TWI748172B - A light converting resin composition - Google Patents

Abstract

The present invention includes a quantum dot, a scattering particle, a cadmium binder resin, a thermosetting agent, a thiol compound, and a solvent, wherein the thermosetting agent is selected from the group consisting of a polyfunctional alicyclic epoxy resin, a novolac epoxy resin, and a silane modified epoxy resin 1 or more, and the equivalent ratio of the thermosetting agent to the thiol compound is 0.1: 0.9 to 0.4: 0.6., which is related to a light converting resin composition excellent in luminance and long-term reliability, a light converting laminated substrate and an image display device using the same.

Description

Light conversion resin composition

The present invention relates to a light conversion resin composition, a light conversion laminated substrate, and an image display device using the light conversion laminated substrate.

In a liquid crystal display (LCD) TV that uses a light emitting element (Light Emitting Diode, LED) for a backlight unit (Back Light Unit, BLU), the LED backlight unit is the part that actually emits light, and in LCD TVs Is one of the most important parts.

As a method of forming a white LED backlight unit, usually red (Red, R), green (Green, G), and blue (Blue, B) LED chips are combined to form a white LED backlight unit, or blue The combination of a color LED chip and a yellow (Yellow, Y) phosphor with a wide half-value width of the emission wavelength presents a white color.

However, in the case of combining red, green, and blue LED chips, there is a problem of increased manufacturing costs due to the number of LED chips and complicated processing steps. In the case of combining yellow phosphors and blue LED chips, In the case of, the wavelengths of green and red cannot be distinguished, so the color purity is poor, and there is a problem of reduced color reproducibility caused by this.

In connection with this, Patent Document 1 provides an optical sheet comprising: a polymer resin layer with a plurality of non-cadmium-based quantum dots dispersed in a polymer resin and patterned on one or both sides; and formed on the polymer resin layer A first barrier film on one side; and a second barrier film formed on the other side of the polymer resin layer, the lower surface of the polymer resin layer is patterned by prisms or lenses, and the polymer resin When the lower surface of the layer is patterned by prisms, the pitch of the prism pattern is 20 to 70 microns, the apex angle is 95 to 120°, and the cross section of the pattern is triangular; the lower surface of the polymer resin layer is patterned with a lens In the case of chemical conversion, the pitch of the lens pattern is 20 to 70 microns, the ratio of the pitch to the height is 4:1 to 10:1, and the cross section of the pattern is semicircular.

Patent Document 2 provides a light-emitting composite including a quantum dot and an aminosiloxane-based ligand represented by the following chemical formula 1 arranged on the surface of the quantum dot.

However, the above-mentioned prior art has the following problems: it not only contains optical films with complex structures such as barrier layers and substrate layers in addition to the light-emitting layer containing quantum dots, but also causes a decrease in the light-emitting brightness of quantum dots. When the film is made at a very high temperature during the manufacturing process, quantum dot extinction occurs. In addition, the above-mentioned prior art is performed at a low processing temperature in order to be processed into the form of an optical film, which has a problem in terms of long-term reliability.

Prior art literature

Patent literature

Patent Document 1: Korean Patent Publication No. 10-1690624

Patent Document 2: Korean Patent Publication No. 10-1628065

The problem to be solved by the invention

The present invention is to solve the above-mentioned problems, and its purpose is to more effectively perform coating formation temperature on a laminated substrate at a temperature of 100 to 250°C by containing a specific thermal curing agent and a thiol compound. Processing, compared with the image display device using the optical sheet with the complicated structure of the prior art, provides a light conversion resin composition, a light conversion laminated substrate, and the use of the light conversion laminated substrate with excellent brightness and long-term reliability The image display device.

The way to solve the problem

The light conversion resin composition of the present invention for achieving the above-mentioned object is characterized by comprising quantum dots, a thermosetting agent, and a thiol compound, and the thermosetting agent is selected from the group consisting of polyfunctional alicyclic epoxy resins and novolac epoxy resins. , And one or more of the group consisting of epoxy resin modified by silane, the equivalent ratio of the thermosetting agent to the thiol compound is 0.1:0.9 to 0.4:0.6.

Invention effect

The light conversion resin composition of the present invention contains a specific thermosetting agent and a thiol compound in a specific equivalent ratio, so that it can be processed efficiently at a coating forming temperature of 100 to 250°C, has excellent brightness characteristics, and a high temperature. , Excellent long-term reliability under high humidity conditions.

The light conversion laminated substrate manufactured from the above-mentioned light conversion resin composition and the image display device using the light conversion laminated substrate have a simple structure and are excellent in reliability even at a low processing temperature.

Hereinafter, the present invention will be described in more detail.

In the present invention, when it is pointed out that a certain component is "on" another component, it not only includes the case where a certain component is in contact with another component, but also includes the case where there are other components between the two components.

In the present invention, when it is pointed out that a certain part "includes" a certain component, it means that, as long as there is no description to the contrary, other components can be further included instead of excluding other components.

＜Light conversion resin composition＞

The light conversion resin composition of the present invention is characterized by comprising quantum dots, a thermal curing agent, and a thiol compound, and the thermal curing agent includes selected from the group consisting of polyfunctional alicyclic epoxy resin, novolak epoxy resin, and silane-modified One or more of the group consisting of epoxy resin, the equivalent ratio of the thermosetting agent to the thiol compound is 0.1:0.9 to 0.4:0.6, which has excellent brightness characteristics and excellent long-term reliability under high temperature and high humidity conditions Effect.

Quantum dots

The light conversion resin composition of the present invention contains quantum dots.

The quantum dots contained in the light conversion resin composition of the present invention are nano-sized semiconductor materials. Atoms constitute molecules, and molecules constitute clusters of small molecular aggregates to form nanoparticles. When such nanoparticles have semiconductor characteristics, they are called quantum dots. The quantum dot has the following characteristics: when it receives energy from the outside and reaches an excited state, it will spontaneously release energy equivalent to the energy band gap. In short, the light conversion resin composition of the present invention includes the quantum dots so as to be capable of light conversion into green light and red light through the incident blue light source.

The aforementioned quantum dots are not particularly limited as long as they are quantum dots capable of emitting light through stimulation by light, and can be selected from group II-VI semiconductor compounds, group III-V semiconductor compounds, group IV-VI semiconductor compounds, and group IV One or more of elements or compounds containing group IV elements.

The group II-VI semiconductor compound may be one or more selected from the group consisting of a two-element compound, a three-element compound, and a four-element compound. The two-element compound is selected from CdS, CdSe, CdTe, ZnS, ZnSe, and ZnTe , ZnO, HgS, HgSe, HgTe, and mixtures thereof; the above-mentioned three-element compound is selected from the group consisting of CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS , CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, and mixtures thereof; the above-mentioned four-element compound is selected from the group consisting of CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgSTZnTe, and their mixtures 'S group.

The group III-V semiconductor compound may be one or more selected from the group consisting of a two-element compound, a three-element compound, and a four-element compound. The two-element compound is selected from GaN, GaP, GaAs, GaSb, AlN, AlP , AlAs, AlSb, InN, InP, InAs, InSb, and mixtures thereof; the above-mentioned three-element compound is selected from GaNP, GaNAS, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InNP , InNAs, InNSb, InPAs, InPSb, and mixtures thereof; the above four-element compound is selected from GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs , InAlPSb, GaAlNP, and their mixtures.

The above-mentioned group IV-VI semiconductor compound may be one or more selected from the group consisting of a two-element compound, a three-element compound, and a four-element compound. The above-mentioned two-element compound is selected from SnS, SnSe, SnTe, PbS, PbSe, PbTe , And mixtures thereof; the above-mentioned three-element compound is selected from the group consisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, and mixtures thereof; the above-mentioned four-element compound is selected Free from the group consisting of SnPbSSe, SnPbSeTe, SnPbSTe, and their mixtures.

The group IV element or the compound containing the group IV element may be one or more selected from the group consisting of a single element compound and a two element compound, but is not limited to this, the foregoing single element compound is selected from Si, Ge, and mixtures thereof The above-mentioned two-element compound is selected from the group consisting of SiC, SiGe and mixtures thereof.

The light conversion resin composition of one embodiment of the present invention has the following advantages: by including the non-cadmium-based quantum dots in the above-mentioned quantum dots, the problem of environmental pollution can be improved, and by including the non-cadmium-based quantum dots with InP Two or more kinds of quantum dots in the core can further improve the luminous efficiency.

The foregoing quantum dots may be a homogeneous single structure; a dual structure such as a core-shell structure and a gradient structure; or a mixed structure of the foregoing structures. For example, in the above-mentioned core-shell dual structure, the materials forming the core and the shell may be formed of the aforementioned semiconductor compounds that are different from each other. According to an embodiment of the present invention, the core may include one or more materials selected from lnP, ZnS, ZnSe, PbSe, AgInZnS, and ZnO, and the shell may include ZnSe, ZnS, ZnTe, PbS, TiO, SrSe, and One or more substances of HgSe, in this case, have the advantage of further improving the luminous efficiency.

For example, quantum dots with a core-shell structure include InP/ZnS, InP/GaP/ZnS, InP/GaP/ZnS, InP/ZnSe/ZnS, InP/ZnSeTe/ZnS, and InP/MnSe/ZnS.

The aforementioned quantum dots can be synthesized by wet chemical process (wet chemical process), metal organic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE), but it is not limited to these .

In order to transmit the incident blue light source and perform light conversion into green light and red light, the above-mentioned quantum dots may include two or more kinds of quantum dots whose emission center excitation wavelengths are different from each other. At this time, the difference between the central excitation wavelengths of two or more quantum dots can be more than 50 nanometers, so when the difference between the central excitation wavelengths is more than 50 nanometers, it has the advantage of easier light conversion to green and red light. .

