TWI741695B - Antennas in package verification board - Google Patents

Antennas in package verification board Download PDF

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Publication number
TWI741695B
TWI741695B TW109125126A TW109125126A TWI741695B TW I741695 B TWI741695 B TW I741695B TW 109125126 A TW109125126 A TW 109125126A TW 109125126 A TW109125126 A TW 109125126A TW I741695 B TWI741695 B TW I741695B
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Taiwan
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board
antenna
array
package verification
antenna package
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TW109125126A
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Chinese (zh)
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TW202109059A (en
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張書維
林決仁
蔡文才
洪子傑
戴揚
方建喆
黃柏嘉
孫德良
盧穎彥
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稜研科技股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/08—Measuring electromagnetic field characteristics
    • G01R29/10—Radiation diagrams of antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
    • H01Q19/104—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces using a substantially flat reflector for deflecting the radiated beam, e.g. periscopic antennas
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H01P3/082—Multilayer dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/02—Waveguide horns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/02—Refracting or diffracting devices, e.g. lens, prism
    • H01Q15/06—Refracting or diffracting devices, e.g. lens, prism comprising plurality of wave-guiding channels of different length
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/14—Reflecting surfaces; Equivalent structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
    • H01Q19/18—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces having two or more spaced reflecting surfaces
    • H01Q19/185—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces having two or more spaced reflecting surfaces wherein the surfaces are plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/29—Combinations of different interacting antenna units for giving a desired directional characteristic
    • H01Q21/293—Combinations of different interacting antenna units for giving a desired directional characteristic one unit or more being an array of identical aerial elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B17/00—Monitoring; Testing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B17/00—Monitoring; Testing
    • H04B17/0082—Monitoring; Testing using service channels; using auxiliary channels
    • H04B17/0085—Monitoring; Testing using service channels; using auxiliary channels using test signal generators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/267—Phased-array testing or checking devices

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Aerials With Secondary Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Support Of Aerials (AREA)

Abstract

Provided is an antenna in package (AiP) verification board, including a board for an antenna array or an electronic circuit disposed thereon; and a plurality of SMPM connectors. The plurality of SMPM connectors are arranged in an array on the board and electrically connected to the antenna array or the electronic circuit of the board to test the characteristics of the antenna array on the board or the characteristics of the electronic circuits on the board. The AiP is fixed on the beamforming test platform. In addition to the aforementioned AiP verification board, the present disclosure also provides an AiP verification board including a plurality of transition structures and an AiP verification board including a plurality of connectors and a plurality of transition structures.

Description

天線封裝驗證板 Antenna package verification board

本發明係有關一種天線封裝(antennas in package,AiP)的驗證及測試，尤指一種適用於毫米波(mmWave)第五代行動通訊(5G)之天線封裝驗證板。 The present invention relates to verification and testing of an antenna package (antennas in package, AiP), in particular to an antenna package verification board suitable for millimeter wave (mmWave) fifth-generation mobile communications (5G).

天線封裝(AiP)是一種將一個或多個天線以及收發器(transceiver)整合到標準表面安裝裝置(standard surface-mount device)中的技術，它已廣泛用於60GHz的手勢感測器(gesture sensor)、77GHz的汽車雷達(automobile radar)、94GHz的相控陣列(phased array)或者甚至高達122GHz的影像感測器及300GHz的無線網路。此外，由於第五代行動通訊(5G)毫米波頻譜通過使用毫米波作為載波，所以具有足夠的帶寬來提供下一代用戶體驗及工業的應用，而AiP技術也逐漸朝向5G毫米波發展方向。 Antenna Package (AiP) is a technology that integrates one or more antennas and transceivers into a standard surface-mount device (standard surface-mount device). It has been widely used in 60GHz gesture sensors. ), 77GHz automobile radar, 94GHz phased array or even up to 122GHz image sensor and 300GHz wireless network. In addition, because the fifth-generation mobile communications (5G) millimeter wave spectrum uses millimeter waves as the carrier, it has sufficient bandwidth to provide next-generation user experience and industrial applications, and AiP technology is gradually moving towards the 5G millimeter wave development direction.

現今，在天線封裝的設計上，其電路板的上層是天線陣列，下層通常是電子電路及電子元件。因此，天線陣列通常無法單獨進行驗證或測試，只能進行整個天線封裝系統的電特性驗證及測試，造成天線封裝在開發以及測試上的盲點。 Nowadays, in the design of antenna packaging, the upper layer of the circuit board is the antenna array, and the lower layer is usually the electronic circuit and electronic components. Therefore, the antenna array usually cannot be verified or tested individually, and can only be verified and tested for the electrical characteristics of the entire antenna packaging system, which results in blind spots in the development and testing of the antenna packaging.

因此，如何提供一種可以單獨測試天線陣列、電子電路、電子元件以及可以同時結合天線與電子元件的驗證板，以克服天線封裝在驗證上的困難並降低天線封裝的開發時程及成本，已是所屬技術領域亟待解決的課題之一。 Therefore, how to provide a verification board that can individually test antenna arrays, electronic circuits, electronic components, and can combine antennas and electronic components at the same time, so as to overcome the difficulties in verification of antenna packaging and reduce the development time and cost of antenna packaging. One of the urgent issues to be solved in the technical field.

為解決上述課題，本發明之一實施例提供一種天線封裝驗證板，該天線封裝驗證板包括：載板，用於設置天線陣列或電子電路；以及複數個推入式連接器，係以陣列方式排列於該載板上，其中，該複數個推入式連接器與該載板上的天線陣列或電子電路電性連接，以測試該載板上的天線陣列之特性或該載板上的電子電路之特性。 In order to solve the above-mentioned problem, an embodiment of the present invention provides an antenna package verification board. The antenna package verification board includes: a carrier board for installing an antenna array or an electronic circuit; and a plurality of push-in connectors in an array manner Arranged on the carrier board, wherein the plurality of push-in connectors are electrically connected to the antenna array or electronic circuit on the carrier board to test the characteristics of the antenna array on the carrier board or the electronics on the carrier board The characteristics of the circuit.

