TWI738985B - Apparatus and method for wastewater treatment - Google Patents

Apparatus and method for wastewater treatment Download PDF

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TWI738985B
TWI738985B TW107108506A TW107108506A TWI738985B TW I738985 B TWI738985 B TW I738985B TW 107108506 A TW107108506 A TW 107108506A TW 107108506 A TW107108506 A TW 107108506A TW I738985 B TWI738985 B TW I738985B
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waste water
catalyst
gas
wastewater
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TW201834974A (en
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熊涼慈
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日商日本觸媒股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/72Treatment of water, waste water, or sewage by oxidation
    • C02F1/725Treatment of water, waste water, or sewage by oxidation by catalytic oxidation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30Hydrogen technology
    • Y02E60/50Fuel cells

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Abstract

本發明之課題係提供一種廢水處理裝置,該廢水處理裝置可防止水垢成分在觸媒表面上析出,由此可高度維持觸媒的處理性能。   本發明之廢水處理裝置係由廢水供給側依序具有分散板2、分散板1、充填物層及觸媒層,當上述分散板2與上述分散板1之距離為H1、上述分散板1與上述充填物層之廢水供給側的交界面之距離為H2、上述充填物層之層長為H3,以及上述H2與上述H3之合計為H6時,上述H6超出100mm,且相對於上述H1,上述H6之比(H6/H1)為0.1以上(包含0.1)100以下(包含100)。The subject of the present invention is to provide a waste water treatment device that can prevent the precipitation of scale components on the surface of the catalyst, and thereby can maintain the treatment performance of the catalyst to a high degree. The wastewater treatment device of the present invention has a dispersion plate 2, a dispersion plate 1, a filling layer, and a catalyst layer in sequence from the waste water supply side. When the distance between the dispersion plate 2 and the dispersion plate 1 is H1, the dispersion plate 1 and When the distance between the interface on the waste water supply side of the filling layer is H2, the layer length of the filling layer is H3, and the sum of the above H2 and the above H3 is H6, the above H6 exceeds 100mm, and relative to the above H1, the above The ratio of H6 (H6/H1) is 0.1 or more (including 0.1) and 100 or less (including 100).

Description

廢水處理裝置及廢水處理方法Waste water treatment device and waste water treatment method

本發明係有關一種廢水處理裝置及廢水處理方法。 The invention relates to a waste water treatment device and waste water treatment method.

化學工廠、食品加工設備、金屬加工設備、金屬鍍敷設備、印刷製版設備、照相處理設備等之各種產業工廠所排出的廢水,可藉由濕式氧化法、濕式分解法、臭氧氧化法,過氧化氫氧化法等之各種方法進行淨化處理。 Wastewater discharged from various industrial plants such as chemical factories, food processing equipment, metal processing equipment, metal plating equipment, printing and plate making equipment, photographic processing equipment, etc., can be treated by wet oxidation, wet decomposition, and ozone oxidation. Purification treatment is carried out by various methods such as hydrogen peroxide method.

例如,在固體觸媒充填至反應塔之濕式氧化法時,通常主要係從固體觸媒充填層(觸媒層)的下部導入廢水及含氧氣體而將廢水進行淨化處理者。因此,藉由所導入之廢水及含氧氣體的作用,而容易引起在觸媒層內的固體觸媒之移動、振動等之運動,藉由固體觸媒之損耗、或廢水中所含水垢成分(銅、鐵等之重金屬類及鈣、鋁等)在觸媒表面析出,因而無法避免引發觸媒的處理性能降低等之問題。 For example, in the wet oxidation method in which the solid catalyst is filled in the reaction tower, the wastewater and oxygen-containing gas are usually introduced from the lower part of the solid catalyst packing layer (catalyst layer) to purify the wastewater. Therefore, due to the action of the introduced wastewater and oxygen-containing gas, it is easy to cause the movement and vibration of the solid catalyst in the catalyst layer, and the loss of the solid catalyst or the water-containing scale component in the wastewater (Heavy metals such as copper and iron, calcium, aluminum, etc.) are deposited on the surface of the catalyst, so it is unavoidable to cause problems such as a reduction in the handling performance of the catalyst.

專利文獻1中揭示一種廢水處理裝置,其係關於由從反應塔之下部導入之廢水等所引起的固體觸媒之損耗,通過在觸媒層之下設置金屬等充填物之層(下部充填物層),除了可防止固體觸媒之損耗,亦可將廢水等均勻地 供給至觸媒層,故可抑制觸媒的處理效率之降低。 Patent Document 1 discloses a waste water treatment device, which relates to the loss of solid catalyst caused by waste water introduced from the lower part of the reaction tower. Layer), in addition to preventing the loss of solid catalysts, the waste water can also be uniformly It is supplied to the catalyst layer, so the reduction in the processing efficiency of the catalyst can be suppressed.

專利文獻2中揭示通過將無觸媒濕式氧化反應層設置在固體觸媒層之前而提高在固體觸媒層之處理效率。而且,專利文獻3中揭示藉由在固體觸媒層之上部設置氣液分散構件而改善處理效率。 Patent Document 2 discloses that by disposing a catalyst-free wet oxidation reaction layer before the solid catalyst layer, the treatment efficiency in the solid catalyst layer is improved. Furthermore, Patent Document 3 discloses that the treatment efficiency is improved by providing a gas-liquid dispersion member on the upper portion of the solid catalyst layer.

(先前技術文獻) (Prior technical literature) (專利文獻) (Patent Document)

[專利文獻1]日本特許第5330751號公報 [Patent Document 1] Japanese Patent No. 5330751

[專利文獻2]日本特開2001-276855號公報 [Patent Document 2] Japanese Patent Application Publication No. 2001-276855

[專利文獻3]日本特開2004-098023號公報 [Patent Document 3] JP 2004-098023 A

的確,在專利文獻1中表明,通過設置下部充填物層,可防止觸媒之損耗而可抑制觸媒之處理效率的降低。 Indeed, Patent Document 1 shows that by providing a lower filling layer, the loss of the catalyst can be prevented and the reduction in the treatment efficiency of the catalyst can be suppressed.

然而,在專利文獻1所揭示之廢水處理裝置,廢水中包含水垢成分(銅、鐵等之重金屬類及鈣、鋁等)時,水垢成分會以離子狀態到達觸媒層而在觸媒表面析出,會有阻礙觸媒活性之問題。 However, in the wastewater treatment device disclosed in Patent Document 1, when the wastewater contains scale components (heavy metals such as copper and iron, calcium, aluminum, etc.), the scale components reach the catalyst layer in an ionic state and deposit on the surface of the catalyst. , There will be a problem of hindering the activity of the catalyst.

另一方面,專利文獻2中,盡管通過無觸媒濕式氧化反應層的設置而提高固體觸媒層之耐久性,惟在廢水處理能力方面並不足而需要第1處理步驟及第2處理步驟之反應塔,且該等需要進一步控制,故不利於成本。 On the other hand, in Patent Document 2, although the durability of the solid catalyst layer is improved by the installation of the catalyst-free wet oxidation reaction layer, the wastewater treatment capacity is insufficient, and the first treatment step and the second treatment step are required. The reaction tower, and these need to be further controlled, so it is not conducive to the cost.

另一方面,專利文獻3中,盡管通過氣液分散構件的設置而改善固體觸媒層之處理效率,然卻與專利文獻1所記載之發明相同,會因水垢成分而有耐久性的不足。 On the other hand, in Patent Document 3, although the treatment efficiency of the solid catalyst layer is improved by the provision of a gas-liquid dispersion member, it is the same as the invention described in Patent Document 1, but has insufficient durability due to scale components.

因此,本發明之目的係提供一種可防止水垢成分以離子狀態到達觸媒層者,亦即,可防止水垢成分在觸媒表面的析出而可高度維持觸媒的處理性能,然後能以簡便構造提供成本低的廢水處理裝置以及廢水處理方法。 Therefore, the object of the present invention is to provide a method that can prevent the scale components from reaching the catalyst layer in an ionic state, that is, prevent the precipitation of scale components on the surface of the catalyst, and can maintain the processing performance of the catalyst at a high level, and then can be constructed simply Provide low-cost wastewater treatment equipment and wastewater treatment methods.

本發明者為了解決上述問題而專心致志進行檢討。首先,對於專利文獻1所揭示之技術與專利文獻2所揭示之技術組合的型態,具體而言,專利文獻1之反應塔下部與專利文獻2之無觸媒濕式氧化反應層結合之型態進行檢討,然並無法得到充分的效果。因此,考慮到是否氣液分散性較差,參照專利文獻3,在無觸媒濕式氧化反應層中設置分散板,但仍無法得到充分的效果。更且,對於分散板之配置反覆進行各種檢討之結果,發現具有至少2片分散板,並將該配置設在特定範圍即可解決上述問題,遂而完成本發明。 In order to solve the above-mentioned problems, the inventors devoted themselves to the review. First, regarding the combination of the technology disclosed in Patent Document 1 and the technology disclosed in Patent Document 2, specifically, the combination of the lower part of the reaction tower of Patent Document 1 and the catalyst-free wet oxidation reaction layer of Patent Document 2 However, it is not possible to obtain sufficient results. Therefore, considering whether the gas-liquid dispersibility is poor, referring to Patent Document 3, a dispersion plate is provided in the catalyst-free wet oxidation reaction layer, but a sufficient effect is still not obtained. Furthermore, as a result of various reviews of the dispersing plate arrangement, it was found that having at least 2 dispersing plates and setting the arrangement in a specific range can solve the above-mentioned problems, and thus the present invention is completed.

亦即,本發明之第1型態係有關一種處理裝置,係由廢水供給側依序具有分散板2、分散板1、充填物層及觸媒層之廢水處理裝置,當上述分散板2與上述分散板1之距離為H1、上述分散板1與上述充填物層之廢水供給側的交界面之距離為H2、上述充填物層之層長為H3,以及上述H2與上 述H3之合計為H6時,上述H6超出100mm,且上述H6與上述H1之比(H6/H1)為0.1以上(包含0.1)100以下(包含100)。 That is, the first aspect of the present invention relates to a treatment device, which is a wastewater treatment device having a dispersing plate 2, a dispersing plate 1, a filling layer, and a catalyst layer from the waste water supply side in this order, when the dispersing plate 2 and The distance between the dispersion plate 1 is H1, the distance between the dispersion plate 1 and the waste water supply side of the filling layer is H2, the layer length of the filling layer is H3, and the H2 and the upper When the total of the H3 is H6, the H6 exceeds 100 mm, and the ratio of the H6 to the H1 (H6/H1) is 0.1 or more (including 0.1) and 100 or less (including 100).

本發明之第2型態係有關一種處理方法,其係使用由廢水供給側依序至少具有氣體-液體擴散部1、氣體-液體擴散部2、氣體-液體擴散部3以及觸媒層之裝置的廢水處理方法,上述廢水中係有氣體分散,且滿足下述(1)~(3):(1)上述氣體-液體擴散部1~3中之上述廢水留置時間均為0.5秒以上(包含0.5秒);(2)上述氣體-液體擴散部3與上述氣體-液體擴散部2中之廢水留置時間的合計為5秒以上(包含5秒);以及(3)相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計為0.1~100倍。 The second aspect of the present invention relates to a treatment method, which uses a device having at least a gas-liquid diffuser 1, a gas-liquid diffuser 2, a gas-liquid diffuser 3, and a catalyst layer in sequence from the waste water supply side In the wastewater treatment method, the above-mentioned wastewater has gas dispersion and meets the following (1)~(3): (1) The above-mentioned wastewater retention time in the above-mentioned gas-liquid diffusion part 1~3 is 0.5 seconds or more (including 0.5 seconds); (2) The total of the waste water retention time in the gas-liquid diffusion portion 3 and the gas-liquid diffusion portion 2 is 5 seconds or more (including 5 seconds); and (3) relative to the gas-liquid diffusion The wastewater retention time in Part 1, the total of the wastewater retention time in (2) above is 0.1 to 100 times.

根據本發明,可防止水垢成分在觸媒表面析出,故可高度維持觸媒的處理性能,然後能以簡便構造提供成本低的廢水處理裝置以及廢水處理方法。 According to the present invention, the precipitation of scale components on the surface of the catalyst can be prevented, so that the treatment performance of the catalyst can be maintained at a high level, and then a low-cost wastewater treatment device and wastewater treatment method can be provided with a simple structure.

1:反應塔 1: reaction tower

2:熱交換器 2: heat exchanger

3:廢水供給泵 3: Wastewater supply pump

4:壓縮機 4: Compressor

5:氣液分離器 5: Gas-liquid separator

6:液位控制閥 6: Liquid level control valve

7:壓力控制閥 7: Pressure control valve

8:加熱手段(加熱器或熱介質) 8: Heating means (heater or heating medium)

9:冷卻器 9: Cooler

10:廢水供給管線 10: Wastewater supply pipeline

11:含氧氣體供給管線 11: Oxygen-containing gas supply line

12:處理液管線 12: Treatment liquid pipeline

13:氣體排出管線 13: Gas discharge line

14:處理液排出管線 14: Treatment liquid discharge pipeline

15:分散板 15: Dispersion plate

16:下部充填物層 16: Lower filling layer

17:觸媒層 17: Catalyst layer

18:上部充填物層 18: Upper filling layer

19:第2充填物層 19: The second filling layer

第1圖係呈示本發明之一實施型態中的廢水處理方法之概略圖。 Figure 1 is a schematic diagram showing a waste water treatment method in one embodiment of the present invention.

第2圖係呈示實施例及比較例中使用之廢水處理裝置的概略圖。 Figure 2 is a schematic diagram showing the wastewater treatment equipment used in the Examples and Comparative Examples.

第3-1圖係呈示實施例中使用之廢水處理裝置的概略 圖。 Figure 3-1 shows the outline of the wastewater treatment equipment used in the examples picture.

第3-2圖係呈示實施例中使用之廢水處理裝置的概略圖。 Figure 3-2 is a schematic diagram showing the wastewater treatment equipment used in the examples.

第3-3圖係呈示實施例中使用之廢水處理裝置的概略圖。 Figure 3-3 is a schematic diagram showing the wastewater treatment equipment used in the examples.

第3-4圖係呈示實施例中使用之廢水處理裝置的概略圖。 Figures 3-4 are schematic diagrams showing the wastewater treatment equipment used in the examples.

第3-5圖係呈示比較例中使用之廢水處理裝置的概略圖。 Figures 3-5 are schematic diagrams showing the wastewater treatment equipment used in the comparative example.

第4圖係呈示實施例中使用之廢水處理裝置的概略圖。 Fig. 4 is a schematic diagram showing the wastewater treatment equipment used in the examples.

第5圖係呈示本發明之分散板之一例的概略圖。 Fig. 5 is a schematic diagram showing an example of the dispersion plate of the present invention.

(發明之最佳實施形態) (The best embodiment of the invention)

以下,對於用以實施本發明之具體型態進行詳細說明,惟本發明之技術範圍應基於對專利請求項之範圍的記載而決定,且不僅限於下述型態。 Hereinafter, specific forms for implementing the present invention will be described in detail, but the technical scope of the present invention should be determined based on the description of the scope of the patent claims, and is not limited to the following forms.

<第1型態:廢水處理裝置> <Type 1: Wastewater treatment plant>

根據本發明之一型態,提供一種處理裝置,係由廢水供給側依序具有分散板2、分散板1、充填物層及觸媒層之廢水處理裝置,當上述分散板2與上述分散板1之距離為H1、上述分散板1與上述充填物層之廢水供給側的交界面之距離為H2、上述充填物層之層長為H3,以及上述H2與上述H3之合計為H6時,上述H6超出100mm,且上述H6與上述H1之比(H6/H1)為0.1以上(包含0.1)100以下(包含100)。 According to one aspect of the present invention, a treatment device is provided, which is a wastewater treatment device having a dispersing plate 2, a dispersing plate 1, a filling layer, and a catalyst layer in sequence from the waste water supply side, when the dispersing plate 2 and the dispersing plate When the distance of 1 is H1, the distance of the interface between the dispersion plate 1 and the waste water supply side of the filling layer is H2, the layer length of the filling layer is H3, and the sum of the above H2 and the above H3 is H6, the above H6 exceeds 100mm, and the ratio of the above H6 to the above H1 (H6/H1) is 0.1 or more (including 0.1) and 100 or less (including 100).

本發明之廢水處理裝置中,分散板2與分散板1之距離為H1、分散板1與充填物層之廢水供給側的交界面之距離為H2、充填物層之層長為H3,以及觸媒層之層長為H4(單位:mm)。觸媒層之廢水排出側亦配置充填物層時,該充填物層之層長為H5。而且,H2與H3之和為H6。 In the wastewater treatment device of the present invention, the distance between the dispersion plate 2 and the dispersion plate 1 is H1, the distance between the dispersion plate 1 and the wastewater supply side of the filling layer is H2, the layer length of the filling layer is H3, and the contact The layer length of the media layer is H4 (unit: mm). When a filling layer is also arranged on the waste water discharge side of the catalyst layer, the layer length of the filling layer is H5. Moreover, the sum of H2 and H3 is H6.

分散板2與分散板1之距離(H1)係由分散板2之廢水排出側之面至分散板1之廢水供給側之面的距離。 The distance (H1) between the dispersion plate 2 and the dispersion plate 1 is the distance from the surface of the dispersion plate 2 on the waste water discharge side to the surface of the dispersion plate 1 on the waste water supply side.

