TWI750348B - Exposure device and exposure method - Google Patents

Abstract

The subject of the present invention is to reduce the capacity of the installed software and to shorten the time required for program rewriting in exposure using a spatial light modulator. The solution of the present invention is that the substrate (W) is placed on each stage (61) in the standby position on both sides of the irradiation area of the exposure head (1) provided with the spatial light modulator (3). , 62), by the conveying system (6) through the irradiation area alternately back and forth conveying. According to the photographic data of the calibration marks of the substrate (W) photographed by the camera (8), the sequence rewriting program (77) rewrites the initial sequence program (73), and when the substrate (W) passes through the irradiation area, the spatial light modulator (3) Each of the pixel mirrors (31) is controlled by the sequence program (74) which has been rewritten to form an exposure pattern on the substrate (W). The substrate (W) on the first table (61) is not exposed when moving forward, and is exposed when moving back, and the substrate on the second table (62) is exposed when moving forward, and when moving back Not exposed.

Description

Exposure device and exposure method

The present invention relates to exposure techniques using spatial light modulators.

Exposure technology, which exposes an object on which a photosensitive layer is formed, and sensitizes the photosensitive layer, is the main technology of photolithography, and is actively used in the formation of various fine circuits and fine structures. In photolithography, light is irradiated in a pattern according to the shape of the member to be formed. Hereinafter, this pattern of light rays is referred to as an exposure pattern. The "shape of the member to be formed" includes the shape of the surface of the substrate itself and the shape of members such as films and layers formed on the surface of the substrate.

As one of such exposure techniques, a technique of forming an exposure pattern using a spatial light modulator is known. Spatial light modulators generally use DMD (Digital Mirror Device). The DMD system has a structure in which tiny square lenses are arranged in a right-angled lattice. The angle of each mirror system with respect to the optical axis is independently controlled, and takes a posture in which light from the light source is reflected to reach the object, and a posture in which the light from the light source does not reach the object. The DMD system includes a controller for controlling each lens, and the controller controls each lens according to the exposure pattern, so that the light of the exposure pattern is irradiated on the surface of the object. When using the spatial light modulator, it is extremely easy to change the exposure pattern according to the needs, which is suitable for the production of various types and small quantities. Moreover, the exposure conditions can be flexibly changed according to the conditions of the process. These advantages are gradually recognized, and exposure devices equipped with spatial light modulators are gradually widely used.

Patent Document 1 discloses an example of a conventional exposure apparatus using a DMD as a spatial light modulator. As described above, an exposure apparatus using a DMD as a spatial light modulator is constituted by a plurality of built-in light sources, DMDs, and an exposure head of an optical system. Each exposure head is independently controlled by a main controller, and a light beam of a predetermined pattern is irradiated from each exposure head to an object to be irradiated. Convergence of the pattern of the light irradiated by each exposure head for the movement of the movement is the exposure pattern as a whole, which corresponds to the shape of the member to be formed.

As an object, there are many plate-shaped ones (substrates), and the substrates are placed on the table. The stage on which the substrate is placed is conveyed through the irradiation area of the light from each exposure head, and exposure is performed at this time. Furthermore, the DMD system can be called a reflection-type spatial light modulator, but it has also been proposed to use a liquid crystal display as a transmission-type spatial light modulator (Patent Document 2). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2008-191303 [Patent Document 2] Japanese Patent Application Laid-Open No. 2017-134375

[The problem to be solved by the invention]

In the exposure apparatus using the spatial light modulator as described above, it is generally difficult to form an exposure pattern with high illuminance. Therefore, many attempts are made to reduce the conveyance speed of the substrate to increase the amount of light, or to increase the number of exposure heads. However, increasing the number of exposure heads will lead to a significant increase in the cost of the device, and the structure of the device will also increase in size and complexity. Therefore, it is necessary to reduce the conveyance speed of the substrates as a last resort, but this means that the processing time (production interval time) becomes longer, and the productivity cannot be improved.

In order to solve such a problem, in the apparatus of patent document 1, the structure which arrange|positions a stage on both sides by pinching irradiation, and passes through an irradiation area alternately is used for exposure. In Patent Document 1, once the substrates on each stage pass through the irradiation area, they are exposed by each exposure head when returning (in the return path). In the apparatus of Patent Document 1, during the loading (mounting) and unloading (unloading) of the substrate on one stage, the other stage can be moved to expose the substrate, so from this viewpoint, it is possible to Improve productivity. However, according to the research of the inventors, it was found that in the device of Patent Document 1, there are problems of the capacity of software and the problem of reduced productivity related to data processing, especially, the problems related to the calibration required at the time of exposure are more obvious. . Hereinafter, this point will be described.

As described above, in exposure using a spatial light modulator, each pixel of the spatial light modulator (in a DMD, each mirror) is controlled to be ON/OFF at a predetermined timing in conjunction with the transfer of the substrate through the irradiated area. ON refers to the state in which light is irradiated by the pixel, and OFF refers to the state in which the pixel is not irradiated with light. By the sequence of ON/OFF of each pixel according to the conveyance speed of the substrate, the substrate is exposed in a predetermined exposure pattern.

In this case, the entire exposure pattern for one substrate is one, and the sequence of each pixel is prepared in advance so as to realize the exposure pattern, and is installed in the main controller as a control program. In this case, one DMD is constituted by, for example, 1024×768 (786432 in total), and such a sequence of a large number of pixels is respectively programmed. In fact, when a plurality of exposure heads are mounted, DMDs corresponding to the number of exposure heads are independently driven. Therefore, the total number of pixels to be controlled is a multiple of the number of exposure heads. In Patent Document 1, 16 exposure heads are mounted, so it is 16 times larger. Therefore, an enlarged number of sequence programs is required, and the capacity of the overall program becomes extremely large.

At this time, in Patent Document 1, exposure is performed in each return path when the left and right stages alternately pass through the irradiation area and reciprocate, so that the moving directions of the stages during exposure are opposite to each other. Therefore, the order of ON and OFF of each pixel is also reversed, and although the entire exposure pattern is the same, two different sequence programs are required. That is, in the apparatus of Patent Document 1, two program groups consisting of an enlarged number of sequence programs are required. In Patent Document 1, the characteristic point is that "drawing data changing means" is provided. However, in practice, it takes time to change a program with a large capacity, which is a disadvantage.

More profoundly, in order to take advantage of the exposure advantage of using the spatial light modulator, the calibration of data processing is carried out. In general exposure using a mask, an XYθ calibration mechanism is installed on the stage, the calibration mark on the substrate is read, and the calibration mechanism is driven based on the result to calibrate the position of the mask-corrected substrate. On the other hand, when the spatial light modulator is used, the formation position of the exposure pattern on the substrate can be freely changed, so the calibration of the mechanism is not required. That is, in the exposure using the spatial light modulator, after reading the alignment marks of the substrate with the camera, the data processing of rewriting the sequence program is performed according to the imaging data sent from the camera, thereby forming the changing exposure pattern. Calibration of position (calibration on data processing).