本發明另一實施例提供一種天線封裝驗證板，該天線封裝驗證板：載板，係用於設置天線陣列或電子電路；至少一接地-訊號-接地(ground-signal-ground,GSG)之通孔，係形成於該載板中；以及複數組轉接結構，係以陣列方式排列於該載板上，其中，該複數組轉接結構透過該接地-訊號-接地(ground-signal-ground,GSG)之通孔，與該載板上的天線陣列或與該載板上的電子電路電性連接，以測試該載板上的天線陣列之特性或該載板上的電子電路之特性。 Another embodiment of the present invention provides an antenna package verification board. The antenna package verification board: a carrier board for setting an antenna array or an electronic circuit; at least one ground-signal-ground (GSG) communication Holes are formed in the carrier; and a complex array of transfer structures are arranged on the carrier in an array, wherein the complex array of transfer structures passes through the ground-signal-ground (ground-signal-ground, The through holes of GSG) are electrically connected to the antenna array on the carrier board or the electronic circuit on the carrier board to test the characteristics of the antenna array on the carrier board or the electronic circuit on the carrier board.

本發明之又一實施例提供一種天線封裝驗證板，該天線封裝驗證板包括：載板，係供設置射頻電路；至少一接地-訊號-接地(ground-signal-ground,GSG)之通孔，係形成於該載板中；複數個連接器，係以陣列方式排列於該載板的一面上；以及複數組轉接結構，係以陣列方 式排列於該載板的另一面上，其中，該複數個連接器係透過該接地-訊號-接地之通孔而與該複數組轉接結構電性連接。 Another embodiment of the present invention provides an antenna package verification board. The antenna package verification board includes: a carrier board for setting a radio frequency circuit; at least one ground-signal-ground (GSG) through hole, Is formed in the carrier; a plurality of connectors are arranged in an array on one side of the carrier; and a plurality of transfer structures are arranged in an array Are arranged on the other side of the carrier board, wherein the plurality of connectors are electrically connected to the plurality of switching structures through the ground-signal-ground through holes.

11:天線陣列板 11: Antenna array board

11’:電子電路板 11’: Electronic circuit board

13:SMPM連接器 13: SMPM connector

31:天線陣列板 31: Antenna array board

31’:電子電路板 31’: Electronic circuit board

33:轉接結構 33: Transfer structure

331:連接墊 331: connection pad

51:SMPM連接器 51: SMPM connector

53:轉接結構 53: transfer structure

55:射頻電路板 55: RF circuit board

71:底部天線封裝驗證板 71: Bottom antenna package verification board

711:轉接結構 711: transfer structure

713:推入式連接器 713: Push-in connector

81:帶通濾波器電路板 81: Bandpass filter circuit board

811:轉接結構 811: transfer structure

813:帶通濾波器電路結構 813: Bandpass filter circuit structure

91:頂部天線封裝驗證板 91: Top antenna package verification board

911:推入式連接器 911: Push-in connector

913:連接墊 913: connection pad

101:波束成形測試平台 101: Beamforming test platform

1011:治具本體 1011: Fixture body

1013:固定夾具 1013: fixed fixture

1015:開口 1015: opening

圖式為合併於且構成本發明之一部分，以顯示本發明的各具體實施例，並且闡述本發明之具體實施例。 The drawings are incorporated in and constitute a part of the present invention to show specific embodiments of the present invention and illustrate specific embodiments of the present invention.

圖1A為本發明之天線封裝驗證板第一實施例的立體分解圖。 FIG. 1A is a three-dimensional exploded view of the first embodiment of the antenna package verification board of the present invention.

圖1B為本發明之天線封裝驗證板第一實施例的立體組合圖。 FIG. 1B is a three-dimensional assembly diagram of the first embodiment of the antenna package verification board of the present invention.

圖2A為本發明之天線封裝驗證板第二實施例的立體分解圖。 2A is a perspective exploded view of the second embodiment of the antenna package verification board of the present invention.

圖2B為本發明之天線封裝驗證板第二實施例的立體組合圖。 2B is a three-dimensional assembly diagram of the second embodiment of the antenna package verification board of the present invention.

圖2C為本發明之天線封裝驗證板第二實施例之轉接結構的立體示意圖。 2C is a three-dimensional schematic diagram of the transfer structure of the second embodiment of the antenna package verification board of the present invention.

圖3A為本發明之天線封裝驗證板第三實施例的立體分解圖。 3A is a perspective exploded view of the third embodiment of the antenna package verification board of the present invention.

圖3B為本發明之天線封裝驗證板第三實施例的立體組合圖。 3B is a three-dimensional assembly diagram of the third embodiment of the antenna package verification board of the present invention.

圖4A為本發明之天線封裝驗證板第四實施例的立體組合俯視圖。 FIG. 4A is a three-dimensional assembled top view of the fourth embodiment of the antenna package verification board of the present invention.

圖4B為本發明之天線封裝驗證板第四實施例的立體組合仰視圖。 4B is a bottom view of the fourth embodiment of the antenna package verification board of the present invention.

圖4C為本發明之天線封裝驗證板第四實施例的立體分解圖。 4C is an exploded perspective view of the fourth embodiment of the antenna package verification board of the present invention.