（上述化學式1中， A₁ 係由下列化學式1-1表示， A₂ 為氫原子、巰基（

）、羧酸基（

）、二硫代乙酸基（

）、膦酸基（

）、胺基（

）、或碳原子數1至20的直鏈烷基， a為2至100的整數） [化學式1-1]

（上述化學式1-1中， A₃ 為一直接鍵或碳原子數1至10的伸烷基， A₄ 係由下列化學式1-2表示， ＊表示鍵結端） [化學式1-2]

（上述化學式1-2中， A₅ 為氧原子或硫原子， A₆ 為一直接鍵或碳原子數1至10的伸烷基， A₇ 係選自由巰基（

）、羧酸基（

）、二硫代乙酸基（

）、膦酸基（

）、及胺基(

）所組成的群組， b為0至1的整數，c為0至10的整數， ＊表示鍵結端）。According to an embodiment of the present invention, the above-mentioned quantum dots may be two or more non-cadmium-based quantum dots containing polyethylene glycol-based ligands, and the polyethylene glycol-based ligands may include the following chemical formula 1 compound of. [Chemical formula 1]

(In the above chemical formula 1, A ₁ is represented by the following chemical formula 1-1, and A ₂ is a hydrogen atom, a mercapto group (

), carboxylic acid group (

), dithioacetate (

), phosphonic acid group (

), amine group (

), or a straight-chain alkyl group having 1 to 20 carbon atoms, a is an integer from 2 to 100) [Chemical formula 1-1]

(In the above chemical formula 1-1, A ₃ is a direct bond or an alkylene group having 1 to 10 carbon atoms, and A ₄ is represented by the following chemical formula 1-2, * represents the bonding end) [Chemical formula 1-2]

(In the above chemical formula 1-2, A ₅ is an oxygen atom or a sulfur atom, A ₆ is a direct bond or an alkylene group having 1 to 10 carbon atoms, and A ₇ is selected from a mercapto group (

), carboxylic acid group (

), dithioacetate (

), phosphonic acid group (

), and amine group (

), b is an integer from 0 to 1, c is an integer from 0 to 10, and * represents the bonding end).

（上述化學式2中， A₂ 係選自由巰基（

）、羧酸基（

）、二硫代乙酸基（

）、膦酸基（

）、胺基（

）、碳原子數1至20的直鏈烷基、及碳原子數3至20的支鏈烷基所組成的群組， d為0至5的整數，e為0至1的整數，f為2至50的整數）。Specifically, the compound of the above Chemical Formula 1 may include the compound represented by the following Chemical Formula 2. [Chemical formula 2]

(In the above chemical formula 2, A ₂ is selected from mercapto groups (

), carboxylic acid group (

), dithioacetate (

), phosphonic acid group (

), amine group (

), a group consisting of a straight chain alkyl group having 1 to 20 carbon atoms, and a branched chain alkyl group having 3 to 20 carbon atoms, d is an integer from 0 to 5, e is an integer from 0 to 1, and f is An integer from 2 to 50).

In this way, when the polyethylene glycol-based ligand of the present invention contains the compound represented by the above-mentioned chemical formula 2, there is an advantage of further improving dispersibility and optical properties.

In the above chemical formula 1, the number of carbon atoms of each "alkyl group" is as shown in the above definition of linear or branched chain, and the content can be similarly applied to the "alkyl group" described below.

According to an embodiment of the present invention, the polyethylene glycol-based ligand may more specifically include: 2-(2-Methoxyethoxy) acetic acid, and light Company), 2-[2-(2-Methoxyethoxy)ethoxy] acetic acid (2-[2-(2-Methoxyethoxy)ethoxy] acetic acid, Wako Company), succinic acid mono-[2- (2-methoxy-ethoxy)-ethyl] ester (Succinic acid mono-[2-(2-methoxy-ethoxy)-ethyl] ester, malonic acid mono-[2-(2-methoxy -Ethoxy)-ethyl] ester (Malonic acid mono-[2-(2-methoxy-ethoxy)-ethyl] ester, glutaric acid mono-{2-[2-(2-ethoxy- Pentanedioic acid mono-{2-[2-(2-ethoxy-ethoxy)-ethoxy]-ethyl}ester, {2-[2-(2- Ethyl-hexyloxy)-ethoxy]-ethoxy}-acetic acid ({2-[2-(2-Ethyl-hexyloxy)-ethoxy]-ethoxy}-acetic acid), succinic acid mono-[2- (2-{2-[2-(2-{2-[2-(2-Ethoxy-ethoxy)-ethoxy]-ethoxy}-ethoxy)-ethoxy]- Succinic acid mono-[2-(2-{2-[2-(2-{2-[2-(2-ethoxy-ethoxy)-ethoxy] -ethoxy}-ethoxy)-ethoxy]-ethoxy}-ethoxy)-ethyl] ester), succinic acid mono-[2-(2-{2-[2-(2-}2-[2-(2-} 2-[2-(2-Methoxy-ethoxy)-ethoxy]-ethoxy}-ethoxy)-ethoxy]-ethoxy}-ethoxy)-ethoxy ]-Ethoxy}-ethoxy)-ethyl] ester (Succinic acid mono-[2-(2-{2-[2-(2-{2-[2-(2-{2-[2 -(2-methoxy-ethoxy)-ethoxy]-ethoxy｝-ethoxy)-ethoxy]-ethoxy｝-ethoxy)-ethoxy]-ethoxy｝-ethoxy)-ethyl] ester), malonic acid mono-[2-( 2-{2-[2-(2-{2-[2-(2-isobutoxy-ethoxy)-ethoxy]-ethoxy}-ethoxy)-ethoxy] -Ethoxy}-ethoxy)-ethyl] ester (Malonic acid mono-[2-(2-{2-[2-(2-{2-[2-(2-isobutoxy-ethoxy)-ethoxy ]-ethoxy}-ethoxy)-ethoxy]-ethoxy}-ethoxy)-ethyl] ester), adipic acid mono-[2-(2-{2-[2-(2-methoxy-ethoxy) -Ethoxy]-ethoxy}-ethoxy)-ethyl] ester (Hexanedioic acid mono-[2-(2-{2-[2-(2-methoxy-ethoxy)-ethoxy]-ethoxy} -ethoxy)-ethyl] ester), 2-oxo-adipate 6-(2-{2-[2-(2-ethoxy-ethoxy)-ethoxy]-ethoxy}- Ethyl) ester (2-Oxo-hexanedioic acid6-(2-{2-[2-(2-ethoxy-ethoxy)-ethoxy]-ethoxy}-ethyl) ester), succinic acid mono-[2-(2- {2-[2-(2-{2-[2-(2-{2-[2-(2-{2-[2-(2-{2-[2-(2-methoxy-ethyl (Oxy)-ethoxy]-ethoxy}-ethoxy)-ethoxy]-ethoxy}-ethoxy)-ethoxy]-ethoxy}-ethoxy)-ethyl Oxy]-ethoxy}-ethoxy)-ethoxy]-ethoxy}-ethoxy)-ethyl] ester (Succinic acid mono-[2-(2-{2-[2- (2-{2-[2-(2-{2-[2-(2-{2-[2-(2-{2-[2-(2-methoxy-ethoxy)-ethoxy]-ethoxy}- ethoxy)-ethoxy]-ethoxy｝-ethoxy)-ethoxy]-ethoxy｝-ethoxy)-ethoxy]-ethoxy｝-ethoxy)-ethoxy]-ethoxy｝-ethoxy)-ethyl] ester), O- (amber 醯) -O'-methylpolyethylene glycol 2'000 (O-(Succinyl)-O'-methylpolyethylene glycol 2'000, Aldrich), (2-butoxy-ethoxy)-acetic acid (( 2-Butoxy-ethoxy)-acetic acid, Wako Corporation), {2-[2-(carboxymethoxy)ethoxy]ethoxy]ethoxy}acetic acid ({2-[2-(carboxymethoxy)ethoxy]ethoxy}acetic acid, Wako Company), 2-[2-(benzyloxy)ethoxy]acetic acid (2-[2 -(Benzyloxy)ethoxy] acetic acid), (2-Carboxymethoxy-ethoxy)-acetic acid ((2-Carboxymethoxy-ethoxy)-acetic acid, Wako), (2-Butoxy-ethoxy) )-Acetic acid ((2-Butoxy-ethoxy)-acetic acid, Wako), but not limited to this.

As described above, the quantum dots of the present invention further contain polyethylene glycol-based ligands, thereby having the following effects: even if solvents such as propylene glycol monomethyl ether acetate used in the mass production line of filters are used The use of volatile solvents such as toluene, hexane, and chloroform can also make the dispersion characteristics of quantum dots good.

Relative to 100 parts by weight of the solid content of the light conversion resin composition, the content of the aforementioned quantum dots may be 1 to 60 parts by weight, preferably 2 to 50 parts by weight, and more preferably 2 to 20 parts by weight. When the content of the aforementioned quantum dots is within the aforementioned range, it has the advantages of excellent luminous efficiency and excellent reliability of the coating. When the content of the non-cadmium-based quantum dots is less than the above range, the light conversion efficiency of green light and red light is insufficient, and when the content is greater than the above range, the emission of blue light may be relatively decreased, and the color reproducibility may be deteriorated. The problem.

Scattering particles

The light conversion resin composition of one embodiment of the present invention may further include scattering particles.

The above-mentioned scattering particles may use common inorganic materials, and preferably may include metal oxides with an average particle size of 50 to 1000 nanometers.

The metals in the above metal oxides can be selected from Li, Be, B, Na, Mg, Al, Si, K, Ca, Sc, V, Cr, Mn, Fe, Ni, Cu, Zn, Ga, Ge, Rb, Sr, Y, Mo, Cs, Ba, La, Hf, W, Tl, Pb, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Ti, Sb, A group consisting of Sn, Zr, Nb, Ce, Ta, In, and combinations thereof, but not limited thereto.

According to an embodiment of the present invention, the aforementioned scattering particles may comprise selected from Al ₂ O ₃ , SiO ₂ , ZnO, ZrO ₂ , BaTiO ₃ , TiO ₂ , Ta ₂ O ₅ , Ti ₃ O ₅ , ITO, IZO, ATO , ZnO-Al, Nb ₂ O ₃ , SnO, MgO, and a combination thereof. In this case, it has the advantage of further improving light efficiency. If necessary, a material that has been surface-treated with a compound having an unsaturated bond such as acrylate can also be used.

In addition, when the light conversion resin composition of the present invention includes scattering particles, the scattering particles can increase the path of light emitted from the quantum dots and can improve the overall light efficiency of the light conversion coating, which is preferable.