In more detail, the sequence program for each pixel is initially programmed in such a way as to describe a predetermined exposure pattern corresponding to the pattern formed on the substrate as a whole. Hereinafter, this program is referred to as an initial sequence program. In the exposure apparatus, a position (hereinafter referred to as an exposure reference point) serving as a reference for exposure processing is set. Each exposure head is mounted so that it may be adjusted so that it may become a predetermined position with respect to an exposure reference point. Moreover, the conveyance system which moves each stage is assembled and installed with high precision so that it may pass a predetermined position with respect to an exposure reference point. Then, in the initial sequence program, the sequence of each pixel is programmed with reference to the exposure reference point. That is, when the substrate is arranged in a horizontal posture and two orthogonal directions in the horizontal plane are set as the XY directions, the sequence of ON and OFF of the pixels is determined according to the position of the exposure reference point of each pixel relative to the XY direction.

The substrate is placed on the table by the transfer mechanism, and the transfer mechanism is controlled so that the relationship between the placement position and the exposure reference point becomes a predetermined position. deviate. At this time, when the camera takes pictures of the calibration marks, the direction and amount of deviation of the substrate can be known according to the photographic data, so the initial sequence program is rewritten in a way of compensating (cancelling) the deviation. By controlling each pixel with the rewritten sequence program, the deviation of the substrate is maintained in this state, and by changing the formation position of the exposure pattern, exposure can be performed in a calibrated state.

The calibration of the data processing does not require the calibration of the mechanism. Therefore, the structure of the apparatus can be simplified, and there is no need to repeat the operation of the mechanism until the alignment is performed with the necessary accuracy. Exposure using a spatial light modulator substantial advantage. However, as described above, the sequence program created for the enlarged number of pixels needs to be completely rewritten, and the burden on data processing is not low. The problem in this situation is that in the situation of Patent Document 1, there are two types of initial sequence programs, and therefore, programs for rewriting are required individually, the capacity of the software is doubled, and processing such as program rewriting takes time. The calibration of data processing needs to be performed for each substrate before exposure. Therefore, if the load of data processing is too large, it will take a long time to start the exposure, and the production interval (the total time required for the exposure processing of one substrate) will become longer. become the main factor in reducing productivity.

The invention of the present application is made by the inventors in order to solve the above-mentioned problems, and the object is to provide a reduction in the capacity of the software to be installed in exposure using a spatial light modulator, and also to shorten the time required for program rewriting when performing calibration on data processing. It takes time, and it is an excellent exposure technology that does not reduce productivity while realizing exposure with the necessary precision. [means to solve the problem]

In order to solve the aforementioned problems, the invention described in claim 1 of the present application has the following structure: It is provided with: an exposure head, which is provided with a spatial light modulator for spatially modulating light according to a predetermined sequence to form an exposure pattern in an irradiation area; The table stands by at the standby positions on both sides of the irradiation area where the light from the exposure head is held; The conveying system reciprocates the first table on which the substrate is placed at the standby position on one side through the irradiation area, and passes through the irradiation area. The second stage on which the substrate is placed at the standby position on the other side is transported back and forth from the irradiation area; The controller controls the spatial light modulator in the exposure head; The camera is used for the substrate on each stage to be exposed in the irradiation area before, photographing the calibration marks of the substrate; and the correction means, which follow the photographic data from the camera to correct the sequence, and use the corrected sequence to control the spatial light modulator; the controller is to change the same exposure pattern , when the substrates formed on the first stage and the substrates on the second stage are used, the sequence corrected according to the photographic data of the substrates on the first stage is used, and the first stage is moved in the return path of the first stage. The substrate on the worktable is exposed, and is not exposed when moving forward, and using the sequence corrected by following the photographic data of the substrate on the second worktable, when the second worktable is moving back, The substrate is exposed, and the spatial light modulator is controlled in a way that no exposure is performed during the return movement. Furthermore, in order to solve the above-mentioned problems, the invention described in claim 2 has the following structure: in the structure of claim 1, the camera is used for both the imaging of the calibration marks on the substrate on the first stage and the first 2. Photographs of calibration marks on the base plate on the workbench. Furthermore, in order to solve the above-mentioned problems, the invention described in claim 3 has the following structure: in the structure of the above-mentioned claim 2, the imaging position of the alignment mark of the substrate on the first stage, that is, the first camera arrangement position and The photographing positions of the calibration marks on the substrate on the second stage, that is, the second cameras are arranged at different positions; a camera moving mechanism for moving the cameras is provided between the first camera arrangement position and the second camera arrangement position. Furthermore, in order to solve the above-mentioned problems, the invention described in claim 4 has the following structure: in the structure of the above-mentioned claim 1, the imaging position of the alignment mark of the substrate on the first stage, that is, the first camera arrangement position is different from that of the first camera. The photographing positions of the calibration marks of the substrate on the second worktable, that is, the second cameras are arranged in different positions; the cameras are respectively arranged at the first camera arrangement position and the second camera arrangement position. Furthermore, in order to solve the above-mentioned problems, the invention described in claim 5 has the following structure: as in the structure of any one of claims 1 to 4 of the claimed scope, the correction means is provided with a The sequence program initially created according to the shape of the formed member according to the exposure pattern data is the initial sequence program, and the sequence rewriting program for rewriting the above-mentioned photographic data is followed. Furthermore, in order to solve the above-mentioned problems, the invention described in claim 6 is an exposure method comprising an exposure head provided with a spatial light modulator for forming an exposure pattern in an irradiated area by spatially modulating light in accordance with a predetermined sequence, An exposure method for exposing a substrate, comprising: a step of placing a substrate on a first stage waiting at a standby position on one side of an irradiation area of light from an exposure head; and irradiating a light from an exposure head The step of placing the substrate on the second stage waiting at the standby position on the other side of the area; The first photographing step of photographing the alignment mark of the substrate placed on the first stage with a camera; A second photographing step in which the calibration marks of the base plate of the stage are photographed with a camera; the sequence is corrected by following the photographic data obtained in the first photographing step, and the spatial light modulator is controlled by using the corrected sequence, while the first working The substrate on the stage moves the first stage by irradiating the area, exposing the substrate on the first stage in the first exposure step; and correcting the sequence by following the photographic data obtained in the second photographing step, The second exposure step of exposing the substrate on the second stage by controlling the spatial light modulator by the modified sequence while moving the second stage in a way that the substrate on the second stage passes through the irradiation area; When the same exposure pattern is formed on the substrate on the first stage and the substrate on the second stage, the moving direction of the first stage in the first exposure step and the moving direction of the second stage in the second exposure step are: The same direction; does not have the same exposure pattern on the substrate on the first stage and the substrate on the second stage, the moving direction of the first stage and the moving direction of the second stage are different. Steps for exposure. [Effect of invention]