圖5A為本發明之天線封裝驗證板第四實施例的底部天線封裝驗證板之上部的立體圖。 5A is a perspective view of the upper part of the bottom antenna package verification board of the fourth embodiment of the antenna package verification board of the present invention.

圖5B為本發明之天線封裝驗證板第四實施例的底部天線封裝驗證板之上部的局部放大立體圖。 5B is a partially enlarged perspective view of the upper part of the bottom antenna package verification board of the fourth embodiment of the antenna package verification board of the present invention.

圖6A為本發明之天線封裝驗證板第四實施例的底部天線封裝驗證板之下部的立體圖。 6A is a perspective view of the lower part of the bottom antenna package verification board of the fourth embodiment of the antenna package verification board of the present invention.

圖6B為本發明之天線封裝驗證板第四實施例的底部天線封裝驗證板之下部的局部放大立體圖。 6B is a partially enlarged perspective view of the lower part of the bottom antenna package verification board of the fourth embodiment of the antenna package verification board of the present invention.

圖7A為本發明之天線封裝驗證板第四實施例的帶通濾波器電路板之上部的立體圖。 7A is a perspective view of the upper part of the band-pass filter circuit board of the fourth embodiment of the antenna package verification board of the present invention.

圖7B為本發明之天線封裝驗證板第四實施例的帶通濾波器電路板之上部的局部放大立體圖。 7B is a partially enlarged perspective view of the upper part of the band-pass filter circuit board of the fourth embodiment of the antenna package verification board of the present invention.

圖8A為本發明之天線封裝驗證板第四實施例的帶通濾波器電路板之下部的立體圖。 8A is a perspective view of the lower part of the band-pass filter circuit board of the fourth embodiment of the antenna package verification board of the present invention.

圖8B為本發明之天線封裝驗證板第四實施例的帶通濾波器電路板之下部的局部放大立體圖。 8B is a partially enlarged perspective view of the lower part of the band-pass filter circuit board of the fourth embodiment of the antenna package verification board of the present invention.

圖9A為本發明之天線封裝驗證板第四實施例的頂部天線封裝驗證板之上部的立體圖。 9A is a perspective view of the upper part of the top antenna package verification board of the fourth embodiment of the antenna package verification board of the present invention.

圖9B為本發明之天線封裝驗證板第四實施例的頂部天線封裝驗證板之下部的立體圖。 9B is a perspective view of the lower part of the top antenna package verification board of the fourth embodiment of the antenna package verification board of the present invention.

圖9C為本發明之天線封裝驗證板第四實施例的頂部天線封裝驗證板之下部的局部放大立體圖。 9C is a partially enlarged perspective view of the lower part of the top antenna package verification board of the fourth embodiment of the antenna package verification board of the present invention.

以下藉由特定之具體實施例加以說明本發明之實施方式，而熟悉此技術之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點和功效，亦可藉由其他不同的具體實施例加以施行或應用。 The following specific examples illustrate the implementation of the present invention, and those skilled in the art can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification, and can also use other different specific embodiments. To implement or apply.

為了解決上述習知技術的缺點，本發明之目的在於提供一種適用於毫米波(mmWave)第五代行動通訊(5G)之天線封裝(antenna in package,AiP)驗證板，本發明的具體實施例說明如下。 In order to solve the shortcomings of the above-mentioned conventional technology, the purpose of the present invention is to provide an antenna in package (AiP) verification board suitable for millimeter wave (mmWave) fifth-generation mobile communications (5G). Specific embodiments of the present invention described as follows.

[第一實施例] [First Embodiment]

圖1A為本發明之天線封裝驗證板之第一實施例的立體分解圖，圖1B為本發明之天線封裝驗證板之第一實施例的立體組合圖。本發明之天線封裝驗證板包括載板，例如設置有天線陣列之天線陣列板11或設置有電子電路之電子電路板11’，以及複數個推入式連接器，例如超小型推入式微(Sub-Miniature Push-on Micro；SMPM)連接器13。複數個SMPM連接器13以陣列方式排列於天線陣列板11或電子電路板11’的一面上，並且複數個SMPM連接器13與天線陣列板11或電子電路板11’電性連接，以測試天線陣列板11上的天線陣列之特性或電子電路板11’上的電子電路之特性。 FIG. 1A is a perspective exploded view of the first embodiment of the antenna package verification board of the present invention, and FIG. 1B is a perspective assembly view of the first embodiment of the antenna package verification board of the present invention. The antenna package verification board of the present invention includes a carrier board, such as an antenna array board 11 provided with an antenna array or an electronic circuit board 11' provided with an electronic circuit, and a plurality of push-in connectors, such as ultra-small push-in micro (Sub -Miniature Push-on Micro; SMPM) connector 13. A plurality of SMPM connectors 13 are arranged in an array on one side of the antenna array board 11 or the electronic circuit board 11', and the plurality of SMPM connectors 13 are electrically connected to the antenna array board 11 or the electronic circuit board 11' to test the antenna The characteristics of the antenna array on the array board 11 or the characteristics of the electronic circuit on the electronic circuit board 11'.

在本實施例中，各複數個SMPM連接器13包括連接墊(pad)(未顯示於圖式中)。天線陣列板11上的天線陣列為毫米波(mmWave)天線陣列，並且電子電路板11’上的電子電路為毫米波電子電路。 In this embodiment, each of the plurality of SMPM connectors 13 includes a connection pad (not shown in the figure). The antenna array on the antenna array board 11 is a millimeter wave (mmWave) antenna array, and the electronic circuit on the electronic circuit board 11' is a millimeter wave electronic circuit.

