CN116031354A

CN116031354A - Display device

Info

Publication number: CN116031354A
Application number: CN202111239231.4A
Authority: CN
Inventors: 孙明晓; 刘永锋; 林昌廷; 刘晓伟; 张廷斌
Original assignee: Hisense Visual Technology Co Ltd
Current assignee: Hisense Visual Technology Co Ltd
Priority date: 2021-10-25
Filing date: 2021-10-25
Publication date: 2023-04-28

Abstract

The invention discloses a display device, comprising: the LED driving device comprises a driving substrate, a light emitting chip arranged on the driving substrate and a packaging layer covering the light emitting chip and the driving substrate. The driving substrate comprises at least one driving chip, the driving chip is packaged in the driving substrate, a packaging shell is not required to be arranged for the driving chip, the size of the driving chip is effectively reduced, and after the distance between the light emitting chips is reduced, the requirement of high-density driving chip arrangement can be met. The driving chip is in circuit connection with the driving substrate in the driving substrate, only the side, deviating from the light-emitting chip, of the driving substrate is used for connecting circuit auxiliary elements, the occupied space of the driving chip is not required to be reserved, the problem that the arrangement space of the back of the driving substrate is insufficient is solved, and the difficulty of pasting is reduced.

Description

Display device

Technical Field

The invention relates to the technical field of display, in particular to a display device.

Background

The light emitting diode (Light Emitting Diode, abbreviated as LED) display technology refers to a display technology using an LED light emitting device directly as a display unit. The LED has the characteristics of high efficiency, high brightness, high reliability, quick response time and the like, has the characteristic of self-luminescence without a backlight source, has the advantages of energy conservation, simple mechanism, small volume, thinness and the like, ensures that the permeability of the LED display device in a display product is higher and higher, and is particularly suitable for being used as an oversized spliced display product.

Currently, packaging technologies such as COB (Chip On Board), COG (Chip On Glass), SMD (Surface Mounted Devices, SMD), and IMD (Integrated Matrix Devices, IMD) may be used for packaging the LED. Wherein, COG can cause splice joints in tiled display devices; SMD and IMD technologies are limited in package size and cannot achieve the reduction of the pitch of the light emitting chips, so COB packaging schemes are generally used for high resolution display devices at present.

In the related art, a light emitting chip is generally connected to an upper surface of a driving substrate, and driving and compensating elements are connected to a lower surface thereof. Even with COB packages, the pitch of the light emitting chips cannot be further reduced due to the limited package size of the driving element.

Disclosure of Invention

In some embodiments of the present invention, a display device includes: the LED driving device comprises a driving substrate, a light emitting chip arranged on the driving substrate and a packaging layer covering the light emitting chip and the driving substrate. The driving substrate comprises at least one driving chip, the driving chip is packaged in the driving substrate, a packaging shell is not required to be arranged for the driving chip, the size of the driving chip is effectively reduced, and after the distance between the light emitting chips is reduced, the requirement of high-density driving chip arrangement can be met. The driving chip is in circuit connection with the driving substrate in the driving substrate, only the side, deviating from the light-emitting chip, of the driving substrate is used for connecting circuit auxiliary elements, the occupied space of the driving chip is not required to be reserved, the problem that the arrangement space of the back of the driving substrate is insufficient is solved, and the difficulty of pasting is reduced.

In some embodiments of the present invention, the driving substrate includes an upper circuit board and a lower circuit board disposed opposite to each other, a set distance is provided between the upper circuit board and the lower circuit board, and at least one driving chip is encapsulated between the upper circuit board and the lower circuit board. The driving substrate further comprises filling glue filled in a gap between the upper circuit board and the lower circuit board for packaging and protecting the driving chip.

In some embodiments of the present invention, the upper circuit board and the lower circuit board are both PCBs, and may be double-layer boards or multi-layer boards.

In some embodiments of the present invention, an upper layer circuit board includes: the first bonding pad, the second bonding pad and the first pin. The first bonding pad is positioned on the surface of one side of the upper circuit board, which is away from the lower circuit board, and is used for connecting the light-emitting chip; the second bonding pad is positioned on the surface of the upper circuit board surface towards one side of the lower circuit board and is used for connecting with the driving chip; the first pin is positioned on the surface of the upper circuit board surface facing to one side of the lower circuit board and is used for receiving external signals.