As described below, according to the invention described in claim 1 or 6 of the present application, the substrate is exposed when the first stage and the second stage move in the same direction, and there is no exposure when the first stage and the second stage move in different directions. , which can reduce the capacity of the necessary software and shorten the processing time of the software. Therefore, the structure of the apparatus becomes simple, and the shortening of the whole operation time (improvement of productivity) can be achieved. Further, according to the invention described in claim 2, in addition to the aforementioned effects, cameras are used for both the substrates on the first stage and the substrates on the second stage, so that the number of cameras can be reduced. The cost becomes cheap in point of view. Furthermore, according to the invention described in claim 3, in addition to the above-mentioned effects, since the camera moving mechanism is provided, it is possible to photograph the substrates on the first stage and the substrates on the second stage simultaneously while using a camera at an optimum level. location for photography. Furthermore, according to the invention described in claim 4, in addition to the aforementioned effects, separate cameras are provided for the substrates on the first stage and the substrates on the second stage, so even if the imaging positions are different, There is also no need for time for movement of the camera. . Therefore, the overall production interval is shortened, and the mechanism is also simple and inexpensive. In addition, according to the invention described in claim 5, the initial sequence program is rewritten using the sequence rewriting program to perform calibration on data processing, so the time required for data processing is shortened, and productivity can be improved from this point of view.

Next, an embodiment (hereinafter, an embodiment) for implementing the present invention will be described. Figures 1 and 2 are schematic views of the exposure apparatus according to the first embodiment, Figure 1 is a schematic front view, and Figure 2 is a schematic plan view. The exposure apparatus shown in FIGS. 1 and 2 is an exposure apparatus using a spatial light modulator. The spatial light modulator is built in the exposure head 1 . First, the exposure head 1 will be described in detail. The exposure head 1 is a cylindrical shape as a whole, which is arranged in a vertical state and emits light downward. FIG. 3 is a schematic view showing the internal structure of the exposure head 1 . As shown in FIG. 3 , the exposure head 1 includes a light source 2 , a spatial light modulator 3 that spatially modulates the light from the light source 2 , and projects an image caused by the light modulated by the spatial light modulator 3 Optical system (hereinafter, projection optical system) 4 and the like.

The light source 2 uses the light source of the optimum wavelength according to the light-sensing wavelength of the photosensitive layer of the substrate W. Most of the photoresist films have photosensitive wavelengths from the visible short wavelength region to the ultraviolet region, and as the light source 2, a light source that outputs light from the visible short wavelength region such as 405 nm or 365 nm to the ultraviolet region is used. In addition, in order to exert the performance of the spatial light modulator 3, it is better to output coherent light rays, so the laser light source 2 is suitable for use. For example, a gallium nitride (GaN)-based semiconductor laser is used.

As the spatial light modulator 3, in this embodiment, a DMD is used. In the DMD, each pixel is a tiny mirror 31 as shown enlarged in FIG. 3 . The mirror (hereinafter, referred to as pixel mirror) 31 is, for example, a square mirror with an angle of about 13.68 μm, and has a structure in which many pixel mirrors 31 are arranged in a rectangular lattice. The number of permutations is, for example, 1024×768.

The spatial light modulator 3 includes a modulator controller 32 that controls each pixel mirror 31 . The exposure apparatus of the embodiment is equipped with the main controller 7 which controls the whole. The modulator controller 32 controls each pixel mirror 31 according to the signal from the main controller 7 . Furthermore, each pixel mirror 31 takes a plane on which the pixel mirrors 31 are arranged as a reference plane, and takes a first posture along the reference plane and a second posture inclined by, for example, about 11 to 13° with respect to the reference plane. In this embodiment, the first posture is the OFF state, and the second posture is the ON state. The spatial light modulator 3 includes a driving mechanism for driving each pixel mirror 31, and the modulator controller 32 can independently control each pixel mirror 31 to take the first posture or take the second posture. Such a spatial light modulator 3 is available from Texas Instruments.

As shown in FIG. 3 , the exposure head 1 includes an irradiation optical system 5 for irradiating the spatial light modulator 3 with light from the light source 2 . In this embodiment, the irradiation optical system 5 includes an optical fiber 51 . In order to form an image with higher illuminance, one exposure head 1 includes a plurality of light sources 2 , and an optical fiber 51 is provided for each light source 2 . As the optical fiber 51, for example, a silica-based multimode optical fiber is used.

In order to perform high-precision imaging using the spatial light modulator 3 , which is a DMD, it is preferable that flat light is incident to be reflected by each pixel mirror 31 , and that light is incident obliquely to each pixel mirror 31 . Therefore, as shown in FIG. 3 , the irradiation optical system 5 includes a collimator lens 52 for collimating the light beams emitted and diffused from the respective optical fibers 51 .

The projection optical system 4 is composed of two projection lens groups 41 and 42 , a microlens array (hereinafter abbreviated as MLA) 43 arranged between the projection lens groups 41 and 42 , and the like. MLA43 is an auxiliary configuration for exposure with higher shape accuracy. MLA43 is an optical component in which many tiny lenses are arranged in a rectangular lattice. Each lens element corresponds to each pixel mirror 31 of the spatial light modulator 3 in a one-to-one manner.

In the above-mentioned exposure head 1 , the light from the light source 2 is guided by the optical fiber 61 and then enters the spatial light modulator 3 through the irradiation optical system 5 . At this time, each pixel mirror 31 of the spatial light modulator 3 is controlled by the modulator controller 32 to be set to a posture that is selectively tilted according to the exposure pattern. That is, in accordance with the exposure pattern, the pixel mirrors 31 located at the positions where light should reach the irradiation area are turned on, and the other pixel mirrors 31 are turned off. The light reflected by the pixel mirror 31 in the OFF state does not reach the irradiation area, and only the light reflected by the pixel mirror 31 in the ON state arrives. Therefore, the light of the predetermined pattern is irradiated to the irradiation area.

A plurality of such exposure heads 1 are provided. As shown in FIG. 2, in this embodiment, eight exposure heads 1 are provided. With the eight exposure heads 1, one exposure pattern is formed as a whole. In addition, each exposure head 1 has the same structure.

On the other hand, as shown in FIG. 1 , the exposure apparatus according to the embodiment includes a pair of tables 61 and 62 which are arranged on both sides with the shot area sandwiched therebetween, and the tables 61 and 62 on which the substrate W is placed are moved to convey the substrate W. The transport system 6. Each of the tables 61 and 62 is for mounting the substrate W on the horizontal upper surface. On each upper surface, a vacuum adsorption hole is provided. In order to reduce the contact area with the board|substrate W, there is a case where it is used for the stage of the structure which provided many protrusions on the upper surface.