The aforementioned scattering particles may have an average particle diameter of 50 to 1000 nm, and preferably, scattering particles in the range of 100 to 500 nm may be used. At this time, if the particle size is too small, the light emitted from the quantum dots cannot be expected to have a sufficient scattering effect. On the contrary, if the particle size is too large, it will precipitate in the composition or the uniform quality of self-luminescence cannot be obtained. The surface of the layer, therefore, needs to be appropriately adjusted for use within the above range.

The content of the scattering particles may be 0.5 to 20 parts by weight, preferably 1 to 15 parts by weight, and more preferably 1 to 10 parts by weight, relative to 100 parts by weight of the total solid content of the light conversion resin composition.

In the case where the content of the aforementioned scattering particles is within the aforementioned range, the effect of increasing the luminous intensity can be maximized, which is preferable. When the content of the scattering particles is less than the above range, it may be difficult to ensure the desired luminous intensity. When the content is greater than the above range, the transmittance of blue irradiated light is significantly reduced, which may cause problems in terms of color reproducibility. Therefore, it is preferable to use it appropriately within the above-mentioned range.

Thiol compound

The light conversion resin composition of the present invention contains a thiol compound.

The above-mentioned thiol compound can prevent oxidation and discoloration of quantum dots during high-temperature processing, increase the degree of curing within the coating film, and can be expected to have the effect of preventing a decrease in light efficiency when evaluating the resistance to blue light for a long time.

上述化學式3中， Rs為氫或C1至C12的烷基，Rp為C1至C12的伸烷基，Rq含或不含碳原子以外之原子的n價脂肪族烴基，t為2至4的整數。According to an embodiment of the present invention, the above-mentioned thiol compound includes the compound represented by the following chemical formula 3, thereby further improving the effect of preventing the decrease in light efficiency. [Chemical formula 3]

In the above chemical formula 3, Rs is hydrogen or a C1 to C12 alkyl group, Rp is a C1 to C12 alkylene group, Rq is an n-valent aliphatic hydrocarbon group with or without atoms other than carbon atoms, and t is an integer from 2 to 4 .

In the present invention, the above-mentioned alkyl group may be linear or branched, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tertiary butyl, secondary butyl, 1- Methyl-butyl, 1-ethyl-butyl, n-pentyl, isopentyl, neopentyl, tertiary pentyl, n-hexyl, 1-methylpentyl, 2-methylpentyl, 4- Methyl-2-pentyl, 3,3-dimethylbutyl, 2-ethylbutyl, n-heptyl, 1-methylhexyl, n-octyl, tertiary octyl, 1-methylheptyl , 2-ethylhexyl, 2-propylpentyl, n-nonyl, 2,2-dimethylheptyl, 1-ethyl-propyl, 1,1-dimethyl-propyl, isohexyl, 2-methylpentyl, 4-methylhexyl, 5-methylhexyl, etc., but not limited thereto.

The above-mentioned alkylene groups are divalent substituents of alkyl groups, such as methylene, ethylene, propylene, butylene, pentylene, hexylene, xylylene, octylene, nonylene, Decenyl, undecyl, dodecyl, tridecyl, tetradecyl, hexadecyl, heptadecyl, or nonadecyl, etc., but not Limited to this.

[化學式5]

[化學式6]

[化學式7]

[化學式8]

[化學式9]

[化學式10]

[化學式11]

In addition, according to an embodiment of the present invention, the above-mentioned thiol compound may include one or more of the compounds represented by the following Chemical Formula 4 to Chemical Formula 11. [Chemical formula 4]

[Chemical formula 5]

[Chemical formula 6]

[Chemical formula 7]

[Chemical formula 8]

[Chemical formula 9]

[Chemical formula 10]

[Chemical formula 11]

By including the above-mentioned thiol compound, the resistance to blue light after thermal curing becomes excellent.

According to an embodiment of the present invention, relative to 100% by weight of the solid content of the light conversion resin composition, the content of the thiol compound may be 0.01 to 50% by weight, preferably 0.1 to 40% by weight, more preferably It can be 0.1 to 30% by weight. When the content of the thiol compound satisfies the above range, the resistance to blue light after thermal curing can be improved. On the other hand, when the content of the above-mentioned thiol compound is not in the above-mentioned range, there is a problem that the resistance to blue light after thermal curing may decrease.

According to an embodiment of the present invention, the weight ratio of the following antioxidants to the thiol compound may be 1:4 to 1:19, preferably 1:4 to 1:15, more preferably 1:4 to 1:10. In the case where the light conversion resin composition of the present invention contains the antioxidant and the thiol compound in the above ratio, it has the following advantages: during the period after the PoB step in the manufacturing process until the inorganic layer for protecting the quantum dots is deposited, By suppressing the phenomenon that the quantum dots in the atmosphere react with oxygen in the atmosphere to cause light extinction, the light maintenance rate or light resistance can be improved. If it is not in the above range, since the quantum dots are extinct with the storage time, the light maintenance rate or light resistance may decrease.

Thermal curing agent

The light conversion resin composition of the present invention contains a thermosetting agent.

The above-mentioned thermal curing agent can prevent yellowing during high-temperature treatment, and therefore has the effect of preventing the luminous efficiency of the quantum dot phosphor from decreasing.

The thermal curing agent includes one or more selected from the group consisting of polyfunctional alicyclic epoxy resin, novolac epoxy resin, and silane-modified epoxy resin, for example, it may include the following chemical formulas 12 to 16 One or more of the compounds.

上述化學式12中， R為C1至C10的烷基， r、s及p各自獨立為1至20的整數。 [化學式13]

The above-mentioned polyfunctional alicyclic epoxy resin may include a compound represented by the following Chemical Formula 12 or 13. [Chemical formula 12]

In the above chemical formula 12, R is a C1 to C10 alkyl group, and r, s, and p are each independently an integer of 1-20. [Chemical formula 13]

In the present invention, with regard to the above-mentioned alkyl group, in addition to the number of carbon atoms of 1 to 10, the above-mentioned content related to the alkyl group can be applied.

As commercially available products of the above-mentioned polyfunctional alicyclic epoxy resin, "CEL-2021" of Daicel Chemical Industry Co., Ltd., alicyclic solid epoxy resin "EHPE-3150", and epoxidized polybutadiene can be used. "PB3600", flexible alicyclic epoxy compound "CEL-2081", lactone modified epoxy resin "PCL-G", etc. In addition, the "Celloxide 2000", "Epolead GT-3000", and "GT-4000" of Daicel Chemical Industry Co., Ltd. can also be used, but it is not limited to this.

By using the above-mentioned multifunctional cycloaliphatic epoxy resin, yellowing will not occur during high-temperature processing, so it has the advantage that the luminous efficiency and light maintenance rate of the quantum dot phosphor will not decrease.

上述化學式14中，v為1至20的整數。The aforementioned novolak epoxy resin may include a compound represented by the following Chemical Formula 14. [Chemical formula 14]

In the above chemical formula 14, v is an integer from 1 to 20.

As a commercially available product of the novolak epoxy resin, Sumiepoxy ESCN 195XL (manufactured by Sumitomo Chemical Industry Co., Ltd.) or the like can be used, but it is not limited to this.

By using the above novolac epoxy resin, yellowing will not occur during high-temperature processing, so it has the advantage that the luminous efficiency and light maintenance rate of the quantum dot phosphor will not decrease.

The silane-modified epoxy resin can be produced by dealcoholization condensation reaction of hydroxyl-containing epoxy resin and alkoxysilane.

上述化學式15中，x為1至34的整數。The above-mentioned hydroxyl-containing epoxy resin may include a compound represented by the following Chemical Formula 15. [Chemical formula 15]

In the above chemical formula 15, x is an integer from 1 to 34.

The above-mentioned alkoxysilane may include a compound represented by the following Chemical Formula 16. [Chemical formula 16] (R ₁₅ ) _y Si(OR ₁₆ ) _{4-y In the} above chemical formula 16, y is an integer of 0 or 1, and R ₁₅ is C1 to C6 alkyl, C6 to C12 aryl, or C2 to C6 For saturated aliphatic residues, the above-mentioned groups may have a functional group directly connected to its carbon atom, R ₁₆ is a hydrogen atom or a C1 to C6 alkyl group, and a plurality of R ₁₆ are the same or different from each other.

Regarding the above-mentioned alkyl group, in addition to the number of carbon atoms of 1 to 6, the content related to the above-mentioned alkyl group can be applied.

The above-mentioned aryl group may be a monocyclic aryl group or a polycyclic aryl group. As said monocyclic aryl group, a phenyl group, a biphenyl group, a terphenyl group, a stilbene group etc. are mentioned, but it is not limited to these. As the above-mentioned polycyclic aryl group, naphthyl, anthryl, phenanthryl, pyrenyl, perylene, eryl, fluorenyl, etc. may be mentioned, but it is not limited thereto.

The above-mentioned unsaturated aliphatic residue may include, but is not limited to, methacryloyl group, acryloyl group, and the like.

As commercial products of the above-mentioned silane-modified epoxy resin, Compoceran E-101, E-102, E-201, E-202, E-211, E-212 (trade names manufactured by Arakawa Chemical Industry Co., Ltd.) can be used. Etc., but not limited to this.

In the case of using the above-mentioned silane-modified epoxy resin, yellowing will not occur during high-temperature processing, so it has the advantage that the luminous efficiency and light maintenance rate of the quantum dot phosphor will not decrease.

The content of the thermal curing agent may be 0.1 to 50% by weight, preferably 1 to 48% by weight, and more preferably 1 to 45% by weight, relative to 100% by weight of the solid content of the light conversion resin composition. When the thermal curing agent satisfies the above range, yellowing will not occur during the high temperature treatment process, and therefore, the light maintenance rate of the luminous efficiency of the quantum dot phosphor will not decrease. On the other hand, in the case where the content of the above-mentioned thermal curing agent is not in the above-mentioned range, the possibility of yellowing during high-temperature treatment may increase.

In the present invention, the equivalent ratio of the thermal curing agent to the thiol compound is 0.1:0.9 to 0.4:0.6. When the equivalent ratio of the thermosetting agent to the thiol compound is within the above range, even after high temperature treatment, it will not be hindered by oxygen, and can react quickly to form a high crosslinking density to protect the polyfunctional thiol compound The density of the core-shell of the quantum dots is increased, which can prevent the quantum dots from extinction. On the other hand, when it is not in the above range, there is a problem of yellowing and quantum dot extinction due to the increase in the content of the thermosetting agent during the high-temperature treatment.