In some embodiments of the present invention, the lower circuit board includes: the second pin, the third pin and the third bonding pad. The second pins are positioned on the surface of the lower circuit board surface facing to one side of the upper circuit board, the second pins correspond to the first pins, and the second pins are interconnected with the corresponding first pins through alloy balls; the third pin is positioned on the surface of one side of the lower circuit board, which is away from the upper circuit board, and is used for receiving external signals and transmitting the external signals to the upper circuit board through the second pin; and the third bonding pad is positioned on the surface of one side of the lower circuit board, which is away from the upper circuit board, and is used for connecting with the circuit auxiliary element.

In some embodiments of the invention, the circuit auxiliary elements include resistors, capacitors, inductors, and the like.

In some embodiments of the present invention, the third pin in the lower circuit board includes: a pin for transmitting a power signal, a pin for transmitting a clock signal, a pin for transmitting a data signal, and a pin for transmitting a ground signal.

In some embodiments of the present invention, a light emitting chip includes: red light emitting chips, green light emitting chips, and blue light emitting chips. Wherein, the red light emitting chip, the green light emitting chip and the blue light emitting chip are repeatedly arranged according to a set sequence to form a matrix structure. The red light emitting chip is used as a red sub-pixel, the green light emitting chip is used as a green sub-pixel, and the blue light emitting chip is used as a blue sub-pixel. Adjacent one red light emitting chip, one green light emitting chip, and one blue light emitting chip constitute one pixel unit, thereby performing full-color image display.

In some embodiments of the present invention, the light emitting chip may also be a stacked chip; the laminated chip comprises a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer which are arranged in a laminated mode. The red light emitting layer, the green light emitting layer, and the blue light emitting layer in one stacked chip can be controlled individually, and thus one stacked chip can perform full-color image display as one pixel unit. Since the light emitting layers in the stacked chips are stacked in the vertical direction, the size of the chips is larger in the same pixel unit size, thereby having higher light emitting luminance. In addition, the laminated chip only needs to be transferred once when transferring a large amount of chips, so that the transfer times can be reduced, and the transfer efficiency can be improved.

In some embodiments of the present invention, the driving substrate having a plurality of driving chips packaged therein may be divided into a plurality of functional units, and at least one driving chip may be packaged inside the driving substrate in each of the functional units, and each of the functional units may be separately fabricated. The display device further comprises a driving backboard, and the plurality of functional units are positioned on the same side of the driving backboard and are electrically connected with the driving backboard. The drive backboard also needs to be provided with a circuit, and after each functional unit is connected to the drive backboard, the circuit interconnection of the functional unit and the drive backboard can be realized. Therefore, the processing difficulty of the driving substrate in each functional unit can be reduced, and higher yield is ensured. Meanwhile, the large-size driving backboard only needs to be simply wired to connect all the functional units, and the manufacturing difficulty of the large-size driving backboard is reduced. The driving backboard can adopt a double-layer board, each functional unit is connected to one surface of the driving backboard, and the circuit auxiliary element is connected to one surface of the driving backboard, which is away from the functional unit.

In some embodiments of the present invention, the driving back plate may be a PCB, and only a simple wiring design is required, i.e., the processing difficulty is small.

In some embodiments of the invention, the driving backboard can adopt a glass substrate with double-sided copper coating, the glass substrate can adopt a dry etching process, and meanwhile, the thickness precision of the glass is controllable, so that the superior size precision and thickness precision of the bonding pad can be ensured, and good splicing is realized.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic cross-sectional view of a related art display device;

FIG. 2 is a schematic diagram of a driving chip in the related art;

FIG. 3 is a schematic cross-sectional view of a display device according to an embodiment of the present invention;

fig. 4 is a schematic cross-sectional structure of a driving substrate according to an embodiment of the present invention;

fig. 5a is a schematic view of a partial planar structure of a display device according to an embodiment of the present invention;

fig. 5b is a schematic diagram of a partial bottom structure of a display device according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a cross-sectional structure of a display device according to an embodiment of the invention;

FIG. 7 is a third schematic cross-sectional view of a display device according to an embodiment of the invention;

fig. 8 is a schematic cross-sectional view of a display device according to an embodiment of the invention.

