JPS61239701A - Triplet line type t branch - Google Patents

Abstract

PURPOSE:To increase the mount density of a T branch in a dielectric substrate by providing the T branch between triplet lines which differ in hierachy by using an intersubstrate connecting element. CONSTITUTION:The through hole of strip patterns 4, 6, and 7 is plated and triplet lines 2a, 2b, and 2c are connected electrically through respective dielectric substrate. The T branch constituted as mentioned above consists of the triplet lines 2a, 2b, and 2c having different electric impedance, e.g. 50, 70.7, and 70.7OMEGA and the electric length of the triplet lines 2b and 2c is lambdag/4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an improvement of a microwave phase triplate line type T-branch (hereinafter referred to as T-branch) using a multilayer substrate.

[Conventional technology]

FIG. 6 shows a partially cutaway perspective view of a conventional triplate strip line (hereinafter referred to as triplate line) disclosed in, for example, Japanese Unexamined Patent Publication No. 56-154804.

In the figure, (1a) has a line width W on a part of one side)
A dielectric substrate A made of a dielectric material with a relative dielectric constant ε1, with a +3 prong conductor (2) and a base plate (3) made of metal adhered to the entire surface of the other surface, (+) is only on one surface. This is a dielectric substrate B with a ground plate (3) in close contact with the entire surface.

Compared to microstrip lines, this triplate line has a closed system, so it has advantages such as no radiation loss and no influence on other devices other than leakage power, so it is often used in antenna feeding circuits, etc. It will be done.

FIG. 1 shows a plan view of a T-branch using this triplate line.

In the figure, (2a) is the input/output terminal P1 of the T branch. P2. P
3 triplate line, (2b) and (2c) are T
This is a triplate line with different characteristic impedance that makes up the branch. Tri-plate line (21))? (2
6) The characteristic impedance Zob t ”00 is determined by the characteristic impedance zOIL of the triplate line (2a) and the output power ratio 1, for example, the output terminal P2.
When the output power to P5 is 131B and zoa is 50Ω, t
zOb -zoo -ro, ro. Furthermore, the axial length 2 of the triplate lines (2b) and (2c) at this time is, for example, λg/4.

Here, λ8 is the propagation wavelength. At this time, in this T branch, the microwave power inputted from two, for example, Pl in FIG. 1, is divided into nine equal parts and becomes output power from P2 and P3.

: [4 problems that the invention is trying to solve]
The conventional dielectric substrate using T-branches configured in this manner has the following problems.

(1) Since it has a shape in which two triplate lines each having a length of λg/4 on one side are connected to one dielectric substrate, the occupied area on one plane is large, and the packaging density of microwave components is high. It gets lower.

(2) If this T-branch requires a large number of multi-distribution circuits or a large number of microwave components, the placement of the T-branch is restricted and cannot be configured on the same plane, making it necessary to use a larger dielectric substrate. Or, the number of dielectric substrates must be increased.

The present invention was made to improve these problems, and aims to increase the mounting density of T-branches within a dielectric substrate and eliminate restrictions on arrangement.

[Means for solving problems]

First, an example will be given to the extent necessary for explaining the present invention.

A triplate line type board-to-board connection element (hereinafter referred to as board-to-board connection) that connects different triplate lines in one layer when a dielectric board used in microwave is multilayered is disclosed in Japanese Patent Application Laid-open No. 56-154805. element) will be explained.

FIG. 8 is a partially removed perspective view of this inter-board connecting element. In the figure, (4), (5), (61, (7)) are
The strip patterns are B, O, and D, respectively.

On one side of the dielectric substrate A (1a) of this inter-board connection element, a strip pattern Bt5) and a strip pattern D (7), which are shown in an enlarged view in FIG. A triplate line A-(2a) is connected to B(5). In addition, dielectric substrate A (1
The other surface (base plate (3) side) of a) is provided with a strip pattern whose enlarged view is shown in FIG. 2(B).

Similarly, 'dielectric substrate B (1b) has a
Strip pattern A+41. is shown in an enlarged view. Strip pattern D (7) is shown in Figure 3 (B) on the main plate (3) side.
) is provided with a strip pattern A(4) shown in an enlarged view.

The dielectric substrate 0 (1a) is provided with a strip pattern A (41) and a strip pattern D (7), which are shown in an enlarged view in FIG. A (
2a) is connected.