分散板中,廢水供給側及排出側之面係定義如下。廢水處理裝置設置與地面垂直,由廢水處理裝置之下部供給廢水,並由廢水處理裝置之上部排出廢水時,分散板之廢水排出側之面(上表面)及廢水供給側之面(下表面),係在各面中,以最高部位與最低部位之中間位置為基準之面。此係,即使分散板之表面不平時或呈傾斜時亦為相同。惟如第2圖中之分散板15-2具有碰撞板時,以碰撞板以外的最高部位與最低部位之中間位置為基準。通常,廢水排出側之面及廢水供給側之面,與垂直於廢水供給方向之面(地面)平行。此時,廢水供給側及廢水排出側之面為平行。 In the dispersion plate, the surface systems on the waste water supply side and the discharge side are defined as follows. The wastewater treatment device is installed perpendicular to the ground. When the wastewater is supplied from the lower part of the wastewater treatment device and discharged from the upper part of the wastewater treatment device, the waste water discharge side surface (upper surface) of the dispersion plate and the waste water supply side surface (lower surface) , Is the plane based on the middle position of the highest part and the lowest part among all the faces. This system is the same even when the surface of the dispersion plate is uneven or inclined. However, when the dispersion plate 15-2 in Figure 2 has a collision plate, the middle position between the highest part and the lowest part other than the collision plate is used as the reference. Generally, the surface on the waste water discharge side and the surface on the waste water supply side are parallel to the surface (ground) perpendicular to the direction of the waste water supply. At this time, the surfaces of the waste water supply side and the waste water discharge side are parallel.

分散板1與充填物層之廢水供給側的交界面之距離(H2),係由分散板1之廢水排出側之面至充填物層之廢水供給側的交界面之距離。 The distance (H2) of the interface between the dispersion plate 1 and the waste water supply side of the filling layer is the distance from the surface of the dispersion plate 1 on the waste water discharge side to the interface between the waste water supply side of the filling layer.

充填物層之廢水供給側及排出側之交界面係定義如下。由於充填物層中充填著充填物,故露出廢水供給側及排出側之面會有不完全平坦之情形。廢水處理裝 置設置與地面垂直,由廢水處理裝置的下部供給廢水,並由廢水處理裝置的上部排出廢水時,廢水供給側之交界面(上表面)及排出側之交界面(下表面),係在充填物層之上表面或下表面中露出的充填物中之最低的部位與最高的部位之中間位置為基準之面。此係,即使充填物層露出之面呈傾斜時亦為相同。通常,廢水排出側之交界面及廢水供給側之交界面,與垂直於廢水供給方向之面(地面)平行。此時,廢水排出側之交界面及廢水供給側之交界面為平行。 The interface between the wastewater supply side and the discharge side of the filling layer is defined as follows. Since the filling material layer is filled with filling material, the surface exposed to the waste water supply side and the discharge side may not be completely flat. Wastewater treatment equipment When the installation is perpendicular to the ground, the waste water is supplied from the lower part of the waste water treatment device, and the waste water is discharged from the upper part of the waste water treatment device. The middle position between the lowest part and the highest part of the filling exposed on the upper or lower surface of the material layer is the reference surface. This system is the same even when the exposed surface of the filling layer is inclined. Generally, the interface on the waste water discharge side and the interface on the waste water supply side are parallel to the surface (ground) perpendicular to the direction of the waste water supply. At this time, the interface on the waste water discharge side and the interface on the waste water supply side are parallel.

充填物層之層長(H3)係由充填物層之廢水供給側的交界面至廢水排出側之交界面的距離。觸媒層之廢水排出側配置充填物層時,該充填物層之層長(H5)亦與H3相同。 The layer length (H3) of the filling layer is the distance from the interface on the waste water supply side of the filling layer to the interface on the waste water discharge side. When a filling layer is arranged on the waste water discharge side of the catalyst layer, the layer length (H5) of the filling layer is also the same as H3.

觸媒層之層長(H4)係由觸媒層之廢水供給側的交界面至廢水排出側之交界面的距離。 The layer length (H4) of the catalyst layer is the distance from the interface on the waste water supply side of the catalyst layer to the interface on the waste water discharge side.

觸媒層中,充填著觸媒(例如:固體觸媒)之充填物,關於觸媒層之廢水供給側的交界面至廢水排出側之交界面的定義係與充填物層相同。 The catalyst layer is filled with a catalyst (for example, solid catalyst). The definition of the interface between the wastewater supply side and the wastewater discharge side of the catalyst layer is the same as that of the filler layer.

本發明之廢水處理裝置,藉由具有如上述之構成,可防止水垢成分在觸媒表面析出。從而可高度維持觸媒之處理性能。 The wastewater treatment device of the present invention, by having the above-mentioned structure, can prevent the precipitation of scale components on the surface of the catalyst. Thereby, the processing performance of the catalyst can be maintained at a high level.

歷來,已知配置複數個分散板可有效地提高氣液混合效率。然而,在含有水垢成分(銅、鐵等之重金屬以及鈣、鋁等)的廢水之情況下,進一步要求高度的分散技術。作為水垢成分的特徵係可列舉如:藉由濕式氧化處 理處理廢水時,在加熱前,以離子形式溶解的水垢成分,在氧的存在下經由加溫加壓,部分析出氧化物或氫氧化物等之固體。因此,根據條件,溶解在廢水中的水垢成分會以離子狀態到達觸媒層,並在觸媒表面析出而有阻礙觸媒活性之虞。因此,本發明中,通過將H6與H1之比(H6/H1)設定在適當的範圍內,並將H6設定為100mm以上(包含100mm),能夠在到達觸媒層之前使析出固體之水垢成分,可預先防止水垢成分在觸媒表面的析出。 Historically, it has been known that multiple dispersing plates can effectively improve the gas-liquid mixing efficiency. However, in the case of wastewater containing scale components (heavy metals such as copper and iron, and calcium, aluminum, etc.), a high degree of dispersion technology is further required. As the characteristic system of the scale component, for example, by wet oxidation In the treatment of wastewater, before heating, the scale components dissolved in the form of ions are heated and pressurized in the presence of oxygen to partially analyze solids such as oxides or hydroxides. Therefore, depending on the conditions, the scale components dissolved in the wastewater may reach the catalyst layer in an ionic state, and precipitate on the surface of the catalyst, which may hinder the activity of the catalyst. Therefore, in the present invention, by setting the ratio of H6 to H1 (H6/H1) in an appropriate range, and setting H6 to 100mm or more (including 100mm), it is possible to precipitate solid scale components before reaching the catalyst layer. , Can prevent the precipitation of scale components on the surface of the catalyst in advance.

而且,為了防止水垢成分直接在觸媒層上蓄積,充填物層亦需要作為分散緩和層。藉由下側充填物層的存在,加速水垢成分在填充物層內的析出,即可預先防止在觸媒表面的析出。同時,與以往相比,分散效果提高,可防止水垢成分局部性析出及堆積,並可使觸媒長期發揮高的處理性能。 In addition, in order to prevent the scale component from directly accumulating on the catalyst layer, the filler layer also needs to serve as a dispersion and relaxation layer. The presence of the lower filler layer accelerates the precipitation of scale components in the filler layer, which can prevent precipitation on the surface of the catalyst in advance. At the same time, compared with the past, the dispersion effect is improved, the local precipitation and accumulation of scale components can be prevented, and the catalyst can exhibit high processing performance for a long time.

本發明之廢水處理裝置中,H6係超出100mm。H6在100mm以下(包含100mm)時,水垢成分不會均勻分散,且水垢成分會以離子狀態到達觸媒層,因而擔心觸媒層表面會被水垢成分所毒害。從可進一步抑制水垢成分在觸媒的析出之觀點,H6係以超出150mm為佳,以超出250mm更佳。H6之上限並無特別限制,例如未達2000mm。H6未達2000mm時,可抑制經由分散板混合而使微細化的氣泡再度凝聚所導致的氣液接觸效率的降低。 In the wastewater treatment device of the present invention, H6 exceeds 100mm. When H6 is below 100mm (including 100mm), the scale components will not be uniformly dispersed, and the scale components will reach the catalyst layer in an ionic state, so there is a concern that the surface of the catalyst layer will be poisoned by the scale components. From the viewpoint of further suppressing the precipitation of scale components in the catalyst, H6 is preferably more than 150mm, more preferably more than 250mm. The upper limit of H6 is not particularly limited, for example, it is less than 2000 mm. When H6 is less than 2000 mm, the reduction in gas-liquid contact efficiency due to the re-aggregation of fine air bubbles through the mixing of the dispersion plate can be suppressed.

本發明之廢水處理裝置中,H6與H1之比(H6/H1)為0.1以上(包含0.1)100以下(包含100)。H6/H1未達 0.1或超出100時,在分散板2及分散板1之間,會因氣液之混合效果不足而產生水垢成分之不平衡流動,使得水垢成分局部堆積而降低處理效率。H6/H1係以0.2以上(包含0.2)為佳,以0.3以上(包含0.3)更佳。H6/H1係以80以下(包含80)為佳,以50以下(包含50)更佳。如在該等範圍,可進一步發揮上述效果。 In the wastewater treatment device of the present invention, the ratio of H6 to H1 (H6/H1) is 0.1 or more (including 0.1) and 100 or less (including 100). H6/H1 not reached When 0.1 or more than 100, between the dispersing plate 2 and the dispersing plate 1, an unbalanced flow of scale components will occur due to the insufficient gas-liquid mixing effect, which will cause the scale components to accumulate locally and reduce the treatment efficiency. H6/H1 is preferably 0.2 or more (including 0.2), more preferably 0.3 or more (including 0.3). H6/H1 is preferably less than 80 (including 80), and more preferably less than 50 (including 50). Within these ranges, the above-mentioned effects can be further exerted.

只要H1滿足上述比(H6/H1)則無特別限制,例如為10mm以上(包含10mm),以20mm以上(包含20mm)為佳,以30mm以上(包含30mm)更佳。而且,H1為1000mm以下(包含1000mm),以900mm以下(包含900mm)為佳,以750mm以下(包含750mm)更佳。由於H1在10mm以上(包含10mm)1000mm以下(包含1000mm)會使氣液之分散混合充分地進行,故可抑制觸媒處理效率的降低,並可抑制水垢成分以離子狀態直接到達觸媒層。 There is no particular limitation as long as H1 satisfies the above-mentioned ratio (H6/H1). For example, it is 10 mm or more (including 10 mm), preferably 20 mm or more (including 20 mm), and more preferably 30 mm or more (including 30 mm). Moreover, H1 is 1000 mm or less (including 1000 mm), preferably 900 mm or less (including 900 mm), and more preferably 750 mm or less (including 750 mm). Since H1 of 10mm or more (including 10mm) and 1000mm or less (including 1000mm) will fully carry out the gas-liquid dispersion and mixing, the reduction of catalyst treatment efficiency can be suppressed, and the scale component can be prevented from directly reaching the catalyst layer in an ionic state.

本發明之廢水處理裝置的大小,如滿足上述H6及H6/H1者即無特別限制,可為廢水處理中一般所使用之反應塔或反應容器的大小。本發明之廢水處理裝置的形狀亦無特別限制,可為廢水處理中一般所使用之反應塔或反應容器的形狀。反應塔或反應容器方面,可使用直徑200~3000mm及長度1000~20000mm之圓柱狀者。 The size of the wastewater treatment device of the present invention is not particularly limited as long as it satisfies the aforementioned H6 and H6/H1, and can be the size of a reaction tower or a reaction vessel generally used in wastewater treatment. The shape of the wastewater treatment device of the present invention is also not particularly limited, and may be the shape of a reaction tower or a reaction vessel generally used in wastewater treatment. For reaction towers or reaction vessels, cylindrical ones with a diameter of 200~3000mm and a length of 1000~20000mm can be used.

本發明之廢水處理裝置係可施用廢水處理的各種方法。廢水的處理方法方面,可列舉如:濕式氧化法、濕式分解法、臭氧氧化法、過氧化氫氧化法等。廢水的處理方法方面,可得到高等級的處理水質,由具有優異 經濟性之觀點上,以濕式氧化法為佳。因此,本發明之一實施型態係提供一種藉由濕式氧化法之廢水處理中使用的廢水處理裝置。 The wastewater treatment device of the present invention can apply various methods of wastewater treatment. In terms of wastewater treatment methods, for example, wet oxidation method, wet decomposition method, ozone oxidation method, hydrogen peroxide oxidation method, etc. can be cited. In terms of waste water treatment methods, high-level treated water quality can be obtained, which has excellent From an economic point of view, the wet oxidation method is preferred. Therefore, one embodiment of the present invention provides a wastewater treatment device used in wastewater treatment by a wet oxidation method.

[廢水] [Wastewater]

對於經由本發明的廢水處理裝置所處理的廢水種類並無特別限制。如為本發明的廢水處理裝置,可有效地處理含有有機化合物、氮化合物及硫化合物之任1種以上的廢水。 There is no particular limitation on the type of waste water treated by the waste water treatment device of the present invention. If it is the wastewater treatment device of the present invention, it can effectively treat wastewater containing any one or more of organic compounds, nitrogen compounds, and sulfur compounds.

上述有機化合物方面,可例示:環氧乙烷及環氧丙烷等之環氧化合物;甲醇及乙醇、乙二醇等之醇化合物;-丙烯酸及甲基丙烯酸、對苯二甲酸等,以及該等之酯等的羧酸及/或其衍生物等。上述氮化合物方面,可例示:胺及亞胺等之有機氮化合物;氨及聯胺等之具有氮-氫鍵的無機氮化合物等。上述硫化合物方面,可例示:硫化氫、硫化鈉、硫化鉀、硫氫化鈉、硫代硫酸鹽、亞硫酸鹽等之無機硫化合物及硫醇類、磺酸類等之有機硫化合物。而且,並不限於僅含有上述化合物之廢水,可含有二噁烷、戴奧辛類及氟氯烷、鄰苯二甲酸二乙基己酯、壬基酚等之有機鹵素化合物及環境賀爾蒙化合物等的有害物質。 The above-mentioned organic compounds can be exemplified: epoxy compounds such as ethylene oxide and propylene oxide; alcohol compounds such as methanol, ethanol, and ethylene glycol;-acrylic acid, methacrylic acid, terephthalic acid, etc., and these The esters of carboxylic acids and/or their derivatives, etc. The above-mentioned nitrogen compounds can be exemplified by organic nitrogen compounds such as amines and imines; inorganic nitrogen compounds having nitrogen-hydrogen bonds such as ammonia and hydrazine. Examples of the above-mentioned sulfur compounds include inorganic sulfur compounds such as hydrogen sulfide, sodium sulfide, potassium sulfide, sodium hydrosulfide, thiosulfate, and sulfite, and organic sulfur compounds such as mercaptans and sulfonic acids. Moreover, it is not limited to waste water containing only the above-mentioned compounds, and may contain organic halogen compounds such as dioxane, dioxin, chlorofluoroalkane, diethylhexyl phthalate, nonylphenol, and environmental hormone compounds, etc. Of harmful substances.

含有如此之化合物的廢水方面,可例示:化學工廠、電子零件製造設備、食品加工設備、金屬加工設備、金屬電鍍設備、印刷製版設備、照相設備等之各種產業工廠所排出之廢水;及火力發電及原子力發電等之發電設備等所排出之廢水等。 Examples of wastewater containing such compounds include: wastewater discharged from various industrial plants such as chemical factories, electronic parts manufacturing equipment, food processing equipment, metal processing equipment, metal plating equipment, printing plate making equipment, photographic equipment, etc.; and thermal power generation And waste water discharged from power generation equipment such as atomic power generation.

工業用廢水之具體例方面,係例示:除了EOG製造設備、醇製造設備、脂肪族羧酸及其酯製造設備、芳香族羧酸或芳香族羧酸酯製造設備以外,由紙/紙漿、纖維、鋼鐵、乙烯/BXT、煤氣化、食用肉處理、藥品處理等之各式各樣產業領域之工廠所排出之廢水。 Specific examples of industrial wastewater include: EOG production equipment, alcohol production equipment, aliphatic carboxylic acid and its ester production equipment, aromatic carboxylic acid or aromatic carboxylic acid ester production equipment, paper/pulp, fiber Wastewater discharged from factories in various industrial fields such as iron and steel, ethylene/BXT, coal gasification, edible meat processing, and pharmaceutical processing.

而且,並不僅限於工業廢水,亦例示下水道污水及屎尿等之家庭廢水。 Moreover, it is not limited to industrial waste water, but also exemplifies domestic waste water such as sewage and excrement.

亦即,本發明之「廢水」並不限於如上所述從產業工廠所排出的所謂工業廢水,總之包含有機化合物,氮化合物及硫化合物中的任1種以上(包含1種)之任何液體,並且如此液體的供給源(產生源)並無特別限定。 That is, the "waste water" of the present invention is not limited to the so-called industrial wastewater discharged from industrial plants as described above, but any liquid containing any one or more (including one) of organic compounds, nitrogen compounds, and sulfur compounds. In addition, the supply source (generation source) of such a liquid is not particularly limited.