The conveyance system 6 is provided with the linear guide 60 arrange|positioned by the irradiation area, and the drive source not shown which linearly moves each table 61 and 62 along the linear guide 60. The linear guide 60 is shared by a pair of tables 61 and 62, and the tables 61 and 62 linearly move on the same track. The drive sources are installed on the tables 61 and 62 respectively, and can drive the tables 61 and 62 independently. As a drive source, for example, a linear motor is used, and a structure of a linear motor table can be adopted. The direction in which the linear guide 60 extends is the conveying direction. Hereinafter, this direction is referred to as the X direction, and the horizontal direction perpendicular to the X direction is referred to as the Y direction.

In addition, standby positions (left standby position and right standby position) are respectively set on both sides away from the irradiation area. A transfer mechanism (not shown) is arranged at each standby position. In this example, the substrate W to be exposed is conveyed by the conveyor 63 , and the substrate W after exposure is accommodated in the collection rack 64 . Each transfer mechanism performs loading for placing the substrates W on the tables 61 and 62 from the conveyor 63 and unloading for removing the exposed substrates W from the tables 61 and 62 and storing them in the collection racks 64 .

Regarding the irradiation area, the description will be supplemented with reference to FIG. 4 . FIG. 4 is a schematic perspective view showing an irradiation area. In FIG. 4 , an area (hereinafter, referred to as an individual area) E that can be irradiated with light by one exposure head 1 is shown by a square frame. The aggregation of individual regions E is the irradiated region. The substrate W is irradiated with light in the respective regions E while moving in the direction indicated by the arrow (X direction) in FIG. 4 . At this time, since the exposure heads 1 in the two rows are mutually displaced, exposure can be performed without gaps even in the horizontal direction (Y direction) perpendicular to the moving direction.

As shown on an enlarged scale in FIG. 4 , in actuality, the individual regions E are aggregates of minute irradiation patterns (hereinafter, referred to as minute patterns) M. One minute pattern M is a pattern created by one pixel mirror 31 . The substrates W placed on the tables 61 and 62 move to the irradiation area along with the movement of the tables 61 and 62 , but the micro-patterns M are turned ON and OFF in a predetermined sequence according to the timing of the movement. Thereby, a desired exposure pattern is formed on the board|substrate W.

As shown in FIG. 1 , the main controller 7 includes a memory unit 71 such as a hard disk or a large-capacity memory. The memory unit 71 stores a main sequence program 72 for controlling the overall sequence of the apparatus, and a pixel sequence program for sequentially controlling the pixel mirrors 31 of the spatial light modulators 3 in the exposure heads 1 during exposure to one substrate W. . The main sequence program 72 calls and executes the pixel sequence program when each substrate W is exposed. Furthermore, it is the modulator controller 32 that actually controls each pixel mirror 31 , so the pixel sequence program is a program that assigns a sequence to the modulator controller 32 and drives each pixel mirror 31 with the sequence. There are two types of pixel sequence programs, one is the initial sequence program 73, and the other is the rewritten sequence program that is rewritten by calibration. The main sequence program 72 actually executes the rewritten sequence program 74 .

Moreover, in the memory|storage part 71, the exposure pattern data 75, the sequence creation program 76, and the sequence rewriting program 77 are memorize|stored. The exposure pattern data 75 is image data of the pattern formed on the substrate W. As shown in FIG. The apparatus of the embodiment is basically an apparatus for single-wafer processing, and the same exposure pattern is formed on each substrate W. In many cases, the exposure patterns are different when the batches are different. In this case, the different exposure pattern data 75 are stored in the memory unit 71 and used. The main controller 7 includes an input unit 701 , and each exposure pattern data 75 is input from the input unit 701 and stored in the memory unit 71 .

The sequence creation program 76 is a program for creating the initial sequence program 73 based on the exposure pattern data 75 . When the exposure pattern data 75 is newly memorized, the sequence creation program 76 is executed, and an initial sequence program 73 based on the exposure pattern data 75 is created.

Next, the rewriting of the initial sequence program 73 for calibration in data processing will be described. For convenience of description, among the pair of workbenches, the workbench 61 on the left side is called the first workbench, and the workbench 62 on the right side is called the second workbench 62. As shown in FIG. 1 , the apparatus includes a camera 8 for calibration. In the first embodiment, the camera 8 is used for both calibration of the substrate W on the first stage 61 and calibration of the substrate W on the second stage 62 .

More specifically, as shown in FIGS. 1 and 2 , a guide rail 801 is provided on the right side of the irradiation area. The guide rails 801 extend in the X direction, and two are arranged parallel to each other. The distance between the two guide rails 801 is almost equal to the width of the table in the Y direction. A pedestal 802 is mounted on each guide rail 801, and the camera 8 is fixed to the pedestal 802. Therefore, in this embodiment, two cameras 8 are provided. Each camera 8 is a digital camera such as a CCD having the necessary resolution.

Each pedestal 802 is provided with a camera moving mechanism 803 , and each camera 8 can be moved to any position on the guide rail 801 by the camera moving mechanism 803 . Moreover, the Y direction adjustment mechanism which is not shown in figure is attached to the base 802. The movement in the Y direction corresponds to the situation where the size of the substrate W is different.

The substrate W has alignment marks. In the apparatus, an arrangement position of the camera 8 (hereinafter, referred to as a first camera arrangement position) for photographing the alignment marks of the substrate W on the first stage 61 and an arrangement position for photographing the substrate on the second table 62 are set. The arrangement position of the camera 8 of the calibration mark of W (hereinafter, referred to as the second camera arrangement position). In this embodiment, the first camera arrangement position is a position near the left end of the guide rail 801 , and the second camera arrangement position is a position near the right end of the guide rail 801 .

Hereinafter, the calibration with respect to the substrate W on the first stage 61 will be described in more detail. Each of the cameras 8 is preliminarily set in a state of being located at the first camera arrangement position. Specifically, the optical axis of each camera 8 is set to a position that matches the arrangement position of the first camera. The two first camera arrangement positions are the same position in the X direction, and are positions separated by a predetermined distance in the Y direction. There are two alignment marks on the substrate W in the width direction of the substrate W, and the spacing distance in the Y direction of the two first camera placement positions is set to be the same as the designed distance between the two alignment marks. In order to adjust the position of each camera 8 in the Y direction, the Y direction adjustment mechanism operates.