□ 1 Also, on the main plate (3) side, there is a strip pattern A (4) shown in an enlarged view in Figure 3 (B).
is provided. Dielectric substrate 1 1 Plate D (1 (1) has a strip pattern D (7) whose enlarged view is shown in FIG. 9 (A).
Each side is provided with a strip pattern, an enlarged view of which is shown in FIG. 9(B).

The quotients of the formed strip patterns shown in FIG. 2 (A) and (B) are respectively defined as the front and back sides of the dielectric substrate A (1a), and similarly, the quotients of the strip patterns shown in FIG. 3 (A) and (B) are The surfaces on which the strip patterns shown are formed are the front and back sides of dielectric plates B (1b) and 0 (1c), respectively, and
The surfaces on which the strip patterns shown in (A) and (B) of the figure are formed are the front side and back side of the dielectric substrate D (14), respectively.

Strip pattern A141. The through hole provided in DlF) is. Plating is applied to the system through-hole portion by a plating method called through-hole plating 1.

FIG. 10 shows a cross-sectional view of the through-hole portion after through-hole plating. As a result, the dielectric substrate 'A (1
Triplate line A (2a) of a) is connected to triplate line A (2a) of dielectric substrate 0 (1c) via strip pattern B (51, strip pattern A (4)).
and.

In addition, strip pattern D of dielectric substrate A (1a)
(7) is electrically connected to the strip pattern D (7) of the dielectric substrate D (1a) via the ground plane (3) of each dielectric substrate.

In other words, through-hole plating is used to electrically connect strip patterns on the front and back sides of a dielectric substrate.

In an inter-board connection element configured using such a dielectric substrate, the propagation mode of the dielectric substrate B (1b) and O (1c) portions can be equivalently considered as a coaxial mode. In other words, from strip pattern A (4) to strip pattern B (51f: connecting strip A, *-the outer diameter of the inner conductor of the coaxial line shown in FIG. The electrically equivalent short-circuit surface formed by the through-hole plating outer diameter is the first
This is considered to be the inner diameter of the outer conductor of the coaxial line shown in Figure 1.

'CC't', 2') IJ7'/<
/ -70 (7, yo...

The distance between adjacent through-hole platings shall be sufficiently small compared to the wavelength. Therefore, the characteristic impedance of this coaxial line can be easily adjusted by changing the outer diameter of the through-hole plating provided in the strip pattern A (4) and the dimensions of the electrically equivalent short-circuit surface.

In order to increase the mounting density of microwave components on one dielectric substrate, the T-branch according to the present invention uses the above-mentioned inter-board connecting element to increase the mounting density of microwave components on one dielectric substrate.
The branch is constructed with a three-dimensional circuit.

[Effect]

In this invention, an inter-board connection element is used.

By providing T-branches between triplate lines of different levels, the mounting density of T-branches within the dielectric substrate is increased.

Furthermore, restrictions on the arrangement of T-branches within the dielectric substrate are eliminated.

〔Example〕

FIG. 1 is a partially removed perspective view of a T-branch of a three-dimensional circuit showing an embodiment of the present invention.

In the figure, (1a) to (51, (7)) are exactly the same as the conventional τ branch and board-to-board connection element described above. (6) is a strip pattern C. The T-branch according to the present invention Line A (2a), B (2b),
O(2c) and dielectric substrate B(1b), O(1
c) an equal amount axial line formed within.

The dielectric substrate A (1a) of the T branch of this three-dimensional circuit has the following.

Strip pattern B 1 whose enlarged view is shown in FIG. 2 (A)
5) and a strip pattern D(7) are provided.
On the ground plate (3) side of the dielectric substrate A (1a), as shown in Fig. 2 (
A strip pattern is provided, an enlarged view of which is shown in B).

Here, a triplate line a (2a) is connected to the strip pattern B (5). Similarly, dielectric substrate B (1b) has strip pattern A (4) and strip pattern D (7) shown in an enlarged view in FIG. 3(A).
but.

On the main plate (3) side, an enlarged view is shown in Figure 3 (B)) I
A J-shaped pattern A(4) is provided. The dielectric substrate 0 (1c) has a strip pattern A (4) and a strip pattern C shown in an enlarged view in FIG. 4(A).
(6) There is a space shown in Figure 4 (B) on the cal base plate (3) side.
An IJ knob putter 7A (4) is provided (・Here, the strip pattern (4) includes triplate lines B (2b), O (2c) and triplate line A (2b) and O (2c) for configuring a T branch. 2a) are connected to the dielectric substrate D (1(1)).