具體而言，如圖1A及圖1B所示，天線陣列板11或電子電路板11’的單面設置有複數個SMPM連接器13，複數個SMPM連接器13以陣列方式排列為一8x8的SMPM連接器陣列，複數個SMPM連接器13可與天線陣列板11或電子電路板11’直接電性連接。因此，由於複數個SMPM連接器13可與測試設備直接連接，所以本實施例可透過複數個SMPM連接器13，分別測試天線陣列板11的天線陣列之特性及電子電路板11’的電子元件之特性，進而降低毫米波天線及其電路在驗證上的困難。值得一提的是，在各SMPM連接器13上的連接墊可設計或優化成適合的結構，以達到低損耗的轉換。 Specifically, as shown in FIGS. 1A and 1B, a plurality of SMPM connectors 13 are provided on one side of the antenna array board 11 or the electronic circuit board 11', and the plurality of SMPM connectors 13 are arranged in an array into an 8x8 SMPM In the connector array, a plurality of SMPM connectors 13 can be directly electrically connected to the antenna array board 11 or the electronic circuit board 11'. Therefore, since the plurality of SMPM connectors 13 can be directly connected to the test equipment, this embodiment can test the characteristics of the antenna array of the antenna array board 11 and the electronic components of the electronic circuit board 11' through the plurality of SMPM connectors 13 respectively. Features, thereby reducing the difficulty of verification of millimeter-wave antennas and their circuits. It is worth mentioning that the connection pads on each SMPM connector 13 can be designed or optimized into a suitable structure to achieve low-loss conversion.

在本實施例中，設置有複數個SMPM連接器13的天線封裝驗證板可固設於波束成形測試平台(beamforming test platform)上，本發明可以將天線封裝分成天線及電路來進行各自的測試。因此，可以不需要製作多種電路板及天線，進而可節省設計上的成本。 In this embodiment, the antenna package verification board provided with a plurality of SMPM connectors 13 can be fixed on a beamforming test platform, and the present invention can divide the antenna package into antennas and circuits for respective tests. Therefore, there is no need to fabricate multiple circuit boards and antennas, thereby saving design costs.

[第二實施例] [Second Embodiment]

請參閱圖2A及圖2B，其分別為本發明之天線封裝驗證板第二實施例的立體分解圖及立體組合圖。本實施例之天線封裝驗證板包括載板，例如設置有天線陣列之天線陣列板31或設置有電子電路之電子電路板31’，以及複數組轉接結構33，其中，複數組轉接結構33將以RDIS公司的invispin為例來進行說明，但本發明並不限於此。複數組轉接結構33以陣列方式排列於天線陣列板31或電子電路板31’的一面上，天線陣列板31的另一 面設置有天線陣列或電子電路板31’的另一面設置有電子電路，透過接地-訊號-接地(ground-signal-ground,GSG)之通孔(through hole)，複數組轉接結構33與天線陣列板31上的天線陣列或與電子電路板31’上的電子電路電性連接，以測試天線陣列板31上的天線陣列之特性或電子電路板31’上的電子電路及元件之特性。此外，天線陣列板31上的天線陣列為毫米波天線陣列，並且電子電路板31’上的電子電路為毫米波電子電路。 Please refer to FIG. 2A and FIG. 2B, which are respectively a three-dimensional exploded view and a three-dimensional assembly view of the second embodiment of the antenna package verification board of the present invention. The antenna package verification board of this embodiment includes a carrier board, such as an antenna array board 31 provided with an antenna array or an electronic circuit board 31' provided with an electronic circuit, and a complex array switching structure 33, wherein the complex array switching structure 33 Invispin of RDIS Company will be used as an example for description, but the present invention is not limited to this. The complex array switching structure 33 is arranged in an array on one side of the antenna array board 31 or the electronic circuit board 31', and the other side of the antenna array board 31 One side is provided with an antenna array or electronic circuit board 31', and the other side is provided with an electronic circuit, through the ground-signal-ground (ground-signal-ground, GSG) through hole, the complex array switching structure 33 and the antenna The antenna array on the array board 31 or the electronic circuit on the electronic circuit board 31' is electrically connected to test the characteristics of the antenna array on the antenna array board 31 or the characteristics of the electronic circuits and components on the electronic circuit board 31'. In addition, the antenna array on the antenna array board 31 is a millimeter wave antenna array, and the electronic circuit on the electronic circuit board 31' is a millimeter wave electronic circuit.

在本實施例中，如圖2C所示，各組轉接結構33中的每一轉接結構包括連接墊(pad)331。 In this embodiment, as shown in FIG. 2C, each of the groups of switching structures 33 includes a connecting pad 331.

如圖2A及圖2B所示，天線陣列板31或電子電路板31’的單面設置有複數組轉接結構33，複數組轉接結構33以陣列方式排列為一8x8的轉接結構轉換陣列，複數組轉接結構33可與天線陣列板31或電子電路板31’直接電性連接，由於複數組轉接結構33亦可與測試設備連接，所以本實施例可透過複數組轉接結構33轉換陣列，分別測試天線陣列板31的天線陣列之特性及電子電路板31’的電子元件之特性，進而降低毫米波天線及其電路在驗證上的困難。值得一提的是，由於各轉接結構33可提供極小的剖面，所以在連接其他的電路板(如印刷電路板)時，電路板僅需要蝕刻對應的同軸墊(coaxial pad)即可與本發明的天線封裝驗證板直接連接，無需額外的連接器。另外，各轉接結構上的連接墊(pad)可設計或優化成適合的結構，以達到低損耗的轉換。 As shown in FIGS. 2A and 2B, a single side of the antenna array board 31 or the electronic circuit board 31' is provided with a complex array switching structure 33, and the complex array switching structure 33 is arranged in an array into an 8x8 switching structure conversion array The complex array switching structure 33 can be directly electrically connected to the antenna array board 31 or the electronic circuit board 31'. Since the complex array switching structure 33 can also be connected to the test equipment, the complex array switching structure 33 can be used in this embodiment. The conversion array separately tests the characteristics of the antenna array of the antenna array board 31 and the characteristics of the electronic components of the electronic circuit board 31', thereby reducing the difficulty of verifying the millimeter wave antenna and its circuit. It is worth mentioning that, since each transfer structure 33 can provide a very small cross-section, when connecting to other circuit boards (such as printed circuit boards), the circuit boards only need to etch the corresponding coaxial pads to connect with the original The invented antenna package verification board is directly connected without additional connectors. In addition, the connection pads on each switching structure can be designed or optimized into a suitable structure to achieve low-loss conversion.

