TWI744893B - Electronic device and manufacturing method of the same - Google Patents

Abstract

The invention discloses an electronic device and a manufacturing method thereof. The pattern circuit of each surface mount structure of the electronic device is disposed on the substrate; at least two through holes are respectively corresponding to at least two signal lines of the pattern circuit; and the two ends of at least one photoelectric element are respectively electrically connected to the at least two signal lines of the pattern circuit. Each connection pad group of the driving circuit board is corresponding to each surface mount structure, and at least two connection pads are respectively corresponding to the at least two through holes of the surface mount structure. At least two conductive members of each conductive member group are disposed corresponding in the at least two through holes of the surface mount structure, and extending to the first surface and the second surface of the substrate; wherein, the conductive member disposed in each through hole respectively electrically connected the signal lines of each surface mounting structure to the connection pads of each conductive member group of the driving circuit board.

Description

Electronic device and manufacturing method thereof

The present invention relates to an electronic device which is different from the traditional surface mount technology (SMT) and its manufacturing method.

In the field of electronic device manufacturing, Surface Mount Technology (SMT) is a technology for soldering electronic parts on the surface of, for example, a Printed Circuit Board (PCB), which is different from the early through-holes. For parts, the use of surface mount technology can greatly reduce the volume of electronic products and achieve the goal of being lighter, thinner, shorter and smaller.

Traditionally, the soldering of the surface mount component and the circuit board is mainly done through solder paste, as long as the solder paste is printed on the solder pads (or pads) of the parts that need to be soldered on the circuit board , And then put the surface mount component on the solder pad, make the solder foot of the surface mount component correspond to the position of the solder paste, and then melt the solder paste into a liquid through a high temperature reflow furnace, and the liquid solder paste will cover the surface The solder feet of the mounted component can be soldered on the circuit board after the surface mount component is cooled.

The purpose of the present invention is to provide an electronic device and a manufacturing method thereof that are different from the traditional electrical connection technology of surface mount components and driving circuit boards.

To achieve the above objective, an electronic device according to the present invention includes a plurality of surface mount structures, a driving circuit board, and a plurality of conductive element groups. Each surface mount structure has a substrate, a pattern circuit, at least two through holes, and at least one photoelectric element; the substrate defines a first surface and a second surface opposite to each other; the pattern circuit is arranged on the first surface of the substrate, and the pattern circuit At least two signal lines are included; at least two through holes communicate with the first surface and the second surface of the substrate, and at least two through holes respectively correspond to the at least two signal lines; at least one photoelectric element is disposed on the first surface of the substrate and its two ends At least two signal lines of the pattern circuit are respectively electrically connected. The drive circuit board includes a plurality of connection pad groups, each connection pad group corresponds to each surface mount structure, and the second surface of the substrate of each surface mount structure is arranged on the surface of the drive circuit board with multiple connection pad groups, and each connection The pad group has at least two connection pads, and the at least two connection pads respectively correspond to at least two through holes of the surface mount structure. The conductive element groups correspond to the surface mount structures, and each conductive element group has at least two conductive elements, and the at least two conductive elements are corresponding to at least two through holes provided in the surface mount structure and extend to the first surface of the substrate And the second surface; wherein, at least two conductive members arranged in each at least two through holes respectively electrically connect at least two signal lines of each surface mount structure to at least two connection pads of each connection pad group of the drive circuit board.

To achieve the above objective, an electronic device according to the present invention includes a surface mount structure, a driving circuit board, and a conductive element group. The surface mount structure has a substrate, a patterned circuit, at least two through holes and at least one photoelectric element. The substrate defines a first surface and a second surface opposite to each other. The pattern circuit is arranged on the first surface of the substrate, and the pattern circuit includes at least two signal lines. At least two through holes communicate with the first surface and the second surface of the substrate, and at least two through holes respectively correspond to at least two signal lines. At least one photoelectric element is arranged on the first surface of the substrate, and its two ends are respectively electrically connected to at least two signal lines of the pattern circuit. The drive circuit board includes a connection pad group, the connection pad group corresponds to the surface mount structure, and the second surface of the substrate of the surface mount structure is arranged on the surface of the drive circuit board with the connection pad group, the connection pad group has at least two connection pads , The at least two connection pads respectively correspond to at least two through holes of the surface mount structure. The conductive element group corresponds to the surface mount structure, and the conductive element group has at least two conductive elements, and the at least two conductive elements are corresponding to at least two through holes provided in the surface mount structure and extend to the first surface and the second surface of the substrate; Wherein, at least two conductive members arranged in at least two through holes respectively electrically connect at least two signal lines of the surface mount structure to at least two connection pads of the connection pad group of the driving circuit board.

In some embodiments, the material of the conductive element includes solder paste, copper paste, or silver paste, or a combination thereof.

In some embodiments, the electronic device further includes a plurality of adhesive elements disposed between the surface mount structures and the driving circuit board, and each adhesive element is provided corresponding to each surface mount structure.

In some embodiments, the electronic device further includes at least one adhesive member disposed between the surface mount structure and the driving circuit board.

In some embodiments, the driving circuit board and the substrate respectively define a side edge along a direction, and the side edge of the driving circuit board and the side edge of the substrate are close to each other.

In some embodiments, the number of optoelectronic elements is multiple, and the optoelectronic elements define a pixel pitch; the distance between the side edge of the driving circuit board and the side edge of the substrate in this direction is less than twice the pixel pitch.

In some embodiments, the electronic device further includes a primary conductive element that at least partially overlaps the through hole and is electrically connected to the conductive element located in the through hole and a conductive pad extending from each of the signal lines.

In some embodiments, the substrate of the surface mount structure further defines a peripheral edge connecting the first surface and the second surface, and at least two through holes are not located on the peripheral edge of the substrate.

In some embodiments, in the surface mount structure and the corresponding conductive element group, the number of the conductive elements is smaller than the number of the through holes.

In some embodiments, the surface mount structure is configured with a number of signal lines greater than two and a plurality of photoelectric elements, and each signal line corresponds to a number of through holes greater than two, wherein at least two photoelectric elements are on the same signal line Share the same through hole and its corresponding conductive element.

In some embodiments, at least one optoelectronic element of the surface mount structure includes a chip or a package, and the chip or package includes one or more light-emitting diodes, one or more sub-millimeter light-emitting diodes, one or Multiple micro light emitting diodes, or one or more image sensors, or a combination thereof.

In some embodiments, the pattern circuit in the surface mount structure includes a thin film circuit or a thin film element.

To achieve the above objective, a method of manufacturing an electronic device according to the present invention includes: providing a surface mount structure, wherein the surface mount structure has a substrate, a patterned circuit, at least two through holes, and at least one optoelectronic element; substrate definition There is a first surface and a second surface opposite to each other; the patterned circuit is formed on the first surface of the substrate, the patterned circuit includes at least two signal lines; at least two through holes connect the first surface and the second surface of the substrate, and at least two communicate The holes respectively correspond to at least two signal lines; at least one optoelectronic element is arranged on the first surface of the substrate, and its two ends are respectively electrically connected to at least two signal lines of the pattern circuit, provide a drive circuit board, and make the surface mount structure substrate The second surfaces of the driving circuit board are respectively arranged on the surface of the driving circuit board with the connection pad group, wherein the connection pad group corresponds to the surface mount structure and has at least two connection pads, and the at least two connection pads respectively correspond to at least two connections of the surface mount structure Hole; and a conductive material is provided in at least two through holes of the surface mount structure to form at least two conductive members, so that the at least two conductive members extend to the first surface and the second surface of the substrate, and each of the at least two through holes The at least two conductive elements respectively electrically connect the at least two signal lines of the surface mount structure to the at least two connection pads of the connection pad group of the driving circuit board.

In some embodiments, in the step of providing a surface mount structure, the step further includes: making the substrate in the surface mount structure further define a peripheral edge connecting the first surface and the second surface, and making at least two through holes not arranged On the periphery of the substrate.