Strip pattern B (5
) and strip pattern C (6), and the strip pattern shown in FIG. 5(B) is provided on the main plate (3) side. As shown in FIG. 10, the through-holes of strip pattern A (4) and strip pattern Ote+ and strip pattern D (7) are plated on the through-hole portions, and the tri-plate line A (
2a), B (2b), and O(2c) are electrically connected via each dielectric substrate.

In the T branch configured as above, triplate lines A (2a) and B with different characteristic impedances are used.
(2b) and O(2c), and the characteristic impedance of each is 1, for example, 50Ω, TO, 7Ω, as before.
.

The electrical length of the triplate lines E (zb) and C (2c) is λg/4.

Therefore, in this T branch, the microwave power input from Pl is transmitted through the triplate line h (2a), the inter-board connecting element, the triplate line B (2b) and 0 (20),
) It passes through ribbed line A (2a) and is equally distributed and output to P2 and P3.

From these, it can be seen that the T-branch of the present invention exhibits good characteristics similar to the conventional T-branch shown in FIG.

In addition, in the above embodiment, T which equally distributes the microwave power
Although branching has been described, it goes without saying that the present invention is not limited to this and can also be applied to unequal distribution T-branches.Furthermore, although the present invention has been described using four dielectric substrates,
The present invention can also be applied to a multilayer dielectric substrate composed of four or more dielectric substrates. Furthermore, the characteristic impedance and axial length of the triplate line forming the T-branch are not limited to the values used in the explanation.

〔Effect of the invention〕

As explained above, this invention
The use of T-branches has the effect of increasing the packaging density of microwave components on one dielectric substrate. '' Also, from the T-branch of the planar circuit to the T-branch of the three-dimensional circuit...
This has the effect of preventing an increase in the number of dielectric substrates even when a large number of microwave components are required.

[Brief explanation of drawings]

FIG. 1 is a partially removed perspective view showing one embodiment of the present invention, and FIGS. 2(A) and 2(B) are strip pattern B. D, tri-plate line A and the strip formed on the back side of the board)
An enlarged view of the IJ knob pattern, Figures 3 (A) and (B) are strip patterns A and D, and the strip patterns formed on the back side of the substrate.) An enlarged view of the IJ knob pattern A, Figure 4 (A),
(B) shows strip patterns A and O and triplate line A. B, O is an enlarged view of the strip pattern A formed on the back side of the substrate, and FIG. Fig. 6 is a perspective view with a portion of the triplate line removed, and Fig. 1 is a plan view of a conventional T-branch. Figure 8 is a partially removed perspective view of an inter-board connection element that connects triplate lines in different layers when dielectric substrates used in conventional microwaves are multilayered; Figure 9 (A)
, (B) is an enlarged view of the +7 strip pattern D and the strip pattern formed on the back surface of the substrate. FIG. 10 is an explanatory diagram of through-hole plating, and FIG. 11 is an explanatory diagram of a coaxial line. In the figure, (1a)t(To)t(1c)? (11) are dielectric substrates A and 'B. 0, DI (2a)? (2b)? (20) are triplate lines A and B. C2 (3) is the main plate, (41 is the strip pattern A, f
f1l office strip pattern B, +6) is strip pattern 0, +71 is strip pattern '/D, (81 is the inner conductor of the coaxial line, (9) is the outer conductor of the coaxial line. Note that in the two figures, the same symbols are , indicating the same or equivalent parts.

Claims (1)

[Claims] A dielectric substrate with a conductor on one side only, a dielectric substrate with a conductor on one side and a strip conductor on the other, and two dielectric substrates with the conductor on the outside. In a T-branch using triplate strip lines configured by stacking one another, the dielectric substrate is multilayered in the thickness direction of the substrate, and the dielectric substrate is connected between the triplate strip lines of different layers from the triplate strip line. A tri-plate type board-to-board connection that electrically connects tri-plate strip lines on different levels by providing multiple through holes perpendicular to the thickness direction of the body board and providing a plating layer on the inner wall of the through holes. A triplate line type T-branch, characterized in that the T-branch is configured three-dimensionally in the thickness direction of a multilayered dielectric substrate on which elements are formed.