastic member 440. Although the elastic member 440 may apply the tensile elastic force in the locking rotation direction of the rotation plate 410, various installation positions and directions of the elastic member 440 may be implemented as necessary.
The link lever 420 is a member for converting the rotational motion of the rotating plate 410 into a linear motion in the installation space 110 and transmitting the linear motion to the opening and closing unit 300, and reciprocates in the radial direction with reference to the vertical rotation center C of the rotating plate 410. One end of the link 420 on the longitudinal side is slidably coupled along the guide hole 411, and a moving serration 421 is formed on one end in the width direction along the longitudinal direction so as to be engaged with the driven gear 320.
The serrations 421 are aligned along the longitudinal direction of the connecting rod 420 and are engaged with the vertical rotation center C2 of the driven gear 320 in a perpendicular manner.
Further, one end of the connecting rod 420 on the longitudinal direction side opposite to the saw tooth portion 421 may be provided with a guide shaft 422, and the guide shaft 422 may be slidably inserted into the guide hole 411. The guide shaft 422 is vertically coupled to the guide hole 411 in a penetrating manner and is slidable in the longitudinal direction of the guide hole 411. The guide shaft 422 may also be provided with a bearing for reducing friction when moving along the guide hole 411.
When the rotating plate 410 is rotated in the locking direction, the connecting rod 420 slides to the outside of the rotating plate 410, and the driven gear 320 is rotated to the locking position. In contrast, when the rotating plate 410 is rotated in the unlocking direction, it slides in the direction of the vertical rotation center C1 of the rotating plate 410, thereby rotating the driven gear 320 to the unlocking position.
The installation space 110 of the turntable 100 may further include a guide module 430 for slidably supporting the coupling rod 420. The guide module 430 slidably supports the outside of the link 420, so the link 420 can move in the locking and unlocking directions without shaking in the width direction.
The driving unit 500 is a member for rotating the rotating plate 410 to the locking position or the unlocking position, and may include a motor 510 and a driving gear 520.
The motor 510 is a member that is installed in the installation space to generate a driving force, and may be mechanically connected to the driving gear 520, and the driving gear 520 may be coupled to a driving shaft of the motor 510 to be horizontally rotatable. The driving gear 520 moves the rotating plate 410 to the locking position or the unlocking position in a state of being engaged with the rotating serration 413.
Next, a sealing ring bonding process of the substrate processing apparatus according to an embodiment of the present invention will be described with reference to fig. 3 and 6 and fig. 7.
First, when the seal ring 200 is coupled to the upper portion of the turntable 100, as shown in fig. 3, the fastening pin 120 of the turntable 100 is inserted into the fastening groove 220 of the seal ring 200. Thereafter, if the driving shaft 511 of the motor 510 is rotated, the driving gear 520 is rotated in the locking direction by the rotational force of the motor 510, and the rotation plate 410 is rotated in the locking direction. At this time, the guide hole 411 of the rotary plate 410 moves to the locking position, and the guide shaft 422 of the connecting rod 420 slides in the longitudinal direction of the guide hole 411. At the same time, the link 420 moves to the lock position, and the driven gear 320 engaged with the moving serration 421 of the link 420 rotates in the lock direction. At this time, the rotation shaft 310 is rotated in the locking direction by the rotation of the driven gear 320, and the eccentric end of the rod 330 is rotated in the locking direction and inserted into the hooking groove 210. In this state, the coupling between the eccentric end of the rod 330 and the hooking groove 210 prevents the seal ring 200 from being separated from the upper portion of the turntable 100.
In addition, the packing ring 200 can be aligned at a correct position by the coupling of the fastening pin 120 and the fastening groove 220, and the packing ring 200 is not shaken to be laterally placed by the supporting force of the fastening pin 120. The upper end of the outer gasket 150 is closely attached to the lower end of the seal ring 200, and the upper end of the inner gasket 160 is closely attached to the lower surface or the inner circumferential surface of the extension 201 formed on the inner circumferential surface of the seal ring 200. Conversely, when the seal ring 200 is separated from the upper portion of the turntable 100, the drive shaft 511 of the motor 510 may be rotated in the unlock direction and driven in the reverse order to the above-described lock order.
Finally, the plurality of levers 330 are rotated to the locking position or the unlocking position by the linear motion of the connection lever 420 in conjunction with the rotational motion of the rotation plate 410 according to an embodiment of the present invention, thereby simultaneously locking and unlocking the levers 330, simplifying the coupling and separating processes of the sealing ring 200, and eliminating coupling errors (twisting, etc.) of the sealing ring 200.
In addition, according to the substrate processing apparatus of an embodiment of the present invention, the inner gasket 160 and the outer gasket 150, which have elasticity, are coupled to the corresponding positions of the turntable 100 and the seal ring 200, respectively, so that the sealing performance of the seal ring 200 can be further improved, and the chemical solution can be prevented from penetrating between the turntable 100 and the seal ring 200.
While the present invention has been described with reference to the preferred embodiments, it should be understood that the present invention is not limited to the embodiments. Therefore, the scope of the present invention is not limited to the embodiments described above, and should be determined based on the claims to be described later and the contents equivalent to the claims. That is, the above-described embodiments are illustrative in all aspects and should be construed as non-limiting, the scope of the present invention is shown by the claims rather than by the detailed description, and all modifications or variations derived from the meaning and scope of the claims and the concept equivalent thereto are included in the scope of the present invention.