(水垢成分) (Scale ingredient)

更且,本發明之廢水處理裝置適於含有水垢成分之廢水處理。如上所述,專利文獻1所揭示之廢水處理裝置中,廢水(銅、鐵等之重金屬類及鈣、鋁等)中含有水垢成分時,水垢成分會以離子狀態到達觸媒層,並析出觸媒表面,會有阻礙觸媒活性之情形。另一方面,本發明之廢水處理裝置中,可抑制水垢成分在觸媒表面的析出,可高度維持觸媒之處理效率。 Furthermore, the wastewater treatment device of the present invention is suitable for wastewater treatment containing scale components. As described above, in the wastewater treatment device disclosed in Patent Document 1, when the wastewater (heavy metals such as copper and iron, calcium, aluminum, etc.) contains scale components, the scale components reach the catalyst layer in an ionic state and precipitate the catalyst. On the surface of the catalyst, there may be situations that hinder the activity of the catalyst. On the other hand, in the wastewater treatment device of the present invention, the precipitation of scale components on the surface of the catalyst can be suppressed, and the treatment efficiency of the catalyst can be maintained at a high level.

水垢成分係選自重金屬類、鋁、磷、矽、鈣及鎂所成群組中之至少1種元素。重金屬類並無特別限定,可列舉例如:鎘(Cd)、鎳(Ni)、鈷(Co)、錳(Mn)、銅(Cu)、鋅(Zn)、銀(Ag)、鐵(Fe)、錫(Sn)、銻(Sb)、鉛(Pb)、鉈(Tl)、汞(Hg)、砷(As)、鉻(Cr)、鉍(Bi)等。 The scale component is at least one element selected from the group consisting of heavy metals, aluminum, phosphorus, silicon, calcium and magnesium. Heavy metals are not particularly limited, and examples include cadmium (Cd), nickel (Ni), cobalt (Co), manganese (Mn), copper (Cu), zinc (Zn), silver (Ag), iron (Fe) , Tin (Sn), antimony (Sb), lead (Pb), thallium (Tl), mercury (Hg), arsenic (As), chromium (Cr), bismuth (Bi), etc.

對於廢水中所含的水垢成分之濃度並無特別限定。本發明之廢水處理裝置係與以往者不同,在包含0.1mg/L以上(包含0.1mg/L)之水垢成分的廢水處理中,可發揮效果。水垢成分之濃度可為0.5mg/L以上(包含0.5mg/L)。水垢成分之濃度如為1g/L以下(包含1g/L),可充分發揮本發明之效果。 The concentration of the scale component contained in the waste water is not particularly limited. The wastewater treatment device of the present invention is different from the conventional ones, and can exhibit an effect in wastewater treatment containing a scale component of 0.1 mg/L or more (including 0.1 mg/L). The concentration of the scale component can be 0.5 mg/L or more (including 0.5 mg/L). If the concentration of the scale component is 1 g/L or less (including 1 g/L), the effect of the present invention can be fully exerted.

[分散板] [Dispersion board]

本發明之廢水處理裝置從廢水之供給側依序具有分散板2、分散板1、充填物層及觸媒層。亦即,本發明之廢水處理裝置至少具有2片分散板。分散板方面,可使用如第5圖所例示之單孔板、附碰撞板之單孔板、多孔板或附碰撞板之多孔板。分散板方面,可配置相同種類之分散板,亦可配置不同之分散板。本發明之廢水處理裝置中,分散板2及分散板1以預定距離(H1)配置時,即可顯現本發明。而且,亦可因應必要,將追加的分散板配置在比分散板2更靠近廢水供給側(上游側)。另外,分散板可由1片板構成,惟從安裝及拆卸之作業性的觀點上,以可分割為2片以上(包含2片)之形狀所構成者為佳。 The wastewater treatment device of the present invention has a dispersing plate 2, a dispersing plate 1, a filling layer, and a catalyst layer in order from the waste water supply side. That is, the wastewater treatment device of the present invention has at least two dispersion plates. As for the dispersion plate, the single-well plate, single-well plate with collision plate, perforated plate or perforated plate with collision plate as illustrated in Figure 5 can be used. Regarding the dispersion plate, the same type of dispersion plate can be configured, or different dispersion plates can be configured. In the wastewater treatment device of the present invention, when the dispersing plate 2 and the dispersing plate 1 are arranged at a predetermined distance (H1), the present invention can be realized. Furthermore, if necessary, an additional dispersing plate may be arranged closer to the waste water supply side (upstream side) than the dispersing plate 2. In addition, the dispersion plate can be composed of one plate, but from the viewpoint of the workability of installation and removal, it is preferably composed of a shape that can be divided into two or more (including two).

單孔板及多孔板的開孔率(包含附碰撞板者),一般為0.005%以上(包含0.005%)30%以下(包含30%)。上述開孔率係以0.05%以上(包含0.05%)為佳,以0.1%以上(包含0.1%)更佳,以0.5%以上(包含0.5%)又更佳,以1%以上(包含1%)為特佳。而且,上述開孔率係以10%以下(包含10%)為佳,以5%以下(包含5%)更佳。藉由在如此之範圍 內,即可防止因攪拌效果而引起的不平衡流動,可使廢水中所含的氣體均勻地分佈。因此,氣液提高而可提高觸媒的處理性能。 The open porosity of single-well plates and multi-well plates (including those with collision plates) is generally above 0.005% (including 0.005%) and below 30% (including 30%). The above-mentioned open porosity is preferably 0.05% or more (including 0.05%), more preferably 0.1% or more (including 0.1%), more preferably 0.5% or more (including 0.5%), and more than 1% (including 1%). ) Is particularly good. Moreover, the above-mentioned open porosity is preferably 10% or less (including 10%), and more preferably 5% or less (including 5%). By being in such a range Inside, the unbalanced flow caused by the stirring effect can be prevented, and the gas contained in the waste water can be evenly distributed. Therefore, the gas-liquid is improved and the processing performance of the catalyst can be improved.

分散板之開孔率係以下述式求算。 The open porosity of the dispersion plate is calculated by the following formula.

開孔率[%]=孔全體之截面積/分散板全體之截面積×100 Hole rate [%]=cross-sectional area of the entire hole/cross-sectional area of the entire dispersion plate×100

對於多孔板(包含附碰撞板者)之孔數,一般係每1m2為5個以上(包含5個)200個以下(包含200個)。從可得到充分之分散效果的觀點,孔數係以每1m2為10個以上(包含10個)為佳,以每1m2為25個以上(包含25個)更佳。而且,從可維持多孔板之強度的觀點,孔數係以每1m2為150個以下(包含150個)為佳,以每1m2為120個以下(包含120個)更佳。 The number of holes in the perforated plate (including those with collision plates) is generally 5 or more (including 5) and 200 or less (including 200) per 1 m 2. From the viewpoint of obtaining a sufficient dispersion effect, the number of holes per 1 m 2 is preferably 10 or more (including 10), and more preferably 25 or more per 1 m 2 (including 25). Further, the strength of the porous plate can be maintained in view of the number of holes per 1m 2 in a line of 150 or less (including 150) preferably, per 1m 2 of 120 or less (including 120) the better.

對於孔之形狀並無特別限定,惟圓柱型或圓錐型者,因製作上容易,因而為佳。而且,對於孔的配置,並無特別限定,如為單孔板時,以配置在中心者為佳,如為多孔板時,以儘可能地全體均一配置者為佳。 There are no special restrictions on the shape of the hole, but cylindrical or conical ones are preferred because they are easy to manufacture. Moreover, the arrangement of the holes is not particularly limited. In the case of a single-well plate, it is preferable to arrange it in the center, and in the case of a porous plate, it is preferable to arrange it as uniformly as possible.

本發明之較佳實施型態中,分散板1及分散板2之至少一者為多孔板,上述多孔板之孔數係以每1m2為5個以上(包含5個)200個以下(包含200個)。藉由如此之構成,可進一步抑制水垢成分在觸媒上的析出,從而可進一步高度維持觸媒的處理性能。 Patterns for the preferred embodiment of the present invention, the dispersion plate 2 of the plate 1 and the dispersion of at least one of a perforated plate, the hole of the perforated plate 2 1M coefficients every 5 or more (including 5) 200 or less (including 200). With such a configuration, the precipitation of scale components on the catalyst can be further suppressed, and the processing performance of the catalyst can be maintained at a higher level.

分散板1與充填物層之廢水供給側的交界面之距離H2,如H2與下述充填物層之層長H3之和(H6)超出 100mm時,並無特別限制,惟由廢水之分散效果的觀點,係以10mm以上(包含10mm)為佳。 The distance H2 between the interface between the dispersion plate 1 and the waste water supply side of the filling layer, such as the sum of H2 and the layer length H3 of the following filling layer (H6) exceeds When it is 100mm, there is no particular limitation, but from the viewpoint of the dispersion effect of waste water, it is better to be 10mm or more (including 10mm).

設置在附碰撞板之單孔板以及附碰撞板之多孔板的碰撞板之直徑,孔徑係以0.5~10.0倍為佳,以1.0~5.0倍更佳,以1.5~3.0倍又更佳。而且,碰撞板與單孔板或多孔板之間隔,孔徑係以0.05~5.0倍為佳,以0.1~3.0倍更佳,以0.2~1.0倍又更佳。藉由設在如此之範圍,廢水及氣體在碰撞板可有效地碰撞,可均勻地分散在碰撞板之周方向。 The diameter of the collision plate installed on the single-hole plate with collision plate and the perforated plate with collision plate is preferably 0.5~10.0 times, 1.0~5.0 times is better, and 1.5~3.0 times is even better. Moreover, the spacing between the collision plate and the single-hole plate or the multi-well plate is preferably 0.05 to 5.0 times the pore diameter, preferably 0.1 to 3.0 times, and even more preferably 0.2 to 1.0 times. By setting in such a range, waste water and gas can effectively collide with the collision plate, and can be evenly dispersed in the circumferential direction of the collision plate.

[充填物層] [Filling layer]

本發明之廢水處理裝置係在分散板1之廢水排出側具有充填物層。藉由如此之構成,可防止觸媒之損耗,且廢水不會不平衡流動,儘可能地可在觸媒層均勻地流動。更且,可防止水垢成分在觸媒表面析出。 The waste water treatment device of the present invention has a filling layer on the waste water discharge side of the dispersion plate 1. With such a structure, the loss of the catalyst can be prevented, and the waste water will not flow unbalanced, and it can flow evenly in the catalyst layer as much as possible. Moreover, it can prevent the precipitation of scale components on the surface of the catalyst.

充填物層中,充填有金屬製或陶瓷製之充填物。充填物係包含選自鐵、銅、不鏽鋼(SUS)、赫史特合金、英高鎳、鈦、鋯、氧化鈦、氧化鋯、氮化矽或氮化碳所成群組中之至少1種。充填物可為單獨1種,亦可為2種以上(包含2種)或合金。藉由濕式氧化法處理廢水時,充填物方面,從耐磨損性、耐腐蝕性及強度之觀點,係以不鏽鋼(SUS)、鋯、赫史特合金、英高鎳或鈦為佳,以不鏽鋼(SUS)或氧化鋯更佳。 The filler layer is filled with a metal or ceramic filler. The filler system includes at least one selected from the group consisting of iron, copper, stainless steel (SUS), Hester alloy, Inconel, titanium, zirconium, titanium oxide, zirconium oxide, silicon nitride, or carbon nitride . The filler may be one type alone, two or more types (including two types), or an alloy. When treating waste water by wet oxidation method, the filling material is preferably stainless steel (SUS), zirconium, Hester alloy, Inconel or titanium from the viewpoint of abrasion resistance, corrosion resistance and strength. It is better to use stainless steel (SUS) or zirconia.

充填物之形狀方面,並無特別限制,可列舉如:丸狀、球狀、塊狀、環狀、鞍狀、多面體狀等的粒 狀;纖維狀、鏈狀、串珠狀等連續體的形狀等。從可容易在反應塔充填之觀點上,充填物之形狀係以粒狀為佳,以丸狀、球狀或環狀更佳。 The shape of the filling is not particularly limited, and examples include pellets, spheres, blocks, rings, saddles, polyhedrons, etc. Shape; fiber-like, chain-like, bead-like and other continuum shapes. From the viewpoint that it can be easily filled in the reaction tower, the shape of the filler is preferably granular, and more preferably pellets, spheres or rings.

充填物之大小,如可得到上述效果,則無特別限制。例如為粒狀之充填物時,平均粒徑為3mm以上(包含3mm),以4mm以上(包含4mm)為佳,以5mm以上(包含5mm)更佳。而且,平均粒徑為30mm以下(包含30mm),以20mm以下(包含20mm)為佳,以15mm以下(包含15mm)更佳。 The size of the filling material is not particularly limited as long as the above-mentioned effects can be obtained. For example, in the case of a granular filling, the average particle size is 3 mm or more (including 3 mm), preferably 4 mm or more (including 4 mm), and more preferably 5 mm or more (including 5 mm). Moreover, the average particle size is 30 mm or less (including 30 mm), preferably 20 mm or less (including 20 mm), and more preferably 15 mm or less (including 15 mm).

而且,本說明書中,粒狀之充填物以及後述固體觸媒之平均粒徑係粒徑之算數平均值。而且,粒徑係指充填物或固體觸媒之最大徑。例如:球狀之充填物或固體觸媒之粒徑為直徑,丸狀之充填物或固體觸媒的粒徑係指其對角線的長度。 In this specification, the average particle size of the granular filler and the solid catalyst described later is the arithmetic average of the particle size. Moreover, the particle size refers to the largest diameter of the filler or solid catalyst. For example, the particle size of a spherical filler or solid catalyst is the diameter, and the particle size of a pelletized filler or solid catalyst refers to the length of its diagonal.

充填物之平均粒徑d1、與下述觸媒層所含的觸媒之平均粒徑d0,從廢水之分散效果的觀點上,以d1>d2者為佳。 The average particle size d1 of the filler and the average particle size d0 of the catalyst contained in the following catalyst layer are preferably d1>d2 from the viewpoint of the dispersion effect of waste water.

充填物之比重(意指真比重,與一般使用之體積比重、充填比重、表觀比重不同)並無特別限制,可適當地選擇。比重方面,一般為2.5以上(包含2.5),以4~12為佳。 The specific gravity of the filling (meaning the true specific gravity, which is different from the volume specific gravity, filling specific gravity, and apparent specific gravity used in general) is not particularly limited, and can be selected appropriately. In terms of specific gravity, it is generally 2.5 or more (including 2.5), preferably 4~12.

充填物層之孔隙率並無特別限制,一般為20~90容量%(充填物層之總體積基準),以30~70容量%為佳,以35~60容量%更佳,以35~55容量%又更佳。 The porosity of the filling layer is not particularly limited, generally 20~90 volume% (based on the total volume of the filling layer), preferably 30~70 volume%, more preferably 35~60 volume%, 35~55 The capacity% is better.

充填物層所充填之充填物無須具有相同的 材質、形狀、大小、比重等,如可呈現本發明之效果,可使用2種以上(包含2種)之充填物。而且,根據使用型態及使用狀況,可適當地選擇合適之充填物。 The filling material filled by the filling material layer does not need to have the same If the material, shape, size, specific gravity, etc. can exhibit the effects of the present invention, two or more types (including two types) of fillers can be used. Moreover, according to the usage type and usage conditions, a suitable filling material can be appropriately selected.

充填物一般係採用將金屬網,格柵等單獨或組合而成之支撐座設置在反應塔中並在其上充填之方法。 The filling generally adopts a method in which metal meshes, grids, etc., alone or in combination, are set in the reaction tower and filled on the support base.

充填物層之層長(H3),如與上述H2之和(H6)超出100mm時,並無特別限制,一般為10mm以上(包含10mm),從防止水垢成分直接蓄積在觸媒層之觀點上,以50mm以上(包含50mm)為佳,以80mm以上(包含80mm)更佳,以100mm以上(包含100mm)又更佳。H3之上限並無特別限制,為300mm以下(包含300mm),從成本之觀點上,以250mm以下(包含250mm)為佳。 The layer length (H3) of the filling layer is not particularly limited if the sum of H2 (H6) exceeds 100mm. Generally, it is 10mm or more (including 10mm). From the viewpoint of preventing the scale component from directly accumulating in the catalyst layer , Preferably 50mm or more (including 50mm), more preferably 80mm or more (including 80mm), and more preferably 100mm or more (including 100mm). The upper limit of H3 is not particularly limited, but is 300 mm or less (including 300 mm), and from the viewpoint of cost, it is preferably 250 mm or less (including 250 mm).

本發明之較佳實施型態中,從進一步提高廢水之分散效果之觀點上,充填物層為2層構造。亦即,本發明之廢水處理裝置以在充填物層與觸媒層之間進一步具有充填物層者為佳。由於充填物層為2層構造,因此可進一步高度維持觸媒之處理性能。 In a preferred embodiment of the present invention, from the viewpoint of further improving the dispersion effect of waste water, the filling layer has a two-layer structure. That is, the wastewater treatment device of the present invention preferably further has a filler layer between the filler layer and the catalyst layer. Since the filling layer has a two-layer structure, the processing performance of the catalyst can be further maintained at a high level.

