TWM581775U - High-frequency antenna device - Google Patents

Abstract

The present invention discloses a high frequency antenna device suitable for use in an operating frequency band between 20 GHz and 45 GHz. The radio-frequency antenna device includes a substrate, an antenna array disposed on one side of the substrate, a processing wafer and a down-converting chip disposed on the other side of the substrate, and a connector mounted on the substrate. The antenna array includes a plurality of antennas disposed at intervals, and the processing chip is electrically coupled to the plurality of antennas. The down-converted chip is electrically coupled to the down-converted chip, and can reduce a high-frequency signal from the processing chip and between 20 GHz and 45 GHz to a down-converted signal between 2 GHz and 6 GHz. The connector is electrically coupled to the processing chip and configured to transmit the down-converted signal.

Description

High frequency antenna device

The present invention relates to a high frequency antenna, and more particularly to a high frequency antenna device suitable for use at 20 GHz to 45 GHz.

The existing high frequency antenna is applied to the fourth generation mobile communication system (4G) standard, so the structure design of the existing high frequency antenna is only applicable to the non-millimeter wave frequency band (for example, 2.6 GHz), thus making the existing high frequency antenna difficult to be applied. In higher frequency bands (eg 20 GHz to 45 GHz) or millimeter wave bands. However, the increase in operating frequency has become a communication trend in the future. Therefore, how to improve the existing high-frequency antenna or to construct a new high-frequency antenna to meet the design requirements is a technical problem that needs to be faced in the field.

Therefore, the creator felt that the above defects could be improved. He devoted himself to research and cooperated with the application of scientific principles, and finally proposed a creation that is reasonable in design and effective in improving the above defects.

The present embodiment provides a high frequency antenna device that can effectively improve defects that may occur in existing high frequency antennas.

The present invention discloses a high frequency antenna device, which is applicable to an operating frequency band between 20 GHz and 45 GHz. The high frequency antenna device includes: a substrate including a first board surface and a second board on opposite sides a board array disposed on the first board surface of the substrate, and the antenna array includes a plurality of antennas disposed at intervals; at least one processing chip mounted on the second board of the substrate And at least one of the processing chips is electrically coupled to the plurality of antennas; at least one a frequency-down wafer mounted on the second surface of the substrate, and at least one of the down-converting wafers is electrically coupled to at least one of the processing wafers; wherein at least one of the down-converting wafers is capable of at least one A high frequency signal of the processing chip and ranging from 20 GHz to 45 GHz is down-converted to a frequency down signal between 2 GHz and 6 GHz; at least one connector is mounted on the substrate, and at least one of the connectors is electrically coupled And connected to at least one of the down-converted chips, and at least one of the connectors is configured to transmit the down-converted signal.

In summary, the high frequency antenna device disclosed in the embodiment of the present invention is provided with a down-converting chip, and the connector needs to be electrically coupled to the processing chip through a corresponding down-conversion chip to enable the connector. Can be used to transmit down-converted signals from corresponding down-converted chips. Accordingly, the high-frequency antenna device can adopt a connector with a lower specification to effectively reduce the production cost, thereby facilitating the promotion of the above-described high-frequency antenna device.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, but the drawings are only for reference and description, and are not intended to limit the scope of the present invention.

100‧‧‧High frequency antenna device

1‧‧‧Substrate

11‧‧‧ first board

12‧‧‧ second board

2‧‧‧Antenna array

20‧‧‧Subarray

21‧‧‧Antenna

211‧‧‧ center point

212‧‧‧Horizontal polarization feed point

213‧‧‧Vertically polarized feed point

3‧‧‧Processing wafer

4‧‧‧Connector

5‧‧‧Down Frequency Chip

S‧‧‧ spacing

S1‧‧‧first spacing

S2‧‧‧Second spacing

D1‧‧‧First distance

D2‧‧‧Second distance

D3‧‧‧ third distance

200, 200a, 200b‧‧‧ external electronic devices (eg mobile phones)

1 is a functional block diagram of a high frequency antenna device according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the high frequency antenna device according to the first embodiment of the present invention.

FIG. 3 is another perspective view of the high frequency antenna device according to the first embodiment of the present invention.

4 is a perspective view showing the high frequency antenna device of FIG. 1 when the antenna array is linearly arranged.

FIG. 5 is a perspective view of the high frequency antenna device of FIG. 1 when the antenna arrays are staggered.

