TWI749021B - 電極、加速器柱以及包含上述的離子植入裝置 - Google Patents
電極、加速器柱以及包含上述的離子植入裝置 Download PDFInfo
- Publication number
- TWI749021B TWI749021B TW106121013A TW106121013A TWI749021B TW I749021 B TWI749021 B TW I749021B TW 106121013 A TW106121013 A TW 106121013A TW 106121013 A TW106121013 A TW 106121013A TW I749021 B TWI749021 B TW I749021B
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- electrode
- ion beam
- electrode assembly
- Prior art date
Links
- 238000005468 ion implantation Methods 0.000 title claims description 36
- 238000010884 ion-beam technique Methods 0.000 claims abstract description 94
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 71
- 150000002500 ions Chemical class 0.000 claims description 30
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- 239000010936 titanium Substances 0.000 description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 17
- 229910052719 titanium Inorganic materials 0.000 description 17
- 239000000758 substrate Substances 0.000 description 15
- 230000001133 acceleration Effects 0.000 description 10
- 230000005855 radiation Effects 0.000 description 8
- 238000011109 contamination Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000002441 reversible effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000001659 ion-beam spectroscopy Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 208000001491 myopia Diseases 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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- 239000013076 target substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H5/00—Direct voltage accelerators; Accelerators using single pulses
- H05H5/06—Multistage accelerators
- H05H5/063—Tandems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H7/00—Details of devices of the types covered by groups H05H9/00, H05H11/00, H05H13/00
- H05H7/06—Two-beam arrangements; Multi-beam arrangements storage rings; Electron rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/03—Mounting, supporting, spacing or insulating electrodes
- H01J2237/032—Mounting or supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/047—Changing particle velocity
- H01J2237/0473—Changing particle velocity accelerating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Particle Accelerators (AREA)
- Physical Vapour Deposition (AREA)
- Electron Sources, Ion Sources (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/228,158 | 2016-08-04 | ||
| US15/228,158 US9807864B1 (en) | 2016-08-04 | 2016-08-04 | Electrode, accelerator column and ion implantation apparatus including same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201816828A TW201816828A (zh) | 2018-05-01 |
| TWI749021B true TWI749021B (zh) | 2021-12-11 |
Family
ID=60142632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106121013A TWI749021B (zh) | 2016-08-04 | 2017-06-23 | 電極、加速器柱以及包含上述的離子植入裝置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9807864B1 (enExample) |
| JP (1) | JP7194100B2 (enExample) |
| KR (1) | KR102448490B1 (enExample) |
| CN (1) | CN109478487B (enExample) |
| TW (1) | TWI749021B (enExample) |
| WO (1) | WO2018026543A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019212766A1 (en) * | 2018-04-30 | 2019-11-07 | Neutron Therapeutics, Inc. | Compact motor-driven insulated electrostatic particle accelerator |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3328618A (en) * | 1965-09-13 | 1967-06-27 | High Voltage Engineering Corp | High-voltage acceleration tube with inserts for the electrodes |
| US5095208A (en) * | 1988-06-24 | 1992-03-10 | Hitachi, Ltd. | Charged particle generating device and focusing lens therefor |
| TW200503041A (en) * | 2003-06-10 | 2005-01-16 | Varian Semiconductor Equipment | Ion implanter having enhanced low energy ion beam transport |
| TW200605199A (en) * | 2004-07-31 | 2006-02-01 | Hynix Semiconductor Inc | Ion implantation apparatus and method for implanting ions by using the same |
| CN101296555A (zh) * | 2007-04-25 | 2008-10-29 | 和舰科技(苏州)有限公司 | 一种离子加速装置 |
| WO2015071439A1 (en) * | 2013-11-14 | 2015-05-21 | Mapper Lithography Ip B.V. | Multi-electrode stack arrangement |
| US20150357166A1 (en) * | 2011-11-30 | 2015-12-10 | Fei Company | Method for attachment of an electrode into an inductively-coupled plasma |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03102800A (ja) * | 1989-09-18 | 1991-04-30 | Shimadzu Corp | 高周波多重極線型加速器 |
| JPH04294043A (ja) * | 1991-03-22 | 1992-10-19 | Matsushita Electron Corp | イオン注入機のチャージアップ制御装置 |
| JPH088097A (ja) * | 1994-06-20 | 1996-01-12 | Nissin High Voltage Co Ltd | 静電型イオン加速装置 |
| JPH10270196A (ja) * | 1997-03-25 | 1998-10-09 | Nissin High Voltage Co Ltd | イオン加速器用加速管 |
| JP3858682B2 (ja) * | 2001-12-12 | 2006-12-20 | 信越半導体株式会社 | イオン注入装置の引出電極系およびイオン注入装置 |
| US20070221862A1 (en) * | 2006-03-22 | 2007-09-27 | Wayne State University | Coupled Electrostatic Ion and Electron Traps for Electron Capture Dissociation - Tandem Mass Spectrometry |
| GB0703044D0 (en) * | 2007-02-16 | 2007-03-28 | Nordiko Technical Services Ltd | Apparatus |
| US9281165B1 (en) * | 2014-08-26 | 2016-03-08 | Varian Semiconductor Equipment Associates, Inc. | Bias electrodes for tandem accelerator |
| CN205726638U (zh) * | 2016-06-07 | 2016-11-23 | 中国工程物理研究院核物理与化学研究所 | 一种强流四极透镜离子加速管 |
-
2016
- 2016-08-04 US US15/228,158 patent/US9807864B1/en active Active
-
2017
- 2017-06-23 TW TW106121013A patent/TWI749021B/zh active
- 2017-07-21 CN CN201780045501.3A patent/CN109478487B/zh active Active
- 2017-07-21 JP JP2019503740A patent/JP7194100B2/ja active Active
- 2017-07-21 KR KR1020197005409A patent/KR102448490B1/ko active Active
- 2017-07-21 WO PCT/US2017/043277 patent/WO2018026543A1/en not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3328618A (en) * | 1965-09-13 | 1967-06-27 | High Voltage Engineering Corp | High-voltage acceleration tube with inserts for the electrodes |
| US5095208A (en) * | 1988-06-24 | 1992-03-10 | Hitachi, Ltd. | Charged particle generating device and focusing lens therefor |
| TW200503041A (en) * | 2003-06-10 | 2005-01-16 | Varian Semiconductor Equipment | Ion implanter having enhanced low energy ion beam transport |
| TW200605199A (en) * | 2004-07-31 | 2006-02-01 | Hynix Semiconductor Inc | Ion implantation apparatus and method for implanting ions by using the same |
| CN101296555A (zh) * | 2007-04-25 | 2008-10-29 | 和舰科技(苏州)有限公司 | 一种离子加速装置 |
| US20150357166A1 (en) * | 2011-11-30 | 2015-12-10 | Fei Company | Method for attachment of an electrode into an inductively-coupled plasma |
| WO2015071439A1 (en) * | 2013-11-14 | 2015-05-21 | Mapper Lithography Ip B.V. | Multi-electrode stack arrangement |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7194100B2 (ja) | 2022-12-21 |
| JP2019523531A (ja) | 2019-08-22 |
| US9807864B1 (en) | 2017-10-31 |
| KR20190026938A (ko) | 2019-03-13 |
| CN109478487B (zh) | 2021-02-19 |
| TW201816828A (zh) | 2018-05-01 |
| WO2018026543A1 (en) | 2018-02-08 |
| KR102448490B1 (ko) | 2022-09-28 |
| CN109478487A (zh) | 2019-03-15 |
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