The LED chip comprises a 1-functional unit, a 2-driving backboard, a 10-driving baseplate, a 20-light emitting chip, a 30-packaging layer, 40, 41-driving chips, a 21-red light emitting chip, a 22-green light emitting chip, a 23-blue light emitting chip, a 101-upper circuit board, a 102-lower circuit board, 103-filling glue, 104-alloy balls, 201-red light emitting layers, 202-green light emitting layers, 203-blue light emitting layers, 401-chip bare chips, 402-packaging shells, 1011-first circuit layers, 1021-second circuit layers, s 1-first bonding pads, s 2-second bonding pads, s 3-third bonding pads, p 1-first pins, p 2-second pins and p 3-third pins.

Detailed Description

In order that the above objects, features and advantages of the invention will be readily understood, a further description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus a repetitive description thereof will be omitted. The words expressing the positions and directions described in the present invention are described by taking the drawings as an example, but can be changed according to the needs, and all the changes are included in the protection scope of the present invention. The drawings of the present invention are merely schematic representations of relative positional relationships and are not intended to represent true proportions.

The LED display device may be packaged by COB, COG, SMD, IMD, or the like.

The tiled display device needs to splice a plurality of display panels, and a Chip On Glass (COG) packaging mode is applied to the situation that the driving substrate is a Glass plate, when the Glass plate is adopted, the driving Chip is usually required to be bound to the side edge of the Glass plate, so that obvious splice seams between the display panels can be generated.

The packaging technology of the surface-mounted device (Surface Mounted Devices, abbreviated as SMD) is to package the light-emitting chip in a packaging support, wherein a patch electrode is arranged on the bottom surface of the packaging support, and the packaged light-emitting chip is electrically connected with the driving substrate in a patch mode.

The packaging technology of the matrix integrated packaging device (Integrated Matrix Devices, abbreviated as IMD) is to package a plurality of light emitting chips arranged in an array in a packaging bracket, and then attach the packaged light emitting chip array to a driving substrate.

However, the SMD or IMD has a package support, so that the size of the package structure cannot be reduced without limitation, and if the light emitting chip and the package support thereof are regarded as a light emitting unit, the SMD or IMD packaging technology is adopted at present to reduce the space between the light emitting units to about 0.9 mm. The display effect is affected by the strong granular sense of the image display.

Currently, high resolution display devices generally employ Chip On Board (COB) packaging technology. The driving substrate adopts a circuit board, and after the light emitting chips are welded on the circuit board, the light emitting chips are packaged in a whole-layer packaging mode, so that the space between the light emitting chips is reduced. At present, the COB packaging technology is adopted to reduce the distance between the light emitting chips to about 0.6 mm.

Fig. 1 is a schematic cross-sectional structure of a display device according to the related art.

As shown in fig. 1, the display device includes a driving substrate 10, a light emitting chip 20, an encapsulation layer 30, and a driving element 40. The light emitting chips 20 are soldered on the same side of the driving substrate 10, and the driving element 40 is soldered on the other side of the driving substrate 10.

Fig. 2 is a schematic diagram of a driving chip in the related art.

As shown in fig. 2, the driving element 40 currently bonded on the back side of the driving substrate 10 generally includes a chip die 401 and a package housing 402. The package can 402 is much larger in size than the light emitting chip 20, and some circuit auxiliary components are further required to be soldered on the back surface of the driving substrate 10. If the pitch of the light emitting chips 20 is further reduced, there is a great difficulty in the conventional wiring design; in addition, the driving element 40 with the package case and the circuit auxiliary element cannot be completely arranged on the back surface of the driving substrate 10. However, in order to provide a display device with higher resolution and definition, further reduction of the pitch of the light emitting chips is an irreversible trend.

In view of the foregoing, an embodiment of the present invention provides a display device, and fig. 3 is a schematic cross-sectional structure of the display device according to the embodiment of the present invention.

As shown in fig. 3, a display device provided in an embodiment of the present invention includes: the substrate 10, the light emitting chip 20, and the encapsulation layer 30 are driven.

The driving substrate 10 is positioned at the bottom of the display device and is generally the same size as the entire size of the display device. In some embodiments, the display device may also include a plurality of driving substrates 10, where the driving substrates 10 are spliced with each other. In order to avoid the optical problem caused by the splicing of the driving substrates 10, the splice between the adjacent driving substrates 10 is made as small as possible, and even seamless splicing is realized.