The first stage 61 on which the substrate W is placed is moved to a position where the camera 8 can image the alignment marks of the substrate W. The distance of this movement is the distance in the X direction until the alignment mark of the substrate W is assumed to be directly below the camera 8 . Hereinafter, this distance will be referred to as the first photographic moving distance. The "presumed position" refers to the position where the substrate W is placed at the correct position on the first table 61 and the substrate W is of the size as designed and the error in the mechanism accuracy of the conveying system 6 is ignored. The main controller 7 sends a control signal to the conveying system 6 by moving the first photographing moving distance in the X direction in the past.

The conveyance system 6 moves the first stage 61 by the amount of the moving distance for the first photographing. However, due to the deviation of the arrangement position of the substrates W and the unevenness of the size of the substrates W, the alignment marks are not positioned on the respective cameras 8 . directly below the optical axis. Even so, each camera 8 has a sufficient field of view, and each calibration mark is located within the field of view of each camera 8 . Furthermore, the first stage 61 passes through the irradiation area or is located in the irradiation area during the movement of the moving distance for the first photographing, but each exposure head 1 does not operate and is not irradiated with light. "Inactive" refers to a state in which light does not reach the irradiation area from each pixel mirror 31, and all pixel mirrors 31 are in an OFF state or blocked by a shutter or the like, and light is not emitted from each exposure head 1.

FIG. 5 is a schematic diagram showing the state of calibration in data processing based on photographic data obtained by each camera 8 . In Fig. 5, the optical axis A of each camera 8 is the center of the field of view V, and is the first camera arrangement position as described above. In the calibration in data processing, a point (hereinafter, calibration reference point) O that becomes the reference is predetermined. For example, the middle point of the two first camera arrangement positions (optical axes A) is defined as the calibration reference point O.

In this example, the calibration marks are a square pattern. The sequence rewriting program 77 processes the photographic data from each camera 8 and specifies the center C of each calibration mark. Hereinafter, the center C of the specified calibration mark is referred to as the detection mark center. The sequence rewriting program 77 acquires the coordinates of the center C of the two detection marks of the XY coordinates with the calibration reference point O as the origin. Then, the length of the line segment L connecting the centers C of the two detection marks and the inclination of the XY coordinates are calculated.

In this example, the size and shape of the substrate W are correct, and when the substrate W is in the correct position, the two alignment marks will be located on the two first camera placement positions (on the optical axis A). A line segment connecting the two first camera arrangement positions (optical axis A) is an accurate line segment (hereinafter, a reference line segment) Ls serving as a reference. Therefore, the sequence rewriting program 77 calculates the ratio of the deviation in the XY direction, the deviation in the rotation direction (theta direction), and the length of the line segment L connecting the centers of the two detection marks relative to the reference line segment Ls. In addition, the rotation direction is a rotation direction centered on a point where the center of the substrate W is assumed to be located when the two alignment marks are located at each first camera arrangement position (optical axis A).

The sequence rewriting program 77 rewrites the original sequence program 73 by applying the ratios of these XYθ deviations and lengths (hereinafter, referred to as n times) to create a rewritten sequence program 74 . That is, the rewritten sequence program 74 is created so that the exposure pattern is formed at a position where XYθ is deviated, the magnification of the exposure pattern is n times, and the exposure pattern is formed at such a position and size. The sequence rewriting program 77 is programmed in this way.

Next, the alignment of the substrate W on the second stage 62 will be described. Regarding the substrate W on the second stage 62, only the imaging position of the calibration mark (the second camera arrangement position) is different, and the other structures are basically the same. In this embodiment, the second camera arrangement position is located on the right side of the irradiation area similarly to the first camera arrangement position, but is a position farther from the irradiation area than the first camera arrangement position. Since the photographing positions are different, the moving distance for photographing (the second moving distance for photographing) for the second stage 62 is different from that for the first table 61 . The second stage 62 mounts the substrate W at the right standby position, advances slightly in the X direction toward the irradiation area, captures an image of the alignment mark of the substrate W at the position, and then advances further to the irradiation area to perform the aligning mark on the substrate W. exposure. Usually, since the positions of the substrate W and the calibration marks on the first stage 61 are the same (substrate W of the same type), the distance between the setting marks and the reference line segment are also set to the same values as constants.

In the exposure apparatus according to the first embodiment, the operation of each exposure head 1 related to the conveyance direction of the substrate W is an important element, and these are realized by the main controller 7, so this point will be described below. . FIG. 6 is a flowchart showing the outline of the main sequence program 72 installed in the main controller 7 .

The main sequence program 72 is always in the execution state during the operation of the device, and the main part is schematically shown in FIG. 6 . Furthermore, when the new exposure pattern data 75 is input, the sequence creation program 76 is automatically executed, and the initial sequence program 73 is created for the exposure pattern data 75 . Since the initial sequence program 73 is created corresponding to each exposure pattern data 75, an ID is given so that each initial sequence program 73 stored in the memory unit 71 of the main controller 7 can be identified. Since this ID corresponds to the type of the substrate W, it is hereinafter referred to as a type ID.

The main sequence program 72 assigns a type ID as a variable. The type ID is not only assigned when the operation of the apparatus is started, but also updated and assigned when the exposure pattern data 75 is changed (when exposure of a different type is performed). As shown in FIG. 6 , the main sequence program 72 sends control signals to the camera moving mechanism 803 in such a way that each camera 8 is located in the first camera configuration. Next, after confirming the placement of the substrate W on the first stage 61, a control signal is sent to the conveyance system 6, and the first stage 61 is moved by the amount of the moving distance for the first photographing. Thereby, each alignment mark of the substrate W on the first stage 61 enters the field of view of each camera 8 .

The main sequence program 72 processes the imaging data from each of the cameras 8, and determines whether each calibration mark has been captured. When the image of one or both of the calibration marks cannot be confirmed, the calibration marks are out of the field of view of the camera 8, so the main sequence program 72 performs error processing. That is, the operation of the device is stopped, and the gist thereof is displayed on the display 702 .

When the image of each calibration mark can be confirmed, the main sequence program 72 executes the sequence rewriting program 77 . Although the sequence rewriting program 77 is not shown in detail, the sequence rewriting program 77 processes the photographic data from each camera 8 and acquires the coordinates of the center C of each mark. Then, the sequence rewriting program 77 obtains the ratio of the deviation to the length of the line segment L connecting the mark center C from the reference line segment Ls, applies these to the initial sequence program 73, and creates a rewritten sequence program 74. In addition, the confirmation of the state in which the image of each calibration mark is acquired, and the error handling when it cannot be confirmed may be implemented as a function of the sequence rewriting program 77 in some cases.