廢水之供給側的充填物層為充填物層1、觸媒層側之充填物層為充填物層2時,充填物層1所含的充填物之平均粒徑d1與充填物層2所含的充填物之平均粒徑d2之關係可為d1>d2,亦可為d1<d2。d1及d2,從廢水之分散效果的觀點上,係以d1>d2者為佳。如為d1>d2時,d2與d1之比(d2/d1)係以0.2以上(包含0.2)為佳,以0.3以上(包含0.3) 更佳,以0.4以上(包含0.4)又更佳。而且,d2/d1以未達1.00為佳,以未達0.95更佳。 When the filling layer on the supply side of wastewater is filling layer 1, when the filling layer on the catalyst layer side is filling layer 2, the average particle size d1 of the filling contained in filling layer 1 and the filling layer 2 contain The relationship between the average particle size d2 of the filler can be d1>d2, or d1<d2. For d1 and d2, from the viewpoint of the dispersion effect of waste water, d1>d2 is better. If d1>d2, the ratio of d2 to d1 (d2/d1) is preferably 0.2 or more (including 0.2), and 0.3 or more (including 0.3) More preferably, it is more preferably 0.4 or more (including 0.4). Moreover, d2/d1 is preferably less than 1.00, and more preferably less than 0.95.

本發明之較佳實施型態中,充填物層1所含的充填物1之平均粒徑d1與充填物層2所含的充填物2之平均粒徑d2以及下述觸媒層所含的觸媒之平均粒徑d2係滿足d1>d2>d0之關係。由廢水之供給側至充填物層1、充填物層2及觸媒層,逐漸減少充填物或觸媒的平均粒徑,藉此即可進一步提高廢水之分散效果。d2與d1之比(d2/d1)係如上述。而且,d0與d2之比(d0/d2)係以0.2以上(包含0.2)為佳,以0.3以上(包含0.3)更佳,以0.4以上(包含0.4)又更佳。而且,d0/d2係以未達1.00為佳,以未達0.95更佳。 In a preferred embodiment of the present invention, the average particle size d1 of the filler 1 contained in the filler layer 1 and the average particle size d2 of the filler 2 contained in the filler layer 2 and the following catalyst layer The average particle size d2 of the catalyst satisfies the relationship of d1>d2>d0. From the wastewater supply side to the filling layer 1, the filling layer 2 and the catalyst layer, the average particle size of the filling or catalyst is gradually reduced, thereby further improving the dispersion effect of the wastewater. The ratio of d2 to d1 (d2/d1) is as described above. Moreover, the ratio of d0 to d2 (d0/d2) is preferably 0.2 or more (including 0.2), more preferably 0.3 or more (including 0.3), and even more preferably 0.4 or more (including 0.4). Moreover, d0/d2 is preferably less than 1.00, and more preferably less than 0.95.

充填物層1及充填物層2所含的充填物之材質、形狀及比重可為相同或不同。 The material, shape and specific gravity of the filling material contained in the filling material layer 1 and the filling material layer 2 may be the same or different.

充填物層之層長係,將充填物層1之層長設為H3、充填物層2之層長設為H7。層長之定義係如上述。而且,H6係H2、H3及H7之和。充填物層可為2層構造,上述H6之較佳範圍相同。 The layer length of the filling layer is H3, and the layer length of the filling layer 2 is H7. The definition of layer length is as above. Moreover, H6 is the sum of H2, H3, and H7. The filler layer may have a two-layer structure, and the preferable range of the above-mentioned H6 is the same.

從廢水之分散效果之觀點上,充填物層2之層長(H7)係以30mm以上(包含30mm)為佳,以50mm以上(包含50mm)更佳,以100mm以上(包含100mm)又更佳。而且,H7係以500mm以下(包含500mm)為佳,以400mm以下(包含400mm)更佳,以300mm以下(包含300mm)又更佳。惟H7係以H6及H6/H1不偏離上述範圍之下而設定。 From the viewpoint of the dispersion effect of waste water, the layer length (H7) of the filling layer 2 is preferably 30mm or more (including 30mm), more preferably 50mm or more (including 50mm), and more preferably 100mm or more (including 100mm) . Moreover, the H7 series is preferably 500mm or less (including 500mm), more preferably 400mm or less (including 400mm), and more preferably 300mm or less (including 300mm). However, H7 is set so that H6 and H6/H1 do not deviate from the above range.

因此,本發明之較佳型態中,上述充填物 層2之層長為30mm以上(包含30mm)500mm以下(包含500mm)。 Therefore, in a preferred form of the present invention, the above-mentioned filling The layer length of layer 2 is 30 mm or more (including 30 mm) and 500 mm or less (including 500 mm).

本發明之廢水處理裝置可在觸媒層之廢水排出側進一步具有充填物層。 The waste water treatment device of the present invention may further have a filling layer on the waste water discharge side of the catalyst layer.

例如:如第2圖所示,廢水處理裝置為向上流動之圓柱形裝置時,為了從上施加負荷來按壓觸媒,因而在觸媒層之廢水排出側進一步設置充填物層(上部充填物層)。上部充填物層的設定可抑制觸媒的損耗。上部充填物層之層長(H5)並無特別限制,可自30~1000mm之範圍適當地選擇。而且,上部充填物層所含的充填物方面,可使用上述的充填物。惟上部充填物層所含的充填物之大小,為了防止充填物進入觸媒層,以使用大於觸媒大小者為佳。 For example, as shown in Figure 2, when the wastewater treatment device is an upward-flowing cylindrical device, in order to apply a load from above to press the catalyst, a filler layer (upper filler layer) is further provided on the waste water discharge side of the catalyst layer ). The setting of the upper filling layer can suppress the loss of the catalyst. The layer length (H5) of the upper filling layer is not particularly limited, and can be appropriately selected from the range of 30~1000mm. In addition, as for the filler contained in the upper filler layer, the above-mentioned filler can be used. However, in order to prevent the filler from entering the catalyst layer, the size of the filler contained in the upper filler layer is preferably larger than the size of the catalyst.

[觸媒層] [Catalyst layer]

本發明之觸媒處理裝置,從廢水之排出側依序具有分散板2、分散板1、充填物層及觸媒層。觸媒層所含的觸媒為一般的固體觸媒。固體觸媒如為一般廢水處理中使用者,則無特別限制均可使用。固體觸媒方面,可列舉如:選自鈦、鐵、鋁、矽、鋯以及鈰中的至少1種金屬;氧化物或該等之複合氧化物,或者含有活性碳等之觸媒。該等之中,以氧化鈦、氧化鋯、氧化鐵、鈦-鋯複合氧化物、鈦-鐵複合氧化物等之氧化物為適用。 The catalyst processing device of the present invention has a dispersing plate 2, a dispersing plate 1, a filling layer, and a catalyst layer in order from the discharge side of the waste water. The catalyst contained in the catalyst layer is a general solid catalyst. If the solid catalyst is used in general wastewater treatment, it can be used without any special restrictions. As for the solid catalyst, for example, at least one metal selected from titanium, iron, aluminum, silicon, zirconium, and cerium; oxides or composite oxides thereof; or catalysts containing activated carbon or the like. Among these, oxides such as titanium oxide, zirconium oxide, iron oxide, titanium-zirconium composite oxide, and titanium-iron composite oxide are suitable.

固體觸媒係除了上述成分(第1成分)以外,亦可含有其它成分(第2成分)。含有2種成分之固體觸媒方面,可列舉如:含有選自鐵、鈦、矽、鋁、鋯以及鈰中的 至少1種金屬;氧化物或該等之複合氧化物、或者活性碳(第1成分),與選自錳、鈷、鎳、鎢、銅、銀、鉑、鈀、銠、金、銦、釕中的至少1種金屬;或該等之金屬化合物(第2成分)之觸媒。固體觸媒之較佳者係,第1成分為氧化鈦、氧化鋯、氧化鐵、鈦-鋯複合氧化物,或鈦-鐵複合氧化物;第2成分為鉑。在含有2種成分之固體觸媒中,係以包含75~99.95重量%之第1成分與0.05~25重量%之第2成分者為佳。而且,第1成分及第2成分之合計係以100重量%為佳。惟可適當地含有無觸媒活性之載體、無機觸媒、黏合劑成分等之第3成分,此時之第1成分及第2成分之重量比係由第1成分的重量與第2成分的重量決定而不考慮第3成分。 The solid catalyst system may contain other components (second component) in addition to the above-mentioned components (first component). For solid catalysts containing two components, examples include: containing selected from iron, titanium, silicon, aluminum, zirconium and cerium At least one metal; oxides or composite oxides of these, or activated carbon (the first component), and selected from manganese, cobalt, nickel, tungsten, copper, silver, platinum, palladium, rhodium, gold, indium, ruthenium At least one metal in the metal; or a catalyst of these metal compounds (the second component). A preferred solid catalyst is that the first component is titanium oxide, zirconium oxide, iron oxide, titanium-zirconium composite oxide, or titanium-iron composite oxide; and the second component is platinum. Among the solid catalysts containing two components, it is preferable to contain 75 to 99.95% by weight of the first component and 0.05 to 25% by weight of the second component. In addition, the total of the first component and the second component is preferably 100% by weight. However, the third component such as a non-catalyst active carrier, inorganic catalyst, and binder component can be appropriately contained. At this time, the weight ratio of the first component and the second component is the weight of the first component and the second component The weight is determined without considering the third component.

上述固體觸媒在使用濕式氧化法之氧化處理中係為適用。從高等級之處理水質及經濟性的觀點上,本發明之廢水處理裝置在使用濕式氧化法之廢水處理中為適用。因此,本發明之較佳實施型態中,觸媒層中所含的觸媒為濕式氧化觸媒。 The above-mentioned solid catalyst is suitable for the oxidation treatment using the wet oxidation method. From the viewpoint of high-grade treated water quality and economic efficiency, the wastewater treatment device of the present invention is suitable for wastewater treatment using a wet oxidation method. Therefore, in a preferred embodiment of the present invention, the catalyst contained in the catalyst layer is a wet oxidation catalyst.

固體觸媒之形狀如為廢水處理中一般使用之形狀,則無特別限制,固體觸媒之形狀方面,可列舉如:丸狀、球狀、環狀等之粒狀;蜂巢狀等。 The shape of the solid catalyst is not particularly limited if it is a shape commonly used in wastewater treatment. The shape of the solid catalyst can include pellets, spheres, rings, etc.; honeycombs, etc.

固體觸媒之大小,如可得到上述效果則無特別限制。例如:如為粒狀之固體觸媒時,平均粒徑例如為1~30mm,以1.5~20mm為佳,以2~15mm更佳。而且,從廢水之分散效果的觀點,固體觸媒之平均粒徑係以比觸媒層更靠近廢水供給側之充填物層中所含的充填物之平均 粒徑較小者為佳。 The size of the solid catalyst is not particularly limited as long as the above-mentioned effects can be obtained. For example, in the case of a granular solid catalyst, the average particle size is, for example, 1~30mm, preferably 1.5~20mm, and more preferably 2~15mm. Moreover, from the viewpoint of the dispersion effect of waste water, the average particle size of the solid catalyst is the average of the filler contained in the filler layer closer to the waste water supply side than the catalyst layer The smaller particle size is better.

固體觸媒係可單獨使用1種,亦可組合2種以上(包含2種)使用。 The solid catalyst system may be used singly or in combination of two or more types (including two types).

觸媒層之層長H4係依觸媒之充填量決定。觸媒之充填量並無特別限定,可依目的而適當地決定。一般係建議調整觸媒的充填量,使觸媒層的空間速度成為0.1hr-1~10hr-1,以0.2hr-1~5hr-1為佳,以0.3hr-1~3hr-1更佳。空間速度在0.1hr-1以上(包含0.1hr-1)時,可確保觸媒的充填量,可避免擴大設備。而且,空間速度在10hr-1以下(包含10hr-1)時,可充分地進行反應塔內之廢水的氧化/分解處理。 The layer length H4 of the catalyst layer is determined by the filling amount of the catalyst. The filling amount of the catalyst is not particularly limited, and can be appropriately determined according to the purpose. Generally, it is recommended to adjust the filling amount of the catalyst so that the space velocity of the catalyst layer becomes 0.1hr -1 ~10hr -1 , preferably 0.2hr -1 ~5hr -1, preferably 0.3hr -1 ~3hr -1 . When the space velocity is above 0.1hr -1 (including 0.1hr -1 ), the filling amount of the catalyst can be ensured and the expansion of equipment can be avoided. Moreover, when the space velocity is 10hr -1 or less (including 10hr -1 ), the oxidation/decomposition treatment of wastewater in the reaction tower can be sufficiently performed.

<第2型態:廢水的處理方法> <Type 2: Wastewater treatment method>

依據本發明之其它型態,提供一種廢水之處理方法,其係使用從廢水之供給側依序具有至少氣體-液體擴散部1、氣體-液體擴散部2、氣體-液體擴散部3以及觸媒層之裝置的廢水處理方法,上述廢水中係有氣體分散,且滿足以下之(1)~(3):(1)上述氣體-液體擴散部1~3中之上述廢水留置時間均為0.5秒以上(包含0.5秒);(2)上述氣體-液體擴散部3與上述氣體-液體擴散部2中之廢水留置時間的合計為5秒以上(包含5秒);以及(3)相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計為0.1~100倍。 According to another aspect of the present invention, a waste water treatment method is provided, which uses at least a gas-liquid diffuser 1, a gas-liquid diffuser 2, a gas-liquid diffuser 3, and a catalyst in order from the waste water supply side The wastewater treatment method of the device of the layer, the above-mentioned wastewater has gas dispersion, and meets the following (1)~(3): (1) The above-mentioned wastewater retention time in the above-mentioned gas-liquid diffusion section 1~3 is 0.5 seconds Above (including 0.5 seconds); (2) the total of the waste water retention time in the gas-liquid diffuser 3 and the gas-liquid diffuser 2 is 5 seconds or more (including 5 seconds); and (3) relative to the gas -The waste water retention time in the liquid diffuser 1, the total of the waste water retention time in (2) above is 0.1 to 100 times.

本型態之裝置中,觸媒層係與上述廢水處理裝置(第1 型態)之觸媒層相同,因而省略說明。 In this type of device, the catalyst layer is the same as the above-mentioned wastewater treatment device (No. 1 The catalyst layer of the type) is the same, so the description is omitted.

本型態之裝置係具有作為將水垢成分與氣體(尤其是氧氣)均勻地分散之手段的氣體-液體擴散部1~3。 This type of device has gas-liquid diffusers 1 to 3 as a means for uniformly dispersing scale components and gas (especially oxygen).

氣體-液體擴散部1(本說明書中,亦稱為「擴散部1」)係從廢水之供給側,氣體-液體分散部與氣體-液體分散部之間的空間、或分散板與充填物層之廢水供給側之面之間的空間;或者充填物層。擴散部1例如相當於第2圖中之H1所示之範圍。 The gas-liquid diffuser 1 (also referred to as "diffuser 1" in this specification) is from the waste water supply side, the space between the gas-liquid dispersion and the gas-liquid dispersion, or the dispersion plate and the filling layer The space between the sides of the waste water supply side; or the filling layer. The diffuser 1 corresponds to, for example, the range shown by H1 in FIG. 2.

氣體-液體擴散部2(本說明書中,亦稱為「擴散部2」)係從廢水之供給側,氣體-液體分散部與氣體-液體分散部之間的空間、或分散板與充填物層之廢水供給側面之間的空間或者充填物層之廢水排出側之面與充填物層之廢水供給側之面之間的空間;或者充填物層。擴散部2例如相當於第2圖中之H2所示之範圍。 The gas-liquid diffuser 2 (also referred to as the "diffuser 2" in this specification) is from the waste water supply side, the space between the gas-liquid dispersion and the gas-liquid dispersion, or the dispersion plate and the filling layer The space between the waste water supply side or the space between the waste water discharge side of the filling layer and the waste water supply side of the filling layer; or the filling layer. The diffuser 2 corresponds to, for example, the range indicated by H2 in FIG. 2.

氣體-液體擴散部3(本說明書中,亦稱為「擴散部3」)係從廢水之供給側,氣體-液體分散部與觸媒層之廢水供給側之面之間的空間或充填物層之廢水排出側之面與觸媒層之廢水供給側之面之間的空間;或者充填物層。擴散部3例如相當於第2圖中之H3所示之範圍。充填物層為2層構造時,2層之合計對應於擴散部3,例如相當於第4圖中之H3+H7所示之範圍。 The gas-liquid diffuser 3 (also referred to as "diffuser 3" in this specification) is from the waste water supply side, the space between the gas-liquid dispersion and the surface of the catalyst layer on the waste water supply side or the filling layer The space between the waste water discharge side surface and the waste water supply side surface of the catalyst layer; or the filling layer. The diffuser 3 corresponds to, for example, the range indicated by H3 in FIG. 2. When the filler layer has a two-layer structure, the total of the two layers corresponds to the diffuser 3, which corresponds to, for example, the range indicated by H3+H7 in Figure 4.

本型態之處理方法中,氣體-液體分散部1~3之至少一者為充填物層。充填物層可為1層亦可為2層以上(包含2層)。而且,本型態之裝置的充填物層係與上述廢水處理裝 置(第1型態)所具有之充填物層相同,因而省略說明。 In this type of processing method, at least one of the gas-liquid dispersion parts 1 to 3 is a filling layer. The filler layer may be one layer or two or more layers (including two layers). Moreover, the filling layer of this type of device is the same as the above-mentioned wastewater treatment device. The filling material layer of the device (the first type) is the same, so the description is omitted.