Alkali-soluble resin

Carddol ( Cardo ) Adhesive resin

The light conversion resin composition of the present invention may include an alkali-soluble resin, and the alkali-soluble resin may include a carbodole-based binder resin, in addition to one or more selected from an acrylic binder resin and an epoxy binder resin.

The above-mentioned carbodole-based binder resin is reactive by the action of light and heat, and functions as a dispersion medium of quantum dots. The carbodole-based binder resin contained in the light conversion resin composition of the present invention is not limited as long as it can be used as a binder resin for quantum dots and can be used as a support for the light conversion coating.

[化學式18]

[化學式19]

[化學式20]

上述化學式17至20中， X及X’各自獨立為單鍵、-CO-、-SO₂ -、-C(CF₃ )₂ -、-Si(CH₃ )₂ -、-CH₂ -、-C(CH₃ )₂ -、-O-、

、

、

、

、

、

、

、

、

、

、

、

、或

， Y為酸酐殘基， Z為酸二酐殘基， R’為氫原子、乙基、苯基、-C₂ H₄ Cl、-C₂ H₄ OH或-CH₂ CH＝CH₂ ， R1、R1’、R2、R2’、R3、R3’、R4、R4’、R5、R5’、R6及R6’各自獨立為氫原子或甲基， R7、R7’、R8及R8’各自獨立為碳原子數1至6的直鏈伸烷基或碳原子數3至6的支鏈伸烷基，上述伸烷基可被酯鍵、碳原子數6至14的環伸烷基、及碳原子數6至14的伸芳基中的至少一種中斷， R9、R9’、R10、R10’、R11、R11’、R12及R12’各自獨立為氫原子、鹵素原子、或碳原子數1至6的直鏈烷基、或碳原子數3至6的支鏈烷基， m及n各自為滿足0≤m≤30、0≤n≤30的整數， 其中，m及n不同時為0。 [化學式21]

[化學式22]

上述化學式21及22中， P各自獨立為

、

、

、

、或

， R13及R14各自獨立為氫、羥基、硫醇基、胺基、硝基、或鹵素原子， Ar1各自獨立為C6至C15的芳基， Y’為酸酐殘基， Z’為酸二酐殘基， A’為O、S、N、Si或Se， a及b各自獨立為1至6的整數， p及q各自獨立為0至30的整數， 其中，p及q不同時為0。The above-mentioned carbodole-based adhesive resin may include at least one repeating unit of the following Chemical Formulas 17 to 22. [Chemical formula 17]

[Chemical formula 18]

[Chemical formula 19]

[Chemical formula 20]

In the above chemical formulae 17 to 20, X and X'are each independently a single bond, -CO-, -SO ₂ -, -C(CF ₃ ) ₂ -, -Si(CH ₃ ) ₂ -, -CH ₂ -,- C(CH ₃ ) ₂ -, -O-,

,

,

,

,

,

,

,

,

,

,

,

,or

, Y is an acid anhydride residue, Z is an acid dianhydride residue, R'is a hydrogen atom, ethyl, phenyl, -C ₂ H ₄ Cl, -C ₂ H ₄ OH or -CH ₂ CH=CH ₂ , R1 , R1', R2, R2', R3, R3', R4, R4', R5, R5', R6 and R6' are each independently a hydrogen atom or a methyl group, and R7, R7', R8 and R8' are each independently a carbon A straight-chain alkylene having 1 to 6 atoms or a branched alkylene having 3 to 6 carbon atoms, the above-mentioned alkylene may be ester-bonded, a cyclic alkylene having 6 to 14 carbon atoms, and the number of carbon atoms At least one of the aryl groups from 6 to 14 is interrupted, and R9, R9', R10, R10', R11, R11', R12, and R12' are each independently a hydrogen atom, a halogen atom, or a straight line having 1 to 6 carbon atoms. For a chain alkyl group or a branched chain alkyl group having 3 to 6 carbon atoms, m and n are each an integer satisfying 0≤m≤30 and 0≤n≤30, wherein m and n are not 0 at the same time. [Chemical formula 21]

[Chemical formula 22]

In the above chemical formulae 21 and 22, P is each independently

,

,

,

,or

, R13 and R14 are each independently hydrogen, hydroxyl, thiol, amine, nitro, or halogen atom, Ar1 is each independently a C6 to C15 aryl group, Y'is an acid anhydride residue, Z'is an acid dianhydride residue The base, A'is O, S, N, Si or Se, a and b are each independently an integer from 1 to 6, and p and q are each independently an integer from 0 to 30, wherein p and q are not 0 at the same time.

In the case where the light conversion resin composition of the present invention contains at least one of the above-mentioned repeating units of the chemical formula 17 to the chemical formula 22, the reliability between the process steps can be excellent. Not only that, but it can also quickly adjust the development speed, so it is possible to suppress the generation of pattern residues, minimize the generation of outgassing, and prevent image retention during panel operation. In addition, it has the following advantages: due to excellent thermal fluidity, it can improve the straightness of the pattern, and no reverse slope will occur, so it is beneficial to improve the poor display, and it can provide high-quality image quality due to the excellent anti-reflection effect. Heat resistance, chemical resistance, durability and reliability.

Y in the above-mentioned chemical formulae 17 and 19 is the residue of an acid anhydride, which can be obtained by reacting a bisphenol epoxy acrylate compound, which is a synthetic intermediate of the carbodole-based binder resin of the present invention, with an acid anhydride compound. The acid anhydride compound into which residue Y can be introduced is not particularly limited. Examples include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl Extending methyl tetrahydrophthalic anhydride, chloro bridged acid anhydride, methyl tetrahydrophthalic anhydride, etc.

Z in the above chemical formulae 18 and 20 is the residue of an acid dianhydride, which can be obtained by reacting a bisphenol epoxy acrylate compound, which is a synthetic intermediate of the carbodole-based binder resin of the present invention, with an acid dianhydride compound. The acid dianhydride compound into which residue Z can be introduced is not particularly limited, and examples include pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, and diphenyl ether tetracarboxylic dianhydride, and other aromatic polynomials. Carboxylic anhydride.

The above-mentioned "acid dianhydride" means a compound containing two acid anhydride groups in the molecule.

In the present invention, there is no particular limitation on the method for producing the above-mentioned carbodole-based binder resin. For example, a bisphenol epoxy compound can be reacted with an epoxy compound to synthesize a bisphenol epoxy compound, and the synthesized bisphenol epoxy compound can be reacted with an acrylate compound to synthesize a bisphenol epoxy acrylate compound, and then the bisphenol epoxy compound can be synthesized. The oxyacrylate compound is produced by reacting with acid anhydride, acid dianhydride, or a mixture thereof, but is not limited thereto.

In the case of containing the carbodole-based binder resin in this way, the content of the carbodole-based binder resin may be 1 to 50 parts by weight, preferably 5 to 40 parts by weight, relative to 100 parts by weight of the entire light conversion resin composition. Parts, more preferably 5 to 30 parts by weight. When the content of the above-mentioned carbodole-based binder resin is within the above-mentioned range, it has the following advantages: due to the sufficient solubility in the developer, the non-pixel portion is less likely to produce development residue on the substrate, and the pixel portion of the exposed portion is less likely to be generated during development. Since the film of the film is reduced, the peeling property of the non-pixel portion tends to be good, which is better.

The above-mentioned acrylic adhesive resin can be directly polymerized or purchased and used in the following manner: it has an acid value of 20 to 200 (mg KOH/gram), a weight average molecular weight of 3,000 to 200,000, preferably 5,000 to 100,000, and a molecular weight dispersion. It has a range of 1.5 to 6.0, preferably 1.8 to 4.0. The acrylic resin system having the molecular weight and molecular weight dispersion in the above-mentioned range has the advantages of being able to increase the hardness and exhibiting a high film retention rate.

In addition, the aforementioned acrylic binder resin can be produced by copolymerizing a monomer having a carboxyl group and an unsaturated bond, and a monomer having an unsaturated bond copolymerizable with the monomer.

Specific examples of the monomer having a carboxyl group and an unsaturated bond include monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid; dicarboxylic acids such as fumaric acid, mesaconic acid, and itaconic acid; and these Carboxylic acid of dicarboxylic acid; Mono(meth)acrylates of polymers having a carboxyl group and a hydroxyl group at both ends, such as carboxyl polycaprolactone mono(meth)acrylate.

More specifically, it may be acrylic acid, methacrylic acid, itaconic acid, maleic acid, maleic anhydride, fumaric acid, or maleic acid alkyl ester, etc. In this case, for the above-mentioned maleic acid alkyl ester, Examples include monomethyl maleate, ethyl maleate, n-propyl maleate, isopropyl maleate, n-butyl maleate, n-hexyl maleate, n-octyl maleate, maleate 2-ethylhexyl acid, n-nonyl maleate or n-dodecyl maleate, etc.

The monomer having a carboxyl group and an unsaturated bond and a monomer copolymerizable with the monomer can be used alone or in combination of two or more.

The above-mentioned copolymerizable monomers may be selected from aromatic vinyl compounds, unsaturated carboxylic acid ester compounds, unsaturated carboxylic acid amino alkyl ester compounds, unsaturated carboxylic acid glycidyl ester compounds, carboxylic acid vinyl ester compounds, Unsaturated ether compounds, vinyl cyanide compounds, unsaturated imines compounds, aliphatic conjugated diene compounds, macromonomers having a monoacrylic acid group or a monomethacrylic acid group at the end of the molecular chain, One of the group consisting of bulk monomers and their combinations.