6 is a perspective view of the high frequency antenna device of FIG. 1 when the antenna is in a rectangular shape.

Fig. 7 is a perspective view showing the high frequency antenna device of Fig. 1 when the antenna is in a circular form.

FIG. 8 is a functional block diagram of the high frequency antenna device according to the second embodiment of the present invention.

FIG. 9 is a perspective view of the high frequency antenna device according to the second embodiment of the present invention.

FIG. 10 is another perspective view of the high frequency antenna device according to the second embodiment of the present invention.

FIG. 11 is a plan view schematically showing the high frequency antenna device of FIG. 8 when a plurality of sub-arrays are linearly arranged.

Fig. 12 is a plan view schematically showing the high frequency antenna device of Fig. 8 when a plurality of sub-arrays are arranged in a matrix.

FIG. 13 is a schematic diagram showing the operation of the antenna array of the high frequency antenna device of FIG. 9 in the first mode.

FIG. 14 is a schematic diagram showing the operation of the antenna array of the high frequency antenna device of FIG. 9 in the first mode and the second mode.

15 is a schematic diagram showing the operation of the antenna array of the high frequency antenna device of FIG. 9 in the third mode.

16 is a functional block diagram of a high frequency antenna device according to a third embodiment of the present invention.

FIG. 17 is a perspective view of the high frequency antenna device according to the third embodiment of the present invention.

FIG. 18 is another perspective view of the high frequency antenna device according to the third embodiment of the present invention.

Please refer to FIG. 1 to FIG. 18 . For the embodiment of the present invention, it should be noted that the related quantity and appearance mentioned in the embodiment are only used to specifically describe the implementation manner of the present creation. In order to understand the content of this creation, not to limit the scope of protection of this creation.

[Example 1]

As shown in FIG. 1 to FIG. 7 , it is the first embodiment of the creation. This embodiment is a high frequency antenna device 100 suitable for use in an operating frequency band between 20 GHz and 45 GHz. That is to say, the radio-frequency antenna device 100 of the present embodiment excludes any antenna device not applied to 20 GHz to 45 GHz. The operating frequency band is further limited to be in the embodiment from 24 GHz to 26.5 GHz and 26.5 GHz to 28.5 GHz. One of the bands of 37 GHz to 40 GHz and 40 GHz to 43.5 GHz, but the creation is not limited thereto.

As shown in FIG. 1, the high-frequency antenna device 100 includes a substrate 1, an antenna array 2 disposed on one side of the substrate 1, and at least one processing chip 3 disposed on the other side of the substrate 1 and at least one The frequency-down wafer 5 and at least one connector 4 mounted on the substrate 1 are mounted. The number of the processing wafer 3, the down-converted chip 5, and the connector 4 is described in the present embodiment, but it can be adjusted and changed according to the type of the antenna array 2.

The substrate 1 includes a first board surface 11 and a second board surface 12 on opposite sides, and the substrate 1 is illustrated by a rectangular printed circuit board in this embodiment, but this creation does not Limited by this.

As shown in FIG. 2 and FIG. 3, the antenna array 2 is disposed on the first board surface 11 of the substrate 1, and the antenna array 2 is used to transmit a millimeter wave signal in this embodiment. As shown in FIG. 2, the antenna array 2 includes a plurality of antennas 21 arranged at intervals, and the plurality of antennas 21 are arranged in M columns and N rows, and both M and N are positive integers greater than 1, so that The plurality of antennas 21 constitute a matrix arrangement, but the present creation is not limited thereto. For example, as shown in FIG. 4, M is equal to 1, that is, the plurality of antennas 21 of the antenna array 2 may be arranged in a row; or, as shown in FIG. 5, the plurality of antennas 21 of the antenna array 2 Arranged in M columns, M is a positive integer greater than 1, and a plurality of antennas 21 of each column are arranged in a staggered arrangement with a plurality of antennas 21 of another adjacent column.

In more detail, the number of antennas 21 of the antenna array 2 is illustrated by 16 in FIG. 2, but the number of the antennas 21 described above may also be adjusted according to design requirements. Furthermore, the shapes of the plurality of antennas 21 are substantially the same, and the shape of each antenna 21 may be a square (eg, FIG. 2), a rectangle (eg, FIG. 6), or a circle (eg, Figure 7), but this creation is not limited to this. Furthermore, each of the antennas 21 described above is a single-polarized metal piece capable of horizontally or vertically polarized in this embodiment. Note, but this creation is not limited to this.