When the sequence rewriting program 77 returns a value indicating that the rewriting of the initial sequence program 73 is correctly completed, the main sequence program 72 calls the rewritten sequence program 74 and becomes a state that can be executed immediately. Then, the main sequence program 72 further transmits a control signal to the conveying system 6 so that the first stage 61 passes through the irradiation area. At this time, when a part of the substrate W on the first stage 61 is located in the irradiation area at the time of imaging of each calibration mark, the control signal sent from the main sequence program 72 to the conveying system 6 causes the first stage 61 to face slightly to the right. A control signal for moving forward, allowing the substrate W to completely pass through the irradiation position, and inverting and retreating at the predetermined inversion position.

The first stage 61 whose reversal position is reversed passes through the irradiation area again. At this timing, the main sequence program 72 operates the rewritten sequence program 74 to turn on and off each pixel mirror 31 of the spatial light modulator 3 in each exposure head 1 at a predetermined timing. Although the description is omitted, a plurality of sensors (not shown) are attached to the conveying line by the conveying system 6 , and the movement of the tables 61 and 62 is detected and sent to the main controller 7 . The main sequence program 72 executes the rewritten sequence program 74 in synchronization with the first stage 61 advancing from the right side through the irradiation area according to the signals from the sensors. At this time, the signal of the moving speed of the first table 61 is given to the main sequence program 72 as a constant, thereby achieving synchronization. After confirming that the first stage 61 is exposed through the irradiation area and returns to the left standby position, the main sequence program 72 sends a control signal so that the transfer mechanism in the left standby position unloads the substrate W and loads the next substrate W .

Next, the main sequence program 72 sends a control signal to the camera moving mechanism 803 so that the camera 8 is positioned in the second camera configuration. Then, after confirming that the substrate W has been loaded on the second table 62 at the right standby position, a control signal is sent to the transfer system 6 to move the second table 62 by the moving distance for the second imaging. Then, the sequence rewriting program 77 is activated, and the photographic data from each camera 8 is processed to rewrite the initial sequence program 73, and a rewritten sequence program 74 is created. The sequence rewriting program 77 is stored in the memory unit 71 so as to overwrite the sequence rewriting program 77 created for the substrate W on the first stage 61 .

When the main sequence program 72 confirms that the sequence rewriting program 77 has been completed normally, it sends a control signal to the conveying system 6 so that the second table 62 is further advanced and passes through the irradiation area. Then, the timing at which the second stage 62 passes through the irradiation area is acquired by a sensor not shown, and the rewritten sequence program 74 is executed synchronously.

When it is confirmed that the second table 62 passes through the irradiation area and reaches the reversing position set on the left side of the irradiation area, the main sequence program 72 will make the second table 62 retreat from the reversing position and return to the right side standby position. A control signal is sent to the conveying system 6 . During the movement of the return path, no operation signal is sent to each exposure head 1, and exposure is not performed. Then, when it is confirmed that the second table 62 has returned to the right standby position, the main sequence program 72 sends a control signal so that the transfer mechanism in the right standby position unloads the substrate W and loads the next substrate W. Thereby, the exposure processing of each substrate W on the second stage 62 is completed, and the main sequence program 72 is programmed to repeat the above-mentioned steps until the substrate W at the end of the lot.

In the structure of the above-mentioned main sequence program 72, the main point is that when the first stage 61 advances to the first camera arrangement position (forward path), the main sequence program 72 does not send an action signal to each exposure head 1, and the first stage 61 is reversed. When the position is reversed back (return path), an action signal is sent for exposure, and when the second stage 62 advances from the second camera arrangement position to pass through the irradiation area (forward path), an action signal is sent to each exposure head 1 for exposure, When the second stage 62 is reversed from the reverse position (return path), no operation signal is sent to each exposure head 1 . That is, the main sequence program 72 is programmed so that exposure is performed when passing through the irradiation area from right to left, and no exposure is performed when passing from left to right for both the first stage 61 and the second stage 62 .

Therefore, the sequence program (initial sequence program 73 ) for each pixel mirror 31 of each spatial light modulator 3 executed by the main sequence program 72 is one, and there is no need to prepare two different “drawing data” as in Patent Document 1 , or change the "Drawing Data". Therefore, the capacity of the software installed in the main controller 7 only needs to be small.

The exposure when moving in the same direction is more significant from the viewpoint of the advantage of exposure using the spatial light modulator 3 , that is, calibration in data processing. In the calibration in data processing, as described above, the positional deviation of the substrate W is obtained from the photographic data of the calibration marks, and the formation position of the exposure pattern is changed according to the deviation. In this case, if the original sequence program (initial sequence program 73 in the embodiment) is different, the program for rewriting must also be adapted to it, and different codes are installed, and two types of programs for rewriting are also required. Therefore, the capacity of the entire software increases, and the time required for program replacement (reading from the memory unit 71 ) cannot be ignored.

As described above, according to the configuration of the embodiment, the required software capacity can be reduced, and the time required for processing the software can also be shortened. Therefore, the structure of the apparatus becomes simple, and the shortening of the whole operation time (improvement of productivity) can be achieved. The description of the overall operation of the exposure apparatus overlaps with the description of the structure of the main sequence program 72, so it is omitted. In addition, the description of the operation|movement of an exposure apparatus corresponds to the description of the embodiment of the invention of an exposure method, and it abbreviate|omits about this also in order to avoid repetition. In addition, the invention of the exposure method corresponds to the invention of the manufacturing method in the sense of the manufacturing method of the board|substrate to be exposed.

Furthermore, when performing calibration on data processing, a sequence program can also be created from the beginning in accordance with the photographic data from the camera 8 . At this time, the exposure pattern data 75 is rewritten in accordance with the photographic data to enlarge and reduce the exposure pattern, or the constant (XYθ) assigned to the formation position of the exposure pattern is changed in the sequence creation program 76, and the sequence program is created and rewritten by the sequence creation program 76. 74 Equivalent sequence programs. However, in this case, the sequence program of each spatial light modulator 3 is re-created from the beginning in each exposure process, so there is a disadvantage that the time required for data processing is long. In the case of the sequence rewriting program 77, there is no such disadvantage, and the productivity can be improved.

Next, the exposure apparatus of 2nd Embodiment is demonstrated. Fig. 7 is a schematic front view of the exposure apparatus according to the second embodiment. The second embodiment is different from the first embodiment in that a camera 81 for the substrate W on the first stage 61 and a camera 82 for the substrate W on the second stage 62 are provided separately. Even in the second embodiment, two guide rails 801 extending parallel to each other along the X direction are provided. Two cameras 81 and 82 are respectively installed on each guide rail 801 , one for the substrate W on the first stage 61 and one for the substrate W on the second stage 62 . The camera 81 for the substrate W on the first stage 61 is referred to as a first camera, and the camera 82 for the substrate W on the second table 62 is referred to as a second camera.