The driving substrate 10 may have the same shape as the entire shape of the display device, and may be generally rectangular or square.

The driving substrate 10 is used to provide driving signals to the light emitting chips 20. In an embodiment of the present invention, the driving substrate 10 may employ a circuit board. The circuit board is more advantageous for perforation, whereby the components are connected on both sides. In practice, the circuit board may be a two-layer board or a multi-layer board, which is not limited herein.

The light emitting chip 20 is disposed on the driving substrate 10 and electrically connected to the driving substrate 10. In the embodiment of the present invention, the light emitting chip 20 performs image display as a pixel unit or a sub-pixel unit.

In practice, the dimensions of the light emitting chip 20 are on the order of micrometers or sub-millimeters. In some embodiments of the present invention, the light emitting chip 20 is a Mini LED (Mini Light Emitting Diode, mini LED) chip or a Micro LED (Micro Light Emitting Diode, micro LED) chip. Wherein the Mini LED is larger in size than the Micro LED. When the method is applied to different application scenes and the requirements on pixel levels are different, a Mini LED or a Micro LED can be adopted according to the implementation conditions, and the method is not limited.

The encapsulation layer 30 covers the surfaces of the light emitting chip 20 and the driving substrate 10 for encapsulating and protecting the light emitting chip 20. The encapsulation layer 30 is provided entirely and has the same shape as the overall shape of the driving substrate 10.

The encapsulation layer 30 may use an encapsulation paste in which the light emitting chip 20 is encapsulated. The encapsulation adhesive may be epoxy resin, silica gel, or the like, and is not limited herein. In addition, the encapsulation layer 30 may be deposited on the surfaces of the driving substrate 10 and the light emitting chip 20 using an inorganic material such as silicon oxide or silicon nitride. The inorganic layers and the organic layers may be alternately deposited on the surfaces of the driving substrate 10 and the light emitting chip 20, or the water-oxygen barrier film may be directly attached to the surfaces of the driving substrate 10 and the light emitting chip 20, which is not limited herein.

As shown in fig. 3, in the embodiment of the present invention, the driving substrate 10 includes at least one driving chip 41. The driving chip is packaged in the driving substrate, a packaging shell is not required to be arranged for the driving chip, the size of the driving chip is effectively reduced, and the requirement of high-density driving chip arrangement can be met after the space between the light emitting chips is reduced. The driving chip is in circuit connection with the driving substrate in the driving substrate, only the side, deviating from the light-emitting chip, of the driving substrate is used for connecting circuit auxiliary elements, the occupied space of the driving chip is not required to be reserved, the problem that the arrangement space of the back of the driving substrate is insufficient is solved, and the difficulty of pasting is reduced.

As shown in fig. 3, the driving substrate 10 further includes: an upper circuit board 101, a lower circuit board 102, and a filler 103.

The upper circuit board 101 and the lower circuit board 102 are disposed opposite to each other with a predetermined distance therebetween, and a predetermined gap is generated therebetween. In the embodiment of the present invention, the substrate of the circuit board is divided into two parts, and corresponding circuits are provided for each part, so that the upper circuit board 101 and the lower circuit board 102 are formed. The substrate of the circuit board may be FR-4 or BT, and is not limited herein.

The upper circuit board 101 and the lower circuit board 102 each include a wiring layer, and the driving chip 41 is disposed between the upper circuit board 101 and the lower circuit board 102 and electrically interconnected with at least one of the circuit boards. It should be noted that, the driving chip 41 in the embodiment of the present invention refers to a chip bare chip, and the chip bare chip is directly disposed inside the driving substrate 10, so that a package housing is not required to be disposed for the chip bare chip, and the size of the driving chip is effectively reduced, so that after the space between the light emitting chips is reduced, the requirement of high-density driving chip arrangement can be satisfied.

The driving chip is in circuit connection with the driving substrate in the driving substrate 10, and only the side, deviating from the light-emitting chip 20, of the driving substrate 10 is used for connecting circuit auxiliary elements, so that the occupied space of the driving chip is not required to be reserved, the problem of insufficient arrangement space on the back of the driving substrate is solved, and the difficulty of pasting is reduced.

The filling glue 103 fills the gap formed between the upper circuit board 101 and the lower circuit board 102, and plays a role in protecting the package of the driving chip 41.