In addition, a center frequency of the operating frequency band corresponds to a wavelength; that is, the wavelength corresponds to a reciprocal of the center frequency. The center point 211 of any two adjacent antennas 21 (corresponding to the intersection of the two diagonal lines of the antenna 21 in FIG. 2) is spaced apart by a pitch S of 0.25 to 0.75 times the wavelength. Wherein, the pitch S is preferably between 0.35 and 0.65 times the wavelength (for example, 0.5 times the wavelength), but the creation is not limited thereto.

As shown in FIG. 2 and FIG. 3 , the processing chip 3 is mounted on the second board surface 12 of the substrate 1 , and the processing chip 3 is electrically coupled to the plurality of antennas 21 . That is, the handle wafer 3 of the present embodiment is soldered to the substrate 1 and electrically connected to the plurality of antennas 21 through a conductive path (not shown) formed on the substrate 1. Accordingly, the processing wafer 3 can control the phase and amplitude of the signals transmitted or received by the antenna array 2.

The down-converted chip 5 is mounted on the second board surface 12 of the substrate 1 , and the down-converted chip 5 is electrically coupled to the processing chip 3 . That is, the down-converted wafer 5 of the present embodiment is soldered to the substrate 1 and electrically connected to the processed wafer 3 through a conductive path (not shown) formed on the substrate 1. Further, the down-converted chip 5 can down-convert a high-frequency signal from the processing chip 3 and between 20 GHz and 45 GHz into a down-converted signal between 2 GHz and 6 GHz.

The connector 4 is mounted on the substrate 1 described above, and the connector 4 is mounted on a peripheral portion of the substrate 1 in this embodiment. The connector 4 is electrically coupled to the processing chip 3, and the connector 4 is configured to transmit the down-converted signal. That is, the connector 4 of the present embodiment is connected to the down-converting chip 5 through a conductive path (not shown) formed on the substrate 1, and is electrically coupled to the processing. Wafer 3. Accordingly, the high frequency antenna device 100 of the present embodiment can adopt the connector 4 with lower specification requirements (for example, the connector used in the standard of the fourth generation mobile communication system). 4), thereby effectively reducing the production cost, thereby facilitating the promotion of the above-described high frequency antenna device 100.

[Embodiment 2]

As shown in FIG. 8 to FIG. 15 , which is the second embodiment of the present invention, the embodiment is similar to the first embodiment, so the same parts of the two embodiments are not described again, and the difference between the two embodiments is Generally speaking, in the embodiment, as shown in FIG. 9 and FIG. 10, the antenna array 2 includes a plurality of sub-arrays 20 arranged at intervals, and each sub-array 20 includes a plurality of antennas 21 arranged in a plurality of columns. And the arrangement layout of the plurality of sub-arrays 20 is the same. In other words, the plurality of antennas 21 of the antenna array 2 in the first embodiment are arranged in a plurality of sub-arrays 20 in this embodiment. Further, the number of the sub-arrays 20 is described in four in FIG. 9 of the present embodiment, but the present creation is not limited thereto. For example, in other embodiments not shown in the present creation, the number of the plurality of sub-arrays 20 of the antenna array 2 may be two or more.

The center point 211 of any two adjacent antennas 21 in any one of the sub-arrays 20 is spaced apart by a first spacing S1, and the center points 211 of the two antennas 21 adjacent to each other but belonging to different sub-arrays 20 are equally spaced apart from each other. A second spacing S2 of the first spacing S1 is used to facilitate operation of the antenna array 2 in the second mode and the third mode in the following description. In other words, the first pitch S1 (or the second pitch S2) is equivalent to the pitch S of the first embodiment in this embodiment.

Moreover, the arrangement of the plurality of sub-arrays 20 of the antenna array 2 can be adjusted according to design requirements. For example, as shown in FIG. 11, the plurality of sub-arrays 20 may be arranged in a row; or, as shown in FIG. 9 and FIG. 12, the plurality of sub-arrays 20 may constitute a matrix arrangement.

As shown in FIGS. 9 and 10, the number of the processing wafers 3 is plural, and the number of the plurality of processing wafers 3 is equivalent to the sub-array of the antenna array 2 in this embodiment. Number of columns 20. The plurality of processing wafers 3 are electrically coupled to the plurality of sub-arrays 20, respectively, such that each of the sub-arrays 20 can be independently controlled by a corresponding one of the processing wafers 3.