In some embodiments, in the step of providing a surface mount structure, it further includes: making each signal line of the surface mount structure correspond to more than two through holes; and in the step of providing a conductive material, It includes: selectively spraying conductive material in the through holes so that the number of the conductive parts is smaller than the number of the through holes.

In some embodiments, the step of providing the surface mount structure further includes: configuring the surface mount structure with a plurality of optoelectronic elements, wherein each optoelectronic element includes one or more wafers; and in the step of arranging a conductive material Before or after, it further includes: discontinuously spreading an encapsulation layer on the substrate of the surface mount structure to cover each photoelectric element, and the encapsulation layer does not cover at least two through holes.

In some embodiments, the step of providing the surface mount structure further includes: configuring the surface mount structure with a plurality of optoelectronic elements, wherein each optoelectronic element includes one or more wafers; and in the step of arranging a conductive material Later, it further includes: continuously or discontinuously spreading an encapsulation layer on the substrate of the surface mount structure to cover each optoelectronic element.

In some embodiments, the step of providing a driving circuit board further includes: forming at least one adhesive member on the driving circuit board, and corresponding and positioning each surface mount structure to the driving circuit board.

As mentioned above, in the electronic device and the manufacturing method thereof of the present invention, the surface mount structure has a substrate, a patterned circuit, at least two through holes, and at least one photoelectric element. The patterned circuit includes at least two signal lines, and at least two through holes communicate with each other. The first surface and the second surface of the substrate, and at least two through holes respectively correspond to at least two signal lines, at least one optoelectronic element is disposed on the first surface of the substrate, and the two ends are respectively electrically connected to at least two signal lines of the pattern circuit; The connection pad group of the drive circuit board has at least two connection pads, and the at least two connection pads respectively correspond to at least two through holes of the surface mount structure; Two through holes extending to the first surface and the second surface of the substrate; wherein, at least two conductive members arranged in the at least two through holes respectively electrically connect at least two signal lines of the surface mount structure to the connection of the driving circuit board The structure design of at least two connecting pads of the pad set makes the electronic device and the manufacturing method of the present invention different from the traditional surface mount component and the driving circuit board electrical connection technology.

Hereinafter, an electronic device and a manufacturing method thereof according to some embodiments of the present invention will be described with reference to related drawings, in which the same components will be described with the same reference signs.

The electronic device and its manufacturing method of the present invention are related to the following co-pending ROC patent applications, all of which belong to the same owner as this application, and the entire contents of each patent application are referred to The method is incorporated into this article: (1), the Republic of China Patent Application No. 107122662, the title of the invention is "Electronic Device and its Its manufacturing method"; (3), Republic of China Patent Application No. 106136523, the title of the invention is "Electronic Device and its Manufacturing Method"; and (4), Republic of China Patent Application No. 106116725, the title of the invention is "Electronic Device And its manufacturing method".

The electronic device of the present invention includes at least one surface mount structure, a driving circuit board, and at least one conductive element group. Wherein, the number of the conductive element group, the surface mount structure, and the connection pad group in the drive circuit board can correspond to each other, and at least two conductive elements of each conductive element group are respectively inserted into at least two through holes of each surface mount structure , To contact at least two connection pads of each connection pad group, so that each conductive element group can electrically connect each surface mount structure to the driving circuit board. Through the surface mount structure, the number of connection pad groups and the conductive element groups correspond to each other, and the connection pads in the connection pad group, the conductive elements in the conductive element group and the through holes of the surface mount structure can be arranged and combined in various numbers. Achieve different implementation aspects of the electronic device of the present invention. It is worth noting that the surface mount structure and the driving circuit board can be reasonably understood as two independent components made by separate manufacturing processes, and the surface mount structure can be realized through the equivalent implementation modes covered by the present invention. Various numbers of permutations and combinations are carried out with the driving circuit board, and the flexibility and application of matching with each other are quite extensive. Each implementation mode is described below.

Fig. 1A is a schematic diagram of the layout of a surface mount structure according to an embodiment of the present invention. Fig. 1B and Fig. 1C respectively show a schematic cross-sectional view taken along the cutting line 1B-1B and the cutting line 1C-1C in Fig. 1A, and Fig. 2 is A schematic diagram of the layout of a driving circuit board according to an embodiment of the present invention, and FIG. 3 is a schematic diagram of the layout of an electronic device according to an embodiment of the present invention.

Please refer to FIG. 3 first, the electronic device 1 includes a plurality of surface mount structures 2, a driving circuit board 3, and a plurality of conductive element groups. A plurality of surface mount structures 2 are disposed on the driving circuit board 3, and are electrically connected to the driving circuit board 3 through corresponding conductive element groups. The multiple surface mount structures 2 of this embodiment are arranged on the driving circuit board 3 in a two-dimensional matrix arrangement, for example, to drive the surface mount structures 2 through the driving circuit board 3. In different embodiments, the surface mount structures 2 can also be arranged in other ways, such as a one-dimensional matrix arrangement or an irregular arrangement, which is not limited. Here, taking the surface mount structure 2 as an example of a passive matrix (PM) optoelectronic structure, with the driving circuit board 3 of the passive matrix, the electronic device 1 can be a passive matrix device. In different embodiments, with an active driving circuit board, the electronic device can be an active matrix device.

As shown in FIGS. 1A to 1C, each surface mount structure 2 has a substrate 21, a pattern circuit 22, at least two through holes 23 and at least one photoelectric element 24.

The substrate 21 defines a first surface S1 and a second surface S2 opposite to each other. Among them, the substrate 21 may be an insulating substrate, or a conductive substrate plus an insulating layer; the substrate 21 may be a flexible board or a rigid board, and it is not limited.

The pattern circuit 22 is disposed on the first surface S1 of the substrate 21, and the pattern circuit 22 includes at least two signal lines L1, L2. In some embodiments, the pattern circuit 22 may include thin film circuits and/or thin film elements. The thin film circuits are, for example, conductive circuits or insulating layers, and the thin film elements are, for example, thin film transistors, capacitors, or resistors. The pattern circuit 22 of this embodiment includes a thin film circuit, and includes two signal lines L1, L2 and a conductive pattern connected to each signal line L1, L2 as an example. It should be noted that the pattern circuit 22 is a general term, as long as the film layer or element formed on the substrate 21 can be called a pattern circuit. In some embodiments, the pattern circuit 22 may also include wires or circuits for transmitting signals, such as scanning circuits or data circuits, depending on the function and use of the electronic device.

At least two through holes 23 communicate with the first surface S1 and the second surface S2 of the substrate 21 (FIGS. 1B and 1C ), and at least two through holes 23 respectively correspond to at least two signal lines L1 and L2. The surface mount structure 2 of this embodiment is an example of a conductive pad having two through holes 23, and the two through holes 23 are respectively located on at least two signal lines L1 and L2. Among them, one through hole 23 corresponds to the signal line L1 and is located on the conductive pattern connected to the signal line L1, and the other through hole 23 corresponds to the signal line L2 and is located on the conductive pattern connected to the signal line L2. In addition, the substrate 21 of the surface mount structure 2 of this embodiment further defines a peripheral edge S3 connecting the first surface S1 and the second surface S2, and the two through holes 23 are located inside the substrate 21, not on the substrate 21. On the perimeter of S3. With this design, compared to the conventional surface mount device with through holes on the periphery of the substrate and the conductive material in the through holes are electrically connected to the drive circuit board, this embodiment is because the two through holes 23 are Located on the inner side of the substrate 21, so that the surface mount structure 2 can be electrically connected to the drive circuit board 3 occupies a small space, and then can increase the component density of the electronic device 1 on the premise of the same size (that is, increase the electronic device Resolution).