The display device provided by the embodiment of the invention adopts a printed circuit board (Printed Circuit Board, abbreviated as PCB) as a driving substrate, and adopts an active driving scheme to scan the light emitting chip to realize image display. Through carrying out the design to the drive base plate, with the drive chip encapsulation in the inside of drive base plate, can reduce the interval between the luminous chip below 0.3mm, break through and adopt the PCB base plate to drive the design limit that luminous chip carries out image display, make display resolution and definition further promote.

Fig. 4 is a schematic cross-sectional structure of a driving substrate according to an embodiment of the present invention.

As shown in fig. 4, the upper layer circuit board 101 includes: a first wiring layer 1011, a first pad s1, a second pad s2, and a first pin p1.

The lower circuit board 102 includes: a second wiring layer 1021, a second pin p2, a third pin p3, and a third pad s3.

Specifically, the first circuit layer 1011 in the upper circuit board 101 and the second circuit layer 1021 in the lower circuit board 102 may be manufactured by using the related art PCB manufacturing process, which is not described herein. The upper circuit board 101 and the lower circuit board 102 in the embodiment of the present invention may be a double-layer board or a multi-layer board, which is not limited herein. The first circuit layer 1011 and the second circuit layer 1021 may be designed according to the actual application.

The surface of the upper circuit board 101 on the side facing away from the lower circuit board 102 is provided with a first pad p1. A surface of the upper circuit board 101 facing away from the lower circuit board 102 is typically provided with a solder mask layer, which exposes the first pad p1. The first pad p1 is used to connect the light emitting chip 20 so as to drive the light emitting chip 20 through signal control.

A second pad p2 is provided on a surface of the upper circuit board 101 facing the lower circuit board 102 side, the second pad p2 being for connection with the driving chip 41. In the embodiment of the present invention, the driving chip 41 is a chip bare chip, and may be soldered to the second pad p2 in a flip-chip manner, so that a package case for the bare chip is not required.

The surface of the upper circuit board 101 facing the lower circuit board 203 is further provided with a first pin p1, and the first pin p1 is used for interconnection with the lower circuit board 102, so as to transmit external signals.

As shown in fig. 4, a surface of the lower circuit board 102 facing the upper circuit board 101 side is provided with a second pin p2, the second pin p1 and the first pin p1 in the upper circuit board 101 correspond to each other, and the second pin p2 and the corresponding first pin p1 are interconnected by an alloy ball 104, thereby achieving signal communication between the lower circuit board 102 and the upper circuit board 101.

The surface of the lower circuit board 102 facing away from the upper circuit board 101 is provided with a third pin p3, and the third pin p3 is used for receiving an external signal and transmitting the external signal to the upper circuit board 101 through the second pin p 2. The external signal is a control signal provided by an external device, and the external signal received by the lower circuit board 102 may be transmitted to the first pin p1 through the second pin p2 and the alloy ball 104, thereby being provided to the upper circuit board 101.

In a specific implementation, the external device may be a display device motherboard, and the external signal provided by the motherboard to the driving substrate may include: power signals, clock signals, data signals, ground signals, and the like. The driving substrate 10 can drive the light emitting chip to perform corresponding display under the control of the signals.

The surface of the lower circuit board 102 on the side facing away from the upper circuit board 101 is further provided with a third pad p3. The side surface of the lower circuit board 102 facing away from the lower circuit board 101 is typically provided with a solder resist layer, which exposes the third pad p3. The third pad p3 is used for connecting circuit auxiliary elements.

In a specific implementation, the driving substrate 10 cannot meet the driving requirement of any display device when being designed, so that a plurality of third pads p3 are arranged on one side of the driving substrate 10 away from the light emitting chip 20, and when the driving substrate is applied to a specific application scene, circuits are compensated by connecting appropriate circuit auxiliary elements to the third pads p3, so that the driving substrate 10 with the same specification has a wider application range. The circuit auxiliary elements may generally include: the elements such as resistors and capacitors and inductors are not limited herein.