氣體-液體分散部係可藉由攪拌效果防止不平衡流動而可將廢水中所含的氣體均勻地分佈之構件,可列舉分散板之例。本型態之裝置的分散板係與上述廢水處理裝置(第1型態)之分散板相同,故省略說明。 The gas-liquid dispersing part is a member that can uniformly distribute the gas contained in the waste water by preventing unbalanced flow due to the stirring effect, and an example of a dispersing plate can be cited. The dispersing plate of the device of this type is the same as the dispersing plate of the above-mentioned wastewater treatment device (the first type), so the description is omitted.

本型態之處理方法中,廢水中分散著氣體。本型態之裝置係藉由具有至少3個氣體-液體擴散部而提高氣液接觸,可提高觸媒之處理性能。 In this type of treatment method, gas is dispersed in the waste water. This type of device improves the gas-liquid contact by having at least three gas-liquid diffusers, which can improve the processing performance of the catalyst.

本型態之處理方法中,氣體-液體擴散部中之廢水留置時間係滿足上述(1)~(3)之條件。 In this type of treatment method, the retention time of wastewater in the gas-liquid diffusion section meets the conditions (1) to (3) above.

以下,對於(1)~(3)進行說明。 Hereinafter, (1) to (3) will be described.

(1)氣體-液體擴散部1~3中之廢水留置時間均為0.5秒以上(包含0.5秒)。該廢水留置時間未達0.5秒時,氣液之混合效果不足,無法呈現本發明之效果。廢水留置時間係以2~300秒為佳。 (1) The retention time of wastewater in the gas-liquid diffuser 1~3 is all 0.5 seconds or more (including 0.5 seconds). When the wastewater retention time is less than 0.5 seconds, the gas-liquid mixing effect is insufficient, and the effect of the present invention cannot be exhibited. The wastewater retention time is preferably 2~300 seconds.

(2)氣體-液體擴散部3與氣體-液體擴散部2中之廢水留置時間的合計為5秒以上(包含5秒)。該廢水留置時間的合計未達5秒時,水垢成分不均勻分散,且水垢成分會以離子狀態到達觸媒層,因而擔心觸媒層表面會被水垢成分所毒害。上述廢水留置時間的合計之下限係以10秒以上(包含10秒)為佳,以35秒以上(包含35秒)更佳,以60秒以上(包含60秒)又更佳。上述廢水留置時間的合計之上限並無特別限制,惟擴散部2與擴散部3中之廢水留置時間之合計係以2500秒以下(包含2500秒)為佳,以1500秒以下(包含1500秒)更佳, 以750以下(包750秒)又更佳,以300秒以下(包含300秒)為特佳。 (2) The total of the waste water retention time in the gas-liquid diffusion section 3 and the gas-liquid diffusion section 2 is 5 seconds or more (including 5 seconds). When the total retention time of the waste water is less than 5 seconds, the scale components are unevenly dispersed, and the scale components reach the catalyst layer in an ion state, and there is a concern that the surface of the catalyst layer will be poisoned by the scale components. The total lower limit of the above-mentioned wastewater retention time is preferably 10 seconds or more (including 10 seconds), more preferably 35 seconds or more (including 35 seconds), and more preferably 60 seconds or more (including 60 seconds). The upper limit of the total waste water retention time mentioned above is not particularly limited, but the total waste water retention time in the diffuser 2 and the diffuser 3 is preferably 2500 seconds or less (including 2500 seconds), preferably 1500 seconds or less (including 1500 seconds) Better, It is more preferably less than 750 (including 750 seconds), and more preferably less than 300 seconds (including 300 seconds).

(3)相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計為0.1~100倍。相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計未達0.1倍或超出100倍時,氣液之混合效果不足,容易產生水垢成分的不平衡流動,故會局部性堆積水垢成分,使處理效率降低。相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計係以0.2倍以上(包含0.2倍)為佳,以0.3倍以上(包含0.3倍)更佳,以80倍以下(包含80倍)為佳,以50倍以下(包含50倍)更佳。 (3) With respect to the wastewater retention time in the gas-liquid diffusion section 1, the total wastewater retention time in (2) above is 0.1 to 100 times. Compared with the wastewater retention time in the gas-liquid diffusion section 1, if the total wastewater retention time in (2) is less than 0.1 times or more than 100 times, the gas-liquid mixing effect is insufficient, and it is easy to cause unbalanced flow of scale components. , So it will locally accumulate scale components and reduce the treatment efficiency. With respect to the wastewater retention time in the gas-liquid diffusion section 1, the total wastewater retention time of (2) above is preferably 0.2 times or more (including 0.2 times), and more preferably 0.3 times or more (including 0.3 times), It is preferably 80 times or less (including 80 times), and more preferably 50 times or less (including 50 times).

氣體-液體擴散部為充填物層時,廢水留置時間為0.5秒以上(包含0.5秒)時,不必要考慮充填物層之孔隙率。充填物層之孔隙率一般為20~90容量%(以充填物層之總體積為基準),以30~70容量%為佳,以35~60容量%更佳。孔隙率降低時,由於填充物層中的湍流程度增加,可獲得與延長廢水留置時間相同的效果。而且,氣體-液體擴散部即使以2層以上(包含2層)之充填物層所構成,氣體-液體擴散部中之廢水留置時間係滿足上述(1)~(3)之條件。 When the gas-liquid diffuser is a filling layer, and the waste water retention time is 0.5 seconds or more (including 0.5 seconds), it is not necessary to consider the porosity of the filling layer. The porosity of the filler layer is generally 20~90% by volume (based on the total volume of the filler layer), preferably 30~70% by volume, and more preferably 35-60% by volume. When the porosity is reduced, the degree of turbulence in the filling layer increases, and the same effect as extending the retention time of wastewater can be obtained. Moreover, even if the gas-liquid diffusion part is composed of two or more filling layers (including two layers), the waste water retention time in the gas-liquid diffusion part meets the above-mentioned conditions (1) to (3).

氣體-液體擴散部中之廢水留置時間係可藉由所供給之廢水流速及裝置大小而適當地控制。而且,廢水留置時間可藉由實施例所記載之方法求算出。 The waste water retention time in the gas-liquid diffuser can be appropriately controlled by the flow rate of the waste water supplied and the size of the device. In addition, the wastewater retention time can be calculated by the method described in the examples.

較佳之實施型態中,上述擴散部3係孔隙率20~90容量%(以充填物層之總體積為基準)之充填物層。上述孔隙率係 以30~70容量%為佳,以35~60容量%更佳,以35~55容量%為特佳。而且,上述擴散部3為充填物層時,上述擴散部2及上述擴散部1之更佳者係非為充填物層之型態。 In a preferred embodiment, the diffusion portion 3 is a filler layer with a porosity of 20 to 90% by volume (based on the total volume of the filler layer). The above porosity system 30~70 volume% is preferred, 35~60 volume% is more preferred, and 35~55 volume% is particularly preferred. Furthermore, when the diffusion portion 3 is a filler layer, the better of the diffusion portion 2 and the diffusion portion 1 is not a type of a filler layer.

較佳之實施型態中,上述擴散部3為2層構造之充填物層。由於充填物層為2層構造,故可高度地維持觸媒之處理性能。 In a preferred embodiment, the diffuser 3 is a two-layered filling layer. Since the filling layer has a two-layer structure, the processing performance of the catalyst can be maintained at a high level.

上述擴散部3中之廢水留置時間為0.5秒以上(包含0.5秒),以5秒以上(包含5秒)為佳,以8秒以上(包含8秒)更佳,以10秒以上(包含10秒)為特佳。未達0.5秒時,無法充分得到本發明之效果。廢水留置時間之上限並無特別限制,惟留置時間過長時,由於到達觸媒層之廢水的氣體與液體之分散性降低,而且,擴散部3為充填物層時,壓力損失增加且發生能量損失,其效果並未提高。因此,擴散部3中之廢水留置時間係以1800秒以下(包含1800秒)為佳,以500秒以下(包含500秒)更佳,以100秒以下(包含100秒)又更佳,以50秒以下(包含50秒)為特佳。 The indwelling time of wastewater in the above-mentioned diffuser 3 is 0.5 seconds or more (including 0.5 seconds), preferably 5 seconds or more (including 5 seconds), more preferably 8 seconds or more (including 8 seconds), and 10 seconds or more (including 10 seconds). Seconds) is particularly good. When it is less than 0.5 seconds, the effects of the present invention cannot be sufficiently obtained. The upper limit of the waste water retention time is not particularly limited, but if the retention time is too long, the dispersibility of the gas and liquid of the waste water reaching the catalyst layer is reduced, and when the diffuser 3 is a filling layer, the pressure loss increases and energy is generated Loss, its effect has not improved. Therefore, the wastewater retention time in the diffuser 3 is preferably 1800 seconds or less (including 1800 seconds), more preferably 500 seconds or less (including 500 seconds), more preferably 100 seconds or less (including 100 seconds), and 50 seconds or less. Less than seconds (including 50 seconds) is particularly preferred.

上述擴散部2中之廢水留置時間為0.5秒以上(包含0.5秒),擴散部2與擴散部3中之廢水留置時間的合計為5秒以上(包含5秒)。擴散部2中之廢水留置時間的上限並無特別限制,惟廢水留置時間過長時,會有供給到擴散部3的廢水中之氣體與液體的分散性降低的情形,而且,該設備相對於待處理的廢水量而言過大,在經濟上亦為不利。因此,擴散部2中之廢水留置時間係以700秒以下(包含700秒)為佳。 The waste water retention time in the diffusion section 2 is 0.5 second or more (including 0.5 second), and the total waste water retention time in the diffusion section 2 and the diffusion section 3 is 5 seconds or more (including 5 seconds). The upper limit of the waste water retention time in the diffuser 2 is not particularly limited. However, if the waste water retention time is too long, the dispersibility of gas and liquid in the waste water supplied to the diffuser 3 may decrease. The amount of waste water to be treated is too large, and it is economically disadvantageous. Therefore, the retention time of wastewater in the diffuser 2 is preferably 700 seconds or less (including 700 seconds).

上述擴散部1中之廢水留置時間為0.5秒以上(包含0.5秒),以1秒以上(包含1秒)為佳,以2秒以上(包含2秒)更佳。廢水留置時間之上限並無特別限制,留置時間過長時,會有供給到上述擴散部2的廢水中之氣體與液體的分散性降低的情形,而且,該設備相對於待處理的廢水量而言過大,在經濟上亦為不利。因此,擴散部1中之廢水留置時間的上限係以2500秒以下(包含2500秒)為佳,以1000秒以下(包含1000秒)更佳,以600秒以下(包含600秒)又更佳,以300秒以下(包含300秒)為特佳。 The indwelling time of waste water in the above-mentioned diffuser 1 is 0.5 seconds or more (including 0.5 seconds), preferably 1 second or more (including 1 second), and more preferably 2 seconds or more (including 2 seconds). The upper limit of the waste water retention time is not particularly limited. If the retention time is too long, the dispersibility of gas and liquid in the waste water supplied to the diffuser 2 may be reduced. Moreover, the equipment is less expensive than the amount of waste water to be treated. Excessive remarks are also unfavorable economically. Therefore, the upper limit of the wastewater retention time in the diffuser 1 is preferably 2500 seconds or less (including 2500 seconds), preferably 1000 seconds or less (including 1000 seconds), and even more preferably 600 seconds or less (including 600 seconds). 300 seconds or less (including 300 seconds) is particularly preferred.

一實施型態中,本型態之處理方法係,上述氣體-液體擴散部1在廢水供給側之交界面具有分散板1,上述氣體-液體擴散部2在與上述氣體-液體擴散部1之交界面具有分散板2,此時,上述分散板1及上述分散板2各自具有1個以上(包含1個)之孔,上述分散板1及上述分散板2之至少一者具有開孔率0.005%~30%之多孔板構造。 In one embodiment, the processing method of this type is that the gas-liquid diffuser 1 has a dispersion plate 1 at the interface of the waste water supply side, and the gas-liquid diffuser 2 is in contact with the gas-liquid diffuser 1 The interface has a dispersion plate 2. In this case, the dispersion plate 1 and the dispersion plate 2 each have one or more (including one) holes, and at least one of the dispersion plate 1 and the dispersion plate 2 has an aperture ratio of 0.005 %~30% perforated plate structure.

上述多孔板構造之開孔率係以0.05%以上(包含0.05%)為佳,以0.1%以上(包含0.1%)更佳,以0.5%以上(包含0.5%)又更佳,以1%以上(包含1%)為特佳。而且,上述開孔率係以10%以下(包含10%)為佳,以5%以下(包含5%)更佳。在如此範圍內,可防止因攪拌效果引起的不平衡流動且使廢水中所含的氣體分佈均勻。因此,可改善氣液接觸而提高觸媒的處理性能。 The porosity of the above-mentioned porous plate structure is preferably 0.05% or more (including 0.05%), more preferably 0.1% or more (including 0.1%), more preferably 0.5% or more (including 0.5%), and more than 1% (Including 1%) is particularly good. Moreover, the above-mentioned open porosity is preferably 10% or less (including 10%), and more preferably 5% or less (including 5%). Within this range, the unbalanced flow caused by the stirring effect can be prevented and the gas contained in the waste water can be evenly distributed. Therefore, the gas-liquid contact can be improved and the processing performance of the catalyst can be improved.

分散板之開孔率的求算方法、多孔板之孔數以及孔的形狀係與上述廢水處理裝置(第1型態)中之分散板相同,故 省略說明。 The method of calculating the open porosity of the dispersing plate, the number of holes in the perforated plate, and the shape of the holes are the same as those of the dispersing plate in the above-mentioned wastewater treatment device (the first type), so The description is omitted.

本發明之其它反應條件係可列舉以下之(i)~(iv)。 Other reaction conditions of the present invention can be exemplified by the following (i) to (iv).

本發明之處理方法的較佳者係以進一步滿足以下之(i)~(iv):(i)上述觸媒層中之LHSV為0.1hr-1~10hr-1;(ii)上述觸媒層中之廢水溫度為80℃~370℃;(iii)上述觸媒層中之壓力係保持至少一部分的廢水為液相之壓力;以及(v)上述氣體中所含的氧量為廢水中之被氧化物的理論需氧量的0.5倍~5.0倍。 The preferred treatment method of the present invention further satisfies the following (i)~(iv): (i) the LHSV in the above-mentioned catalyst layer is 0.1hr -1 ~10hr -1 ; (ii) the above-mentioned catalyst layer The temperature of the wastewater in the gas is 80℃~370℃; (iii) the pressure in the above catalyst layer maintains at least a part of the wastewater in the liquid phase; and (v) the amount of oxygen contained in the gas is the pressure The theoretical oxygen demand of oxide is 0.5 to 5.0 times.

以下,對於(i)~(iv)進行說明。 Hereinafter, (i) to (iv) will be described.

(i)觸媒層中之LHSV(液體空間速度:Liquid Hourly Space Velocity) (i) LHSV (Liquid Hourly Space Velocity) in the catalyst layer

LHSV為0.1hr-1~10hr-1,以0.2hr-1~5hr-1為佳,以0.3hr-1~3hr-1更佳。LHSV為0.1hr-1以上(包含0.1hr-1)時,可用經濟高效的設備實施。而且,LHSV為10hr-1以下(包含10hr-1)時,可充分地進行反應塔內之廢水的氧化/分解處理。 The LHSV is 0.1hr -1 ~10hr -1 , preferably 0.2hr -1 ~5hr -1, and more preferably 0.3hr -1 ~3hr -1 . When the LHSV is 0.1hr -1 or more (including 0.1hr -1 ), it can be implemented with cost-effective equipment. Moreover, when the LHSV is 10hr -1 or less (including 10hr -1 ), the oxidation/decomposition treatment of wastewater in the reaction tower can be sufficiently performed.

(ii)觸媒層中之廢水溫度 (ii) Wastewater temperature in the catalyst layer

觸媒層中之廢水溫度為80℃~370℃,以100℃~270℃為佳,以110℃~270℃更佳,以200℃~270℃為特佳。廢水溫度超出370℃時,為了保持廢水之液相狀態而不得不施加高壓,在此情況下,設備會有變大的情形,而有增加運行成本的情形。廢水溫度未達80℃時,廢水中之被氧化物的氧化/分解處理會有難以有效地進行之情形。 The temperature of wastewater in the catalyst layer is 80℃~370℃, preferably 100℃~270℃, more preferably 110℃~270℃, especially 200℃~270℃. When the wastewater temperature exceeds 370°C, high pressure has to be applied in order to maintain the liquid state of the wastewater. In this case, the equipment may become larger, which may increase the operating cost. When the temperature of the wastewater does not reach 80°C, the oxidation/decomposition treatment of the oxides in the wastewater may be difficult to effectively proceed.

(iii)觸媒層中之壓力 (iii) Pressure in the catalyst layer

本型態之裝置中,觸媒層中之壓力係廢水之至少一部分保持液相之壓力。由於至少一部分的廢水保持液相,故以因應廢水的處理溫度適當地調整壓力為佳。 In this type of device, the pressure in the catalyst layer is the pressure that at least a part of the waste water maintains the liquid phase. Since at least a part of the wastewater remains in the liquid phase, it is better to adjust the pressure appropriately in response to the treatment temperature of the wastewater.

具體上係如以下之例示。 Specifically, it is as illustrated below.