At least one photoelectric element 24 is disposed on the first surface S1 of the substrate 21, and its two ends are electrically connected to at least two signal lines L1, L2 of the pattern circuit 22, respectively. The optoelectronic element 24 may include a chip or a package. The chip or package may, for example, but not limited to, include one or more light emitting diodes (LED), one or more sub-millimeter light emitting diodes (Mini LED), one or more micro LEDs, or one or more image sensors, or a combination thereof. The number of the optoelectronic element 24 in this embodiment is one, and includes a flip-chip type light-emitting diode chip, and is correspondingly disposed on the conductive pattern connected to the signal lines L1, L2 through the two connection pads P1, P2, so that The photoelectric element 24 can be electrically connected to the two signal lines L1 and L2 of the pattern circuit 22 through the two connection pads P1 and P2, respectively. In some embodiments, the light-emitting diode chip can emit, for example, red light, or blue light, or green light, or ultraviolet light, or infrared light, or light of other wavelengths, which is not limited by the present invention.

Please refer to FIG. 2, the driving circuit board 3 includes a plurality of connecting pad groups 31 which are arranged in a two-dimensional matrix. Each connection pad group 31 corresponds to each surface mount structure 2, and the second surface S2 of the substrate 21 of each surface mount structure 2 is disposed on the surface of the driving circuit board 3 having a plurality of connection pad groups 31 (FIG. 3 ). In other words, in this embodiment, each surface mount structure 2 is provided on the surface of the driving circuit board 3 through its lower surface (second surface S2) and the corresponding connection pad group 31 (one surface mount structure 2 corresponds to One unit of connecting pad group 31). Each connection pad group 31 has at least two connection pads 311 and 312, and the at least two connection pads 311 and 312 respectively correspond to at least two through holes 23 of the surface mount structure 2. Each connection pad group 31 of this embodiment is an example of having two connection pads 311, 312 and corresponding to the two through holes 23 (the sum of the number of connection pads 311, 312 is the same as the number of through holes 23) . Among them, the connection pad 311 corresponds to and is connected to one of the through holes 23 of the surface mount structure 2 (the through hole 23 on the upper right side of FIG. 1A), and the connection pad 312 and the other through hole 23 of the surface mount structure 2 (FIG. The through hole 23) on the lower left side of 1A corresponds and connects. In addition, the driving circuit board 3 of this embodiment may further include a plurality of wires T1 and T2 arranged in a staggered manner. The connection pads 311 of each connection pad group 31 are sequentially arranged on the wires T1 arranged horizontally, and each connection pad The connecting pads 312 of the group 31 are sequentially arranged on the longitudinally arranged wires T2.

Please refer to FIG. 1A and FIG. 3 again, a plurality of conductive element groups correspond to the surface mount structures 2. Wherein, each conductive element group has at least two conductive elements 41, and the at least two conductive elements 41 are correspondingly provided in the at least two through holes 23 in the surface mount structure 2 and extend to the first surface S1 and the second surface S2 of the substrate 21. In this embodiment, each conductive element group has two conductive elements 41 as an example. The material of the conductive member 41 may include, but is not limited to, solder paste, copper paste, or silver paste, or a combination thereof. Here, the two conductive members 41 of each conductive member group are respectively correspondingly disposed in the two through holes 23 in each surface mount structure 2 (in this embodiment, the number of conductive members 41 is equal to the number of through holes 23 The same), and extend to the first surface S1 and the second surface S2 of the substrate 21, so that the conductive member 41 disposed in each through hole 23 of each surface mount structure 2 can separate two pieces of each surface mount structure 2 The signal lines L1 and L2 are electrically connected to the two connection pads 311 and 312 of each connection pad group 31 of the driving circuit board 3. In other words, this embodiment utilizes two through holes 23 located inside the surface mount structure 2 and conductive element groups (two conductive elements 41) located inside the two through holes 23, and the connecting pad group 31 ( Connection pads 311, 312), so that the drive circuit board 3 can be electrically connected to the corresponding photoelectric elements 24 through the corresponding connection pads 311, 312, the corresponding conductive members 41, and the corresponding signal lines L1, L2, so as to drive the respective photoelectric elements 24 (Light-emitting diodes) emit light.

In addition, FIG. 4A and FIG. 4B are respectively schematic diagrams of the layout of the surface mount structure of different embodiments of the present invention.

The main difference from the surface mount structure 2 of the foregoing embodiment is that the surface mount structure 2 of FIG. 1A has only two signal lines L1, L2 and one optoelectronic element 24, but the surface mount structure of FIG. 4A and FIG. 4B are respectively configured with The number is greater than two, three signal lines and two photoelectric elements 24. Among them, the two photoelectric elements 24 in FIG. 4A are arranged horizontally (1*2), and the two photoelectric elements 24 in FIG. 4A are arranged vertically (2*1).

The surface mount structure of FIG. 4A is configured with three signal lines (the added signal line is marked as L4) and two photoelectric elements 24. Among them, the photoelectric element 24 on the left is electrically connected to the signal line L1 and the signal line L2, and is respectively connected to the driving circuit board through the signal lines L1 and L2 and the corresponding two through holes 23 (and two conductive elements, not shown). (Not shown) is electrically connected, and the optoelectronic element 24 on the right is electrically connected to the signal line L1 and the signal line L4, and the signal line L4 is electrically connected to the driving circuit board through the corresponding through hole 23 (and conductive member). Therefore, the two photoelectric elements 24 in FIG. 4A share the same through hole 23 (and its corresponding conductive element) on the same signal line L1. With this configuration of the shared through holes 23, not only the device density of the electronic device can be increased, but also the drilling cost can be reduced by reducing the number of through holes while maintaining the same pixels (the same number of photoelectric elements 24).

In addition, the surface mount structure of FIG. 4B is also configured with more than two-thirds of the signal lines (the added signal line is marked as L3) and two photoelectric elements 24. Wherein, the photoelectric element 24 on the upper side is electrically connected to the signal line L1 and the signal line L2, and is respectively connected to the driving circuit board through the signal lines L1 and L2 and the corresponding two through holes 23 (and two conductive elements, not shown). (Not shown) is electrically connected, and the photoelectric element 24 on the lower side is electrically connected to the signal line L2 and the signal line L3, and the signal line L3 is electrically connected to the driving circuit board through the corresponding through hole 23 (and conductive member, not shown) connect. Therefore, the two photoelectric elements 24 in FIG. 4B share the same through hole 23 (and its corresponding conductive element) on the same signal line L2. With the configuration of the shared through hole 23, the component placement density of the electronic device can also be increased and the cost can be reduced.

In addition, please refer to FIGS. 5A to 7, where FIG. 5A is a schematic diagram of the layout of a surface mount structure according to another embodiment of the present invention, and FIGS. 5B to 5E respectively show that in FIG. , 5C-5C cut surface line, 5D-5D cut surface line and 5E-5E cut surface line schematic cross-sectional view, FIG. 6 is a schematic diagram of the layout of the drive circuit board according to another embodiment of the present invention, and FIG. A schematic diagram of the layout of an electronic device according to an embodiment.

Please refer to FIG. 7 first, the electronic device 1a includes a plurality of surface mount structures 2a, a driving circuit board 3a, and a plurality of conductive element groups. A plurality of surface mount structures 2a are arranged on the driving circuit board 3a, and are electrically connected to the driving circuit board 3a through corresponding conductive element groups. The multiple surface mount structures 2a of this embodiment are still arranged on the drive circuit board 3a in a two-dimensional matrix arrangement to drive the surface mount structures 2a through the drive circuit board 3a; of course, the surface mount structures are also It is not limited to a one-dimensional matrix arrangement. The surface mount structure 2a of the present embodiment still uses a passive matrix (PM) photoelectric structure as an example, and the passive driving circuit board 3a makes the electronic device 1a a passive matrix device.

As shown in FIG. 5A, the main difference from the surface mount structure 2 of the foregoing embodiment is that the surface mount structure 2a of FIG. The matrix shape of 2. In addition, the surface mount structure 2a further has four signal lines L1, L2, L3, and L4.