The planar structure of the display device provided in the embodiment of the present invention is shown in fig. 5a, where the light emitting chips 20 are located on the front surface of the driving substrate, and the light emitting chips 20 are packaged by adopting a COB whole-layer packaging method, which is beneficial to reducing the space between the light emitting chips 20 and improving the packaging efficiency. The bottom structure of the display device is shown in fig. 5b, and fig. 5b shows a plurality of third pins s3 on the back surface of the driving substrate 10. The power supply signal transmission circuit includes pins VDD R and VDD GB for transmitting power supply signals, pins CLKi and CLKo for transmitting clock signals, pins SDi and SDo for transmitting data signals, and a pin GND for transmitting ground signals.

In a specific implementation, other external signals may be required for driving the display device to display, and a corresponding third pin may be disposed on the back surface of the driving substrate, which is not limited herein.

FIG. 6 is a schematic diagram of a cross-sectional structure of a display device according to an embodiment of the invention; fig. 7 is a schematic diagram of a third cross-sectional structure of a display device according to an embodiment of the invention.

When the display device is used for full-color display, a plurality of light emitting chips with different colors are required to be arranged as sub-pixels, and the full-color display is realized through the proportion of different brightness of the sub-pixels.

In some embodiments, as shown in fig. 6, the light emitting chip includes: a red light emitting chip 21, a green light emitting chip 22, and a blue light emitting chip 23. The red light emitting chips 21, the green light emitting chips 22, and the blue light emitting chips 23 are repeatedly arranged in a predetermined order, for example, may be arranged in a row direction in the order of red, green, and blue, and may be arranged in a plurality of rows at the same time to form a matrix structure. The red light emitting chip 21 serves as a red sub-pixel, the green light emitting chip 22 serves as a green sub-pixel, and the blue light emitting chip 23 serves as a blue sub-pixel. Adjacent one red light emitting chip 21, one green light emitting chip 22, and one blue light emitting chip 23 constitute one pixel unit, thereby performing full-color image display.

In some embodiments, as shown in fig. 7, the light emitting chip may also employ a stacked chip; the stacked chip includes a red light-emitting layer 201, a green light-emitting layer 202, and a blue light-emitting layer 203, which are stacked. The stacked chip may be fabricated by using a Mip technology, and the red light emitting layer 201, the green light emitting layer 202, and the blue light emitting layer 203 may be formed by using an epitaxial technology, which is not limited herein.

The red light emitting layer 201, the green light emitting layer 202, and the blue light emitting layer 203 in one stacked chip can be controlled individually, and thus one stacked chip can perform full-color image display as one pixel unit. Since the light emitting layers in the stacked chips are stacked in the vertical direction, the size of the chips is larger in the same pixel unit size, thereby having higher light emitting luminance. In addition, the laminated chip only needs to be transferred once when transferring a large amount of chips, so that the transfer times can be reduced, and the transfer efficiency can be improved.

In the embodiment of the present invention, the display device generally requires a plurality of driving chips, and the driving chips 41 may be simultaneously embedded in the same driving substrate. However, since the number of driving chips 41 required in a large-sized display device is large, if individual driving chips are defective or failed, the entire driving substrate cannot be used, and a discard process is required, so that the yield is low.

In view of the above, an embodiment of the present invention provides a display device structure, and fig. 8 is a schematic cross-sectional view of the display device according to the embodiment of the present invention.

As shown in fig. 8, in some embodiments, the driving substrate having a plurality of driving chips packaged therein may be divided into a plurality of functional units 1, each of the functional units 1 may be configured in the manner of the above-described embodiments, at least one driving chip may be packaged inside the driving substrate in each of the functional units 1, and each of the functional units may be separately fabricated.

At this time, the display device further includes a driving back plate 2, the plurality of functional units 1 are located on the same side of the driving back plate 2, and each functional unit 1 is electrically connected to the driving back plate. The driving back plate 2 also needs to be provided with a circuit, and after each functional unit 1 is connected to the driving back plate 2, the functional units 1 and the circuits of the driving back plate 2 can be interconnected. Therefore, the processing difficulty of the driving substrate in each functional unit can be reduced, and higher yield is ensured. Meanwhile, the large-size driving backboard 2 only needs to be simply wired to connect the functional units 1, so that the manufacturing difficulty of the large-size driving backboard 2 is reduced. When the structure shown in fig. 8 is adopted, the driving back plate 2 may be a double-layer plate, each functional unit 1 is connected to one side of the driving back plate 2, and the circuit auxiliary element is connected to one side of the driving back plate 2 facing away from the functional unit 1.