在本實施例中，設置有複數組轉接結構33的天線封裝驗證板可固設於波束成形測試平台上，本發明可以將天線封裝分成天線及電路來進行各自的測試。因此，可以不需要製作多種電路板及天線，進而可節省設計上的成本。 In this embodiment, the antenna package verification board provided with the complex array switching structure 33 can be fixed on the beamforming test platform, and the present invention can divide the antenna package into antennas and circuits for respective tests. Therefore, there is no need to fabricate multiple circuit boards and antennas, thereby saving design costs.

[第三實施例] [Third Embodiment]

請參閱圖3A及圖3B，其分別為本發明之天線封裝驗證板第三實施例的立體分解圖及立體組合圖。本發明之天線封裝驗證板包括複數個連接器51(例如SMPM連接器)以及複數組轉接結構53(例如invispin)。複數個SMPM連接器51以陣列方式排列於載板(例如設置有射頻電路之射頻電路板55)的一面上，複數組轉接結構53以陣列方式排列於射頻電路板55的另一面上，透過設置於載板中的接地-訊號-接地之通孔，複數個SMPM連接器51可與複數組轉接結構53電性連接。 Please refer to FIGS. 3A and 3B, which are respectively a three-dimensional exploded view and a three-dimensional assembly view of the third embodiment of the antenna package verification board of the present invention. The antenna package verification board of the present invention includes a plurality of connectors 51 (for example, SMPM connectors) and a plurality of switching structures 53 (for example, invispin). A plurality of SMPM connectors 51 are arranged in an array on one side of a carrier board (for example, a radio frequency circuit board 55 provided with a radio frequency circuit), and a plurality of switching structures 53 are arranged in an array on the other side of the radio frequency circuit board 55, through The ground-signal-ground through holes provided in the carrier board, and a plurality of SMPM connectors 51 can be electrically connected to a plurality of switching structures 53.

在本實施例中，如圖3A及圖3B所示，射頻電路板的55一面設置有複數組轉接結構53，而射頻電路板55的另一面設置有複數個SMPM連接器51，複數組轉接結構53及複數個SMPM連接器51皆以陣列方式排列為一4x4的轉接結構陣列及SMPM連接器陣列之轉換結構，其中，各組的轉接結構53係依據(ground-signal-ground,GSG)之通孔來進行配置。也就是說，本實施例的複數個SMPM連接器51可與測試設備或儀器直接連接，而複數組轉接結構53則與待測物(device under test,DUT)快速連接，因此，待測物僅需要蝕刻對應的同軸墊(coaxial pad)即可與本發明的天線封裝驗證板上的複數組轉接結構直接連接，無需額外的連接器。值得一提的是，各轉接結構53上的連接墊可設計或優化成適合的結構，以達到低損耗的轉換。 In this embodiment, as shown in FIGS. 3A and 3B, one side of the radio frequency circuit board 55 is provided with a complex array of switching structures 53, and the other side of the radio frequency circuit board 55 is provided with a plurality of SMPM connectors 51, and the complex array of switching The connection structure 53 and the plurality of SMPM connectors 51 are all arranged in an array into a 4x4 switching structure array and SMPM connector array conversion structure, wherein the switching structure 53 of each group is based on (ground-signal-ground, GSG) through holes for configuration. In other words, the plurality of SMPM connectors 51 of this embodiment can be directly connected to the test equipment or instrument, and the plurality of switching structures 53 are quickly connected to the device under test (DUT). Therefore, the device under test It is only necessary to etch the corresponding coaxial pad to directly connect with the complex array transfer structure on the antenna package verification board of the present invention, without additional connectors. It is worth mentioning that the connection pads on each transfer structure 53 can be designed or optimized into a suitable structure to achieve low-loss conversion.

值得一提的是，由於複數個SMPM連接器51可與測試設備或儀器直接連接且待測物不需要額外的連接器或轉接結構，所以本實施例可透過複數個SMPM連接器51及複數組轉接結構53，分別測試天線陣列板的天線陣 列之特性及電子電路板的電子元件之特性，進而降低毫米波天線及其電路在驗證上的困難。 It is worth mentioning that, since a plurality of SMPM connectors 51 can be directly connected to test equipment or instruments and the object under test does not require additional connectors or adapter structures, this embodiment can use a plurality of SMPM connectors 51 and a plurality of Group switching structure 53, respectively test the antenna array of the antenna array board The listed characteristics and the characteristics of the electronic components of the electronic circuit board, thereby reducing the difficulty of verification of the millimeter wave antenna and its circuit.

在本實施例中，設置有複數個SMPM連接器51及複數組轉接結構53的天線封裝驗證板可固設於波束成形測試平台上，本實施例可以將天線封裝分成天線及電路來進行各自的測試。因此，可以不需要製作多種電路板及天線，進而可節省設計上的成本。 In this embodiment, the antenna package verification board provided with a plurality of SMPM connectors 51 and a plurality of switching structures 53 can be fixed on the beamforming test platform. In this embodiment, the antenna package can be divided into antennas and circuits for each Test. Therefore, there is no need to fabricate multiple circuit boards and antennas, thereby saving design costs.