‧當處理溫度為80℃以上(包含80℃)且未達95℃時 ‧When the processing temperature is above 80°C (including 80°C) and does not reach 95°C

如為大氣壓力以上(包含大氣壓力)即可,從經濟性之觀點上,可為大氣壓力,然為了提高處理效率,以加壓為佳。 If it is above atmospheric pressure (including atmospheric pressure), it can be atmospheric pressure from an economic point of view, but in order to improve the processing efficiency, it is better to pressurize.

‧當處理溫度為95℃以上(包含95℃)且未達170℃時 ‧When the processing temperature is above 95℃ (including 95℃) and does not reach 170℃

則為0.2~1MPa(Gauge)左右之壓力 The pressure is about 0.2~1MPa (Gauge)

‧當處理溫度為170℃以上(包含170℃)且未達230℃時 ‧When the processing temperature is above 170°C (including 170°C) and does not reach 230°C

為1~5MPa(Gauge)左右之壓力 Pressure of about 1~5MPa (Gauge)

‧當處理溫度為230℃以上(包含230℃)時 ‧When the processing temperature is above 230℃ (including 230℃)

則為超出5MPa(Gauge)左右之壓力 The pressure exceeds about 5MPa (Gauge)

另外,上述處理溫度之範圍中之壓力上限僅為粗略的標準,可通過處理效率及裝置的耐壓性之間的平衡決定。具體之上限值為21MPa以下(包含21MPa),以10MPa以下(包含10MPa)為佳,以8MPa以下(包含8MPa)為特佳。而且,壓力之上限係在觸媒層中之廢水溫度的飽和蒸氣壓的2倍以下(包含2倍),以1.5倍以下(包含1.5倍)為佳。 In addition, the upper limit of the pressure in the above processing temperature range is only a rough standard and can be determined by the balance between the processing efficiency and the pressure resistance of the device. The specific upper limit is 21 MPa or less (including 21 MPa), preferably 10 MPa or less (including 10 MPa), and particularly preferably 8 MPa or less (including 8 MPa). Moreover, the upper limit of the pressure is 2 times or less (including 2 times) of the saturated vapor pressure of the wastewater temperature in the catalyst layer, preferably 1.5 times or less (including 1.5 times).

(iv)氣體中所含之氧量 (iv) The amount of oxygen contained in the gas

根據後述「理論需氧量」的定義,氣體中所含之氧量為廢水中的被氧化物之理論需氧量的0.5~5.0倍。該氧量係 以廢水中的被氧化物之理論需氧量的0.7倍以上(包含0.7倍)為佳,並以5.0倍以下(包含5.0倍)為佳,以3.0倍以下(包含3.0倍)更佳。 According to the definition of "theoretical oxygen demand" described later, the oxygen contained in the gas is 0.5 to 5.0 times the theoretical oxygen demand of the oxidized waste water. The amount of oxygen It is preferable that the theoretical oxygen demand of oxidized in the wastewater is 0.7 times or more (including 0.7 times), and 5.0 times or less (including 5.0 times) is preferable, and 3.0 times or less (including 3.0 times) is more preferable.

本型態之處理方法中,廢水處理裝置係以使用上述第1型態之處理裝置為佳。 In the treatment method of this type, the wastewater treatment device is preferably the treatment device of the above-mentioned first type.

<本發明之具體態樣之說明> <Description of specific aspects of the present invention>

以下,對於使用本發明之第1型態的廢水處理裝置(本說明書,亦稱為「本發明之廢水處理裝置」)之廢水處理方法進行具體說明。第1圖係呈示採用作為氧化處理步驟之一的濕式氧化處理時之廢水處理方法的一個實施態樣之概略圖,惟本發明之一個型態的廢水處理裝置所使用之處理方法並不限定於此。 Hereinafter, the waste water treatment method using the waste water treatment device of the first aspect of the present invention (this specification, also referred to as the "waste water treatment device of the present invention") will be specifically described. Fig. 1 is a schematic diagram showing an embodiment of a waste water treatment method when wet oxidation treatment is used as one of the oxidation treatment steps, but the treatment method used in a type of waste water treatment device of the present invention is not limited Here.

從廢水供給源所供給之廢水係通過廢水供給管線10供給至廢水供給泵3,進而送至熱交換器2。此時之空間速度並無特別限定,可依觸媒之處理能力而適當地決定。 The waste water supplied from the waste water supply source is supplied to the waste water supply pump 3 through the waste water supply line 10, and is further sent to the heat exchanger 2. The space velocity at this time is not particularly limited, and can be appropriately determined according to the processing capacity of the catalyst.

本發明之廢水處理裝置中,濕式氧化處理可在含氧氣體之存在或不存在的任一條件下進行,然增加廢水中之氧濃度可提高廢水中所含被氧化物的氧化/分解效率,因此以將含氧氣體混入廢水中為佳。 In the wastewater treatment device of the present invention, the wet oxidation treatment can be carried out under any conditions in the presence or absence of oxygen-containing gas. However, increasing the oxygen concentration in the wastewater can improve the oxidation/decomposition efficiency of the oxides contained in the wastewater. Therefore, it is better to mix oxygen-containing gas into wastewater.

在含氧氣體之存在下進行濕式氧化處理時,例如將含氧氣體自含氧氣體供給管線11導入,以壓縮機4升壓後,廢水供給至熱交換器2之前混入廢水中為佳。本發明中,「含氧氣體」係含有分子狀氧及/或臭氧之氣體, 如為此氣體時,可為純氧、富氧氣體、空氣、過氧化氫水溶液及其它之工廠產生的含氧氣體等,含氧氣體之種類並無特別限定,從經濟性之觀點上,該等之中,建議使用空氣。 When the wet oxidation treatment is performed in the presence of oxygen-containing gas, for example, the oxygen-containing gas is introduced from the oxygen-containing gas supply line 11, and the pressure is increased by the compressor 4, and the wastewater is mixed with the wastewater before being supplied to the heat exchanger 2. In the present invention, "oxygen-containing gas" is a gas containing molecular oxygen and/or ozone, For this gas, it can be pure oxygen, oxygen-enriched gas, air, hydrogen peroxide aqueous solution, and other oxygen-containing gas produced in factories. The type of oxygen-containing gas is not particularly limited. From an economic point of view, the While waiting, it is recommended to use air.

含氧氣體供給至廢水時之供給量並無特別限定,只要供給可提高廢水中之被氧化物的氧化/分解能力之有效量即可。含氧氣體之供給量係例如藉由在含氧氣體供給管線11上設置含氧氣體流量調節閥(未圖示)等而可適當地調整對廢水的供給量。較佳之含氧氣體的供給量係推薦廢水中之被氧化物的理論需氧量之0.5倍以上(包含0.5倍),以0.7倍以上(包含0.7倍)更佳,以5.0倍以下(包含5.0倍)為佳,以3.0倍以下(包含3.0倍)更佳。 The supply amount of the oxygen-containing gas when supplied to the wastewater is not particularly limited, as long as it is supplied in an effective amount that can increase the oxidation/decomposition ability of the oxides in the wastewater. The supply amount of oxygen-containing gas can be appropriately adjusted by providing an oxygen-containing gas flow control valve (not shown) or the like on the oxygen-containing gas supply line 11, for example. The preferred supply of oxygen-containing gas is recommended to be more than 0.5 times (including 0.5 times) of the theoretical oxygen demand of the oxidized gas in the recommended wastewater, preferably at least 0.7 times (including 0.7 times), and preferably at least 5.0 times (including 5.0) Times) is better, and 3.0 times or less (including 3.0 times) is more preferred.

另外,本發明中,「理論需氧量」係指將廢水中的有機化合物及氮化合物等之被氧化物氧化及/或分解成氮氣、二氧化碳、水及灰分所需的氧量,在本發明中,理論需氧量係由化學需氧量(COD(Cr))表示。 In addition, in the present invention, "theoretical oxygen demand" refers to the amount of oxygen required to oxidize and/or decompose organic compounds and nitrogen compounds in wastewater into nitrogen, carbon dioxide, water, and ash. In, the theoretical oxygen demand is represented by the chemical oxygen demand (COD(Cr)).

送至熱交換器2之廢水被預熱。然而,在熱交換器2內部有1/2以上的廢水蒸發的條件下,廢水中的有機物及水垢成分堆積在熱交換器2內,導致熱交換效率降低、管道堵塞、因體積的急遽膨脹而導致出口側排管部的負荷、由於在反應塔的液化導致的氣槌現象等之問題。因此,以可耐受對應於加熱溫度的壓力之構造為佳。 The wastewater sent to the heat exchanger 2 is preheated. However, under the condition that more than 1/2 of the waste water evaporates inside the heat exchanger 2, the organic matter and scale components in the waste water accumulate in the heat exchanger 2, resulting in reduced heat exchange efficiency, clogged pipes, and rapid expansion of the volume. This leads to problems such as the load on the outlet side of the pipe and the gas hammer phenomenon caused by liquefaction in the reaction tower. Therefore, it is better to have a structure that can withstand the pressure corresponding to the heating temperature.

在熱交換器2中被預熱的廢水係供給至具備加熱手段8(加熱器或熱介質)的反應塔1(本發明之廢水處理裝置)。加 熱手段8係反應塔內之廢水溫度以具有可加熱至上述「(ii)觸媒層之廢水溫度」中記載之範圍的能力者為佳。 The wastewater preheated in the heat exchanger 2 is supplied to the reaction tower 1 (the wastewater treatment device of the present invention) provided with the heating means 8 (heater or heat medium). add The thermal means 8 is that the temperature of the wastewater in the reaction tower is preferably capable of being heated to the range described in the above "(ii) Wastewater temperature in the catalyst layer".

而且,熱交換器2及反應塔1係以可耐受上述「(iii)觸媒層中之壓力」中記載之壓力的構造為佳。 Furthermore, the heat exchanger 2 and the reaction tower 1 are preferably constructed to withstand the pressure described in the above-mentioned "(iii) Pressure in the catalyst layer".

而且,廢水之加熱順序並無特別限定,如上所述,可在反應塔外部預熱後在反應塔內進一步加熱,亦可僅在反應塔內加熱。而且,對於廢水之加熱方法亦無特別限定,可使用加熱器、熱交換器,而且亦可在反應塔內設置加熱器將廢水加熱。亦可進一步在廢水中供給蒸氣等之熱源。 Moreover, the heating order of the waste water is not particularly limited. As described above, it may be further heated in the reaction tower after preheating outside the reaction tower, or it may be heated only in the reaction tower. Moreover, there is no particular limitation on the method of heating wastewater, and heaters and heat exchangers can be used, and a heater can be installed in the reaction tower to heat the wastewater. It is also possible to further supply a heat source such as steam in the waste water.

加壓下進行處理時,可在反應塔之下游裝設壓力調整機構。例如第1圖所示,可藉由在氣液分離器的排氣出口側裝設壓力控制閥7等之習知手段控制。只要控制壓力的控制範圍以可維持反應塔中上述「(iii)觸媒層中的壓力」所記載之條件即可。 When processing under pressure, a pressure adjustment mechanism can be installed downstream of the reaction tower. For example, as shown in Figure 1, it can be controlled by conventional means such as installing a pressure control valve 7 on the exhaust outlet side of the gas-liquid separator. What is necessary is just to control the control range of the pressure so that the conditions described in the above "(iii) the pressure in the catalyst layer" in the reaction tower can be maintained.

而且,本發明中使用之濕式氧化處理中,反應塔之數量、種類及形狀等並無特別限定,可使用單數或組合複數種之反應塔。反應塔可為單管式亦可為多管式。設置複數個反應塔時,可根據目的而任意配置直列或並列之反應塔等。 Furthermore, in the wet oxidation treatment used in the present invention, the number, type, shape, etc. of the reaction towers are not particularly limited, and a singular or a combination of plural kinds of reaction towers can be used. The reaction tower can be a single-tube type or a multi-tube type. When a plurality of reaction towers are installed, the reaction towers in series or parallel can be arranged arbitrarily according to the purpose.

對反應塔供給廢水之方法方面,可使用氣液向上並流,氣液向下並流,氣液對流等各種型態,而且,在設置複數個反應塔時,可組合2種以上(包含2種)之該等供給方法。 In terms of the method of supplying wastewater to the reaction tower, various types such as gas-liquid upward cocurrent flow, gas-liquid downward cocurrent flow, gas-liquid convection, etc. can be used. Moreover, when multiple reaction towers are installed, two or more types (including two Kinds) of these supply methods.

反應塔中,在使用上述濕式氧化觸媒時,除了提高廢水中所含之有機化合物、氮化合物以及硫化合物之任1種以上(包含1種)等之被氧化物的氧化/分解處理效率,同時維持長期間優異之觸媒活性、觸媒耐久性,並可得到廢水經高等級淨化之處理水。 In the reaction tower, when the above-mentioned wet oxidation catalyst is used, in addition to improving the oxidation/decomposition treatment efficiency of any one or more (including one) of organic compounds, nitrogen compounds, and sulfur compounds contained in wastewater , At the same time, it maintains excellent catalyst activity and catalyst durability for a long period of time, and can obtain high-grade purified treated water from wastewater.

在使用複數個反應塔時,可分別使用不同的觸媒。而且,亦可組合充填觸媒之反應塔(本發明之廢水處理裝置)與不使用觸媒之反應塔。 When multiple reaction towers are used, different catalysts can be used respectively. Moreover, it is also possible to combine a reaction tower filled with a catalyst (the waste water treatment device of the present invention) and a reaction tower that does not use a catalyst.

廢水中之被氧化物在反應塔內經氧化/分解處理,惟本發明中之「氧化/分解處理」係例示如:將乙酸轉化為二氧化碳與水之氧化分解處理;將乙酸轉化為二氧化碳與甲烷之去羧分解處理;將硫化物、氫硫化物、亞硫酸鹽,硫代硫酸鹽轉化為硫酸鹽之氧化處理;將二甲基亞碸轉化為二氧化碳、水、硫酸根離子等之灰分的氧化及氧化分解處理;將尿素轉化為氨與二氧化碳之水解處理;將氨或肼轉化為氮氣與水的氧化分解處理;將二甲基亞碸轉化為二甲基碸或甲磺酸之氧化處理等,意即,係包含將易分解性的被氧化物分解成氮氣、二氧化碳、水及灰分等為止之分解處理、將難分解性之有機化合物及氮化合物的分子量降低之分解處理,或進行氧化之氧化處理等各種的氧化及/或分解之意。 The oxides in the wastewater undergo oxidation/decomposition treatment in the reaction tower, but the "oxidation/decomposition treatment" in the present invention exemplifies the oxidative decomposition treatment of converting acetic acid into carbon dioxide and water; converting acetic acid into carbon dioxide and methane Decarboxylation treatment; oxidation treatment to convert sulfide, hydrosulfide, sulfite, thiosulfate into sulfate; oxidation and oxidation of dimethyl sulfite into carbon dioxide, water, sulfate ion, etc. Oxidative decomposition treatment; hydrolysis treatment that converts urea into ammonia and carbon dioxide; oxidative decomposition treatment that converts ammonia or hydrazine into nitrogen and water; oxidation treatment that converts dimethyl sulfite into dimethyl sulfide or methanesulfonic acid, etc., That is, it includes decomposition treatment to decompose easily decomposable oxides into nitrogen, carbon dioxide, water, ash, etc., decomposition treatment to reduce the molecular weight of difficult-to-decompose organic compounds and nitrogen compounds, or oxidation for oxidation Various oxidation and/or decomposition meanings such as treatment.

而且,在通過不使用觸媒之濕式氧化處理而得的處理液中,被氧化物中之難分解性的有機化合物多殘存低分子量,低分子量之有機化合物方面,多殘留低分 子量之有機酸,尤其是乙酸。然而,在使用如本發明之觸媒的方法中,藉由提高反應溫度、增加觸媒量而可降低該等之殘留量。 In addition, in the treatment liquid obtained by wet oxidation treatment without using a catalyst, many of the hardly decomposable organic compounds in the oxide remain low molecular weight, and low molecular weight organic compounds have many residues and low scores. Organic acids, especially acetic acid. However, in the method of using the catalyst of the present invention, the residual amount can be reduced by increasing the reaction temperature and increasing the amount of the catalyst.

第1圖係具體地呈示其處理例,廢水係在反應塔1經氧化/分解處理之後,從處理液管線12取出處理液,根據需要在冷卻器9適當冷卻後,通過氣液分離器5分離成氣體與液體。此時,使用液位控制器LC檢測液位狀態,以藉由液位控制閥6使氣液分離器內之液位控制為恆定者為佳。而且,使用壓力控制器PC檢測壓力狀態,並且通過壓力控制閥7將氣液分離器內之壓力控制為恆定者為佳。 Figure 1 shows a concrete example of the treatment. After the wastewater is oxidized/decomposed in the reaction tower 1, the treatment liquid is taken out from the treatment liquid line 12, appropriately cooled by the cooler 9 as necessary, and then separated by the gas-liquid separator 5. Into gas and liquid. At this time, the liquid level controller LC is used to detect the liquid level state, and the liquid level in the gas-liquid separator is controlled to be constant by the liquid level control valve 6. Furthermore, it is better to use the pressure controller PC to detect the pressure state, and to control the pressure in the gas-liquid separator to be constant through the pressure control valve 7.

壓力控制閥之位置係只要可維持/控制氣液分離器之前設置等的反應塔內的處理條件之範圍,可適當地變更。 The position of the pressure control valve can be appropriately changed as long as it can maintain/control the range of the processing conditions in the reaction tower such as the installation before the gas-liquid separator.