In FIG. 5A, the pattern circuit 22a not only includes four signal lines L1, L2, L3, and L4, but also includes a conductive pattern connected to each signal line L1, L2, L3, and L4. Among them, the signal lines L1 and L3 are horizontally arranged, and are interlaced with the longitudinally arranged signal lines L2 and L4 to define four pixels, and each pixel corresponds to a photoelectric element 24. In addition, the number of through holes 23 in this embodiment is four, and each through hole 23 (and the corresponding photoelectric element 24) corresponds to a signal line L1, L2, L3, L4, respectively. Among them, the four through holes 23 are all located inside the substrate 21 and not located on the peripheral edge S3 of the substrate 21. Therefore, compared with the prior art, the component placement density of the electronic device 1a can be increased under the premise of the same size.

In addition, as shown in FIG. 6, each connection pad group of the driving circuit board 3a of this embodiment has eight connection pads 311, 312,... 318. Taking the connection pad group in the upper left area A of FIG. 6 as an example, the four connection pads 311, 312, 317, and 318 respectively correspond to the four through holes 23 of the surface mount structure 2a. In this embodiment, the number of connection pads 311 to 318 (8) is greater than the number of through holes 23 (4), and the number of conductive elements 41 of each conductive element group is also the same as the number of through holes 23.

It is worth noting that in different embodiments, under the structure of maintaining the electrical connection between the surface mount structure and the driving circuit board, in the surface mount structure and the corresponding conductive element group, if the number of the conductive elements 41 is less than The number of through holes 23 means that there are more through holes 23 (more drilled holes), but fewer conductive elements 41, because it is not necessary to mount each through hole in each surface mount structure It is sufficient to provide conductive elements 41 in 23 to drive the corresponding photoelectric elements. Therefore, the number of the conductive elements 41 can be less than the number of the through holes 23, and at least two photoelectric elements share the same through hole on the same signal line. 23 and the design of the conductive element 41 corresponding to the aforementioned shared through hole 23, can reduce the manufacturing cost of the electronic device (because there is no need for so many processes for disposing the conductive element 41, the cost can be lower), while keeping the electronic device in The state of the same pixel (the same number of photoelectric elements 24). In order to achieve flexibility to meet the needs of different clients, those skilled in the art can choose conductive elements with the same number of through holes or less than through holes when the same number of surface mount structures are produced, as long as the surface mount can be maintained The structure is electrically connected to the driving circuit board, and the driving circuit board can be used to drive the optoelectronic elements on the surface mount structures. In addition, if the through hole is not provided with a conductive element, it is also possible to insert a conductive element for electrical connection reinforcement when a defect occurs in the aforementioned manufacturing process.

In addition, please refer to FIG. 5A and FIG. 6 again. In the surface mount structure 2a of this embodiment, the two upper (lateral) optoelectronic elements 24 electrically connected by the signal line L1 are 24 also shares the same through hole 23 and its corresponding conductive member 41 on the same signal line L1, and is electrically connected to the corresponding connection pad 311 of the driving circuit board 3a; the two lower sides electrically connected by the signal line L3 ( For the optoelectronic element 24 in the horizontal direction, the two optoelectronic elements 24 also share the same through hole 23 and the corresponding conductive member 41 on the same signal line L3, and the corresponding connection pad 317 of the driving circuit board 3a is electrically connected. connect.

In addition, taking the two left (longitudinal) photoelectric elements 24 electrically connected to the signal line L2 as an example, the two photoelectric elements 24 also share the same through hole 23 and the corresponding conductive member 41 on the same signal line L2. And the corresponding connection pad 312 of the driving circuit board 3a is electrically connected; and the two photoelectric elements 24 on the right side (longitudinal) electrically connected by the signal line L4, these two photoelectric elements 24 are also on the same signal line L4 The same through hole 23 and its corresponding conductive member 41 are shared to be electrically connected to the corresponding connection pad 318 of the driving circuit board 3a. With the configuration of these shared through holes 23, not only the component placement density of the electronic device 1a can be increased, but also the cost can be reduced (because there are fewer holes than the optoelectronic components 24 (pixels)).

In addition, FIG. 8A is a schematic diagram of the layout of the surface mount structure of another embodiment of the present invention, and FIG. 8B is a schematic diagram of the circuit of the surface mount structure of FIG. 8A. As shown in FIG. 8A and FIG. 8B, the surface mount structure 2b of this embodiment takes an active matrix (AM) photoelectric structure as an example, with an active driving circuit board (not shown), The composed electronic device becomes an active matrix device. In some embodiments, a plurality of surface mount structures 2b can be arranged in a two-dimensional matrix arrangement or other arrangements on the corresponding drive circuit board, so as to drive the optoelectronic elements of the surface mount structures 2b through the drive circuit board. twenty four.

As shown in FIG. 8A, the main difference from the surface mount structure 2a of the previous embodiment is that the surface mount structure 2b of this embodiment has nine photoelectric elements 24 arranged in a 3*3 matrix (a total of 9 Pixel). Among them, each photoelectric element 24 (each pixel) includes three light emitting diodes (LED) to form three sub-pixels. Each sub-pixel may include one light-emitting diode chip and three sub-pixels. The three light-emitting diodes in the pixel can be red, blue, and green LEDs to form a full-color pixel, thereby forming a full-color LED display.

Taking the pixel in the upper left corner of FIG. 8A as an example, the signal line of the pattern circuit 22b includes a plurality of signal lines Vscan and V-LED arranged horizontally and connected to adjacent pixels, and vertically arranged and connected to adjacent pixels The signal lines Vdata-R, Vdata-G, Vdata-B, VDD-R, VDD-G, VDD-B. In addition, the pattern circuit 22b may further include a thin film element, a circuit, and a conductive pattern connected to each signal line in the area B. Please refer to FIG. 8A for details. Wherein, the thin film circuit in the area B may include a 2T1C circuit structure as shown in FIG. 8B (not shown in FIG. 8A). In the 2T1C circuit structure of FIG. 8B, in addition to two transistors T3 and T4 and multiple signal lines, a capacitor C may also be included. For the connection relationship of the components of the 2T1C circuit architecture, refer to FIG. 8B, which will not be further described here. In different embodiments, the thin film circuit in the area B may also have other circuit structures, such as 4T2C or 5T1C.

Therefore, when the scan signal transmitted by the signal line Vscan turns on the transistor T3, the data signal can be transmitted to the gate of the transistor T4 through the signal line Vdata through the transistor T3, and the transistor T4 is turned on, so that the data voltage can pass through the signal line. VDD and transistor T4 are transmitted to the corresponding photoelectric element 24 to cause the photoelectric element 24 to emit light. Those skilled in the art can understand the operation principle and detailed process of each pixel according to the circuit structure of FIG. 8B and the component configuration of FIG. 8A, and no further description is provided here.

In addition, the number of through holes 23 of the pixel in the upper left corner of FIG. 8A is 4 (there are 24 through holes 23 in the entire surface mount structure 2b), and the corresponding conductive elements (not shown) provided in these through holes (Shown) and are respectively electrically connected to the corresponding driving circuit board (not shown) to drive the photoelectric element 24 of the surface mount structure 2b to emit light through the driving circuit board. In addition, the surface mount structure 2b of FIG. 8A also has a configuration in which the through hole 23 is shared.

The 24 through holes 23 of the surface mount structure 2b of this embodiment are all located on the inner side of the substrate 21, and are not located on the peripheral edge S3 of the substrate 21. In this way, the component placement density of the electronic device can also be increased on the premise of the same size, that is, the pixel of the electronic device of the same size can be increased. In addition, the number of conductive elements in each conductive element group of this embodiment is also the same as the number of through holes 23. In a different embodiment, under the structure that maintains the electrical connection between the surface mount structure 2b and the driving circuit board, in the surface mount structure 2b and the corresponding conductive element group, if the number of the conductive elements is smaller than the through holes The number of 23, that is, when there are more through holes 23 but fewer conductive elements, because there is no need to provide conductive elements in each through hole 23 in each surface mount structure 2b, it is enough to drive its corresponding Therefore, if the number of the conductive elements is less than the number of the through holes 23, the manufacturing cost of the electronic device can also be reduced.