Specifically, the above-mentioned copolymerizable monomers include styrene, vinyl toluene, methylstyrene, p-chlorostyrene, o-methoxystyrene, m-methoxystyrene, and p-methoxystyrene. , O-vinyl benzyl methyl ether, m-vinyl benzyl methyl ether, p-vinyl benzyl methyl ether, o-vinyl benzyl glycidyl ether, m-vinyl benzyl glycidyl ether, or p-vinyl Aromatic vinyl compounds such as benzyl glycidyl ether; methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, (meth) Alkyl (meth)acrylates such as n-butyl acrylate, isobutyl (meth)acrylate, secondary butyl (meth)acrylate, or tertiary butyl (meth)acrylate; (meth)acrylic acid Cyclopentyl ester, cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, tricyclo[5.2.1.0 ^2,6 ]decane-8-diyl (meth)acrylate, Alicyclic (meth)acrylates such as 2-dicyclopentyloxyethyl (meth)acrylate or isobornyl (meth)acrylate; phenyl (meth)acrylate or benzyl (meth)acrylate (Meth) aryl acrylates such as esters; 2-hydroxyethyl (meth) acrylate or 2-hydroxypropyl (meth) acrylate, etc. (meth) hydroxyalkyl acrylates; N-cyclohexyl maleate N-benzylmaleimide, N-phenylmaleimide, N-o-hydroxyphenylmaleimide, N-m-hydroxyphenylmaleimide, N- P-Hydroxyphenylmaleimide, N-o-methylphenylmaleimide, N-m-methylphenylmaleimide, N-p-methylphenylmaleimide, N -N-substituted maleimines such as o-methoxyphenyl maleimines, N-m-methoxyphenyl maleimines, N-p-methoxyphenyl maleimines Compounds; (meth)acrylamide, N,N'-dimethyl (meth)acrylamide and other unsaturated amide compounds; 3-(methacryloxymethyl)oxetane, 3-(methacryloxymethyl)-3-ethyloxetane, 3-(methacryloxymethyl)-2-trifluoromethyloxetane, 3- (Methacryloxymethyl)-2-phenyloxetane, 2-(methacryloxymethyl)oxetane, or 2-(methacryloxymethyl) Group) Unsaturated oxetane compounds such as -4-trifluoromethyl oxetane, etc.

[化學式24]

（上述化學式23及化學式24中， Ra各自為氫原子或可被羥基取代的C1至C7的烷基，A各自為單鍵或可包含雜原子的二價烴基）。The above-mentioned epoxy binder resin is a copolymer containing a monomer unit containing an alkali-soluble group and a monomer unit corresponding to a polymerizable unsaturated compound containing a curable group. The unsaturated compound may be one or more selected from the group consisting of 3,4-epoxytricyclic [5.2.1.0 ^2,6 ] decane ring-containing compounds represented by the following chemical formula 23 or 24. [Chemical formula 23]

[Chemical formula 24]

(In the above Chemical Formula 23 and Chemical Formula 24, each Ra is a hydrogen atom or a C1 to C7 alkyl group which may be substituted by a hydroxyl group, and each A is a single bond or a divalent hydrocarbon group which may contain a hetero atom).

Regarding Ra, as an alkyl group having 1 to 7 carbon atoms which may be substituted by a hydroxyl group, for example, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, secondary butyl, and pentyl are mentioned. , Hexyl, heptyl and other alkyl groups; hydroxymethyl, 1-hydroxyethyl, 2-hydroxyethyl, 1-hydroxypropyl, 2-hydroxypropyl, 3-hydroxypropyl, 1-hydroxy-1-methyl Hydroxyalkyl groups such as hydroxyethyl, 2-hydroxy-1-methylethyl, 1-hydroxybutyl, 2-hydroxybutyl, 3-hydroxybutyl, 4-hydroxybutyl, etc. As Ra, a hydrogen atom or an alkyl group having 1 to 2 carbon atoms which may be substituted by a hydroxyl group is preferred, and a hydrogen atom or a methyl group is particularly preferred.

Regarding A, in a divalent hydrocarbon group that may contain a hetero atom, the hetero atom may be bonded to the end of the hydrocarbon group or may be between the carbon atoms constituting the hydrocarbon group. Examples of heteroatoms include nitrogen, oxygen, and sulfur atoms.

Other representative examples of A include alkylene groups such as methylidene, ethylidene, propylidene, and trimethylene (e.g., alkylene groups having 1 to 12 carbon atoms, especially alkylene groups having 1 to 12 carbon atoms). To 6 alkylene groups); sulfidene groups such as sulfidene groups, sulfidene groups, and sulfidene groups (for example, sulfidene groups with 1 to 12 carbon atoms, especially those with 1 to 6 carbon atoms) Aminoalkylenes, such as aminoalkylenes, aminoethylenes, and aminoalkylenes (for example, aminoalkylenes having 1 to 12 carbon atoms, especially aminoalkylenes having 1 to 6 carbon atoms); Alkyl) and so on.

In the present invention, with regard to the "alkylene group", the same content as the alkyl group can be applied except that it is divalent.

As a representative example of the polymerizable unsaturated compound ^{containing 3,4-epoxytricyclo[5.2.1.0 2,6} ] decane ring represented by Chemical Formula 23 and Chemical Formula 24, epoxidized dicyclopentenyl ( Meth)acrylate, [3,4-epoxytricyclo[5.2.1.0 ^2,6 ]decane-9-yl (meth)acrylate; 3,4-epoxytricyclo[5.2.1.0 ^{2, 6} ]Decane-8-yl (meth)acrylate], epoxidized dicyclopentenoxyethyl (meth)acrylate, [2-(3,4-epoxy tricyclo[5.2.1.0 ^{2 ,6} ]decane-9-yloxy)ethyl (meth)acrylate; 2-(3,4-epoxytricyclo[5.2.1.0 ^2,6 ]decane-8-yloxy)ethyl( Meth)acrylate], epoxidized dicyclopentenoxybutyl (meth)acrylate, epoxidized dicyclopentenoxyhexyl (meth)acrylate, etc. Among them, epoxidized dicyclopentenyl (meth)acrylate and epoxidized dicyclopentenyloxyethyl (meth)acrylate are particularly preferred.

The compound represented by Chemical Formula 23 and the compound represented by Chemical Formula 24 may be used independently of each other. In addition, they can be mixed and used in any ratio. In the case of mixing the two, the ratio of chemical formula 23:chemical formula 24 is preferably 5:95 to 95:5, more preferably 10:90 to 90:10, and more preferably 20:80 to 80:20.

上述化學式25中， R17為氫原子或碳原子數1至7的烷基， R18為碳原子數1至12的一級或二級烷基、碳原子數2至12的烯基、碳原子數6至10的芳基、碳原子數7至20的芳烷基、或-(R19-O)m-R20基，此時，R19為碳原子數1至12的二價烴基，R20為氫原子或碳原子數1至12的烴基，m為1以上的整數。In addition, the above-mentioned epoxy adhesive resin may further comprise selected from the group consisting of styrene which may be substituted with C1 to C6 alkyl groups, unsaturated carboxylic acid esters represented by the following chemical formula 25, and N-substituted maleimines One or more monomer units of a polymerizable unsaturated compound that does not contain a curable group in the group. [Chemical formula 25]

In the above chemical formula 25, R17 is a hydrogen atom or an alkyl group having 1 to 7 carbon atoms, R18 is a primary or secondary alkyl group having 1 to 12 carbon atoms, an alkenyl group having 2 to 12 carbon atoms, and 6 carbon atoms. An aryl group having to 10, an aralkyl group having 7 to 20 carbon atoms, or a -(R19-O)m-R20 group, in this case, R19 is a divalent hydrocarbon group having 1 to 12 carbon atoms, and R20 is a hydrogen atom or A hydrocarbon group having 1 to 12 carbon atoms, and m is an integer of 1 or more.

Regarding the above-mentioned primary or secondary alkyl group, in addition to being a primary or secondary alkyl group, the content of the above-mentioned alkyl group can be applied.

The aforementioned alkenyl group having 2 to 12 carbon atoms may be vinyl, 1-propenyl, isopropenyl, 1-butenyl, 2-butenyl, 3-butenyl, 1-pentenyl, 2- Pentenyl, 3-pentenyl, 3-methyl-1-butenyl, 1,3-butadienyl, allyl, 1-phenylvinyl-1-yl, 2-phenylethylene 1-yl, 2,2-diphenylvinyl-1-yl, 2-phenyl-2-(naphthyl-1-yl)vinyl-1-yl, 2,2-bis(diphenyl (Base-1-yl) vinyl-1-yl, stilbene group, styryl group, but still not limited thereto.

The above-mentioned aryl group includes, for example, phenyl, biphenyl, naphthyl, etc., but is not limited thereto.

The above-mentioned aryl group can be applied to the aryl part of the above-mentioned aralkyl group.

The above m is preferably an integer of 1 or more, specifically, it may be an integer of 1 to 20, but is not limited thereto.

In the case where the epoxy resin further includes a repeating unit derived from the monomer represented by the chemical formula 25, it has the advantage of forming a high curing density in the coating film even at a low temperature, and therefore it is preferable.

With respect to 100 parts by weight of the solid content of the light conversion resin composition, the content of the alkali-soluble resin may be 1 to 60 parts by weight, preferably 10 to 50 parts by weight, and more preferably 30 to 50 parts by weight. When the content of the alkali-soluble resin is within the above range, the solubility in the developer is sufficient, so it is easy to form a pattern, and prevents the film of the pixel portion of the exposed portion from being reduced during development, so that the non-pixel portion can be better peeled off. Therefore better. In the case where the content of the alkali-soluble resin is less than the above range, the non-pixel portion may only slightly fall off, and when the content of the alkali-soluble resin is more than the above range, the solubility in the developer decreases, and pattern formation may be difficult.

additive

The light conversion resin composition of the present invention may further include additives.

The above-mentioned additives may be antioxidants. In the case of further containing antioxidants, the free radicals generated by heat during post-baking can be captured, effectively inhibiting and preventing the reaction of free radicals with quantum dots and reducing the luminous efficiency due to free radicals. The capturing effect is excellent, so even if it is used in a small amount, a sufficient effect can be expected.

The antioxidant may include one or more selected from the group consisting of phenol-based antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants, and they may be phenol-phosphorus-based antioxidants, phenol-sulfur-based antioxidants, and phosphorus-sulfur-based antioxidants. An oxidant or a combination of phenol-phosphorus-sulfur antioxidants is used.