In specific implementation, the driving back plate 2 can be a PCB, and only a simple wiring design is needed, i.e. the processing difficulty is small.

However, since the PCB is generally formed by wet etching, the processing accuracy is slightly poor, and the thickness tolerance is large (thickness±10%) and all have a certain influence on the display device splicing. Therefore, in some embodiments, the driving backboard 2 can also adopt a glass substrate with double-sided copper coating, the glass substrate can adopt a dry etching process, and meanwhile, the thickness precision of the glass is controllable, so that the superior size precision and thickness precision of the bonding pad can be ensured, and good splicing is realized.

According to a first inventive concept, in some embodiments of the present invention, a display apparatus includes: the LED driving device comprises a driving substrate, a light emitting chip arranged on the driving substrate and a packaging layer covering the light emitting chip and the driving substrate. The driving substrate comprises at least one driving chip, the driving chip is packaged in the driving substrate, a packaging shell is not required to be arranged for the driving chip, the size of the driving chip is effectively reduced, and after the distance between the light emitting chips is reduced, the requirement of high-density driving chip arrangement can be met. The driving chip is in circuit connection with the driving substrate in the driving substrate, only the side, deviating from the light-emitting chip, of the driving substrate is used for connecting circuit auxiliary elements, the occupied space of the driving chip is not required to be reserved, the problem that the arrangement space of the back of the driving substrate is insufficient is solved, and the difficulty of pasting is reduced.

According to a second inventive concept, an upper circuit board and a lower circuit board are oppositely arranged, a set distance is reserved between the upper circuit board and the lower circuit board, and at least one driving chip is packaged between the upper circuit board and the lower circuit board. The upper layer circuit board and the lower layer circuit board are both PCBs and can be double-layer boards or multi-layer boards. The driving substrate further comprises filling glue filled in a gap between the upper circuit board and the lower circuit board for packaging and protecting the driving chip.

According to a third inventive concept, an upper layer circuit board includes: the first bonding pad, the second bonding pad and the first pin. The first bonding pad is positioned on the surface of one side of the upper circuit board, which is away from the lower circuit board, and is used for connecting the light-emitting chip; the second bonding pad is positioned on the surface of the upper circuit board surface towards one side of the lower circuit board and is used for connecting with the driving chip; the first pin is positioned on the surface of the upper circuit board surface facing to one side of the lower circuit board and is used for receiving external signals.

The lower layer circuit board includes: the second pin, the third pin and the third bonding pad. The second pins are positioned on the surface of the lower circuit board surface facing to one side of the upper circuit board, the second pins correspond to the first pins, and the second pins are interconnected with the corresponding first pins through alloy balls; the third pin is positioned on the surface of one side of the lower circuit board, which is away from the upper circuit board, and is used for receiving external signals and transmitting the external signals to the upper circuit board through the second pin; and the third bonding pad is positioned on the surface of one side of the lower circuit board, which is away from the upper circuit board, and is used for connecting with the circuit auxiliary element.

According to a fourth inventive concept, a light emitting chip includes: red light emitting chips, green light emitting chips, and blue light emitting chips. Wherein, the red light emitting chip, the green light emitting chip and the blue light emitting chip are repeatedly arranged according to a set sequence to form a matrix structure. The red light emitting chip is used as a red sub-pixel, the green light emitting chip is used as a green sub-pixel, and the blue light emitting chip is used as a blue sub-pixel. Adjacent one red light emitting chip, one green light emitting chip, and one blue light emitting chip constitute one pixel unit, thereby performing full-color image display.

According to the fifth inventive concept, the light emitting chip may also employ a stacked chip; the laminated chip comprises a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer which are arranged in a laminated mode. The red light emitting layer, the green light emitting layer, and the blue light emitting layer in one stacked chip can be controlled individually, and thus one stacked chip can perform full-color image display as one pixel unit. Since the light emitting layers in the stacked chips are stacked in the vertical direction, the size of the chips is larger in the same pixel unit size, thereby having higher light emitting luminance. In addition, the laminated chip only needs to be transferred once when transferring a large amount of chips, so that the transfer times can be reduced, and the transfer efficiency can be improved.