In addition, the present invention also provides a manufacturing method of an electronic device, which may include: providing a plurality of surface mount structures, wherein each of the surface mount structures has a substrate, a patterned circuit, at least two through holes, and at least one photoelectric element. The substrate is defined with a first surface and a second surface opposite to each other; a patterned circuit is formed on the first surface of the substrate, the patterned circuit includes at least two signal lines; at least two through holes connect the first surface of the substrate and the first surface The second surface, and the at least two through holes respectively correspond to the at least two signal lines; at least one photoelectric element is disposed on the first surface of the substrate, and its two ends are respectively electrically connected to the at least two signal lines of the pattern circuit ( Step S01); Provide a driving circuit board, and make the second surface of the substrate of each surface mount structure respectively disposed on the surface of the driving circuit board having a plurality of connecting pad groups, wherein each of the connecting pad groups corresponds to Each of the surface mount structures has at least two connection pads, and the at least two connection pads respectively correspond to the at least two through holes of the surface mount structure (step S02); and, on the at least two through holes of the surface mount structure A conductive material is arranged in the two through holes to form at least two conductive elements, so that the at least two conductive elements extend to the first surface and the second surface of the substrate, and the at least two in each of the at least two through holes are electrically conductive Respectively electrically connecting the at least two signal lines of each of the surface mount structures to the at least two connection pads of each of the connection pad groups of the driving circuit board (step S03). Among them, the order of step S02 and step S03 can be interchanged. In other words, after the process of disposing the conductive material in step S03, the surface mount structures are respectively disposed on the driving circuit board.

Hereinafter, please refer to FIGS. 9A to 9H to describe the above-mentioned manufacturing method. 9A to 9H are schematic diagrams of the manufacturing process of an electronic device according to an embodiment of the invention. Here, the manufacturing method of the electronic device 1a in FIG. 7 is taken as an example. Those skilled in the art can deduce the manufacturing process of the electronic device in other embodiments from the manufacturing method of the electronic device 1a.

Hereinafter, the manufacturing process of the multiple surface mount structures 2a of the electronic device 1a will be introduced first.

As shown in FIG. 9A, first, a plurality of signal lines L1, L3 arranged side by side and laterally arranged in sequence on a large-area substrate 21, and conductive patterns connected to the signal lines L1, L3 are sequentially formed; then, on the substrate 21 A plurality of signal lines L2, L4 arranged side by side and longitudinally and a conductive pattern connected to each signal line L2, L4 are sequentially formed to obtain a plurality of pattern circuits 22a. Among them, in order to avoid short circuit between the signal lines L1, L3 and the signal lines L2, L4, it is necessary to cover the signal lines L1, L3 and their conductive patterns with an insulating layer ( Fig. 9A is not shown), and then the signal lines L2 and L4 and the conductive patterns connected to them are formed.

Here, the substrate 21 defines a first surface S1 and a second surface S2 opposite to each other, and the pattern circuit 22a is formed on the first surface S1. In some embodiments, the substrate 21 may be a rigid board or a soft board. If the substrate 21 is a flexible board, in order to make the subsequent components can be smoothly formed on the flexible board through the subsequent process, and to facilitate the operation of the flexible board, the flexible board can be formed on a rigid carrier first, and The rigid carrier board is removed in the subsequent steps. If the substrate 21 is a rigid board, this process is not required. The material of the substrate 21 can be glass, resin, metal or ceramic, or a composite material. Among them, the resin material is flexible and may contain organic polymer materials. The glass transition temperature (Tg) of the organic polymer materials may be between 250 degrees Celsius and 600 degrees Celsius, preferably The range may be between 300 degrees Celsius and 500 degrees Celsius, for example. With such a high glass transition temperature, a thin film process can be directly performed on the substrate 21 to form thin film transistors and other components or circuits in the subsequent process. The aforementioned organic polymer material can be a thermoplastic material, such as polyimide (PI), polyethylene (PE), polyvinylchloride (PVC), polystyrene (PS), acrylic (propylene , Acrylic, Fluoropolymer, polyester or nylon.

The material of the pattern circuit 22a may use a single-layer or multi-layer structure composed of metal (for example, aluminum, copper, silver, molybdenum, titanium) or an alloy thereof. Here, the patterned circuit 22a can be formed on the substrate 21 by, for example, a thin film process. The pattern circuit 22a can be directly formed on the substrate 21; or, the pattern circuit 22a can also be formed on the substrate 21 indirectly, for example, a buffer layer or an insulating layer is included between the two, which is not limited. The aforementioned thin film process may include a low temperature polysilicon (LTPS) process, an amorphous silicon (a-Si) process, or a metal oxide (such as IGZO) semiconductor process, etc., and the present invention is not limited.

As shown in FIG. 9B, a plurality of connection pad groups (connection pads P1, P2) are formed on the conductive patterns corresponding to the respective signal lines L1, L2. The material of the connection pads P1 and P2 is, for example, but not limited to, copper, silver, or gold, or a combination thereof, or other suitable conductive materials. In some embodiments, in order to fabricate thicker connection pads P1 and P2, methods such as electroplating, printing, or evaporation and lift-off patterning can be used to fabricate the connection pads P1 and P2.

As shown in FIG. 9C, the substrate 21 is then selectively drilled to form a plurality of through holes 23, wherein each through hole 23 communicates with the first surface S1 and the second surface S2 of the substrate 21, and the same The holes 23 respectively correspond to the signal lines L1 to L4. In some embodiments, in the step of providing a plurality of surface mount structures, it may further include: making each signal line L1 to L4 of the surface mount structure 2a correspond to a plurality of through holes 23 with a number greater than two. By sharing the through holes 23, not only the arrangement density of the components of the electronic device can be increased, but also the cost can be reduced. It is worth mentioning that the sequence of making the connection pads P1 and P2 and the selective drilling can be reversed.

As shown in FIG. 9D, next, a process of arranging the optoelectronic element 24 is performed, so that a plurality of optoelectronic elements 24 are respectively arranged on the corresponding connection pads P1, P2, so that both ends of the optoelectronic element 24 can pass through the connection pads P1, P2, respectively. It is electrically connected to the signal lines L1 ˜ L4 corresponding to the pattern circuit 22.

Then, as shown in FIG. 9E, a cutting process is performed to obtain a plurality of surface mount structures 2a. The structure of the surface mount structure 2a of FIG. 9E is the same as that of FIG. 5A, and the detailed technical content can refer to the above-mentioned FIG. 5A to FIG. 5E and the corresponding description, which will not be repeated here. In some embodiments, the step of providing a plurality of surface mount structures 2a may further include: configuring each surface mount structure 2a with a plurality of optoelectronic elements 24, wherein each optoelectronic element 24 includes one or more wafers. It is worth noting that the cutting process is not limited to occur after FIG. 9D, and it can also occur after FIG. 9A, FIG. 9B, or FIG.