The above-mentioned phenolic antioxidants include 3,9-bis[2-[3-(3-tertiarybutyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethyl Ethoxy]-2,4,8,10-tetraoxaspiro[5.5]undecane, neopentylerythritol tetra[3-(3,5-di-tertiarybutyl-4-hydroxyphenyl) ) Propionate], 1,3,5-trimethyl-2,4,6-tris(3'5'-di-tertiarybutyl-4-hydroxybenzyl)benzene, triethylene glycol-bis [3-(3-tertiary butyl-5-methyl-4-hydroxyphenyl) propionate], 4,4'-thiobis(6-tertiary butyl-3-methylphenol), Tris-(3,5-di-tertiarybutyl-4-hydroxybenzyl)-isocyanurate, 1,3,5-tris(4-tertiarybutyl-3-hydroxy-2,6- Dimethylbenzyl)-isocyanurate, 1,6-hexanediol-bis[3-(3,5-di-tertiarybutyl-4-hydroxyphenyl)propionate], 2, 2-thio-diethylenebis[3-(3,5-di-tertiarybutyl-4-hydroxyphenyl)propionate], N,N'-hexamethylenebis(3,5 -Di-tertiary butyl-4-hydroxy-hydrocinnamamide), 1,3,5-trimethyl-2,4,6-tris(3,5-di-tertiary butyl-4-hydroxy Benzyl)benzene, 2,4-bis[(octylthio)methyl]-o-cresol, 1,6-hexanediol-bis-[3-(3,5-di-tertiarybutyl- 4-hydroxyphenyl) propionate], octadecyl-[3-(3,5-di-tertiary butyl-4-hydroxyphenyl) propionate, 2,2'-methylene bis (4-methyl-6-tertiary butylphenol), 4,4'-butylene-bis(3-methyl-6-tertiary butylphenol), 1,1,3-tris(2-methyl 4-hydroxy-5-tertiary butylphenyl)butane, 1,3,5-tris(4-hydroxybenzyl)benzene, and tetrakis[methylene-3-(3,5'-di -Tertiary butyl-4'-hydroxyphenyl propionate)] methane and the like.

Among the above-mentioned phenolic antioxidants, 3,9-bis[2-[3-(3-tertiarybutyl-4-hydroxy-5-methylphenyl) is preferred from the viewpoints of heat resistance and heat-resistant discoloration prevention Propyloxy]-1,1-dimethylethoxy]-2,4,8,10-tetraoxaspiro[5.5]undecane, 1,3,5-trimethyl-2,4 ,6-tris(3'5'-di-tertiary butyl-4-hydroxybenzyl)benzene, neopentylerythritol tetrakis[3-(3,5-di-tertiarybutyl-4-hydroxyphenyl) ) Propionate], triethylene glycol-bis[3-(3-tertiary butyl-5-methyl-4-hydroxyphenyl) propionate], 4,4'-thiobis(6- Tertiary butyl-3-methylphenol), tris-(3,5-di-tertiary butyl-4-hydroxybenzyl)-isocyanurate, 1,3,5-tris(4-tri Butyl-3-hydroxy-2,6-dimethylbenzyl)-isocyanurate, 1,6-hexanediol-bis[3-(3,5-di-tertiary butyl-4) -Hydroxyphenyl)propionate], 2,2-thio-diethylenebis[3-(3,5-di-tertiarybutyl-4-hydroxyphenyl)propionate], N, N'-hexamethylene bis(3,5-di-tertiarybutyl-4-hydroxy-hydrocinnamamide), 1,3,5-trimethyl-2,4,6-tris(3, 5-Di-tertiary butyl-4-hydroxybenzyl)benzene, and 2,4-bis[(octylthio)methyl]-o-cresol.

Commercial products include Irganox 1010 (manufactured by BASF), Sumilizer BBM-S (manufactured by Sumitomo Chemical Co., Ltd.), ADK STAB AO-80 (manufactured by ADEKA Co., Ltd.), Sumilizer GP (manufactured by Sumitomo Chemical Co., Ltd.), Irganox 1035 (manufactured by Sumitomo Chemical Co., Ltd.) Made by BASF) and so on.

The above-mentioned phosphorus antioxidants include 3,9-bis(2,6-di-tertiarybutyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9- Diphosphaspiro[5.5]undecane, diisodecyl neopentaerythritol diphosphite, bis(2,4-di-tertiary butylphenyl) neopentaerythritol diphosphite, 2, 2'-Methylenebis(4,6-di-tertiarybutyl-1-phenyloxy)(2-ethylhexyloxy)phosphorus, 6-[3-(3-tertiarybutyl-4- Hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tertiarybutyldibenzo[d,f][1,3,2]dioxin, Triphenyl phosphite, diphenyl isodecyl phosphite, phenyl isodecyl phosphite, 4,4'-butylene-bis(3-methyl-6-tertiarybutylphenyl ditridecane Base) phosphite, stearyl phosphite, tris(nonylphenyl) phosphite, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10- (3,5-Di-tertiary butyl-4-hydroxybenzyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-decyloxy-9, 10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, tris(2,4-di-tertiary butylphenyl) phosphite, cycloneopentane tetrayl bis(2, 4-Di-tertiary butylphenyl) phosphite, cycloneopentane tetrayl bis(2,6-di-tertiary butylphenyl) phosphite, 2,2-methylene bis(4 ,6-Di-tertiary butylphenyl) octyl phosphite, tris (2,4-di-tertiary butyl phenyl) phosphite, tetrakis (2,4-di-tertiary butyl benzene) Group) [1,1-biphenyl]-4,4' ylidene diphosphonate, bis[2,4-bis(1,1-dimethylethyl)-6-methylphenyl]ethyl Base ester, and phosphonic acid, etc.

Among the above-mentioned phosphorus antioxidants, 2,2'-methylenebis(4,6-di-tertiarybutyl-1-phenyloxy) (2- Ethylhexyloxy) phosphorus, 3,9-bis(2,6-di-tertiary butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-di Phosphospiro[5.5]undecane, and 6-[3-(3-tertiarybutyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra- Tertiary butyl dibenzo[d,f][1,3,2]dioxin and so on.

The sulfur-based antioxidants include 2,2-bis({[3-(dodecylthio)propionyl]oxy}methyl)-1,3-propanediyl-bis[3-(twelve Alkylthio) propionate], 2-mercaptobenzimidazole, dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, two Stearyl-3,3'-thiodipropionate, neopentylerythritol-tetra(3-laurylthiopropionate), and 2-mercaptobenzimidazole, etc.

Among the above sulfur antioxidants, 2,2-bis({[3(dodecylthio)propionyl]oxy}methyl)-1,3-bis({[3(dodecylthio)propionyl]oxy}methyl)-1,3- Propanediyl-bis[3-(dodecylthio)propionate], 2-mercaptobenzimidazole, etc.

With respect to 100% by weight of the solid content of the light conversion resin composition, the content of the antioxidant may be 0.01 to 30% by weight, preferably 0.1 to 20% by weight, and more preferably 0.1 to 15% by weight.

In the case where the content of the antioxidant is within the above range, it is advantageous to solve the decrease in luminous efficiency. When the content of the antioxidant is less than the above range, the above-mentioned effect (that is, the effect of suppressing the decrease in the luminous efficiency of the quantum dots after hard baking treatment) cannot be ensured, and when the content is greater than the above range, it has heat The problem that curing cannot be fully carried out.

Solvent

The light conversion resin composition of the present invention may further include a solvent.

The solvent contained in the light conversion resin composition of the present invention may contain at least one solvent, and in particular, when 50% or more of the solvent with a boiling point of 100 to 240°C is contained relative to the total solvent, the flow characteristics are excellent, and coating unevenness will not occur. And dry foreign matter, so it is possible to provide a good light conversion laminated substrate without coating foreign matter.

When the above-mentioned solvent with a boiling point of less than 100°C is more than 50% of all solvents, the drying speed is fast, and uneven surface of the coating film may occur during the vacuum drying process, which may cause defects. On the other hand, when the boiling point is greater than 240°C When the solvent is more than 50% of all solvents, it may cause the problem of longer Tack-time in the vacuum drying process. Therefore, it is suitable to use a solvent with a boiling point of 100 to 240°C for more than 50% of all solvents.

As a specific example, it may include one or more selected from the group consisting of ethers, aromatic hydrocarbons, ketones, alcohols, esters, or amines. Specifically, it may be propylene glycol monomethyl ether ethyl Ester, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, toluene, xylene, mesitylene, methylpentyl Ketone, methyl isobutyl ketone, cyclohexanone, butanol, hexanol, cyclohexanol, ethyl 3-ethoxypropionate, 1,3-butanediol diacetate, ethyl-3- Ethoxy propionate, propylene glycol diacetate, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monodiethyl ether, methoxybutyl acetate, ethylene two One or two or more of the group consisting of alcohol and γ-butyrolactone.

Relative to 100% by weight of the light conversion resin composition, the content of the solvent may be 30 to 90% by weight, preferably 40 to 80% by weight, and more preferably 60 to 75% by weight. When the content of the above-mentioned solvent is within the above-mentioned range, use roll coater, spin coater, slit spin coater, slit coater (sometimes called die coater), inkjet When coating with a coating device such as a machine, the coating properties can be improved.

＜Light conversion laminated base material＞

The light conversion laminated base material of this invention contains the hardened|cured material of a light conversion resin composition. The above-mentioned light conversion laminated substrate can be processed more efficiently at a coating formation temperature of 100 to 250°C by using a cured product of the light conversion resin composition. Compared with the conventional complicated structure, the brightness and long-term Reliability can become excellent.

The light conversion laminated substrate may be silicon (Si), silicon oxide (SiOx), or a polymer substrate, and the polymer substrate may be polyethersulfone (PES) or polycarbonate (PC) or the like.

The said light conversion laminated base material can be formed by thermosetting the said light conversion resin composition.

＜Image display device＞

The image display device of the present invention includes the above-mentioned light conversion laminated substrate. Specific examples of the above-mentioned image display devices include liquid crystal displays (liquid crystal display devices; LCD), organic EL displays (organic EL display devices), liquid crystal projectors, display devices used in game consoles, and portable terminals such as portable phones. Display devices such as the display devices used in digital cameras, display devices used in car navigation, etc., are particularly suitable for color display devices.

The above-mentioned image display device may include, in addition to the above-mentioned light conversion laminated base material, a structure known to those skilled in the technical field of the present invention, that is, the present invention includes an image display apparatus capable of applying the light conversion laminated base material of the present invention .

Hereinafter, in order to specifically describe this specification, an embodiment is used for detailed description. However, the embodiments in this specification can be deformed into various other types, and should not be construed that the scope of this specification is limited by the embodiments described in detail below. The embodiments in this specification are provided to explain this specification more completely to those of ordinary skill in the art. In addition, as long as there is no special mention, the "%" and "parts" of the content shown below are based on weight.