此處,氣液分離器內之溫度並無特別限定,惟在反應塔將廢水進行氧化/分解處理而得的處理液中因含有二氧化碳,故以例如藉由提高氣液分離器內之溫度使釋出廢水中之二氧化碳,或經氣液分離器分離後之液體以空氣等之氣體進行起泡處理而釋出液體中之二氧化碳者為佳。 Here, the temperature in the gas-liquid separator is not particularly limited. However, the treated liquid obtained by oxidizing/decomposing wastewater in the reaction tower contains carbon dioxide. Therefore, for example, the temperature in the gas-liquid separator is increased. It is better to release the carbon dioxide in the waste water, or the liquid separated by the gas-liquid separator is bubbled with air and other gases to release the carbon dioxide in the liquid.

處理液之溫度控制中,可將處理液供給至氣液分離器5之前經由熱交換器2、冷卻器9等之冷卻手段冷卻、亦可在氣液分離之後裝設熱交換器(無圖示)或冷卻器(無圖示)等之冷卻手段將處理液進行冷卻。 In the temperature control of the processing liquid, the processing liquid can be cooled by cooling means such as heat exchanger 2, cooler 9, etc. before the processing liquid is supplied to the gas-liquid separator 5. It is also possible to install a heat exchanger after the gas-liquid separation (not shown) ) Or cooler (not shown) and other cooling means to cool the processing liquid.

在氣液分離器5分離而得之液體(處理液)係 由處理液排出管線14排出。經排出之液體可進一步經生物處理或膜分離處理等之各種習知步驟進一步施行淨化處理。更且,經濕式氧化處理而得之處理液的一部分在進行濕式氧化處理之前直接返回到廢水中、或者從廢水供給管線之任意位置供給至廢水中、或進行濕式氧化處理。例如亦可將經濕式氧化處理而得之處理液作為廢水之稀釋水使用而降低廢水之TOD濃度或COD濃度。而且,在氣液分離器5分離而得之氣體係由氣體排出管線13排出外界。另外,排出的廢氣可進一步進行其它步驟。而且,在進行本發明中使用之濕式氧化處理時,熱交換器亦可用於加熱器及冷卻器,並且該等熱交換器可適當組合使用。 The liquid (treatment liquid) obtained by separation in the gas-liquid separator 5 is It is discharged from the processing liquid discharge line 14. The discharged liquid can be further purified by various conventional steps such as biological treatment or membrane separation treatment. Furthermore, a part of the treated liquid obtained by the wet oxidation treatment is directly returned to the waste water before the wet oxidation treatment is performed, or is supplied to the waste water from any position of the waste water supply line, or is subjected to the wet oxidation treatment. For example, the treated liquid obtained by wet oxidation treatment can also be used as the dilution water of wastewater to reduce the TOD concentration or COD concentration of the wastewater. Furthermore, the gas system separated in the gas-liquid separator 5 is discharged to the outside through the gas discharge line 13. In addition, the exhaust gas may be further subjected to other steps. Furthermore, when performing the wet oxidation treatment used in the present invention, the heat exchanger can also be used for a heater and a cooler, and these heat exchangers can be used in combination as appropriate.

實施例 Example

以下,參照實施例及比較例以更詳細地說明本發明,惟本發明並不限定於此。 Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these.

[實施例1] [Example 1]

實施例1之反應塔的細節呈示於第2圖。設置在直徑600mm、長度9000mm之圓柱狀的反應塔1之由網格及金屬網而成的支撐座上,將直徑600mm、長度5~8mm(平均長度6.5mm)之圓柱狀的SUS製丸狀物(平均粒徑8.5mm)在高度方向上充填100mm(H3)(下部充填物層16;擴散部3)。該丸狀物之比重約為7.9,孔隙率為43%。 The details of the reaction tower of Example 1 are shown in Figure 2. Installed on the support base of the grid and metal mesh of the cylindrical reaction tower 1 with a diameter of 600mm and a length of 9000mm, and pellets the cylindrical SUS with a diameter of 600mm and a length of 5-8mm (average length of 6.5mm) The material (average particle size 8.5 mm) is filled with 100 mm (H3) in the height direction (lower filling material layer 16; diffuser 3). The specific gravity of the pellets is about 7.9, and the porosity is 43%.

接著,下部充填物層16之上在高度方向7074mm(H4)充填固體觸媒2000L(觸媒層17)。使用之固體觸媒係以氧化鈦與鉑作為主成分所構成之觸媒,各自的重量 比以TiO2:Pt換算為99.0:1.0。而且,該固體觸媒之形狀係直徑4mm φ×長度6mm之丸狀物(平均粒徑7.2mm)。然後,該觸媒層17之上,與上述相同,在高度方向300mm(H5)充填SUS製丸狀物(上部充填物層18)。 Next, the lower filler layer 16 is filled with a solid catalyst 2000L (catalyst layer 17) in the height direction of 7074 mm (H4). The solid catalyst used is a catalyst composed of titanium oxide and platinum as main components, and the weight ratio of each is 99.0:1.0 in terms of TiO 2 :Pt. In addition, the shape of the solid catalyst is a pellet with a diameter of 4 mm φ × a length of 6 mm (average particle diameter 7.2 mm). Then, the catalyst layer 17 is filled with SUS pellets (upper filler layer 18) in the height direction of 300 mm (H5) in the same manner as described above.

下部充填物層16之下側(上游側)配置有多孔板15-1(氣體-液體分散部)以及附碰撞板之單孔板15-2(氣體-液體分散部),該等分散板之間的空間(擴散部1)之距離為950mm(H1),附碰撞板之單孔板15-2與下部充填物層16的廢水供給側之面之間的空間(擴散部2)之距離為10mm(H2),從多孔板15-1至觸媒層17入口(交界面)之距離為110mm(H6)。多孔板之開孔率係2.2%,多孔板中每1m2均一配置53個之孔。 The lower side (upstream side) of the lower filling layer 16 is provided with a porous plate 15-1 (gas-liquid dispersion part) and a single-hole plate 15-2 (gas-liquid dispersion part) with a collision plate. The distance between the space (diffusion part 1) is 950mm (H1), and the distance between the single-hole plate 15-2 with collision plate and the waste water supply side surface of the lower filling layer 16 (diffusion part 2) is 10mm (H2), the distance from the porous plate 15-1 to the entrance (interface) of the catalyst layer 17 is 110mm (H6). The opening ratio of the perforated plate 2.2% based porous plate 2 uniformly arranged holes 53 of each of 1m.

(廢水物理試驗) (Waste water physical test)

第1圖所示之廢水處理方法中,反應塔1係使用實施例1之反應塔,在下列條件下進行合計1000小時的廢水處理。從廢水供給管線10輸送之廢水通過廢水供給泵3以4m3/hr的流量加壓、進料後,使反應塔之最高溫度成為250℃之方式以熱交換器2及電熱器(加熱手段8)進行調節,由反應塔1之底部供給。而且,由含氧氣體供給管線11供給空氣,以壓縮機4升壓後,以O2/COD(Cr)(空氣中之氧量/化學需氧量)=1.5之比例的方式從熱交換器2的前部供給,混入該廢水。觸媒層中之LHSV為2.0hr-1。將濕式氧化處理後之處理液經處理液管線12在冷卻器9冷卻後,經由氣液分離器5進行氣液分離處理。氣液分離器5中,由液位控制器(LC)檢測 液位,並使液位控制閥6運作以保持恆定液面,同時通過壓力控制器(PC)檢測壓力,並使壓力控制閥7運作以保持7MPaG之壓力而操作。然後,經如此操作處理之處理液從處理液排出管線14排出。處理開始時之反應塔入口壓力(PI)為7.2MPaG。 In the wastewater treatment method shown in Figure 1, the reaction tower 1 uses the reaction tower of Example 1, and performs wastewater treatment for a total of 1000 hours under the following conditions. The waste water transported from the waste water supply pipeline 10 is pressurized and fed by the waste water supply pump 3 at a flow rate of 4 m 3 /hr, and the maximum temperature of the reaction tower is 250 ℃ by heat exchanger 2 and electric heater (heating means 8 ) Is adjusted and supplied from the bottom of the reaction tower 1. In addition, air is supplied from the oxygen-containing gas supply line 11, and after the compressor 4 is pressurized, the air is supplied from the heat exchanger at a ratio of O 2 /COD (Cr) (oxygen content in the air/chemical oxygen demand) = 1.5 The front part of 2 is supplied, mixed with the waste water. The LHSV in the catalyst layer is 2.0hr -1 . After the treatment liquid after wet oxidation treatment is cooled in the cooler 9 through the treatment liquid line 12, the gas-liquid separation treatment is performed through the gas-liquid separator 5. In the gas-liquid separator 5, the liquid level is detected by the liquid level controller (LC), and the liquid level control valve 6 is operated to maintain a constant liquid level. At the same time, the pressure is detected by the pressure controller (PC), and the pressure control valve 7 It operates to maintain a pressure of 7MPaG. Then, the treatment liquid treated in this manner is discharged from the treatment liquid discharge line 14. The inlet pressure (PI) of the reaction tower at the beginning of the treatment was 7.2 MPaG.

用於處理之廢水係COD(Cr)=43g/L、pH=11,水垢成分係含有25mg/L之鈣、1mg/L之鐵。 The wastewater used for treatment is COD(Cr)=43g/L, pH=11, and the scale component contains 25mg/L calcium and 1mg/L iron.

(COD(Cr)處理率) (COD(Cr) processing rate)

1000小時反應後之COD(Cr)處理率為85%。COD(Cr)處理率係使用下述式求算。 The COD (Cr) treatment rate after 1000 hours of reaction is 85%. The COD (Cr) treatment rate is calculated using the following formula.

COD(Cr)處理率[%]=[廢水之COD(Cr)-處理液之COD(Cr)]/廢水之COD(Cr)×100 COD(Cr) treatment rate [%]=[COD(Cr) of waste water-COD(Cr) of treatment liquid]/COD(Cr) of waste water×100

(水垢成分之附著) (Attachment of scale ingredients)

取出觸媒並以肉眼確認水垢成分之附著狀態,依照以下基準評定為B。 Take out the catalyst and visually confirm the adhesion state of the scale components, and evaluate it as B according to the following criteria.

A:幾乎看不到任何附著。 A: Hardly any adhesion is seen.

B:看到些許附著。 B: Slightly attached.

C:看到明顯附著(褐色)。 C: Obvious adhesion (brown) is seen.

(廢水之留置時間) (Retention time of wastewater)

擴散部1~3中之廢水留置時間係使用以下之式求算出。擴散部1~3中之廢水留置時間呈示於表1-2。 The waste water retention time in the diffuser 1~3 is calculated using the following formula. The retention time of wastewater in the diffusion section 1~3 is shown in Table 1-2.

廢水留置時間(秒)=擴散部之層長(mm)÷廢水流速(mm/ 秒) Wastewater retention time (seconds) = layer length of diffusion part (mm) ÷ wastewater flow rate (mm/ Second)

[實施例2~7] [Examples 2~7]

在實施例2~7,於實施例1之反應塔中,使用多孔板15-1與附碰撞板之單孔板15-2之間的距離H1以及自多孔板15-1至下部充填物層16入口之距離H2之值變更為表1-1所示之值的反應塔,進行上述廢水處理試驗。1000小時後之處理率及水垢成分在觸媒之附著狀態呈示於表1,而且,廢水留置時間呈示於表1-2。 In Examples 2-7, in the reaction tower of Example 1, the distance H1 between the perforated plate 15-1 and the single-hole plate 15-2 with the collision plate and the distance from the perforated plate 15-1 to the lower filling layer 16 In the reaction tower where the distance H2 from the inlet was changed to the value shown in Table 1-1, the above wastewater treatment test was performed. The treatment rate after 1000 hours and the adhesion state of scale components on the catalyst are shown in Table 1, and the wastewater retention time is shown in Table 1-2.

[實施例8~9] [Examples 8~9]

在實施例8~9,於實施例4之反應塔中,使用H1之值變更為表2-1所示之值的反應塔,進行上述廢水處理試驗。1000小時後之處理率及水垢成分在觸媒之附著狀態呈示於表2-1,以及廢水留置時間呈示於表2-2。 In Examples 8-9, in the reaction tower of Example 4, the reaction tower whose value of H1 was changed to the value shown in Table 2-1 was used to perform the above-mentioned wastewater treatment test. The treatment rate after 1000 hours and the adhesion state of scale components on the catalyst are shown in Table 2-1, and the wastewater retention time is shown in Table 2-2.

[比較例1] [Comparative Example 1]

比較例1中,於實施例1之反應塔中,使用H1之值變更為1200mm的反應塔,進行上述廢水處理試驗。1000小時後之處理率及水垢成分在觸媒之附著狀態呈示於表3-1,以及廢水留置時間呈示於表3-2。 In Comparative Example 1, in the reaction tower of Example 1, a reaction tower whose value of H1 was changed to 1200 mm was used to conduct the above-mentioned wastewater treatment test. The treatment rate after 1000 hours and the adhesion state of scale components on the catalyst are shown in Table 3-1, and the wastewater retention time is shown in Table 3-2.

[比較例2] [Comparative Example 2]

比較例2中,於實施例1之反應塔中,使用H1及H2之值變更為表3-1所示之值的反應塔,進行上述廢水處理試驗。1000小時後之處理率及水垢成分在觸媒之附著狀態呈示於表3-1,以及廢水留置時間呈示於表3-2。 In Comparative Example 2, in the reaction tower of Example 1, the reaction tower in which the values of H1 and H2 were changed to the values shown in Table 3-1 was used to perform the above-mentioned wastewater treatment test. The treatment rate after 1000 hours and the adhesion state of scale components on the catalyst are shown in Table 3-1, and the wastewater retention time is shown in Table 3-2.

[比較例3] [Comparative Example 3]

比較例3中,於實施例1之反應塔中,使用H1及H2之值變更為表3-1所示之值且未充填下部充填物層16的反應塔,進行上述廢水處理試驗。1000小時後之處理率及水垢成分在觸媒之附著狀態呈示於表3-1,以及廢水留置時間呈示於表3-2。 In Comparative Example 3, in the reaction tower of Example 1, the reaction tower in which the values of H1 and H2 were changed to the values shown in Table 3-1 and was not filled with the lower filling layer 16 was used to perform the above-mentioned wastewater treatment test. The treatment rate after 1000 hours and the adhesion state of scale components on the catalyst are shown in Table 3-1, and the wastewater retention time is shown in Table 3-2.

Figure 107108506-A0305-02-0039-1
Figure 107108506-A0305-02-0039-1

Figure 107108506-A0305-02-0039-2
Figure 107108506-A0305-02-0039-2
Figure 107108506-A0305-02-0040-4
Figure 107108506-A0305-02-0040-4

Figure 107108506-A0305-02-0040-5
Figure 107108506-A0305-02-0040-5
Figure 107108506-A0305-02-0041-6
Figure 107108506-A0305-02-0041-6

Figure 107108506-A0305-02-0041-7
Figure 107108506-A0305-02-0041-7

Figure 107108506-A0305-02-0041-8
Figure 107108506-A0305-02-0041-8
Figure 107108506-A0305-02-0042-9
Figure 107108506-A0305-02-0042-9

Figure 107108506-A0305-02-0042-10
Figure 107108506-A0305-02-0042-10

如表1-1及2-1所示,可知在實施例1~9中,通過將H6及H6/H1設定在預定範圍內,可抑制觸媒中的水垢成分析出,從而可高度維持觸媒之處理性能。另一方面,如表3-1所示,可知在比較例1~3中,H6/H1或H6之值均不在本發明之範圍內,水垢成分明顯附著在觸媒上,且觸媒性能降低。 As shown in Tables 1-1 and 2-1, it can be seen that in Examples 1-9, by setting H6 and H6/H1 within a predetermined range, the scale composition in the catalyst can be suppressed and the catalyst can be maintained at a high level. Media processing performance. On the other hand, as shown in Table 3-1, it can be seen that in Comparative Examples 1 to 3, the value of H6/H1 or H6 is not within the scope of the present invention, the scale component is obviously attached to the catalyst, and the catalyst performance is reduced .

而且,如表1-2及2-2所示,可知在實施例1~9中,(1)擴散部1~3中之廢水留置時間、(1)擴散部3與擴散部2中之廢水留置時間的合計,以及(3)相對於擴散部1中之廢水留置時間的上述(2)廢水留置時間之合計在預定的範圍內,可抑制觸媒中的水垢成分析出,從而可高度維持觸媒之處理 性能。另一方面,如表3-2所示,可知在比較例1~3中,均未滿足上述(1)~(3)之任一者,水垢成分明顯附著在觸媒上,且觸媒性能降低。 Moreover, as shown in Tables 1-2 and 2-2, it can be seen that in Examples 1-9, (1) the waste water retention time in the diffusion part 1~3, (1) the waste water in the diffusion part 3 and the diffusion part 2 The total retention time and (3) the total retention time of the wastewater in the diffusion section 1 (2) The total retention time of the wastewater in the above-mentioned (2) wastewater retention time is within a predetermined range, and the scale components in the catalyst can be inhibited from being analyzed, thereby achieving a high degree of maintenance. Catalyst treatment performance. On the other hand, as shown in Table 3-2, it can be seen that in Comparative Examples 1 to 3, none of the above (1) to (3) is satisfied, the scale component is obviously attached to the catalyst, and the catalyst performance reduce.