The number of the down-converted wafers 5 is plural, and the number of the above-described plurality of down-converted wafers 5 is equivalent to the number of sub-arrays 20 of the antenna array 2 in this embodiment. The plurality of frequency-down wafers 5 are electrically coupled to the plurality of processing wafers 3, respectively, such that each of the processing wafers 3 can correspond to one of the frequency-down wafers 5.

The number of the connectors 4 is plural, and the number of the above-described plurality of connectors 4 is equivalent to the number of sub-arrays 20 of the antenna array 2 in this embodiment. The plurality of connectors 4 are electrically coupled to the plurality of down-converting chips 3, respectively, such that each of the down-converted wafers 5 can correspond to one of the connectors 4.

Further, the antenna array 2 includes a plurality of operation modes in the architecture of the high-frequency antenna device 100 of the embodiment, and the plurality of operation modes include a first mode and a second mode in this embodiment. And a third mode, but the creation is not limited to this. The antenna array 2 can operate in at least one of the foregoing multiple modes of operation; that is, the antenna array 2 can also perform two different modes of operation simultaneously (such as the antenna array 2 in FIG. 14). Synchronous execution of the first mode and the second mode).

The first mode: as shown in FIG. 13, any of the sub-arrays 20 performs wireless signal transmission with an external electronic device 200 (eg, a mobile phone) within a first distance D1. That is, when all the sub-arrays 20 of the antenna array 2 and the plurality of external electronic devices 200 respectively perform wireless signal transmission, the high-frequency antenna device 100 can synchronize and equalize the number of external electronic devices of the sub-array 20 The device 200 performs wireless signal transmission.

The second mode: as shown in FIG. 14, at least two adjacent sub-arrays 20 (eg, the upper two sub-arrays 20 in FIG. 14) cooperate with each other to be a second distance apart An external electronic device 200a (e.g., a mobile phone) in D2 performs wireless signal transmission, and the first distance D1 is smaller than the second distance D2. That is, when the distance between the external electronic device 200a and the high-frequency antenna device 100 is between the first distance D1 and the second distance D2, the antenna array 2 can be combined with each other by at least two adjacent sub-arrays 20 Wireless signal transmission is performed with the external electronic device 200a.

The third mode: as shown in FIG. 15, the entire sub-arrays 20 cooperate with each other to perform wireless signal transmission with an external electronic device 200b within a third distance D3, and the second distance D2 is smaller than the third mode. Distance D3. That is, when the distance between the external electronic device 200b and the high-frequency antenna device 100 is between the second distance D2 and the third distance D3, the antenna array 2 can cooperate with the entire sub-array 20 to cooperate with the external The electronic device 200b performs wireless signal transmission.

According to the above, the antenna array 2 of the radio-frequency antenna device 100 of the present embodiment can select at least one of the plurality of operation modes according to the position and the number of the external electronic devices 200, 200a, and 200b to enable the high-frequency. The antenna device 100 can effectively achieve better operational efficiency.

[Embodiment 3]

As shown in FIG. 16 to FIG. 18 , which is the third embodiment of the present invention, the embodiment is similar to the first embodiment, so the same portions of the two embodiments are not described again, and the difference between the two embodiments is Generally described as follows: In this embodiment, each antenna 21 is a dual-polarized metal piece capable of horizontal polarization and vertical polarization. Each antenna 21 preferably defines a horizontal polarization feed point 212 and a vertical polarization feed point 213. In each antenna 21, the horizontal polarization feed point 212 and the vertical polarization feed point 213 form a right angle with respect to the center point 211.

Furthermore, since each antenna 21 of the antenna array 2 in this embodiment operates in a dual polarization, the number of the connectors 4 and the number of the down-converted wafers 5 are two in the embodiment, and the The processing chip 3 is divided by the above two down-conversion chips 5 It is electrically coupled to the two connectors 4 .

[Technical Effects of the Present Creation Example]

In summary, the high frequency antenna device disclosed in the embodiment of the present invention is provided with a down-converting chip, and the connector needs to be electrically coupled to the processing chip through a corresponding down-conversion chip to enable the connector. Can be used to transmit down-converted signals from corresponding down-converted chips. Accordingly, the high-frequency antenna device can adopt a connector with a lower specification to effectively reduce the production cost, thereby facilitating the promotion of the above-described high-frequency antenna device.