在本實施例中，值得注意的是，可利用複數個設置有SMPM連接器51及轉接結構53的轉換驗證板對設置於中間的待測物(例如，天線陣列板或電子電路板)進行測試及驗證，因此應用上將不會再限制於電路板本身的疊構限制。 In this embodiment, it is worth noting that a plurality of conversion verification boards provided with SMPM connectors 51 and transition structures 53 can be used to perform a test on the object under test (for example, an antenna array board or an electronic circuit board) disposed in the middle. Testing and verification, so the application will no longer be limited to the stacking restrictions of the circuit board itself.

[第四實施例] [Fourth Embodiment]

請參閱圖4A、圖4B及圖4C，其分別為本發明之天線封裝驗證板第四實施例的立體組合俯視圖、立體組合仰視圖及立體分解圖。本實施例包含底部天線封裝驗證板71、帶通濾波器電路板81以及頂部天線封裝驗證板91，其中，帶通濾波器電路板81設置在底部天線封裝驗證板71與頂部天線封裝驗證板91之間，設置在其中的帶通濾波器電路板81亦可以其他電路板置換，或者在帶通濾波器電路板81的上方及/或下方加入其他電路板。換言之，多個電路板可堆疊於其中，同時進行多個電路板的量測與驗證。 Please refer to FIG. 4A, FIG. 4B and FIG. 4C, which are respectively a three-dimensional combined top view, a three-dimensional combined bottom view and a three-dimensional exploded view of the fourth embodiment of the antenna package verification board of the present invention. This embodiment includes a bottom antenna package verification board 71, a band pass filter circuit board 81, and a top antenna package verification board 91. The band pass filter circuit board 81 is set on the bottom antenna package verification board 71 and the top antenna package verification board 91. Meanwhile, the band-pass filter circuit board 81 provided therein can also be replaced by other circuit boards, or other circuit boards can be added above and/or below the band-pass filter circuit board 81. In other words, multiple circuit boards can be stacked in it, and measurement and verification of multiple circuit boards can be performed at the same time.

在本實施例中，底部天線封裝驗證板71、帶通濾波器電路板81及頂部天線封裝驗證板91依序堆疊，並可固設於一波束成形測試平台101上，該波束成形測試平台101包含治具本體1011以及複數個固定夾具 1013，前述測試平台及夾具係為例示說明，並非作為本發明之限制。此外，本實施例之波束成形測試平台101中的治具本體1011之中心具有一開口1015，以利於透過該開口1015對設置於波束成形測試平台101上的天線封裝驗證板或電路板之上下兩面進行測試及驗證。 In this embodiment, the bottom antenna package verification board 71, the band-pass filter circuit board 81, and the top antenna package verification board 91 are stacked in sequence, and can be fixed on a beamforming test platform 101. The beamforming test platform 101 Contains a fixture body 1011 and a plurality of fixing fixtures 1013. The aforementioned test platform and fixture are just examples and not as a limitation of the present invention. In addition, the fixture body 1011 in the beamforming test platform 101 of this embodiment has an opening 1015 at the center, so as to facilitate access to the upper and lower sides of the antenna package verification board or the circuit board provided on the beamforming test platform 101 through the opening 1015. Perform testing and verification.

具體而言，圖5A及圖5B分別為本實施例的底部天線封裝驗證板71之上部的立體圖及局部放大立體圖。圖6A及圖6B分別為本實施例的底部天線封裝驗證板71之下部的立體圖及局部放大立體圖。如圖4C、5A、5B、6A、6B所示，底部天線封裝驗證板71之上部具有複數個轉接結構711，並與帶通濾波器電路板81之下部電性連接，其中，複數個轉接結構711係以陣列方式排列，而底部天線封裝驗證板71之下部則具有複數個推入式連接器713(例如SMPM連接器)，其中，複數個推入式連接器713也以陣列方式排列，透過接地-訊號-接地(ground-signal-ground,GSG)之通孔(未顯示)，複數個推入式連接器713與複數組轉接結構711電性連接。 Specifically, FIGS. 5A and 5B are respectively a perspective view and a partially enlarged perspective view of the upper part of the bottom antenna package verification board 71 of this embodiment. 6A and 6B are respectively a perspective view and a partially enlarged perspective view of the lower part of the bottom antenna package verification board 71 of this embodiment. As shown in FIGS. 4C, 5A, 5B, 6A, and 6B, the upper part of the bottom antenna package verification board 71 has a plurality of transfer structures 711, and is electrically connected to the lower part of the band-pass filter circuit board 81, wherein the plurality of transfer structures The connection structure 711 is arranged in an array, and the lower part of the bottom antenna package verification board 71 has a plurality of push-in connectors 713 (such as SMPM connectors), and the plurality of push-in connectors 713 are also arranged in an array. , Through the ground-signal-ground (GSG) through holes (not shown), the plurality of push-in connectors 713 are electrically connected to the complex array transfer structure 711.