Claims (12)

1. A substrate processing apparatus, comprising:
a rotary table on the upper surface of which a wafer is placed;
an annular seal ring coupled to an upper portion of the turntable, the seal ring having a plurality of hooking grooves formed along an inner circumferential surface thereof;
a plurality of opening/closing units which are provided to be interlocked in a radial direction with a vertical rotation center of the rotary table as a reference, are hooked to the hooking groove when performing a locking operation, and are separated from the hooking groove when performing an unlocking operation to release the hooking; and
and a power transmission unit disposed in the installation space of the rotary table, and configured to cause the opening/closing unit to be interlocked to the locking position or the unlocking position by an external force.
2. The substrate processing apparatus according to claim 1,
the rotary table is provided with a placing part protruding along the side surface of the rotary table for placing the lower end of the sealing ring,
the lower end of the sealing ring is placed on the placing part, and the inner circumferential surface of the sealing ring is tightly attached to the side surface of the rotating table.
3. The substrate processing apparatus according to claim 2,
the opening/closing unit includes:
a rotating shaft disposed in a radial direction with respect to a vertical rotation center of the turntable, and having a lower end that is coupled to the turntable so as to be horizontally rotatable therethrough;
a driven gear coupled to a lower end of the rotary shaft in a horizontally rotatable manner; and
and a lever coupled to an upper end of the rotation shaft in a horizontally rotatable manner, wherein when the lever is rotated to a locking position, one end of the lever eccentric to one side is hooked to the hooking groove, and when the lever is rotated to an unlocking position, one end of the lever eccentric to one side is separated from the hooking groove, thereby releasing the hooking.
4. The substrate processing apparatus according to claim 3,
the lower surface of the lever further includes a tapered surface formed to be inclined upward toward the eccentric end, and the tapered surface presses and supports the lower surface of the hooking groove downward when the lever is rotated to the lock position.
5. The substrate processing apparatus according to claim 3,
the power transmission unit is mechanically engaged with the driven gear in a meshing manner, so that the driven gear rotates to a locking position or an unlocking position.
6. The substrate processing apparatus according to claim 5,
the power transmission unit includes:
a rotating plate which can rotate in a locking direction or an unlocking direction with a vertical rotation center as a reference and is provided with a plurality of guide holes which are vertically penetrated in a radial direction; and
and a connecting rod, one end of which on the length direction side is slidably coupled along the guide hole, and one end of which in the width direction is formed with a moving serration part to be engaged with the driven gear.
7. The substrate processing apparatus according to claim 6,
when the rotating plate is rotated in the locking direction, the connecting rod slides to the outside of the rotating plate, thereby rotating the driven gear to the locking position, and when the rotating plate is rotated in the unlocking direction, the connecting rod slides to the vertical rotation center direction of the rotating plate, thereby rotating the driven gear to the unlocking position.
8. The substrate processing apparatus according to claim 6,
the guide hole has the following shape: a long hole shape having a length in an oblique direction toward a vertical rotation center and an edge of the rotation plate,
the connecting rod has a guide shaft at one end on the longitudinal side thereof, and the guide shaft is slidably inserted into the guide hole.
9. The substrate processing apparatus according to claim 6, further comprising:
and an elastic member having both ends coupled to the installation space and the rotation plate, and applying a tensile force to a locking direction of the rotation plate.
10. The substrate processing apparatus according to claim 2,
a plurality of fastening pins are vertically arranged on the rotary table along the upper surface of the placing part,
and a fastening groove is concavely formed at the lower end of the sealing ring, so that the fastening pin can be correspondingly inserted in a concave-convex mode.
11. The substrate processing apparatus according to claim 2,
the rotary table further includes:
an annular outer gasket groove formed continuously along an upper surface of the mounting portion; and
and an annular outer gasket inserted into the outer gasket groove, wherein an upper end of the outer gasket protruding toward an upper portion of the outer gasket groove is closely attached to a lower end of the seal ring.
12. The substrate processing apparatus according to claim 2,
an extension portion is formed on the seal ring to protrude along an inner circumferential surface of the seal ring,
the rotary table further includes: an annular inner seal groove formed continuously along an edge-side upper surface of the rotary table; and an annular inner gasket inserted into the inner gasket groove, wherein an upper end of the inner gasket protruding toward an upper portion of the inner gasket groove is closely attached to a lower surface or an inner circumferential surface of the extension portion.
CN202011281096.5A 2019-12-24 2020-11-16 Substrate processing apparatus Pending CN113035738A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2019-0173775 2019-12-24
KR1020190173775A KR20210082293A (en) 2019-12-24 2019-12-24 Substrate processing apparatus

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CN113035738A true CN113035738A (en) 2021-06-25

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CN (1) CN113035738A (en)
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Publication number Priority date Publication date Assignee Title
JP6545585B2 (en) * 2014-10-16 2019-07-17 株式会社荏原製作所 Substrate holder and plating apparatus
JP6696851B2 (en) * 2016-07-13 2020-05-20 株式会社ディスコ Chuck table mechanism
JP6788417B2 (en) * 2016-07-28 2020-11-25 ナブテスコ株式会社 Gear device
JP7055039B2 (en) * 2017-03-22 2022-04-15 東京エレクトロン株式会社 Board processing equipment
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TW202127565A (en) 2021-07-16
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