[實施例10-14] [Example 10-14]

在實施例10-14,於實施例4之反應塔中,使用設置作為分散板15-1之多孔板的開孔率以及每1m2之多孔板的孔數變更為表4所示之值的反應塔,進行上述廢水處理試驗。 In Examples 10-14, in the reaction tower of Example 4, the opening ratio of the perforated plate provided as the dispersion plate 15-1 and the number of holes per 1 m 2 of the perforated plate were changed to the values shown in Table 4 In the reaction tower, the above-mentioned wastewater treatment test was carried out.

多孔板之開孔率係由以下之式求算之值。 The open porosity of the perforated plate is the value calculated by the following formula.

開孔率[%]=孔全體之截面積/分散板全體之截面積×100 Hole rate [%]=cross-sectional area of the entire hole/cross-sectional area of the entire dispersion plate×100

將結果呈示於表4。 The results are shown in Table 4.

Figure 107108506-A0305-02-0043-11
Figure 107108506-A0305-02-0043-11

如表4所示,可知觸媒之處理性能及水垢成分在觸媒的析出係可藉由多孔板之開孔率及每1m2之孔數 控制。 As shown in Table 4, it can be seen that the treatment performance of the catalyst and the precipitation of scale components in the catalyst can be controlled by the opening rate of the porous plate and the number of holes per 1 m 2.

[實施例15-1~15-4] [Examples 15-1~15-4]

將實施例15-1~15-4之反應塔的細節呈示於第3-1~3-4圖。H1~H6之值係如表5-1所示,與實施例4之反應塔為相同之值。對於分散板15-1~15-4,使用變更如以下之反應塔,進行上述廢水處理試驗。將結果呈示於表5-1及5-2。 The details of the reaction towers of Examples 15-1 to 15-4 are shown in Figures 3-1 to 3-4. The values of H1~H6 are shown in Table 5-1, which are the same values as the reaction tower of Example 4. For the dispersion plates 15-1~15-4, the above-mentioned wastewater treatment test was performed using the reaction tower modified as follows. The results are shown in Tables 5-1 and 5-2.

第3-1圖(實施例15-1):分散板15-1配置成為附碰撞板之單孔板、分散板15-2配置成為多孔板之裝置 Figure 3-1 (Example 15-1): Dispersion plate 15-1 is arranged as a single-hole plate with collision plate, and dispersion plate 15-2 is arranged as a perforated plate

第3-2圖(實施例15-2):分散板15-1及15-2作成多孔板之裝置 Figure 3-2 (Embodiment 15-2): Dispersion plates 15-1 and 15-2 are made into perforated plates

第3-3圖(實施例15-3):分散板15-1及15-2作成附碰撞板之單孔板的裝置 Figure 3-3 (Embodiment 15-3): Dispersing plates 15-1 and 15-2 are made into single-hole plates with collision plates

第3-4圖(實施例15-4):將附碰撞板之單孔板(15-4)與多孔板(15-3)再另外配置1片之的裝置。分散板15-3與分散板15-4之間隔設為150mm、分散板15-2與分散板15-3之間隔設為300mm。 Figure 3-4 (Embodiment 15-4): The single-well plate (15-4) and the perforated plate (15-3) with the collision plate are additionally equipped with another device. The distance between the dispersion plate 15-3 and the dispersion plate 15-4 was set to 150 mm, and the distance between the dispersion plate 15-2 and the dispersion plate 15-3 was set to 300 mm.

[比較例4] [Comparative Example 4]

比較例4之反應,如第3-5圖所示,係僅配置1片多孔板作為分散板之裝置。H2~H6之值係如表5-1所示,與實施例4之反應塔為相同之值。使用該反應塔,進行上述廢水處理試驗。將結果呈示於表5-1及5-2。 The reaction of Comparative Example 4, as shown in Figs. 3-5, was a device in which only one perforated plate was arranged as a dispersing plate. The values of H2~H6 are shown in Table 5-1, which are the same values as the reaction tower of Example 4. Using this reaction tower, the above-mentioned wastewater treatment test was performed. The results are shown in Tables 5-1 and 5-2.

[表5-1]

Figure 107108506-A0305-02-0045-12
[Table 5-1]
Figure 107108506-A0305-02-0045-12

Figure 107108506-A0305-02-0045-13
Figure 107108506-A0305-02-0045-13
Figure 107108506-A0305-02-0046-14
Figure 107108506-A0305-02-0046-14

如表5-1及5-2所示,相對於下部充填物層之廢水的流動,藉由在上游側(廢水供給側)設置2片分散板,可抑制觸媒中的水垢成分析出,從而可高度維持觸媒之處理性能。而且,在實施例4,藉由設置多孔板(分散板15-2)作為分散板2、設置附碰撞板之單孔板(分散板15-1)作為分散板1,相較於實施例15-1~15-3,可抑制觸媒中的水垢成分析出,從而可高度維持觸媒之處理性能。更且,將實施例4與實施例15-4進行比較時,可知通過分散板的增設,可提高本發明的效果。 As shown in Tables 5-1 and 5-2, with respect to the flow of waste water in the lower filling layer, by installing two dispersing plates on the upstream side (waste water supply side), the scale components in the catalyst can be suppressed. Thereby, the processing performance of the catalyst can be maintained at a high level. Furthermore, in Example 4, by setting a perforated plate (dispersion plate 15-2) as the dispersion plate 2, a single-hole plate with collision plate (dispersion plate 15-1) was provided as the dispersion plate 1, compared to Example 15. -1~15-3, can inhibit the scale composition in the catalyst, so as to maintain the catalyst's processing performance to a high degree. Furthermore, when Example 4 is compared with Example 15-4, it can be seen that the effect of the present invention can be improved by adding a dispersion plate.

[實施例16] [Example 16]

在實施例16,於實施例4之反應塔中,使用H3之值變更為200mm之反應塔,進行上述廢水處理試驗。將結果呈示於表6-1及6-2。 In Example 16, in the reaction tower of Example 4, a reaction tower whose value of H3 was changed to 200 mm was used to conduct the above-mentioned wastewater treatment test. The results are shown in Tables 6-1 and 6-2.

[實施例17] [Example 17]

將實施例17之反應塔的細節呈示於第4圖。在下部充填物層16(H3:170mm;充填物層1)之上,將直徑8.0mm之球狀的SUS球在高度方向上充填30mm(H7)作為第2充填物層19(充填物層2)。該SUS球之比重約為8.2,第2充填物層19之孔隙率為41%。使用該反應塔,進行上述廢水處理試驗。將結果呈示於表6-1及6-2。 The details of the reaction tower of Example 17 are shown in Fig. 4. On the lower filler layer 16 (H3: 170 mm; filler layer 1), a spherical SUS ball with a diameter of 8.0 mm is filled with 30 mm (H7) in the height direction as the second filler layer 19 (filler layer 2). ). The specific gravity of the SUS ball is about 8.2, and the porosity of the second filling layer 19 is 41%. Using this reaction tower, the above-mentioned wastewater treatment test was performed. The results are shown in Tables 6-1 and 6-2.

[實施例18~20] [Examples 18-20]

在實施例18~20,於實施例17之反應塔中,使用將H7之值變更為表6-1所示之值的反應塔,進行上述廢水處理試驗。將結果呈示於表6-1及6-2。 In Examples 18 to 20, in the reaction tower of Example 17, a reaction tower in which the value of H7 was changed to the value shown in Table 6-1 was used to perform the above-mentioned wastewater treatment test. The results are shown in Tables 6-1 and 6-2.

[實施例21] [Example 21]

在實施例21,於實施例18之反應塔的第2充填物層19(充填物層2)中,使用直徑7.5mm之球狀的鋯球在高度方向上充填100mm(H7)以取代SUS球之反應塔,進行上述廢水處理試驗。鋯球之比重約為5.3、第2充填物層19(充填物層2)之孔隙率為41%。將結果呈示於表6-1及6-2。 In Example 21, in the second filling layer 19 (filling layer 2) of the reaction tower of Example 18, spherical zirconium balls with a diameter of 7.5 mm were used to fill 100 mm (H7) in the height direction instead of SUS balls For the reaction tower, the above-mentioned wastewater treatment test was carried out. The specific gravity of the zirconium balls is about 5.3, and the porosity of the second filling layer 19 (filling layer 2) is 41%. The results are shown in Tables 6-1 and 6-2.

Figure 107108506-A0305-02-0047-15
Figure 107108506-A0305-02-0047-15
Figure 107108506-A0305-02-0048-16
Figure 107108506-A0305-02-0048-16

Figure 107108506-A0305-02-0048-17
Figure 107108506-A0305-02-0048-17

如表6-1及6-2所示,可知藉由將下部充填物層(擴散部3)作成2層構造,可更高度地維持觸媒之處理性能。而且,在實施例21,相較於實施例18,藉由將陶瓷填料使用於第2填充物層19,認為可更高度維持觸媒之處理性能,從而可進一步抑制水垢成分在觸媒的析出。 As shown in Tables 6-1 and 6-2, it can be seen that by making the lower filling layer (diffusion part 3) into a two-layer structure, the processing performance of the catalyst can be maintained more highly. In addition, in Example 21, compared with Example 18, by using ceramic filler in the second filler layer 19, it is considered that the treatment performance of the catalyst can be maintained to a higher degree, and the precipitation of scale components in the catalyst can be further suppressed. .

1‧‧‧反應塔 1‧‧‧Reaction Tower

2‧‧‧熱交換器 2‧‧‧Heat exchanger

3‧‧‧廢水供給泵 3‧‧‧Waste water supply pump

4‧‧‧壓縮機 4‧‧‧Compressor

5‧‧‧氣液分離器 5‧‧‧Gas-liquid separator

6‧‧‧液位控制閥 6‧‧‧Liquid level control valve

7‧‧‧壓力控制閥 7‧‧‧Pressure control valve

8‧‧‧加熱手段(加熱器或熱介質) 8‧‧‧Heating means (heater or heating medium)

9‧‧‧冷卻器 9‧‧‧Cooler

10‧‧‧廢水供給管線 10‧‧‧Wastewater supply pipeline

11‧‧‧含氧氣體供給管線 11‧‧‧Oxygen-containing gas supply pipeline

12‧‧‧處理液管線 12‧‧‧Treatment liquid pipeline

13‧‧‧氣體排出管線 13‧‧‧Gas discharge pipeline

14‧‧‧處理液排出管線 14‧‧‧Processing liquid discharge pipeline

Claims (10)

一種處理裝置,包含一反應容器,上述反應容器由其廢水供給側依序具有分散板2、分散板1、充填物層及觸媒層之廢水處理裝置,當上述分散板2與上述分散板1之距離為H1、上述分散板1與上述充填物層之廢水供給側的交界面之距離為H2、上述充填物層之層長為H3,以及上述H2與上述H3之合計為H6時,上述H6超出100mm,且上述H6與上述H1之比(H6/H1)為0.1以上(包含0.1)100以下(包含100),其中上述H1係10mm以上(包含10mm)1000mm以下(包含1000mm),H1、及H2之距離分別對應於上述反應容器內的氣體-液體擴散部1的一空間、及氣體-液體擴散部2的一空間,及上述反應容器具有一含氧氣體供給管線。 A treatment device comprising a reaction vessel. The reaction vessel has a dispersing plate 2, a dispersing plate 1, a filling layer, and a catalyst layer in sequence from the waste water supply side of the reaction vessel. When the dispersing plate 2 and the dispersing plate 1 When the distance is H1, the distance between the dispersion plate 1 and the waste water supply side of the filling layer is H2, the layer length of the filling layer is H3, and the sum of the above H2 and the above H3 is H6, the above H6 Exceeding 100mm, and the ratio of the above H6 to the above H1 (H6/H1) is 0.1 or more (including 0.1) and 100 or less (including 100), where the above H1 is 10mm or more (including 10mm) and 1000mm or less (including 1000mm), H1, and The distance of H2 corresponds to a space of the gas-liquid diffusion portion 1 and a space of the gas-liquid diffusion portion 2 in the reaction vessel, and the reaction vessel has an oxygen-containing gas supply line. 如請求項1之處理裝置,其中上述分散板1及上述分散板2之至少一者為多孔板,上述多孔板之孔數係每1m2為5個以上(包含5個)200個以下(包含200個)。 For example, the processing device of claim 1, wherein at least one of the dispersing plate 1 and the dispersing plate 2 is a perforated plate, and the number of holes of the perforated plate is 5 or more (including 5) and 200 or less (including 5) per 1 m 2 200). 如請求項1之處理裝置,其中上述充填物層為2層構造。 Such as the processing device of claim 1, wherein the above-mentioned filling layer has a two-layer structure. 如請求項3之處理裝置,其中上述2層構造的充填物層中,當廢水供給側之充填物層為充填物層1,以及觸媒層側之充填物層為充填物層2時,上述 充填物層2之層長為30mm以上(包含30mm)500mm以下(包含500mm)。 Such as the treatment device of claim 3, wherein in the above-mentioned two-layer structure of the filling layer, when the filling layer on the waste water supply side is the filling layer 1, and the filling layer on the catalyst layer side is the filling layer 2, the above The layer length of the filling layer 2 is 30 mm or more (including 30 mm) and 500 mm or less (including 500 mm). 如請求項3或4之處理裝置,其中上述2層構造的充填物層中,當廢水供給側之充填物層為充填物層1,以及觸媒層側之充填物層為充填物層2時,上述充填物層1所含的充填物1之平均粒徑d1、上述充填物層2所含的充填物2之平均粒徑d2以及上述觸媒層所含的觸媒之平均粒徑d0滿足d1>d2>d0之關係。 Such as the treatment device of claim 3 or 4, wherein in the above-mentioned two-layer structure of the filling layer, when the filling layer on the waste water supply side is the filling layer 1, and the filling layer on the catalyst layer side is the filling layer 2. , The average particle size d1 of the filler 1 contained in the filler layer 1, the average particle size d2 of the filler 2 contained in the filler layer 2, and the average particle size d0 of the catalyst contained in the catalyst layer satisfy The relationship of d1>d2>d0. 如請求項1之處理裝置,其中上述觸媒層所含的觸媒為濕式氧化觸媒。 The processing device of claim 1, wherein the catalyst contained in the above-mentioned catalyst layer is a wet oxidation catalyst. 一種廢水處理方法,其係使用如請求項1之處理裝置的廢水處理方法,其中上述充填物層之層長H3對應於上述反應容器內的氣體-液體擴散部3的一空間,上述廢水中係有氣體分散,且滿足下述(1)~(3):(1)上述氣體-液體擴散部1~3中之上述廢水留置時間均為0.5秒以上(包含0.5秒);(2)上述氣體-液體擴散部3與上述氣體-液體擴散部2中之廢水留置時間的合計為5秒以上(包含5秒);以及(3)相對於上述氣體-液體擴散部1中之廢水留置時間,上述(2)之廢水留置時間的合計為0.1~100倍。 A waste water treatment method, which is a waste water treatment method using the treatment device of claim 1, wherein the layer length H3 of the filling layer corresponds to a space of the gas-liquid diffusion part 3 in the reaction vessel, and the waste water is It has gas dispersion and satisfies the following (1)~(3): (1) The above-mentioned wastewater retention time in the above-mentioned gas-liquid diffusion section 1~3 is 0.5 seconds or more (including 0.5 seconds); (2) The above gas -The total of the waste water retention time in the liquid diffusion part 3 and the gas-liquid diffusion part 2 is 5 seconds or more (including 5 seconds); and (3) with respect to the waste water retention time in the gas-liquid diffusion part 1, the above (2) The total retention time of wastewater is 0.1-100 times. 如請求項7之處理方法,其中上述氣體-液體擴散部3係孔隙率20~90容量%之充填物層。 The processing method of claim 7, wherein the gas-liquid diffusion part 3 is a filling layer with a porosity of 20 to 90% by volume. 如請求項7之處理方法,其中上述分散板1及上述分散板2分別具有1個以上(包含1個)的孔,上述分 散板1及上述分散板2的至少一方具有開孔率0.005%~30%之多孔板構造。 Such as the processing method of claim 7, wherein the dispersing plate 1 and the dispersing plate 2 each have more than one (including one) hole, and the At least one of the bulk plate 1 and the aforementioned dispersion plate 2 has a porous plate structure with an opening ratio of 0.005% to 30%. 如請求項7~9中任一項之處理方法,其中進一步滿足以下之(i)~(iv):(i)上述觸媒層中之LHSV為0.1hr-1~10hr-1;(ii)上述觸媒層中之廢水溫度為80℃~370℃;(iii)上述觸媒層中之壓力為廢水之至少一部分保持液相的壓力;以及(iv)上述氣體所含的氧量係廢水中之被氧化物的理論需氧量之0.5倍~5.0倍。 Such as the processing method of any one of Claims 7 to 9, which further meets the following (i) to (iv): (i) The LHSV in the above-mentioned catalyst layer is 0.1hr -1 ~10hr -1 ; (ii) The temperature of the wastewater in the catalyst layer is 80°C to 370°C; (iii) the pressure in the catalyst layer is the pressure at which at least a part of the wastewater maintains the liquid phase; and (iv) the amount of oxygen contained in the gas is in the wastewater The theoretical oxygen demand of being oxidized is 0.5 to 5.0 times.
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