After that, the surface mount structures 2a of FIG. 9E are sequentially arranged on the driving circuit board 3a of FIG. 9F. However, before the surface mount structures 2a are sequentially arranged on the drive circuit board 3a, in order to pre-fix the surface mount structures 2a, please refer to FIG. 9F again. In the step of providing the drive circuit board 3a, It may further include: forming a plurality of adhesive members 5 on the surface of the driving circuit board 3a with a plurality of connecting pad groups, and making each adhesive member 5 correspond to and positioning each surface mount structure 2a to the driving circuit board 3a. Here, each adhesive member 5 is, for example, red glue, so as to (temporarily) fix each surface mount structure 2a on the driving circuit board 3a (FIG. 9G). After that, as shown in FIG. 9H, the conductive material setting process is performed in the through hole 23. Here, the conductive elements 41 can be formed by spraying conductive materials on the through holes 23, so that the conductive elements 41 can respectively extend to the first surface S1 and the second surface S2 of the substrate 21 (as shown in FIG. 9I ), after the reflow process is performed, each surface mount structure 2a is electrically connected to the driving circuit board 3a. Wherein, the conductive material may include, but is not limited to, solder paste, silver glue, or anisotropic conductive glue, or a combination thereof, or other suitable materials, and is not limited. In this embodiment, the conductive elements 41 are formed in the through holes 23 by selectively jetting conductive materials. In addition to the spray printing process, in different embodiments, methods such as dispensing, sputtering, or electroplating can also be used to provide conductive materials, which are not limited. In some embodiments, the step of disposing a conductive material may further include: selectively spraying conductive material in the through holes 23 to form the conductive members 41, so that the number of the conductive members 41 is smaller than the number of the conductive members 41. By equalizing the number of through holes 23, the manufacturing cost of the electronic device can be reduced.

It should be noted that, in FIG. 9G, because the conductive material (conductive member 41) has not been disposed in the through hole 23, the manufacturing method may further include: attaching the conductive material to each surface before or after the step of disposing the conductive material. The substrate 21 of the mounting structure 2a is discontinuously covered with an encapsulation layer (or a protective layer/or an insulating layer, not shown) to cover the optoelectronic elements 24, but the encapsulation layer cannot cover the through holes 23 (so that it can be filled Into conductive materials). Among them, the encapsulation layer can be covered on the optoelectronic element 24 and the pattern circuit 22a by resin transfer molding (Resin Transfer Molding) or sealant dispensing or other appropriate methods to protect the optoelectronic element 24 and the pattern circuit 22a from foreign matter and subsequent Process destruction. In addition, in some embodiments, after the step of arranging conductive materials to form the conductive elements 41, it may further include: continuously or discontinuously covering the substrate 21 of each surface mount structure 2a with an encapsulation layer to cover Each photoelectric element 24. Here, since the arrangement process of the conductive member 41 has been performed in FIG. 9H, the encapsulation layer can be used to protect the components, patterns or circuits (including through holes 23) on the first surface S1 of the substrate 21 of each surface mount structure 2a. Damaged by foreign objects and subsequent manufacturing processes.

Please refer to FIG. 10A and FIG. 10B, where FIG. 10A and FIG. 10B are respectively a schematic diagram of a partial manufacturing process of an electronic device 1c according to another embodiment of the present invention.

For ease of understanding, FIG. 10A is used as a continuation of FIG. 9D. After FIG. 9D, the substrate 21 on which the pattern circuit 22a, the connection pads P1, P2, the through holes 23, etc. are arranged is also subjected to a cutting process, but it is similar to that shown in FIG. 9E. The difference is that in this embodiment, the substrate 21 can be cut close to the size of the driving circuit board; here, the driving circuit board in FIG. 10A may be the driving circuit board 3a in FIG. 6 or FIG. 9F. Therefore, the size of the surface mount structure 2a of FIG. 9G is much smaller than the size of the drive circuit board 3a, and a plurality of surface mount structures 2a are arrayed on the drive circuit board 3a; while in this embodiment of FIG. 10A, it is The single surface mount structure 2c is correspondingly arranged on the drive circuit board 3a (in this embodiment, the size of the drive circuit board 3a is slightly larger than the surface mount structure 2c). However, the cutting of the substrate 21 can also be performed between the two steps in FIGS. 9A to 9E, as long as the final surface mount structure 2c and the driving circuit board 3a are in a one-to-one configuration.

Similarly, in order to pre-fix the surface mount structure 2c, at least one adhesive member 5 can be preset on the driving circuit board 3a, and the process of selectively placing conductive materials in the through holes 23c as shown in FIG. 10B is performed, such as As mentioned above, the method of selectively disposing the conductive material by spraying on the through holes 23c and the subsequent reflow process can be used to form the conductive elements 41c. In this embodiment, the number of the surface mount structure 2c, the connection pad group, and the conductive element group corresponding to each other is one. The surface mount structure 2c has a plurality of through holes 23c, and the connection pad group has a plurality of connection pads. The conductive element group has a plurality of conductive elements 41c; the implementation and arrangement and combination of the foregoing three are also similar to the foregoing several embodiments. For example, the through hole 23c can also be selected not to be located on the periphery of the substrate 21, and the number of conductive elements 41c is equivalent. The number of through holes 23c and the surface mount structure 2c are provided with a number of signal lines greater than two and a plurality of photoelectric elements 24, and each signal line corresponds to a number of through holes 23c greater than two. Among them, at least two photoelectric elements The components 24 share the same through hole 23c and the conductive member 41c corresponding to the aforementioned shared through hole 23c on the same signal line. In addition, the through holes 23c in FIGS. 10A and 10B have been configured with the minimum number of through holes. However, in some implementations where the number of through holes is not configured at the minimum number, the number of conductive members 41c can be selected to be less than the number of through holes 23c.

It is worth noting that the size of the aforementioned substrate 21 and the size of the drive circuit board 3a are close to each other in at least one direction; for example, the substrate 21 may be slightly longer, shorter or the same in an X-axis direction compared to the drive circuit board 3a. As shown in the embodiment of FIG. 10A and FIG. 10B, the driving circuit board 3a and the substrate 21 define two side edges 30a and 210 along the X axis, respectively. The two opposite side edges 210 of the substrate 21 are slightly shorter than the drive along the X axis. Two opposite side edges 30a of the circuit board 3a, but not limited to this. In other words, the driving circuit board and the substrate respectively define at least one side edge along at least one direction, and the side edge of the driving circuit board and the side edge of the substrate define a distance, and the distance may be zero or not zero. Both sides of the drive circuit board and the substrate along the X-axis (or Y-axis) direction can be defined. It should be noted that the distance between one side edge of the drive circuit board and one side edge of the substrate is not limited to be consistent or symmetrical; When the distance between one side edge of the circuit board and one side edge of the substrate is zero, the two side edges are aligned with each other.

In addition, the number of the aforementioned optoelectronic elements is multiple, and the optoelectronic elements can define a pixel pitch. If the distance between one side edge of the driving circuit board and one side edge of the substrate is less than a predetermined distance, for example, less than X When the pixel pitch is twice as large as the axis (or Y axis), it can be beneficial to splicing with another electronic device with the same or similar structure; for example, in some embodiments, multiple electronic devices along the X axis (and along the Y axis) ) Directions are spliced with each other, one of the electronic devices is along the X axis, and the distance between one side edge of the driving circuit board and one side edge of the substrate is less than 2 times the pixel, and the other electronic device spliced with the previous electronic device is also along X In the axial direction, it is also assumed that the distance between one side edge of the driving circuit board and one side edge of the substrate is smaller than twice the pixel pitch, and the pixel pitch between the two electronic devices is smaller than twice the pixel pitch of each electronic device.

11A and 11B are respectively partial enlarged schematic diagrams of an electronic device according to another embodiment of the invention. As shown in FIG. 11A, the main difference between the surface mount structure 2c of this embodiment and the previous embodiment is that the surface mount structure 2d of FIG. The pads L1d and L2d are provided with a primary conductive member 42d above the through hole 23d after the conductive material (conductive member 41d) is placed in the through hole 23d, and the secondary conductive member 42d can be connected to the through hole 23d, the conductive pad L1d (or At the same time, it is at least partially overlapped with the through hole 23d and the conductive pad L2d), and the secondary conductive member 42d is electrically connected to the conductive member 41d and the conductive pad L1d (conductive pad L2d) at the same time by using, for example, a reflow process. The secondary conductive member 42d can Providing the conductive member 41d with an appropriate force reduces the probability that the conductive member 41d shrinks in the through hole 23 and is difficult to be electrically connected to the conductive pad L1d (conductive pad L2d) effectively. In some embodiments, the secondary conductive member 42d may be a micro-resistor, for example, a micro-resistor with a size of 0402 (0.04 inches * 0.02 inches). In some embodiments, the number of secondary conductive elements 42d can be configured according to the number of conductive elements 41d. In addition, in some embodiments, as shown in FIG. 11B, the surface mount structure 2e is on the substrate 21, each through hole 23e is respectively adjacent to the conductive pads L1e, L2e extended by at least two signal lines, and the secondary conductive member 42e is at least partially The overlapped through hole 23e is electrically connected to the conductive electrical sheet L1e (conductive gasket L2e), and the secondary conductive element 42e is electrically connected to the conductive element 41e and the conductive gasket L1e (conductive gasket L2e) at the same time, respectively.