Furthermore, the high frequency antenna device and the antenna array thereof disclosed in the embodiments of the present invention include a plurality of operation modes, and the antenna array can operate in at least one of the plurality of operation modes to enable the high frequency The antenna array of the antenna device can selectively perform at least one of the plurality of operation modes according to the position and the number of the external electronic devices, thereby enabling the high-frequency antenna device to effectively achieve better operational efficiency.

In addition, the high-frequency antenna device and the antenna array thereof disclosed in the embodiments of the present invention are arranged and designed through multiple antennas (eg, each antenna can be horizontally polarized and vertically polarized, and any two adjacent antennas) The center point interval has a specific value of spacing), so that it can be applied in the operating frequency band (or millimeter wave band) of 20 GHz to 45 GHz, and has better transmission efficiency.

The above description is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the present invention. Any changes and modifications made according to the scope of the present invention should be protected by the present invention.

Claims (10)

A high-frequency antenna device is applicable to an operating frequency range of 20 GHz to 45 GHz. The high-frequency antenna device includes: a substrate including a first board surface and a second board surface on opposite sides; an antenna An array disposed on the first board surface of the substrate, and the antenna array includes a plurality of antennas disposed at intervals; at least one processing wafer mounted on the second board surface of the substrate, and at least one The processing chip is electrically coupled to the plurality of antennas; at least one down-converting chip is mounted on the second board surface of the substrate, and at least one of the down-converting chips is electrically coupled to at least one Processing the wafer; wherein at least one of the down-converted chips can down-convert a high-frequency signal from at least one of the processing chips and between 20 GHz and 45 GHz to a down-converted signal between 2 GHz and 6 GHz; at least one connection And at least one of the connectors is electrically coupled to the at least one of the down-converted chips, and at least one of the connectors is configured to transmit the down-converted signal. The high-frequency antenna device according to claim 1, wherein the plurality of the antennas of the antenna array are divided into a plurality of sub-arrays arranged at intervals, and the arrangement layouts of the plurality of sub-arrays are the same; at least one of the The number of the processing chips is a plurality of and electrically coupled to the plurality of sub-arrays, and the number of the at least one of the down-converted wafers is multiple and electrically coupled to the plurality of processing wafers respectively; The antenna array includes a plurality of modes of operation, and the antenna array is operable to operate in at least one of the plurality of modes of operation, the plurality of modes of operation comprising: a first mode: any one The sub-array is for wireless signal transmission with an external electronic device within a first distance; and a second mode: two adjacent sub-arrays cooperate with each other to perform wireless signal transmission with an external electronic device within a second distance; wherein the first distance is smaller than the second distance. The high frequency antenna device according to claim 2, wherein the number of the plurality of subarrays of the antenna array is three or more, and the plurality of operation modes further includes a third mode: all of the sub The arrays cooperate with each other to wirelessly transmit signals to and from an external electronic device within a third distance, the second distance being less than the third distance. The radio-frequency antenna device of claim 3, wherein the plurality of sub-arrays of the antenna array are arranged in a row or form a matrix. The high-frequency antenna device according to claim 2, wherein a center point of any two adjacent ones of the sub-arrays is spaced apart by a first pitch, and adjacent to two of the different sub-arrays The center points of the antennas are spaced apart by a second pitch equal to the first pitch. The high frequency antenna device according to claim 5, wherein a center frequency of the operating frequency band corresponds to a wavelength, and the first pitch is between 0.25 and 0.75 times the wavelength. The radio-frequency antenna device according to claim 1, wherein the plurality of the plurality of antennas have the same outer shape, and each of the antennas has a square shape, a rectangular shape, or a circular shape. The high frequency antenna device according to claim 7, wherein the plurality of the antennas are arranged in M columns and N rows, and both M and N are positive integers greater than 1, such that the plurality of antennas form a matrix. arrangement. The high frequency antenna device according to claim 1, wherein a center frequency of the operating frequency band corresponds to a wavelength, and a center point interval of any two adjacent antennas is between 0.25 and 0.75 times wavelength spacing. The high frequency antenna device according to claim 1, wherein the operating frequency band is further limited to be between 24 GHz and 26.5 GHz, 26.5 GHz to 28.5 GHz, and 37 GHz. One of the bands of 40 GHz and 40 GHz to 43.5 GHz.