The position where the first camera 81 is installed corresponds to the first camera arrangement position in the first embodiment, and the position where the second camera 82 is installed corresponds to the second camera arrangement position in the first embodiment. The cameras 81 and 82 are similarly provided with adjustment in the Y direction (not shown), and can respond to changes in the size of the substrate W and changes in the positions of the alignment marks.

The structure and operation of the apparatus of the second embodiment are the same as those of the first stage 61 except that the alignment marks on the substrate W on the first stage 61 and the alignment marks on the second stage 62 are photographed by separate cameras 81 and 82 . One embodiment is the same. The main sequence program 72 is given as an argument when the sequence rewriting program 77 is activated, information specifying which stage to calibrate the substrate W on. If the sequence rewriting program 77 is the calibration of the substrate W on the first stage 61 , the photographic data from the first camera 81 is obtained, and a rewritten sequence program 74 is created according to it, which is the substrate on the second stage 62 . If W is calibrated, the photographic data from the second camera 82 is obtained, and the rewritten sequence program 74 is created according to the data.

Even in the second embodiment, only one initial sequence program 73 is required, and only one sequence rewriting program 77 is required to correct it. Therefore, the capacity of necessary software can be reduced, and the time required for processing the software can also be shortened. Therefore, the structure of the apparatus becomes simple, and the shortening of the whole operation time (improvement of productivity) can be achieved.

Furthermore, in the second embodiment, since separate cameras 81 and 82 are provided for the substrate W on the first stage 61 and the substrate W on the second stage 62, it is not necessary as in the first embodiment. The time used for the movement of the camera 8 . Therefore, the overall production interval time can be shortened. In addition, a mechanism for moving each of the cameras 81 and 82 in the X direction is not required, and the structure becomes simpler and the cost is low. However, since the number of cameras 8 increases, the cost increases compared to the first embodiment in this regard. In addition, there is a case where a moving mechanism is provided so that the position of each of the cameras 81 and 82 in the X direction can be changed.

In the above-described embodiments, two cameras 8 , 81 , and 82 are used for calibration of one substrate W, but when there are three or more calibration marks, the number of cameras is increased according to the situation. For example, when there are four alignment marks on one substrate W, four cameras 8 are used at the same time, and the four alignment marks are photographed simultaneously for alignment.

In addition, there are cases where the number of cameras is smaller than the number of alignment marks on one substrate W. For example, there are cases where two cameras are used for four calibration marks. At this time, in the structure of the first embodiment, after the two alignment marks on the left are photographed, the two cameras may be moved to the right without the substrate W, and the two alignment marks on the right may be photographed for alignment. example of action. Also, there may be cases where one camera has been moved to four locations in sequence and has been calibrated. In either case, the arrangement position (photographing position) of the camera after the movement is predetermined as the reference position, and if there is no calibration mark within the field of view of the camera located at this position (if the calibration mark cannot be photographed), an error occurs.

Furthermore, in the first embodiment, the first camera arrangement position and the second camera arrangement position may be set to the same position. For example, each alignment mark of the substrate W on the first stage 61 may be photographed at the second camera arrangement position. However, since the moving distance for photographing with respect to the first stage 61 becomes longer, there is a disadvantage in that the production interval becomes longer from this point of view.

In addition, in each embodiment, it has been described that the imaging of each calibration mark is performed in a state in which the stages 61 and 62 are stopped, but each calibration mark may be captured while moving the stages 61 and 62 . At this time, since moving images are sent from each camera as photographing data, an image (still image) at the timing when each calibration mark is simultaneously photographed is extracted, and image processing is performed similarly to obtain the center of each mark. At this time, in order to perform photographing, the speed of the stages 61 and 62 may be temporarily reduced.

As described above, in the exposure apparatus and the exposure method of each embodiment, when exposing the substrate W on each of the tables 61 and 62 while arranging the tables 61 and 62 on the left and right with the irradiation area held between them, the time of passing through the irradiation area is The direction of movement is often the same. The "same direction" at this time is the "same direction" when the same exposure pattern is formed on the substrates W on each of the stages 61 and 62, and the same exposure pattern is formed without moving in the reverse direction.

When forming different exposure patterns, there may also be exposures in which the edges move in different directions. That is, when the pattern A is exposed to the substrate W on the first stage 61 and the pattern B is exposed to the substrate W on the second stage 62, there may be exposures that move in opposite directions. In such a case, since the exposure pattern data is originally different, and two initial sequence programs are required, it is meaningless to set them in the same direction.

In addition, there are cases where different exposure patterns should be formed in the forward path and the return path for one substrate W, but in this case, there may be exposure patterns on the forward path of the substrate W on the first stage 61 and the second stage 62 . The exposure pattern of the return path of the substrate W on the top is set to be the same, and the exposure pattern of the return path of the substrate W on the first stage 61 and the return path of the substrate W on the second stage 62 are set to be the same situation. . At this time, as long as the formation of the same exposure pattern is performed, each of the stages 61 and 62 is moved in the same direction, which is the same as that of the above-described embodiments.

In each embodiment, the calibration in data processing is performed not only to adjust the positional deviation of the substrate W in each direction of XYθ, but also to enlarge and reduce the exposure pattern to be formed. This point assumes, for example, that the substrate W is thermally expanded to some extent irreversibly during the heat treatment in the previous process. When such thermal expansion occurs, the distance between the two alignment marks is proportional to the thermal expansion of the substrate W. As shown in FIG. Even if there is such a small thermal expansion, there is no problem as a product, and the formed fine pattern needs to be enlarged in response to the expansion of the substrate W. Therefore, as described above, two calibration marks are detected to obtain the separation distance, and the magnification relative to the distance serving as the reference is calculated, and the exposure pattern is enlarged or reduced by the magnification. When the alignment marks are provided at 3 places, since the deformation of the substrate W can also be detected, there are cases in which it deforms in accordance with the deformation of the exposure pattern.

In the present invention, "calibration marks" need to be interpreted in a broad sense, and are not necessarily limited to those that can be called "marks". There is also a case of through-holes, and there are cases where a singularity such as a notch formed in the peripheral edge of the substrate W or a singularity such as a corner of a square substrate W is photographed as alignment marks.

The exposure apparatus and exposure method of each of the above-mentioned embodiments can be used for various applications in which a desired pattern is formed at a position on a substrate. Since exposure patterns can be formed at predetermined positions through calibration in data processing, the exposure patterns can be appropriately changed according to the type, so it is suitable for the manufacture of high-performance products that require a variety of low-volume production. Specifically, it can be preferably used in the manufacture of printed circuit boards mounted on various electronic products such as smartphones, or in the manufacture of display boards required for the manufacture of various displays.