In summary, in the electronic device and the manufacturing method thereof of the present invention, at least one surface mount structure is connected to the drive circuit board through at least one conductive element group, and the number of the surface mount structure and the drive circuit board can be configured in multiple pairs. One, one-to-one, or even a one-to-many configuration under certain considerations. Each surface mount structure has a substrate, a patterned circuit, at least two through holes, and at least one photoelectric element. The patterned circuit includes at least two signal lines, at least two through holes communicate with the first surface and the second surface of the substrate, and at least two through holes are respectively Corresponding to at least two signal lines, at least one photoelectric element is disposed on the first surface of the substrate, and its two ends are respectively electrically connected to at least two signal lines of the pattern circuit; the connecting pad group of the driving circuit board has at least two connecting pads, and at least two connecting pads The pads respectively correspond to at least two through holes of the surface mount structure. At least two conductive elements of each conductive element group are correspondingly arranged in the at least two through holes in the surface mount structure and extend to the first surface and the second surface of the substrate; wherein, at least two conductive elements arranged in the at least two through holes The at least two signal lines of the surface mount structure are respectively electrically connected to the at least two connection pads of the connection pad group of the driving circuit board. The surface mount structure and the drive circuit board that are made by individual processes and are independent of each other. Through the implementation of the present invention and its equivalent implementation aspects, the surface mount structure and the drive circuit board can be arranged and combined in various numbers. The flexibility of matching with each other is quite large; at the same time, because the surface mount structure and the driving circuit board are independent of each other and not limited to the same manufacturing process, for example, the cost can be reduced by avoiding the steps of reopening the photomask due to different designs. The electronic device and the manufacturing method of the present invention are different from the traditional surface mount component and the driving circuit board electrical connection technology.

In addition, independent surface mount structures and drive circuit boards, such as surface mount structures made of polyimide substrates, and drive circuit boards based on FR4 epoxy resin, can be combined with each other. At the same time, it combines the advantages of precision manufacturing on the polyimide substrate and the mechanical strength (robustness) of the epoxy resin drive circuit board; among them, the advantages of the combination of independent heterogeneous materials, when the size of the substrate and the size of the drive circuit board are close (For example, in at least one direction, the side edge of the drive circuit board and the side edge of the substrate are close to each other), this advantage is more prominent.

In addition, the electronic device can be provided with a secondary conductive member or a secondary conductive gasket connected to the secondary conductive member. The secondary conductive member can provide an appropriate force to the conductive member, reducing the shrinkage of the conductive member in the through hole and making it difficult to effectively electrically connect to the Probability of conductive gaskets.

In addition, in some embodiments of the present invention, the configuration of the common through holes of the surface mount structure can not only increase the component placement density of the electronic device, but also reduce the cost of the electronic device. In addition, in some embodiments of the present invention, the number of the conductive elements passing through the electronic device is smaller than the number of the through holes of the surface mount structure, which can also reduce the cost of the electronic device.

It is worth noting that the electronic device of the present invention is not limited to the number of conductive component groups, surface mount structures, and drive circuit boards. The measure words or antecedent basis of each component are not limited to " "At least one" or "one" is limited. The "one" in the present invention should be understood as "one" or "at least one". Therefore, in order to facilitate reading and understanding, the present invention uses a quantifier or a precedent basis "one". The various embodiments are described, but are not limited to the understanding of the various embodiments. In other words, the present invention can also expand various embodiments with "at least one". For example, the electronic device of the present invention includes at least one surface mount structure, at least one driving circuit board, and at least one conductive element group. At least one surface mount structure has a substrate, a patterned circuit, at least two through holes, and at least one photoelectric element. The substrate defines a first surface and a second surface opposite to each other. The pattern circuit is arranged on the first surface of the substrate, and the pattern circuit includes at least two signal lines. At least two through holes communicate with the first surface and the second surface of the substrate, and at least two through holes respectively correspond to at least two signal lines. At least one photoelectric element is arranged on the first surface of the substrate, and its two ends are respectively electrically connected to at least two signal lines of the pattern circuit. The at least one driving circuit board includes at least one connection pad group, the at least one connection pad group corresponds to at least one surface mount structure, and the second surface of the substrate of the at least one surface mount structure is disposed on the at least one driving circuit board and has at least one connection On the surface of the pad group, at least one connection pad group has at least two connection pads, and the at least two connection pads respectively correspond to at least two through holes of the at least one surface mount structure. At least one conductive element group corresponds to at least one surface mount structure, at least one conductive element group has at least two conductive elements, and at least two conductive elements are correspondingly provided in at least two through holes in at least one surface mount structure and extend to the substrate A first surface and a second surface; wherein, at least two conductive members disposed in at least two through holes respectively electrically connect at least two signal lines of at least one surface mount structure to at least one connection pad group of at least one drive circuit board At least two connection pads.

The above descriptions are merely illustrative and not restrictive. Any equivalent modifications or alterations that do not depart from the spirit and scope of the present invention should be included in the scope of the appended patent application.

1,1a,1b,1c,1d,1e: electronic device 2, 2a, 2b, 2c, 2d, 2e: surface mount structure 21: substrate 22, 22a, 22b: pattern circuit 23, 23c, 23d, 23e: through hole 24: Optoelectronics 210, 30a: side edge 3,3a: drive circuit board 31: Connecting pad group 311～318: Connecting pad 41, 41c, 41d, 41e: conductive parts 42d, 42e: secondary conductive parts 5: Adhesive parts 1B-1B, 1C-1C, 5B-5B, 5C-5C, 5D-5D, 5E-5E, 9I-9I: cut surface A, B: area C: Capacitance L1, L2, L3, L4, Vdata, Vdata-R, Vdata-G, Vdata-B, VDD, VDD-R, VDD-G, VDD-B, V-LED, Vscan: signal line L1d, L2d, L1e, L2e: conductive gasket P1, P2: connection pad S1: First surface S2: second surface S3: Perimeter T1, T2: Wire T3, T4: Transistor

FIG. 1A is a schematic diagram of the layout of a surface mount structure according to an embodiment of the present invention. Fig. 1B and Fig. 1C respectively show a schematic cross-sectional view of Fig. 1A along the 1B-1B cutting line and the 1C-1C cutting line. FIG. 2 is a schematic diagram of the layout of a driving circuit board according to an embodiment of the present invention. FIG. 3 is a schematic diagram of the layout of an electronic device according to an embodiment of the invention. 4A and 4B are respectively schematic diagrams of the layout of the surface mount structure of different embodiments of the present invention. FIG. 5A is a schematic diagram of the layout of a surface mount structure according to another embodiment of the present invention. Figures 5B to 5E respectively show schematic cross-sectional views of Figure 5A along the 5B-5B cutting line, 5C-5C cutting line, 5D-5D cutting line, and 5E-5E cutting line. FIG. 6 is a schematic diagram of the layout of a driving circuit board according to another embodiment of the present invention. FIG. 7 is a schematic diagram of the layout of an electronic device according to another embodiment of the present invention. FIG. 8A is a schematic diagram of the layout of a surface mount structure according to another embodiment of the present invention. FIG. 8B is a schematic circuit diagram of the surface mount structure of FIG. 8A. 9A to 9H are schematic diagrams of the manufacturing process of an electronic device according to an embodiment of the invention. Fig. 9I shows a schematic cross-sectional view of Fig. 9H along the line 9I-9I. 10A and 10B are respectively schematic diagrams of a partial manufacturing process of an electronic device according to another embodiment of the present invention. 11A and 11B are respectively partial enlarged schematic diagrams of an electronic device according to another embodiment of the invention.