圖7A及圖7B分別為本實施例的帶通濾波器電路板81之上部的立體圖及局部放大立體圖。如圖7A及圖7B所示，帶通濾波器電路板81之上部具有複數組轉接結構811，並與上方的頂部天線封裝驗證板91之下部電性連接，其中，複數個轉接結構811係以陣列方式排列。圖8A及圖8B分別顯示本實施例的帶通濾波器電路板81之下部的立體圖及局部放大立體圖。如圖8A及圖8B所示，帶通濾波器電路板81之下部為帶通濾波器電路結構813，透過接地-訊號-接地(GSG)之連接墊(pad)，帶通濾波器電路板81之下部與下方的底部天線封裝驗證板71之上部電性連接。 7A and 7B are respectively a perspective view and a partially enlarged perspective view of the upper portion of the bandpass filter circuit board 81 of this embodiment. As shown in FIGS. 7A and 7B, the upper portion of the band-pass filter circuit board 81 has a complex array of switching structures 811, and is electrically connected to the lower portion of the upper top antenna package verification board 91, wherein a plurality of switching structures 811 It is arranged in an array. 8A and 8B respectively show a perspective view and a partially enlarged perspective view of the lower part of the band-pass filter circuit board 81 of this embodiment. 8A and 8B, the lower part of the band-pass filter circuit board 81 is a band-pass filter circuit structure 813, through the ground-signal-ground (GSG) connection pad (GSG), the band-pass filter circuit board 81 The lower part is electrically connected to the upper part of the lower antenna package verification board 71.

圖9A為本實施例的頂部天線封裝驗證板91之上部的立體圖，而圖9B及圖9C則分別顯示本實施例的頂部天線封裝驗證板91之下部的立體圖及局部放大立體圖。如圖9A、9B、9C所示，頂部天線封裝驗證板91之上部具有複數個推入式連接器911(例如SMPM連接器)，而頂部天線封裝驗證板91之下部則具有複數組接地-訊號-接地(GSG)之連接墊913，並與其下方的帶通濾波器電路板81之上部電性連接。 9A is a perspective view of the upper part of the top antenna package verification board 91 of this embodiment, and FIGS. 9B and 9C respectively show a perspective view and a partially enlarged perspective view of the lower part of the top antenna package verification board 91 of this embodiment. As shown in FIGS. 9A, 9B, and 9C, the upper part of the top antenna package verification board 91 has a plurality of push-in connectors 911 (such as SMPM connectors), and the lower part of the top antenna package verification board 91 has a plurality of ground-signals -The ground (GSG) connection pad 913 is electrically connected to the upper part of the band-pass filter circuit board 81 below it.

綜上所述，本發明之上述具體實施例可以有效地縮短天線封裝的開發時間，也就是可以藉由本發明的驗證板來快速抽換天線或電路，以進行其各自的驗證及測試，可以大幅縮短天線封裝的開發時程。另外，在整體測試系統整合上，可以更加具備測試的彈性。此外，由於電路的操作頻寬較為寬頻，天線則較為窄頻，所以在測試不同頻段的特性時，僅需更換天線，而無需重新設計及製作電路，因此應用上也較傳統的測試結構更為寬廣。 In summary, the above-mentioned specific embodiments of the present invention can effectively shorten the development time of the antenna package, that is, the verification board of the present invention can be used to quickly replace the antenna or circuit for their respective verification and testing, which can greatly Shorten the development timeline of antenna packaging. In addition, the integration of the overall test system can be more flexible in testing. In addition, since the operating bandwidth of the circuit is relatively wide, and the antenna is relatively narrow, when testing the characteristics of different frequency bands, only the antenna needs to be replaced without the need to redesign and make the circuit. Therefore, the application is more than the traditional test structure. broad.

上述實施形態僅為例示性說明本發明之技術原理、特點及其功效，並非用以限制本發明之可實施範疇，任何熟習此技術之人士均可在不違背本發明之精神與範疇下，對上述實施形態進行修飾與改變。然任何運用本發明所教示內容而完成之等效修飾及改變，均仍應為下述之申請專利範圍所涵蓋。而本發明之權利保護範圍，應如下述之申請專利範圍所列。 The above-mentioned embodiments are only illustrative to illustrate the technical principles, features and effects of the present invention, and are not intended to limit the scope of the present invention. Anyone familiar with this technology can do the same without departing from the spirit and scope of the present invention. The above embodiment is modified and changed. However, any equivalent modifications and changes made by using the teachings of the present invention should still be covered by the scope of the following patent applications. The scope of protection of the rights of the present invention shall be as listed in the following patent scope.

11:天線陣列板 11: Antenna array board

11’:電子電路板 11’: Electronic circuit board

13:SMPM連接器 13: SMPM connector

Claims (20)