In addition, in each of the above-mentioned embodiments, the exposure apparatus includes a plurality of exposure heads 1 , but it can be implemented with only one exposure head 1 . In the case of using a large exposure head, or in the case of the formed exposure pattern having a small size, only one is required. Furthermore, in the foregoing embodiments, the spatial light modulator 3 is a DMD, but a transmissive spatial light modulator such as a liquid crystal display may also be used.

1‧‧‧Exposure head 2‧‧‧Light source 3‧‧‧Spatial light modulator 5‧‧‧Irradiation optical system 6‧‧‧Conveying system 7‧‧‧Main controller 8‧‧‧Camera 31‧‧‧Pixels Mirror 32‧‧‧Modulator Controller 41‧‧‧Projection Lens Group 42‧‧‧Projection Lens Group 43‧‧‧Micro Lens Array (MLA)51‧‧‧Fiber 52‧‧‧Collimator Lens 60‧‧ ‧Linear guide 61‧‧‧First stage 62‧‧‧Second stage 63‧‧‧Conveyor 71‧‧‧Memory section 72‧‧‧Main sequence program 73‧‧‧Initial sequence program 74‧‧‧ Rewritten Sequence Program 75‧‧‧Exposure Pattern Data 76‧‧‧Sequence Creation Program 77‧‧‧Sequence Rewriting Program 81‧‧‧Camera 82‧‧‧Camera 701‧‧‧Input Section 702‧‧‧Display 801‧‧‧ Guide rail 802‧‧‧Pedestal 803‧‧‧Camera moving mechanism W‧‧‧Substrate

1 is a schematic front view of the exposure apparatus of the first embodiment. [Fig. 2] A schematic plan view of the exposure apparatus of the first embodiment. [Fig. 3] A schematic diagram showing the internal structure of the exposure head. [Fig. 4] A schematic perspective view showing the irradiation area. [Fig. 5] A schematic diagram depicting the state of calibration in data processing based on the photographic data obtained by each camera. [Fig. 6] A flowchart showing the outline of the main sequence program installed in the main controller. [Fig. 7] A schematic front view of the exposure apparatus of the second embodiment.

1‧‧‧Exposure head

6‧‧‧Conveying system

7‧‧‧Main Controller

8‧‧‧Camera

60‧‧‧Linear guide

61‧‧‧First Workbench

62‧‧‧Second workbench

71‧‧‧Memory Department

72‧‧‧Main sequence program

73‧‧‧Initial Sequence Program

74‧‧‧The sequence program has been rewritten

75‧‧‧Exposure pattern data

76‧‧‧Sequence creation program

77‧‧‧Sequence Rewriting Program

701‧‧‧Input

702‧‧‧Display

801‧‧‧Guide track

802‧‧‧Pedestal

803‧‧‧Camera Movement Mechanism

W‧‧‧Substrate

Claims (6)

An exposure device is characterized by comprising: an exposure head, which is provided with a spatial light modulator for spatially modulating light according to a predetermined sequence to form an exposure pattern in an irradiated area; Standby at the standby positions on both sides of the irradiation area of the light beam; the conveying system reciprocates the first stage on which the substrate is placed at the standby position on one side through the irradiation area, and reciprocates the standby position on the other side through the irradiation area. a second worktable on which the substrate is positioned; the controller controls the spatial light modulator in the exposure head; the camera is used for photographing the calibration marks of the substrate on each worktable before the substrate is exposed in the irradiation area; and the correction means, according to the photographic data from the camera to correct the sequence, and use the corrected sequence to control the spatial light modulator; the controller is to use the same exposure pattern formed on the substrate on the first stage with the When the substrate on the second stage is used, the substrate on the first stage is exposed during the return movement of the first stage using the sequence corrected in accordance with the photographic data of the substrate on the first stage, and the substrate moves on the forward path. Exposure is not performed at the time of exposure, and the substrate on the second table is exposed when the second table moves forward, and is not exposed when the second table moves back, using the sequence corrected according to the photographic data of the substrate on the second table. The exposure method controls the spatial light modulator; the camera takes pictures of the calibration marks of the substrate on the first stage. The position is the position on the other side of the irradiation area, and the position where the camera captures the alignment mark of the substrate on the second stage is also the position on the other side of the irradiation area. The exposure apparatus according to claim 1, wherein the camera is used for both imaging of alignment marks on the substrate on the first stage and imaging of alignment marks on the substrate on the second stage. The exposure apparatus according to claim 2, wherein the imaging position of the alignment mark of the substrate on the first stage, that is, the arrangement position of the first camera, and the imaging position of the alignment mark of the substrate on the second table That is, the second cameras are arranged in different positions; a camera moving mechanism for moving the aforementioned cameras is provided between the first camera arrangement position and the second camera arrangement position. The exposure apparatus according to claim 1, wherein the imaging position of the alignment mark of the substrate on the first stage, that is, the first camera arrangement position and the imaging position of the alignment mark of the substrate on the second table That is, the second camera is configured in different positions; the first camera configuration position and the second camera configuration position are configured with cameras respectively. The exposure device as described in any one of items 1 to 4 of the scope of the application, wherein, The correction means includes a sequence program that is initially prepared by exposure pattern data corresponding to the shape of the member formed on the substrate, ie, an initial sequence program, and a sequence rewriting program for rewriting according to the photographic data. An exposure method for exposing a substrate by using an exposure head that utilizes a spatial light modulator that spatially modulates light in accordance with a predetermined sequence to form an exposure pattern in an irradiated area, is characterized by: The step of placing the substrate on the first stage waiting at the standby position on one side of the irradiated area with light from the exposure head; The step of placing the substrate on the table; the first photographing step of photographing the alignment mark of the substrate placed on the first table with a camera; the first photographing step of photographing the alignment mark of the substrate placed on the second table with a camera The second photographing step: correcting the sequence by following the photographic data obtained in the first photographing step, and using the corrected sequence to control the spatial light modulator, while the substrate on the first stage passes through the irradiation area to make the first A first exposure step of exposing the substrate on the first stage by moving the worktable; and correcting the sequence by following the photographic data obtained in the second photographing step, and using the corrected sequence to control the spatial light modulator, A second exposure step of exposing the substrate on the second worktable while moving the second worktable in a way that the substrate on the second worktable passes through the irradiation area; When the same exposure pattern is formed on the substrate on the first stage and the substrate on the second stage, the moving direction of the first stage in the first exposure step and the moving direction of the second stage in the second exposure step It is the same direction; when the same exposure pattern is formed on the substrate on the first stage and the substrate on the second stage, the moving direction of the first stage and the moving direction of the second stage are different. The step of exposing the substrate; in the first photographing step, the position where the camera photographed the alignment mark of the substrate on the first worktable is the position on the other side of the irradiation area, and in the second photographing step, the camera photographed the second worktable The position where the alignment mark of the substrate on the stage is photographed is also the position on the other side of the irradiation area.

Images