According to the sixth inventive concept, the driving substrate having the plurality of driving chips packaged therein may be divided into a plurality of functional units, at least one driving chip may be packaged inside the driving substrate in each of the functional units, and each of the functional units may be separately fabricated. The display device further comprises a driving backboard, and the plurality of functional units are positioned on the same side of the driving backboard and are electrically connected with the driving backboard. The drive backboard also needs to be provided with a circuit, and after each functional unit is connected to the drive backboard, the circuit interconnection of the functional unit and the drive backboard can be realized. Therefore, the processing difficulty of the driving substrate in each functional unit can be reduced, and higher yield is ensured. Meanwhile, the large-size driving backboard only needs to be simply wired to connect all the functional units, and the manufacturing difficulty of the large-size driving backboard is reduced. The driving backboard can adopt a double-layer board, each functional unit is connected to one surface of the driving backboard, and the circuit auxiliary element is connected to one surface of the driving backboard, which is away from the functional unit.

According to the seventh inventive concept, the driving back plate may employ a PCB, and only a simple wiring design is required, i.e., the processing difficulty is small. Or, the driving backboard can adopt a glass substrate with double-sided copper coating, the glass substrate can adopt a dry etching process, and meanwhile, the thickness precision of the glass is controllable, so that the excellent size precision and thickness precision of the bonding pad can be ensured, and good splicing is realized.

While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

1. A display device, comprising:

a driving substrate;

the light-emitting chip is positioned on the driving substrate and is electrically connected with the driving substrate;

the packaging layer is covered on the surfaces of the light-emitting chip and the driving substrate;

the driving substrate comprises at least one driving chip, and the driving chip is packaged in the driving substrate.

2. The display device according to claim 1, wherein the driving substrate includes:

an upper layer circuit board;

the lower circuit board is arranged opposite to the upper circuit board; the upper circuit board and the lower circuit board are separated by a set distance; the driving chip is packaged between the upper circuit board and the lower circuit board;

wherein, upper circuit board includes:

the first bonding pad is positioned on the surface of one side of the upper circuit board, which is away from the lower circuit board, and is used for connecting the light-emitting chip;

the second bonding pad is positioned on the surface of one side of the upper circuit board facing the lower circuit board and is used for connecting the driving chip;

the first pins are positioned on the surface of one side of the upper circuit board facing the lower circuit board;

the lower circuit board includes:

the second pin is positioned on the surface of one side of the lower circuit board facing the upper circuit board; the second pins are mutually corresponding to the first pins, and are interconnected with the corresponding first pins through alloy balls;

the third pin is positioned on the surface of one side, away from the upper circuit board, of the lower circuit board and is used for receiving external signals and transmitting the external signals to the upper circuit board through the second pin;

and the third bonding pad is positioned on the surface of one side of the lower circuit board, which is away from the upper circuit board, and is used for connecting with the circuit auxiliary element.

3. The display device according to claim 2, wherein the circuit auxiliary element includes: resistance and capacitance.

4. The display device according to claim 2, wherein the external signal includes: power signal, clock signal, data signal and ground signal.

5. The display device according to any one of claims 2 to 4, wherein the driving substrate further comprises:

and the filling glue is positioned between the upper circuit board and the lower circuit board and used for filling a gap between the upper circuit board and the lower circuit board.

6. The display device of any one of claims 1-4, wherein the light emitting chip is a Micro LED chip or a Mini LED chip.

7. The display device according to claim 6, wherein the light emitting chip includes: a red light emitting chip, a green light emitting chip, and a blue light emitting chip;

the red light emitting chips, the green light emitting chips and the blue light emitting chips are repeatedly arranged according to a set sequence; adjacent one of the red light emitting chips, one of the green light emitting chips and one of the blue light emitting chips constitute one pixel unit.

8. The display device of claim 6, wherein the light emitting chip is a stacked chip; the laminated chip comprises a red light-emitting layer, a green light-emitting layer and a blue light-emitting layer which are arranged in a laminated manner; one of the stacked chips serves as one pixel unit.

9. The display device according to any one of claims 2 to 4, wherein the display device comprises a plurality of driving substrates;

the display device further comprises a driving backboard, a plurality of driving substrates are positioned on the same side of the driving backboard, and each driving substrate is electrically connected with the driving backboard; the circuit auxiliary element is connected to one side of the drive backboard, which is away from the drive substrate.

10. The display device of claim 9, wherein the drive back plate is a circuit board or a glass drive plate.