Preparation example 1 : Scattering particle dispersion S1 Preparation

_{Using a bead mill, 70.0 parts by weight of TiO 2} (Huntsman TTO-55(C)) with a particle size of 100 nm as scattering particles and 4.0 parts by weight of DISPERBYK-2001 (manufactured by BYK) as a dispersant , 26 parts by weight of propylene glycol methyl ether acetate as a solvent were mixed/dispersed for 12 hours to prepare scattering particle dispersion S1.

Synthesis example 1 : Synthesis of green quantum dots ( Q-1 )

Add 0.4 millimoles (0.058 grams) of indium acetate, 0.6 millimoles (0.15 grams) of palmitic acid, and 20 milliliters of 1-octadecene (octadecene) into the reactor. Heat to 120°C. After 1 hour, the atmosphere in the reactor was changed to nitrogen. After heating to 280°C, quickly inject _{a mixed solution of 0.2 millimoles (58 μl) of tris(trimethylsilyl) phosphine (TMS 3} P) and 1.0 ml of trioctyl phosphine, and react for 1 minute.

Next, 2.4 millimoles (0.448 g) of zinc acetate, 4.8 millimoles of oleic acid, and 20 mL of trioctylamine were added to the reactor, and heated to 120°C under vacuum. After 1 hour, the atmosphere in the reactor was changed to nitrogen, and the temperature of the reactor was raised to 280°C. 2 ml of the InP core solution synthesized above was added, and then 4.8 millimoles of selenium (Se/TOP) in trioctyl phosphine was added, and the final mixture was allowed to react for 2 hours. Ethanol is added to the reaction solution after being rapidly cooled to room temperature, and centrifuged. The resulting precipitate is filtered under reduced pressure and dried under reduced pressure to form an InP/ZnSe core-shell.

Next, 2.4 millimoles (0.448 g) of zinc acetate, 4.8 millimoles of oleic acid, and 20 mL of trioctylamine were added to the reactor, and heated to 120°C under vacuum. After 1 hour, the atmosphere in the reactor was changed to nitrogen, and the temperature of the reactor was raised to 280°C. 2 ml of the InP core solution synthesized above was added, and then 4.8 millimoles of sulfur (S/TOP) in trioctyl phosphine was added, and the final mixture was allowed to react for 2 hours. Ethanol was added to the reaction solution after being rapidly cooled to room temperature, and centrifuged. The precipitate was filtered under reduced pressure and dried under reduced pressure to obtain quantum dots with an InP/ZnSe/ZnS core-shell structure.

The maximum luminescence peak of the luminescence spectrum of the obtained nano quantum dots was 535 nm.

Synthesis example 2 : Synthesis of red quantum dots ( Q-2 )

Add 0.2 millimoles of indium acetate (0.058 grams), 0.6 millimoles (0.15 grams) of palmitic acid, and 10 milliliters of 1-octadecene into the reactor, and heat to 120°C under vacuum. After 1 hour, the atmosphere in the reactor was changed to nitrogen. After heating to 280°C, quickly inject _{a mixed solution of 0.1 millimoles (29 microliters) of tris(trimethylsilyl) phosphine (TMS 3} P) and 0.5 ml of trioctyl phosphine, and react for 20 minutes. Acetone was added to the reaction solution which was quickly cooled to room temperature, and the precipitate obtained by centrifugal separation was dispersed in toluene. The obtained InP semiconductor nanocrystals showed the first UV absorption maximum wavelength of 560 to 590 nm.

Add 1.2 millimoles of zinc acetate (0.224 g), 2.4 millimoles of oleic acid, and 10 ml of trioctylamine into the reactor, and heat to 120°C under vacuum. After 1 hour, the atmosphere in the reactor was changed to nitrogen, and the temperature of the reactor was raised to 280°C. 1 ml of the synthesized InP core solution was added, and then 2.4 millimoles of S (sulfur)/TOP (trioctyl phosphine) was added, and the final mixture was allowed to react for 2 hours. Ethanol was added to the reaction solution after being rapidly cooled to room temperature, and centrifuged to obtain InP (core)/ZnS (shell) quantum dots with an emission wavelength of 636 nm.

Preparation example 2 ：Quantum dot dispersion A-1

Using a bead mill, 25.0 parts by weight of the quantum dot Q-1 of Synthesis Example 1, 6 parts by weight of Ajisper PB-821 as a dispersant, and 69 parts by weight of propylene glycol monomethyl ether acetate as a solvent were mixed and dispersed For 12 hours, prepare quantum dot dispersion A-1.

Preparation example 3 ：Quantum dot dispersion A-2

After dispersing the quantum dot Q-1 of Synthesis Example 1 in chloroform, 5 ml of the quantum dot solution was added to the centrifuge tube, and 20 ml of ethanol was added for precipitation. Centrifugation was performed and the supernatant was removed. After adding 2 ml of chloroform to the precipitate to disperse the quantum dots, 0.50 g of (2-butoxy-ethoxy)-acetic acid was added, while in a nitrogen atmosphere at 60 The reaction was carried out for 1 hour while heating at °C.

Next, after adding 25 ml of n-hexane to the reaction mass to precipitate the quantum dots, centrifugal separation was performed. After the precipitate was separated, 4 ml of propylene glycol monomethyl ether acetate was added and heated at 80°C. While dispersing, a quantum dot dispersion liquid A-2 was prepared.

Preparation example 4 ：Quantum dot dispersion A-3

Using a bead mill, 25.0 parts by weight of the quantum dot Q-2 of Synthesis Example 2, 6 parts by weight of Ajisper PB-821 as a dispersant, and 69 parts by weight of propylene glycol monomethyl ether acetate as a solvent were mixed and dispersed For 12 hours, a quantum dot dispersion A-3 was prepared.

Preparation example 5 ：Quantum dot dispersion A-4

After dispersing the quantum dot Q-2 of Synthesis Example 2 in chloroform, 5 ml of the quantum dot solution was added to the centrifuge tube, and 20 ml of ethanol was added for precipitation. Centrifugation was performed and the supernatant was removed. After adding 2 ml of chloroform to the precipitate to disperse the quantum dots, 0.65 g of 2-[2-(2-methoxyethoxy)ethoxy]acetic acid was added. (Wako), while heating at 60°C in a nitrogen atmosphere, the reaction was carried out for 1 hour.

Next, after adding 25 ml of n-hexane to the reaction mass to precipitate the quantum dots, centrifugal separation was performed and the supernatant was removed. After the precipitate was separated, 4 ml of propylene glycol monomethyl ether acetate was added, while The dispersion was performed while heating at 80°C to prepare a quantum dot dispersion A-4.

Synthesis example 3 ：Alkali-soluble resin containing carbodole-based binder resin ( E-1 )

(1) In the reactor, add 138 grams of 9,9'-bis(4-glycidyloxyphenyl) fluorene (Hear chem) as a bisphenol epoxy compound, and 2-carboxyethyl acrylate (2 -Carboxyethylacrylate) 54 grams, benzyl triethyl ammonium chloride (Oi Kakin Co., Ltd.) 1.4 grams, triphenyl phosphine (Aldrich) 1 grams, propylene glycol methyl ethyl acetate (Daicel Chemical Co., Ltd.) 128 g and 0.5 g of hydroquinone were heated to 120°C and maintained for 12 hours to synthesize the compound represented by the following chemical formula 26.

[化學式27]

(2) In the reactor, add 60 grams of the compound represented by the following chemical formula 26, 11 grams of biphenyltetracarboxylic dianhydride (Mitsubishi Gas Company), 3 grams of tetrahydrophthalic anhydride (Aldrich), and propylene glycol 20 g of methyl ethyl acetate (Dacel Chemical Co., Ltd.) and 0.1 g of N,N'-tetramethylammonium chloride were heated to 120°C and maintained for 2 hours to synthesize the compound represented by the following chemical formula 27. The weight average molecular weight of the resin represented by the obtained chemical formula 27 was 5,400 g/mol. [Chemical formula 26]

[Chemical formula 27]

Synthesis example 4 : Alkali-soluble resin containing acrylic binder resin ( E-2 )

Prepare a flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen introduction pipe. On the other hand, as a monomer dropping funnel, 74.8 g (0.20 mol) of benzyl maleimide and acrylic acid are added. After 43.2 grams (0.30 mol), 118.0 grams (0.50 mol) of vinyl toluene, 4 grams of tertiary butyl peroxide-2-ethylhexanoate, 40 grams of propylene glycol monomethyl ether acetate (PGMEA), It is prepared by stirring and mixing; as a drop tank for the chain transfer agent, 6 g of n-dodecyl mercaptan and 24 g of PGMEA are added and mixed and stirred. After that, 395 g of PGMEA was introduced into the flask, the atmosphere in the flask was changed from air to nitrogen, and the temperature of the flask was raised to 90°C while stirring. Next, the monomer and chain transfer agent were added dropwise from the dropping funnel. During the dripping, keep 90°C for 2 hours respectively. After 1 hour, the temperature is raised to 110°C and maintained for 3 hours, then the gas introduction tube is introduced to start the oxygen/nitrogen=5/95 (v/v) mixed gas Bubbling. Next, 28.4 grams of glycidyl methacrylate [(0.10 mol), (33 mol% relative to the carboxyl group of acrylic acid used in this reaction)], 2,2'-methylene bis(4- 0.4 g of methyl-6-tertiary butyl phenol) and 0.8 g of triethylamine were added to the flask, and the reaction was continued at 110°C for 8 hours to obtain an alkali-soluble resin with a solid acid value of 70 mg KOH/g. The weight average molecular weight in terms of polystyrene measured by GPC was 16,000 g/mol, and the molecular weight distribution (Mw/Mn) was 2.3.

Synthesis Example 5: Alkali-soluble resin (E-3) containing epoxy-based binder resin

In a flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen introduction tube, add 120 grams of propylene glycol monomethyl ether acetate, 80 grams of propylene glycol monomethyl ether, and 2,2'-azo Diisobutyronitrile 2 grams, acrylic acid 18 grams, p-vinyl toluene 37.9 grams, methyl methacrylate 10 grams, glycidyl methacrylate 34.1 grams, n-dodecyl mercaptan 3 grams, and nitrogen replacement.