一種天線封裝驗證板，包括：載板，用於設置天線陣列或電子電路；複數組接地-訊號-接地(ground-signal-ground,GSG)之通孔，係以陣列方式形成於該載板中；以及複數個推入式連接器，係以陣列方式排列於該載板上，其中，各該複數個推入式連接器係透過各該複數組接地-訊號-接地(ground-signal-ground,GSG)之通孔與該載板上的該天線陣列之各天線或該電子電路之各電子元件電性連接，以測試該載板上的天線陣列之特性或該載板上的電子電路之特性。 An antenna package verification board, including: a carrier board for setting an antenna array or electronic circuit; a complex array of ground-signal-ground (GSG) through holes formed in the carrier board in an array And a plurality of push-in connectors are arranged in an array on the carrier board, wherein each of the plurality of push-in connectors is ground-signal-ground (ground-signal-ground, The through holes of GSG) are electrically connected to the antennas of the antenna array on the carrier board or the electronic components of the electronic circuit to test the characteristics of the antenna array on the carrier board or the electronic circuit on the carrier board . 如請求項1所述之天線封裝驗證板，其中，各該複數個推入式連接器包括連接墊(pad)。 The antenna package verification board according to claim 1, wherein each of the plurality of push-in connectors includes a connection pad. 如請求項1所述之天線封裝驗證板，其中，該天線陣列為毫米波(mmWave)天線陣列，該電子電路為毫米波電子電路。 The antenna package verification board according to claim 1, wherein the antenna array is a millimeter wave (mmWave) antenna array, and the electronic circuit is a millimeter wave electronic circuit. 如請求項1所述之天線封裝驗證板，其中，該天線封裝驗證板固設於波束成形測試平台上。 The antenna package verification board according to claim 1, wherein the antenna package verification board is fixed on a beamforming test platform. 如請求項1所述之天線封裝驗證板，其中，該複數個推入式連接器係與測試設備相連接。 The antenna package verification board according to claim 1, wherein the plurality of push-in connectors are connected with test equipment. 如請求項1所述之天線封裝驗證板，其中，該複數個推入式連接器為超小型推入式微(Sub-Miniature Push-on Micro；SMPM)連接器。 The antenna package verification board according to claim 1, wherein the plurality of push-in connectors are sub-miniature push-on micro (SMPM) connectors. 一種天線封裝驗證板，包括：載板，係用於設置天線陣列或電子電路； 複數組接地-訊號-接地(ground-signal-ground,GSG)之通孔，係以陣列方式形成於該載板中；以及複數組轉接結構，係以陣列方式排列於該載板上，其中，各該複數組轉接結構係透過各該複數組接地-訊號-接地(ground-signal-ground,GSG)之通孔，與該載板上的該天線陣列之各天線或與該載板上的該電子電路之各電子元件電性連接，以測試該載板上的天線陣列之特性或該載板上的電子電路之特性。 An antenna package verification board, including: a carrier board, which is used to set an antenna array or an electronic circuit; A complex array of ground-signal-ground (GSG) through holes are formed in an array on the carrier board; and a complex array of transfer structures are arranged in an array on the carrier board, wherein , Each of the complex array switching structures is connected with each antenna of the antenna array on the carrier board or with the carrier board through the ground-signal-ground (GSG) through holes of the complex arrays The electronic components of the electronic circuit are electrically connected to test the characteristics of the antenna array on the carrier board or the characteristics of the electronic circuit on the carrier board. 如請求項7所述之天線封裝驗證板，其中，各該複數組轉接結構中的每一轉接結構包括連接墊(pad)。 The antenna package verification board according to claim 7, wherein each switching structure in each of the plurality of switching structures includes a connection pad. 如請求項7所述之天線封裝驗證板，其中，該天線陣列為毫米波(mmWave)天線陣列，該電子電路為毫米波電子電路。 The antenna package verification board according to claim 7, wherein the antenna array is a millimeter wave (mmWave) antenna array, and the electronic circuit is a millimeter wave electronic circuit. 如請求項7所述之天線封裝驗證板，其中，該天線封裝驗證板固設於波束成形測試平台上。 The antenna package verification board according to claim 7, wherein the antenna package verification board is fixed on a beamforming test platform. 如請求項7所述之天線封裝驗證板，其中，該複數組轉接結構與測試設備相連接。 The antenna package verification board according to claim 7, wherein the complex array switching structure is connected with the test equipment. 如請求項7所述之天線封裝驗證板，其中，該複數組轉接結構與電路板相連接。 The antenna package verification board according to claim 7, wherein the plurality of switching structures are connected to the circuit board. 一種天線封裝驗證板，包括：載板，係供設置射頻電路；複數組接地-訊號-接地(ground-signal-ground,GSG)之通孔，係以陣列方式形成於該載板中；複數個連接器，係以陣列方式排列於該載板的一面上；以及 複數組轉接結構，係以陣列方式排列於該載板的另一面上，其中，各該複數個連接器係透過各該複數組接地-訊號-接地(ground-signal-ground,GSG)之通孔而與各該複數組轉接結構電性連接。 An antenna package verification board, comprising: a carrier board for setting up radio frequency circuits; a complex array of ground-signal-ground (GSG) through holes formed in the carrier board in an array; plural The connectors are arranged in an array on one side of the carrier board; and The complex array switching structure is arranged in an array on the other side of the carrier board, wherein each of the plurality of connectors is connected through the ground-signal-ground (GSG) communication of each of the complex arrays. The holes are electrically connected with each of the plurality of switching structures. 如請求項13所述之天線封裝驗證板，其中，各該複數個連接器包括連接墊(pad)。 The antenna package verification board according to claim 13, wherein each of the plurality of connectors includes a connection pad. 如請求項13所述之天線封裝驗證板，其中，各該複數組轉接結構中的每一轉接結構包括連接墊(pad)。 The antenna package verification board according to claim 13, wherein each switching structure in each of the plurality of switching structures includes a connection pad. 如請求項13所述之天線封裝驗證板，其中，該複數個連接器與測試設備相連接，該複數組轉接結構與待測物相連接。 The antenna packaging verification board according to claim 13, wherein the plurality of connectors are connected with the test equipment, and the plurality of switching structures are connected with the object under test. 如請求項13所述之天線封裝驗證板，其中，該複數個連接器及/或該複數組轉接結構與電路板相連接。 The antenna package verification board according to claim 13, wherein the plurality of connectors and/or the plurality of switching structures are connected to the circuit board. 如請求項16所述之天線封裝驗證板，其中，該待測物為毫米波(mmWave)天線陣列或毫米波電子電路。 The antenna package verification board according to claim 16, wherein the object under test is a millimeter wave (mmWave) antenna array or a millimeter wave electronic circuit. 如請求項13所述之天線封裝驗證板，其中，該天線封裝驗證板固設於波束成形測試平台上。 The antenna package verification board according to claim 13, wherein the antenna package verification board is fixed on a beamforming test platform. 如請求項13所述之天線封裝驗證板，其中，該複數個連接器為超小型推入式微連接器為(Sub-Miniature Push-on Micro；SMPM)連接器。 The antenna package verification board according to claim 13, wherein the plurality of connectors are sub-miniature push-on micro (Sub-Miniature Push-on Micro; SMPM) connectors.
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