1: Electronic device

2: Surface mount structure

21: substrate

22: pattern circuit

23: Through hole

24: Optoelectronics

3: drive circuit board

41: Conductive parts

L1, L2: signal line

P1, P2: connection pad

S1: First surface

S3: Perimeter

T1, T2: Wire

Claims (19)

An electronic device, including: Multiple surface mount structures, each of which has: A substrate, defined with a first surface and a second surface opposite to each other; A pattern circuit arranged on the first surface of the substrate, the pattern circuit including at least two signal lines; At least two through holes connecting the first surface and the second surface of the substrate, and the at least two through holes respectively correspond to the at least two signal lines; and At least one photoelectric element is disposed on the first surface of the substrate, and its two ends are respectively electrically connected to the at least two signal lines of the pattern circuit; A drive circuit board includes a plurality of connection pad groups, each of the connection pad groups corresponds to each of the surface mount structures, and the second surface of the substrate of each of the surface mount structures is disposed on the drive circuit board. The surface of the connection pad group, each of the connection pad groups has at least two connection pads, and the at least two connection pads respectively correspond to the at least two through holes of the surface mount structure; and A plurality of conductive element groups corresponding to the surface mount structures, each of the conductive element groups has at least two conductive elements, and the at least two conductive elements are corresponding to the at least two through holes provided in the surface mount structure and extend to The first surface and the second surface of the substrate; wherein the at least two conductive members disposed in each of the at least two through holes respectively electrically connect the at least two signal lines of each of the surface mount structures to the driving circuit The at least two connecting pads of the connecting pad group of each board. An electronic device, including: A surface mount structure with: A substrate, defined with a first surface and a second surface opposite to each other; A pattern circuit arranged on the first surface of the substrate, the pattern circuit including at least two signal lines; At least two through holes connecting the first surface and the second surface of the substrate, and the at least two through holes respectively correspond to the at least two signal lines; and At least one photoelectric element is disposed on the first surface of the substrate, and its two ends are respectively electrically connected to the at least two signal lines of the pattern circuit; A drive circuit board includes a connection pad group corresponding to the surface mount structure, and the second surface of the substrate of the surface mount structure is disposed on the surface of the drive circuit board with the connection pad group , The connection pad group has at least two connection pads, and the at least two connection pads respectively correspond to the at least two through holes of the surface mount structure; and A conductive element group corresponding to the surface mount structure, the conductive element group has at least two conductive elements, and the at least two conductive elements correspond to the at least two through holes provided in the surface mount structure and extend to the substrate The first surface and the second surface; wherein, the at least two conductive elements disposed in the at least two through holes respectively electrically connect the at least two signal lines of the surface mount structure to the connection pad of the driving circuit board The at least two connecting pads of the group. The electronic device according to claim 1 or 2, wherein the material of the conductive member includes solder paste, copper paste, or silver paste, or a combination thereof. The electronic device according to claim 1, further comprising: A plurality of adhesive pieces are arranged between the surface mount structures and the driving circuit board, and each of the adhesive pieces is arranged corresponding to each of the surface mount structures. The electronic device according to claim 2, further including: At least one adhesive part is arranged between the surface mount structure and the driving circuit board. The electronic device according to claim 1 or 2, wherein the driving circuit board and the substrate respectively define a side edge along a direction, and the side edge of the driving circuit board and the side edge of the substrate define a distance. The electronic device according to claim 6, wherein the number of the optoelectronic elements is multiple, and the optoelectronic elements define a pixel pitch; the distance between the side edge of the driving circuit board and the side edge of the substrate is along the The direction is less than 2 times the pixel pitch. The electronic device according to claim 1 or 2, further including: The primary conductive element at least partially overlaps the through hole and is electrically connected to the conductive element located in the through hole and a conductive pad extending from each of the signal lines. The electronic device according to claim 1 or 2, wherein the substrate of the surface mount structure further defines a peripheral edge connecting the first surface and the second surface, and the at least two through holes are not located on the peripheral edge of the substrate . The electronic device according to claim 1 or 2, wherein in the surface mount structure and the corresponding conductive element group, the number of the conductive elements is less than the number of the through holes. The electronic device according to claim 1 or 2, wherein the surface mount structure is configured with a number of signal lines greater than two and a plurality of photoelectric elements, and each signal line corresponds to a number of through holes greater than two, wherein At least two photoelectric elements share the same through hole and its corresponding conductive element on the same signal line. The electronic device according to claim 1 or 2, wherein the at least one optoelectronic element of the surface mount structure includes a chip or a package, and the chip or the package includes one or more light-emitting diodes, one or Multiple sub-millimeter light emitting diodes, one or more micro light emitting diodes, or one or more image sensors, or a combination thereof. The electronic device according to claim 1 or 2, wherein the pattern circuit in the surface mount structure includes a thin film circuit or a thin film element. A manufacturing method of an electronic device, including: A surface mount structure is provided, wherein the surface mount structure has: A substrate, defined with a first surface and a second surface opposite to each other; A pattern circuit formed on the first surface of the substrate, the pattern circuit including at least two signal lines; At least two through holes connecting the first surface and the second surface of the substrate, and the at least two through holes respectively correspond to the at least two signal lines; and At least one photoelectric element is disposed on the first surface of the substrate, and its two ends are respectively electrically connected to the at least two signal lines of the pattern circuit; A drive circuit board is provided, and the second surface of the substrate of the surface mount structure is respectively arranged on the surface of the drive circuit board with a connection pad group, wherein the connection pad group corresponds to the surface mount structure and has at least Two connection pads, the at least two connection pads respectively corresponding to the at least two through holes of the surface mount structure; and A conductive material is provided in the at least two through holes of the surface mount structure to form at least two conductive elements, so that the at least two conductive elements extend to the first surface and the second surface of the substrate, and the at least two The at least two conductive elements in the through hole respectively electrically connect the at least two signal lines of the surface mount structure to the at least two connection pads of the connection pad group of the driving circuit board. The manufacturing method according to claim 14, wherein the step of providing the surface mount structure further includes: The substrate in the surface mount structure is further defined with a peripheral edge connecting the first surface and the second surface, and the at least two through holes are not arranged on the peripheral edge of the substrate. The manufacturing method according to claim 14, wherein: In the step of providing the surface mount structure, it further includes: So that each of the signal lines of the surface mount structure corresponds to a plurality of through holes with a number greater than two; and In the step of setting a conductive material, it further includes: The conductive material is selectively sprayed in the through holes, so that the number of the conductive parts is smaller than the number of the through holes. The manufacturing method according to claim 14, wherein: In the step of providing the surface mount structure, it further includes: Configuring the surface mount structure with a plurality of optoelectronic elements, wherein each of the optoelectronic elements includes one or more chips; and Before or after the step of setting a conductive material, it further includes: An encapsulation layer is discontinuously covered on the substrate of the surface mount structure to cover each of the photoelectric elements, and the encapsulation layer does not cover the at least two through holes. The manufacturing method according to claim 14, wherein: In the step of providing the surface mount structure, it further includes: Configuring the surface mount structure with a plurality of the optoelectronic elements, wherein each of the optoelectronic elements includes one or more chips; and After the step of setting a conductive material, it further includes: The substrate of the surface mount structure is continuously or discontinuously covered with an encapsulation layer to cover each of the optoelectronic elements. The manufacturing method according to claim 14, wherein: In the step of providing a driving circuit board, it further includes: At least one adhesive member is formed on the driving circuit board, and the at least one adhesive member corresponds to and positions the surface mount structure to the driving circuit board.

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