After that, while stirring, the temperature of the reaction liquid was increased to 80°C, and the reaction was carried out for 8 hours. The acid value of the solid content of the synthesized alkali-soluble resin was 140 mg KOH/g, and the weight average molecular weight Mw measured by GPC was about 13,110.

Preparation example 4: Preparation of light conversion resin composition (Comparative Examples 1'to 10' and Comparative Examples 1 to 8)

The light conversion resin composition of the comparative example was prepared using the components and contents (% by weight) in Table 1 below.

experiment example

Using the light conversion resin composition prepared in the above comparative example, the light conversion coating was prepared in the following manner, and the brightness and light resistance at this time were measured by the method described below. The evaluation results are described in Table 2 and below. table 3.

(1) Preparation of light conversion coating

The light conversion resin composition prepared in the comparative example was used to prepare a coating film. That is, each of the above-mentioned light conversion resin compositions was applied on a 5 cm x 5 cm glass substrate by spin coating, then placed on a hot plate, and maintained at a temperature of 100°C for 10 minutes to form a thin film. The light conversion coating was prepared by heating in a heating oven at ℃ for 30 minutes. The thickness of the light conversion resin film prepared above is 15 micrometers in thickness based on the content of quantum dots.

(2) Evaluation of brightness and light maintenance rate

The substrate prepared in (1) above was placed on top of a blue light source (XLamp XR-E LED, Royalblue 450, Cree) with a wavelength of 450 nanometers, and the illuminance was set to 60 milliwatts/cm² (mW/cm2). cm ² ), after that, the outside light and air were blocked, and the brightness was measured at regular intervals using a brightness meter (CAS140CT Spectrometer, Instrument Systems). The evaluation results are described in Table 2 below.

In addition, with regard to the brightness measured at regular intervals, the light retention rate was measured with the initial brightness as a reference, and is described in Table 3.

With reference to Table 2 and Table 3 mentioned above, it can be confirmed that the comparative example which contains a thermosetting agent or a thiol compound alone has a decrease in brightness and a decrease in the light retention rate at regular intervals. However, it can be confirmed that the comparative example containing the thermosetting agent and the thiol compound at a certain content ratio shows a brightness characteristic that is 1000 nits or more higher than that of the other comparative examples.

This is because the thermal curing agent and the thiol compound are not hindered by oxygen during the high-temperature treatment process, and react quickly to form a high crosslink density. The multifunctional thiol compound protects the core-shell density of the quantum dots, thus improving the evaluation The resistance of quantum dots to blue light can prevent extinction, which can be confirmed by the excellent light retention rate.

Preparation Example 5: Preparation of Light Conversion Resin Composition (Examples 11 to 26 and Comparative Examples 10 to 16)

The light conversion resin compositions of Examples and Comparative Examples were prepared using the components and contents (% by weight) of Table 4 below.

Experimental example 2

Using the light conversion resin compositions prepared in the above examples and comparative examples, the light conversion coating was prepared as follows, and the brightness, light retention, and coating film hardness at this time were measured by the following methods. The results are shown in Table 5 below .

(1) Preparation of light conversion coating

The light conversion resin composition prepared in the Examples and Comparative Examples was used to prepare coating films. That is, each of the above-mentioned light conversion resin compositions was applied on a 5 cm x 5 cm glass substrate by spin coating, then placed on a hot plate, and maintained at a temperature of 100°C for 10 minutes to form a thin film. The light conversion coating was prepared by heating in a heating oven at ℃ for 30 minutes. The thickness of the light conversion resin film prepared above is 15 micrometers in thickness based on the content of quantum dots.

(2) Evaluation of brightness

After placing the coating film prepared in (1) above on a blue light source (XLamp XR-E LED, Royalblue 450, Cree), the brightness was measured using a brightness meter (CAS140CT Spectrometer, Instrument systems). The evaluation results are described in Table 5 below.

(3) Light maintenance rate

For the coated substrate produced by the above-mentioned light conversion coating preparation method, perform a hard bake at 230°C for 60 minutes, and measure the luminous efficiency before and after the hard bake, and the luminous efficiency after the hard bake. The luminous efficiency after 24 hours in each condition of fluorescent lamp (BUNGAEPYO, FLDC/T8/17K57, 5700K) and yellow lamp (BUNGAEPYO, FHF32SSEX-Y-NU-KEV), confirm that the luminous efficiency maintains the level, and list 5 below Expressed in terms of light maintenance rate.

(4) Hardness of coating film

The degree of curing of the coating film prepared in (1) above was measured at a high temperature of 150° C. using a hardness tester (HM500; a product of Fisher Company). The results obtained at this time are shown in Table 5 below. At this time, the surface hardness was evaluated based on the following criteria.

<Evaluation criteria>

○: Surface hardness is 50 or more

△: The surface hardness is 30 or more and less than 50

×: Surface hardness is less than 30

[table 5]

With reference to Table 5 above, in the case of the examples of the present invention, the hardness of the coating film has better performance than that of the comparative example. From the results, it can be seen that the occurrence of vapor-deposited film during the heat treatment introduced during display production can be greatly reduced. Bad rupture. In addition, it can be confirmed that the example of the present invention has an increased coating film hardness, and therefore, the brightness and light retention rate are significantly superior to those of the comparative example. On the other hand, it can be confirmed that in the case of Comparative Examples 15 and 16 containing an antioxidant in a certain range or more, although the brightness and light retention rate are excellent, the hardness of the coating film decreases.

none

:none.

:none.

Claims (17)

A light conversion resin composition, characterized in that it comprises quantum dots, a thermosetting agent, a thiol compound, and an antioxidant, and the thermosetting agent comprises a polyfunctional alicyclic epoxy resin, a novolak epoxy resin, and One or more of the group consisting of epoxy resin modified by silane, the equivalent ratio of the thermosetting agent to the thiol compound is 0.1:0.9 to 0.4:0.6, and the weight ratio of the antioxidant to the thiol compound is 1:4 To 1:19, and wherein the thiol compound contains the compound represented by the following chemical formula 3.

In chemical formula 3, Rs is hydrogen or a C1 to C12 alkyl group, Rp is a C1 to C12 alkylene group, Rq is an n-valent aliphatic hydrocarbon group with or without atoms other than carbon atoms, and t is an integer from 2 to 4 . The light conversion resin composition according to claim 1, wherein the light conversion resin composition further comprises a group consisting of scattering particles, an alkali-soluble resin containing a Cardo-based binder resin, an additive, and a solvent More than one kind. The light conversion resin composition according to claim 1, wherein the content of the antioxidant is 0.01 to 30% by weight relative to 100% by weight of the solid content of the light conversion resin composition. The light conversion resin composition according to claim 1, wherein the thiol compound contains at least one compound represented by the following chemical formula 4 to chemical formula 11,

[Chemical formula 7]

The light conversion resin composition according to claim 1, wherein the polyfunctional alicyclic epoxy resin contains a compound represented by the following Chemical Formula 12 or 13, [Chemical Formula 12]

In Chemical Formula 12, R is a C1 to C10 alkyl group, and r, s, and p are each independently an integer from 1 to 20,

The light conversion resin composition according to claim 1, wherein the novolak epoxy resin contains a compound represented by the following chemical formula 14,

In Chemical Formula 14, v is an integer from 1 to 20. The light conversion resin composition according to claim 1, wherein the silane-modified epoxy resin is produced by dealcoholization condensation reaction of a hydroxyl-containing epoxy resin and an alkoxysilane. The light conversion resin composition according to claim 7, wherein the hydroxyl-containing epoxy resin contains the compound represented by the following chemical formula 15,

In Chemical Formula 15, x is an integer from 1 to 34. The light conversion resin composition according to claim 1, wherein the content of the thermosetting agent is 0.1 to 50% by weight relative to 100% by weight of the solid content of the light conversion resin composition. The light conversion resin composition according to claim 1, wherein the quantum dots include non-cadmium-based quantum dots. The light conversion resin composition according to claim 10, wherein the non-cadmium-based quantum dot system includes two or more kinds of quantum dots having an InP core. The light conversion resin composition according to claim 1, wherein the quantum dot system comprises a core and a shell, the core contains at least one substance selected from the group consisting of InP, ZnS, ZnSe, PbSe, AgInZnS, and ZnO, and the shell contains One or more substances selected from ZnSe, ZnS, ZnTe, PbS, TiO, SrSe, and HgSe. The light conversion resin composition according to claim 1, wherein the quantum dots include two or more types of quantum dots whose central excitation wavelengths are different from each other by 50 nanometers or more. The light conversion resin composition according to claim 1, wherein the quantum dot system includes two or more non-cadmium-based quantum dots arranged on the surface and containing a polyethylene glycol-based ligand. The light conversion resin composition according to claim 14, wherein the polyethylene glycol-based ligand system comprises a compound represented by the following chemical formula 1.

In the chemical formula 1, A ₁ is represented by the following chemical formula 1-1, and A ₂ is a hydrogen atom, a mercapto group (*-SH), a carboxylic acid group (

), dithioacetate (

), phosphonic acid group (

), an amine group (-NH ₂ ), or a linear alkyl group with 1 to 20 carbon atoms, a is an integer from 2 to 100, [Chemical formula 1-1]*-A ₃ -OA _{4 In} chemical formula 1-1, A ₃ is a direct bond or an alkylene having 1 to 10 carbon atoms, A ₄ is represented by the following chemical formula 1-2, * represents the bonding end, [Chemical formula 1-2]

In the chemical formula 1-2, A ₅ is an oxygen atom or a sulfur atom, A ₆ is a direct bond or an alkylene group having 1 to 10 carbon atoms, and A ₇ is selected from the group consisting of mercapto (*-SH) and carboxylic acid groups (

), dithioacetate (

), phosphonic acid group (

), and an amine group (-NH ₂ ), b is an integer from 0 to 1, c is an integer from 0 to 10, and * represents a bonding end. The light conversion resin composition according to claim 2, wherein the scattering particles include Al ₂ O ₃ , SiO ₂ , ZnO, ZrO ₂ , BaTiO ₃ , TiO ₂ , Ta ₂ O ₅ , Ti ₃ O ₅ , ITO, IZO, ATO, ZnO-Al, Nb ₂ O ₃ , SnO, MgO and a combination of more than one group. The light conversion resin composition according to claim 2, wherein the alkali-soluble resin further contains one or more selected from acrylic adhesive resins and epoxy adhesive resins.